CN215345230U

CN215345230U - Circuit board assembly, DLP optical machine module and DLP projector

Info

Publication number: CN215345230U
Application number: CN202121777376.5U
Authority: CN
Inventors: 马菲菲
Original assignee: Goertek Optical Technology Co Ltd
Current assignee: Goertek Optical Technology Co Ltd
Priority date: 2021-07-30
Filing date: 2021-07-30
Publication date: 2021-12-28
Anticipated expiration: 2031-07-30

Abstract

The utility model discloses a circuit board assembly, a DLP optical machine module and a DLP projector. The circuit board assembly comprises a substrate, a reinforcing plate and a matte layer, wherein the substrate is provided with a first surface and a second surface which are oppositely arranged, and the second surface is provided with a mounting position for mounting a chip; the reinforcing plate is arranged on the first surface, the part of the second surface corresponding to the reinforcing plate is formed into a reinforcing area, the part of the second surface not corresponding to the reinforcing plate is formed into a non-reinforcing area, and the installation position is positioned in the area of the reinforcing area; the matte layer is coated on the reinforced area and covers the area where the mounting position is located. The circuit board assembly of the technical scheme of the utility model can influence the light path of the chip due to light reflection, thereby ensuring that the product performance is not influenced.

Description

Circuit board assembly, DLP optical machine module and DLP projector

Technical Field

The utility model relates to the technical field of optical projection, in particular to a circuit board assembly, a DLP optical machine module and a DLP projector.

Background

A DLP (digital Light processing) projector adopts a DMD (digital Micromirror Device) chip as an imaging Device, and implements a projection technique of projecting an image by adjusting reflected Light. Because DLP projecting apparatus has characteristics such as native contrast is high, the machine is miniaturized, the light path adopts closed, makes it more and more receive user's favor.

At present, in an optical module of a DLP projector, a commonly used circuit board is an RFPC board (flexible printed circuit board) or an FPC board (flexible printed circuit board). As shown in fig. 1, in order to protect the circuit on the circuit board 1, a cover film 2 is usually attached to the surface of the circuit board 1, but in such a circuit board 1, when the cover film 2 is attached, the cover film 2 corresponding to a chip mounting area 3 (such as a DMD chip mounting area) is likely to affect the optical path of the chip due to light reflection, and finally, the performance of the product is adversely affected.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a circuit board assembly, and aims to solve the problems that the light path of a chip is influenced and the product performance is adversely influenced due to the reflection of a covering film on a circuit board in the conventional DLP optical-mechanical module.

To achieve the above object, the present invention provides a circuit board assembly comprising:

the chip mounting structure comprises a substrate, a first chip and a second chip, wherein the substrate is provided with a first surface and a second surface which are oppositely arranged, and the second surface is provided with a mounting position for mounting a chip;

the reinforcing plate is arranged on the first surface, the part of the second surface, corresponding to the reinforcing plate, is formed into a reinforcing area, the part, not corresponding to the reinforcing plate, is formed into a non-reinforcing area, and the installation position is positioned in the area of the reinforcing area; and

and the matte layer is coated on the reinforced area and covers the area where the mounting position is located.

Optionally, a peripheral edge of the matte layer extends beyond a peripheral edge of the mounting site.

Optionally, the distance between the peripheral edge of the matte layer and the peripheral edge of the installation position is defined as L, and L is larger than or equal to 0.3 mm.

Optionally, the matte layer is an ink layer.

Optionally, the circuit board assembly further includes a protective film, and the protective film is disposed on the second surface and does not cover an area where the mounting position is located.

Optionally, the protective film is attached to the non-reinforced region and extends to a region of the reinforced region on a side close to the non-reinforced region.

Optionally, the mounting position is located in the middle of the reinforced area, and the protective film is attached to the non-reinforced area and extends to the peripheral area of the reinforced area corresponding to the mounting position.

Optionally, the reinforcing plate is a steel plate and is at least partially embedded within the base plate.

The utility model also provides a DLP optical-mechanical module, which comprises a circuit board assembly, wherein the circuit board assembly comprises:

The utility model also provides a DLP projector, which comprises a DLP optical mechanical module, wherein the DLP optical mechanical module comprises a circuit board assembly, and the circuit board assembly comprises:

According to the circuit board assembly, the reinforcing plate is mounted on the first surface of the base plate, the mounting position is arranged on the second surface of the base plate and used for mounting the chip, and the mounting position is arranged in the reinforcing area corresponding to the reinforcing plate, so that after the chip is mounted on the mounting position, the strength of the mounting area can be reinforced by the reinforcing plate, and the phenomenon that the base plate is broken due to the fact that the base plate is stressed is effectively avoided. And further, the matte layer is coated on the reinforced area to cover the area where the mounting position is located, so that the surface of the mounting position can form a non-bright surface under the action of the matte layer and is not easy to reflect light, and when the chip is mounted on the mounting position, the light path of the chip is not influenced, thereby effectively avoiding the adverse effect on the product performance.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic diagram of a prior art structure;

FIG. 2 is a side view of one embodiment of a circuit board assembly of the present invention;

FIG. 3 is a front view of one embodiment of a circuit board assembly of the present invention;

FIG. 4 is a front view of another embodiment of a circuit board assembly of the present invention;

fig. 5 is a front view of yet another embodiment of a circuit board assembly of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				10	Substrate	11	First surface
12	Second surface	121	Reinforced zone
				1211	Mounting position	122	Non-reinforced zone
20	Reinforcing plate	30	Matte layer
				40	Protective film	100	Circuit board assembly

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The present invention provides a circuit board assembly 100.

With combined reference to fig. 2 and 3, in the embodiment of the present invention, the circuit board assembly 100 includes a substrate 10, a stiffener 20, and a matte layer 30, wherein the substrate 10 has a first surface 11 and a second surface 12 disposed opposite to each other, and the second surface 12 is provided with a mounting site 1211 for mounting a chip; the reinforcing plate 20 is mounted on the first surface 11, the portion of the second surface 12 corresponding to the reinforcing plate 20 is formed as a reinforced area 121, the portion not corresponding to the reinforcing plate 20 is formed as a non-reinforced area 122, and the mounting position 1211 is located in the area of the reinforced area 121; the matte layer 30 is coated on the reinforced area 121 and covers the area where the installation position 1211 is located.

The circuit board assembly 100 of the present application may be an FPC (flexible circuit board) or an RFPC (flexible hard composite board). The substrate 10 can be made of a polyimide copper clad laminate, and a rolled copper foil material with high purity and a very uniform structure is selected, so that the crystal direction of the rolled copper foil material is parallel to the line direction, and the toughness of the product is improved; meanwhile, before the circuit is manufactured on the substrate 10, the polyimide copper clad laminate is subjected to high-temperature heat treatment, so that the flexural property of the copper foil is enhanced again, and the shrinkage and stress of polyimide due to moisture absorption are eliminated, thereby effectively improving the overall flexural capacity of the circuit board assembly 100.

Mounting locations 1211 may be used to mount the DMD chip for image projection. In general, after the DMD chip is mounted on the mounting site 1211, the substrate 10 is likely to be broken because the substrate 10 is made of a soft material and the substrate 10 is relatively heavy at the corresponding site, and thus the strength of the substrate 10 needs to be reinforced by the reinforcing plate 20. Specifically, the material of the reinforcing plate 20 may be steel, aluminum, nickel-plated steel, etc., and the shape of the reinforcing plate 20 may be adapted to the shape of the substrate 10, but the area is smaller than the area of the substrate 10, for example, when the shape of the substrate 10 is rectangular, the shape of the reinforcing plate 20 may also be designed to be rectangular. The matte layer 30 may be a coating structure and applied to the second surface 12 in the area of the reinforced areas 121, such that the surface of the reinforced areas 121 is formed as a non-reflective surface.

According to the circuit board assembly 100 of the present invention, the reinforcing plate 20 is mounted on the first surface 11 of the substrate 10, the mounting locations 1211 are disposed on the second surface 12 of the substrate 10 for mounting the chip, and the mounting locations 1211 are disposed in the reinforcing region 121 corresponding to the reinforcing plate 20, so that after the chip is mounted on the mounting locations 1211, the strength of the mounting region can be reinforced by the reinforcing plate 20, thereby effectively preventing the substrate 10 from being broken due to the weight. Further, the matte layer 30 is coated on the reinforced area 121, so that the matte layer 30 covers the area where the mounting position 1211 is located, and thus, the surface of the mounting position 1211 can form a non-bright surface under the action of the matte layer 30, and the chip is not easy to reflect light, so that when the chip is mounted on the mounting position 1211, the optical path of the chip is not affected, and further, the adverse effect on the product performance is effectively avoided.

The matte layer 30 covers the area where the installation position 1211 is located, and in a specific embodiment, referring to fig. 4, the peripheral edge of the matte layer 30 exceeds the peripheral edge of the installation position 1211. In this embodiment, the coated area of the matte layer 30 is larger than the area occupied by the mounting site 1211, and the periphery of the matte layer 30 surrounds the periphery of the mounting site 1211. In the actual production process, because a certain error is inevitably generated when the chip is mounted on the mounting position 1211, so that the chip deviates from the position preinstalled in the mounting position 1211, in this embodiment, the coated boundary of the matte layer 30 exceeds the boundary of the mounting position 1211, so that the matte layer 30 is still ensured to be arranged at the position where the chip is correspondingly mounted when the chip is mounted with the certain error, and light reflection is avoided, thereby avoiding affecting the optical path of the chip and ensuring the performance of the product.

With continued reference to FIG. 4, in an embodiment of the present application, the peripheral edge of the matte layer 30 is defined to be beyond the peripheral edge of the mounting position 1211 by a distance L, where L ≧ 0.3 mm. That is, the distance from the boundary of the matte layer 30 to the boundary of the mounting position 1211 is not less than 0.3mm, and in practical applications, some deviation may occur simultaneously in both the position of the mounting position 1211 itself and the chip mounting position, resulting in a combination deviation. Therefore, when the boundary of the matte layer 30 exceeds the boundary of the mounting position 1211 by at least 0.3mm, the chip is provided with the matte layer 30 at the position corresponding to the reinforced area 121 under the condition that the combination deviation occurs, so that the reflection is avoided, the light path of the chip is prevented from being influenced, and the performance of the product is ensured.

In practical applications, when the matte layer 30 is coated, the matte layer 30 may cover the entire reinforced area 121, that is, the area of the matte layer 30 is equivalent to the area of the reinforced area 121, so that when the chip is mounted in the reinforced area 121, the optical path of the chip may not be affected by light reflection. Of course, the dummy layer 30 may be a position where the mounting bits 1211 are exactly covered, that is, the area of the dummy layer 30 is equivalent to the area of the mounting bits 1211, without considering the position error and the mounting error.

Optionally, in the present application, the matte layer 30 is an ink layer. Specifically, the matte layer 30 may be made of black matte ink, which not only can perform extinction and avoid the influence on the optical path due to reflection, but also can manufacture pads with regular shapes at the mounting positions 1211 by using the ink because the tolerance of outward diffusion of the ink is small (usually ± 0.05mm) when the ink is applied, so that when the chip is mounted at the mounting positions 1211, the chip can make good contact with the substrate 10, and the reliability is better.

Of course, in other embodiments of the present application, the matte layer 30 may also be a matte coating, such as a matte paint or a modified oil.

Since various lines for signal connection are generally disposed on the substrate 10, the lines laid out on the second surface 12 are protected from being damaged by exposure. Referring again to fig. 1 and 2, in an embodiment of the present application, the circuit board assembly 100 further includes a protection film 40, and the protection film 40 is disposed on the second surface 12 and does not cover an area where the mounting position 1211 is located.

The protection film 40 can cover the region outside the installation site 1211, and the region of the installation site 1211 can be covered by the matte layer 30, so that the lines of the layout enhanced region 121 and the non-enhanced region 122 can be covered to avoid exposure. Alternatively, the protection film 40 is a plastic film, for example, the protection film 40 may be a polyester film (PET) having good insulating property, the protection film 40 covers the region outside the installation position 1211, so as to ensure good insulating property on the second surface 12, and the polyester film has excellent adhesive property, outstanding flexibility, and optimal cost performance.

Based on the above-mentioned embodiment, it is considered that after the stiffener 20 is disposed on the first surface 11 of the substrate 10, the reinforced region 121 and the non-reinforced region 122 are formed on the second surface 12, so that there is a risk of fracture at the boundary between the reinforced region 121 and the non-reinforced region 122. In order to avoid the fracture at the intersection between the reinforced region 121 and the non-reinforced region 122, in an embodiment of the present application, as shown in fig. 2, the protective film 40 is attached to the non-reinforced region 122 and extends to a region of the reinforced region 121 close to the non-reinforced region 122.

With such an arrangement, the protection film 40 can span over the reinforced area 121 and the non-reinforced area 122, so that the stress at the boundary can be dispersed to the reinforced area 121 and the non-reinforced area 122 through the protection film 40, thereby avoiding the stress concentration at the boundary, and further effectively reducing the risk of the substrate 10 breaking.

In another embodiment of the present application, as shown in fig. 5, the mounting position 1211 is located in the middle of the reinforced area 121, and the protective film 40 is attached to the non-reinforced area 122 and extends to the peripheral area of the reinforced area 121 corresponding to the mounting position 1211. In this embodiment, the protection film 40 may be fully distributed in the region of the reinforced region 121 corresponding to the region outside the mounting position 1211, so that the area of the protection film 40 attached to the second surface 12 may be further increased, and thus the stress at the boundary between the reinforced region 121 and the non-reinforced region 122 may be more uniformly dispersed, thereby further reducing the risk of fracture.

In some embodiments of the present application, the stiffener plate 20 is a steel plate and is at least partially embedded within the base plate 10. The reinforcing plate 20 may be a thin plate structure, and may be formed as a steel sheet, and it is understood that the reinforcing plate 20 is formed by using a steel sheet, so that not only the strength of the circuit board assembly 100 may be reinforced by using the strength of the reinforcing plate, but also the steel sheet has a certain heat conductivity, and may assist in dissipating heat from the circuit board assembly 100. In addition, since the reinforcing plate 20 is mounted on the substrate 10 by embedding, the reinforcing plate 20 can be stably mounted without protruding too much from the first surface 11, thereby facilitating the control of the overall thickness of the circuit board assembly 100.

In addition, the present invention further provides a DLP optical-mechanical module, which includes a circuit board assembly 100, and the specific structure of the circuit board assembly 100 refers to the above embodiments, and since the DLP optical-mechanical module adopts all technical solutions of all the above embodiments, the DLP optical-mechanical module at least has all the beneficial effects brought by the technical solutions of the above embodiments, and details are not repeated herein.

In addition, the present invention further provides a DLP projector, which includes a DLP optical mechanical module, where the DLP optical mechanical module includes a circuit board assembly 100, and the specific structure of the circuit board assembly 100 refers to the above embodiments, and since the DLP optical mechanical module adopts all technical solutions of all the above embodiments, all the beneficial effects brought by the technical solutions of the above embodiments are at least achieved, and are not repeated herein.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A circuit board assembly, comprising:

2. The circuit board assembly of claim 1, wherein a peripheral edge of the matte layer extends beyond a peripheral edge of the mounting site.

3. The circuit board assembly of claim 2, wherein a distance L is defined between a peripheral edge of the matte layer and a peripheral edge of the mounting site, wherein L is greater than or equal to 0.3 mm.

4. The circuit board assembly of claim 1, wherein the matte layer is an ink layer.

5. The circuit board assembly according to any one of claims 1 to 4, further comprising a protective film disposed on the second surface and not covering an area where the mounting site is located.

6. The circuit board assembly of claim 5, wherein the protective film is attached to the non-reinforced region and extends to a region of the reinforced region on a side thereof adjacent to the non-reinforced region.

7. The circuit board assembly of claim 5, wherein the mounting site is located at a middle position of the reinforced region, and the protective film is attached to the non-reinforced region and extends to a peripheral region of the reinforced region corresponding to the mounting site.

8. The circuit board assembly of any of claims 1-4, wherein the stiffener plate is a steel plate and is at least partially embedded within the base plate.

9. A DLP opto-mechanical module comprising the circuit board assembly of any one of claims 1 to 8.

10. A DLP projector comprising the DLP opto-mechanical module of claim 9.