CN219893500U

CN219893500U - Flexible circuit board, display module and display device

Info

Publication number: CN219893500U
Application number: CN202320355257.3U
Authority: CN
Inventors: 都阿娟; 贾群; 杨虎飞; 黄小霞; 孙浩; 杨恩建; 黄允晖; 王永乐; 吴易谦; 曾乙伦; 曾国栋; 陈伟; 姚孟亮
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2023-02-20
Filing date: 2023-02-20
Publication date: 2023-10-24
Anticipated expiration: 2033-02-20

Abstract

The utility model relates to a flexible circuit board, which comprises a substrate, wherein the substrate comprises a main body area, a first binding area and a second binding area which are positioned on two opposite sides of the main body area, a first metal layer and a second metal layer are respectively arranged on two opposite sides of the substrate, the front projection of the substrate is covered by the first metal layer, the front projection of the substrate is covered by the second metal layer, at least part of the first binding area is covered by the front projection of the substrate, and at least part of the second binding area is covered by the second metal layer. The utility model also relates to a display module and a display device.

Description

Flexible circuit board, display module and display device

Technical Field

The utility model relates to the technical field of manufacturing of display products, in particular to a flexible circuit board, a display module and a display device.

Background

As a new generation of display technology, large-size technology in AMOLED has received increasing industry attention. The OLED has the characteristics of large size, high transmittance, foldability, ultra-light weight, high definition, high brightness, high contrast, quick response, low energy consumption, soft display realization and the like, so that the OLED product becomes a main stream high-end product pursued by customers. Nowadays, more and more high-end display products are favored by customers, the OLED display module is widely applied to mobile phone products, but many design problems in the middle-size and large-size field still need to be continuously improved, because the use scene of the middle-size and large-size screen is different from that of the mobile phone, particularly, because of the size increase, a plurality of FPC bonding+pcb (circuit board) boards are needed to meet the design requirement, and the OLED products mainly have light and thin characteristics, so that the FPC design also follows the characteristics of being as short and small as possible, the FPC (flexible circuit board) has the problem of warping due to the material characteristics of the FPC itself, particularly, the conventional design of the existing middle-size and large-size project FPC design generally has two Bonding areas (Bonding areas), and the conventional design of the existing Bonding area is a single-layer area, namely, compared with the Normal area (conventional area), no metal layer is designed on the back of the Bonding area, and the warping problem is more serious, and the Bonding process and yield of the MDL are seriously affected.

Disclosure of Invention

In order to solve the technical problems, the utility model provides a flexible circuit board, a display module and a display device, and solves the problem of warping of a binding area of the flexible circuit board.

In order to achieve the above purpose, the technical scheme adopted by the embodiment of the utility model is as follows: the utility model provides a flexible line way board, includes the substrate, in being on a parallel with the direction of substrate, the substrate includes main body district and is located the first binding area and the second binding area of the opposite both sides of main body district, in the direction of perpendicular to the substrate, the opposite both sides of substrate are provided with first metal layer and second metal layer respectively, first metal layer is in the orthographic projection of substrate covers the substrate, the second metal layer is in the orthographic projection of substrate covers the main body district, and covers at least part first binding area, and cover at least part second binding area.

Optionally, the first binding region and/or the second binding region are provided with alignment marks, and the second metal layer is provided with a first hollow area exposing the alignment marks.

Optionally, a first protection layer is disposed on a side, away from the substrate, of the first metal layer, and a second protection layer is disposed on a side, away from the substrate, of the second metal layer.

Optionally, the first protective layer includes a first adhesive layer and a first protective film, and the first adhesive layer is located between the first protective film and the first metal layer;

the second protective layer comprises a second adhesive layer and a second protective film, and the second adhesive layer is positioned between the second protective film and the second metal layer.

Optionally, the first protective film and the second protective film are both made of polyacetamide.

Optionally, a first electromagnetic shielding film is disposed on a side, away from the substrate, of the first protective layer, and a second electromagnetic shielding film is disposed on a side, away from the substrate, of the second protective layer.

Optionally, the second electromagnetic shielding film includes a second hollowed-out area, and orthographic projection of the second hollowed-out area on the substrate and orthographic projection of the first hollowed-out area on the substrate are completely overlapped.

Optionally, the first metal layer has a first area, a third hollow area is provided on the first electromagnetic shielding film, the orthographic projection of the third hollow area on the first metal layer is located in the first area, a fourth hollow area is provided on the first protection layer, and the orthographic projection of the fourth hollow area on the first metal layer is located in the first area.

The embodiment of the utility model also provides a display module, which comprises the flexible circuit board.

The embodiment of the utility model also provides a display device which comprises the display module.

The beneficial effects of the utility model are as follows: the binding region is provided with a double-layer structure, so that the strength of the binding region is enhanced and the problem that the binding region is easy to warp is solved compared with the single-layer structure.

Drawings

Fig. 1 is a schematic view showing a structure of a flexible wiring board in the related art;

fig. 2 is a schematic structural view of a flexible circuit board according to an embodiment of the present utility model;

FIG. 3 shows a schematic view of section A-A of FIG. 2;

fig. 4 is a schematic diagram showing a part of a structure of a display module according to the present utility model.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. It will be apparent that the described embodiments are some, but not all, embodiments of the utility model. All other embodiments, which are obtained by a person skilled in the art based on the described embodiments of the utility model, fall within the scope of protection of the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Referring to fig. 2 and 3, the present embodiment provides a flexible circuit board, including a substrate 1, in a direction parallel to a surface of the substrate 1, the substrate 1 includes a main body region 11, and a first binding region 10 and a second binding region 20 located at opposite sides of the main body region 11, in a direction perpendicular to the substrate 1, opposite sides of the substrate 1 are respectively provided with a first metal layer 2 and a second metal layer 3, an orthographic projection of the first metal layer 2 on the substrate 1 covers the substrate 1, an orthographic projection of the second metal layer 3 on the substrate 1 covers the main body region 11, and covers at least part of the first binding region 10, and at least part of the second binding region 20.

In the related art, the binding area is in a single-layer structure, referring to fig. 1, the first metal layer 2 and the second metal layer 3 are respectively disposed on opposite sides of the substrate 1, but the front projection of the second metal layer 3 on the substrate 1 does not cover the binding area, but the binding area is easy to warp, in this embodiment, the binding area (including the first binding area 10 and the second binding area 20) is configured as a double-layer structure, that is, the binding area includes the first metal layer 2 and the second metal layer 3 disposed on two sides of the substrate 1, and the strength of the first binding area 10 and the second binding area 20 is enhanced by the double-layer structure, so that the problem that the first binding area 10 and the second binding area 20 are easy to warp is improved.

Illustratively, the first metal layer 2 and the second metal layer 3 are both made of copper.

Illustratively, the first binding area 10 and/or the second binding area 20 are provided with alignment marks 100, and the second metal layer 3 is provided with a first hollow area exposing the alignment marks 100.

The first binding area 10 is used for connecting the flexible circuit board 201 with the display panel 202, the second binding area 20 is used for connecting the flexible circuit board 201 with the circuit board 203, and referring to fig. 4, the alignment mark 100 is used for aligning the flexible circuit board 201 with the display panel 202 and/or for aligning the flexible circuit board 201 with the circuit board 203. The first hollow area is configured to expose the alignment mark 100, so as to capture the alignment mark 100 during alignment.

It should be noted that, the alignment mark 100 is disposed at a corner of the first bonding area 10, and/or the alignment mark is disposed at a corner of the second bonding area 20, so as to avoid that the arrangement of the alignment mark 100 affects the circuit distribution on the flexible circuit board 201.

The side of the flexible circuit board 201 connected to the display panel 202 or the circuit board 203 is the side of the substrate 1 where the first metal layer 2 is disposed, and the alignment mark 100 is disposed on the side of the substrate 1 where the second metal layer 3 is disposed.

The alignment mark 100 may be formed in various ways, for example, by patterning the second metal layer 3 directly, that is, by forming the alignment mark 100 simultaneously when forming the second metal layer 3, or by etching the second metal layer 3 after forming the second metal layer 3.

Illustratively, the side of the first metal layer 2 remote from the substrate 1 is provided with a first protective layer 4, and the side of the second metal layer 3 remote from the substrate 1 is provided with a second protective layer 5.

Illustratively, the first protective layer 4 includes a first adhesive layer 41 and a first protective film 42, the first adhesive layer 41 being located between the first protective film 42 and the first metal layer 2;

the second protective layer 5 comprises a second glue layer 51 and a second protective film 52, the second glue layer 51 being located between the second protective film 52 and the second metal layer 3.

The materials of the first adhesive layer 41 and the second adhesive layer 51 may be the same or different, and the materials of the first protective film 42 and the second protective film 52 may be the same or different, and in some embodiments of the present disclosure, the materials of the first adhesive layer 41 and the second adhesive layer 51 are the same, for example, the materials of the first adhesive layer 41 and the second adhesive layer 51 are all AD adhesive layers (acrylic hot melt adhesive layers), but not limited thereto. The materials of the first protective film 42 and the second protective film 52 are the same, for example, the materials of the first protective film 42 and the second protective film 52 are PI (polyimide), but not limited thereto.

The first protective film 42 or the second protective film 52 made of PI has good bending performance and protective performance, and can play a good role in protecting the corresponding first metal layer 2 or second metal layer 3. In addition, the AD glue layer is deformed by heat to a large extent, and a strong adhesive force can be generated, so that the adhesion between the first protective film 42 and the first metal layer 2 and/or the adhesion between the second protective film 52 and the second metal layer 3 can be significantly enhanced.

Illustratively, the first metal layer 2 includes a first portion located in the body region 11 and a second portion located in the first bonding region 10 and the second bonding region 20, the first portion is covered by the front projection of the first protective layer 4 on the first metal layer 2, and the second portion is exposed from the first protective layer 4, so that the flexible circuit board 201 is bonded to the display panel 202 through the first bonding region 10 and is connected to the circuit board 203 through the second bonding region 20.

The orthographic projection of the second protective layer 5 on the second metal layer 3 completely covers the second metal layer 3. It should be noted that, the second protection layer 5 includes a second adhesive layer 51 and a second protection film 52, and the second adhesive layer 51 and the second protection film 52 are both made of transparent materials, for example, the second adhesive layer 51 is made of AD glue, and the second protection film 52 is made of PI material, so as to avoid affecting capturing the alignment mark 100.

Illustratively, the first protective layer 4 is provided with a first electromagnetic shielding layer 6 on a side remote from the substrate 1, and the second protective layer 5 is provided with a second electromagnetic shielding layer 7 on a side remote from the substrate 1.

The arrangement of the first electromagnetic shielding layer 6 and the second electromagnetic shielding layer 7 can shield the interference of external electromagnetic signals, so as to improve the working stability of the flexible circuit board 201.

Illustratively, the second electromagnetic shielding layer 7 includes a second hollowed-out area, and the orthographic projection of the second hollowed-out area on the substrate 1 and the orthographic projection of the first hollowed-out area on the substrate 1 completely coincide. The second hollowed-out area is arranged corresponding to the first hollowed-out area so as to expose the alignment mark 100, which is beneficial to capturing the alignment mark 100.

The areas of the first binding area 10 and the second binding area 20 may be the same or different, and may be set according to actual needs, and for example, when the number of binding pins of the second binding area 20 is greater than the number of binding areas of the first binding area 10, the area of the first binding area 10 is smaller than the area of the second binding area 20, so as to reduce cost, referring to fig. 2, in the first direction (X direction), the length of the first binding area 10 is smaller than the length of the second binding area 20. The shape of the flexible circuit board can be set according to actual needs, and the flexible circuit board can be integrally trapezoid or special-shaped, and the flexible circuit board shown in fig. 2 is special-shaped.

Illustratively, the first metal layer 2 has a first area 101, a third hollowed-out area is disposed on the first electromagnetic shielding layer 6, an orthographic projection of the third hollowed-out area on the first metal layer 2 is located in the first area 101, a fourth hollowed-out area is disposed on the first protective layer 4, and an orthographic projection of the fourth hollowed-out area on the first metal layer 2 is located in the first area 101.

The third hollow area and the fourth hollow area are arranged such that the first area 101 of the first metal layer 2 is exposed, and the first area 101 is used for being connected with an external circuit. In order to make the flexible wiring board 201 have a sufficient wiring space, the first region 101 is provided at the edge of the body region 11.

It should be noted that the first metal layer 2 has at least one first region 101, and the number of the first regions 101 may be set according to actual needs, and three first regions 101 are provided in fig. 2, but not limited thereto. The specific shape of the first area 101 may be a regular or irregular geometric shape, which may be specifically set according to actual needs. When the number of the first areas 101 is plural, the shapes of the plural first areas 101 may be identical, different, or partially identical.

The main body region 11 of the flexible circuit board is further provided with a second region 102, and the second region 102 is provided with an identification mark, such as a two-dimensional code, which is disposed on a side of the first electromagnetic shielding layer 6 away from the substrate 1 or a side of the second electromagnetic shielding layer 7 away from the substrate 1, so as to facilitate scanning and identification.

Illustratively, the substrate 1 is made of PI (polyimide), so as to ensure the bending performance of the whole flexible circuit board 201.

The embodiment of the utility model further provides a display module, which comprises the flexible circuit board 201, a display panel 202 and a circuit board 203, and referring to fig. 4, the flexible circuit board 201 is connected with the display panel 202 through the first binding area 10, and the flexible circuit board 201 is connected with the circuit board 203 through the second binding area 20.

The display panel 202 is provided with a third binding area, and a plurality of flexible circuit boards 201 are arranged at intervals along the extending direction of the third binding area.

The flexible circuit board 201 is bound with the display panel 202 or the circuit board 203 through an anisotropic conductive adhesive film, the anisotropic conductive adhesive film contains conductive particles, and the flexible circuit board 201 can be bound with the display panel 202 or the circuit board 203 through the conductive particles.

The display device may be: any product or component with display function such as a liquid crystal television, a liquid crystal display, a digital photo frame, a mobile phone, a tablet personal computer and the like, wherein the display device further comprises a flexible circuit board, a printed circuit board and a backboard.

It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present utility model, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the utility model, and are also considered to be within the scope of the utility model.

Claims

1. The utility model provides a flexible line way board, its characterized in that includes the substrate, in being on a parallel with the direction of substrate, the substrate includes main body district and is located the first binding district and the second binding district of the opposite both sides of main body district, in the direction of perpendicular to substrate, the opposite both sides of substrate are provided with first metal layer and second metal layer respectively, first metal layer is in the orthographic projection of substrate covers the substrate, the second metal layer is in the orthographic projection of substrate covers the main body district, and covers at least part first binding district, and cover at least part second binding district.

2. The flexible circuit board according to claim 1, wherein the first binding region and/or the second binding region is provided with an alignment mark, and the second metal layer is provided with a first hollow region exposing the alignment mark.

3. The flexible circuit board of claim 2, wherein a side of the first metal layer away from the substrate is provided with a first protective layer and a side of the second metal layer away from the substrate is provided with a second protective layer.

4. The flexible circuit board of claim 3 wherein the first protective layer comprises a first adhesive layer and a first protective film, the first adhesive layer being located between the first protective film and the first metal layer;

5. The flexible circuit board of claim 4 wherein the first protective film and the second protective film are each made of a polyacetamide.

6. The flexible circuit board of claim 4, wherein a side of the first protective layer away from the substrate is provided with a first electromagnetic shielding film and a side of the second protective layer away from the substrate is provided with a second electromagnetic shielding film.

7. The flexible circuit board of claim 6, wherein the second electromagnetic shielding film comprises a second hollowed-out area, and wherein an orthographic projection of the second hollowed-out area on the substrate is completely coincident with an orthographic projection of the first hollowed-out area on the substrate.

8. The flexible circuit board of claim 6, wherein the first metal layer has a first region, a third hollowed-out region is provided on the first electromagnetic shielding film, an orthographic projection of the third hollowed-out region on the first metal layer is located in the first region, a fourth hollowed-out region is provided on the first protective layer, and an orthographic projection of the fourth hollowed-out region on the first metal layer is located in the first region.

9. A display module comprising the flexible circuit board of any one of claims 1-8.

10. A display device comprising the display module of claim 9.