CN215453381U - Display module and display device - Google Patents
Display module and display device Download PDFInfo
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- CN215453381U CN215453381U CN202121059947.1U CN202121059947U CN215453381U CN 215453381 U CN215453381 U CN 215453381U CN 202121059947 U CN202121059947 U CN 202121059947U CN 215453381 U CN215453381 U CN 215453381U
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Abstract
The embodiment of the application provides a display module and a display device. The display module assembly includes display panel and the flexible line way board that binds with display panel, and the flexible line way board includes flexible substrate, forms copper layer and the protective layer that covers the copper layer on flexible substrate, is provided with on the flexible line way board to be used for making the copper layer dew copper district that reveals, and dew copper district arranges the edge at the flexible line way board, and the protective layer forms border protection structure in the marginal position in dew copper district. In the embodiment of the application, the existence of the boundary protection structure enables the thickness at the edge of the copper exposure area to be increased, so that the structural strength at the edge of the copper exposure area is enhanced to a certain degree. In addition, the boundary protection structure is integrated with the protection layer except the copper exposed area, so that the structural rigidity of the copper exposed area can be enhanced. From this, make the structural strength in dew copper district edge and dew copper district's structural rigidity all obtain the reinforcing to make the difficult emergence fold of dew copper district of flexible line way board or fracture.
Description
Technical Field
The application relates to the technical field of display, in particular to a display module and a display device.
Background
This section provides background information related to the present disclosure only and is not necessarily prior art.
In the related art, the Flexible Printed Circuit (FPC) in the display module may be divided into a single-layer board, a double-layer board, and a multi-layer board according to the number of copper layers. The main FPC with the multi-layer structure is relatively high in cost, so that more and more display modules consider the main FPC with the double-layer structure more. However, the main FPC having the double-layer structure and the single-layer structure is easily wrinkled or broken due to the thinness of the copper exposed area, and once the above problem occurs, the main FPC can only be scrapped, thereby causing waste in time and cost.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a display module assembly and a display device to solve the problem that the copper-exposed area of a Flexible Printed Circuit (FPC) is prone to wrinkling or cracking.
The embodiment of the first aspect of this application provides a display module assembly, including display panel and with the flexible line way board that display panel bound, the flexible line way board includes the flexible substrate, forms copper layer and cover on the flexible substrate the protective layer on copper layer, be provided with on the flexible line way board and be used for making the copper exposure area that the copper layer shows, the copper exposure area is arranged the edge of flexible line way board, the protective layer is in the border protection structure is formed to the border position in copper exposure area.
In some embodiments of the present application, the border protection structure has a width of 0.3mm to 1.0 mm.
In some embodiments of the present application, the number of the copper layers is two, wherein one layer of the copper layer is formed on one side of the flexible substrate, the other layer of the copper layer is formed on the other side of the flexible substrate, the number of the protective layers is two, and the two layers of the protective layers correspondingly cover one layer of the copper layer.
In some embodiments of this application, the display module assembly still includes the cover the electromagnetic shielding layer that the protective layer set up, the quantity of electromagnetic shielding layer is two-layer, and is two-layer the electromagnetic shielding layer covers the one deck correspondingly the protective layer.
In some embodiments of the present application, the number of the copper layers is one, the copper layers are formed on one side of the flexible substrate, and the number of the protective layers is one and is disposed to cover the copper layers.
In some embodiments of this application, the display module assembly still includes the cover the electromagnetic shielding layer that the protective layer set up, the quantity of electromagnetic shielding layer is two-layer, one of them layer the electromagnetic shielding layer covers the protective layer sets up, another layer the electromagnetic shielding layer covers the flexible substrate sets up.
In some embodiments of the present application, the protective layer includes an AD glue layer and a PI film, the AD glue layer being disposed between the PI film and the copper layer.
In some embodiments of the present application, the flexible substrate is a PI board.
In some embodiments of the present application, the flexible wiring board is bound to the display panel by an anisotropic conductive film.
An embodiment of a second aspect of the present application provides a display device, including the display module in any of the above embodiments.
According to display module assembly and display device that this application embodiment provided, be provided with on display module assembly's the flexible line way board and be used for making the copper layer dew copper district that reveals, dew copper district is used for being connected with external circuit to realize current output. In order to enable the flexible circuit board to have a sufficient wiring space, the copper exposure area is arranged at the edge position of the flexible circuit board. In this application embodiment, the protective layer forms the boundary protection structure in the edge position of dew copper district, and the existence of boundary protection structure makes the thickness increase at the edge of dew copper district to make the structural strength at dew copper district edge obtain the reinforcing of certain degree. In addition, the boundary protection structure is integrated with the protection layer except the copper exposed area, so that the structural rigidity of the copper exposed area can be enhanced. From this, make the structural strength in dew copper district edge and dew copper district's structural rigidity all obtain the reinforcing to make the difficult emergence fold of dew copper district of flexible line way board or fracture.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the drawings used in the description of the embodiments of the present application or the related art are briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present application;
FIG. 2 is a schematic cross-sectional view of a flexible wiring board according to an embodiment of the present application;
fig. 3 is a schematic cross-sectional view of a flexible wiring board according to another embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
An embodiment of a first aspect of the present application provides a display module. The display module includes a display panel and a flexible printed circuit 100 bound to the display panel.
As shown in fig. 1 to 3, the flexible printed circuit board 100 includes a flexible substrate 110, a copper layer 120 formed on the flexible substrate 110, and a protection layer 130 covering the copper layer 120, the flexible printed circuit board 100 is provided with a copper exposure region 101 for exposing the copper layer 120, the copper exposure region 101 is disposed at an edge of the flexible printed circuit board 100, and the protection layer 130 forms a boundary protection structure 1301 at an edge position of the copper exposure region 101.
According to the display module of this application embodiment, be provided with on its flexible line way board 100 and be used for making copper layer 120 expose dew copper district 101, dew copper district 101 is used for being connected with external circuit to realize current output. Wherein, in order to make the flexible circuit board 100 have sufficient routing space, the copper exposed area 101 is disposed at the edge position of the flexible circuit board 100. In the embodiment of the application, the protective layer 130 forms a boundary protection structure 1301 at the edge of the exposed copper region 101, and the existence of the boundary protection structure 1301 increases the thickness of the edge of the exposed copper region 101, so that the structural strength of the edge of the exposed copper region 101 is enhanced to a certain extent. In addition, the boundary protection structure 1301 is integrated with the protection layer 130 except the copper exposed region 101, so that the structural rigidity of the copper exposed region 101 may also be enhanced. Therefore, the structural strength at the edge of the copper exposure area 101 and the structural rigidity of the copper exposure area 101 are enhanced, so that the copper exposure area 101 of the flexible circuit board 100 is not easy to wrinkle or break.
In some embodiments of the present application, the width L of the boundary protection structure 1301 is 0.3mm to 1.0 mm. If the width L of the boundary protection structure 1301 is too small, the enhancement effect on the structural strength at the edge of the copper exposure area 101 and the structural rigidity of the copper exposure area 101 is weak, so that the purpose of avoiding the occurrence of wrinkles and cracks in the copper exposure area 101 is difficult to achieve. On the contrary, if the width L of the boundary protection structure 1301 is too large, the copper exposed region 101 is shifted toward the middle of the flexible circuit board 100 so as not to reduce the area of the copper exposed region 101, and thus the routing space of the flexible circuit board 100 is compressed. In this embodiment, the width L of the boundary protection structure 1301 is set to 0.3mm to 1.0mm, and when the above conditions are satisfied, the structural strength at the edge of the copper exposure region 101 and the structural rigidity of the copper exposure region 101 can be effectively enhanced, and the wiring space of the flexible circuit board 100 can not be squeezed due to the obvious deviation of the copper exposure region 101 to the middle of the flexible circuit board 100.
In some embodiments of the present application, as shown in fig. 2, the number of copper layers 120 is two, wherein one copper layer 120 is formed on one side of the flexible substrate 110, another copper layer 120 is formed on the other side of the flexible substrate 110, and the number of protective layers 130 is two, and two protective layers 130 correspondingly cover one copper layer 120. In this embodiment, the number of the copper layers 120 is two, and the copper layers are distributed on two sides of the flexible substrate 110, so that the flexible printed circuit 100 is a double-layer structure, which is beneficial to saving the manufacturing cost of the display module compared to the flexible printed circuit 100 adopting a multi-layer board structure (the number of the copper layers 120 is three or more than three).
In some other embodiments of the present application, as shown in fig. 3, the number of copper layers 120 is one, copper layers 120 are formed on one side of flexible substrate 110, and protective layer 130 is one and disposed to cover copper layers 120. In the present embodiment, the number of the copper layers 120 is one, and therefore, the flexible circuit board 100 in the present embodiment is a single-layer board structure. For the flexible circuit board 100 adopting the single-layer board structure, the thickness of the copper exposed region 101 is thinner, and therefore, the problem that the copper exposed region 101 is easily wrinkled or broken can also be solved by the boundary protection structure 1301.
In some embodiments of the present application, the display module further includes an electromagnetic shielding layer 140 disposed to cover the protection layer 130, and the number of the electromagnetic shielding layer 140 may be two. The arrangement positions of the battery shield layers are different between the flexible wiring board 100 using the double-layer board structure and the flexible wiring board 100 using the single-layer board structure. Specifically, based on the flexible wiring board 100 adopting a two-layer structure, two electromagnetic shielding layers 140 may be correspondingly covered with one protective layer 130. Based on the flexible wiring board 100 adopting the single-layer board structure, one electromagnetic shielding layer 140 is disposed to cover the protection layer 130, and the other electromagnetic shielding layer 140 is disposed to cover the flexible substrate 110. The electromagnetic shielding layer 140 functions to shield the interference of external electromagnetic signals, so as to improve the operation stability of the flexible circuit board 100.
In some embodiments of the present application, the protection layer 130 includes an acrylic hot melt adhesive layer (AD adhesive layer 131) and a polyimide film (PI film 132), and the AD adhesive layer 131 is disposed between the PI film 132 and the copper layer 120. Specifically, the PI film 132 has good bending performance and protection performance, and can protect the copper layer 120 well. In addition, the AD glue layer 131 deforms a large amount when heated, and generates a strong adhesive force, so that the adhesion between the PI film 132 and the copper layer 120 can be significantly enhanced.
In some embodiments of the present application, the flexible substrate 110 is a polyimide film (PI) plate, which has a better bending performance, and the polyimide film plate is used as the flexible substrate 110, which can ensure the overall bending performance of the flexible printed circuit board 100.
In some embodiments of the present application, the flexible printed circuit board 100 is bound to the display panel through an anisotropic conductive film, the anisotropic conductive film contains conductive particles, and the flexible printed circuit board 100 can be bound to the display panel through the conductive particles.
An embodiment of a second aspect of the present application provides a display device, which includes the display module in any of the above embodiments.
According to the display device of this application embodiment, its display module assembly includes display panel and the flexible line way board 100 that binds with display panel, is provided with the dew copper district 101 that is used for making copper layer 120 expose on the flexible line way board 100, and dew copper district 101 is used for being connected with external line to realize current output. Wherein, in order to make the flexible circuit board 100 have sufficient routing space, the copper exposed area 101 is disposed at the edge position of the flexible circuit board 100. In the embodiment of the application, the protective layer 130 forms a boundary protection structure 1301 at the edge of the exposed copper region 101, and the existence of the boundary protection structure 1301 increases the thickness of the edge of the exposed copper region 101, so that the structural strength of the edge of the exposed copper region 101 is enhanced to a certain extent. In addition, the boundary protection structure 1301 is integrated with the protection layer 130 except the copper exposed region 101, so that the structural rigidity of the copper exposed region 101 may also be enhanced. Therefore, the structural strength at the edge of the copper exposure area 101 and the structural rigidity of the copper exposure area 101 are enhanced, so that the copper exposure area 101 of the flexible circuit board 100 is not easy to wrinkle or break.
Furthermore, the display device further comprises a backlight module, the backlight module is arranged on the light incident side of the display module, and the backlight module is used for providing light for the display module.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
All the embodiments in the present specification are described in a related manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments.
The above description is only for the preferred embodiment of the present application, and is not intended to limit the scope of the present application. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application are included in the protection scope of the present application.
Claims (10)
1. The utility model provides a display module assembly, its characterized in that, including display panel and with the flexible line way board that display panel bound, the flexible line way board includes the flexible substrate, forms copper layer and cover on the flexible substrate the protective layer on copper layer, be provided with on the flexible line way board and be used for making the copper layer exposes dew copper district, dew copper district arranges the edge of flexible line way board, the protective layer is in dew copper district's border protection structure is formed to the border position.
2. The display module of claim 1, wherein the border protection structure has a width of 0.3mm to 1.0 mm.
3. The display module according to claim 1, wherein the number of the copper layers is two, one of the copper layers is formed on one side of the flexible substrate, the other of the copper layers is formed on the other side of the flexible substrate, the number of the protective layers is two, and the two protective layers correspondingly cover one of the copper layers.
4. The display module according to claim 3, further comprising two electromagnetic shielding layers covering the protection layer, wherein the two electromagnetic shielding layers correspondingly cover one of the protection layers.
5. The display module according to claim 1, wherein the number of the copper layers is one, the copper layers are formed on one side of the flexible substrate, and the number of the protective layers is one and is disposed to cover the copper layers.
6. The display module according to claim 5, further comprising an electromagnetic shielding layer covering the protection layer, wherein the number of the electromagnetic shielding layer is two, one of the electromagnetic shielding layer covers the protection layer, and the other electromagnetic shielding layer covers the flexible substrate.
7. The display module according to any one of claims 1 to 6, wherein the protective layer comprises an AD glue layer and a PI film, the AD glue layer being disposed between the PI film and the copper layer.
8. The display module according to any one of claims 1 to 6, wherein the flexible substrate is a PI board.
9. The display module assembly according to any one of claims 1 to 6, wherein the flexible circuit board is bound to the display panel by an anisotropic conductive film.
10. A display device, comprising the display module according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121059947.1U CN215453381U (en) | 2021-05-18 | 2021-05-18 | Display module and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121059947.1U CN215453381U (en) | 2021-05-18 | 2021-05-18 | Display module and display device |
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| CN215453381U true CN215453381U (en) | 2022-01-07 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113163584A (en) * | 2021-05-18 | 2021-07-23 | 京东方科技集团股份有限公司 | Display module and display device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113163584A (en) * | 2021-05-18 | 2021-07-23 | 京东方科技集团股份有限公司 | Display module and display device |
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