CN219227916U

CN219227916U - FPC and fingerprint module of flexible double-deck board single-deck board that becomes

Info

Publication number: CN219227916U
Application number: CN202222865879.9U
Authority: CN
Inventors: 黄振升; 郝明友; 金道为
Original assignee: Guangdong Zhixin Photoelectric Technology Co ltd; Guangdong Ziwenxing Electronic Technology Co ltd
Current assignee: Guangdong Zhixin Photoelectric Technology Co ltd; Guangdong Ziwenxing Electronic Technology Co ltd
Priority date: 2022-10-29
Filing date: 2022-10-29
Publication date: 2023-06-20
Anticipated expiration: 2032-10-29

Abstract

The utility model discloses a flexible double-layer board-to-single-layer board FPC, which relates to the field of flexible circuit boards and comprises a substrate, a front and back cover film, front and back printing ink and a front and back steel sheet, wherein a circuit is arranged on the back surface of the substrate, a first function setting area and a second function setting area are arranged on the substrate, a front steel sheet arranged on the front surface of the substrate and positioned in the first function setting area, front printing ink arranged on the front surface of the substrate and positioned in the second function setting area, a back cover film arranged on the back surface of the substrate and avoiding the first function setting area, back printing ink arranged on the back surface of the substrate and positioned in the first function setting area, and a back steel sheet arranged on the back cover film and positioned in the second function setting area.

Description

FPC and fingerprint module of flexible double-deck board single-deck board that becomes

Technical Field

The utility model relates to the technical field of flexible circuit boards, in particular to an FPC (flexible printed circuit) with a flexible double-layer board changing into a single-layer board and a fingerprint module.

Background

The conventional flexible double-layer board for FPC is provided with lines on both the front and back surfaces of the substrate 1, one surface is entirely wired, and the other surface is copper-plated, and some interference between signal lines is reduced by copper-plating, so that it is necessary to provide cover films on both the front and back surfaces to protect the lines.

Referring to fig. 1, a first function setting region 11 and a second function setting region 12 are provided on a substrate 1, a front cover film 7 is provided on the front surface of the substrate 1, wherein the front cover film 7 is not provided on the front surface of the second function setting region 12, but the front ink 6 is provided, and the front cover film 7 is provided on the front surface of the first function setting region 11, and a front steel sheet 5 is provided on the front cover film 7; the reverse side covering film 2 is arranged on the front side of the substrate 1, wherein the reverse side covering film 2 is not arranged on the back side of the first function setting area 11, but the reverse side ink 3 is arranged on the back side of the second function setting area 12, the reverse side covering film 2 is arranged on the back side of the second function setting area 12, and the reverse side steel sheet 4 is arranged on the reverse side covering film 2, so that the manufacturing procedures are more, and the manufacturing cost is higher.

Disclosure of Invention

The utility model aims to overcome the defects in the prior art, and provides the FPC and the fingerprint module with the flexible double-layer plate changed into the single-layer plate, which can save one surface of a cover film, cancel copper plating at a copper-laying position, improve the production efficiency of the FPC and reduce the manufacturing cost.

In order to achieve the above purpose, the utility model provides an FPC and a fingerprint module of a flexible double-layer board to single-layer board, which comprises a substrate, wherein a circuit is arranged on the back surface of the substrate, a first function setting area and a second function setting area are arranged on the substrate, a front steel sheet arranged on the front surface of the substrate and positioned in the first function setting area, front ink arranged on the front surface of the substrate and positioned in the second function setting area, a back cover film arranged on the back surface of the substrate and avoiding the first function setting area, back ink arranged on the back surface of the substrate and positioned in the first function setting area, and a back steel sheet arranged on the back cover film and positioned in the second function setting area.

According to the technical scheme, copper laying of the front circuit is canceled, the circuit is designed on the back side of the base material, the circuit on the back side is protected by the back cover film, copper plating, etching and cover film at corresponding positions are canceled in the process, the production efficiency of the FPC is improved, the exposed positions are grounded, and compared with the FPC of the flexible double-layer board, the technical scheme can improve the ESD (electro-static discharge) prevention effect and the bending resistance.

In the technical scheme, the front steel sheet or the back steel sheet is reinforced by PI reinforcing plate, FR4 reinforcing plate and steel sheet.

In the above technical scheme, the base material comprises a copper foil substrate and an insulating layer.

In the above technical scheme, the material of the reverse side covering film is the same as the material of the insulating layer.

The technical scheme also provides a capacitive fingerprint module, which comprises the FPC with the flexible double-layer plate changed into a single-layer plate in the technical scheme.

The technical scheme also provides an under-screen optical fingerprint module, which comprises the FPC with the flexible double-layer plate changed into a single-layer plate in the technical scheme.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the technical scheme, the circuit is designed on the back side of the base material, the circuit on the back side is protected by the back side covering film, copper plating, etching and covering film of the circuit on the front side are canceled in design, copper plating, etching and covering film of corresponding positions are canceled in technology, the production efficiency of the FPC is improved, the exposed position is grounded, and compared with the FPC of the flexible double-layer board, the technical scheme can improve the ESD (electro-static discharge) prevention effect and the bending resistance.

2. The technical scheme can be applied to an under-screen optical fingerprint module or an under-screen optical fingerprint module.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is an exploded view of a prior art FPC and fingerprint module with a flexible two-layer to single-layer board;

FIG. 2 is a schematic diagram of the structure of the FPC and the fingerprint module of the flexible double-layer board to single-layer board provided by the utility model;

FIG. 3 is an exploded view of a flexible two-layer to single-layer FPC and fingerprint module provided by the present utility model;

fig. 4 is a front view of the FPC of the capacitive fingerprint module flexible double-layer board to single-layer board provided by the utility model;

FIG. 5 is a reverse side view of the flexible double-layer to single-layer FPC of the capacitive fingerprint module provided by the utility model;

FIG. 6 is a front view of an FPC with an under-screen optical fingerprint module flexible double-layer board to single-layer board;

fig. 7 is a reverse side view of the FPC of the under-screen optical fingerprint module flexible double-layer board-to-single-layer board provided by the utility model.

The reference numerals of the drawings are: 1. a substrate; 11. a first function setting area; 12. a second function setting area; 2. covering a film on the back surface; 3. a reverse side ink; 4. a reverse side steel sheet; 5. a front steel sheet; 6. front side ink; 7. and (5) covering the film on the front surface.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.

In the present utility model, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" as it appears throughout includes three parallel schemes, for example "A and/or B", including the A scheme, or the B scheme, or the scheme where A and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

As shown in fig. 2 to 3, the present embodiment provides a flexible double-layer-to-single-layer-board FPC and a fingerprint module, which includes a base material 1, a reverse cover film 2, a reverse ink 3, a reverse steel sheet 4, a front steel sheet 5, and a front ink 6. Wherein, the back surface of the base material 1 is provided with a circuit, the front surface is not provided with a circuit, and the base material 1 is provided with a first function setting area 11 and a second function setting area 12. In addition, the base material 1 is a material formed by combining a copper foil substrate and an insulating layer, and the upper and lower layer circuit conduction effect can be formed through the steps of drilling, black hole, copper plating, photosensitive film pasting, exposure/development, etching/stripping.

The reverse side covering film 2 is disposed on the reverse side of the substrate 1 and avoids the first function setting region 11, and is mainly used for protecting the circuit on the reverse side of the substrate 1. The back cover film 2 is an insulating base material which is the same as the material of the insulating layer on the copper foil substrate, and then a thermosetting adhesive is coated between the back surface of the base material 1 and the back cover film 2 to play a role in protecting a circuit. The front steel sheet 5 is mounted on the front surface of the base material 1 and is located on the first function setting area 11. The reverse ink 3 is mounted on the reverse side of the substrate 1 and on the first function setting region 11, the obverse ink 6 is mounted on the obverse side of the substrate 1 and on the second function setting region 12, and the reverse steel sheet 4 is mounted on the reverse cover film 2 and on the second function setting region 12.

The conventional flexible double-layer board of FPC is provided with lines on the front and back surfaces of the substrate 1, one surface is entirely wiring, and the other surface is copper-plated, so that some interference between signal lines is reduced by copper-plating, and therefore, the lines are required to be protected by covering films on the front and back surfaces, and the manufacturing cost is high. According to the technical scheme, all circuits are designed on the back surface of the base material 1, namely, a single-sided wiring is manufactured, the circuit on the back surface is protected by the back surface covering film 2, and as the front surface of the base material 1 is exposed outside a component area and is free of circuits, copper laying of the circuit on the front surface is canceled, if copper laying on the back surface is canceled, copper plating, etching and covering film at corresponding positions are canceled technically in an FPC etching procedure, the optimization of a double-layer board to a single-layer board can be realized, one-sided covering film is canceled structurally, the manufacturing cost is reduced, and in addition, the exposed position is grounded, compared with the FPC of a flexible double-layer board, the technical scheme can improve the ESD (electro-static discharge) prevention effect and the bending resistance; according to the technical scheme, the flexible double-layer board is changed into a single-layer board, copper plating and etching procedures of a copper laying position are canceled while one surface of a covering film is saved, FPC cost is saved, and FPC production efficiency is improved.

The front steel sheet 5 or the back steel sheet 4 in the technical scheme is PI reinforcing plate or FR4 reinforcing or steel sheet reinforcing. PI reinforcing plate: the flexibility of the flexible circuit board is mainly solved, the strength of the plugging part is improved, and the whole assembly of the product is facilitated. FR4 reinforcement: the hardness, flatness, insulating property and deformation coefficient of the composite material are relatively stable, and the composite material can be selectively used according to the thickness and the reinforcing degree of the structure. Steel sheet reinforcement: 1. the flatness is good, the hardness is strong, the deformation coefficient is low, and the support device is suitable for supporting high-precision devices. 2. The material has good heat dissipation performance and can play a role in heat conduction and heat dissipation. 3. Through the windowing ground connection of the covering film, the FPC and the mainboard can have a ground connection conducting effect. The material of the front steel sheet 5 and/or the back steel sheet 4 can be changed according to actual needs.

Referring to fig. 4-5, the present embodiment further provides a capacitive fingerprint module, which includes the FPC of the flexible double-layer board-to-single-layer board described in the above technical scheme.

Referring to fig. 6-7, the present embodiment further provides an under-screen optical fingerprint module, which further includes the FPC of the flexible double-layer board-to-single-layer board in the above technical scheme.

The above examples are preferred embodiments of the present utility model, but the embodiments of the present utility model are not limited to the above examples, and any other changes, modifications, substitutions, combinations, and simplifications that do not depart from the spirit and principle of the present utility model should be made in the equivalent manner, and the embodiments are included in the protection scope of the present utility model.

Claims

1. The utility model provides a flexible double-layer board becomes FPC of single-layer board, its characterized in that, including substrate (1), be provided with the circuit on the reverse side of substrate (1), be provided with first function setting area (11) and second function setting area (12) on substrate (1), install on substrate (1) openly and be located positive steel sheet (5) of first function setting area (11), install on substrate (1) openly and be located positive printing ink (6) of second function setting area (12), set up on substrate (1) reverse side and avoid reverse side covering film (2) of first function setting area (11), install on substrate (1) reverse side and be located reverse side printing ink (3) of first function setting area (11), install on reverse side covering film (2) and be located reverse side steel sheet (4) of second function setting area (12).

2. The flexible double-layer-to-single-layer-plate FPC according to claim 1, characterized in that the front steel sheet (5) or the back steel sheet (4) is reinforced by PI reinforcing plate or FR4 reinforcing plate or steel sheet.

3. A flexible double-layer-to-single-layer-board FPC according to claim 1, characterized in that the substrate (1) comprises a copper foil substrate and an insulating layer.

4. A flexible double-layer-to-single-layer-board FPC according to claim 3, characterized in that the material of the reverse side cover film (2) is the same as that of the insulating layer.

5. A capacitive fingerprint module comprising the flexible two-layer-to-one-layer FPC of any one of claims 1-4.

6. An under-screen optical fingerprint module comprising the flexible two-layer-to-one-layer FPC of any one of claims 1-4.