CN215260845U

CN215260845U - Secondary drying device for wafer

Info

Publication number: CN215260845U
Application number: CN202120684267.2U
Authority: CN
Inventors: 周一; 毕洪伟
Original assignee: Weike Saile Microelectronics Co Ltd
Current assignee: Weike Saile Microelectronics Co Ltd
Priority date: 2021-04-02
Filing date: 2021-04-02
Publication date: 2021-12-21
Anticipated expiration: 2031-04-02

Abstract

The utility model discloses a wafer secondary drying device, including wafer drying groove and card stopper, once dry mechanism is installed to wafer drying inslot, the fixed body that keeps off is installed to the bottom in wafer drying groove, the card stopper is installed in wafer drying groove bottom through this fixed body that keeps off, the bottom in wafer drying groove still is equipped with secondary stoving mechanism, and this secondary stoving mechanism is located fixed and keeps off within the body. The utility model discloses utilize flexible component and the cooperation of the component of blowing, flexible component will rise through the wafer support after once drying, and the component of blowing is aimed at the wafer bottom and is blown hot-blastly, carries out secondary stoving process with the wafer, makes the liquid medicine on wafer surface fully volatilize, keeps wafer surface clean.

Description

Secondary drying device for wafer

Technical Field

The utility model relates to a wafer cleaning technology field, concretely relates to wafer secondary drying device.

Background

After the wafer is ground and etched, the surface of the wafer reaches a certain degree of cleanliness, but the wafer still needs to be cleaned with the chemical solution because the chemical solution remains on the surface of the wafer. The general treatment method is as follows: and (3) after the wafer is cleaned by deionized water, dehydrating the wafer by absolute ethyl alcohol, finally putting the dehydrated wafer into a clamping plug one by one, and drying residual alcohol and liquid medicine on the surfaces of the wafers in a closed environment by using a drying device.

However, in the drying process, because the card plug and the wafer have a certain contact surface, and the gap between the wafer and the wafer is small, the drying device is difficult to dry to the positions with contact or shielding, so the wafer has a certain amount of residual liquid medicine or alcohol, the drying degree is uneven, the residual liquid medicine or alcohol slides down along the wafer and is often accumulated at the bottom of the wafer, and the drying effect of the wafer is greatly reduced. The wafer is allowed to dry completely, requiring a long wait time, which increases the possibility of recontamination of the wafer surface.

SUMMERY OF THE UTILITY MODEL

In order to solve the defects, the utility model provides a wafer secondary drying device, the device have reduced the influence of stoving in-process jam to the wafer, have increased the drying efficiency on wafer surface.

In order to achieve the above purpose, the technical scheme of the utility model is as follows:

the utility model provides a wafer secondary drying device, includes wafer drying groove and card stopper, install once drying mechanism in the wafer drying groove, its key lies in: the bottom in wafer stoving groove is installed and is fixed the fender body, the card stopper is installed in wafer stoving tank bottom through this fixed fender body, the bottom in wafer stoving groove still is equipped with secondary stoving mechanism, and this secondary stoving mechanism is located fixed fender body.

By adopting the scheme, the wafer drying groove is a closed space, wafers are placed on the blocking plugs in batches after being cleaned by absolute ethyl alcohol, and are firstly dried for the first time, and the blocking plugs are arranged at the bottom of the wafer drying groove through the fixed blocking body, so that the blocking plugs can be prevented from displacing in the drying process of the drying mechanism; and primary drying is usually insufficient, and the secondary drying mechanism is recycled at the moment to dry the liquid medicine flowing to the bottom of the wafer again so as to ensure that the liquid medicine and alcohol are fully volatilized and keep the surface of the wafer clean.

Further, secondary stoving mechanism includes flexible subassembly and the subassembly of blowing, flexible subassembly is located under the card stopper, the air outlet orientation of the subassembly of blowing the flexible subassembly.

Adopt above-mentioned scheme, the flexible subassembly of secondary stoving mechanism holds up the wafer from the card stopper, and the subassembly of blowing simultaneously aims at the wafer bottom that is propped up and blows hot-blastly, through flexible subassembly and the cooperation of the subassembly of blowing, makes the liquid medicine of wafer bottom fully volatilize, and flexible subassembly descends again after the stoving finishes, puts back the wafer in the card stopper.

Furthermore, the telescopic assembly comprises a plurality of H-shaped rod pieces, all the H-shaped rod pieces are arranged in parallel and are arranged at equal intervals, and two end tops of each H-shaped rod piece are provided with V-shaped forks.

By adopting the scheme, the V-shaped fork at the top of the two ends of the H-shaped rod piece in the telescopic assembly is used as a supporting point of the wafer to support the wafer, and the bottom of the supported wafer cannot contact with the beam of the H-shaped rod piece, so that the contact between the wafer and the beam is reduced, and the drying speed of the wafer is increased.

Furthermore, the blocking plug is provided with a plurality of parallel wafer placing positions, each wafer placing position is hollow, the wafer placing positions are aligned with the H-shaped rod pieces one by one, and the width of the H-shaped rod pieces is slightly smaller than that of the wafer placing positions.

By adopting the scheme, each wafer placing position stores one wafer, and the wafers are placed more densely, so that the wafer placing positions are arranged to be hollow, and the primary drying efficiency of the wafers is increased; the wafer placing position is aligned with the H-shaped rod piece one by one, when secondary drying is carried out, the H-shaped rod piece rises to support the wafer from the wafer placing position, and the place where the wafer is contacted with the clamping plug can be fully dried. Wherein the width of the H-shaped rod is smaller than that of the wafer placing position, and the width difference between the H-shaped rod and the wafer placing position is within 0.2mm, such as: the width of the wafer placement site was 2mm, and the width of the "H" type bar member was 1.8 mm.

Furthermore, the telescopic assembly further comprises a driver, the driver comprises a driving end group and a signal receiving end, the driving end of the driver is connected with all the H-shaped rod pieces, and the signal receiving end of the driver is connected with a control system.

By adopting the scheme, the number of the driving end groups of the driver is the same as that of the H-shaped rod pieces, and the lifting of each H-shaped rod piece is controlled by the driver, wherein the generation and processing of signals of a control system and a driving device are the prior art, and are not described herein again; for example, a rat playing device, and the control system controls the driving device to drive each rat to ascend and descend.

Furthermore, the blowing assembly comprises two blowpipes, the two blowpipes are respectively arranged on two sides of the telescopic assembly, and one side of each blowpipe close to the telescopic assembly is uniformly provided with a plurality of air outlets.

By adopting the scheme, the air outlets of the two air blowing pipes are arranged oppositely, when the H-shaped rod piece supports the wafer, the air outlets blow out clean nitrogen towards the bottom of the wafer, and the wafer is dried quickly.

Furthermore, the tail end of the blowpipe is closed, the air inlet of the blowpipe is connected with an air supply system, a temperature heater is arranged between the air inlet and the air supply system, and the gas at the output end of the air supply system is heated by the temperature heater and then is conveyed into the blowpipe.

Further, the fixed blocking body is of a hollow cuboid frame structure, and the size of the fixed blocking body is matched with the bottom of the clamping plug.

By adopting the scheme, the blocking body is set to be a hollow cuboid frame structure, so that the phenomenon that the fixed blocking body blocks the wind to cause insufficient drying of the wafer is avoided.

Furthermore, the primary drying mechanism comprises blowing assemblies arranged on four top corners of the wafer drying groove, and the four blowing assemblies are all connected with the gas supply system.

Has the advantages that: the utility model discloses utilize flexible component and the cooperation of the component of blowing, flexible component will rise through the wafer support after once drying, and the component of blowing is aimed at the wafer bottom and is blown hot-blastly, carries out secondary stoving process with the wafer, makes the liquid medicine on wafer surface fully volatilize, keeps wafer surface clean.

Drawings

Fig. 1 is a schematic view of the overall assembly of the present invention.

Fig. 2 is an assembly schematic diagram of the secondary drying mechanism.

Fig. 3 is a plan view of the installation of the secondary drying mechanism and the card plug.

Fig. 4 is a schematic view of the assembly between the bayonet stopper and the fixed stopper.

Fig. 5 is a schematic view of a blowpipe.

Fig. 6 is a schematic view of an H-shaped rod.

Figure 7 is a schematic diagram of a blower assembly.

Fig. 8 is a schematic view of a blowing member.

Fig. 9 is a schematic view showing the assembly of the blowing member with the wafer drying bath.

The device comprises a wafer drying groove 1, a fixed baffle 2, a clamping plug 3, a secondary drying mechanism 4, a blowing assembly 41, a telescopic assembly 42, a temperature heater 43, a blowing pipe 411, an air outlet 412, an H-shaped rod 421, a V-shaped fork 422, a primary drying mechanism 5, a blowing element 51 and a low-temperature heater 52.

Detailed Description

Specific embodiments of the present invention will be described with reference to fig. 1 to 9.

As shown in fig. 1, fig. 2, fig. 3 and fig. 4, a wafer secondary drying device comprises a wafer drying groove 1 and a clamping plug 3, wherein a primary drying mechanism 5 is installed in the wafer drying groove 1, a fixed blocking body 2 is installed at the bottom of the wafer drying groove 1, the fixed blocking body 2 is a hollow cuboid frame structure, and the size of the fixed blocking body 2 is matched with the bottom of the clamping plug 3; the blocking plug 3 is arranged at the bottom of the wafer drying groove 1 through the fixed blocking body 2, a secondary drying mechanism 4 is further arranged at the bottom of the wafer drying groove 1, and the secondary drying mechanism 4 is located in the fixed blocking body 2. The secondary drying mechanism 4 comprises a blowing assembly 41 and a telescopic assembly 42, the telescopic assembly 42 is positioned under the card plug 3, and an air outlet of the blowing assembly 41 faces the telescopic assembly 42.

As shown in fig. 2, 3 and 6, the telescopic assembly 42 includes a plurality of H-shaped rods 421, all the H-shaped rods 421 are installed in parallel and at equal intervals between two H-shaped rods, and two end tops of each H-shaped rod 421 are both provided with V-shaped forks 422. The jam 3 is provided with a plurality of parallel wafer placing positions 31, each wafer placing position 31 is all set to hollow shape, and the wafer placing position 31 is aligned with the H-shaped rod 421 one by one, and the width of the H-shaped rod 421 is slightly smaller than that of the wafer placing position 31. The telescopic assembly 42 further comprises a driver, the driver comprises a driving end group and a signal receiving end, the driving end group of the driver is connected with all the H-shaped rod members 421, and the signal receiving end of the driver is connected with a control system.

In this embodiment, the two tips of the "H" shaped rod 421 may also be provided with U-shaped forks, which can support the wafer and protect the wafer to prevent the wafer from being broken due to the swinging when the wafer is lifted or lowered or blown by wind. And the number of the wafers and the positions of the wafers can be manually set in the control system so as to selectively drive the H-shaped rod member according to the positions of the wafers.

As shown in fig. 2, 3, 5 and 7, the blowing assembly 41 includes two blowing pipes 411, the two blowing pipes 411 are respectively disposed at two sides of the telescopic assembly 42, and a plurality of air outlets 412 are uniformly formed at one side of the blowing pipes 411 close to the telescopic assembly 42. The tail end of the blowpipe 411 is closed, the air inlet of the blowpipe 411 is connected with an air supply system, a temperature heater 43 is arranged between the air inlet and the air supply system, and the gas at the output end of the air supply system is heated by the temperature heater 43 and then conveyed into the blowpipe 411.

As shown in fig. 1 and 8, the primary drying mechanism 5 includes blowing components 51 installed at four corners of the wafer drying bath 1, and all of the four blowing components 51 are connected to the air supply system. The air outlets of the four blowing elements 51 face the plug 3, and a low-temperature heater 52 is arranged between the blowing elements 51 and the air supply system.

In this embodiment, since the wafer is stable in the chuck 3, the wind speed of the blowing element 51 of the primary drying mechanism 5 is high and the temperature is low; however, since the wafer is supported by the telescopic member 42 and the supporting point is small, the air speed of the blowing pipe 41 in the secondary drying mechanism 4 is small and the temperature is high. And the specific temperatures of the temperature heater 43 and the low temperature heater 52 may be artificially set in the control system.

Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art will understand that the present invention can be modified or replaced with other embodiments without departing from the spirit and scope of the present invention, which should be construed as follows.

Claims

1. The utility model provides a wafer secondary drying device, includes wafer drying groove and card stopper, the wafer drying inslot is installed once and is dried mechanism, its characterized in that: the bottom of the wafer drying groove is provided with a fixed baffle, the clamping plug is arranged at the bottom of the wafer drying groove through the fixed baffle, the bottom of the wafer drying groove is also provided with a secondary drying mechanism, and the secondary drying mechanism is positioned in the fixed baffle.

2. The wafer secondary drying apparatus of claim 1, wherein: the secondary drying mechanism comprises a blowing assembly and a telescopic assembly, the telescopic assembly is located under the clamping plug, and an air outlet of the blowing assembly faces towards the telescopic assembly.

3. The wafer secondary drying apparatus of claim 2, wherein: the telescopic assembly comprises a plurality of H-shaped rod pieces, all the H-shaped rod pieces are arranged in parallel and at equal intervals, and two end tops of each H-shaped rod piece are provided with V-shaped fork openings.

4. The wafer secondary drying apparatus of claim 3, wherein: the blocking plug is provided with a plurality of parallel wafer placing positions, and each wafer placing position is hollow.

5. The wafer secondary drying apparatus of claim 4, wherein: the wafer placing positions are aligned with the H-shaped rod pieces one by one, and the width of the H-shaped rod pieces is slightly smaller than that of the wafer placing positions.

6. The wafer secondary drying apparatus of claim 3, wherein: the telescopic assembly further comprises a driver, the driver comprises a driving end group and a signal receiving end, the driving end group of the driver is connected with all the H-shaped rod pieces, and the signal receiving end of the driver is connected with a control system.

7. The wafer secondary drying apparatus of claim 2, wherein: the blowing assembly comprises two blowpipes which are respectively arranged on two sides of the telescopic assembly, and one side of each blowpipe close to the telescopic assembly is evenly provided with a plurality of air outlets.

8. The wafer secondary drying apparatus of claim 7, wherein: the tail end of the blowpipe is closed, the air inlet of the blowpipe is connected with an air supply system, a temperature heater is arranged between the air inlet and the air supply system, and gas at the output end of the air supply system is heated by the temperature heater and then conveyed into the blowpipe.

9. The wafer secondary drying apparatus of claim 8, wherein: the primary drying mechanism comprises blowing elements arranged on four top corners of the wafer drying groove, and the four blowing elements are all connected with the gas supply system.

10. The wafer secondary drying apparatus of claim 1, wherein: the fixed blocking body is of a hollow cuboid frame structure, and the size of the fixed blocking body is matched with the bottom of the clamping plug.