CN215259288U

CN215259288U - Novel COB (chip on Board) package for copper substrate

Info

Publication number: CN215259288U
Application number: CN202121305108.3U
Authority: CN
Inventors: 郑先涛
Original assignee: SHENZHEN GETIAN OPTO-ELECTRONICS CO LTD
Current assignee: SHENZHEN GETIAN OPTO-ELECTRONICS CO LTD
Priority date: 2021-06-10
Filing date: 2021-06-10
Publication date: 2021-12-21
Anticipated expiration: 2031-06-10

Abstract

The utility model relates to the technical field of copper substrates, and discloses a copper substrate COB new package, which comprises a copper substrate body, wherein the top surface of the copper substrate body is provided with a circuit layer, the circuit layer comprises a copper sheet A, a copper sheet B and a copper sheet C, the bottom surfaces of the copper sheet A, the copper sheet B and the copper sheet C are all fixedly connected with the top surface of the copper substrate body, the left end of the top surface of the copper substrate body is provided with two input positive electrodes which are respectively positioned on the copper sheet A and the copper sheet B, the right end of the copper substrate body is provided with an input negative electrode which is positioned on the copper sheet C, the center of the copper substrate body is provided with mirror aluminum, the left side of the mirror aluminum is provided with two LED lamp holder positive electrodes, the right side of the mirror aluminum is provided with an LED lamp holder negative electrode, the two LED lamp holder positive electrodes are respectively connected with the two input positive electrodes through the copper sheet A and the copper sheet B, and the LED lamp holder negative electrode is connected with the input negative electrode through the copper sheet C, simple structure, convenient to use can make the more convenient installation of copper base plate body dispel the heat on the radiator.

Description

Novel COB (chip on Board) package for copper substrate

Technical Field

The utility model relates to a copper base plate technical field specifically is a new encapsulation of copper base plate COB.

Background

The copper substrate is used for fixing the LED lamp, so that the internal circuit and the control circuit are connected in a conduction mode to supply power to the LED lamp, and the copper substrate is installed on the radiator, so that the copper substrate can transfer heat generated by the LED lamp to the radiator to achieve the radiating function.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a copper base plate COB new packaging solves above-mentioned problem.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: a novel COB package of a copper substrate comprises a copper substrate body, wherein a circuit layer is arranged on the top surface of the copper substrate body and comprises a copper sheet A, a copper sheet B and a copper sheet C, the bottom surfaces of the copper sheet A, the copper sheet B and the copper sheet C are fixedly connected to the top surface of the copper substrate body, the copper sheet A and the copper sheet B are located at the left end of the copper substrate body, the copper sheet C is located at the right end of the copper substrate body, two input anodes are arranged at the left end of the top surface of the copper substrate body and are respectively located on the copper sheet A and the copper sheet B, an input cathode is arranged at the right end of the copper substrate body and is located on the copper sheet C, mirror aluminum is arranged in the center of the copper substrate body, two LED lamp holder anodes are arranged on the left side of the mirror aluminum, an LED lamp holder cathode is arranged on the right side of the mirror aluminum, the two LED lamp holder anodes are respectively connected with the two input anodes through the copper sheet A and the copper sheet B, the cathode of the LED lamp holder is connected with the input cathode through a copper sheet C.

Preferably, the locating slot has all been seted up to the left and right sides wall of copper base plate body, and the locating slot is the semicircle ring-type, and the fixed orifices that run through around all being seted up at the upper and lower both ends of copper base plate body top surface.

Preferably, the back of the copper substrate body is fixedly connected with a heat dissipation flitch, and the upper end and the lower end of the heat dissipation flitch are respectively in movable sleeved relation with the upper side wall and the lower side wall of the copper substrate body.

Preferably, annular chutes are formed in the top surfaces of the upper end and the lower end of the heat dissipation flitch, light collecting plates are movably sleeved in the two annular chutes, and the light collecting plates are of horn-shaped structures.

Preferably, the inside fretwork of solar panel and the front and back both sides of solar panel all are the opening form, and both ends are provided with two radiating fin A respectively about the solar panel back.

Preferably, four radiating fin A's bottom all is the fixed connection relation with the bottom of solar panel, and four radiating fin A's inside all is fixed to be emboliaed and has been had heat pipe A and heat pipe B, and heat pipe A and heat pipe B all are the loop configuration.

Preferably, the solar panel back is provided with eight radiating fin B, and eight radiating fin B are located the upper and lower both ends of solar panel respectively, and eight radiating fin B all fix the embolia on the outer wall of heat pipe A and heat pipe B.

(III) advantageous effects

Compared with the prior art, the utility model provides a new encapsulation of copper base plate COB possesses following beneficial effect:

1. this new packaging technology of copper base plate COB, through the circuit layer, the input is anodal, the input negative pole, the LED lamp stand is anodal, the LED lamp stand negative pole, the setting of constant head tank and fixed orifices, be connected with external control circuit respectively through two input anodal and input negative poles, thereby respectively through copper sheet A, copper sheet B and copper sheet C give the LED lamp power supply, constant head tank and fixed orifices on the copper base plate body can be convenient carry out fixed mounting with the copper base plate body, compare current copper base plate packaging technology, moreover, the steam generator is simple in structure, high durability and convenient use, can make the more convenient installation of copper base plate body dispel the heat on the radiator.

2. The novel COB packaging process for the copper substrate comprises the steps that through the arrangement of a heat dissipation pasting plate, a light gathering plate, a heat dissipation fin A, a heat dissipation fin B, a heat conduction pipe A and a heat conduction pipe B, the light gathering plate on the front side of a copper substrate body can gather LED light, scattering of a light source is reduced, brightness of an LED lamp is increased, meanwhile, the light gathering plate has a heat insulation effect, the situation that parts around the copper substrate body are damaged due to overhigh temperature when the copper substrate body works is prevented, heat on the copper substrate body is transferred to the heat dissipation pasting plate through the heat dissipation pasting plate, the heat is transferred and dispersed through the heat dissipation fin A on the back side of the light gathering plate and is respectively transferred to the heat conduction pipe A and the heat conduction pipe B and finally transferred to the heat dissipation fin B, heat dissipation of the copper substrate body is effectively achieved through the arrangement of the heat dissipation fin A, the heat conduction pipe B and the heat dissipation fin B, and the heat dissipation fin A, The heat conduction pipe A, the heat conduction pipe B and the heat dissipation fins B can also dissipate heat of the light gathering plate, so that the phenomenon that the temperature of the copper substrate body is concentrated in the light gathering plate when the copper substrate body is used to cause the temperature of the LED lamp to be too high and increase energy consumption is avoided, and the heat dissipation effect of the copper substrate body is better.

Drawings

FIG. 1 is a front view of the present invention;

fig. 2 is a front view of the copper substrate body of the present invention;

fig. 3 is a front view of the copper substrate body and the heat dissipation attachment plate of the present invention;

FIG. 4 is a rear view of the heat dissipation patch of the present invention;

FIG. 5 is a front view of the heat dissipation plate of the present invention;

fig. 6 is a rear view of the light-gathering plate of the present invention.

In the figure: 1. a copper substrate body; 2. a circuit layer; 21. a copper sheet A; 22. a copper sheet B; 23. a copper sheet C; 3. inputting a positive electrode; 4. inputting a negative electrode; 5. an LED lamp holder anode; 6. a cathode of the LED lamp holder; 7. mirror aluminum; 8. positioning a groove; 9. a fixing hole; 10. a heat dissipation pasting plate; 11. an annular chute; 12. a light-gathering plate; 13. A heat dissipation fin A; 14. a heat conduction pipe A; 15. a heat conduction pipe B; 16. and a heat dissipation fin B.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-6, a new package of a copper substrate COB comprises a copper substrate body 1, a circuit layer 2 is disposed on a top surface of the copper substrate body 1, the circuit layer 2 includes a copper sheet a21, a copper sheet B22 and a copper sheet C23, bottom surfaces of the copper sheet a21, the copper sheet B22 and the copper sheet C23 are all fixedly connected to the top surface of the copper substrate body 1, the copper sheet a21 and the copper sheet B22 are located at a left end of the copper substrate body 1, the copper sheet C23 is located at a right end of the copper substrate body 1, two input anodes 3 are disposed at the left end of the top surface of the copper substrate body 1, the two input anodes 3 are respectively located on the copper sheet a21 and the copper sheet B22, an input cathode 4 is disposed at a right end of the copper substrate body 1, the input cathode 4 is located on the copper sheet C23, a mirror surface aluminum 7 is disposed at a center of the copper substrate body 1, two LED socket anodes 5 are disposed at a left side of the mirror surface aluminum 7, an LED socket cathode 6 is disposed at a right side of the mirror surface aluminum base 7, and two LED socket anodes 5 are respectively connected to the input cathode 363 through a21 and a copper sheet B22, the LED lamp holder cathode 6 is connected with the input cathode 4 through a copper sheet C23, the left side wall and the right side wall of the copper substrate body 1 are respectively provided with a positioning groove 8, the positioning grooves 8 are in a semicircular shape, the upper end and the lower end of the top surface of the copper substrate body 1 are respectively provided with a fixing hole 9 which penetrates through the copper substrate body from front to back, the back surface of the copper substrate body 1 is fixedly connected with a heat dissipation pasting plate 10, the upper end and the lower end of the heat dissipation pasting plate 10 are respectively in movable sleeved relation with the upper side wall and the lower side wall of the copper substrate body 1, the top surfaces of the upper end and the lower end of the heat dissipation pasting plate 10 are respectively provided with an annular chute 11, a light gathering plate 12 is movably sleeved inside the two annular chutes 11, the light gathering plate 12 is in a horn-shaped structure, the inner part of the light gathering plate 12 is hollowed, the front surface and the back surface of the light gathering plate 12 are both open, the left end and the right end of the back surface of the light gathering plate 12 are respectively provided with two heat dissipation fins A13, the bottom ends of the four heat dissipation fins A13 are in fixed connection relation with the bottom end of the light gathering plate 12, the inside of four radiating fin A13 all is fixed to embolia has heat pipe A14 and heat pipe B15, and heat pipe A14 and heat pipe B15 all are loop configuration, and the solar panel 12 back is provided with eight radiating fin B16, and eight radiating fin B16 are located the upper and lower both ends of solar panel 12 respectively, and eight radiating fin B16 all are fixed embolia on heat pipe A14 and heat pipe B15's outer wall.

When the LED lamp is used, the two input anodes 3 and the two input cathodes 4 are respectively connected with an external control circuit, so that the LED lamp is respectively supplied with power through the copper sheets A21, the copper sheets B22 and the copper sheets C23, the copper substrate body 1 can be conveniently and fixedly installed through the positioning grooves 8 and the fixing holes 9 on the copper substrate body 1, the structure is simple, the use is convenient, the copper substrate body 1 can be more conveniently installed on a radiator for radiating, the LED lamp light can be focused through the light-gathering plate 12 on the front side of the copper substrate body 1, the scattering of a light source is reduced, the brightness of the LED lamp is increased, meanwhile, the light-gathering plate 12 has a heat insulation effect, the situation that zero devices around the copper substrate body 1 are damaged due to overhigh temperature when the copper substrate body 1 works is prevented, the heat on the copper substrate body 1 is transmitted to the heat-radiating pasting plate 10 through the heat-radiating pasting plate 10, the heat is transmitted and dispersed through the heat-radiating fins A13 on the back side of the light-gathering plate 12 through the heat-radiating pasting plate 10, conduct respectively to on heat pipe A14 and the heat pipe B15, and finally still can transmit to on the radiating fin B16, through radiating fin A13, heat pipe A14, heat pipe B15 and radiating fin B16's setting has effectively realized the heat dissipation to copper base plate body 1, radiating fin A13 simultaneously, heat pipe A14, heat pipe B15 and radiating fin B16 also can dispel the heat to the solar panel 12, prevent that copper base plate body 1 from leading to the too high power consumption of LED lamp temperature to increase in the solar panel 12 when using temperature is concentrated in, thereby make the radiating effect of copper base plate body 1 better.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a new encapsulation of copper base plate COB, includes copper base plate body (1), its characterized in that: the LED lamp base comprises a copper base body (1), wherein a circuit layer (2) is arranged on the top surface of the copper base body (1), the circuit layer (2) comprises a copper sheet A (21), a copper sheet B (22) and a copper sheet C (23), the bottom surfaces of the copper sheet A (21), the copper sheet B (22) and the copper sheet C (23) are fixedly connected to the top surface of the copper base body (1), the copper sheet A (21) and the copper sheet B (22) are located at the left end of the copper base body (1), the copper sheet C (23) is located at the right end of the copper base body (1), two input anodes (3) are arranged at the left end of the top surface of the copper base body (1), the two input anodes (3) are respectively located on the copper sheet A (21) and the copper sheet B (22), an input cathode (4) is arranged at the right end of the copper base body (1), the input cathode (4) is located on the copper sheet C (23), mirror surface aluminum (7) is arranged at the center of the copper base body (1), and two LED lamp base anodes (5) are arranged on the left side of the mirror surface aluminum (7), the right side of the mirror surface aluminum (7) is provided with an LED lamp holder cathode (6), the two LED lamp holder anodes (5) are respectively connected with the two input anodes (3) through a copper sheet A (21) and a copper sheet B (22), and the LED lamp holder cathode (6) is connected with the input cathode (4) through a copper sheet C (23).

2. The COB new package with copper substrate of claim 1, wherein: constant head tank (8) have all been seted up to the left and right sides wall of copper base plate body (1), and constant head tank (8) are the semicircle ring-type, and fixed orifices (9) that run through around all are seted up at the upper and lower both ends of copper base plate body (1) top surface.

3. The COB new package with copper substrate of claim 1, wherein: the back of the copper substrate body (1) is fixedly connected with a heat dissipation flitch (10), the upper end and the lower end of the heat dissipation flitch (10) are respectively in movable sleeved relation with the upper side wall and the lower side wall of the copper substrate body (1), and the top surfaces of the upper end and the lower end of the heat dissipation flitch (10) are provided with annular sliding grooves (11).

4. The COB new package with copper substrates of claim 3, wherein: the light collecting plate (12) is movably sleeved in the inner portion of the annular sliding groove (11), the light collecting plate (12) is of a horn-shaped structure, the inner portion of the light collecting plate (12) is hollow, the front face and the rear face of the light collecting plate (12) are both open, and two radiating fins A (13) are arranged at the left end and the right end of the back face of the light collecting plate (12) respectively.

5. The COB new package with copper substrates of claim 4, wherein: four the bottom of radiating fin A (13) all is the fixed connection relation with the bottom of solar panel (12), and the inside of four radiating fin A (13) all is fixed to be emboliaed has heat pipe A (14) and heat pipe B (15), and heat pipe A (14) and heat pipe B (15) all are the loop configuration.

6. The COB new package with copper substrate of claim 5, wherein: eight radiating fins B (16) are arranged on the back of the light collecting plate (12), the eight radiating fins B (16) are respectively located at the upper end and the lower end of the light collecting plate (12), and the eight radiating fins B (16) are fixedly sleeved on the outer walls of the heat conducting pipes A (14) and the heat conducting pipes B (15).