CN215251161U - Powder atomic layer deposition device for preventing powder from being adhered to inner wall - Google Patents

Abstract

The utility model provides a prevent that powder from being stained with glutinous powder atomic layer deposition device at inner wall mainly includes a vacuum cavity, a shaft seal device, a drive unit and a knocking device. The driving unit is connected with the rear wall of the vacuum cavity through a shaft seal device and drives the vacuum cavity to rotate. The shaft seal device comprises an outer tube body and an inner tube body, wherein the inner tube body is arranged in the accommodating space of the outer tube body. The knocking device comprises a wheel body and a knocking unit, wherein the wheel body is connected with the shaft sealing device or the vacuum cavity. At least one convex part is arranged on the wheel surface of the wheel body, and the knocking unit is contacted with the convex part and the wheel surface of the wheel body. When the wheel body rotates, the knocking unit moves to the wheel surface from the protruding part and knocks the wheel surface or the vacuum cavity of the wheel body, so that powder in the reaction space is prevented from being adhered to the inner surface or the inner wall of the vacuum cavity.

Description

Powder atomic layer deposition device for preventing powder from being adhered to inner wall

Technical Field

The utility model relates to a prevent that powder atomic layer deposition device that glues at inner wall is stained with to powder, adjacent with the vacuum cavity including a knocking device, can drive knocking device when the vacuum cavity rotates and strike the vacuum cavity to avoid the powder in the reaction space to be stained with and glue internal surface or the inner wall at the vacuum cavity.

Background

Nanoparticles (nanoparticles) are generally defined as particles smaller than 100 nm in at least one dimension, which are physically and chemically distinct from macroscopic materials. In general, the physical properties of macroscopic materials are independent of their size, but nanoparticles are not, and thus have potential applications in biomedical, optical, and electronic fields.

Quantum dots (Quantum dots) are nanoparticles of semiconductors, and the currently studied semiconductor materials are II-VI materials, such as ZnS, CdS, CdSe, etc., of which CdSe is the most drawing attention. The size of the quantum dot is usually between 2 and 50 nm, and after the quantum dot is irradiated by ultraviolet rays, electrons in the quantum dot absorb energy and transition from a valence band to a conduction band. The excited electrons release energy by luminescence when they return from the conduction band to the valence band.

The energy gap of the quantum dot is related to the size of the quantum dot, the larger the size of the quantum dot is, the smaller the energy gap is, the longer wavelength light can be emitted after irradiation, and the smaller the size of the quantum dot is, the larger the energy gap is, the shorter wavelength light can be emitted after irradiation. For example, 5 to 6 nm quantum dots emit orange or red light, while 2 to 3 nm quantum dots emit blue or green light, depending on the material composition of the quantum dots.

Light generated by Light Emitting Diodes (LEDs) employing quantum dots can approach a continuous spectrum while having high color rendering properties and facilitating improvement of the light emitting quality of the LEDs. In addition, the wavelength of the emitted light can be adjusted by changing the size of the quantum dots, so that the quantum dots become the development focus of a new generation of light-emitting devices and displays.

Although the quantum dots have the advantages and characteristics, the quantum dots are easy to agglomerate in the application or manufacturing process. In addition, the quantum dots have higher surface activity and are easy to react with air and water vapor, so that the service life of the quantum dots is shortened.

In particular, when quantum dots are made into the sealant of the light emitting diode, an agglomeration effect may be generated, thereby reducing the optical performance of the quantum dots. In addition, after the quantum dots are manufactured into the sealant of the light emitting diode, external oxygen or moisture may still penetrate through the sealant to contact the surfaces of the quantum dots, so that the quantum dots are oxidized, and the efficiency or the service life of the quantum dots and the light emitting diode is affected. Surface defects and dangling bonds (dangling bonds) of the quantum dots can also cause non-radiative recombination (non-radiative recombination), which also affects the luminous efficiency of the quantum dots.

At present, the quantum well structure is formed by forming a thin film with a thickness of nanometer on the surface of the quantum dot through Atomic Layer Deposition (ALD), or forming a plurality of thin films on the surface of the quantum dot.

The atomic layer deposition can form a thin film with uniform thickness on the substrate, can effectively control the thickness of the thin film, and is theoretically suitable for three-dimensional quantum dots. When the quantum dots are placed on the carrier plate, contact points exist between adjacent quantum dots, so that precursors for atomic layer deposition cannot contact the contact points, and a thin film with uniform thickness cannot be formed on the surfaces of all the nano-particles.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem that above-mentioned prior art faces, the utility model provides a prevent that powder is stained with glutinous powder atomic layer deposition device at the inner wall, mainly set up a knocking device on vacuum cavity or bearing seal device to strike vacuum cavity through knocking device, make vacuum cavity's internal surface or inner wall produce vibrations, shake to be stained with glutinous powder on vacuum cavity internal surface or inner wall with the deposition process.

An object of the utility model is to provide a prevent that powder from being stained with glutinous powder atomic layer deposition device at the inner wall, mainly include a drive unit, an axle seal device, a vacuum cavity and a knocking device, wherein drive unit passes through the bearing seal device and connects and drive the rotation of vacuum cavity.

The knocking device comprises a wheel body and a knocking unit, wherein the wheel body is connected with the shaft seal device or the vacuum cavity, and at least one bulge part is arranged on the wheel surface of the wheel body. The knocking unit is in contact with the protruding portion and the wheel surface of the wheel body, and in the rotating process of the wheel body, the knocking unit can move to the wheel surface from the protruding portion and knock the wheel surface or the vacuum cavity of the wheel body, so that the vacuum cavity generates vibration to remove powder stuck on the inner surface or the inner wall of the vacuum cavity.

An object of the utility model is to provide a prevent that powder from being stained with glutinous powder atomic layer deposition device at the inner wall, mainly include a drive unit, a shaft seal device, a vacuum cavity and a knocking device, wherein drive unit passes through shaft seal device and connects vacuum cavity, and knocking device then sets up on shaft seal device or vacuum cavity. When the driving unit drives the vacuum cavity to rotate through the shaft seal device, the wheel body of the knocking device rotates, and the knocking part of the knocking unit can move back and forth between the boss part and the wheel surface of the wheel body and knock the wheel surface or the vacuum cavity of the wheel body.

Particularly, the utility model provides a knocking device need not additionally set up the motor, alright make the portion of knocking the unit continuously strike vacuum cavity and/or wheel body, can simplify powder atomic layer deposition device's structure and cost of manufacture, reach the purpose of getting rid of the powder of being stained with glutinous simultaneously.

The utility model discloses a knocking device includes a wheel body and a unit of strikeing, wherein strikes the unit and includes a portion of strikeing and a fixed part. The knocking part is connected with the fixing part through at least one guide unit, so that the knocking part can move relative to the fixing part along the guide unit and knock the wheel surface and/or the vacuum cavity of the wheel body.

In order to achieve the above object, the present invention provides a powder atomic layer deposition device for preventing powder from being adhered to an inner wall, including: a vacuum chamber including a reaction space for accommodating a plurality of powders; a shaft seal device connected with the vacuum cavity and comprising an outer tube and an inner tube, wherein the outer tube is provided with a containing space for containing the inner tube; the driving unit is connected with the shaft sealing device and drives the vacuum cavity to rotate through the shaft sealing device; at least one gas extraction pipeline positioned in the inner pipe body, is in fluid connection with the reaction space of the vacuum cavity and is used for extracting gas in the reaction space; at least one gas inlet pipeline, which is positioned in the inner tube body, is in fluid connection with the reaction space of the vacuum cavity and is used for conveying a precursor gas to the reaction space; and a tapping device, comprising: the wheel body is connected with the shaft seal device or the vacuum cavity and rotates along with the shaft seal device, wherein at least one bulge part is arranged on a wheel surface of the wheel body, the bulge part comprises a first surface and a second surface, one side of the first surface and one side of the second surface are connected with the wheel surface of the wheel body, the other ends of the first surface and the second surface are connected with each other, and an included angle between the first surface and the wheel surface of the wheel body is larger than 90 degrees; and the knocking unit is adjacent to the wheel body, and can displace between the convex part and the wheel surface of the wheel body when the wheel body rotates and knock the wheel surface or the vacuum cavity of the wheel body.

The powder atomic layer deposition device for preventing powder from being stuck on the inner wall comprises a knocking unit and a wheel body, wherein the knocking unit comprises a knocking part and a fixing part, and the knocking part is connected with the fixing part and used for displacing relative to the fixing part and the wheel body.

The powder atomic layer deposition device for preventing powder from being stuck on the inner wall comprises a knocking unit, wherein the knocking unit comprises an elastic unit connected with a knocking part, and the elastic unit provides restoring force towards the wheel body for the knocking unit.

Prevent that the powder from being stained with the powder atomic layer deposition device who glues at the inner wall, wherein strike the unit and include that a buffer portion connects and strike the portion, strike the portion and strike vacuum cavity or wheel body via buffer portion.

The powder atomic layer deposition device for preventing powder from being stuck on the inner wall is characterized in that an included angle between the second surface and the wheel surface of the wheel body is smaller than 90 degrees.

The atomic layer deposition device for preventing the powder from being adhered to the inner wall comprises a gas inlet pipeline and a gas outlet pipeline, wherein the gas inlet pipeline comprises at least one non-reaction gas conveying pipeline and at least one reaction gas conveying pipeline, the non-reaction gas conveying pipeline is used for conveying a non-reaction gas to the reaction space so as to blow the powder in the reaction space, and the reaction gas conveying pipeline is used for conveying a precursor gas to the reaction space.

The powder atomic layer deposition device for preventing the powder from being stuck on the inner wall is characterized in that the non-reaction gas conveying pipeline comprises an extension pipeline, and the extension pipeline is positioned in the reaction space.

The device for preventing powder from being adhered to the inner wall of the atomic layer deposition device comprises a filtering unit, wherein the filtering unit is positioned at one end of an inner pipe body connected with a reaction space, an air exhaust pipeline is in fluid connection with the reaction space through the filtering unit, and an extension pipeline penetrates through the filtering unit.

The powder atomic layer deposition device for preventing the powder from being stuck on the inner wall is characterized in that the inner tube body extends to the reaction space of the vacuum cavity body from the accommodating space of the outer tube body, and a protruding tube part is formed in the reaction space.

The powder atomic layer deposition device for preventing powder from being adhered to the inner wall comprises a vacuum cavity, wherein the vacuum cavity comprises a front wall, a rear wall and a side wall, the front wall faces the rear wall, the front wall is connected with the rear wall through the side wall, a reaction space is formed among the front wall, the rear wall and the side wall, and the knocking device is adjacent to the rear wall of the vacuum cavity.

The utility model has the advantages that: the utility model provides a novel prevent that powder is stained with and glues powder atomic layer deposition device at inner wall mainly sets up a knocking device on vacuum cavity or bearing seal device to strike vacuum cavity through the knocking device, make vacuum cavity's internal surface or inner wall produce vibrations, shake the powder that is stained with and glues on vacuum cavity internal surface or inner wall with the deposition process and fall.

Drawings

Fig. 1 is a schematic front side view of an embodiment of the atomic layer deposition apparatus for preventing powder from adhering to an inner wall of the present invention.

Fig. 2 is a schematic cross-sectional view of an embodiment of the powder atomic layer deposition apparatus of the present invention for preventing powder from adhering to the inner wall.

Fig. 3 is a schematic cross-sectional view of an embodiment of a shaft sealing device of the powder atomic layer deposition device for preventing powder from being adhered to an inner wall of the present invention.

Fig. 4 is a schematic rear side view of an embodiment of the atomic layer deposition apparatus for preventing powder from adhering to an inner wall of the apparatus.

Fig. 5 is a schematic side view of an embodiment of the knocking device for preventing powder from adhering to the inner wall of the powder ald device.

FIG. 6 is a schematic cross-sectional view of another embodiment of the atomic layer deposition apparatus for preventing powder from adhering to an inner wall of the present invention.

FIG. 7 is a schematic cross-sectional view of another embodiment of the atomic layer deposition apparatus for preventing powder from adhering to an inner wall of the present invention.

Description of reference numerals:

10-a powder atomic layer deposition device for preventing powder from sticking to the inner wall; 11-vacuum chamber; 111-front wall; 113-rear wall; 115-side walls; 117-cover plate; 119-a cavity; 12-a reaction space; 121-powder; 13-a shaft seal device; 130-a protruding tube portion; 131-an outer body; 132-a containing space; 133-an inner tube; 134-a connection space; 139-a filtration unit; 14-a rapping device; 141-wheel body; 1411-wheel face; 143-a tapping unit; 1431-knock section; 1433-fixation section; 1435-a guide unit; 1437-an elastic unit; 145-a boss; 1451-a first surface; 1453-a second surface; 147-a buffer; 15-a drive unit; 16-a heating device; 171-a suction line; 172-extension line; 1721-air outlet; 173-an air intake line; 175-non-reactive gas delivery line; 177-a heater; 179-temperature sensing unit; 191-a carrier; 193-first support frame; 195-a second support.

Detailed Description

Please refer to fig. 1, fig. 2 and fig. 3, which are a front side schematic view, a cross-sectional view and a cross-sectional view of an embodiment of a shaft sealing device of the powder atomic layer deposition device for preventing powder from being adhered to an inner wall according to an embodiment of the powder atomic layer deposition device for preventing powder from being adhered to an inner wall of the present invention. As shown in the figure, the atomic layer deposition device 10 for preventing powder from sticking to the inner wall mainly includes a vacuum chamber 11, a shaft seal device 13, a driving unit 15 and a knocking device 14, wherein the driving unit 15 is connected to the vacuum chamber 11 through the shaft seal device 13 and drives the vacuum chamber 11 to rotate.

In one embodiment of the present invention, the vacuum chamber 11 includes a front wall 111, a rear wall 113 and a side wall 115, wherein the front wall 111 faces the rear wall 113, and the side wall 115 is located between the front wall 111 and the rear wall 113 and connects the front wall 111 and the rear wall 113 to form a reaction space 12 between the front wall 111, the rear wall 113 and the side wall 115.

The reaction space 12 is used for accommodating a plurality of powders 121, wherein the powders 121 may be Quantum dots (Quantum dots), such as ZnS, CdS, CdSe, and other II-VI semiconductor materials, and the thin film formed on the Quantum dots may be aluminum oxide (Al2O 3). In one embodiment of the present invention, the vacuum chamber 11 may include a cover 117 and a chamber 119, wherein the cover 117 is used to cover and connect with the chamber 119 to form the reaction space 12 therebetween. The lid 117 may be the front wall 111 of the vacuum chamber 11, while the chamber 119 is formed by the rear wall 113 and the side walls 115 of the vacuum chamber 11.

The shaft seal device 13 is connected to the rear wall 113 of the vacuum chamber 11 and includes an outer tube 131 and an inner tube 133, wherein the outer tube 131 has an accommodating space 132, and the inner tube 133 has a connecting space 134, for example, the outer tube 131 and the inner tube 133 may be hollow cylinders. The accommodating space 132 of the outer tube 131 is used for accommodating the inner tube 133, wherein the outer tube 131 and the inner tube 133 are coaxially disposed. The shaft seal device 13 can be a common shaft seal or a magnetic fluid shaft seal, and is mainly used to isolate the reaction space 12 of the vacuum chamber 11 from the external space to maintain the vacuum of the reaction space 12.

The driving unit 15 connects one end of the shaft sealing device 13, and the other end of the shaft sealing device 13 connects the rear wall 113 of the vacuum chamber 11. The driving unit 15 drives the vacuum chamber 11 to rotate through the shaft sealing device 13, for example, the driving unit 15 is a motor, and is connected to the rear wall 113 of the vacuum chamber 11 through the outer tube 131, and drives the vacuum chamber 11 to rotate through the outer tube 131. In addition, the driving unit 15 is not connected to the inner tube 133, so that the inner tube 133 does not rotate when the driving unit 15 drives the outer tube 131 and the vacuum chamber 11 to rotate.

The driving unit 15 can drive the outer tube 131 and the vacuum chamber 11 to rotate continuously in the same direction, for example, clockwise or counterclockwise. The vacuum chamber 11 stirs the powder 121 in the reaction space 12 during rotation, so that the powder 121 is uniformly heated and contacts with the precursor or the non-reactive gas.

At least one pumping line 171, at least one gas inlet line 173, at least one non-reactive gas delivery line 175, a heater 177 and/or a temperature sensing unit 179 may be disposed in the connection space 134 of the inner tube 133, as shown in fig. 2 and 3.

The gas pumping line 171 is fluidly connected to the reaction space 12 of the vacuum chamber 11 and is used for pumping out the gas in the reaction space 12, so that the reaction space 12 is in a vacuum state for performing the atomic layer deposition process. Specifically, the gas exhaust line 171 may be connected to a pump, and the gas in the reaction space 12 is exhausted by the pump.

The gas inlet line 173 is fluidly connected to the reaction space 12 of the vacuum chamber 11 and is configured to deliver a precursor and/or a non-reactive gas to the reaction space 12, wherein the non-reactive gas may be an inert gas such as nitrogen or argon. In practice, the gas inlet line 173 may deliver a carrier gas (carrier gas) and the precursor into the reaction space 12. The gas inlet line 173 also delivers non-reactive gases into the reaction space 12 and evacuates them through the evacuation line 171 to remove the precursors from the reaction space 12. In one embodiment of the present invention, the gas inlet 173 may be connected to a plurality of branch lines, and sequentially deliver different precursors into the reaction space 12 through each branch line.

The gas inlet line 173 may increase the flow rate of the non-reactive gas supplied to the reaction space 12 and blow the powder 121 in the reaction space 12 by the non-reactive gas, so that the powder 121 is diffused to various regions of the reaction space 12 by the non-reactive gas.

In one embodiment of the present invention, the gas inlet line 173 may include at least one non-reactive gas delivery line 175 and at least one reactive gas delivery line. The non-reactive gas delivery line 175 is fluidly connected to the reaction space 12 of the vacuum chamber 11 and is configured to deliver a non-reactive gas to the reaction space 12, while the reactive gas delivery line is configured to deliver precursor gases to the reaction space 12. The non-reactive gas is used to blow the powder 121 in the reaction space 12, and the driving unit 15 is used to drive the vacuum chamber 11 to rotate, so as to effectively and uniformly stir the powder 121 in the reaction space 12 and deposit a thin film with uniform thickness on the surface of each powder 121. The reactant gas delivery line is fluidly connected to the reaction space 12 and is configured to deliver the precursor to the reaction space 12.

The vacuum chamber 11 is driven to rotate by the driving unit 15 via the shaft sealing device 13 and the non-reactive gas is delivered to the reaction space 12 through the gas inlet line 173, although the powder 121 in the reaction space 12 may be stirred. However, in practical applications, a certain amount of the powder 121 may stick to the inner surface or the inner wall of the vacuum chamber 11, so that the precursor transported to the reaction space 12 cannot contact the powder 121 sticking to the vacuum chamber 11, and a thin film with a uniform thickness cannot be formed on all the surfaces of the powder 121.

In order to solve the above and other problems encountered in the prior art, the present invention provides a knocking device 14 disposed on the vacuum chamber 11 or the shaft seal device 13, wherein the knocking device 14 includes a wheel 141 and a knocking unit 143, and the knocking unit 143 contacts the wheel 141. The wheel body 141 is connected to the vacuum chamber 11 or the shaft seal device 13 and rotates with the shaft seal device 13 and/or the vacuum chamber 11, wherein the wheel body 141 can be fastened to the rear wall 113 or the sidewall 115 of the vacuum chamber 11 by screws, or the wheel body 141 is sleeved on the shaft seal device 13.

The wheel surface 1411 of the wheel body 141 is provided with at least one protrusion 145, as shown in fig. 4 and 5, wherein the protrusion 145 may protrude toward the radial outer side of the wheel body 141 and be inclined spirally with the center of the wheel body 141. In an embodiment of the present invention, the protruding portion 145 of the wheel 141 includes a first surface 1451 and a second surface 1453, wherein one side of the first surface 1451 and the second surface 1453 is connected to the wheel surface 1411 of the wheel 141, and the other side of the first surface 1451 and the second surface 1453 is connected to each other. The included angle between first surface 1451 and second surface 1453 is less than 90 degrees, the included angle between first surface 1451 and wheel surface 1411 is greater than 90 degrees, and the included angle between second surface 1453 and wheel surface 1411 is less than 90 degrees.

The knocking unit 143 is adjacent to the wheel body 141, wherein the knocking unit 143 is displaced between the protrusion 145 and the wheel surface 1411 of the wheel body 141 when the wheel body 141 rotates, and knocks the wheel surface 1411 of the wheel body 141 or the vacuum chamber 11.

Specifically, the striking unit 143 includes a striking portion 1431 and a fixing portion 1433, wherein the striking portion 1431 is connected to the fixing portion 1433 and can be displaced relative to the fixing portion 1433. The knocking portion 1431 may be connected to the fixing portion 1433 through at least one guide unit 1435, for example, the guide unit 1435 may be a guide rail or a guide groove, so that the knocking portion 1431 may be displaced along the guide unit 1435 with respect to the fixing portion 1433.

The knocking portion 1431 of the knocking unit 143 contacts the outer periphery or the outer surface of the wheel body 141, and the knocking portion 1431 is reversely moved between the protrusion 145 and the wheel surface 1411 when the wheel body 141 rotates. Specifically, when the wheel 141 rotates along with the vacuum chamber 11 and/or the shaft seal device 13, the knocking portion 1431 moves to the first surface 1451 of the protrusion 145 along the wheel surface 1411, and moves away from the wheel 141 along with the first surface 1451 relative to the fixing portion 1433. When the striking portion 1431 is displaced to the boundary between the first surface 1451 and the second surface 1453, the striking portion 1431 is displaced from the protrusion 145 toward the wheel surface 1411, and strikes the wheel surface 1411 of the wheel 141 and/or the vacuum chamber 11. In an embodiment of the present invention, the striking portion 1431 may be displaced from the protrusion 145 to the wheel surface 1411 along the radial direction of the wheel body 141, wherein the striking portion 1431 of the striking unit 143 may not contact the second surface 1453 of the protrusion 145 during the rotation process of the wheel body 141 relative to the striking unit 143.

In an embodiment of the present invention, the knocking unit 143 may be disposed at the upper half portion of the wheel body 141, and when the wheel body 141 rotates relative to the knocking unit 143, the knocking portion 1431 may receive the action of gravity, and is displaced or falls down toward the wheel surface 1411 by the protruding portion 145. In practical applications, the striking portion 1431 may be connected to a weight, or the weight of the striking portion 1431 may be increased to increase the force of the striking portion 1431 striking the wheel 141 and/or the vacuum chamber 11.

In another embodiment of the present invention, the knocking portion 1431 may be connected to an elastic unit 1437, for example, the knocking portion 1431 may be connected to the fixing portion 1433 through the elastic unit 1437, and the restoring force of the elastic unit 1437 drives the knocking portion 1431 to be displaced from the protrusion 145 toward the wheel surface 1411.

When the striking part 1431 strikes the wheel 141 and/or the sidewall 115 of the vacuum chamber 11, the vacuum chamber 11 vibrates, so that the sticky powder 121 leaves the inner surface or the inner wall of the vacuum chamber 11 and scatters in the reaction space 12 of the vacuum chamber 11. Through the arrangement of the driving unit 15, the air inlet pipeline 173 and the knocking device 14, the problem that the powder 121 is stuck to the vacuum cavity 11 can be effectively solved, and the powder 121 can be formed on the surface of most of the powder 121 to form a thin film with uniform thickness.

In an embodiment of the present invention, a buffer portion 147 may be disposed on the knocking portion 1431, as shown in fig. 6, wherein the knocking portion 1431 knocks the wheel 141 and/or the sidewall 115 of the vacuum chamber 11 through the buffer portion 147 to avoid damage to the vacuum chamber 11 and/or the knocking device 14 during knocking, for example, the buffer portion 147 may be a rubber pad.

The utility model discloses a knocking device 14 is adjacent with lateral wall 115 or back wall 113 of vacuum cavity 11, can not interfere the line of action of dismantling or installing vacuum cavity 11 and/or apron 117 to be favorable to simplifying design and configuration that prevents that the powder from being stained with glutinous powder atomic layer deposition device 10 at the inner wall.

Furthermore the utility model discloses a knocking device 14 need not set up drive arrangement, for example the motor, only needs to set up wheel body 141 on vacuum cavity 11 or shaft seal device 13, then drives shaft seal device 13 and vacuum cavity 11 through drive unit 15 and rotates, and knocking portion 1431 just can make a round trip to move between bellying 145 and wheel face 1411 to continuously knock wheel body 141 and/or vacuum cavity 11.

The gas inlet line 173 and the non-reactive gas delivery line 175 of the atomic layer deposition device 10 for preventing powder from adhering to the inner wall are used to deliver non-reactive gas to the reaction space 12, wherein the gas inlet line 173 delivers a smaller flow of non-reactive gas to mainly remove the precursor in the reaction space 12, and the non-reactive gas delivery line 175 delivers a larger flow of non-reactive gas to mainly blow the powder 121 in the reaction space 12.

Specifically, the gas inlet line 173 and the non-reactive gas transfer line 175 may transfer the non-reactive gas to the reaction space 12 at different time points, so that the non-reactive gas transfer line 175 may not be provided in practical applications, and the flow rate of the non-reactive gas transferred by the gas inlet line 173 at different time points may be adjusted. When the precursor in the reaction space 12 is to be removed, the flow rate of the non-reactive gas delivered to the reaction space 12 by the gas inlet line 173 is reduced, and when the powder 121 in the reaction space 12 is to be blown, the flow rate of the non-reactive gas delivered to the reaction space 12 by the gas inlet line 173 is increased.

The utility model discloses a when drive unit 15 drove outer body 131 and vacuum cavity 11 and rotates, interior body 133 and inside exhaust tube 171, admission line 173 and/or non-reactive gas conveying line 175 can not be along with rotating, be favorable to improving admission line 173 and/or non-reactive gas conveying line 175 and carry the stability of the non-reactive gas and/or predecessor to reaction space 12.

The heater 177 is used for heating the connection space 134 and the inner tube 133, and heating the pumping line 171, the gas inlet line 173 and/or the non-reactive gas transporting line 175 in the inner tube 133 to increase the temperature of the gas in the pumping line 171, the gas inlet line 173 and/or the non-reactive gas transporting line 175. The temperature sensing unit 179 is used to measure the temperature of the heater 177 or the connection space 134 to obtain the operating status of the heater 177.

A filter unit 139 may be disposed at one end of the inner pipe 133 connected to the reaction space 12, wherein the pumping line 171, the gas inlet line 173 and/or the non-reactive gas delivery line 175 in the inner pipe 133 are fluidly connected to the reaction space 12 of the vacuum chamber 11 via the filter unit 139.

The gas extraction line 171 is connected to the reaction space 12 through the filter unit 139, so that the powder 121 in the reaction space 12 can be prevented from being extracted together when the gas extraction line 171 extracts the gas in the reaction space 12, and the loss of the powder 121 can be reduced.

In an embodiment of the present invention, as shown in fig. 6, the gas inlet line 173 and/or the non-reactive gas delivery line 175 may extend from the connection space 134 of the inner body 133 of the shaft sealing device 13 to the reaction space 12 of the vacuum chamber 11, wherein the gas inlet line 173 and/or the non-reactive gas delivery line 175 extending to the reaction space 12 may be defined as an extension line 172. The extension line 172 may pass through the filter unit 139 and extend to the reaction space 12. In addition, a heating device 16 may be disposed inside, outside or around the vacuum chamber 11, wherein the heating device 16 is adjacent to or in contact with the sidewall 115 of the vacuum chamber 11 and is used to heat the vacuum chamber 11 and the reaction space 12.

In an embodiment of the present invention, the gas inlet 173, the non-reactive gas delivery 175 and/or the extension 172 in the reaction space 12 extend toward the front wall 111 of the vacuum chamber 11. In various embodiments, the gas inlet line 173, the non-reactive gas delivery line 175 and/or the extension line 172 located in the reaction space 12 may also be bent and extended toward the side wall 115 and/or the rear wall 113 of the vacuum chamber 11. The extension line 172 may further include at least one outlet 1721, wherein the outlet 1721 faces the front wall 111 and/or the sidewall 115 of the vacuum chamber.

In another embodiment of the present invention, the extension line 172 may continuously supply the non-reactive gas to the reaction space 12, and may adjust the flow rate of the non-reactive gas. Specifically, the mode in which the extension line 172 outputs the non-reactive gas may include an agitation mode in which the flow rate of the non-reactive gas output from the extension line 172 is large and the powder 121 in the reaction space 12 may be agitated by the output non-reactive gas, and a general mode. The flow rate of the non-reactive gas output from the extension line 172 in the normal mode is small, and the powder 121 in the reaction space 12 may not be agitated, but the non-reactive gas output in the normal mode forms a positive pressure at the air outlet 1721 of the extension line 172 to prevent the powder 121 from entering the extension line 172 through the air outlet 1721.

In an embodiment of the present invention, the powder atomic layer deposition apparatus 10 for preventing the powder from adhering to the inner wall may include a bearing portion 191 for bearing the driving unit 15, the vacuum chamber 11, the shaft sealing device 13 and/or the knocking device 14. For example, the bearing portion 191 is connected to the driving unit 15, the vacuum chamber 11 is connected to the bearing portion 191 through at least one first support frame 193, and the tapping device 14 is connected to the bearing portion 191 through at least one second support frame 195.

In an embodiment of the present invention, as shown in fig. 7, the inner tube 133 of the shaft sealing device 13 can extend from the accommodating space 132 of the outer tube 131 to the reaction space 12 of the vacuum chamber 11, so that the inner tube 133 forms a protruding tube 130 in the reaction space 12.

In practical applications, the wheel body 141 of the striking device 14 may be disposed on the rear wall 113 of the vacuum chamber 11, and the striking portion 1431 may extend from the wheel body 141 to the sidewall 115 of the vacuum chamber 11, so that the striking portion 1431 may strike the wheel surface 1411 of the wheel body 141 and the sidewall 115 of the vacuum chamber 11.

The utility model discloses the advantage:

the utility model provides a novel prevent that powder is stained with and glues powder atomic layer deposition device at inner wall mainly sets up a knocking device on vacuum cavity or bearing seal device to strike vacuum cavity through the knocking device, make vacuum cavity's internal surface or inner wall produce vibrations, shake the powder that is stained with and glues on vacuum cavity internal surface or inner wall with the deposition process and fall.

The foregoing is merely a preferred embodiment of the invention, and is not intended to limit the scope of the invention, which is defined by the appended claims, in which all equivalent changes and modifications in the shapes, constructions, features, and spirit of the invention are intended to be included.

Claims (10)

1. A powder atomic layer deposition device for preventing powder from being stuck on an inner wall, comprising:

a vacuum chamber including a reaction space for accommodating a plurality of powders;

a shaft sealing device connected with the vacuum cavity and comprising an outer tube and an inner tube, wherein the outer tube is provided with a containing space for containing the inner tube;

a driving unit connected to the shaft seal device and driving the vacuum chamber to rotate via the shaft seal device;

at least one gas extraction line positioned in the inner tube body, fluidly connected to the reaction space of the vacuum chamber, and used for extracting a gas in the reaction space;

at least one gas inlet pipeline, which is positioned in the inner tube body, is in fluid connection with the reaction space of the vacuum cavity and is used for conveying a precursor gas to the reaction space; and

a rapping device, comprising:

a wheel body connected with the shaft seal device or the vacuum cavity and rotating along with the shaft seal device, wherein a wheel surface of the wheel body is provided with at least one bulge part, the bulge part comprises a first surface and a second surface, one side of the first surface and one side of the second surface are connected with the wheel surface of the wheel body, the other ends of the first surface and the second surface are connected with each other, and an included angle between the first surface and the wheel surface of the wheel body is larger than 90 degrees; and

and the knocking unit is adjacent to the wheel body, and can displace between the convex part and the wheel surface of the wheel body when the wheel body rotates and knock the wheel surface or the vacuum cavity of the wheel body.

2. The atomic layer deposition apparatus according to claim 1, wherein the knocking unit includes a knocking portion and a fixing portion, and the knocking portion is connected to the fixing portion and configured to be displaced relative to the fixing portion and the wheel.

3. The atomic layer deposition apparatus according to claim 2, wherein the knocking unit includes a resilient unit connected to the knocking portion, the resilient unit providing a restoring force to the knocking unit toward the wheel.

4. The apparatus of claim 2, wherein the knocking unit comprises a buffer portion connected to the knocking portion, and the knocking portion knocks the vacuum chamber or the wheel through the buffer portion.

5. The apparatus of claim 1, wherein an angle between the second surface of the protrusion and the wheel surface of the wheel is less than 90 degrees.

6. The apparatus of claim 1, wherein the gas inlet line comprises at least one non-reactive gas delivery line for delivering a non-reactive gas to the reaction space to blow the powder in the reaction space and at least one reactive gas delivery line for delivering the precursor gas to the reaction space.

7. The apparatus of claim 6, wherein the non-reactive gas delivery line comprises an extension line disposed in the reaction space.

8. The apparatus of claim 7, further comprising a filter unit disposed at an end of the inner tube fluidly connected to the reaction space, wherein the exhaust line is fluidly connected to the reaction space via the filter unit, and the extension line passes through the filter unit.

9. The apparatus of claim 1, wherein the inner tube extends from the receiving space of the outer tube to the reaction space of the vacuum chamber, and a protruding tube is formed in the reaction space.

10. The apparatus of claim 1, wherein the vacuum chamber comprises a front wall, a back wall and a side wall, the front wall faces the back wall, the front wall is connected to the back wall via the side wall, the reaction space is formed between the front wall, the back wall and the side wall, and the tapping device is adjacent to the back wall of the vacuum chamber.

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