CN215121689U - Heat radiator for server room - Google Patents
Heat radiator for server room Download PDFInfo
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- CN215121689U CN215121689U CN202121150692.XU CN202121150692U CN215121689U CN 215121689 U CN215121689 U CN 215121689U CN 202121150692 U CN202121150692 U CN 202121150692U CN 215121689 U CN215121689 U CN 215121689U
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- heat dissipation
- server room
- server
- heat
- shaped pipe
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Abstract
The utility model relates to a server computer lab field provides a heat abstractor of server computer lab for solve the high temperature problem in the server computer lab. The utility model provides a heat abstractor of server computer lab, include: a pump located above the server room; the cooling water tank is connected with the pump; the heat dissipation assembly comprises at least one U-shaped pipe, a water inlet pipe and a water outlet pipe, the water inlet pipe is connected with the pump, the water outlet pipe is connected with the cooling water tank, the U-shaped pipe is located inside the machine room, and the U-shaped pipe is fixed to the top of the server machine room. Can improve the radiating efficiency effectively, the pump is located the computer lab top simultaneously, and the energy of consumption is few.
Description
Technical Field
The utility model relates to a server computer lab field, concretely relates to heat abstractor of server computer lab.
Background
Server rooms (english: server rooms) are rooms designed for continuous operation of computer servers, usually equipped with air conditioning. Buildings or sites dedicated for this purpose are referred to as data centers.
With the rapid development of industries such as global communication, internet of things, electronic commerce, cloud computing and the like, a large number of electronic information rooms are built for communication operators, governments, enterprises and the like. The electronic equipment in the machine room can continuously generate heat during operation. In order to ensure the normal operation of the information electronic equipment, a special air conditioner is generally installed in the server room, and the information electronic equipment is cooled by the special air conditioner. The integration level of information electronic equipment is higher and higher, and the heat density of the information electronic equipment is also higher and higher, so that the load of a special air conditioner for a machine room is larger and larger, and the energy consumption is higher and higher. Data show that the energy consumption of the information electronic equipment accounts for 45% of the overall energy consumption of the machine room at present, while the energy consumption of refrigeration equipment such as a special air conditioner for the machine room accounts for 40% of the overall energy consumption of the machine room, which directly drives the energy consumption of the information electronic equipment or exceeds the energy consumption of the electronic equipment, so that the communication machine room still has a larger energy-saving space by improving a refrigeration system of the communication machine room. The heat dissipation mode of current computer lab, the energy consumption is higher, and the radiating efficiency is lower.
SUMMERY OF THE UTILITY MODEL
The utility model provides a technical problem provides a heat abstractor for server computer lab high temperature problem in.
In order to solve the technical problem, the utility model provides a technical scheme does:
a heat dissipation device for a server room, comprising:
a pump located above the server room;
the cooling water tank is connected with the pump;
the heat dissipation assembly comprises at least one U-shaped pipe, a water inlet pipe and a water outlet pipe, the water inlet pipe is connected with the pump, the water outlet pipe is connected with the cooling water tank, the U-shaped pipe is located inside the machine room, and the U-shaped pipe is fixed to the top of the server machine room.
The heat dissipation assembly is located above the machine room, rising heat can be effectively collected, the U-shaped pipe can fully utilize the gap between server equipment, and the distance between the heat dissipation assembly and the server equipment is reduced.
Can improve the radiating efficiency effectively, the pump is located the computer lab top simultaneously, and the energy of consumption is few.
Preferably, the U-shaped pipe is fixed to the top of the server room by a fixing member.
Preferably, the outer side of the U-shaped pipe is connected with the radiating fins. The radiating fins can increase the contact area of the U-shaped pipe and heat, and improve the heat collecting efficiency.
Preferably, the method further comprises the following steps:
and the cooling fan is arranged at the bottom of the server room. The heat radiation fan can promote the upward flow of heat.
Preferably, a heat insulation layer is arranged in the tank body of the cooling water tank.
Preferably, the water inlet pipe is wrapped in an insulating sleeve.
Preferably, the outer side of the heat dissipation fins is provided with a recess, and the inner side of the heat dissipation fins is connected with the U-shaped pipe.
Preferably, the heat dissipation fan is disposed below the U-shaped pipe.
Preferably, the bottom of the server room is provided with an air suction fan, and the top of the server room is provided with an exhaust fan.
Compared with the prior art, the utility model discloses the beneficial effect who has does: can improve the radiating efficiency effectively, the pump is located the computer lab top simultaneously, and the energy of consumption is few.
Drawings
Fig. 1 is a sectional view of a heat sink of a server room.
Fig. 2 is a schematic diagram of a U-shaped pipe of a heat dissipation device of a server room.
Fig. 3 is a bottom view of fig. 2.
Fig. 4 is a schematic view of a fastener.
Detailed Description
The following examples are further illustrative of the present invention and are not intended to be limiting thereof.
Example 1
A heat dissipation device for a server room, comprising:
a pump 100, the pump 100 being located above a server room;
a cooling water tank 200, wherein the cooling water tank 200 is connected with the pump 100;
the heat dissipation assembly comprises at least one U-shaped pipe 310, a water inlet pipe 320 and a water outlet pipe 330, the water inlet pipe 320 is connected with the pump 100, the water outlet pipe 330 is connected with the cooling water tank 200, the U-shaped pipe 310 is located inside a machine room, and the U-shaped pipe 310 is fixed to the top of the server machine room.
The heat dissipation assembly is located above the machine room, rising heat can be effectively collected, the U-shaped pipe can fully utilize the gap between server equipment, and the distance between the heat dissipation assembly and the server equipment is reduced.
Can improve the radiating efficiency effectively, the pump is located the computer lab top simultaneously, and the energy of consumption is few.
Example 2
A heat dissipation device for a server room, comprising:
a pump 100, the pump 100 being located above a server room;
a cooling water tank 200, wherein the cooling water tank 200 is connected with the pump 100;
the heat dissipation assembly comprises at least one U-shaped pipe 310, a water inlet pipe 320 and a water outlet pipe 330, the water inlet pipe 320 is connected with the pump 100, the water outlet pipe 330 is connected with the cooling water tank 200, the U-shaped pipe 310 is located inside a machine room, and the U-shaped pipe 310 is fixed to the top of the server machine room.
The U-shaped 310 pipe is fixed on the top of the server room by a fixing member 410. The outside of the U-shaped tube 310 is connected with the heat dissipating fins 311. Further comprising:
and the cooling fan 420 is arranged at the bottom of the server room. A heat insulation layer is arranged in the tank body of the cooling water tank 200. The inlet pipe 320 is wrapped in a heat insulating sleeve. The outer side of the heat dissipation fin 311 is provided with a recess, and the inner side of the heat dissipation fin 311 is connected with the U-shaped pipe 310. The heat dissipation fan 420 is disposed below the U-shaped pipe.
The radiating fins can increase the contact area of the U-shaped pipe and heat, and improve the heat collecting efficiency. The heat radiation fan can promote the upward flow of heat.
Example 3
A heat dissipation device for a server room, comprising:
a pump 100, the pump 100 being located above a server room;
a cooling water tank 200, wherein the cooling water tank 200 is connected with the pump 100;
the heat dissipation assembly comprises at least one U-shaped pipe 310, a water inlet pipe 320 and a water outlet pipe 330, the water inlet pipe 320 is connected with the pump 100, the water outlet pipe 330 is connected with the cooling water tank 200, the U-shaped pipe 310 is located inside a machine room, and the U-shaped pipe 310 is fixed to the top of the server machine room.
The U-shaped 310 pipe is fixed on the top of the server room by a fixing member 410. The outside of the U-shaped tube 310 is connected with the heat dissipating fins 311. Further comprising:
and the cooling fan 420 is arranged at the bottom of the server room. A heat insulation layer is arranged in the tank body of the cooling water tank 200. The inlet pipe 320 is wrapped in a heat insulating sleeve. The outer side of the heat dissipation fin 311 is provided with a recess, and the inner side of the heat dissipation fin 311 is connected with the U-shaped pipe 310. The heat dissipation fan 420 is disposed below the U-shaped pipe. The server room bottom is provided with the induced draft fan, the server room top is provided with the exhaust fan.
The top exhaust fan and the bottom suction fan can promote air circulation.
The above detailed description is specific to possible embodiments of the present invention, and the above embodiments are not intended to limit the scope of the present invention, and all equivalent implementations or modifications that do not depart from the scope of the present invention should be included within the scope of the present invention.
Claims (9)
1. The utility model provides a heat abstractor of server computer lab which characterized in that includes:
a pump located above the server room;
the cooling water tank is connected with the pump;
the heat dissipation assembly comprises at least one U-shaped pipe, a water inlet pipe and a water outlet pipe, the water inlet pipe is connected with the pump, the water outlet pipe is connected with the cooling water tank, the U-shaped pipe is located inside the machine room, and the U-shaped pipe is fixed to the top of the server machine room.
2. The heat dissipation device of the server room as claimed in claim 1, wherein the U-shaped pipe is fixed to the top of the server room by a fixing member.
3. The heat dissipation device of the server room as claimed in claim 1, wherein the outer sides of the U-shaped tubes are connected with heat dissipation fins.
4. The heat sink of a server room according to claim 1, further comprising:
and the cooling fan is arranged at the bottom of the server room.
5. The heat dissipation device of a server room according to claim 1, wherein a heat insulation layer is disposed in the tank body of the cooling water tank.
6. The heat dissipating device of a server room of claim 3, wherein the water inlet pipe is wrapped in a heat insulating sleeve.
7. The heat dissipation device of the server room as claimed in claim 3, wherein a recess is formed on an outer side of the heat dissipation fin, and an inner side of the heat dissipation fin is connected to the U-shaped pipe.
8. The heat dissipation device of a server room according to claim 4, wherein the heat dissipation fan is disposed below the U-shaped pipe.
9. The heat dissipation device of a server room as claimed in claim 1, wherein the bottom of the server room is provided with a suction fan, and the top of the server room is provided with an exhaust fan.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121150692.XU CN215121689U (en) | 2021-05-26 | 2021-05-26 | Heat radiator for server room |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121150692.XU CN215121689U (en) | 2021-05-26 | 2021-05-26 | Heat radiator for server room |
Publications (1)
Publication Number | Publication Date |
---|---|
CN215121689U true CN215121689U (en) | 2021-12-10 |
Family
ID=79299838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202121150692.XU Active CN215121689U (en) | 2021-05-26 | 2021-05-26 | Heat radiator for server room |
Country Status (1)
Country | Link |
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CN (1) | CN215121689U (en) |
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2021
- 2021-05-26 CN CN202121150692.XU patent/CN215121689U/en active Active
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