CN218072265U - Heat dissipation device and electronic equipment - Google Patents
Heat dissipation device and electronic equipment Download PDFInfo
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- CN218072265U CN218072265U CN202221717308.4U CN202221717308U CN218072265U CN 218072265 U CN218072265 U CN 218072265U CN 202221717308 U CN202221717308 U CN 202221717308U CN 218072265 U CN218072265 U CN 218072265U
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- heat
- card chip
- heat dissipation
- radiator
- mounting
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Abstract
The utility model discloses a heat abstractor and electronic equipment, wherein, heat abstractor is used for dispelling the heat to the display card chip, heat abstractor includes casing and radiator unit, the casing is equipped with the installation cavity, the casing has the installation face, the installation face is equipped with the intercommunication the mounting hole of installation cavity, the display card chip install in the installation face, and correspond the mounting hole sets up, radiator unit locates the installation cavity, part radiator unit is located in the mounting hole, and with display card chip butt, radiator unit is equipped with the circulation runner, the circulation runner intussuseption is filled with liquid metal. The utility model discloses aim at promoting heat abstractor's heat conduction and heat transfer ability.
Description
Technical Field
The utility model relates to a display card chip heat dissipation technical field, in particular to heat abstractor and electronic equipment.
Background
With the annual improvement of the performance and power consumption of the display card chip, however, the size and the manufacturing process of the display card chip are limited by the physical size, the power consumption density of the display card chip is higher and higher, and further, higher requirements are provided for the heat transfer performance of the heat dissipation module.
The traditional air-cooled heat dissipation scheme can only improve the heat transfer capacity of the heat dissipation module by increasing the number of heat pipes in contact with the display card chip. However, for high power consumption products, the space for increasing the number of heat pipes has been limited due to the industry standard size constraints of graphics card chip products.
For the water-cooling heat dissipation scheme, although flowing water has excellent heat conduction and heat transfer capacity, the water-cooling heat dissipation module is assembled with the display card chip mainboard in a separated manner, and the industrial standard size requirement of the display card chip product is difficult to meet.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a heat abstractor aims at promoting under display card chip standard size requirement, heat abstractor's heat conduction and heat transfer ability.
In order to achieve the above object, the present invention provides a heat dissipation device comprising:
the display card chip comprises a shell, a chip mounting plate and a chip mounting plate, wherein the shell is provided with a mounting cavity and a mounting surface, the mounting surface is provided with a mounting hole communicated with the mounting cavity, and the display card chip is mounted on the mounting surface and arranged corresponding to the mounting hole; and
the heat dissipation assembly is arranged in the mounting cavity, part of the heat dissipation assembly is located in the mounting hole and abutted against the display card chip, the heat dissipation assembly is provided with a circulating flow channel, and liquid metal is filled in the circulating flow channel.
The utility model discloses an in one embodiment, radiator unit is still including locating the heat-transfer pipe of installation cavity with connect in the heat conduction bottom plate of heat-transfer pipe, be equipped with in the heat-transfer pipe circulation flow channel, the heat conduction bottom plate is located in the mounting hole, and with display card chip butt.
In an embodiment of the present invention, the heat transfer pipe is an annular structure connected end to end, the heat dissipation assembly further includes an electromagnetic pump disposed in the installation cavity, the electromagnetic pump is provided with a through hole, and the heat transfer pipe is disposed through the electromagnetic pump.
In an embodiment of the present invention, the heat dissipation assembly further includes a heat radiator set disposed in the installation cavity, the heat radiator set is connected to one side of the display card chip opposite to the heat transfer pipe.
In an embodiment of the present invention, the heat sink assembly is provided with a groove, and the heat transfer pipe is disposed in the groove.
In an embodiment of the present invention, the heat transfer pipe includes a first heat dissipation region, a second heat dissipation region, and a connection region connected between the first heat dissipation region and the second heat dissipation region, the connection region being connected to the heat conductive bottom plate;
the radiator group comprises a first radiator, a second radiator and a third radiator;
the first radiator is connected with the first heat dissipation area, the second radiator is connected with the second heat dissipation area, and the third radiator is connected with the connection area.
In an embodiment of the present invention, the liquid metal is a gallium-based alloy.
In an embodiment of the present invention, a through hole is provided on a surface of the casing facing away from the mounting surface, and the through hole communicates with the mounting cavity;
the heat dissipation device further comprises a fan, and the fan is arranged at the through hole.
In an embodiment of the present invention, a boss is disposed on the mounting surface, and the boss surrounds the mounting hole.
The utility model also provides an electronic equipment, electronic equipment include the display card chip and as above heat abstractor, the display card chip with heat abstractor's installation face is connected.
The utility model discloses technical scheme provides a heat abstractor is used for dispelling the heat to the display card chip, be equipped with installation face and mounting hole on heat abstractor's the casing, the display card chip is installed in installation face and is corresponded the mounting hole setting, the casing has the installation cavity simultaneously, radiator unit locates the installation cavity, some radiator unit passes through mounting hole and display card chip butt, the cooling unit is equipped with the circulation runner that the liquid metal was filled to the inside seal, the heat that the display card chip produced transmits the liquid metal for in the circulation runner through the partial radiator unit that is located the mounting hole, through the outstanding heat conduction heat transfer property of liquid metal, transmit other radiator unit with the heat, increase the heat dissipation capacity, thereby promote radiator's heat conduction and heat transfer capacity.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural view of an embodiment of the heat dissipation device of the present invention;
fig. 2 is a schematic structural view of another embodiment of the heat dissipation device of the present invention;
fig. 3 is a schematic structural view of another embodiment of the heat dissipation device of the present invention;
fig. 4 is a schematic structural view of another embodiment of the heat dissipation device of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
212 | First |
| 10 | |
213 | Second |
| 11 | |
214 | Connecting |
| 111 | |
22 | Heat conducting |
| 112 | |
23 | |
| 12 | Through |
24 | |
| 13 | Fan with |
241 | Groove |
| 20 | |
242 | |
| 21 | |
243 | |
| 211 | Circulating |
244 | Third radiator |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front, and rear … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a heat abstractor 100.
In an embodiment of the present invention, as shown in fig. 1, fig. 2, fig. 3 and fig. 4, the heat dissipation apparatus 100 includes:
the display card chip comprises a shell 10, wherein the shell 10 is provided with an installation cavity, the shell 10 is provided with an installation surface 11, the installation surface 11 is provided with an installation hole 111 communicated with the installation cavity, and the display card chip is installed on the installation surface 11 and arranged corresponding to the installation hole 111; and
the heat dissipation assembly 20 is arranged in the installation cavity, part of the heat dissipation assembly 20 is located in the installation hole 111 and is abutted to the display card chip, the heat dissipation assembly 20 is provided with a circulation flow channel 211, and the circulation flow channel 211 is filled with liquid metal.
The utility model discloses heat abstractor 100 that technical scheme provided is used for dispelling the heat to the display card chip, be equipped with installation face 11 and mounting hole 111 on heat abstractor 100's the casing 10, the display card chip mounting is in installation face 11 and correspond the setting of mounting hole 111, casing 10 has the installation cavity simultaneously, the installation cavity is located to radiator unit 20, part radiator unit 20 is through mounting hole 111 and display card chip butt, the heat dissipation group is equipped with the circulation runner 211 of inside seal packing liquid metal, the heat that the display card chip produced transmits the liquid metal in circulation runner 211 through the part radiator unit 20 that is located mounting hole 111, through the outstanding heat conduction heat transfer property of liquid metal, with heat transfer to other radiator unit 20, increase the heat dissipation capacity, thereby promote heat conduction and the heat transfer capacity of heat abstractor 100.
In the present embodiment, the housing 10 is die cast.
In the embodiment, the problem that the traditional air cooling scheme is restricted by the size of a display card chip, so that the space for increasing the number of the heat pipes is limited and the heat transfer capacity is limited is solved. In this scheme, the liquid metal is hermetically accommodated in the circulation flow channel 211 of the heat dissipation assembly 20, and the heat absorbed by a certain part of the heat dissipation assembly 20 from the display card chip can be transferred to each part of the heat dissipation assembly 20 due to the flow of the liquid metal, so that the heat transfer capacity of the heat dissipation assembly 20 is greatly improved.
In an embodiment of the present invention, as shown in fig. 1, fig. 2 and fig. 3, the heat dissipation assembly 20 further includes a heat transfer pipe 21 disposed in the installation cavity and a heat conduction bottom plate 22 connected to the heat transfer pipe 21, the circulation flow channel 211 is disposed in the heat transfer pipe 21, and the heat conduction bottom plate 22 is disposed in the installation hole 111 and abuts against the display card chip.
In this embodiment, the heat conducting bottom plate 22 may be a copper plate or a VC (vacuum-Chamber Vapor Chamber), in which after absorbing the heat of the graphic card chip, the liquid at the bottom of the vacuum Chamber in the VC evaporates and diffuses into the vacuum Chamber, conducts the heat to the top and transfers to the other heat dissipation assemblies 20, and then condenses into liquid to return to the bottom. The evaporation and condensation process of the refrigerator-like air conditioner is quickly circulated in the vacuum cavity, so that the VC has high heat dissipation efficiency.
In this embodiment, the size of the mounting hole 111 is larger than the size of the heat conducting bottom plate 22, so that the heat conducting bottom plate 22 is completely embedded into the mounting hole 111 and is abutted against the display card chip to the greatest extent; the butt department between heat conduction bottom plate 22 and the display card chip scribbles heat conduction silicone grease, and heat conduction silicone grease can fill the gap on heat conduction bottom plate 22 and the mutual contact surface of display card chip, and then has increased the area of contact of heat conduction bottom plate 22 with the display card chip, increases the heat-conducting ability.
In an embodiment of the present invention, as shown in fig. 1, fig. 2 and fig. 3, the heat transfer pipe 21 is an annular structure connected end to end, the heat dissipation assembly 20 further includes an electromagnetic pump 23 disposed in the installation cavity, the electromagnetic pump 23 is provided with a through hole, and the heat transfer pipe 21 is disposed through the electromagnetic pump 23.
In this embodiment, the heat generated by the graphics card chip is transferred to the heat transfer tube 21 through the heat conducting bottom plate 22, the electromagnetic pump 23 circulates the liquid metal sealed inside the heat transfer tube 21 in the heat transfer tube 21, when the liquid metal flows through a position with a higher temperature, the liquid metal absorbs the heat of the heat transfer tube 21, and when the liquid metal flows through a position with a lower temperature, the liquid metal transfers the heat to the heat transfer tube 21.
It is understood that the direction of heat transfer between the liquid metal and the heat transfer pipe 21, depending on the current temperature difference between the liquid metal and the heat transfer pipe 21, the liquid metal absorbs heat from the heat transfer pipe 21 when the temperature of the liquid metal is lower than the temperature of the heat transfer pipe 21, and the heat transfer pipe 21 absorbs heat from the liquid metal when the temperature of the liquid metal is higher than the temperature of the heat transfer pipe 21.
In this embodiment, the heat transfer pipe 21 of the internal sealing liquid metal is embedded in the electromagnetic pump 23, so that the flow rate of the liquid metal in the pipeline of the heat transfer pipe 21 can be controlled by adjusting the current or the magnetic field intensity of the electromagnetic pump 23, the heat absorption and heat release frequency between the liquid metal and the heat transfer pipe 21 is increased, and the heat conduction and heat transfer capacity of the heat dissipation device 100 is adjusted to match the display card chips with different heat consumptions.
In this embodiment, the electromagnetic principle of the electromagnetic pump 23 is different from the pure mechanical principle of the blade-type water pump, and noise is not generated in the working process of the electromagnetic pump 23.
In an embodiment of the present invention, the heat dissipation assembly 20 further includes a heat radiator assembly 24 disposed in the mounting cavity, and the heat radiator assembly 24 is connected to a side of the heat transfer pipe 21 facing away from the display card chip.
In this embodiment, the heat transfer pipe 21 absorbs heat generated by the display card chip through the liquid metal inside the heat transfer pipe 21 and the heat conducting bottom plate 22, and then transfers the heat to the heat radiator group 24 connected to the heat transfer pipe 21, and the heat radiator group 24 is provided with a plurality of heat radiation fins, so that the heat radiation area of the whole heat radiation assembly 20 is increased, and the heat radiation efficiency of the heat radiation device 100 is improved.
In an embodiment of the present invention, as shown in fig. 1, 2 and 3, the radiator assembly 24 is provided with a groove 241, and the heat transfer pipe 21 is disposed in the groove 241.
In this embodiment, the grooves 241 of the radiator group 24 are connected with the heat transfer pipes 21 in a matching manner, and the electromagnetic pump 23 on the heat transfer pipe 21 is also connected with the grooves 241 in a matching manner, so that the contact area between the radiator group 24 and the heat transfer pipes 21 is increased, and the heat transfer efficiency between the radiator group 24 and the heat transfer pipes 21 is improved.
In an embodiment of the present invention, as shown in fig. 3, the heat transfer pipe 21 includes a first heat dissipation area 212, a second heat dissipation area 213, and a connection area 214 connected between the first heat dissipation area 212 and the second heat dissipation area 213, and the connection area 214 is connected to the heat conductive base plate 22;
the radiator group 24 comprises a first radiator 242, a second radiator 243 and a third radiator 244;
the first heat sink 242 is connected to the first heat dissipation region 212, the second heat sink 243 is connected to the second heat dissipation region 213, and the third heat sink 244 is connected to the connection region 214.
In this embodiment, the radiator group 24 is modularly provided with the first radiator 242, the second radiator 243 and the third radiator 244, so that the assembly, the disassembly and the maintenance are facilitated, and during the assembly, the radiators can be better brought into close contact with different regions (the first radiating region 212, the second radiating region 213 and the connecting region 214) on the heat transfer pipe 21, and the heat transfer efficiency is improved.
In an embodiment of the present invention, the liquid metal is a gallium-based alloy.
It should be understood that the liquid metal in the heat transfer pipe 21 should be a metal in a liquid state at normal temperature, and it should be noted that the metal referred to herein includes various alloys, such as gallium indium tin alloy, and the like.
In an embodiment of the present invention, as shown in fig. 1, a through hole 12 is provided on a surface of the housing 10 away from the mounting surface 11, and the through hole 12 communicates with the mounting cavity;
the heat dissipation device 100 further includes a fan 13, and the fan 13 is disposed at the through hole 12.
In this embodiment, three through holes 12 and three fans 13 are provided, and the fans 13 drive the airflow to pass through the fins of each radiator so as to take away the heat of the radiator group 24, and then the airflow is discharged through the through holes 12.
In an embodiment of the present invention, as shown in fig. 4, a boss 112 is disposed on the mounting surface 11, and the boss 112 is disposed around the mounting hole 111.
In this embodiment, four bosses 112 are arranged on the outer surface of the casing 10 around the mounting hole 111, and the size surrounded by the four bosses 112 is matched with the specification of the display card chip, so that the display card chip can be limited in the mounting hole 111, and the heat conducting bottom plate 22 can be in full contact with the display card chip conveniently.
The utility model also provides an electronic device, which comprises a display card chip and the heat dissipation device 100, wherein the display card chip is connected with the mounting surface 11 of the heat dissipation device 100; the specific structure of the heat dissipation device 100 refers to the above embodiments, and since the electronic device adopts all the technical solutions of all the embodiments, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and no further description is given here.
Further, the electronic device may be a desktop computer, the graphics card chip is disposed in a host of the desktop computer, the heat dissipation device 100 is also disposed in the host, and the mounting surface 11 of the heat dissipation device 100 is connected to the graphics card chip.
It is understood that the electronic device may also be a notebook computer, and the display card chip in the notebook computer is also connected to the mounting surface 11 of the heat dissipation device 100.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. The utility model provides a heat abstractor for dispel the heat to the display card chip, its characterized in that, heat abstractor includes:
the display card chip comprises a shell, a chip mounting plate and a chip mounting plate, wherein the shell is provided with a mounting cavity and a mounting surface, the mounting surface is provided with a mounting hole communicated with the mounting cavity, and the display card chip is mounted on the mounting surface and arranged corresponding to the mounting hole; and
the heat dissipation assembly is arranged in the mounting cavity, part of the heat dissipation assembly is located in the mounting hole and abutted against the display card chip, the heat dissipation assembly is provided with a circulating flow channel, and liquid metal is filled in the circulating flow channel.
2. The heat dissipating device of claim 1, wherein the heat dissipating assembly further comprises a heat transfer tube disposed in the mounting cavity and a heat conducting bottom plate connected to the heat transfer tube, the heat transfer tube having the circulation channel therein, the heat conducting bottom plate being disposed in the mounting hole and abutting against the display card chip.
3. The heat dissipating device of claim 2, wherein said heat transfer tube is an end-to-end ring structure, said heat dissipating assembly further comprises an electromagnetic pump disposed in said mounting cavity, said electromagnetic pump having a through hole, said heat transfer tube being disposed through said electromagnetic pump.
4. The heat dissipating device of claim 2, wherein the heat dissipating assembly further comprises a heat sink assembly disposed in the mounting cavity, the heat sink assembly being connected to a side of the heat transfer tube opposite to the graphics card chip.
5. The heat dissipating device of claim 4, wherein said heat sink stack has a groove, and said heat transfer tubes are disposed in said groove.
6. The heat dissipating device of claim 4, wherein said heat transfer tube comprises a first heat dissipating section, a second heat dissipating section, and a connecting section connected between said first heat dissipating section and said second heat dissipating section, said connecting section being connected to said thermally conductive base plate;
the radiator group comprises a first radiator, a second radiator and a third radiator;
the first radiator is connected with the first heat dissipation area, the second radiator is connected with the second heat dissipation area, and the third radiator is connected with the connection area.
7. The heat sink of any one of claims 1 to 6, wherein the liquid metal is a gallium-based alloy.
8. The heat dissipation device according to any one of claims 1 to 6, wherein a through hole is provided on a surface of one side of the housing facing away from the mounting surface, and the through hole communicates with the mounting cavity;
the heat dissipation device further comprises a fan, and the fan is arranged at the through hole.
9. The heat sink of any one of claims 1 to 6, wherein a boss is provided on the mounting surface, the boss being disposed around the mounting hole.
10. An electronic device, characterized in that the electronic device comprises a graphics card chip and the heat dissipation device of any one of claims 1 to 9, wherein the graphics card chip is connected with a mounting surface of the heat dissipation device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221717308.4U CN218072265U (en) | 2022-07-01 | 2022-07-01 | Heat dissipation device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221717308.4U CN218072265U (en) | 2022-07-01 | 2022-07-01 | Heat dissipation device and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218072265U true CN218072265U (en) | 2022-12-16 |
Family
ID=84436554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221717308.4U Active CN218072265U (en) | 2022-07-01 | 2022-07-01 | Heat dissipation device and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218072265U (en) |
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2022
- 2022-07-01 CN CN202221717308.4U patent/CN218072265U/en active Active
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