CN215070354U

CN215070354U - Cable and microstrip conversion circuit

Info

Publication number: CN215070354U
Application number: CN202120686552.8U
Authority: CN
Inventors: 王仕杰; 胡罗林; 张华彬; 易祖军; 严秦; 谢兵; 范宏; 杨翊铭; 廖翎谕; 李茂林
Original assignee: Chengdu Phase Lock Electronic Technology Co Ltd
Current assignee: Chengdu Phase Lock Electronic Technology Co Ltd
Priority date: 2021-04-02
Filing date: 2021-04-02
Publication date: 2021-12-07
Anticipated expiration: 2031-04-02

Abstract

The utility model provides a cable and microstrip switching circuit, which comprises a metal probe, a medium substrate, a linear microstrip line, a microstrip ground and a metal shell, wherein the metal shell is provided with an air cavity, and the medium substrate is arranged in the metal shell; the linear microstrip line is arranged on the top layer of the dielectric substrate, and the microstrip line is arranged on the bottom layer of the dielectric substrate; the metal probe penetrates through the metal shell on the periphery of the air cavity, the tail end of the metal probe extends to the linear microstrip line and is connected with the microstrip line, and the connecting position of the metal probe and the microstrip line is positioned on a central line in the length direction of the microstrip line; the metal probe penetrates through one end of the metal shell, and the upper surface of the metal probe is tangentially parallel to the surface of the microstrip line. The metal probe is a cable needle, the periphery of the cable needle is wrapped with an insulating sleeve, and the insulating sleeve is abutted to the outer side of the metal shell; the cable needle penetrates through the metal shell and forms a relative height difference with the microstrip line. The practical specific process has strong feasibility, and can realize the high-performance ultra wide band transmission effect.

Description

Cable and microstrip conversion circuit

Technical Field

The utility model relates to the field of electronic technology, particularly, relate to a cable and microstrip converting circuit.

Background

In order to improve the integration level and miniaturization degree of a microwave active module circuit, the interior of the circuit usually adopts a microstrip circuit form which is easy to interconnect with an MMIC (microwave monolithic integrated circuit), and a system interface usually adopts a radio frequency coaxial cable or a waveguide form, so that a radio frequency coaxial cable-microstrip conversion circuit is required to be designed for an input interface and an output interface of the module circuit in general.

The extension part of the lead of the radio frequency coaxial cable-microstrip conversion circuit in the prior art introduces parasitic inductance, which can seriously limit the application of the conversion circuit in a high frequency band.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving the above-mentioned problem that exists among the prior art, provide a cable and microstrip converting circuit.

The embodiment of the utility model discloses a realize through following technical scheme: a cable to microstrip conversion circuit comprising: a metal probe, a dielectric substrate, a linear microstrip feed line, a microstrip ground and a metal shell, wherein the metal shell is provided with an air cavity,

the dielectric substrate is arranged in the air cavity;

the linear micro-strip feeder line is arranged on the top layer of the dielectric substrate, and the micro-strip ground is arranged on the bottom layer of the dielectric substrate;

the metal probe penetrates through the metal shell, the tail end of the metal probe extends to the linear micro-strip feeder line and is connected with the linear micro-strip feeder line,

the connecting position of the metal probe and the linear microstrip feeder line is positioned on the central line of the linear microstrip feeder line in the length direction;

the metal probe penetrates through one end of the metal shell, and the tangential direction of the upper surface of the metal probe is parallel to the surface of the linear micro-strip feeder line.

According to a preferred embodiment, the metal probe is a cable needle, the periphery of the cable needle is wrapped with an insulating sleeve, and the insulating sleeve is abutted to the outer side of the metal shell;

the cable pin penetrates through the metal shell and forms a relative height difference with the linear microstrip feed line.

Furthermore, the connecting position of the cable pin and the linear type micro-strip feeder line is as close as possible to the edge of the linear type micro-strip feeder line close to the cable pin.

Further, the cable pin is connected to a port of the linear microstrip feed line, which is close to the cable pin.

According to a preferred embodiment, the metal probe is an insulator pin, and a tangential direction of a lower surface of the insulator pin is on the same horizontal plane with an upper surface of the linear microstrip feeder line.

Further, an air gap is formed between the inner side wall of the metal shell close to the dielectric substrate and the dielectric substrate.

According to a preferred embodiment, the air gap ranges from: 0.001 mm-1 mm.

According to a preferred embodiment, the dimensions of the air chamber are: 15mm 3.5mm 1.5 mm.

According to a preferred embodiment, the dielectric substrate is of the type ROGERS 4350B.

According to a preferred embodiment, the dielectric substrate has a thickness of 0.508mm and a dielectric constant of 3.48.

The utility model discloses technical scheme has following advantage and beneficial effect at least: (1) the utility model has strong feasibility of the specific process, the welding spot is positioned at the port of the linear micro-strip feeder close to the cable needle, and the ultra-wide band and the transmission effect with high performance can be realized; (2) this practicality can improve converting circuit's reliability through set up the clearance as far as possible little between metal casing and dielectric substrate.

Drawings

Fig. 1 is a schematic structural diagram of a cable and microstrip conversion circuit provided in embodiment 1 of the present invention;

fig. 2 is a schematic structural diagram of a cable and microstrip conversion circuit provided in embodiment 2 of the present invention;

icon: 100-dielectric substrate, 200-linear microstrip feeder line, 300-air cavity, 400-metal shell, 500-insulating sleeve, 600-cable pin, 700-insulator pin and 800-air gap.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Example 1

Referring to fig. 1, the present embodiment provides a cable and microstrip conversion circuit, including: a metal probe, a dielectric substrate 100, a linear microstrip feed line 200, a microstrip ground and a metal case 400,

the dielectric substrate 100 is disposed in the air cavity 300, and optionally, the dielectric substrate 100 adopted in this embodiment is ROGERS 4350B, the thickness is 0.508mm, and the dielectric constant is 3.48; optionally, the air chamber 300 has dimensions: 15mm 3.5mm 1.5 mm.

Specifically, the linear microstrip feed line 200 is disposed on the top layer of the dielectric substrate 100, and the microstrip is disposed on the bottom layer of the dielectric substrate 100.

Further, the metal probe passes through the metal housing 400, and the end of the metal probe extends to the linear microstrip feed line 200 and is connected with the linear microstrip feed line 200; wherein, the connection position of the metal probe and the linear microstrip feed line 200 is positioned on the central line of the linear microstrip feed line 200 in the length direction; the metal probe penetrates through one end of the metal housing 400, and the upper surface of the metal probe is tangentially parallel to the surface of the linear microstrip feed line 200.

Further, the metal probe adopted in this embodiment is a cable needle 600, the periphery of the cable needle 600 is wrapped with an insulating sleeve 500, and the insulating sleeve 500 abuts against the outer side of the metal shell 400; the cable pin 600 penetrates through the metal housing 400, and forms a relative height difference with the linear microstrip feed line 200.

It should be added that the exposed portion of the cable pin 600 stripped from the insulating sheath 500 in this embodiment should be as short as possible.

In this embodiment, modeling simulation is performed on the condition that the metal probe is used to the cable pin 600 and a relative height difference is formed between the cable pin 600 and the linear microstrip feed line 200 through structural simulation software, and tuning and simulation optimization of various parameters are performed to draw a conclusion that: the connection position between the cable pin 600 and the linear microstrip feed line 200, that is, the closer the welding point is to the edge of the linear microstrip feed line 200 close to the cable pin 600, the better; specifically, the position of the welding point at the port of the linear microstrip feed line 200 close to the cable pin 600 is optimal, and a high-performance ultra-wideband can be realized.

Example 2

Referring to fig. 2, in a cable and microstrip conversion circuit provided in this embodiment, a metal probe is an insulator pin 700, which is different from that in embodiment 1; specifically, the lower surface of the insulator pin 700 is tangential to and on the same horizontal plane as the upper surface of the linear microstrip feed line 200.

Further, an air gap 800 is formed between the inner sidewall of the metal shell 400 close to the dielectric substrate 100 and the dielectric substrate 100, in this embodiment, the range of the air gap 800 is: 0.001 mm-1 mm.

In this embodiment, the air gap 800 variation is modeled and simulated by the structural simulation software, and tuning and simulation optimization of each parameter are performed to draw a conclusion: under the condition of continuous microstrip, the simulation curve is better, the VSWR of the standing wave is less than 1.35 before the optimization of the frequency band of 0-40GHz, and the VSWR of the standing wave is less than 1.18 after the optimization;

in addition, the larger the gap is, the poorer the matching effect is, and the optimization simulation result is not obviously improved as can be seen from the variation trend of the simulation curve; when the gap is smaller than 0.7mm, the simulated standing wave VSWR is smaller than 2 in the frequency band of 0-20 GHz, so that the smaller the gap is, the better the gap is in design, and the gap can reach 40GHz when the gap is smaller than or equal to 0.2mm as can be seen from a curve.

Example 3

Different from the embodiments 1 and 2, in the cable and microstrip conversion circuit provided by the embodiment, the metal probe is connected with the linear microstrip feed line 200 in a screw installation or bonding mode;

specifically, in the cable and microstrip conversion circuit provided in this embodiment, the dielectric substrate 100 is bonded better in a 4350B manner than in a screw mounting manner at 0.5GHz to 20 GHz; at 20 GHz-40 GHz, the dielectric substrate 100 is bonded with 3003 better than the screw mounting mode; 3003 is preferable to 4350B for the dielectric substrate 100 at 0GHz to 40 GHz. That is, preferably, the dielectric substrates 100 are bonded using 4350B at 0.5GHz to 20 GHz; the dielectric substrate 100 can be bonded with 3003 at 20GHz to 40GHz, thereby achieving better performance.

The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A cable to microstrip conversion circuit, comprising: a metal probe, a dielectric substrate (100), a linear microstrip feed line (200), a microstrip ground and a metal housing (400), the metal housing (400) having an air cavity (300),

the dielectric substrate (100) is arranged in the metal shell (400);

the linear microstrip feed line (200) is arranged on the top layer of the dielectric substrate (100), and the microstrip ground is arranged on the bottom layer of the dielectric substrate (100);

the metal probe penetrates through the metal shell (400), and the tail end of the metal probe extends to the linear micro-strip feed line (200) and is connected with the linear micro-strip feed line (200),

the connecting position of the metal probe and the linear micro-strip feeder line (200) is positioned on the central line of the linear micro-strip feeder line (200) in the length direction;

the metal probe penetrates through one end of the metal shell (400), and the tangential direction of the upper surface of the metal probe is parallel to the surface of the linear micro-strip feeder line (200).

2. The cable-to-microstrip conversion circuit according to claim 1, wherein the metal probe is a cable pin (600), an insulating sleeve (500) is wrapped around the cable pin (600), and the insulating sleeve (500) abuts against the outside of the metal shell (400);

the cable pin (600) penetrates through the metal shell (400) and forms a relative height difference with the linear microstrip feed line (200).

3. The cable-to-microstrip transition circuit according to claim 2, wherein the connection location of the cable pin (600) to the linear microstrip feed line (200) is as close as possible to the edge of the linear microstrip feed line (200) close to the cable pin (600).

4. The cable-to-microstrip conversion circuit of claim 2 wherein said cable pin (600) is connected to said linear microstrip feed line (200) at a port adjacent to said cable pin (600).

5. The cable-to-microstrip transition circuit of claim 1 wherein said metal probe is an insulator pin (700), a lower surface of said insulator pin (700) being tangential to an upper surface of said linear microstrip feed line (200) and being at the same level.

6. The cable-to-microstrip conversion circuit according to claim 5, wherein an air gap (800) is formed between the inner side wall of the metal housing (400) near the dielectric substrate (100) and the dielectric substrate (100).

7. The cable to microstrip conversion circuit according to claim 6 wherein said air gap (800) ranges from: 0.001 mm-1 mm.

8. The cable to microstrip conversion circuit according to claim 1 wherein the air cavity (300) has dimensions: 15mm 3.5mm 1.5 mm.

9. The cable and microstrip conversion circuit of claim 1 wherein said dielectric substrate (100) is of type ROGERS 4350B.

10. The cable-to-microstrip conversion circuit according to claim 1 wherein said dielectric substrate (100) has a thickness of 0.508mm and a dielectric constant of 3.48.