CN215008225U - LED packaging light source - Google Patents
LED packaging light source Download PDFInfo
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- CN215008225U CN215008225U CN202121021905.9U CN202121021905U CN215008225U CN 215008225 U CN215008225 U CN 215008225U CN 202121021905 U CN202121021905 U CN 202121021905U CN 215008225 U CN215008225 U CN 215008225U
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- led
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Abstract
The utility model discloses a LED encapsulates light source, which comprises a bracket, the intermediate position of support is provided with the round cup shape that is used for placing LED chipset and places the region, LED chipset includes at least two series connection's LED chip. The utility model discloses can realize single 72V, 2W power, when the finished product was used, can reduce the number of light sources, promote the operating efficiency, reduce processing and assembly cost.
Description
Technical Field
The utility model relates to a LED encapsulates light source technical field, in particular to high-pressure lamp pearl can be used to the high power LED encapsulation light source of indoor lighting class.
Background
The LED is used as a fourth-generation green lighting source and is widely applied at present, the mainstream lighting sources in the market at present mainly adopt conventional sizes of 5730, 2835 and the like, the design and effect of a product circuit need to be comprehensively considered by combining the size, the luminous power and the luminous area of the light source, the number of the light sources used by similar products is more, and the market demand cannot be met.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a LED encapsulates light source, aims at promoting the stable performance of LED encapsulation light source, reduces processing and assembly cost.
In order to achieve the above object, the present invention provides an LED package light source, which comprises a bracket, wherein a circular cup-shaped placing region for placing an LED chip set is disposed at an intermediate position of the bracket, and the LED chip set comprises at least two serially connected LED chips.
The utility model discloses a further technical scheme is, the anodal pin of first chip in two chips is connected the support positive pole of support, negative pole pin are connected the anodal pin of second chip in two chips, the negative pole pin of second chip is connected the support negative pole of support.
The further technical proposal of the utility model is that the two chips are 36V chips.
The utility model discloses a further technical scheme is, two chips are blue light chip.
The utility model discloses a further technical scheme is, two chips adopt high thermal conductivity insulating cement fixed connection in place the region.
The utility model discloses a further technical scheme is, the length of support is 3.5mm, and is wide for 2.8mm, and the height is 0.7mm, and the angle is 120 degrees.
The further technical proposal of the utility model is that the luminous area of the LED packaging light source is 2.5mm2。
The further technical proposal of the utility model is that the bracket is made of PCT material or red copper.
The utility model discloses a further technical scheme is, the LED light source adopts SMD heat radiation structure.
The utility model discloses a further technical scheme is, LED encapsulation light source adopts and divides the encapsulation of high temperature curing silicone resin solidification body encapsulation glue encapsulation.
The utility model discloses a beneficial effect of LED encapsulation light source is, the utility model discloses an above-mentioned technical scheme, which comprises a bracket, the intermediate position of support is provided with the cup-shaped region of placing that is used for placing the LED chip group, the LED chip group includes at least two series connection's LED chip, can realize single 72V, 2W power, and when the finished product was used, can reduce the light source and count, promote the operating efficiency, reduce processing and assembly cost.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic front view of a preferred embodiment of an LED packaged light source of the present invention;
FIG. 2 is a schematic diagram of a back side structure of a preferred embodiment of the LED packaged light source of the present invention;
fig. 3 is a schematic cross-sectional view of a preferred embodiment of the LED package light source of the present invention.
The reference numbers illustrate:
| code | Name (R) | Code | Name (R) |
| A1 | Support positive pole | A5 | Gold thread |
| A2 | 36V chip | A6 | Heat radiation structure |
| A3 | Support cathode | B1 | 36V chip |
| A4 | Packaging adhesive |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1 to 3, the present invention provides a LED package light source, which includes a support, wherein a circular cup-shaped placing region for placing a LED chip set is disposed at an intermediate position of the support, and the LED chip set includes at least two LED chips connected in series.
As an embodiment, the number of the LED chips is two, such as a first chip B1 and a second chip a2 shown in fig. 1 to 3, wherein a positive terminal of the first chip B1 is connected to a positive terminal a1 of the rack through a gold wire a5, a negative terminal is connected to a positive terminal of the second chip a2 through a gold wire a5, and a negative terminal of the second chip a2 is connected to a negative terminal A3 of the rack through a gold wire a 5.
In one embodiment, the first chip B1 and the second chip a2 are both 36V chips, wherein the chips may be blue chips.
In this embodiment, the first chip B1 and the second chip a2 are mounted in series in the circular cup-shaped placing region, so that the power of a single chip 72V or 2W can be realized.
Further, in this embodiment, the two chips, i.e., the first chip B1 and the second chip a2, are fixedly connected to the placement region by using a high thermal conductivity insulating adhesive.
Specifically, the first chip B1, the second chip a2, and the support may be physically and fixedly connected using a japanese high-thermal-conductivity insulating paste.
This embodiment adopts first chip B1 with second chip A2 adopts high thermal conductivity insulating cement fixed connection in place the region, the colloid surface is level and smooth, first chip B1 second chip A2 with no debris and bubble between the support can guarantee the performance of LED light source.
In this embodiment, the length of support is 3.5mm, and wide being 2.8mm, high being 0.7mm, the angle is 120 degrees, the luminous area of LED encapsulation light source is 2.5mm2。
Specifically, the support is rectangular, the middle of the support is provided with a circular cup-shaped LED chip group placing area, the light emitting circle center of the LED light source takes the central point of the circular cup-shaped LED chip group placing area as the center, the light emitting area is 2.5mm2, the light emitting path can be guaranteed to be concentrated, and the light emitting color consistency is good.
The support is made of a PCT material or red copper, and the LED light source adopts a patch type heat dissipation structure A6.
The bracket is made of the PCT material or red copper, and the patch type heat dissipation structure A6 is adopted, so that the heat sink area is increased, the heat dissipation effect is good, and the heat sink is suitable for multi-chip packaging combination design.
In this embodiment, the LED package light source is packaged by using a high-temperature cured silicone resin cured body packaging adhesive a 4.
The packaging adhesive A4 is a high-temperature cured silicone resin cured body, has the characteristics of high transparency, high light transmittance, high vulcanization resistance, excellent cold and hot shock resistance and the like, and has excellent adhesion performance with a bracket and a silver coating.
The utility model discloses a beneficial effect of LED encapsulation light source is, the utility model discloses an above-mentioned technical scheme, which comprises a bracket, the intermediate position of support is provided with the cup-shaped region of placing that is used for placing the LED chip group, the LED chip group includes at least two series connection's LED chip, can realize single 72V, 2W power, and when the finished product was used, can reduce the light source and count, promote the operating efficiency, reduce processing and assembly cost.
The above only is the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all under the concept of the present invention, the equivalent structure transformation made by the contents of the specification and the drawings is utilized, or the direct/indirect application is included in other related technical fields in the patent protection scope of the present invention.
Claims (10)
1. The LED packaging light source is characterized by comprising a support, wherein a circular cup-shaped placing area for placing an LED chip set is arranged in the middle of the support, and the LED chip set comprises at least two LED chips connected in series.
2. The LED package light source of claim 1, wherein an anode pin of a first chip of the two chips is connected to an anode of a support of the support, a cathode pin is connected to an anode pin of a second chip of the two chips, and a cathode pin of the second chip is connected to a cathode of the support.
3. The LED package light source of claim 1 or 2, wherein both of the two chips are 36V chips.
4. The LED packaged light source of claim 3, wherein both of the two chips are blue chips.
5. The LED package light source of claim 1, wherein the two chips are fixedly connected to the placement area by high thermal conductivity insulating glue.
6. The LED packaged light source of claim 1, wherein the support has a length of 3.5mm, a width of 2.8mm, a height of 0.7mm, and an angle of 120 degrees.
7. The LED packaged light source of claim 6, wherein the LED packaged light source has a light emitting area of 2.5mm2。
8. The LED packaged light source of claim 1, wherein the support is made of PCT material or red copper.
9. The LED packaged light source of claim 1, wherein the LED light source is a surface mount heat sink structure.
10. The LED package light source of claim 1, wherein the LED package light source is packaged with a high temperature cured silicone resin encapsulant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121021905.9U CN215008225U (en) | 2021-05-13 | 2021-05-13 | LED packaging light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121021905.9U CN215008225U (en) | 2021-05-13 | 2021-05-13 | LED packaging light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215008225U true CN215008225U (en) | 2021-12-03 |
Family
ID=79134373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121021905.9U Active CN215008225U (en) | 2021-05-13 | 2021-05-13 | LED packaging light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215008225U (en) |
-
2021
- 2021-05-13 CN CN202121021905.9U patent/CN215008225U/en active Active
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Legal Events
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518000 floor 5, building B and floor 6, building B, No. 1 new plant, No. 3 industrial zone, Luozu community, Shiyan street, Bao'an District, Shenzhen, Guangdong Patentee after: Shenzhen Liangan Technology Co.,Ltd. Address before: 518000 6 / F, block a and 6 / F, block B, No. 1 new plant, No. 3 industrial zone, Luozu community, Shiyan street, Bao'an District, Shenzhen, Guangdong Patentee before: SHENZHEN LIANGAN PHOTOELECTRICITY TECHNOLOGY CO.,LTD. |