CN214898429U - Snap-in schottky diode - Google Patents

Abstract

The utility model provides a formula of buckleing schottky diode, including the schottky diode, the schottky diode includes schottky chip, cladding and is in the insulating plastic-sealed body in the schottky chip outside, be located two pins of the insulating plastic-sealed body left and right sides, the bar groove has all been seted up at insulating plastic-sealed body both ends, the bar groove extends to schottky chip one end, the bar inslot is filled with conductive plastic, two conductive plastic respectively with the positive negative pole of schottky chip is connected, conductive plastic one end is equipped with the extension, be equipped with the mounting groove on the extension, the pin with the mounting groove lock is connected. The utility model discloses a schottky diode, through the mode installation pin of lock, simple structure assembles easily.

Description

Snap-in schottky diode

Technical Field

The utility model relates to a diode technical field, concretely relates to formula of bucking-in schottky diode.

Background

A schottky diode is a diode in which a barrier is formed at an interface by a metal and an N-type semiconductor contact. Because the Schottky diode has no accumulation and dissipation process of minority carriers near a PN junction, the capacitance effect is very small, the working speed is very high, and the Schottky diode is particularly suitable for high-frequency or switch state application. Conventional schottky diode structure, two pins are direct with the welding of the negative and positive poles of schottky chip usually, through the encapsulation shaping after, the position of two pins is fixed, in case the pin breaks scheduling problem appears, and the schottky diode is directly scrapped, can't reuse.

SUMMERY OF THE UTILITY MODEL

To above problem, the utility model provides a formula schottky diode is detained, through the mode installation pin of lock, simple structure assembles easily.

In order to achieve the above object, the present invention provides the following technical solutions:

the utility model provides a detain formula schottky diode, includes the schottky diode, the schottky diode includes schottky chip, cladding the insulating plastic-sealed body in the schottky chip outside, is located two pins of the insulating plastic-sealed body left and right sides, the bar groove has all been seted up at insulating plastic-sealed body both ends, the bar groove extends to schottky chip one end, the bar inslot is filled with conductive plastic, two conductive plastic respectively with the positive negative pole of schottky chip is connected, conductive plastic one end is equipped with the extension, be equipped with the mounting groove on the extension, the pin with the mounting groove lock is connected.

Specifically, the pin includes the welding part, connects the supporting part of welding part one end, connects the plane portion of supporting part one end, connects the contact site of plane portion one end, connects the kink in the contact site upper end, plane portion with the angle that the contact site formed is 90, the contact site inserts the mounting groove is inboard, the kink is in through buckling the back lock extension upper end.

Specifically, the bottom of the insulating plastic package body is further provided with a radiating gasket.

Specifically, the angle formed by the welding part and the supporting part is 120 °.

Specifically, the outer side surface of the insulating plastic package body is further coated with a fireproof coating.

The utility model has the advantages that:

the utility model discloses a schottky diode fills conductive plastic at schottky chip both ends, is equipped with the extension in conductive plastic one end, is equipped with the mounting groove on the extension, is connected the pin with the mounting groove lock for the pin is replaceable characteristic, when the pin appears breaking, changes the pin easily, and simple structure changes the degree of difficulty and hangs down.

Drawings

Fig. 1 is a schematic structural diagram of a snap-in schottky diode according to the present invention.

Fig. 2 is a schematic structural diagram of the insulating plastic package body.

Fig. 3 is a schematic structural view of the lead before and after bending.

Fig. 4 is a top view of the snap-in schottky diode of the present invention.

Fig. 5 is a cross-sectional view taken along the plane a-a in fig. 4.

The reference signs are: the schottky chip 1, the insulating plastic package 2, the leads 3, the soldering portion 31, the supporting portion 32, the planar portion 33, the contact portion 34, the bending portion 35, the conductive plastic 4, the extending portion 41, the mounting groove 411 and the heat dissipation pad 5.

Detailed Description

The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.

As shown in fig. 1-5:

the utility model provides a detain formula schottky diode, including schottky diode, schottky diode includes schottky chip 1, the cladding is at the insulating plastic-sealed body 2 in the schottky chip 1 outside, be located two pins 3 of the 2 left and right sides of insulating plastic-sealed body, the bar groove has all been seted up at 2 both ends of insulating plastic-sealed body, the bar groove extends to 1 one end of schottky chip, the bar inslot is filled with conductive plastic 4, conductive plastic 4 mixes resin and conducting material, the functional type macromolecular material of processing is carried out with the processing mode of plastics, the electric conductivity has, two conductive plastic 4 are connected with schottky chip 1's positive negative pole respectively, 4 one end of conductive plastic is equipped with extension 41, be equipped with mounting groove 411 on the extension 41, pin 3 is connected with mounting groove 411 lock.

Preferably, the lead 3 includes a soldering portion 31, a supporting portion 32 connected to one end of the soldering portion 31, a flat portion 33 connected to one end of the supporting portion 32, a contact portion 34 connected to one end of the flat portion 33, and a bent portion 35 connected to an upper end of the contact portion 34, an angle formed by the flat portion 33 and the contact portion 34 is 90 °, the contact portion 34 is inserted into the mounting groove 411, and the bent portion 35 is bent to be engaged with an upper end of the extending portion 41.

Preferably, in order to improve the heat dissipation performance of the bottom of the insulating plastic package body 2, a heat dissipation gasket 5 is further arranged at the bottom of the insulating plastic package body 2.

Preferably, the angle formed by the welding portion 31 and the supporting portion 32 is 120 °.

Preferably, in order to improve the fireproof performance of the outer side surface of the insulating plastic package body 2, the outer side surface of the insulating plastic package body 2 is further coated with a fireproof coating.

The above examples only represent 1 embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (5)

1. The utility model provides a detain formula schottky diode, a serial communication port, includes the schottky diode, the schottky diode includes schottky chip (1), cladding in insulating plastic-sealed body (2) in schottky chip (1) outside, be located two pins (3) of insulating plastic-sealed body (2) left and right sides, the bar groove has all been seted up at insulating plastic-sealed body (2) both ends, the bar groove extends to schottky chip (1) one end, the bar inslot is filled there are conductive plastic (4), two conductive plastic (4) respectively with the positive negative pole of schottky chip (1) is connected, conductive plastic (4) one end is equipped with extension (41), be equipped with mounting groove (411) on extension (41), pin (3) with mounting groove (411) lock is connected.

2. The snap-in schottky diode of claim 1, wherein the lead (3) comprises a soldering portion (31), a supporting portion (32) connected to one end of the soldering portion (31), a flat portion (33) connected to one end of the supporting portion (32), a contact portion (34) connected to one end of the flat portion (33), and a bent portion (35) connected to an upper end of the contact portion (34), an angle formed by the flat portion (33) and the contact portion (34) is 90 °, the contact portion (34) is inserted into the inner side of the mounting groove (411), and the bent portion (35) is bent and then fastened to an upper end of the extending portion (41).

3. A snap-in schottky diode as claimed in claim 1, wherein the bottom of the insulating plastic package (2) is further provided with a heat sink (5).

4. Snap-in schottky diode according to claim 2, characterized in that the angle formed by the weld (31) and the support (32) is 120 °.

5. Snap-in schottky diode according to claim 1, characterized in that the outer side of the insulating plastic body (2) is also coated with a fire-retardant coating.

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