CN214851997U - Aluminum substrate with high pressure resistance - Google Patents
Aluminum substrate with high pressure resistance Download PDFInfo
- Publication number
- CN214851997U CN214851997U CN202121450900.8U CN202121450900U CN214851997U CN 214851997 U CN214851997 U CN 214851997U CN 202121450900 U CN202121450900 U CN 202121450900U CN 214851997 U CN214851997 U CN 214851997U
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- heat dissipation
- high pressure
- pressure resistance
- aluminum plate
- heat
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Abstract
The utility model discloses an aluminium base board with high pressure resistance, the below that includes aluminum plate (1) is equipped with heat dissipation support (5), the left and right sides of aluminum plate (1) is equipped with outside bayonet socket (10) of opening, the left and right sides of heat dissipation support (5) is equipped with outside opening slide (6), slide cooperation in slide (6) is connected with joint arm (7), set firmly tensioning spring (8) between joint arm (7) and the slide (6) inner wall, one side that the tensioning spring (8) was kept away from to joint arm (7) has set firmly dop (9), open slot (11) that link up the setting from top to bottom is seted up in the middle of heat dissipation support (5), be equipped with location spout (16) on the left and right sides wall of open slot (11), be equipped with the heat dissipation module in open slot (11); this practicality can realize quick installation and heat dissipation work, prevents to receive external force influence and damage simultaneously.
Description
Technical Field
The utility model relates to an aluminium base board technical field specifically is an aluminium base board with high pressure resistant performance.
Background
When the aluminum substrate circuit board runs, heat is generated, when the heat is not transferred in time and is accumulated continuously, the temperature of the circuit board and the peripheral circuit board segments of the circuit board is increased continuously, and if the temperature exceeds the temperature limit which can be borne by the circuit board material, the circuit board is easy to damage or burn. In order to transfer heat generated by chip operation and heat on a circuit board in time, a heat radiating fin is generally arranged on the existing circuit board, and the traditional heat radiating fin is not easy to disassemble and assemble, has poor pressure resistance and is easy to be damaged by external force.
Disclosure of Invention
An object of the utility model is to provide an aluminium base board with high pressure resistance for overcome above-mentioned defect among the prior art.
The aluminum substrate with high pressure resistance of the utility model comprises a heat dissipation support arranged below an aluminum plate, bayonets with outward openings are arranged on the left side and the right side of the aluminum plate, slideways with outward openings are arranged on the left side and the right side of the heat dissipation support, the inner slideway of the slideway is matched and connected with a clamping arm, a tension spring is fixedly arranged between the clamping arm and the inner wall of the slideway, a clamping head is fixedly arranged on one side of the clamping arm far away from the tension spring, an open slot which is arranged in a vertically through way is arranged in the middle of the heat dissipation support, the left side wall and the right side wall of the open slot are provided with positioning chutes, the open slot is internally provided with a heat radiation module, the heat dissipation module comprises a heat conduction plate, heat dissipation fins are fixedly arranged at the bottom of the heat conduction plate, positioning guide blocks matched and connected with the positioning chute slide ways are fixedly arranged on the left side and the right side of the heat conduction plate, and jacking springs are arranged between the positioning guide blocks and the bottom wall of the positioning chute.
According to the further technical scheme, the top of the aluminum plate is sequentially provided with an insulating medium layer, a copper foil circuit layer and a resistance welding ink layer from bottom to top, and the insulating medium layer has good strength, flexibility and high-voltage breakdown resistance.
According to the further technical scheme, a buffering support block is fixedly arranged at the bottom of the heat dissipation support.
Further technical scheme, the fin is equipped with a plurality ofly and the equidistance setting of arranging.
The beneficial effects of this utility are: this practicality is connected with the dop cooperation through the bayonet socket to realize quick installation, the roof pressure through roof pressure spring makes the top of heat-conducting plate and aluminum plate's firm contact, thereby provides the transmission work of heat, and discharges the absorptive heat fast by the fin of heat-conducting plate bottom, prevents through buffering a piece that whole receives the influence of external force and influence and impaired.
Drawings
Fig. 1 is a schematic view of an internal structure of an aluminum substrate with high pressure resistance according to the present invention;
FIG. 2 is an enlarged schematic view of A of FIG. 1 according to the present invention;
fig. 3 is a schematic structural diagram of the heat dissipation module in the present application.
Detailed Description
The present invention will be described in detail with reference to fig. 1 to 3.
Referring to fig. 1-3, an aluminum substrate with high pressure resistance according to an embodiment of the present invention includes a heat sink 5 disposed below an aluminum plate 1, wherein bayonets 10 with outward openings are disposed on left and right sides of the aluminum plate 1, so as to facilitate rapid installation work, slides 6 with outward openings are disposed on left and right sides of the heat sink 5, a clamping arm 7 is connected to an inner slide of the slide 6 in a matching manner, a tension spring 8 is fixedly disposed between the clamping arm 7 and an inner wall of the slide 6, a chuck 9 is fixedly disposed on a side of the clamping arm 7 away from the tension spring 8, so as to achieve rapid matching work with the bayonet 10, an open slot 11 vertically penetrating through the heat sink 5 is disposed in the middle of the heat sink 5, positioning chutes 16 are disposed on left and right side walls of the open slot 11, a heat sink module is disposed in the open slot 11, and includes a heat conductive plate 13, thereby realize the rapid transfer heat, the bottom of heat-conducting plate 13 has set firmly fin 14, the left and right sides of heat-conducting plate 13 set firmly with location guide block 15 that 16 slides of location spout cooperate and connect, location guide block 15 with be equipped with roof pressure spring 17 between the diapire of location spout 16 to make heat-conducting plate 13 with aluminum plate 1's contact complex steadiness.
Beneficially or exemplarily, the aluminum plate 1 is provided with an insulating medium layer 2, a copper foil circuit layer 3 and a solder mask ink layer 4 on the top in sequence from bottom to top, and the insulating medium layer has good strength and flexibility and high voltage breakdown resistance.
Advantageously or exemplarily, a buffering support block is fixedly arranged at the bottom of the heat dissipation support 5 to prevent the heat dissipation support from being damaged due to the influence of external force.
Advantageously or exemplarily, the heat dissipation fins 14 are arranged in a plurality of and equidistant arrangements to provide heat dissipation effect.
The beneficial effects of this utility are: this practicality is connected with the dop cooperation through the bayonet socket to realize quick installation, the roof pressure through roof pressure spring makes the top of heat-conducting plate and aluminum plate's firm contact, thereby provides the transmission work of heat, and discharges the absorptive heat fast by the fin of heat-conducting plate bottom, prevents through buffering a piece that whole receives the influence of external force and influence and impaired.
It will be apparent to those skilled in the art that various modifications to the above embodiments can be made without departing from the general spirit and concept of the invention. All falling within the scope of protection of the present application. The protection scheme of this utility model is based on the appended claims of this utility model.
Claims (4)
1. The utility model provides an aluminium base board with high pressure resistance, includes that the below of aluminum plate (1) is equipped with heat dissipation and holds in the palm (5), its characterized in that: the aluminum plate heat dissipation device is characterized in that bayonets (10) with outward openings are arranged on the left side and the right side of the aluminum plate (1), slide ways (6) with outward openings are arranged on the left side and the right side of the heat dissipation support (5), clamping arms (7) are connected with clamping arms (7) in a matched mode in the slide ways (6), tensioning springs (8) are fixedly arranged between the clamping arms (7) and the inner walls of the slide ways (6), clamping heads (9) are fixedly arranged on one sides of the tensioning springs (8) in the clamping arms (7), open grooves (11) which are vertically arranged in the middle of the heat dissipation support (5) in a communicated mode are formed in the middle of the heat dissipation support, positioning sliding grooves (16) are formed in the left side wall and the right side wall of the open grooves (11), heat dissipation modules are arranged in the open grooves (11), each heat dissipation module comprises a heat conduction plate (13), heat dissipation fins (14) are fixedly arranged at the bottom of the heat conduction plate (13), positioning guide blocks (15) are fixedly connected with the slide ways of the positioning sliding grooves (16), and a jacking spring (17) is arranged between the positioning guide block (15) and the bottom wall of the positioning chute (16).
2. The aluminum substrate with high pressure resistance as recited in claim 1, wherein: the top of the aluminum plate (1) is sequentially provided with an insulating medium layer (2), a copper foil circuit layer (3) and a solder resist ink layer (4) from bottom to top.
3. The aluminum substrate with high pressure resistance as recited in claim 1, wherein: and a buffer support block is fixedly arranged at the bottom of the heat dissipation support (5).
4. The aluminum substrate with high pressure resistance as recited in claim 1, wherein: the radiating fins (14) are arranged in a plurality of equidistant arrangement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121450900.8U CN214851997U (en) | 2021-06-29 | 2021-06-29 | Aluminum substrate with high pressure resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121450900.8U CN214851997U (en) | 2021-06-29 | 2021-06-29 | Aluminum substrate with high pressure resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214851997U true CN214851997U (en) | 2021-11-23 |
Family
ID=78811057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121450900.8U Active CN214851997U (en) | 2021-06-29 | 2021-06-29 | Aluminum substrate with high pressure resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214851997U (en) |
-
2021
- 2021-06-29 CN CN202121450900.8U patent/CN214851997U/en active Active
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