CN214807926U

CN214807926U - Rotatable beauty instrument

Info

Publication number: CN214807926U
Application number: CN202023162718.0U
Authority: CN
Inventors: 李兵
Original assignee: Shenzhen Yuyi Electronic Technology Co Ltd
Current assignee: Shenzhen Yuyi Electronic Technology Co Ltd
Priority date: 2020-04-02
Filing date: 2020-12-23
Publication date: 2021-11-23
Anticipated expiration: 2030-12-23
Also published as: CN112484337A; CN115628569A; CN213312973U; CN216258753U; CN213312969U; CN112484336A; CN214807922U; CN214971202U; CN214807921U; CN213994603U; CN213432629U

Abstract

The utility model relates to a rotatable beauty instrument, which comprises a main machine body, wherein a light source component, a power supply unit and a control circuit board are arranged in the main machine body; the power supply unit supplies power to the light source component; the front end surface of the beauty instrument is a working surface; the beauty instrument controls the power supply unit to excite the light source assembly to generate pulsed light through the control circuit board, and the pulsed light generated by the light source assembly penetrates through the working face to perform beauty treatment. The main body of the beauty instrument is divided into a first main body and a second main body which can rotate relatively by a pair of cross sections in the main body, the cross sections are respectively used as the connecting end surfaces between the first main body and the second main body, and the first main body and the second main body are connected by a rotary connecting structure; the front end face of the first main machine body is the working face, and the light source assembly is located in the first main machine body.

Description

Rotatable beauty instrument

Technical Field

The utility model belongs to the technical field of portable beauty instrument equipment and specifically relates to a rotatable beauty instrument.

Background

Currently, the depilatory instruments commonly used in the market are generally straight plates, and the machine body can not rotate; the rotatable epilator comprises a hand-held part and a rotating head part, wherein the rotating head part is generally vertically arranged with the hand-held part, for example, the hand-held part is in an upright structure, and the rotating head part is in a rotating fit with a horizontal direction vertical to the hand-held part. These epilation instruments rotate and can only realize a dimension, for example advance rotation angle of adjustment in the vertical plane, and the adjustment dimension is limited, and the handheld operation of user is inconvenient, and experience is relatively poor.

Disclosure of Invention

An object of the utility model is to provide a rotatable beauty instrument solves the rotatory head of current beauty instrument and adjusts limited, use inconvenient scheduling problem.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a rotatable beauty instrument comprises a main machine body, a light source component, a power supply unit and a main control circuit board are arranged in the main machine body; the power supply unit supplies power to the light source component; the front end surface of the beauty instrument is a working surface; the beauty instrument controls the power supply unit to excite the light source assembly to generate pulse light through the control circuit board, and the pulse light generated by the light source assembly penetrates through the working surface to perform beauty treatment; the main body of the beauty instrument is divided into a first main body and a second main body which can rotate relatively by a pair of cross sections in the main body, and the first main body and the second main body are connected by a rotary connection structure; the front end face of the first main machine body is the working face, and the light source assembly is located in the first main machine body.

Furthermore, the matching of the pair of sections and the rotary connection structure enables the first main machine body to freely rotate relative to the second main machine body, so that the first main machine body and the second main machine body are in a straight plate type or side-standing type structure with different angles; the cross section is respectively used as the connecting end surfaces of the first host body and the second host body.

Furthermore, when the beauty instrument is of a straight plate type structure, the first main machine body is connected with the second main machine body in an aligned mode, and the connecting end faces of the first main machine body and the second main machine body are attached in an aligned and parallel mode;

the first main body is freely rotated and connected with the second main body in an inclined way at various preset angles to form a side-standing structure of the beauty instrument, and the connecting end surfaces of the first main body and the second main body are jointed in parallel in a staggered way or in an aligned way.

Further, the pair of sections are cross sections of the main body of the beauty instrument, or the pair of sections are oblique sections of the main body of the beauty instrument; the pair of sections are mutually attached and supported.

Further, the rotational connection is a pivoting or gimbaled rotational connection; the first main machine body can freely rotate relative to the second main machine body and is not separated from the second main machine body; the rotary connection structure is provided with a limiting structure, and the rotating shaft and the shaft hole are prevented from being separated from each other in a rotating fit mode.

Furthermore, the pivoting includes arranging a rotating shaft and a shaft hole between the first main machine body and the second main machine body to form a rotating fit, so that the first main machine body rotates relative to the second main machine body; the limiting structure is arranged on the rotating shaft and/or the shaft hole; wherein, one of the connection end surfaces of the first main machine body and the second main machine body is provided with a shaft hole, and the other connection end surface is provided with a rotating shaft; or, a shaft hole is formed in one of the connecting end surfaces of the first main machine body and the second main machine body, a universal ball is arranged on the other connecting end surface, and the roller is nested in the shaft hole and rotationally matched with the shaft hole to drive the first main machine body to rotate relative to the second main machine body; set up limit structure on shaft hole and/or the ball, prevent that ball and shaft hole normal running fit from breaking away from each other. The limiting structure is one or a combination of a baffle plate structure, a flange, a buckle and a fastener.

Furthermore, a boss is arranged in the center of one connecting end face of the connecting end faces of the first main machine body and the second main machine body to form a rotating shaft, and a shaft hole is arranged in the center of the other connecting end face; the boss penetrates through the shaft hole, and the tail end of the boss is further provided with a rotary position fixing connecting plate as a limiting structure to prevent the boss from separating from the shaft hole; the rotary position fixing connecting plate and the lug boss are fixedly connected. Fastening connection between rotatory position fixed connection board and the boss includes: the screw is fastened and connected, and the screw is fastened and connected with the stud, the buckle is fastened and connected, the riveting is fastened and connected, and the ball head is elastically buckled and fixedly connected with one or more of the studs.

Furthermore, a plurality of air inlets and air outlets are arranged on the shell of the first main machine body, and a radiator and a fan are arranged in the first main machine body. The air inlet, the space on the surface of the radiator, the fan and the air passage between the air outlets are communicated to form an air-cooling heat dissipation channel, and the air-cooling heat dissipation channel is used for sucking ambient cold air into the space on the surface of the radiator through the air inlet and discharging the ambient cold air to the air outlets through the fan to perform air-cooling heat dissipation. The working surface of the beauty instrument is refrigerated by the semiconductor refrigeration sheet or the cold surface of the semiconductor refrigeration sheet is used as the working surface. The semiconductor refrigerating sheet comprises a PN galvanic couple particle layer, a cold surface and a hot surface; the cold surface and the hot surface are respectively arranged at the cold end and the hot end of the PN galvanic couple particle layer; the PN galvanic couple particle layer comprises P type/N type semiconductor particles. And the cold surface and the hot surface form a cold end circuit or a metal conductor through metallization, and the P-type/N-type semiconductor particles are connected in series. The semiconductor refrigerating sheet is provided with a light transmitting area for transmitting pulse light generated by a light source to carry out cosmetic treatment.

Furthermore, the working surface is made of transparent crystal materials to form a transparent crystal working surface, so that an icing effect is obtained; the cold surface of the semiconductor refrigeration sheet is made of transparent crystal materials to form a transparent crystal cold surface, and the transparent crystal cold surface is used as a working surface; or the semiconductor refrigerating sheet refrigerates the working surface of the transparent crystal. The hot surface of the semiconductor refrigerating sheet is connected with the radiator, and the radiator radiates heat to the hot surface; the light-transmitting area is formed by a hollow area inside the semiconductor chilling plate, and/or the light-transmitting area is provided by a transparent crystal of the semiconductor chilling plate.

Furthermore, the semiconductor refrigeration sheet adopts a transparent crystal as a cold surface, and the transparent crystal is fixedly connected with one or more groups of PN galvanic couple particle layers and a hot surface connected with the PN galvanic couple particle layers; the cold surface of the transparent crystal forms a light transmitting area for transmitting pulse light generated by a light source to carry out cosmetic treatment; or the hot surface of the semiconductor refrigerating sheet is annular; the PN galvanic couple particle layer is annular or P-type/N-type semiconductor particles are arranged in an annular manner; the annular middle area forms a light transmission area; the cold surface of the transparent crystal is a whole crystal, and an annular hollow area of the hot surface is sealed and covered for transmitting pulse light generated by a light source; or the hot surface of the semiconductor refrigerating sheet is annular; the PN galvanic couple particle layer is annular or P-type/N-type semiconductor particles are arranged in an annular manner; the cold surface is annular and is made of transparent or non-transparent materials, the annular hot surface and the annular cold surface are respectively welded at two ends of a PN galvanic couple particle layer or a P-type/N-type semiconductor particle, and the annular middle area forms a light transmission area.

Furthermore, the hot surface of the semiconductor refrigeration sheet is connected with the radiator through a heat pipe, and the heat pipe is used for quickly conducting the heat of the hot surface to the radiator for radiating together; the heat pipe contains a refrigerant therein. The radiator comprises a plurality of radiating fins; the radiating fins are metal radiating fins or graphene radiating fins. The radiating fins are connected and fixed through a connecting structure; or the plurality of radiating fins are of an integral structure integrally formed by graphene. The heat sink includes one or more sets of parallel arranged fins. The heat pipe is arranged in the channel of the one or more groups of radiating fins which are arranged in parallel in a penetrating way and is matched with the radiating fins in a close contact way, or the heat pipe is fixed on the heat conducting fins which are combined on the radiating fins and is matched with the radiating fins in a close contact way.

Furthermore, the hot surface of the semiconductor refrigeration piece is formed by a heat conducting plate; the heat-conducting plate is a VC heat-conducting plate, and a refrigerant is contained in the heat-conducting plate. The interior of the heat pipe is communicated with the interior of the heat conducting plate to form a communicated closed space; the refrigerant flows through the sealed space. The heat conducting plate is a metal plate; the surface of the metal plate is provided with an insulating layer and the hot end circuit or the metal conductor so as to connect the P-type/N-type semiconductor particles in series.

In some embodiments, the cosmetic apparatus uses an epilating apparatus as a main body, and the pulsed light generated by the cosmetic apparatus can be used for epilating; the optical filtering component is arranged on the head of the depilating apparatus and is used for filtering the pulse wave generated by the light source so as to obtain the beauty treatment apparatus with different efficacies of beauty treatment or treatment. A bin channel or a clamping groove for inserting the optical filter component is arranged between the light source component and the working surface in the depilating instrument, and the optical filter component can be inserted in a pluggable and replaceable manner, so that the cosmetic instrument with different cosmetic or treatment effects is obtained. The filtering component comprises a filter, a frame bracket for fixing the filter and a filtering component circuit; the light filtering component circuit is arranged on the frame bracket; the filtering component and the bin channel or the clamping groove are further elastically abutted by an elastic element. Different filter assemblies are provided with filters with different wavelengths and resistors with different resistance values, and the corresponding filter assemblies are identified by detecting the resistance values of the resistors in the filter assemblies or detecting the voltages at two ends of the resistors or detecting the current flowing through the resistors. The resistor is arranged on the circuit board of the light filtering component and is electrically connected with the main control circuit board in the beauty instrument through the electrode component. The electrode assembly comprises a group of counter electrodes which are respectively and correspondingly electrically connected with two ends of the resistor on the filter circuit board. A pair of electrodes of the electrode component is fixed by the insulating body, one end of each electrode at two ends is used for electrically connecting one end of the resistor on the light filtering component circuit board, and the other end is used for electrically connecting a main control circuit board in the beauty instrument; the electrode assembly is mounted on a structural member inside the cosmetic instrument. The insulating body is provided with pins which are clamped and fixed with the filtering component.

Further, the light source assembly is arranged on the light source bracket, and light generated by the light source assembly is transmitted to the working surface through the light-emitting cavity assembly; the light-emitting cavity component is abutted against the hot surface of the refrigerating sheet and the front end of the light source bracket to form a light-transmission sealing channel connected between the light source component and the working surface; the light-emitting cavity component comprises a mirror surface cover bracket, a mirror surface cover, a sealing ring pressing plate and white glass or a high-transparency medium plate; the mirror surface cover is internally provided with a light channel which is matched with a light transmission area of the semiconductor refrigeration sheet and is arranged on the mirror surface cover bracket; the front end of the mirror face cover bracket is an annular cavity which is sheathed with the mirror face cover in a matching way, and the rear end surface of the mirror face cover bracket is covered and sealed by white glass or a highly transparent dielectric plate; the edge of the white glass or the high transparent medium plate is sleeved with a sealing ring; a pressing plate is further arranged outside the white glass or the high-transparency medium plate and used for pressing the white glass or the high-transparency medium plate; the front end of the light channel is sealed by a semiconductor refrigeration sheet or a working surface, and the rear end of the light channel is sealed by white glass or a high-transparency medium plate; one or more pieces of white glass or high-transparency medium plates are arranged on the light-emitting surface of the light source component.

In some embodiments, a sub-control circuit board is disposed in the first main body, and a power supply unit and a main control circuit board are disposed in the second main body; the sub-control circuit board is electrically connected with the main control circuit board; the beauty instrument is provided with a power line for connecting an external power supply; the power supply unit is an energy storage capacitor; the power line is connected with a power adapter which is a first electric control module; the sub-control circuit board is a high-voltage discharge PCBA and a second electric control module; the main control circuit board is a boost PCBA and is a third electric control module; the voltage input by the power supply line of the power adapter is wide voltage AC 90V-264V, and the voltage is reduced to DC12V or DC 24V or to a voltage value between DC 12-24V in power adaptation through the first electronic control module; the voltage is output to the beauty instrument main body through a power line, when the voltage is input to the second electric control module to be boosted through PCBA, the voltage is adjusted from DC12V or DC 24V or DC 12V-24V to be boosted to be charged to the energy storage capacitor through DC250V-400V according to the energy gear requirement; the light of the light source component is controlled by the third electric control module to emit light; the light source of the light source component is an IPL lamp tube, and the light source is triggered to light up to release capacitance energy, so that a flashing effect is achieved.

Further, the radiator is used for radiating heat of the light source component; the space on the surface of the light source component is communicated with the air-cooling heat dissipation channel and used for sucking ambient cold air into the space on the surface of the light source component through the air inlet and discharging the ambient cold air to the air outlet through the fan to realize air-cooling heat dissipation; the light source component comprises a light source and a reflecting cup covered outside the light source; the light source is electrified to generate pulsed light.

The utility model has the advantages that:

the utility model discloses a rotatable beauty instrument separates the main frame body for first main part and the second main part of relative rotation through a pair of connection terminal surface, and the rotation in-process can realize the formula of standing on one's side of vertical and free rotation, and the person of facilitating the use operates.

The present invention will be described in further detail with reference to the accompanying drawings.

Drawings

Fig. 1 is a perspective view of a bar-type structure of a rotatable beauty instrument according to an embodiment of the present invention.

Fig. 2 is a perspective view of a side-standing structure of the rotatable beauty instrument according to the embodiment of the present invention.

Fig. 3 is a top view of the rotatable beauty instrument according to the embodiment of the present invention in several rotation states.

Fig. 4 is an exploded view of the rotatable beauty instrument according to the embodiment of the present invention.

Fig. 5-7 are sectional views of the side-standing structure of the rotatable beauty instrument according to the embodiment of the present invention.

Fig. 8 is a schematic diagram of various schemes of the rotary connection structure of the rotary beauty instrument of the utility model.

Fig. 9 is a sectional view of a rotatable beauty instrument according to another embodiment of the present invention.

Fig. 10 is a perspective view of the first embodiment of the semiconductor refrigeration sheet of the present invention.

Fig. 11 is an exploded view of the first embodiment of the semiconductor cooling plate of the present invention.

Fig. 12 is a front view of the first embodiment of the semiconductor cooling fin of the present invention.

Fig. 13 is a side view of a first embodiment of the semiconductor chilling plate of the present invention.

Fig. 14 is a perspective view of the refrigerating surface of the first embodiment of the semiconductor refrigerating sheet of the present invention.

Fig. 15 is a perspective view of a second embodiment of the semiconductor cooling plate of the present invention.

Fig. 16(a) to 16(f) are schematic views of a heat dissipation system in a second embodiment of the semiconductor cooling fin of the present invention.

Fig. 17 is a perspective view of a third embodiment of the semiconductor cooling plate of the present invention.

Fig. 18(a) to 18(c) are schematic views of a heat dissipation system in a third embodiment of the semiconductor cooling fin of the present invention.

Fig. 19 is a perspective view of a fourth embodiment of the semiconductor cooling plate of the present invention.

Fig. 20(a) to 20(d) are schematic views of a heat dissipation system in a fourth embodiment of the semiconductor refrigeration sheet of the present invention.

Fig. 21 is a perspective view of a fifth embodiment of the semiconductor refrigeration sheet of the present invention.

Fig. 22(a) to 22(e) are schematic views of a heat dissipation system in a fifth embodiment of the semiconductor refrigeration sheet of the present invention.

Fig. 23 is an exploded view of two schematic configurations of a refrigeration structure according to an embodiment of the present invention.

Fig. 24 is a perspective view of a refrigeration structure according to an embodiment of the present invention.

Fig. 25(a) -25(e) are process flow diagrams of the refrigeration structure of the embodiment of the present invention.

Fig. 26 is a schematic circuit diagram of a semiconductor refrigeration chip according to an embodiment of the present invention.

Fig. 27 is a schematic view of a refrigeration structure of an embodiment of the present invention.

Detailed Description

It should be noted that, in the present invention, features of various embodiments and embodiments can be combined with each other without conflict, and the present invention is further described in detail with reference to the accompanying drawings and specific embodiments.

Referring to fig. 1-9, the present invention relates to a cosmetic apparatus 1000, which generally uses a depilation apparatus as a main body and generates IPL pulsed light for depilation treatment or other cosmetic treatments. For example, the filter assemblies 50 with different wave bands are replaceably installed on the handpiece of the main body of the hair removal device, and the IPL pulsed light is filtered to obtain the pulsed light with different wave bands and then transmitted to the working surface for light emission, so that different cosmetic functions or therapeutic functions can be realized. The utility model discloses a beauty instrument includes first host computer body 100 and second host computer body 200, and first host computer body 100 second host computer body 200 free rotation relatively is rotatory to the formula structure that stands to the side by the straight board-like structure. In some embodiments, the beauty treatment apparatus main body is divided by a pair of sections to form a first main body 100 and a second main body 200. The pair of cross sections are connected and limited by a rotary connection structure, so that the first main body 100 can freely rotate relative to the second main body 200. The pair of sections are respectively used as a connecting end surface of the first main machine body and a connecting end surface of the second main machine body; accordingly, the front end face of the first main body 100 is a working face of the beauty instrument and can be directly contacted with the skin, the pulsed light generated inside the main body is transmitted to the working face and then is subjected to depilating treatment or other beauty treatment, and the rear end face is the cross-section and is used as a connecting end face of the first main body, which is denoted by reference numeral 64. The other cross section is used as the front housing of the second main body 200, and is correspondingly the connecting end surface of the second main body, which is marked with the reference numeral 68. The pair of sections can be the cross section of the whole main body of the beauty instrument; preferably, the pair of sections are oblique sections of the whole main body of the beauty instrument, so that the first main body 100 and the second main body 200 are connected from a linear type (straight plate type) connection rotation to an oblique type (side-standing type) connection, and the front end surface of the first main body 100 is a working surface capable of contacting with the skin surface to perform depilation treatment or other beauty treatment.

In one embodiment, when the beauty instrument 1000 is a bar type, the first main body 100 and the second main body 200 are aligned and connected, and the connection end surfaces 64 and 68 are aligned and attached in parallel. In this case, the connection end surface corresponds to a chamfered section (or cross section) of the entire main body. Preferably, the two

main bodies

100 and 200 are connected in a straight line/bar type. In other embodiments, the first main body 100 is freely rotated, and the first main body 100 and the second main body 200 (in the axial length direction) are connected with each other in a manner of deviating from a straight plate (or a straight line) and inclining at a certain angle, that is, in a side-standing state; the connection end faces of the first host machine body and the second host machine body are staggered or aligned and attached in parallel, and the connection end faces support each other, so that the first host machine body and the second host machine body can be stabilized at various rotating positions.

In some embodiments, the relative rotation between the first main body 100 and the second main body 200 is implemented by a rotation connection structure 40, the rotation connection structure 40 can be a pivot or a ball, and a limit fit is further provided to allow the relative rotation between the first main body and the second main body without disengagement. For example, a rotation shaft and a shaft hole or a shaft sleeve are disposed between the first main body 100 and the second main body 200 to form a rotation fit. Alternatively, the rotational connection structure may be a universal rotational connection structure such as a ball-and-socket structure. In various embodiments of the rotary connection structure 40, referring to fig. 4-9 in combination, the rotary connection structure 40 is a pivot structure formed between the connection end surfaces of the first main body 100 and the second main body 200 and is provided with a limit structure, wherein a shaft hole 42 is formed on one of the connection end surface housings, a rotating shaft structure such as a boss 43 is provided on the other connection end surface housing, and the boss 43 penetrates through the shaft hole 42 from one side and then the tail end is clamped on the other side of the shaft hole 42, so that the shaft hole 42 is sleeved and limited on the boss 43 and can rotate relatively. Furthermore, a limiting structure is arranged on the rotating shaft or the shaft hole, so that the rotating shaft is not separated from the shaft hole. In a specific example, a structure having a size larger than that of the shaft hole 42, such as a flange and/or a locking structure, may be provided at the end of the boss 43. In this embodiment, in fig. 8(a), a rotation position fixing connecting plate 41 is further disposed at the end of the boss 43, the size of the rotation position fixing connecting plate 41 is larger than that of the shaft hole 42, the boss 43 is prevented from being separated from the shaft hole 42, the rotation position fixing connecting plate 41 and the boss 43 are fixed by screws, and a screw position 44 is correspondingly disposed and fixed by screws, so that the boss 43 and the rotation position fixing connecting plate 41 are fastened together; at this time, the shaft hole 42 formed on the connecting end surface 64 is sleeved outside the boss (rotating shaft), and both ends of the shaft hole are limited by the connecting end surface 68 where the boss 43 is located and the rotating position fixing connection plate 41 respectively. In fig. 8(b), a through hole is formed in the center of the boss 43 and the rotary fixing connecting plate 41, the boss 41 and the rotary fixing connecting plate 41 are further locked by a screw and a stud in the through hole, and the screw and a nut of the stud are respectively clamped outside the through hole of the boss and the through hole of the connecting plate 41; in fig. 8(c), a spring buckle is arranged at one side of the rotary fixing connecting plate 41, is clamped into a through hole in the boss 43, and is reversely buckled outside the through hole by a tail end buckle; in fig. 8(d), a riveting structure is further arranged in the aligned central through hole of the boss 43 and the rotating fixing connecting plate 41, a hook is arranged at the tail end of the rivet, and the cap part and the hook of the rivet are respectively clamped on the outer sides of the boss 43 and the through hole of the rotating fixing connecting plate 41 to fasten the boss 43 and the rotating fixing connecting plate 41 together; in fig. 8(e), a ball snap is provided on one side of the rotation fixing connecting plate 41, a spherical groove is correspondingly provided on the boss 43, and the spherical snap is elastically clamped in the spherical groove, thereby fastening the boss 43 and the rotation fixing connecting plate 41 together. Preferably, the boss 43 is formed to protrude forward from the center of the housing connecting the end faces and to extend a certain length in the direction of the central axis. As shown in the figure, a shaft hole 42 is formed in the center of the connecting end surface 64 of the housing of the first main body 100, a boss 43 is formed in the center of the housing of the connecting end surface 68 of the second main body 200 to protrude outwards, the shaft hole 42 is sleeved outside the boss 43, the boss 43 penetrates through the shaft hole 42 of the terminating end surface 64 of the first main body 100, the rotating position fixing connection plate 41 is arranged at the tail end, and the rotating position fixing connection plate 41 is located in the first main body 100 and is located inside the connecting end surface 64. It will be appreciated that the boss 43 and the shaft hole 42 are alternately arranged.

In other embodiments, the rotation connection structure may be that universal balls are respectively disposed on the housings of the connection end surfaces of the first main body 100 and the second main body 200 to be engaged with the shaft holes, and a limit structure is also disposed to prevent the balls from being disengaged from the shaft holes.

The utility model discloses a beauty instrument, first host computer body 100 can be relative second host computer body 200 horizontal rotation, can stop at arbitrary angle according to different angles and operation requirement.

The utility model discloses free rotation type beauty instrument's benefit lies in:

the user can do the multi-angle when using, and the multi freedom adjustment is more convenient to use, and the operation is more convenient, and experience is felt stronger, more humanized.

The utility model discloses beauty instrument, including radiator unit 2, light source subassembly 3, electrical unit 4 and main control circuit board 5 etc.. The heat sink 2, the light source assembly 3, the power supply unit 4, and the main control circuit board 5 are mounted in the housing 6. The beauty instrument has a pair of end faces 64, 68 that form the first main body 100 and the second main body 200 at a distance. The cosmetic apparatus 1000 or the first body has a front end face of the body 100 as a working face. The main control circuit board 5 inside the beauty instrument 1000 is electrically connected to the light source unit 3 and the power supply unit 4. The main control circuit board 5 controls the power supply unit 4 to start the light source assembly 3 to work to generate pulse light, and the pulse light is transmitted to the working surface and is transmitted by the working surface to perform unhairing treatment or cosmetic treatment with other effects. The power supply unit 4 is used to supply power to the light source assembly 3. The heat dissipation assembly 2 is used for dissipating heat inside the beauty instrument.

In some embodiments, the head (or front end) of the beauty instrument 1000 is provided with the semiconductor chilling plate 1, and the chilling surface of the semiconductor chilling plate 1 is used as a working surface or used for chilling the working surface. The heat dissipation assembly 2 is connected with the refrigerating sheet 1 and used for refrigerating the refrigerating sheet 1. The housing 6 is provided with a plurality of air inlets 60 and air outlets 66. The beauty instrument (depilating instrument) 1000 may also be provided with a power cord and/or a charging interface for connection with an external power source.

The heat dissipation assembly 2 is used for heat dissipation of the semiconductor chilling plate 1 and/or the light source assembly 3 and comprises a heat pipe 21, a heat sink 23 connected with the heat pipe, and a fan 25. The heat pipe 21 is connected with the refrigerating sheet 1, so as to conduct the heat generated by the refrigerating sheet 1 to the heat dissipation assembly 2 for heat dissipation. The fan 25 is installed in a cavity 28, one side of the cavity 28 extends to form an air outlet channel 280, and the end of the air outlet channel 280 is connected to the air outlet 66.

The air passages among the air inlet 60, the heat dissipation space on the surface of the radiator, the fan 25, the air outlet channel 280 and the air outlet 66 are communicated to form a heat dissipation air passage of the radiator, namely a first heat dissipation air passage; by starting the fan to work, cold air is sucked from the air inlet 60 to the surface of the radiator 23 to take away heat, and hot air is discharged to the outside of the air outlet channel 280 and the air outlet 66 by the fan 25, so that air-cooled heat dissipation of the radiator is realized. The fan 25 is electrically connected to the control circuit board 5, and its operation is controlled by the control circuit board 5.

The refrigeration piece 1 of beauty instrument's front end (head) installation can adopt the refrigeration piece that is suitable for among the prior art as the working face simultaneously, is refrigerated the refrigeration piece by radiator unit 2. In some embodiments, the work surface is cooled by a semiconductor cooling plate 1. As a preferred embodiment, the cold surface of the semiconductor refrigerating sheet 1 is directly used as the working surface. The semiconductor chilling plate 1 may employ a transparent crystal directly as the chilling face 10 and at the same time as the working face of the skin contact face, as will be described in detail below. The heat pipe 21 is connected with the hot surface 12 of the semiconductor chilling plate 1, so that the heat of the semiconductor chilling plate 1 is conducted from the hot surface 12 to the heat dissipation assembly 2 for heat dissipation.

The case 6 of the beauty instrument is divided into a rotary head case (first main body case) 61 and a rear case (second main body case) 62 by the pair of cut-off/connection end surfaces 64/68. In this embodiment, the rotary head casing 61 and the rear casing 62 are sleeve-shaped, and may be an integral casing or a sleeve-shaped assembled from multiple parts. The rotary head housing 61 corresponds to a housing of the first main body 100, and an air inlet 60 and an air outlet 66 are formed on the housing 61, and are used for sucking cold air (cold air) from the outside to the inside to cool and dissipate heat of the heat sink 23 and/or the light source assembly 3. The air inlet 60 and the air outlet 66 can be one or a group of openings, the number, the position, the shape and the arrangement of the air inlet 60 and the air outlet 66 are specifically set according to the heat dissipation requirement, or a cover plate is covered on the opening of the shell, and the gap of the cover plate forms lateral air inlet or air outlet. The rear housing 62 may or may not be provided with air holes as desired.

The radiator 23 is positioned at the rear position of the air inlet 60; the air inlet 60 is used for communicating an external environment with an air passage inside the housing, communicating with a heat dissipation space air passage on the surface of the heat sink, and sucking ambient cold air into the surface of the heat sink 23 for air-cooling heat dissipation.

The rotator head housing 61 or the rear housing 62 may be equipped with a key or keypad or a touch screen or display 201. The interior of the rotary head housing 61 may also mount a sub-control circuit board 5' electrically connected to the main control circuit board 5. The keys or key board or touch screen or display 201 is electrically connected with the sub-control circuit board 5' and/or the main control circuit board 5.

In this embodiment, the heat dissipation assembly 2, the light source assembly 3, the fan 23, and the sub-control circuit board 5' are disposed inside the first main body 100; the power supply unit 4 and the main control circuit board 5 are disposed inside the second main body 200. Of course, the internal components of the beauty instrument may be provided at different positions according to the requirements of the internal space, the function, and the like.

The light source assembly 3 includes a light source 31 and a reflector 32 covering the light source. When the light source 31 is powered on, pulsed light is generated, the control circuit board 5 controls the power supply unit 4 to supply power to the light source, and the light source assembly emits the pulsed light to be transmitted to the working head to act on the surface of skin, so that ablation depilation or other cosmetology or treatment can be carried out. In this embodiment, the heat generated by the operation of the light source assembly 3 is also dissipated through the heat dissipating assembly 2. The light reflecting cup 32 is made of a heat conducting material, and heat generated by the light source 31 is conducted to the light reflecting cup 32 to dissipate heat. The light source 31 may be a lamp tube. The power supply unit 4 may adopt a capacitor or a power supply conversion module.

The utility model discloses an in one embodiment, light source subassembly 3 is installed on light source support 7, and light source support 7 is installed in casing 6 and is located the rear of work head, is connected by mirror surface cover 71 between work head and the light source support 7 and forms the light-emitting cavity, and the pulsed light that light source subassembly 3 produced is through the internal transmission of light-emitting cavity and the cosmetic processing of transmission work head back to external skin unhairing processing or other efficiency. Two ends of the light source component 3 are arranged on the light source bracket 7, and two ends of the reflecting cup or the light source are provided with shading sleeves 72 to shade two ends of the light source component; the light-shielding sleeve 72 may be a sealing sleeve, which is sleeved outside the two ends of the light source assembly.

The light generated by the light source assembly 3 is transmitted to the working surface through the light-emitting cavity. As an embodiment, the light-emitting cavity is connected to the hot surface 12 of the cooling plate and the front end of the light source bracket 7 to form a light-transmitting sealing channel connected between the light source assembly and the working surface, and is sealed by abutting the hot surface 12 of the cooling plate and the other end of the light source bracket 7. The corresponding components of the light-emitting cavity comprise a mirror mask support 70, a mirror mask 71, a sealing ring 73, a sealing ring pressing plate 75 and a white glass or high transparent medium plate 76. The mirror cover 71 is cylindrical, defines a light channel inside, and has a shape and a size at the front end thereof adapted to the light transmission area of the semiconductor cooling plate 1 to transmit the light generated by the light source assembly to the light transmission area of the cooling plate 1. The mirror cover 71 is mounted on the mirror cover support 70; the mirror face cover support 70 is made of a heat insulation material and is used for fixing the mirror face cover 71 and insulating heat, the front-end annular cavity is matched with the mirror face cover 71, the mirror face cover 71 can be sleeved in or out of the mirror face cover support 70, and in the embodiment, the mirror face cover support is sleeved in the front-end annular cavity of the mirror face cover support 70; the rear end face of the mirror cover bracket 70 is provided with a white glass or high transparent dielectric plate 76 for covering and sealing. The white glass or the high transparent medium plate 76 has high light transmittance, the edge of the white glass or the high transparent medium plate is sleeved with the sealing ring 73, and the white glass or the high transparent medium plate is combined with the sealing ring 73 to be used for transmitting light (serving as a light emitting surface of the light source component) and sealing the other end of the cavity of the refrigerating sheet, so that a closed light transmission channel is formed between the light emitting surface of the refrigerating sheet 1 and the light emitting surface of the light source component 3, water drops inside the refrigerating sheet 1 are prevented from being generated due to temperature difference during refrigeration, a heat insulation effect can be achieved, and the refrigeration effect of the cold surface of the refrigerating sheet is better. Outside the white glass or high-transparency medium plate 76, a pressing plate 76 is further provided, which is a ring frame in conformity with the shape of the white glass or high-transparency medium plate 76, and presses the white glass or high-transparency medium plate 76. The pressure plate 76 may also be provided with a slot for receiving a filter, which is used to insert the filter. One or more white glass or high-transparency dielectric plates 76 can be arranged on the light emitting surface of the light source assembly 3, and pulsed light generated by the light source assembly 3 is transmitted to the light transmitting area or the working surface of the semiconductor refrigerating sheet through the sealed light channel after being transmitted by the white glass or high-transparency dielectric plates 76.

In this embodiment, the light source assembly 3 is covered with an air guiding cover 30, and an air cooling cavity 33 for dissipating heat of the light source assembly is formed in a space between the air guiding cover 30 and the surface of the light source assembly 3. The air cooling cavity 33 is communicated with the air inlet hole air passage on the shell and communicated with the air passage between the cavity 28 for installing the fan. The inner side of the air guide cover 30 is covered outside the reflecting cup 32 of the light source, the air cooling cavity 33 is a space defined between the air guide cover 30 and the surface of the reflecting cup 32 of the light source, and cold air sucked into the air cooling cavity dissipates heat to the reflecting cup 32 of the light source. The shape and size of the wind scooper 30 are matched with the light reflecting cup 32 of the light source and are arranged close to the outer wall of the light reflecting cup to limit the air cooling cavity 33, and the configuration mode is used for reducing the height of the gap and maximizing the surface area of the opposite surface, so that stronger negative pressure can be formed in the air cooling cavity 33 when the fan is started, and the intensity of cold air sucked by the air inlet 60 is improved. Preferably, one side of the wind scooper 30 is covered outside the reflector 32 and is shaped like a trumpet to define the air cooling cavity 33, and the other side is provided with the hollow connecting end 34. The trumpet-shaped edge is clamped and arranged on the light source bracket 7. The hollow connecting end 34 is communicated with the air cooling cavity 33 and is also communicated with the air channel between the cavities inside the fan 25; the width of the hollow connecting end 34 is designed on the maximum principle to facilitate rapid gas flow.

The air passages among the air inlet 60 on the casing 6, the space on the surface of the light source assembly, namely the air cooling cavity 33, the cavity 28 for installing the fan, the air outlet channel 280 and the air outlet 66 are communicated to form a heat dissipation air duct of the light source assembly 3, namely a second heat dissipation air duct. Through the work of the start fan 25, the cold air is sucked from the second air inlet 65 to the surface of the light source assembly, the heat on the surface of the light source assembly is taken away to form hot air, the hot air is sucked into the cavity 28 and is discharged to the air outlet channel 280 by the fan, and finally, the hot air is discharged from the air outlet 66, so that the air-cooled heat dissipation of the light source assembly 3 is realized.

The sealing member 8 is connected to the outside of the wind scooper 30. One side of the sealing element 8 is provided with an air guide connecting pipe 81; one end of the connecting pipe 81 is connected with the hollow connecting end 34 of the wind scooper 30 so as to be communicated with the air cooling cavity 33; the other end of the connecting pipe 81 is connected to the air inlet of the fan 25, and the air passages are communicated. The other side of the sealing member 8 may further form an annular sealing ring 82, and the annular sealing ring 82 is installed at the edge of the air inlet hole at one end of the fan 25 to prevent side air leakage and moisture.

In this embodiment, the fan 25 is mounted inside a cavity 28, the cavity 28 comprising an annular cavity portion. One side of the cavity 28 extends obliquely towards the air outlet 66 to form an oblique air outlet channel 280, which can prevent air from flowing backwards.

The front end/working head of the beauty instrument 1000 (or the first main body 100) includes a head support 63, which is tightly clamped on the front end surface of the rotary head shell 61, and includes a ring-shaped head support 63, and a slot is arranged on the inner side for mounting a skin detection light receiving member, i.e. a sensor 9. The head support 63 is used for mounting the working surface 10' of the beauty instrument and/or the semiconductor chilling plate 1. After the semiconductor refrigerating sheet 1 is installed, the light emitting cavity assembly, the optical filter, the radiator assembly 2 (including the fan 25), the light source assembly 3, the sub-control circuit board 5' and other components are sequentially installed inside the semiconductor refrigerating sheet, the connecting end face 64 covers the rear end face of the rotary head shell 61, the screw position 44 can be set, the shell of the connecting end face 64 and the rear end face of the rotary head shell 61 are fastened and installed through screws, and therefore the first host machine body 100 is obtained. As can be seen from the above embodiments, the connecting end surface 64 may be provided with the shaft hole 42, and the inner side thereof is provided with the limiting structure of the rotary connecting structure 40, such as the rotary position fixing connecting plate 41; alternatively, a rotating shaft structure (boss 43) or a ball may be provided on the connecting end surface 64. The power unit 4 (usually a capacitor) and the main control circuit board 5 are installed inside the second main body 200, and the connection end surface 68 is used as a front end surface thereof, and a rotation shaft or a shaft hole is correspondingly arranged to cooperate with a rotation mechanism arranged on the connection end surface of the first main body 100 to form a rotation connection structure. The connection end face 68 of the second main body 200 covers the front end of the rear case 62 and can be further fastened and mounted by screws, and the connection end face 68 is provided with a screw position 44. The fastening mode between the boss (rotating shaft) 43 and the rotating position fixed connection 41 can be selected from the following group: accessible screw position is by the screw fastening, screw and guide pin bushing double-screw bolt (one end sets up the screw hole, the other end is the nut) screw thread tightening's mode, the buckle straining is fixed, it is fixed by rivet riveting, by the elasticity chucking cooperation between spherical bullet knot and the spherical groove, or one or several kinds of fastening mode cooperation use among other fastening modes, form pivot structure cover in shaft hole 42 normal rotation cooperation with boss (pivot) 43 and rotatory position fixed connection 41 are fixed together, form limit structure simultaneously at shaft hole 42 both ends.

The tail of the second main body 200 (or the beauty instrument 1000) is covered by the tail cover 69. The tail cover 69 is provided with a power cord connected to the internal main control circuit board 5 for connection to an external power source. The power line may be a DC line, and may interface with the second main body 200, and an adapter may be connected to the power line.

In other embodiments, the power line 53 is connected to a power adapter, the power unit 4 employs an energy storage capacitor, and the principle of power supply electrical control is as follows:

the power adapter is a first electric control module; the sub-control circuit board 5' is a high-voltage discharge PCBA (printed circuit board assembly), namely a second electric control module, arranged in the rotary head shell 61, and the main control circuit board 5 arranged in the rear shell 62 is a boosting PCBA, namely a third electric control module;

the electric control principle from the start-up of the beauty instrument to the normal work is as follows: after a cable (AC line) of the power adapter is plugged into a commercial power socket, the power adapter is electrified, the voltage input from the outside is wide voltage AC 90V-264V, and the voltage is reduced to DC12V or DC 24V or a voltage value between DC 12-24V in power adaptation through the first electric control module; then output to the beauty instrument main machine through the DC line (at this time, the DC line is inserted into the DC seat of the main machine); when the DC voltage is input into the second electronic control module to boost the PCBA, namely the sub-control circuit board 5', the voltage is adjusted from DC12V or DC 24V, or the voltage value between DC 12V-24V, and the boosted voltage value (the voltage value range DC 250V-400V) is adjusted to charge the energy storage capacitor 4 according to the gear corresponding to the energy required by the unhairing treatment or the cosmetic/therapeutic treatment; and the light source component 3 is controlled to emit light by a third electric control module, namely the main control circuit board 5. The low-voltage input is safer to use. The light source in the light source assembly 3, such as the lamp tube 31, has the following lighting principle: the IPL lamp tube is triggered to light by double voltage, and the energy of the capacitor is released, thereby achieving the flash effect.

Referring also to fig. 10-22(e), in these embodiments, the semiconductor cooling plate 1 is used to be mounted on the working head of the beauty instrument to be used as a working surface or to cool the working surface 10'. The semiconductor refrigerating sheet 1 can be a transparent crystal directly used as the cold surface 10 and simultaneously used as a working surface of a skin contact surface. The heat pipe 21 of the heat dissipation assembly 2 is connected with the hot surface 12 of the semiconductor refrigeration piece 1, and the heat of the semiconductor refrigeration piece 1 is conducted from the hot surface 12 to the heat dissipation assembly 2 for heat dissipation. The semiconductor refrigerating plate 1 is fixedly assembled by a working head support 63. The working head support 63 is assembled with the front end of the housing 6 and with the light source support 7 in a clamping manner, and the working head support 63 can be further assembled with the housing 6 and the light source support 7 by fasteners such as screws, positioning posts or snap structures.

The semiconductor refrigerating sheet 1 is electrically connected with the control circuit board 5 or 5'. The control circuit board 5 or 5' controls the light source assembly 3 to work to generate pulsed light to penetrate through the semiconductor chilling plate 1 for depilation treatment or other cosmetic operations. The control circuit board 5 or 5' can also be used for controlling the semiconductor chilling plate 1 to work. It is understood that the semiconductor cooling plate 1 may also be provided with an independent power supply or an independent control circuit board, and the semiconductor cooling plate 1 is controlled to operate independently, which is not limited herein.

One end of the heat pipe 21 can be provided with a heat conducting piece 22, the heat conducting piece 22 is attached to the hot surface 12 of the semiconductor refrigerating sheet 1, and the heat conducting piece 22 is used for conducting the heat of the hot surface 12 of the semiconductor refrigerating sheet to the heat pipe 21 through the heat conducting piece 22 and dissipating the heat through the heat pipe 21 and the radiator 23. The heat sink 23 is a fin heat sink, and may be an integral structure or be assembled and fixed by one or more sets of heat dissipation fins.

The heat conducting member 22 is generally a metal member, preferably copper, and the shape of the heat conducting member 22 is adapted to the shape of the hot surface 12 of the semiconductor chilling plate 1 and is in contact with the hot surface 12 of the semiconductor chilling plate 1 for fast heat transfer. The heat pipe 21 has a refrigerant circulating therein, and is fixed to the surface or the inside of the fin radiator 23. The heat pipe 21 is preferably a copper pipe. One end or one section of the heat pipe 21 connected with the semiconductor refrigerating sheet 1 is wound to form a ring 24, and the shape and the size of the ring 24 are matched with those of the hot surface of the semiconductor refrigerating sheet 1. The ring 24 of the heat pipe 21 is in accordance with the outline of the heat conducting member 22, and the heat conducting member 22 and the ring 24 of the heat pipe 21 are sleeved and attached to each other in a ring shape. The heat conducting member 22 and the ring 24 of the heat pipe may be welded to form a ring-shaped joint, so that heat can be rapidly transferred to the heat pipe 21. In this embodiment, the heat-conducting member 22 is a metal ring. The ring 24 of the heat pipe 21 absorbs heat, and the refrigerant inside absorbs heat and evaporates, then flows to one end of the radiator 23, is cooled by the radiator after being cooled by condensation, and then circularly flows back to the ring section to continuously absorb heat.

The fan 25 of the heat sink assembly cooperates with the fin radiator 23 to enhance the discharge of hot air from the surface of the fin radiator 23. The radiator 23 is installed in parallel with the fan 25, and the air path is communicated. The finned radiator 23 is installed inside the housing and behind the air inlet 60, and the air inlet 60 is communicated with the heat dissipation air duct of the fins on the surface of the radiator 23. The heat dissipation air duct on the surface of the fin is communicated with the air passage of the fan 25, so that the hot air on the surface of the fin is sucked into the air inlet hole of the fan, and is discharged to the air outlet channel 280 by the fan and then is discharged from the air outlet 66. The fin radiator 23 is installed at the side of the intake opening of the fan 25.

In this embodiment, the fan 25 is used for both the heat dissipation of the light source module 3 and the heat dissipation process of the heat sink 23 of the semiconductor cooling fins, and is used for drawing in cold air and discharging hot air. Specifically, the fan 25 is started, ambient cold air is respectively sucked from the air inlet 60, and respectively enters the air cooling cavity 33 on the surface of the light source assembly and the surface of the radiator 23, heat on the surfaces of the light source assembly and the radiator is taken away and then is sucked into the fan 25, finally hot air is discharged from the fan 25 to the air outlet channel 280, and then is discharged to the external environment through the air outlet 66, so that heat dissipation of the light source assembly 3 and the radiator 23 is realized, the radiator 23 cools the heat pipe through heat dissipation, and refrigeration of the semiconductor refrigeration sheet 1 is realized.

In the first embodiment of the semiconductor refrigeration sheet of the present invention, the semiconductor refrigeration sheet 1 includes a cold surface 10, a semiconductor couple layer (or PN couple particle layer) 11 formed by connecting a semiconductor couple with a metal conductor, and a hot surface 12. A semiconductor galvanic couple layer (PN galvanic couple particle layer) 11 is located between the cold face 10 and the hot face 12. The cold surface 10 of the semiconductor refrigeration piece is formed by transparent crystals, so that a transparent crystal cold surface is formed; the inner surface of the transparent crystal cold surface 10 is fixedly connected with a metal conductor electrically connected with a semiconductor galvanic couple layer (PN galvanic couple particle layer) 11. The hot surface 12 of the semiconductor refrigeration sheet is made of ceramic or other base materials, and the inner side surface of the hot surface base material is fixedly connected with a metal conductor electrically connected with a semiconductor galvanic couple layer (PN galvanic couple particle layer) 11. The semiconductor refrigeration sheet 1 is formed by sandwiching a semiconductor couple layer (PN couple particle layer) 11 between a hot surface 12 and a transparent crystal cold surface 10. The semiconductor galvanic couple layer (PN galvanic couple particle layer) 11 is connected with positive and negative electrodes 113. The transparent crystal is a transparent material with high light transmittance, high thermal conductivity and high heat resistance, such as natural spar or gem.

The fixed connection between the semiconductor galvanic couple layer (PN galvanic couple particle layer) 11 and the transparent crystal cold surface 10 and hot surface 12 can be realized by a method suitable in the prior art. For example, the inner surfaces of the cold surface 10 of the transparent crystal and the hot surface 12 of the ceramic substrate are metallized to form a metal conductor or a cold/hot circuit, and then welded to the two ends of the couple of the semiconductor couple layer (PN couple particle layer) 11 to form a fixed and electrically connected structure.

In one embodiment, the semiconductor electric double layer (PN electric double particle layer) 11 is ring-shaped, and its ring-shaped region 111 is used for arranging electronic components, i.e., PN electric double particles, and a plurality of PN electric double particles are arranged in a ring shape; an annular inner hollow region 112 is penetrated by light. The inside of a semiconductor couple layer (PN couple particle layer) 11 is an NP semiconductor couple, metal conductors or circuits arranged on a cold surface and a hot surface are connected to form a refrigerating sheet circuit, and by means of the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting N, P two different semiconductor materials in series, heat transfer can be generated between two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold-hot end. The cold end adopts transparent crystal to form the cold side of semiconductor refrigeration piece, and the hot end still adopts ceramic substrate to form hot side 12 of semiconductor refrigeration piece, can also adopt other suitable materials as the hot side certainly. A metal conductor or a circuit is formed on the surface of the cold surface 10 opposite to the hot surface 12 through metallization, and the metal conductor or the circuit is respectively electrically connected with an NP semiconductor couple inside the semiconductor couple layer (PN couple particle layer) 11 and is welded and fixed, so that the semiconductor couple layer (PN couple particle layer) 11 and the circuit communicated with the semiconductor refrigerating sheet are fixed.

The hot surface 12 is shaped and sized to fit the semiconductor electric double layer (PN electric double layer) 11, and is also, for example, annular, with the annular region 121 serving as a heat radiation surface and the hollow inner region 122 for light to penetrate. The ring shape of the hot surface 12 is fittingly attached to the ring shape of the semiconductor galvanic couple layer (PN galvanic couple particle layer) 11, which facilitates rapid heat dissipation. The ceramic substrate hot surface 12 is communicated with the hollow inner area of the semiconductor electric double layer (PN electric double particle layer) 11, and the edges are aligned.

The transparent crystal cold surface 10 covers the whole surface of the semiconductor couple layer (PN couple particle layer) 11, thereby forming whole surface refrigeration. The transparent crystal cold face 10 is a whole or whole crystal with continuous surface. Preferably, the thickness of the cold face of transparent crystal is no less than 1mm to improve the intensity of semiconductor refrigeration piece 1, reduce the damage risk of assembly, increase of service life. The transparent crystal material of the embodiment has high light transmittance and high thermal conductivity coefficient, so that pulsed light penetrates through the transparent crystal to perform unhairing treatment or other cosmetic operations, and the high thermal conductivity coefficient is favorable for improving the refrigeration efficiency and effect.

The middle region of the transparent crystal cold surface 10 is a light transmission region 102, and the peripheral annular region 101 is attached to the semiconductor electric double layer (PN electric double layer) 11 in a fitting manner. Accordingly, the light-transmitting region 102 of the cold surface of the transparent crystal is covered on the inner hollow region 112 of the semiconductor electric double layer (PN electric double particle layer) 11, so that the hollow region is covered and light can penetrate through the hollow region. The whole refrigerating area of the transparent crystal cold surface 10 comprises a light-transmitting area 102 and an annular area 101 at the periphery of the light-transmitting area. The whole surface of the crystal is refrigerated, so that the refrigerating area is increased, and the experience feeling is better.

Referring to fig. 12, the surface of the annular region 101 of the transparent crystal cold side 10 is subjected to a light shielding treatment to form an annular light shielding region (shaded portion in fig. 12) for shielding the electronic components inside. Specifically, the shading treatment may be to plate a shading film on one or both sides of the transparent crystal, and then remove the shading film at the corresponding position of the middle light-transmitting region; or, directly printing a shielding layer on the annular area of the transparent crystal, and keeping the light-transmitting area clear. The shading area is formed by carrying out surface treatment on the cold surface 10 of the transparent crystal, can be treated on the double surfaces or any single surface of the crystal, and can be treated by adopting the modes of coating, spraying, printing and the like.

The peripheral edge of the transparent crystal cold side 10 may be further processed to form an assembly site 103 (see fig. 13) for fixed assembly with an external housing (e.g., a workhead support). In a more specific example, the mounting location 103 may be a beveled edge or stepped surface that forms a snap fit with the workhead support 63.

In other embodiments, the semiconductor chilling plate 1 includes a semiconductor couple layer (PN couple particle layer) 11, and a hot surface 12 and a cold surface 10 at two ends of the semiconductor couple layer (PN couple particle layer). The cold side 10 is made of transparent crystals to form a transparent crystal cold side. One or more groups of semiconductor electric double layers (PN electric double layer) 11 and a hot surface 12 fixedly connected with the semiconductor electric double layers (PN electric double layer) are fixedly connected to the surface of the transparent crystal. The semiconductor cooling plate has a light transmissive region 102, the light transmissive region 102 being provided by the transparent crystal.

The one or more groups of semiconductor galvanic couple layers (PN galvanic couple particle layers) and the hot surfaces fixedly connected with the semiconductor galvanic couple layers (PN galvanic couple particle layers) are arranged on one side, two opposite sides or multiple sides of the transparent crystal.

Referring to fig. 15, in the semiconductor refrigeration sheet 1 according to the second embodiment of the present invention, the cold surface 10 is a square (not limited to a square) transparent crystal, and a side surface, for example, a left side surface of the transparent crystal is provided with a group of semiconductor electric double layers (PN electric double particle layers) 11 and a hot surface 12 fixedly connected to the semiconductor electric double layers (PN electric double particle layers). The semiconductor galvanic couple layer (PN galvanic couple particle layer) 11 is provided with a pair of electrodes (not shown). Two other pairs of surfaces of the transparent crystal, such as the front and back (or upper and lower) surfaces, may be used as light transmissive regions 102 for pulsed light transmission for depilatory or other effective cosmetic treatment. In a specific example, the hot side 12 of the semiconductor chilling plate may be formed of a ceramic substrate to form a ceramic substrate hot side. The inner surface of the ceramic substrate is fixedly connected with the metal conductor of the semiconductor galvanic couple layer (PN galvanic couple particle layer) 11. A semiconductor galvanic couple layer (PN galvanic couple particle layer) 11 is sandwiched between the ceramic substrate hot face 12 and the transparent crystal cold face 10. The hot surface 12 and the transparent crystal cold surface 10 are welded and fixed to opposite sides of a semiconductor thermocouple layer (PN thermocouple layer) 11. The transparent crystal cold surface 10 covers the whole surface of a semiconductor galvanic couple layer (PN galvanic couple particle layer) 11 so as to form whole surface refrigeration.

With further reference to fig. 16(a) to 16(f), the semiconductor cooling plate 1 of these embodiments is connected to the heat dissipation assembly 2, so as to conduct the heat of the semiconductor cooling plate from the heat-radiating surface 12 to the heat dissipation assembly for heat dissipation. The heat radiation module 2 includes a heat pipe 21 and a heat sink 23 connected to the heat pipe 21. The heat pipe is installed on the surface or inside the radiator. The heat pipe 21 is in direct contact with the hot side 12 of the semiconductor chilling plate 1 or in contact with the hot side through a heat conducting member. In this embodiment, one end 26 of the heat pipe is adapted to the shape of the hot surface 12 of the semiconductor chilling plate, and is in contact with each other; to facilitate a close contact between the end 26 of the heat pipe and the hot side 12, the end of the heat pipe 21 may be bent, for example, in an L-shape as shown in the drawings. The heat pipe 21 may be a capillary copper pipe having a refrigerant circulating therein. The radiator is one or a combination of a plurality of fin radiators, radiating fins or heat conducting plates. In the various heat sink structures shown in the figures, the heat sink 23 shown in fig. 16(a) and 16(e) is a heat sink, for example, one or more sets of heat sinks are arranged in parallel, and the heat pipe 21 is inserted and fixed in the parallel heat sinks. The heat sink 23 in fig. 16(b), 16(c), 16(d), and 16(f) includes a heat conductive plate 230 and a set of parallel fins 231 fixed to one side surface of the heat conductive plate 230. One end 26 of the heat pipe 21 is bent to contact with the hot surface 12 of the semiconductor chilling plate, and may have the same shape and size, and the heat pipe 21 is fixed on the other side surface of the heat conducting plate 230, or is inserted into or on the surface of one or more sets of parallel heat dissipation fins 231. The heat sink may be made of a metal sheet having high thermal conductivity.

Referring to fig. 17, in the semiconductor refrigeration sheet 1 according to the third embodiment of the present invention, the cold surface 10 is a square (not limited to a square) transparent crystal, and a group of semiconductor couple layers (PN couple particle layers) 11 and a hot surface 12 fixedly connected to the semiconductor couple layers (PN couple particle layers) are respectively disposed on opposite side surfaces of the transparent crystal, for example, on the left and right sides. Each semiconductor galvanic layer (PN galvanic particulate layer) 11 is provided with a pair of electrodes (not shown). Two other pairs of surfaces of the transparent crystal, such as the front and back surfaces (or upper and lower surfaces) may be used as light transmissive regions 102 for pulsed light transmission for depilatory or other effective cosmetic treatments. In a specific example, the hot sides 12 of the two semiconductor cooling fins are formed of a ceramic substrate to form a ceramic substrate hot side. The inner side surface of each ceramic substrate is fixedly connected with the metal conductor of the corresponding semiconductor galvanic couple layer (PN galvanic couple particle layer) 11. A semiconductor galvanic couple layer (PN galvanic couple particle layer) 11 is sandwiched between the hot side 12 of the ceramic substrate and the side of the transparent crystal cold side 10. The left and right surfaces of the two hot surfaces 12 and the transparent crystal cold surface 10 are respectively attached and fixed to the opposite two side surfaces of the corresponding semiconductor couple layer (PN couple particle layer) 11. The surfaces of the two sides of the transparent crystal cold surface 10 are respectively covered with the whole surfaces of the corresponding semiconductor couple layers (PN couple particle layers) 11 so as to form whole surface refrigeration.

Further refer to fig. 18(a) -18 (c), the utility model discloses third embodiment semiconductor refrigeration piece 1 is connected with radiator unit 2, and the heat from hot face 12 conduction with the semiconductor refrigeration piece is dispelled the heat to radiator unit. In this embodiment, the heat dissipation assembly 2 includes two heat pipes 21 and a heat sink 23 connected to the heat pipes 21. The heat pipe is installed on the surface or inside of the heat sink 23. The heat pipe 21 is in direct contact with the hot side 12 of the semiconductor chilling plate 1 or in contact with the hot side through a heat conducting member. For example, one end 26 of each heat pipe is matched with the shape of the hot surface 12 of the semiconductor chilling plate, and the heat pipes are in contact with each other; to facilitate close contact between the end 26 of the heat pipe and the hot side 12, the end of the heat pipe 21 may be bent as desired, as shown in the drawings, and the bent portions are designed in L-shape. The heat pipe 21 may be a capillary copper pipe having a refrigerant circulating therein. The radiator is one or a combination of a plurality of fin radiators, radiating fins or heat conducting plates. In the various heat sink structures shown in the figures, the heat sink 23 shown in fig. 18(a) is one or more sets of parallel heat dissipation fins, and the two heat pipes 21 are inserted and fixed in the one or more sets of parallel heat dissipation fins. The heat sink 23 in fig. 18(b) and 18(c) includes a heat conductive plate 230 and one or more sets of parallel radiating fins 231 fixed to one side surface of the heat conductive plate 230. One end 26 of each heat pipe 21 is bent and then attached to and contacted with one hot surface 12 of the semiconductor chilling plate, the shape and the size of the heat pipe 21 are consistent, and the heat pipe 21 is fixed on the other side surface of the heat conducting plate 230 or is arranged in or on the surface of a group of parallel radiating fins 231 in a penetrating mode.

The heat sink 231 may be a metal sheet with high thermal conductivity, or the heat sink 23 may be a heat sink 231 integrally formed of graphene. The heat conductive plate 230 may be provided with two pieces for fixing one heat pipe 21, respectively. The heat conducting plate 230 may also be a graphene heat conducting plate integrally formed with graphene, and may be integrally formed with the graphene heat sink 231 to form an integral structure.

Referring to fig. 19, in a semiconductor refrigeration sheet 1 according to a fourth embodiment of the present invention, a cold surface 10 is a square (not limited to a square) transparent crystal, and a side surface, for example, an upper surface of the transparent crystal is provided with a group of semiconductor electric double layers (PN electric double particle layers) 11 and a hot surface 12 fixedly connected to the semiconductor electric double layers (PN electric double particle layers). The semiconductor galvanic couple layer (PN galvanic couple particle layer) 11 is provided with a pair of electrodes (not shown). Two other pairs of surfaces of the transparent crystal, such as the front and back (or left and right) surfaces, may be used as light transmissive regions 102 for pulsed light transmission for depilatory or other effective cosmetic treatment. In a specific example, the hot side 12 of the semiconductor cooling plate is a ceramic or other substrate hot side 12. The inner surface of the ceramic substrate hot surface 12 and the upper surface of the transparent crystal are metallized and then welded and fixed to the metal conductor of the semiconductor couple layer (PN couple particle layer) 11, so as to be fixed to both end surfaces of the semiconductor couple layer (PN couple particle layer) 11. The transparent crystal cold surface 10 covers the whole surface of a semiconductor galvanic couple layer (PN galvanic couple particle layer) 11 so as to form whole surface refrigeration.

Further refer to fig. 20(a) ~20(d), the utility model discloses fourth embodiment semiconductor refrigeration piece 1 is connected with radiator unit 2, and the heat with the semiconductor refrigeration piece is conducted to radiator unit from hot side 12 and is dispelled the heat. The heat radiation module 2 includes a heat pipe 21 and a heat sink 23 connected to the heat pipe 21. In the various heat sink structures shown in the figures, the heat sink 23 shown in fig. 20(a) and 20(b) is a set of parallel fins, and the heat pipe 21 is fixed to the parallel fins by penetration. The heat sink 23 in fig. 20(c) and 20(d) includes a heat conductive plate 230 and a set of parallel fins 231 fixed to one side surface of the heat conductive plate 230. One end 26 of the heat pipe 21 is in contact with the hot surface 12 of the semiconductor chilling plate, and may have the same shape and size, and the heat pipe 21 is fixed on the other side surface of the heat conducting plate 230, or is fixed in or on the surface of a set of parallel heat dissipation fins 231. The heat pipe 21 is bent in a U-shape or L-shape to form an area surface that conforms to and is in close contact with the hot face 12.

Referring to fig. 21, in a semiconductor refrigeration chip 1 according to a fifth embodiment of the present invention, a cold surface 10 is a square (not limited to a square) transparent crystal, and a set of semiconductor couple layers (PN couple particle layers) 11 and a hot surface 12 fixedly connected to the semiconductor couple layers (PN couple particle layers) are respectively disposed on opposite side surfaces, for example, upper and lower surfaces, of the transparent crystal. Each semiconductor galvanic layer (PN galvanic particulate layer) 11 is provided with a pair of electrodes (not shown). Two other pairs of surfaces of the transparent crystal, such as the front and back (or left and right) surfaces, may be used as light transmissive regions 102 for pulsed light transmission for depilatory or other effective cosmetic treatment. In a specific example, the hot surfaces 12 of the two semiconductor chilling plates are ceramic or other substrate hot surfaces, and after the inner side surfaces are metalized, a metal conductor or a hot end circuit is formed and is welded and electrically connected with the corresponding semiconductor galvanic couple layer (PN galvanic couple particle layer) 11. Two semiconductor galvanic couple layers (PN galvanic couple particle layers) 11 are sandwiched between a ceramic substrate hot surface 12 and the upper or lower surface of the transparent crystal cold surface 10, respectively. The upper and lower surfaces of the two hot surfaces 12 and the transparent crystal cold surface 10 are respectively bonded and fixed to the two opposite side surfaces of the corresponding semiconductor couple layer (PN couple particle layer) 11. The upper and lower surfaces of the cooling chamber cover the entire surfaces of the corresponding semiconductor couple layer (PN couple particle layer) 11, respectively, thereby forming the entire surface cooling.

With reference to fig. 22(a) to 22(e), the semiconductor refrigeration sheet 1 of the fifth embodiment of the present invention is connected to the heat dissipation assembly 2, and the heat of the semiconductor refrigeration sheet is conducted from the hot surface 12 to the heat dissipation assembly for heat dissipation. In this embodiment, the heat dissipation assembly 2 includes two heat pipes 21 and a heat sink 23 connected to the heat pipes 21. The heat pipe is installed on the surface or inside the radiator. One end 26 of the heat pipe is in intimate, abutting contact with the hot side 12. the heat pipe 21 may be L-shaped or U-shaped or other suitable shape to form a surface area that conforms to and is in intimate contact with the hot side 12. In the various heat sink structures shown in the figures, the heat sink 23 shown in fig. 22(a), 22(b), and 22(c) is one or more sets of parallel fins, and two heat pipes 21 are inserted and fixed in the parallel fins. The heat sink 23 in fig. 22(d) and 22(e) includes a heat conductive plate 230 and one or more sets of parallel fins 231 fixed to one side surface of the heat conductive plate 230. One end 26 of each heat pipe 21 is bent and then attached to and contacted with one hot surface 12 of the semiconductor chilling plate, and the shape and size of the heat pipe 21 are consistent, and the heat pipe 21 is fixed on the other side surface of the heat conducting plate 230 or is arranged in or on the surface of one or more groups of parallel radiating fins 231.

The semiconductor cooling plate 1 and the heat dissipating member 2 of the second to fifth embodiments (fig. 15 to 22 (e)) are applied to the beauty instrument (hair removal instrument) 1000 (fig. 1 to 7) of the above embodiments, and the semiconductor cooling plate 1 is attached to the working head of the beauty instrument (hair removal instrument) and functions as a transparent crystal cooling surface as a working surface. The heat dissipating module 2 is mounted inside the housing 6. The heat sink 23 is installed at one side of the fan 25, the heat dissipation air duct on the surface of the heat sink 23 is communicated with the cavity 28, and the hot air in the surface space of the heat sink 23 from the fan 25 is drawn into the cavity 28 and exhausted to the outside from the air outlet 66. Other structures refer to the foregoing embodiments and are not described herein.

In other embodiments, the hot surface 12 of the semiconductor chilling plate 1 can be made of other materials available in the art besides ceramic substrate, for example, the hot surface 12 can cover the whole surface of the annular semiconductor galvanic couple layer (PN galvanic couple particle layer) 11 with a transparent medium.

In the foregoing embodiments, the cold side 10 of the semiconductor refrigeration chip 1 directly uses a transparent medium, preferably directly uses a transparent crystal as the semiconductor refrigeration side, and directly uses as the working side contacting with the skin. The working surface is located at the front end surface of the epilating apparatus, i.e. at the front end surface of the working head. Preferably, the transparent crystal cold surface (or the transparent medium cold surface) is the whole surface of the working surface, so that the front-end whole-surface refrigeration effect is formed. The whole surface refrigeration has the advantages that the next depilation position can be precooled during depilation, the previous depilation position can continue to have ice feeling to reduce the burning sensation brought by depilation, and the icing time is prolonged equivalently.

In other embodiments, the main difference with respect to the above embodiments is that the working head is different, and a transparent crystal (or a transparent medium body) is directly used as the working surface contacting with the skin. Preferably, the transparent crystal (or transparent medium body) is the whole face of the working face, so as to form a front-end whole-face refrigeration effect. The transparent crystal (or transparent medium body) is refrigerated by the refrigerating sheet 1 attached to the back surface of the transparent crystal. The working head support 63 is an annular housing with a transparent crystal (or transparent dielectric) tightly fitted within the annular rim of the housing. The refrigerating sheet 1 is also clamped in the working head support 63, is attached to the back of the transparent crystal (or the transparent medium body), and can be installed on one side of the transparent crystal or multiple sides of the transparent crystal (or the transparent medium body) for refrigerating. The refrigerating sheet 1 installed on the working head can be used for refrigerating the working surface 10' of the transparent crystal (or the transparent medium body) by adopting the refrigerating sheet applicable in the prior art, and the heat dissipation assembly 2 of the embodiment is used for dissipating heat of the refrigerating sheet 1.

As some examples, the working head of the beauty instrument (epilator) 1000 is equipped with at least two sensors 9 for detecting whether the transparent crystal working surface is completely or almost completely covered by the skin to activate or deactivate the light source. Wherein, two inductors 9 are arranged on the diagonal line or the position close to the diagonal line of the edge of the working surface 10 of the transparent crystal. The inductor 9 is connected with the control circuit board 5.

The utility model discloses a beauty instrument 1000 is provided with the cannel or the draw-in groove that are used for the holding to install filtering component 50 in it. When the light source module works, the pulse light generated by the light source module 3 is filtered by the filtering module 50 and then transmitted to the light emergent working surface, and the transmitted light wave is used for beauty treatment or treatment operation. The filter assembly 50 is located at the front end of the light source assembly 3; the bin channel is arranged on the sealing ring pressing plate 75 or the light source bracket 7, or is defined by the sealing ring pressing plate and the light source bracket together; the filter assembly is further resiliently held by a spring 52. The filter assembly 50 includes a filter, such as filter glass, a frame bracket for mounting the filter, and a circuit board on which a resistor is disposed. The filter circuit board and the resistor may be disposed in a slot (not shown) of the frame bracket.

In this embodiment, the beauty instrument 1000 may be provided with a plurality of filter assemblies 50 for optional use. The filter assembly 50 can be detachably and replaceably assembled in the beauty instrument or can be inserted into the storage channel/clamping groove in a pluggable manner, and the filter wave bands of different filter assemblies 50 can be set to be different so as to obtain emergent light with different wave bands and correspondingly obtain different beauty efficacies.

In some embodiments, the wavelength of the light exiting the filter (the light wave filtered by the filter) may be: 510nm-1200nm, 530nm-1200nm, 560nm-1200nm, 590nm-1200nm, 610nm-1200nm, 640nm-1200nm and 645-750 nm.

The filter assembly 50 used in the beauty instrument 1000 with hair removal function preferably has a wavelength of light above 610nm, for example, a filter assembly with a wavelength range of 610 and 1200nm is used to transmit light with a wavelength greater than 610nm to the working surface. In other embodiments, the light wave of at least one filtering component 50 may be 645-750nm, i.e. two-band filtering, to filter the light waves below 645nm and above 750nm, and the wavelength of the emergent light is 645-750 nm.

Examples of the wavelength of the filter and the cosmetic efficacy of the cosmetic instrument include, but are not limited to:

the filter of 430-1200nm can be used for treating inflammatory acne;

480-1200nm filter can be used for treating acne and vascular lesions;

the filter of 530 and 1200nm can be used for treating vascular (superficial fine blood vessels) and pigment lesions;

560-1200nm filters can be used for wrinkle reduction, treatment of pigmentary and vascular lesions (deep thick blood vessels);

the filter with 640-1200nm can be used for hair removal, skin tendering and deep red removal;

690 and 1200nm filter can be used for depilation, deep red removal, etc.

Different filter assemblies 50 may be provided with filters of different wavelengths and resistors of different resistances, so that the corresponding filter assembly is identified by detecting the resistance of the resistor in the filter assembly or detecting the voltage across the resistor or detecting the current flowing through the resistor. The corresponding relation between the resistance value of the resistor, the voltage/current at two ends and the wavelength of the optical filter is preset.

The resistor is arranged on the circuit board and electrically connected with the control circuit boards 5 and 5' in the beauty instrument through the electrode component 51. The electrode assembly 51 includes a set of counter electrodes 511 and 512 electrically connected to the two ends of the resistor on the filter circuit board, respectively, for detecting the voltage at the two ends of the resistor, and identifying the resistor and the corresponding filter according to a predetermined value to obtain the wavelength of the filter. The pair of electrodes 511 and 512 of the electrode assembly 51 are fixed by the insulating body, and one end of each electrode is electrically connected to one end of the resistor 502 on the circuit board 501 of the filter assembly, and the other end is electrically connected to the control circuit board in the beauty instrument. The electrode assembly 51 is mounted on the sealing ring pressing plate 75 or the light source bracket 7, for example, a groove is formed on the sealing ring pressing plate 75 for being clamped into the insulating body, and a cavity or a slot is formed on the sealing ring pressing plate 75, or a cavity or a slot is defined between the sealing ring pressing plate 75 and the light emitting surface of the light source assembly, so as to mount the light filtering assembly 50 on the cross section of the light transmission channel. The insulating body is further provided with an elastic pin for elastically clamping the filtering assembly 50.

Specifically, the utility model discloses a principle that beauty instrument discerns its light filter (filter glass) of using does:

when the filter assembly 50 is inserted into the working head of the beauty instrument, one end of each of the electrodes 511 and 512 of the electrode assembly 50 inside the beauty instrument is connected to one end of the resistor on the circuit board, so that the control circuit board 5, 5' in the beauty instrument detects the resistance value, voltage value or current value of the resistor through the circuit, and queries the wavelength of the filter corresponding to the resistance value, voltage value or current value to identify the different filter assemblies 50.

The utility model discloses a beauty instrument, beauty instrument host computer can dispose a plurality of filtering component 50, selects the filtering component that corresponds the wave band according to the usage. The light filtering component 50 is inserted into a warehouse port on the beauty instrument host, after the beauty instrument is connected with a power supply, the control circuit board starts the power supply unit 4 to excite the light source component 3 to generate pulsed light, the pulsed light is emitted from a working surface after being filtered by the light filter in the light filtering component 50, and the beauty operation is carried out on the skin. When different beauty functions are needed, the original filtering component 50 is ejected from the bin passage opening on the shell, and different filtering components 50 are replaced. The beauty instrument of the utility model can also be provided with the light filtering component 50 in the depilating instrument, so that the depilating instrument has other beauty or treatment functions except depilating, such as skin tendering, whitening, red removing, wrinkle removing, skin disease treatment, etc.

Referring to fig. 23-27, in other embodiments, the semiconductor cooling plate with heat dissipation structure forms a cooling structure 100 of an integral structure, which includes the semiconductor cooling plate 1, the heat pipe 21 and the heat sink 23, and the heat pipe 21 is connected to the semiconductor cooling plate 1 and the heat sink 23, forming an integral structure of the semiconductor cooling plate with heat sink. In other embodiments, the heat sink 23 may be directly combined with the semiconductor cooling plate 1 to form an integral structure of the cooling structure.

The semiconductor refrigeration piece 1 comprises a PN galvanic couple particle layer 11, a cold surface 10 and a hot surface 12. The cold surface 10 and the hot surface 12 are respectively arranged at the cold end and the hot end of the PN galvanic couple particle layer, and the PN galvanic couple particle layer is provided with a positive electrode and a negative electrode (refer to fig. 4).

The PN electric dipole particle layer 11 includes P-type/N-type semiconductor particles (see fig. 23(b) and 26 to 27). In some embodiments, the P-type/N-type semiconductor particles may be directly welded to the cold surface 10 and the hot surface 12 of the semiconductor chilling plate in a granular form according to a predetermined circuit arrangement, so as to form a sandwich structure between the cold surface 10 and the hot surface 12 of the semiconductor chilling plate. In assembly, one end of the P-type/N-type semiconductor particles may be first soldered to one of the cold side 10 or the hot side 12, for example, the P-type/N-type semiconductor particles may be soldered and fixed to the hot side, and then the cold side 10 may be soldered to the other end of the P-type/N-type semiconductor particles, thereby forming the semiconductor cooling fin structure, as shown in fig. 23(a), 26 and 25 (e). In other embodiments, the P-type/N-type semiconductor particles may be fixed into a whole structure with a predetermined shape, and corresponding circuits or electrical connection points are formed at two ends, as shown in fig. 23, the PN couple particle layer 11 is made into a predetermined shape, such as a ring shape, and the circuits or electrical connection points and welding points (not shown) are formed at two corresponding end surfaces, and are welded and electrically connected with the metal conductors or circuits on the cold surface 10 and the hot surface 12, respectively. The PN couple particle layer 11 may be formed by a semiconductor couple layer (PN couple particle layer) of a semiconductor refrigeration sheet in the prior art.

The hot end of the PN galvanic couple particle layer forms the hot surface 12 of the semiconductor refrigerating sheet by using a heat conducting plate. For convenience of description, the semiconductor hot side and the heat conductive plate are denoted by reference numeral 12 in the present specification and the drawings. The heat conducting plate 12 is in direct contact with the P-type/N-type semiconductor particles, and the heat at the hot end is directly absorbed and conducted by the heat conducting plate 12. Heat-conducting plate 12 contains a refrigerant therein. Heat-conducting plate 12 has formed thereon circuit 122 as a hot-side circuit; the hot end circuit 122 is connected with the P type/N type semiconductor particles to be communicated with the internal circuit of the semiconductor chilling plate, and is connected with an external power supply through positive and negative electrodes.

Referring again to fig. 23(b), 25(e) and fig. 26 to 27, one end of the P-type/N-type semiconductor particles of the PN couple particle layer 11 is soldered to the hot-side circuit 122 and connected in series by the hot-side circuit 122. The particle distribution diagram of the heat conducting plate of the semiconductor refrigeration sheet is shown, wherein the strip-shaped frame is a circuit formed on the heat conducting plate, for example, the heat conducting plate is a copper plate, and the circuit is obtained after etching and is used for welding the P/N type semiconductor particles. The surface of the heat conducting plate 12 is formed with metal conducting points, which are correspondingly welded and connected with the P-type/N-type semiconductor particles in series. During welding, the P-type semiconductor particles and the N-type semiconductor particles can be welded twice, and when the P-type semiconductor particles are loaded, the positions of the N-type semiconductor particles are shielded by the tool fixture.

The other end of the P type/N type semiconductor particles in the PN galvanic couple particle layer is welded on the cold surface 10 of the semiconductor refrigerating sheet. Referring to fig. 23(b), 26, and 25(e), the cold side circuit 110 is provided on the cold side and electrically connected to the other end of the P-type/N-type semiconductor particle. The cold-side circuit 110 may be a conductive pad formed of solder paste according to a predetermined circuit pattern or a solder paste printed according to a circuit pattern for bonding the other end of the P-type/N-type semiconductor particles.

After the cold surface 10 is assembled on the hot surface 12 of the welded P/N type semiconductor particles, the circuits at two ends of the P/N type semiconductor particles or PN galvanic couple particle layer 11 are communicated to form an internal circuit of the semiconductor refrigeration sheet, and the internal circuit is connected with an external power supply through the anode and the cathode 113.

In some embodiments, thermally conductive plate 12 is a metal plate, such as a copper or aluminum plate. Heat-conducting plate 12 is internally formed with a space for accommodating a refrigerant. The refrigerant is usually a cooling liquid. The surface of the metal heat conducting plate is provided with an insulating layer 123 and a hot end circuit 122. The insulating layer 123 is an electrical insulating film covering the surface of the metal heat conducting plate, and the surface of the metal heat conducting plate is etched to form a hot-end circuit. Preferably, the heat conducting plate is a vc (vapor chambers) heat conducting plate, which specifically includes a heat conducting bottom plate 120 and a heat conducting cover plate 121, wherein the heat conducting bottom plate 120 and the heat conducting cover plate 121 are fastened to each other, and a space is formed inside. The surface of the heat conducting bottom plate 120 is provided with a circuit 122 which is electrically connected with the PN couple particle layer 11. The heat conducting cover plate 121 is provided with a hole site 124, the hole site 124 is matched with the inner diameter or the outer diameter of the heat pipe, and one end of the heat pipe is inserted into the hole site 124 to be fixed and communicated with the space inside the heat conducting plate.

Copper powder can be further placed in the heat conducting plate to increase the heat conducting and heat absorbing areas; the copper powder can be welded on the inner wall of the space, or the copper powder is directly placed in the space in the heat conducting plate. An inner ring sealant 125 may be further disposed inside the heat conducting plate for sealing a joint gap between the heat conducting bottom plate 120 and the heat conducting cover plate 121. Preferably, the heat conductive base plate 120 and the heat conductive cover plate 121 are welded or riveted at the connection portion to form an integral structure.

The shape of the heat-conducting plate 12 is designed according to the overall shape of the refrigeration plate and its application, and may be an overall plate-box structure or other shapes. In the embodiment shown in the figures, the heat conducting plate 12 is annular in whole and is formed by fastening an annular heat conducting base plate 120 and an annular heat conducting cover plate 121. The inner side of the heat conduction bottom plate forms a groove structure, after the heat conduction bottom plate is buckled with the cover plate 121, the groove corresponds to form an inner space, and the groove can also be provided with a boss supporting structure and can be matched and positioned with a clamping groove arranged on the corresponding surface of the cover plate. The annular structure center may define a light transmissive region for transmitting pulsed light to facilitate use of the cooling structure as a cosmetic instrument (e.g., an epilator). The annular heat conducting plate 12 forms an annular hot surface, the PN galvanic couple particle layer 11/P/N type semiconductor particles are also arranged in an annular mode, and the cold surface can be formed by annular materials or by welding and assembling a whole transparent crystal with the PN galvanic couple particle layer 11/P/N type semiconductor particles and the annular heat conducting plate 12.

The vc (vapor chambers) heat conducting plate of the present invention can be made of copper/aluminum or other metal heat conducting material, for example, a layer of insulating material is formed (for example, sprayed) on the surface of the copper plate contacting with the conducting layer particles of the cooling plate, and a corresponding circuit is formed by etching or printing or other methods for electrically connecting P/N semiconductor particles so that the charge movement can achieve the heating/cooling effect. The interior of the heat conducting plate is processed into a solid space, and after the heat conducting base plate 120 and the heat conducting cover plate 121 are fastened, a closed space for accommodating copper powder and refrigerant is formed inside and is communicated with the space inside the heat pipe 21. After the heat-conducting bottom plate 120, the heat-conducting cover plate 121 and the heat pipe 21 are welded at high temperature, the heat pipe 21 or the heat-conducting plate 12 is vacuumized through a vacuum nozzle reserved thereon, and finally sintered to form a communicated closed space. The heat conducting plate 12 is directly used as the hot end of the refrigeration piece, is communicated with the heat pipe or is directly connected with the radiator, is used as a part of the heat pipe or the radiator, combines the refrigeration piece and the radiator into a whole, and has simpler structure.

The utility model refrigeration structure 100 can adopt a plurality of heat pipes 21; the heat pipe 21 is connected with the heat conducting plate 12 to dissipate heat together; the heat pipe 21 contains a refrigerant therein; the interior of the heat pipe is communicated with the interior of the heat conducting plate to form a communicated closed space; the refrigerant flows through the closed space. Typically, the heat pipe is a metal pipe, such as a copper pipe or an aluminum pipe. In the embodiment shown in the figures, one or two straight pipes are used as the heat pipe 12, one end is connected with the heat conducting plate 21, the other end is connected with the radiator 23, and two ends of the heat pipe 12 can be respectively welded or welded and fixed with the heat conducting plate 21 and the radiator 12 to form an integral inseparable structure.

The heat conducting plate 12 and/or the heat pipe 21 are provided with vacuum nozzles capable of being sintered and closed or fused, and the vacuum nozzles capable of being closed are communicated with the interior of the heat conducting plate and/or the interior of the heat pipe for vacuumizing.

Copper powder is contained in the heat pipe 21 to increase the heat conduction and heat absorption areas; copper powder is welded on the inner wall of the pipe, or copper powder particles are directly placed in the heat pipe and provided with a copper net. The heat pipe 21 and the heat conducting plate 12 can be welded, fused or riveted to form an integral structure. Specifically, one end of the heat pipe 21 is welded or riveted with the hole 124 provided on the heat conducting plate.

The heat sink 23 is connected to the heat-conducting plate 12 or connected to the heat-conducting plate 12 through the heat pipe 21 to form an integral structure for dissipating heat to the heat-conducting plate.

The heat sink 23 may be a finned heat sink comprising a plurality of fins 231. In some embodiments, the heat sink is a metallic finned heat sink, and may be assembled from one or more sets of metallic fins 231, such as copper plates. One or more sets of heat sinks 231 may be connected and fixed by a connection structure. For example, each heat sink is provided with a clip and a clip hole, and the heat sinks are further fixed by the heat conductive sheet or the heat pipe 21 by forming a snap fit between the clip and the clip hole.

In the illustrated embodiment, the heat sink 23 includes one or more sets of parallel-arranged fins 231; the heat pipe 21 is inserted into the channel 230 of one or more sets of parallel arranged heat sinks and tightly contacted and matched, and the heat pipe 21 and the channel 230 can be further welded by soldering tin to increase the contact area and accelerate the heat transfer. In other embodiments, the heat pipe 21 may also be fixedly connected and closely contacted with one or more sets of heat conducting fins (heat conducting members) combined with the parallel heat dissipation fins.

In other embodiments, the heat spreader 23 is a graphene heat spreader, which is a unitary structure formed by integrally molding several graphene heat dissipation sheets 231. The graphene heat spreader 23 includes an integral inseparable structure formed by integrally molding one or more graphene heat dissipation sheets 231, and the manufacturing process may be directly performed by an injection molding process or a mold pressing process. The graphene heat spreader 23 may be an integrally formed independent heat spreader, i.e., an integrally formed unitary indivisible structure including one or more sets of graphene fins 231. The graphene heat sink 23 may also be used in combination with other heat dissipation elements, such as with the heat pipe 21 or a heat conducting element. The heat pipe 21 may be mounted on the surface or inside the graphene heat sink 23 and fitted in close contact to conduct heat quickly. The heat conducting member may be mounted on the graphene heat spreader 23, for example, the graphene heat spreader 23 formed by integrally molding one or more sets of parallel graphene heat dissipation fins 231 is located or mounted on one side of the heat conducting member; the graphene heat spreader 23 and other heat conducting plates may be integrally formed into an integral structure, that is, one or more sets of parallel graphene fins 231 may be integrally formed with the heat conducting plates. The graphene radiator combination can be flexible and changeable, such as: the copper plate + the copper tube + one or more sets of graphene fins 231; alternatively, copper tubing (flattened hot contact end) + graphene fins 231; alternatively, the copper plate + graphene fins 231; alternatively, only the integrated graphene heat sink 231 is provided. For example, a heat sink for cooling a semiconductor cooling plate or a depilating work surface may be a copper plate + copper tube + graphene heat sink 231.

The graphene heat spreader 23 may be integrally formed or combined with other structural components of the beauty instrument (e.g., depilating device), and may be formed as an integral structure, for example, the graphene heat spreader 23 may be integrally formed with the structural components inside the beauty instrument (e.g., depilating device), such as a bracket, a heat conducting cover, a fan housing, etc., or may be integrally formed with the inside of the housing of the beauty instrument (e.g., depilating device).

The graphene radiating fin is integrally formed by directly forming through an injection molding process or a die pressing process, and when the graphene radiating fin is integrally formed or combined with other structural parts, the other structural parts can be placed in a mold during the injection molding process or the die pressing process, and the graphene radiating fin is formed at one time during injection molding or die pressing, so that the other structural parts and the graphene radiating fin are fixed into a whole. In the graphene radiator, a whole inseparable structure is formed between one group or multiple groups of radiating fins through an integrated ground type, a buckle structure for connecting the devices is not required to be arranged, a device alignment structure is not required to be arranged, and the process and the structure are simple.

The integrally formed graphene heat sink 23 may have any shape suitable for the internal space of the beauty instrument case, the graphene heat sink 23 is parallel graphene fins, a channel 232 for installing the heat pipe 21 may be integrally formed in the graphene heat sink, and the heat pipe 21 may be inserted into the channel 232 to be in close contact therewith.

The appearance of graphite alkene radiator 23 then does not receive beauty instrument inner space's influence, can be nimble can laminate in beauty instrument (if the appearance that moults) internals shape according to designs such as beauty instrument inner space size and radian, better utilization the product inner space, improve the utilization ratio in space, the radiating area that also strengthens simultaneously more makes the heat source can be faster more high-efficient even derivation and give off. Compared with the traditional radiator, the graphene radiator is smaller in density and lighter, and the weight of a beauty instrument (such as a depilatory instrument) is greatly reduced. The graphene radiator can be formed at one time by adopting an injection molding process or a die pressing process, the size precision is high, the consistency of parts is high, the deformation of a product is small, the graphene radiating fins can be made into a wave shape or a conductive shape according to requirements, the distance between every two graphene radiating fins is the same, the consistency of the heat conduction of the product radiation can be effectively ensured, and the quality consistency of the finished product of the beauty instrument is effectively improved. The graphene radiator has the advantages of simple preparation process, high productivity and low reject ratio, relatively improves the efficiency of finished products assembled on a beauty instrument (such as a depilator), improves the production capacity, and effectively reduces the cost of the beauty instrument (such as the depilator).

In other embodiments, the graphene heat spreader 23 may be effectively combined with other components, such as a two-in-one three-in-one all-in-one design, which conducts and dissipates heat more quickly and uniformly. For example, the graphene heat sink may be designed to be integrated with an internal mounting bracket, such as the tail of the bracket 7, integrally formed with the bracket, or integrally formed with one side of the sealing member 8; or, the fan and the outer shell of the fan are integrally formed to form an integral structure, so that heat can be conducted and dissipated more quickly and uniformly. The graphene radiator 23 is also integrally formed with the housing or the bracket to form an integral structure, so that the beauty instrument (such as a depilator) is more convenient to mount and has higher efficiency.

In other embodiments, the cold side of the semiconductor chilling plate can be made of a cold side material suitable in the prior art, such as ceramic. According to the use needs, when the cold side needs to form the light transmission area, when the cold side made of opaque materials is adopted, a reserved hollow area, such as a central through hole of a ring core, needs to be arranged for transmitting light.

In some embodiments, the cold end of the PN galvanic couple particle layer uses transparent crystals, so that the transparent crystal cold surface of the semiconductor refrigeration sheet is formed and can transmit pulsed light.

As described above and shown in fig. 25(e) and fig. 26 to 27, the cold-side circuit 110 or the metal conductor is formed on the transparent crystal cold side 10 by a conventional method such as metallization, etching, plating, printing, or coating, and electrically connected to the PN couple particle layer 11 and welded to each other; the PN galvanic couple particle layers 11 are arranged in a ring shape; heat-conducting plate 12 is annular. The annular middle area forms a light-transmitting area of the semiconductor refrigerating sheet.

The annular PN galvanic couple particle layer is welded on the annular heat conducting plate 12 and further welded on the edge annular belt 101 of the transparent crystal cold surface; the annular middle region forms a light-transmitting region 102 through which pulsed light generated by the power supply unit 3 is transmitted for depilating or other beauty treatment.

The semiconductor refrigeration piece 1 of the embodiment comprises a cold surface 10, a PN galvanic couple particle layer 11 and a heat conducting plate hot surface 12. A PN galvanic particulate layer 11 is located between the cold face 10 and the hot face 12. The cold surface 10 of the semiconductor refrigeration piece is formed by transparent crystals, so that a transparent crystal cold surface is formed; the inner side surface of the transparent crystal cold surface 10 is fixedly connected with the metal conductor of the PN galvanic couple particle layer 11. The hot surface 12 of the semiconductor refrigerating sheet is composed of a VC heat conducting plate, and the inner side surface of the VC heat conducting plate is fixedly connected with a metal conductor of the PN galvanic couple particle layer 11. The VC heat conduction plate hot surface 12 and the transparent crystal cold surface 10 sandwich the PN couple particle layer 11 to form the semiconductor refrigeration sheet 1. The positive and negative electrodes 113 are connected to the ends of the PN couple particle layer 11. The transparent crystal is a transparent material with high light transmittance, high thermal conductivity and high heat resistance, such as natural spar or gem.

The PN galvanic couple particle layer 11, namely the semiconductor galvanic couple layer, is fixedly connected with the transparent crystal cold surface 10 and the VC heat-conducting plate hot surface 12. As some examples, this may be done in a manner suitable in the art. For example, the inner surfaces of the transparent cold crystal surface 10 and the hot VC heat-conducting plate surface 12 are metallized to form the cold-side circuit 110 and the hot-side circuit 122 or metal conductor, and then the cold-side circuit and the hot-side circuit are welded to the two ends of the P/N semiconductor particles. Or the PN couple particle layer 11, the transparent crystal cold surface 10 and the VC heat conduction plate hot surface 12 are bonded by heat conduction glue to form bonding fixation.

In this embodiment, the PN couple particle layer 11 is annular, and an annular region thereof is used for disposing electronic components, and an inner hollow region thereof is used for light to penetrate. The PN galvanic couple particle layer 11 is formed by connecting two ends of a P/N type semiconductor particle in series through a metal conductor/cold end and hot end circuit, and utilizes the Peltier effect of semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series through N, P, heat transfer can be generated between the two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. The cold end adopts transparent crystal to form the cold side of semiconductor refrigeration piece, and the hot end still adopts VC heat-conducting plate to form the hot side 12 of semiconductor refrigeration piece.

The shape and size of the hot surface 12 of the VC heat conducting plate are matched with those of the PN galvanic particle layer 11, for example, the shape and size are also annular, and a hollow area inside the annular area is used for light to penetrate through.

As an example, the transparent crystal cold face 10 covers the whole faces of the PN couple particle layer 11 and the VC heat-conducting plate 12, thereby forming whole face refrigeration. The transparent crystal cold face 10 is a whole or whole crystal with continuous surface. Preferably, the thickness of the cold face of transparent crystal is no less than 1mm to improve the intensity of semiconductor refrigeration piece 1, reduce the damage risk of assembly, increase of service life. The transparent crystal material of the embodiment has high light transmittance and high heat conductivity coefficient, so that pulsed light penetrates through the transparent crystal to perform unhairing operation, and the high heat conductivity coefficient is favorable for improving the refrigeration efficiency and the effect.

The middle area of the transparent crystal cold surface 10 is a light transmission area, and the annular area is attached to the PN galvanic couple particle layer 11 in a matching mode. Correspondingly, the light-transmitting area of the cold surface of the transparent crystal is covered on the inner hollow area of the PN couple particle layer 11/VC heat-conducting plate 12, so that the hollow area is covered and light can penetrate through the hollow area. The whole refrigerating area of the transparent crystal cold surface 10 comprises a light transmission area and an annular area at the periphery of the light transmission area. The whole surface of the crystal is refrigerated, so that the refrigerating area is increased, and the experience feeling is better.

Referring again to fig. 25(a) -25(e), the assembly principle of the self-contained cooling fins is as follows:

referring to fig. 25(a), a single heat pipe 21, such as a copper/aluminum pipe, is inserted into a corresponding hole 124 provided on the heat conducting cover plate 121 of the refrigeration fin, and waits for the next processing procedure; copper/aluminum tubes are assembled with the heat conducting plate 21 after copper powder is added;

referring to fig. 25(b), after the heat conducting plate is processed into a concave-convex three-dimensional space, copper powder or a copper mesh is placed in the space, and is subjected to high-temperature welding with the heat conducting plate cover plate 121+ conduit 21 group in the previous process, and after liquid is contained in the internal space, the heat pipe is vacuumized from a vacuum nozzle arranged at the tail end or other positions to form a whole with a closed space;

referring to fig. 25(c), after the tooth-shaped heat sink 231 is connected into the heat sink 23 by single-chip buckling, the heat sink is welded with the tail end of the heat pipe into a whole, or a graphene heat sink is used; the heat sink 23 cooperates with the fan in the particular application;

referring to fig. 25(d), after the heat conducting plate 12 and the heat sink are assembled, the P-type/N-type semiconductor particles are distributed according to a predetermined design circuit and can be welded on the heat conducting plate 12 of the cooling plate through high temperature, such as 150-;

referring to fig. 25(e), after the P-type/N-type semiconductor particles are welded on the heat conducting plate 12 of the refrigeration plate, they are welded and fixed with the transparent crystal hot surface 10, and the external and internal peripheral sealing compound can be further formed into the refrigeration plate peripheral sealing compound 104 (fig. 23 (a)) which mainly seals and fixes the periphery of the PN couple particle layer 11, thereby completing the assembly of the refrigeration structure.

In the refrigeration piece with the radiator, the hot end of a ceramic plate and an intermediate heat conducting piece connected with a heat pipe are omitted from the refrigeration piece 1, P-type/N-type semiconductor particles are directly welded on a heat conducting plate 12, and heat generated by the hot end of the refrigeration piece 1 is directly conducted to an internal refrigerant by the heat conducting plate 12. The heat passes through the heat conducting plate 12, the radiating fins 231 and the fan 25, the heat does not need to pass through a ceramic plate and heat conducting silicone grease, intermediate links are reduced, the influence of the appearance of a product is avoided, the heat is effectively conducted on the whole surface, and the heat is conducted more quickly and directly.

In some embodiments, the transparent crystal is used as the cold surface of the semiconductor refrigeration piece and directly used as the working surface of the beauty instrument, the heat conduction silicone grease and the cold conduction piece layer are omitted in the semiconductor refrigeration piece, the semiconductor refrigeration piece can be directly contacted with the surface of the skin, the transparent crystal directly acts on the skin, the refrigeration efficiency is improved, and the cold conduction speed is accelerated.

The vc (vapor chambers) heat conducting plate in this embodiment may be made of copper/aluminum or other metal heat conducting materials, a layer of insulating material is formed (for example, sprayed) on the surface of the copper plate in contact with the conductive layer particles of the cooling plate, and a corresponding circuit is formed by etching or printing or other methods to electrically connect the P-type/N-type semiconductor particles to move charges, thereby achieving the heating/cooling effect. The other side of the heat-conducting bottom plate needs to be processed into a three-dimensional space, a closed space for containing copper powder and a refrigerant is formed inside the heat-conducting bottom plate after the heat-conducting bottom plate is buckled with the heat-conducting cover plate, and the heat-conducting bottom plate is communicated with the space inside the heat pipe. The heat conducting bottom plate 120, the heat conducting cover plate 121 and the heat pipe 21 are welded at high temperature, and then are vacuumized through a vacuum nozzle reserved on the heat pipe or the heat conducting plate, and finally are sintered to form a communicated closed space. In the utility model, adopt the heat-conducting plate directly as the hot junction of refrigeration piece, link up or the lug connection radiator as having a perfect understanding with the heat pipe simultaneously, as the partly of heat pipe or radiator, will refrigerate the piece and combine as an organic whole with the radiator, the structure is simpler.

The refrigeration piece heating panel directly contacts with the P/N semiconductor particle layer, directly serves as the hot junction, and the radiating efficiency is fast, and the area is big, and the loss is little, saves intermediate link for heat-conducting speed.

The refrigerating plate omits a ceramic plate hot end and an intermediate heat conducting piece connected with the heat pipe, the P-type/N-type semiconductor particles are directly welded on the heat conducting plate, and heat generated by the hot end of the refrigerating plate is directly conducted to the internal refrigerant by the heat conducting plate. The heat passes through the heat conducting plate, the radiating fin and the fan, the heat does not need to pass through a ceramic plate and heat conducting silicone grease, intermediate links are reduced, the whole surface is not influenced by the appearance of a product, and the heat is effectively conducted, so that the heat is conducted more quickly and directly.

In other embodiments, the transparent crystal cold surface is adopted, the heat-conducting silicone grease and the cold conducting part layer are omitted, the transparent crystal cold surface is directly contacted with the surface of the skin, and the transparent crystal is directly acted on the skin, so that the refrigeration efficiency is improved, and the cold conducting speed is accelerated.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, and are intended to be within the scope of the invention; the scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A rotatable beauty instrument comprises a main machine body, a light source component, a power supply unit and a main control circuit board are arranged in the main machine body; the power supply unit supplies power to the light source component; the front end surface of the beauty instrument is a working surface; the beauty instrument controls the power supply unit to excite the light source assembly to generate pulse light through the control circuit board, and the pulse light generated by the light source assembly penetrates through the working surface to perform beauty treatment; the method is characterized in that: the main body of the beauty instrument is divided into a first main body and a second main body which can rotate relatively by a pair of cross sections in the main body, and the first main body and the second main body are connected by a rotary connection structure; the front end face of the first main machine body is the working face, and the light source assembly is located in the first main machine body.

2. The rotatable cosmetic instrument of claim 1, wherein: the first main machine body freely rotates relative to the second main machine body so that the first main machine body and the second main machine body are in a straight plate type or side-standing type structure with different angles; the cross section is respectively used as the connecting end surfaces of the first host body and the second host body.

3. The rotatable cosmetic instrument of claim 2, wherein: when the beauty instrument is of a straight plate type structure, the first main machine body is connected with the second main machine body in an aligned mode, and the connecting end faces of the first main machine body and the second main machine body are attached in an aligned and parallel mode;

4. The rotatable cosmetic instrument of claim 1, wherein: the pair of sections are the cross sections of the main body of the beauty instrument, or the pair of sections are the oblique sections of the main body of the beauty instrument; the pair of sections are mutually attached and supported.

5. The rotatable cosmetic instrument of claim 1, wherein: the rotary connecting structure is a pivot or universal rotary connecting structure; the first main machine body can freely rotate relative to the second main machine body and is not separated from the second main machine body; the rotary connection structure is provided with a limiting structure, and the rotating shaft and the shaft hole are prevented from being separated from each other in a rotating fit mode.

6. The rotatable cosmetic instrument of claim 5, wherein: the pivot rotation comprises the steps that a rotating shaft and a shaft hole are arranged between the first main machine body and the second main machine body to form rotating fit, so that the first main machine body rotates relative to the second main machine body; the limiting structure is arranged on the rotating shaft and/or the shaft hole; wherein, one of the connection end surfaces of the first main machine body and the second main machine body is provided with a shaft hole, and the other connection end surface is provided with a rotating shaft; alternatively, the first and second electrodes may be,

one of the connecting end surfaces of the first main machine body and the second main machine body is provided with a shaft hole, the other connecting end surface is provided with a universal ball, and the roller is nested in the shaft hole and rotationally matched to drive the first main machine body to rotate relative to the second main machine body; the shaft hole and/or the ball are/is provided with a limiting structure to prevent the ball from being separated from the shaft hole when the ball is in running fit with the shaft hole;

the limiting structure is one or a combination of a baffle plate structure, a flange, a buckle and a fastener.

7. The rotatable cosmetic instrument of claim 6, wherein:

a boss is arranged in the center of one connecting end face of the connecting end faces of the first main machine body and the second main machine body to form a rotating shaft, and a shaft hole is arranged in the center of the other connecting end face; the boss penetrates through the shaft hole, and the tail end of the boss is further provided with a rotary position fixing connecting plate as a limiting structure to prevent the boss from separating from the shaft hole; the rotary position fixing connecting plate and the lug boss are fixedly connected;

fastening connection between rotatory position fixed connection board and the boss includes: the screw is fastened and connected, and the screw is fastened and connected with the stud, the buckle is fastened and connected, the riveting is fastened and connected, and the ball head is elastically buckled and fixedly connected with one or more of the studs.

8. The rotatable beauty instrument of any one of claims 1 to 7, wherein:

the shell of the first main machine body is provided with a plurality of air inlets and air outlets, and the first main machine body is internally provided with a radiator and a fan;

the air inlet, the space on the surface of the radiator, the fan and the air passage between the air outlets are communicated to form an air-cooling heat dissipation channel, and the air-cooling heat dissipation channel is used for sucking ambient cold air into the space on the surface of the radiator through the air inlet and discharging the ambient cold air to the air outlets through the fan for air-cooling heat dissipation;

the working surface of the beauty instrument is refrigerated by a semiconductor refrigeration piece or the cold surface of the semiconductor refrigeration piece is used as the working surface;

the semiconductor refrigerating sheet comprises a PN galvanic couple particle layer, a cold surface and a hot surface; the cold surface and the hot surface are respectively arranged at the cold end and the hot end of the PN galvanic couple particle layer; the PN galvanic couple particle layer comprises P-type/N-type semiconductor particles;

the cold surface and the hot surface form a cold end circuit or a metal conductor through metallization, and the P-type/N-type semiconductor particles are connected in series;

the semiconductor refrigerating sheet is provided with a light transmitting area for transmitting pulse light generated by a light source to carry out cosmetic treatment.

9. The rotatable cosmetic instrument of claim 8, wherein:

the working surface is made of transparent crystal materials to form a transparent crystal working surface, so that an icing effect is obtained;

the cold surface of the semiconductor refrigeration sheet is made of transparent crystal materials to form a transparent crystal cold surface, and the transparent crystal cold surface is used as a working surface; or the semiconductor refrigerating sheet refrigerates the working surface of the transparent crystal;

the hot surface of the semiconductor refrigerating sheet is connected with the radiator, and the radiator radiates heat to the hot surface;

the light-transmitting area is formed by a hollow area inside the semiconductor chilling plate, and/or the light-transmitting area is provided by a transparent crystal of the semiconductor chilling plate.

10. The rotatable cosmetic instrument of claim 8, wherein:

the semiconductor refrigeration sheet adopts a transparent crystal as a cold surface, and the transparent crystal is fixedly connected with one or more groups of PN galvanic couple particle layers and a hot surface connected with the PN galvanic couple particle layers; the cold surface of the transparent crystal forms a light transmitting area for transmitting pulse light generated by a light source to carry out cosmetic treatment; or

The hot surface of the semiconductor refrigerating sheet is annular; the PN galvanic couple particle layer is annular or P-type/N-type semiconductor particles are arranged in an annular manner; the annular middle area forms a light transmission area; the cold surface of the transparent crystal is a whole crystal, and an annular hollow area of the hot surface is sealed and covered for transmitting pulse light generated by a light source; or

The hot surface of the semiconductor refrigerating sheet is annular; the PN galvanic couple particle layer is annular or P-type/N-type semiconductor particles are arranged in an annular manner; the cold surface is annular and is made of transparent or non-transparent materials, the annular hot surface and the annular cold surface are respectively welded at two ends of a PN galvanic couple particle layer or a P-type/N-type semiconductor particle, and the annular middle area forms a light transmission area.

11. The rotatable cosmetic instrument of claim 8, wherein:

the hot surface of the semiconductor refrigerating sheet is connected with the radiator through a heat pipe and used for quickly conducting heat of the hot surface to the radiator for radiating together; the inside of the heat pipe contains a refrigerant;

the radiator comprises a plurality of radiating fins; the radiating fins are metal radiating fins or graphene radiating fins;

the radiating fins are connected and fixed through a connecting structure; or the plurality of radiating fins are of an integral structure integrally formed by graphene;

the radiator comprises one or more groups of radiating fins which are arranged in parallel;

the heat pipe is arranged in the channel of the one or more groups of radiating fins which are arranged in parallel in a penetrating way and is matched with the radiating fins in a close contact way, or the heat pipe is fixed on the heat conducting fins which are combined on the radiating fins and is matched with the radiating fins in a close contact way.

12. The rotatable cosmetic instrument of claim 11, wherein:

the hot surface of the semiconductor refrigerating sheet is formed by a heat conducting plate; the heat conduction plate is a VC heat conduction plate, and a refrigerant is contained in the heat conduction plate;

the interior of the heat pipe is communicated with the interior of the heat conducting plate to form a communicated closed space; a refrigerant flows through the sealed space;

the heat conducting plate is a metal plate; the surface of the metal plate is provided with an insulating layer and a hot end circuit or a metal conductor so as to connect the P-type/N-type semiconductor particles in series.

13. The rotatable beauty instrument of any one of claims 1 to 7, wherein:

the beauty instrument takes a depilating instrument as a main body and can generate IPL pulsed light for depilating treatment; the optical filtering component is arranged on the head of the depilating instrument and is used for filtering the pulse wave generated by the light source so as to obtain the beauty instrument with different efficacies of beauty treatment or treatment;

a bin channel or a clamping groove for inserting the optical filter component is arranged between the light source component and the working surface in the depilating instrument, and the optical filter component is inserted in a pluggable and replaceable manner, so that the cosmetic instrument with different cosmetic or therapeutic effects is obtained;

the filtering component comprises a filter, a frame bracket for fixing the filter and a filtering component circuit; the light filtering component circuit is arranged on the frame bracket; the filtering component and the bin channel or the clamping groove are further elastically abutted by an elastic element;

different filter assemblies are provided with filters with different wavelengths and resistors with different resistance values, and the corresponding filter assemblies are identified by detecting the resistance values of the resistors in the filter assemblies or detecting the voltages at two ends of the resistors or detecting the current flowing through the resistors;

the resistance is arranged on the circuit board of the light filtering component and is electrically connected with the main control circuit board in the beauty instrument through the electrode component;

the electrode assembly comprises a group of counter electrodes which are respectively and correspondingly electrically connected with two ends of the resistor on the filter circuit board;

a pair of electrodes of the electrode component is fixed by the insulating body, one end of each electrode at two ends is used for electrically connecting one end of the resistor on the light filtering component circuit board, and the other end is used for electrically connecting a main control circuit board in the beauty instrument; the electrode assembly is arranged on a structural part in the beauty instrument;

the insulating body is provided with pins which are clamped and fixed with the filtering component.

14. The rotatable cosmetic instrument of claim 8, wherein:

the light source assembly is arranged on the light source bracket, and light generated by the light source assembly is transmitted to the working surface through the light-emitting cavity assembly;

the light-emitting cavity component is abutted against the hot surface of the refrigerating sheet and the front end of the light source bracket to form a light-transmission sealing channel connected between the light source component and the working surface;

the light-emitting cavity component comprises a mirror surface cover bracket, a mirror surface cover, a sealing ring pressing plate and white glass or a high-transparency medium plate; the mirror surface cover is internally provided with a light channel which is matched with a light transmission area of the semiconductor refrigeration sheet and is arranged on the mirror surface cover bracket; the front end of the mirror face cover bracket is an annular cavity which is sheathed with the mirror face cover in a matching way, and the rear end surface of the mirror face cover bracket is covered and sealed by white glass or a highly transparent dielectric plate; the edge of the white glass or the high transparent medium plate is sleeved with a sealing ring; a pressing plate is further arranged outside the white glass or the high-transparency medium plate and used for pressing the white glass or the high-transparency medium plate; the front end of the light channel is sealed by a semiconductor refrigeration sheet or a working surface, and the rear end of the light channel is sealed by white glass or a high-transparency medium plate;

one or more pieces of white glass or high-transparency medium plates are arranged on the light-emitting surface of the light source component.

15. The rotatable beauty instrument of any one of claims 1 to 7, wherein:

a sub-control circuit board is arranged in the first host body, and a power supply unit and a main control circuit board are arranged in the second host body; the sub-control circuit board is electrically connected with the main control circuit board; the beauty instrument is provided with a power line for connecting an external power supply; the power supply unit is an energy storage capacitor;

the power line is connected with a power adapter which is a first electric control module; the sub-control circuit board is a high-voltage discharge PCBA and a second electric control module; the main control circuit board is a boost PCBA and is a third electric control module;

the voltage input by the power supply line of the power adapter is wide voltage AC 90V-264V, and the voltage is reduced to DC12V or DC 24V or to a voltage value between DC 12-24V in power adaptation through the first electronic control module; the voltage is output to the beauty instrument main body through a power line, when the voltage is input to the second electric control module to be boosted through PCBA, the voltage is adjusted from DC12V or DC 24V or DC 12V-24V to be boosted to be charged to the energy storage capacitor through DC250V-400V according to the energy gear requirement; the light of the light source component is controlled by the third electric control module to emit light;

the light source of the light source component is an IPL lamp tube, and the light source is triggered to light up to release capacitance energy, so that a flashing effect is achieved.

16. The rotatable cosmetic instrument of claim 8, wherein:

the radiator is used for radiating heat of the light source component;

the space on the surface of the light source component is communicated with the air-cooling heat dissipation channel and used for sucking ambient cold air into the space on the surface of the light source component through the air inlet and discharging the ambient cold air to the air outlet through the fan to realize air-cooling heat dissipation;

the light source component comprises a light source and a reflecting cup covered outside the light source; the light source is electrified to generate pulsed light.