CN114812062A - A cooling and cooling system based on semiconductor refrigeration - Google Patents
A cooling and cooling system based on semiconductor refrigeration Download PDFInfo
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- CN114812062A CN114812062A CN202210572089.3A CN202210572089A CN114812062A CN 114812062 A CN114812062 A CN 114812062A CN 202210572089 A CN202210572089 A CN 202210572089A CN 114812062 A CN114812062 A CN 114812062A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 144
- 238000005057 refrigeration Methods 0.000 title claims abstract description 61
- 238000001816 cooling Methods 0.000 title claims abstract description 46
- 239000004020 conductor Substances 0.000 claims abstract description 73
- 239000002184 metal Substances 0.000 claims abstract description 73
- 239000000919 ceramic Substances 0.000 claims abstract description 30
- 238000007789 sealing Methods 0.000 abstract description 3
- 239000000110 cooling liquid Substances 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D31/00—Other cooling or freezing apparatus
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Abstract
Description
技术领域technical field
本发明涉及制冷技术领域，尤其涉及一种基于半导体制冷的降温冷却系统。The invention relates to the technical field of refrigeration, in particular to a cooling and cooling system based on semiconductor refrigeration.
背景技术Background technique
目前的制冷有风冷和水冷两种形式，风冷就是通过空气中得温度进行交替反复，达到降温得效果，但随着外界温度得升高，制冷效果逐渐下降，当外界温度于设备的工作温度阈值时就没有冷热交替的效果；因此，急需一种基于半导体制冷的降温冷却系统，用以解决现有设备没有冷热交替的技术问题。At present, there are two forms of cooling: air cooling and water cooling. Air cooling is to obtain the temperature in the air alternately and repeatedly to achieve the cooling effect, but as the outside temperature rises, the cooling effect gradually decreases. At the temperature threshold, there is no effect of alternating hot and cold; therefore, a cooling and cooling system based on semiconductor refrigeration is urgently needed to solve the technical problem that the existing equipment does not have alternating hot and cold.
发明内容SUMMARY OF THE INVENTION
为了解决现有的技术问题，本发明的目的是提供一种基于半导体制冷的降温冷却系统，通过将半导体制冷完美的融合到风冷效果中，半导体可以产生0度以下的温度，不管外界环境如何，将半导体制冷的一侧通过风道将冷气输送到设备中，大大提高温度差，提高制冷的效果及速度。In order to solve the existing technical problems, the purpose of the present invention is to provide a cooling and cooling system based on semiconductor refrigeration. By perfectly integrating the semiconductor refrigeration into the air cooling effect, the semiconductor can generate a temperature below 0 degrees, regardless of the external environment. , the side of the semiconductor refrigeration is transported to the equipment through the air duct, which greatly increases the temperature difference and improves the cooling effect and speed.
为了实现上述技术目的，本发明提供了一种基于半导体制冷的降温冷却系统，由依次连接的风扇、半导体制冷系统、进风口、抽风机、出风口组成；In order to achieve the above technical purpose, the present invention provides a cooling and cooling system based on semiconductor refrigeration, which is composed of a fan, a semiconductor refrigeration system, an air inlet, an exhaust fan, and an air outlet connected in sequence;
半导体制冷系统，包括：Semiconductor refrigeration systems, including:
第一绝缘陶瓷片部，设置在进风口与抽风机的连接端的另一端；The first insulating ceramic sheet portion is arranged at the other end of the connection end between the air inlet and the exhaust fan;
第一金属导体部，与第一绝缘陶瓷片部连接；The first metal conductor part is connected with the first insulating ceramic sheet part;
半导体部，半导体部的一端与第一金属导体部连接；a semiconductor part, one end of the semiconductor part is connected with the first metal conductor part;
第二金属导体部，与半导体部的另一端连接；The second metal conductor part is connected to the other end of the semiconductor part;
第二绝缘陶瓷片部，设置在风扇的一端，并与第二金属导体部连接；The second insulating ceramic sheet portion is arranged at one end of the fan and is connected to the second metal conductor portion;
直流电源，与第二金属导体部和/或第一金属导体部电性连接。The DC power supply is electrically connected to the second metal conductor portion and/or the first metal conductor portion.
优选地，第二金属导体部通过半导体部与第一金属导体部连接。Preferably, the second metal conductor portion is connected to the first metal conductor portion through the semiconductor portion.
优选地，半导体部由交替设置的N型半导体和P型半导体组成，其中，N型半导体的第一端通过第一金属导体部与P型半导体的第一端连接，P型半导体的第二端通过第二金属导体部与N型半导体的第二端连接。Preferably, the semiconductor portion is composed of alternately arranged N-type semiconductors and P-type semiconductors, wherein the first end of the N-type semiconductor is connected to the first end of the P-type semiconductor through the first metal conductor portion, and the second end of the P-type semiconductor is connected to the first end of the P-type semiconductor. It is connected to the second end of the N-type semiconductor through the second metal conductor portion.
优选地，N型半导体和P型半导体的数量相同；Preferably, the numbers of N-type semiconductors and P-type semiconductors are the same;
直流电源的正极通过第二金属导体部与N型半导体电性连接；The positive electrode of the DC power supply is electrically connected to the N-type semiconductor through the second metal conductor;
直流电源的负极通过第二金属导体部与P型半导体电性连接。The negative electrode of the DC power supply is electrically connected to the P-type semiconductor through the second metal conductor portion.
优选地，半导体部由交替设置的P型半导体和N型半导体组成，其中，P型半导体的第一端通过第二金属导体部与N型半导体的第一端连接，N型半导体的第一端通过第二金属导体部与P型半导体的第二端连接；Preferably, the semiconductor portion is composed of alternately arranged P-type semiconductors and N-type semiconductors, wherein the first end of the P-type semiconductor is connected to the first end of the N-type semiconductor through the second metal conductor portion, and the first end of the N-type semiconductor is connected to the first end of the N-type semiconductor. connected with the second end of the P-type semiconductor through the second metal conductor portion;
N型半导体和P型半导体的数量相同；The number of N-type semiconductors and P-type semiconductors is the same;
第一绝缘陶瓷片部与第二金属导体部连接；the first insulating ceramic sheet part is connected with the second metal conductor part;
第二绝缘陶瓷片部与第一金属导体部连接；The second insulating ceramic sheet portion is connected to the first metal conductor portion;
直流电源的正极通过第一金属导体部与N型半导体电性连接；The positive electrode of the DC power supply is electrically connected to the N-type semiconductor through the first metal conductor part;
直流电源的负极通过第一金属导体部与P型半导体电性连接。The negative electrode of the DC power supply is electrically connected to the P-type semiconductor through the first metal conductor portion.
优选地，直流电源，与第二金属导体部和第一金属导体部电性连接，用于通过切换直流电源与第二金属导体部、第一金属导体部的电性连接关系，控制半导体制冷系统进行制冷。Preferably, the DC power supply is electrically connected to the second metal conductor portion and the first metal conductor portion, and is used to control the semiconductor refrigeration system by switching the electrical connection relationship between the DC power supply and the second metal conductor portion and the first metal conductor portion Refrigerate.
优选地，降温冷却系统包括两个半导体制冷系统；Preferably, the cooling system includes two semiconductor refrigeration systems;
每个半导体制冷系统之间并行设置或串行设置，其中，当每个半导体制冷系统之间为串行设置时，第一个半导体制冷系统的第二绝缘陶瓷片部与第二个半导体制冷系统的第一绝缘陶瓷片部连接。Each semiconductor refrigeration system is arranged in parallel or in series, wherein, when each semiconductor refrigeration system is arranged in series, the second insulating ceramic sheet part of the first semiconductor refrigeration system and the second semiconductor refrigeration system The first insulating ceramic piece is connected.
优选地，降温冷却系统包括至少三个半导体制冷系统；Preferably, the cooling system includes at least three semiconductor refrigeration systems;
每个半导体制冷系统之间并行设置和/或串行设置；Parallel setup and/or serial setup between each refrigerating system;
每个半导体制冷系统的第二绝缘陶瓷片部相互连接；The second insulating ceramic sheet portions of each semiconductor refrigeration system are connected to each other;
每个半导体制冷系统的第一绝缘陶瓷片部分别与风扇、进风口连接。The first insulating ceramic sheet part of each semiconductor refrigeration system is respectively connected with the fan and the air inlet.
本发明公开了以下技术效果：The present invention discloses the following technical effects:
本发明提高了制冷效果，降低散热时间，有免去冷却液的存储及密封困扰。The invention improves the cooling effect, reduces the heat dissipation time, and avoids the trouble of storage and sealing of the cooling liquid.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings required in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some of the present invention. In the embodiments, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative labor.
图1为本发明所述的半导体制冷系统的结构示意图；1 is a schematic structural diagram of a semiconductor refrigeration system according to the present invention;
图2为本发明所述的降温冷却系统的结构示意图。FIG. 2 is a schematic structural diagram of the cooling system according to the present invention.
具体实施方式Detailed ways
下为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。通常在此处附图中描述和示出的本申请实施例的组件可以以各种不同的配置来布置和设计。因此，以下对在附图中提供的本申请的实施例的详细描述并非旨在限制要求保护的本申请的范围，而是仅仅表示本申请的选定实施例。基于本申请的实施例，本领域技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都属于本申请保护的范围。In order to make the purposes, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments It is only a part of the embodiments of the present application, but not all of the embodiments. The components of the embodiments of the present application generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations. Thus, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the application as claimed, but is merely representative of selected embodiments of the application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.
如图1-2所示，本发明提供了一种基于半导体制冷的降温冷却系统，由依次连接的风扇、半导体制冷系统、进风口、抽风机、出风口组成；As shown in Figures 1-2, the present invention provides a cooling and cooling system based on semiconductor refrigeration, which consists of a fan, a semiconductor refrigeration system, an air inlet, an exhaust fan, and an air outlet connected in sequence;
半导体制冷系统，包括：Semiconductor refrigeration systems, including:
第一绝缘陶瓷片部，设置在进风口与抽风机的连接端的另一端；The first insulating ceramic sheet portion is arranged at the other end of the connection end between the air inlet and the exhaust fan;
第一金属导体部，与第一绝缘陶瓷片部连接；The first metal conductor part is connected with the first insulating ceramic sheet part;
半导体部，半导体部的一端与第一金属导体部连接；a semiconductor part, one end of the semiconductor part is connected with the first metal conductor part;
第二金属导体部，与半导体部的另一端连接；The second metal conductor part is connected to the other end of the semiconductor part;
第二绝缘陶瓷片部，设置在风扇的一端，并与第二金属导体部连接；The second insulating ceramic sheet portion is arranged at one end of the fan and is connected to the second metal conductor portion;
直流电源，与第二金属导体部和/或第一金属导体部电性连接。The DC power supply is electrically connected to the second metal conductor portion and/or the first metal conductor portion.
进一步地优选地，本发明提到的第二金属导体部通过半导体部与第一金属导体部连接。Further preferably, the second metal conductor part mentioned in the present invention is connected to the first metal conductor part through the semiconductor part.
进一步地优选地，本发明提到的半导体部由交替设置的N型半导体和P型半导体组成，其中，N型半导体的第一端通过第一金属导体部与P型半导体的第一端连接，P型半导体的第二端通过第二金属导体部与N型半导体的第二端连接。Further preferably, the semiconductor portion mentioned in the present invention is composed of alternately arranged N-type semiconductors and P-type semiconductors, wherein the first end of the N-type semiconductor is connected to the first end of the P-type semiconductor through the first metal conductor portion, The second end of the P-type semiconductor is connected to the second end of the N-type semiconductor through the second metal conductor portion.
进一步地优选地，本发明提到的N型半导体和P型半导体的数量相同；Further preferably, the number of N-type semiconductors and P-type semiconductors mentioned in the present invention are the same;
直流电源的正极通过第二金属导体部与N型半导体电性连接；The positive electrode of the DC power supply is electrically connected to the N-type semiconductor through the second metal conductor;
直流电源的负极通过第二金属导体部与P型半导体电性连接。The negative electrode of the DC power supply is electrically connected to the P-type semiconductor through the second metal conductor portion.
进一步地优选地，本发明提到的半导体部由交替设置的P型半导体和N型半导体组成，其中，P型半导体的第一端通过第二金属导体部与N型半导体的第一端连接，N型半导体的第一端通过第二金属导体部与P型半导体的第二端连接；Further preferably, the semiconductor portion mentioned in the present invention is composed of alternately arranged P-type semiconductors and N-type semiconductors, wherein the first end of the P-type semiconductor is connected to the first end of the N-type semiconductor through the second metal conductor portion, The first end of the N-type semiconductor is connected to the second end of the P-type semiconductor through the second metal conductor portion;
N型半导体和P型半导体的数量相同；The number of N-type semiconductors and P-type semiconductors is the same;
第一绝缘陶瓷片部与第二金属导体部连接；the first insulating ceramic sheet part is connected with the second metal conductor part;
第二绝缘陶瓷片部与第一金属导体部连接；The second insulating ceramic sheet portion is connected to the first metal conductor portion;
直流电源的正极通过第一金属导体部与N型半导体电性连接；The positive electrode of the DC power supply is electrically connected to the N-type semiconductor through the first metal conductor part;
直流电源的负极通过第一金属导体部与P型半导体电性连接。The negative electrode of the DC power supply is electrically connected to the P-type semiconductor through the first metal conductor portion.
进一步地优选地，本发明提到的直流电源，与第二金属导体部和第一金属导体部电性连接，用于通过切换直流电源与第二金属导体部、第一金属导体部的电性连接关系，控制半导体制冷系统进行制冷。Further preferably, the DC power supply mentioned in the present invention is electrically connected with the second metal conductor portion and the first metal conductor portion, and is used for switching the electrical properties of the DC power supply with the second metal conductor portion and the first metal conductor portion. The connection relationship is used to control the semiconductor refrigeration system for refrigeration.
进一步地优选地，本发明提到的降温冷却系统包括两个半导体制冷系统；Further preferably, the cooling system mentioned in the present invention includes two semiconductor refrigeration systems;
每个半导体制冷系统之间并行设置或串行设置，其中，当每个半导体制冷系统之间为串行设置时，第一个半导体制冷系统的第二绝缘陶瓷片部与第二个半导体制冷系统的第一绝缘陶瓷片部连接。Each semiconductor refrigeration system is arranged in parallel or in series, wherein, when each semiconductor refrigeration system is arranged in series, the second insulating ceramic sheet part of the first semiconductor refrigeration system and the second semiconductor refrigeration system The first insulating ceramic piece is connected.
进一步地优选地，本发明提到的降温冷却系统包括至少三个半导体制冷系统；Further preferably, the cooling system mentioned in the present invention includes at least three semiconductor refrigeration systems;
每个半导体制冷系统之间并行设置和/或串行设置；Parallel setup and/or serial setup between each refrigerating system;
每个半导体制冷系统的第二绝缘陶瓷片部相互连接；The second insulating ceramic sheet portions of each semiconductor refrigeration system are connected to each other;
每个半导体制冷系统的第一绝缘陶瓷片部分别与风扇、进风口连接。对于至少三个半导体制冷系统的技术设计中，降温冷却系统具有控制自身温度的特性，即不受外界温度干扰，能够保持自身温度的恒温，对于处于不同环境恶略地区，通过自身具备的加热或散热功能，保持自身系统的工作状态。The first insulating ceramic sheet part of each semiconductor refrigeration system is respectively connected with the fan and the air inlet. For the technical design of at least three semiconductor refrigeration systems, the cooling and cooling system has the characteristics of controlling its own temperature, that is, it is not disturbed by the external temperature, and can maintain a constant temperature of its own temperature. Cooling function, keep the working state of its own system.
本发明设计的直流电源与两个金属导体的连接方式，可以理解为分别连通，通过控制装置以及控制方法，实现不同制冷工作，例如：通过改变电源极性，同时改变N型半导体和P型半导体的连接关系，实现系统回路切换的工作方式，有助于系统自身的性能保持；或在改变电源极性时，不改变半导体的连接关系，用于实现系统功能切换的工作方式，为降温冷却系统提供不同的工作思路，例如，在环境温度较低或较高时，保持出风口温度恒定以及半导体制冷系统自身保持相对平稳的温度状态，保证了整套系统的平稳运行，并节省了整套系统的能源消耗，并且当处于外部条件恶略的环境中时，整套系统仍能保持相对平稳的工作状态。The connection mode of the DC power supply and the two metal conductors designed by the present invention can be understood as being connected respectively, and different refrigeration works are realized through the control device and the control method, for example, by changing the polarity of the power supply, the N-type semiconductor and the P-type semiconductor are changed at the same time. The connection relationship of the semiconductors can realize the working mode of system loop switching, which is helpful to maintain the performance of the system itself; or when changing the polarity of the power supply, the connection relationship of the semiconductors is not changed, which is used to realize the working mode of system function switching, which is a cooling system for cooling system. Provide different working ideas, for example, when the ambient temperature is low or high, the temperature of the air outlet is kept constant and the semiconductor refrigeration system itself maintains a relatively stable temperature state, which ensures the smooth operation of the whole system and saves the energy of the whole system consumption, and the whole system can still maintain a relatively stable working state when it is in an environment with harsh external conditions.
本发明设计的系统的工作过程表示为：The working process of the system designed by the present invention is expressed as:
工作过程1：空气——半导体制冷片的冷空气端——风道——抽风机——风道——设备产热部位——外部空气Working process 1: Air - cold air end of semiconductor refrigeration sheet - air duct - exhaust fan - air duct - equipment heat generating part - outside air
工作过程2：空气——半导体制冷片的热空气端——隔离保温棉(冷热气流隔离)——散热片——外部空气。Working process 2: Air - the hot air end of the semiconductor refrigeration sheet - isolation insulation cotton (cold and hot airflow isolation) - heat sink - outside air.
本发明在实际制冷设备的应用中，且效果良好，降温效果良好，对设备的温度控制有很好的控制效果，及降低了水冷方案的成本及繁琐的密封工作，又高于常规风冷的制冷效果。In the application of the actual refrigeration equipment, the invention has good effect, good cooling effect, good control effect on the temperature control of the equipment, and reduces the cost of the water cooling scheme and the tedious sealing work, and is higher than the conventional air cooling. cooling effect.
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined.
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。In the present invention, unless otherwise expressly specified and limited, the terms "installed", "connected", "connected", "fixed" and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection , or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between the two elements, unless otherwise specified limit. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。In the description of this specification, description with reference to the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples", etc., mean specific features described in connection with the embodiment or example , structure, material or feature is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art may combine and combine the different embodiments or examples described in this specification, as well as the features of the different embodiments or examples, without conflicting each other.
尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。Although the embodiments of the present invention have been shown and described above, it should be understood that the above-mentioned embodiments are exemplary and should not be construed as limiting the present invention. Embodiments are subject to variations, modifications, substitutions and variations.
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