CN213312969U

CN213312969U - Unhairing instrument

Info

Publication number: CN213312969U
Application number: CN202021412195.8U
Authority: CN
Inventors: 赵凤球
Original assignee: Shenzhen Yuyi Electronic Technology Co Ltd
Current assignee: Shenzhen Yuyi Electronic Technology Co Ltd
Priority date: 2020-04-02
Filing date: 2020-07-16
Publication date: 2021-06-01
Anticipated expiration: 2030-07-16
Also published as: CN213994603U; CN112484337A; CN115628569A; CN214807921U; CN213432629U; CN216258753U; CN213312973U; CN112484336A; CN214807922U; CN214971202U; CN214807926U

Abstract

The application relates to a depilating instrument, which comprises a depilating working head, a light source assembly, a heat dissipation assembly and a control circuit board; the control circuit board controls the light source assembly to generate pulse light to perform unhairing treatment. The hair removal instrument comprises a light source assembly, a heat dissipation assembly, a control circuit board, a first air inlet, a second air outlet and a control circuit board, wherein the light source assembly, the heat dissipation assembly and the control circuit board are arranged inside a shell of the hair removal instrument; the heat dissipation assembly comprises a heat radiator and a fan; the fan is arranged in a cavity, an air path at one side of the cavity extends through to form an air outlet channel, and the tail end of the air outlet channel is communicated with the air outlet; the air passages among the first air inlet, the space on the surface of the radiator, the cavity for installing the fan, the air outlet channel and the air outlet are communicated to form an air-cooling radiating channel of the radiator; the fan is started to work to suck cold air to carry out air cooling heat dissipation on the radiator.

Description

Unhairing instrument

Technical Field

The utility model belongs to the technical field of cosmetic instrument and specifically relates to an appearance moults.

Background

According to the existing freezing point hair removal instrument, sapphire is adopted to be in contact with skin in a hair removal working head, semiconductor refrigerating sheets are arranged on the side surfaces around the sapphire to refrigerate the sapphire to form an ice compress effect, and an air cooling heat dissipation is carried out on a lamp tube assembly in the hair removal instrument and an air inlet in the front of a radiator, so that the heat dissipation is slow, the cooling effect is poor, the experience feeling is poor, and the hair removal efficiency and the hair removal effect are influenced; but also can cause the formation of water mist or water drops, which can damage the control circuit board.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the utility model provides an appearance that moults solves current appearance radiating efficiency that moults low, the not good problem of refrigeration effect.

In order to solve the technical problem, the utility model adopts the following technical scheme:

a depilating instrument comprises a depilating working head, a light source assembly, a heat dissipation assembly and a control circuit board; the control circuit board controls the light source assembly to generate pulse light for unhairing; the light source assembly, the heat dissipation assembly and the control circuit board are arranged inside a shell of the depilating instrument, and a first air inlet and an air outlet are formed in the shell; the heat dissipation assembly comprises a heat radiator and a fan; the fan is arranged in a cavity, an air path at one side of the cavity extends through to form an air outlet channel, and the tail end of the air outlet channel is communicated with the air outlet; the air passages among the first air inlet, the space on the surface of the radiator, the cavity for installing the fan, the air outlet channel and the air outlet are communicated to form an air-cooling radiating channel of the radiator; the fan is started to work to suck cold air to carry out air cooling heat dissipation on the radiator.

In some embodiments, one side of the cavity extends obliquely towards the air outlet to form an oblique air outlet channel; the shell is provided with an opening, and the radiator is arranged in the shell and is positioned behind the opening; the outer side of the opening is covered with a baffle plate; a gap is reserved between the baffle and the edge of the opening of the shell; the gap forms a lateral air inlet on the surface of the radiator; one or more groups of air holes are arranged on the baffle; the first air inlet comprises a lateral air inlet formed by the gap and/or one or more groups of air holes; the air outlet is formed at one side of the gap between the baffle and the edge of the opening of the shell; the air outlet is connected with the tail end of an air outlet channel of the cavity and used for laterally and outwards discharging hot air; the depilating instrument works by starting the fan, the first air inlet sucks cold air to the space on the surface of the radiator, the heat on the surface of the radiator is taken away to form hot air, the hot air is sucked into the cavity provided with the fan, the hot air is discharged to the air outlet channel by the fan, and the air outlet is discharged, so that air-cooling heat dissipation of the radiator is realized.

In some embodiments, the heat sink is a fin heat sink, a plurality of fins, one or more groups of parallel fins, or a combination of several heat conducting plates; the space on the surface of the radiator is communicated with an air inlet hole of the fan and is used for sucking hot air on the surface of the radiator into the cavity provided with the fan; the heat sink and the fan are vertically installed.

In some embodiments, a second air inlet is formed in the housing at a position corresponding to the light source assembly, and the second air inlet is communicated with a space air path of the heat dissipation surface of the light source assembly; the second air inlet, the space of the heat dissipation surface of the light source component, the cavity for installing the fan, the air outlet channel and the air outlet are communicated through air passages to form an air-cooling heat dissipation channel of the light source component;

the second air inlet sucks cold air to the surface of the light source component through the work of the starting fan, the heat on the surface of the light source component is taken away to form hot air, the hot air is discharged from the air outlet channel and the air outlet through the fan, and therefore the air cooling heat dissipation of the light source component is achieved.

In some embodiments, the light source assembly is externally covered with a wind scooper, and a space between the wind scooper and the light source assembly forms a wind cooling cavity for heat dissipation of the light source assembly; the air cooling cavity is used as a space of a heat dissipation surface of the light source component; the air cooling cavity is communicated with the cavity body provided with the fan through an air path and is also communicated with the air path between the second air inlets; the light source component is arranged on the light source bracket; the light source bracket is arranged in the shell and is positioned behind the hair removal working head; at least one ventilation pipeline is arranged in the light source support and communicated with the space between the second air inlet and the heat dissipation surface of the light source component.

In some embodiments, the light source assembly includes a light source and a reflector cup disposed outside the light source; the air cooling cavity is a space defined between the air guide cover and the light reflecting cup of the light source; the light reflecting cup is made of heat conducting materials; the shape and the size of the wind scooper are matched with those of the reflecting cup and are arranged close to the outer surface of the reflecting cup; one side of the wind guide cover is covered outside the reflecting cup and is in a horn shape, and the other side of the wind guide cover is provided with a hollow connecting end; the hollow connecting end is communicated with the air cooling cavity and is also communicated with the air passage of the cavity for installing the fan; the light source bracket is respectively provided with a wind shielding piece to shield two ends of the light source component; the wind shielding piece is obliquely arranged towards the surface of the reflecting cup and is used for guiding cold wind sucked by the second air inlet to the surface of the reflecting cup; the wind shield is also used for shielding light to avoid light leakage; at least one ventilation pipeline is respectively arranged in the upper part and the lower part of the light source bracket, and correspondingly, at least one second air inlet is respectively arranged at the position of the upper shell and the lower shell corresponding to the light source component.

In some embodiments, the wind scooper is coupled to a seal; one side of the sealing element is provided with an air guide connecting pipe; one end of the air guide connecting pipe is communicated with the hollow connecting end of the air guide cover so as to be communicated with the air passage of the air cooling cavity; the other end of the air guide connecting pipe is connected with the cavity for installing the fan in an air path communication way; the other side of the sealing element is provided with an annular sealing ring which is arranged at the outer edge of an air inlet hole of the fan to prevent lateral air leakage; the outer side of the annular sealing ring is further provided with another annular sealing ring which is arranged at the edge of the tail end of the air outlet channel to prevent lateral air leakage; the cavity for installing the fan is buckled with a pressing plate to fix the fan in the cavity; the pressing plate is provided with an opening which is aligned with the opening of the fan shell to form an air inlet of the fan.

In some embodiments, the epilation working head is provided with a semiconductor refrigeration piece as an epilation working surface; the semiconductor refrigerating sheet comprises a semiconductor couple layer, and a hot surface and a cold surface at two ends of the semiconductor couple layer; the semiconductor refrigerating sheet adopts transparent crystals as a cold surface directly and as a depilating working surface of a skin contact surface; the semiconductor refrigerating sheet is provided with a light transmitting area; the light-transmitting region is provided by the transparent crystal; performing a depilation treatment by controlling a light source assembly to generate pulsed light to be transmitted from a light-transmitting area of the semiconductor chilling plate to a contacted skin; the radiator is used for radiating heat of the hot surface of the semiconductor refrigerating sheet.

In some embodiments, the heat dissipation assembly comprises a heat pipe, and the heat pipe conducts the heat of the hot surface to a heat sink to dissipate heat together; the heat pipe is directly contacted with the hot surface or is contacted with the hot surface through a heat conducting piece; one end or one side of the heat conducting piece or the heat pipe is matched with the shape of the hot surface of the semiconductor refrigerating sheet and is in contact with the hot surface of the semiconductor refrigerating sheet in a mutually attached manner; the heat pipe is arranged on the surface or inside the radiator; the heat pipe has a refrigerant circulating therein.

In some embodiments, the epilation working head is equipped with at least two sensors for detecting whether the epilation working surface is completely or almost completely covered by skin to activate or deactivate the light source; wherein, the two sensors are arranged on the diagonal line or the position close to the diagonal line of the edge of the depilating working surface; the epilating apparatus further comprises a power supply unit; the light source assembly is electrically connected with the power supply unit; the power supply unit is a capacitor or a power supply conversion module; the fan is electrically connected with the control circuit board.

The utility model has the advantages that:

the utility model discloses an appearance that moults has improved air intake, air outlet and radiator unit, utilizes the fan to form stronger negative pressure for cold wind inhales with hot-blast exhaust speed and discharge amount, improves the radiating effect greatly.

Furthermore, the working head of the depilating device adopts the semiconductor refrigeration sheet as the working surface, the heat pipe and the radiator are used for radiating heat of the hot surface of the semiconductor refrigeration sheet, the arrangement of an air inlet and an air outlet on the shell corresponding to the radiator is improved, the fan is used for discharging hot air on the surface of the radiator, the radiating efficiency is improved, the temperature of the cold surface can reach below the freezing point, and the user experience is good. Due to the improvement of refrigeration and heat dissipation efficiency, the pulse light intensity of the depilating instrument can be adjusted, and the depilating efficiency and effect are improved.

The present application is described in further detail below with reference to the attached figures.

Drawings

Fig. 1 is a perspective view of a depilating apparatus in accordance with an embodiment of the present application.

Fig. 2 is a perspective view of an alternate perspective of an epilating apparatus in accordance with an embodiment of the application.

Fig. 3 is an exploded view of the epilator in accordance with the embodiment of the application, from the perspective shown in fig. 2.

Fig. 4 is a sectional view of the internal structure of an epilating apparatus in an embodiment of the application.

Fig. 5 is a perspective view of an epilating apparatus in accordance with an embodiment of the application with a part of the housing removed.

Fig. 6 is a schematic view of a light source assembly structure and an air-cooling heat dissipation channel of a depilating apparatus in an embodiment of the present application.

Fig. 7 is a cross-sectional view of an epilating apparatus and an air-cooled heat dissipation channel of a heat sink according to an embodiment of the present application.

Fig. 8 is an exploded view of a heat dissipation structure of a semiconductor cooling fin according to the first embodiment of the present application.

Fig. 9 is a schematic view of a heat dissipation structure of a semiconductor cooling fin according to a first embodiment of the present application.

Fig. 10 is a perspective view of a semiconductor chilling plate according to the first embodiment of the present application.

Fig. 11 is an exploded view of a semiconductor chilling plate according to the first embodiment of the present application.

Fig. 12 is a front view of a semiconductor chilling plate according to the first embodiment of the present application.

Fig. 13 is a side view of a semiconductor chilling plate according to the first embodiment of the present application.

Fig. 14 is a perspective view of a cooling surface of a semiconductor cooling plate according to the first embodiment of the present application.

Fig. 15 is a perspective view of a semiconductor chilling plate according to a second embodiment of the present application.

Fig. 16(a) to 16(f) are schematic views of a heat dissipation structure of a semiconductor cooling fin according to a second embodiment of the present application.

Fig. 17 is a perspective view of a semiconductor chilling plate according to a third embodiment of the present application.

Fig. 18(a) to 18(f) are schematic views of heat dissipation structures of semiconductor cooling fins according to a third embodiment of the present application.

Fig. 19 is a perspective view of a semiconductor chilling plate according to a fourth embodiment of the present application.

Fig. 20(a) to 20(h) are schematic views of a heat dissipation structure of a semiconductor cooling fin according to a fourth embodiment of the present application.

Fig. 21 is a perspective view of a semiconductor chilling plate according to a fifth embodiment of the present application.

Fig. 22(a) to 22((h) are schematic views of heat dissipation structures of semiconductor cooling fins according to a fifth embodiment of the present application.

Detailed Description

It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict, and the present application is further described in detail with reference to the accompanying drawings and specific embodiments.

Referring to fig. 1-7, the present application relates to an epilating apparatus 1000 comprising an epilating work head, a heat dissipation assembly 2, a light source assembly 3, a power supply unit 4, a control circuit board 5, and the like. The heat sink assembly 2, the light source assembly 3, the power supply unit 4 and the control circuit board 5 are mounted within a housing 6 of the epilating apparatus. The control circuit board 5 is electrically connected with the light source assembly 3 and the power supply unit 4 to control the light source to generate pulsed light for depilating work. The power supply unit 4 is used to supply power to the light source assembly 3. The appearance 1000 that moults working head portion installs the refrigeration piece as the working face that moults, and control circuit board 5 controls power supply unit 4 and starts the work of light source subassembly 3 and produce the pulsed light, and the pulsed light pierces through the working face that moults is mouled and is handled. The heat dissipation assembly 2 is connected with the refrigerating sheet 1 and used for refrigerating the refrigerating sheet 1. The housing 6 is provided with a first air inlet 60 and an air outlet 66. The depilation instrument 1000 may also be provided with a power supply line and/or a charging interface for connection to an external power supply.

The heat radiation module 2 includes a heat pipe 21, a heat sink 23 connected to the heat pipe, and a fan 25. The heat pipe 21 is connected with the refrigerating sheet 1, so as to conduct the heat generated by the refrigerating sheet 1 to the heat dissipation assembly 2 for heat dissipation. The fan 25 is installed in a cavity 28, one side of the cavity 28 extends to form an air outlet channel 280, and the end of the air outlet channel 280 is connected to the air outlet 66.

The air passages among the first air inlet 60, the space on the surface of the radiator, the cavity 28 for installing the fan, the air outlet channel 280 and the air outlet 66 are communicated to form an air-cooling heat dissipation channel (an arrow in fig. 4) of the radiator, namely a first air-cooling heat dissipation passage; by starting the fan to work, the first air inlet 60 sucks cold air to the surface of the radiator 23 to take away heat, and the fan 25 discharges the hot air to the outside of the air outlet channel 280 and the air outlet 66, so that air-cooled heat dissipation of the radiator is realized. The fan 25 is electrically connected to the control circuit board 5, and its operation is controlled by the control circuit board 5.

The refrigeration piece 1 arranged on the hair removal working head can adopt the refrigeration piece suitable for the prior art as a hair removal working surface at the same time, and the refrigeration piece is refrigerated by the heat dissipation assembly 2. In some embodiments, the cooling plate 1 mounted in the epilation working head comprises a semiconductor cooling plate, which is used to cool the working surface so as to form the cooling surface for working. As a preferred embodiment, the unhairing working head directly adopts the cold surface of the semiconductor refrigeration piece 1 as the working surface. The semiconductor cooling plate 1 uses transparent crystals directly as the cooling surface 10 and at the same time as the epilation surface for the skin contact surface, see in particular below. The heat pipe 21 is connected with the hot surface 12 of the semiconductor chilling plate 1, so that the heat of the semiconductor chilling plate 1 is conducted from the hot surface 12 to the heat dissipation assembly 2 for heat dissipation.

The housing 6 comprises an upper shell 61 and a lower shell 62 (in a top-bottom orientation, for convenience of description only) and a depilating work head housing 63. The upper casing 61 and/or the lower casing 62 have second air inlets 65 at positions corresponding to the light source assembly 3, and preferably, the upper and lower casings have the second air inlets 65. The second air inlet 65 is communicated with a space air passage of the heat dissipation surface of the light source assembly 3, and is used for sucking cold air (cold air) from the outside inwards to perform air cooling heat dissipation on the light source assembly 3.

The lower case 62 is provided with an opening 69, and the heat sink 23 is located at a position behind the opening; the outer side of the opening 69 is covered with a baffle plate 64, and the baffle plate 64 is buckled on the opening 69 of the lower shell. The baffle is provided with air holes 68, and the air holes 68 can be one group or a plurality of groups of through holes which are densely arranged. The air holes 68 are used for communicating the external environment with the air passage inside the housing, specifically, the air passage in the space on the surface of the heat sink, and are used for sucking the ambient cold air into the surface of the heat sink 23 for air cooling and heat dissipation.

The gap between the edge of the baffle plate 64 and the edge of the lower shell opening 69 is used as an air outlet 66 and a lateral air inlet 67, the air outlet 66 is connected with the tail end of the air outlet channel 280 of the cavity 28, and the lateral air inlet 67 is used for forming lateral air inlet on the surface of the radiator. As shown in fig. 1 and 7, a gap is formed between the baffle 64 and the peripheral edge of the opening 69 of the lower shell 62, wherein a gap between one side edge forms an air outlet 66, gaps between the other edges form a lateral air inlet 67, and the lateral air inlet 67 is communicated with an air passage on the surface of the heat sink 23 behind the lower shell 62, and is used for laterally feeding air to the surface of the heat sink 23, thereby increasing the amount and speed of feeding cold air. The lateral air inlet can also effectively avoid that the control circuit board 5 is easily eroded by water mist or water drops formed by the front air inlet mode of the lower shell. The air holes 68 on the shell are used for feeding air in the positive direction and are combined with the lateral air inlets 67 for feeding air in the lateral direction, so that multidirectional air feeding is formed to cool and radiate the surface of the radiator in an air cooling mode, and radiating efficiency is improved. The first air inlet 60 is used for introducing cold air to the surface of the radiator, and preferably comprises a lateral air inlet 67 formed by a gap between the baffle plate 64 and the edge of the opening of the lower shell, and one or more groups of air holes 68 on the baffle plate. In other embodiments, the first air inlet 60 is not limited to the lateral air inlet 67 and the air hole 68.

The upper case 61 is equipped with keys or a key sheet. The control circuit board 5 is mounted on the inner side of the upper case 61.

The light source assembly 3 includes a light source 31 and a reflector 32 covering the light source. When the light source 31 is powered on, pulsed light is generated, the control circuit board 5 controls the power supply unit 4 to supply power to the light source, and the pulsed light is transmitted from the light source component to the depilating head to act on the surface of the skin, so that ablation and depilation are performed. The heat generated by the operation of the light source assembly 3 is dissipated by the heat dissipating assembly 2. The light reflecting cup 32 is made of a heat conducting material, and heat generated by the light source 31 is conducted to the light reflecting cup 32 to dissipate heat. The light source 31 may be a lamp tube. The power supply unit 4 may adopt a capacitor or a power supply conversion module.

Light source subassembly 3 installs on light source support 7, and light source support 7 installs in casing 6 and is located the rear of the work head that moults, and the work head that moults is connected by mirror surface cover 71 with light source support 7 between, and the pulsed light that light source subassembly 3 produced transmits to the work head that moults through in the mirror surface cover 71 and carries out the processing of mouling. Both ends of the light source assembly 3 are mounted on the light source bracket 7, and the light source bracket 7 is respectively provided with a wind shielding piece 72 (figure 6) to shield both ends of the light source assembly; the wind shielding member 72 is disposed obliquely toward the surface of the light source reflecting cup 32 so as to guide the cool wind sucked from the second wind inlet 65 toward the surface of the reflecting cup for heat dissipation. The wind shielding piece 72 is used for guiding cold wind and shielding light, so that light leakage at two installation ends of the light source assembly is avoided. The wind deflector 72 may be plate-shaped with the plate surface inclined to the surface of the reflector cup 32. The wind shield 72 may also be a gland sleeve, which is sleeved outside the two ends of the light source assembly.

At least one ventilation pipeline 70 is arranged in the light source bracket 7, and each ventilation pipeline 70 is communicated with the surface of the light reflecting cup of the light source from the second air inlet 65 up and down and is communicated with the space on the surface of the light source component, namely, the air passage of the air cooling cavity 33. The end of the ventilation pipeline 70 is communicated with the second air inlet 65 arranged on the housing, and the cold air sucked by the second air inlet 65 is guided to the surface of the light source component for heat dissipation. Preferably, at least one ventilation pipeline 70 is respectively disposed in the upper and lower portions of the light source bracket 7, and correspondingly, the second air inlet 65 is disposed at a corresponding position of the upper and

lower housings

61, 62 and connected to the ventilation pipeline 70.

The light source assembly 3 and the mirror cover 71 are mounted on the light source bracket 7, and gaskets 73 are respectively sleeved on the peripheries of the outer portions of the light source assembly 3 and the mirror cover 71 and used for mounting and fixing and preventing light leakage.

In this embodiment, the light source assembly 3 is covered with an air guiding cover 30, and an air cooling cavity 33 for dissipating heat of the light source assembly is formed in a space between the air guiding cover 30 and the surface of the light source assembly 3. The air-cooling chamber 33 corresponds to the space of the surface of the light source assembly. The air cooling cavity 33 is in air path communication with a ventilation pipeline 70 arranged in the light source bracket 7, and further in air path communication with a second air inlet 65 arranged on the shell 6. The air passage between the air cooling cavity 33 and the cavity 28 for installing the fan is through. An air-cooling chamber 33 surrounds the light source assembly 3. Specifically, the inner side of the air guiding cover 30 is covered outside the light reflecting cup 32 of the light source, the air cooling cavity 33 is a space defined between the air guiding cover 30 and the surface of the light reflecting cup 32 of the light source, and cold air sucked into the air cooling cavity dissipates heat to the light reflecting cup 32 of the light source. The shape and size of the wind scooper 30 are matched with the light source reflection cup 32 and are installed close to the outer wall of the light source reflection cup to limit the air cooling chamber 33, and the configuration mode is to reduce the height of the gap and maximize the surface area of the opposite surface, so that a stronger negative pressure can be formed in the air cooling chamber 33 when the fan is started, and the strength of cold air sucked by the second air inlet 65 is improved. Preferably, one side of the wind scooper 30 is covered outside the reflector 32 and is shaped like a horn, and the other side is provided with a hollow connecting end 34. The trumpet-shaped edge is clamped and arranged on the light source bracket 7. The hollow connecting end 34 is communicated with the air cooling cavity 33 and is also communicated with the air path of the cavity 28; the width of the hollow connecting ends 34 maximizes the space available on the surface of the heat sink and may be in the form of a flat mouth.

The second air inlet 65 on the housing 6, the space on the surface of the light source assembly, i.e. the air cooling cavity 33, the cavity 28 for mounting the fan, the air outlet channel 280 and the air outlet 66 are communicated with each other through air passages to form an air cooling heat dissipation channel, i.e. a second air cooling heat dissipation passage, of the light source assembly 3. Through the work of the start fan 25, the cold air is sucked from the second air inlet 65 to the surface of the light source assembly, the heat on the surface of the light source assembly is taken away to form hot air, the hot air is sucked into the cavity 28 and is discharged to the air outlet channel 280 by the fan, and finally, the hot air is discharged from the air outlet 66, so that the air-cooled heat dissipation of the light source assembly 3 is realized.

The sealing member 8 is connected to the outside of the wind scooper 30. One side of the sealing element 8 is provided with an air guide connecting pipe 81; one end of the connecting pipe 81 is connected with the hollow connecting end 34 of the wind scooper 30 so as to be communicated with the air cooling cavity 33; the other end of the connecting pipe 81 is connected to the cavity 28 and the air path is communicated. The other side of the sealing member 8 forms an annular sealing ring 82, and the annular sealing ring 82 is installed at the edge of the air inlet hole at one end of the fan 25 to prevent lateral air leakage. The outside of the annular sealing ring 82 of the sealing member 8 is further formed with another annular sealing ring 83. The other annular sealing ring 83 is mounted at the edge of the tail end of the air outlet channel 280 of the cavity 28 to prevent lateral air leakage.

The cavity 28 is an annular cavity, and is fastened with the pressing plate 29 to fix the fan 25 in the cavity. One side of the cavity 28 extends obliquely towards the air outlet 66 to form an oblique air outlet channel 280, which can prevent air from flowing backwards. The air outlet channel 280 is communicated with the air passage inside the cavity 28. The central opening of the pressure plate 29 is aligned with the opening of the fan housing to form the air inlet opening of the fan. The annular sealing ring 83 of the sealing element is mounted on the opening of the pressure plate to prevent lateral air leakage.

Referring to fig. 8-14 together, the semiconductor cooling plate provided in the first embodiment of the present application, as the cooling plate 1 mounted on the epilation working head, is used as the epilation working surface to contact with the skin. The semiconductor refrigerating plate 1 uses transparent crystal as the cold surface 10 directly and as the depilating surface of the skin contacting surface. The heat pipe 21 of the heat dissipation assembly 2 is connected with the hot surface 12 of the semiconductor refrigeration piece 1, and the heat of the semiconductor refrigeration piece 1 is conducted from the hot surface 12 to the heat dissipation assembly 2 for heat dissipation. The semiconductor cooling plate 1 is fixedly assembled by the epilating work head housing 63. The working head housing 63 is assembled with the front ends of the upper and

lower housings

61, 62 and with the light source holder 7 in a clamping manner, and the working head housing 63 can be further assembled with the upper and

lower housings

61, 62 and the light source holder 7 by fasteners such as screws, positioning posts or snap structures.

The semiconductor refrigerating sheet 1 is electrically connected with the control circuit board 5 and the power supply unit 4. The control circuit board 5 controls the light source assembly 3 to work to generate pulsed light to penetrate through the semiconductor chilling plate 1 for depilation operation. The control circuit board 5 can also be used for controlling the semiconductor refrigerating sheet 1 to perform refrigerating work. It can be understood that the semiconductor refrigeration sheet 1 can also be provided with an independent power supply or an independent control circuit board to independently control the semiconductor refrigeration sheet 1 to work.

One end of the heat pipe 21 is provided with a heat conducting piece 22, the heat conducting piece 22 is attached to the hot surface 12 of the semiconductor refrigerating sheet 1, and the heat conducting piece 22 is used for conducting the heat of the hot surface 12 of the semiconductor refrigerating sheet to the heat pipe 21 through the heat conducting piece 22 and dissipating the heat through the heat pipe 21 and the radiator 23. The heat sink 23 is a fin heat sink.

The heat conducting member 22 is generally a metal member, preferably copper, and the shape of the heat conducting member 22 is adapted to the shape of the hot surface 12 of the semiconductor chilling plate 1 and is in contact with the hot surface 12 of the semiconductor chilling plate 1 for fast heat transfer. The heat pipe 21 has a refrigerant circulating therein, and is fixed to the surface or the inside of the fin radiator 23. The heat pipe 21 is preferably a copper pipe. One end of the heat pipe 21 connected with the semiconductor refrigerating sheet 1 is wound to form a ring 24, and the shape and the size of the ring 24 are matched with those of the hot surface of the semiconductor refrigerating sheet 1. The ring 24 of the heat pipe 21 is in accordance with the outline of the heat conducting member 22, and the heat conducting member 22 and the ring 24 of the heat pipe 21 are sleeved and attached to each other in a ring shape. The heat conducting member 22 and the ring 24 of the heat pipe may be welded to form a ring-shaped joint, so that heat can be rapidly transferred to the heat pipe 21. In this embodiment, the heat-conducting member 22 is a metal ring. The ring 24 of the heat pipe 21 absorbs heat, and the refrigerant inside absorbs heat and evaporates, then flows to one end of the radiator 23, is cooled by the radiator after being cooled by condensation, and then circularly flows back to the ring section to continuously absorb heat.

The fan 25 of the heat sink assembly cooperates with the fin radiator 23 to enhance the discharge of hot air from the surface of the fin radiator 23. The radiator 23 and the fan 25 are arranged up and down, and the air path is communicated. The finned radiator 23 is installed inside the casing and behind the baffle plate 64 of the lower casing, and the air holes 68 opened on the baffle plate 64 and the lateral air inlets 67 formed on the periphery are communicated with the heat dissipation air ducts of the fins on the surface of the radiator 23. The air channels on the surfaces of the fins are communicated with the cavity 28, so that the hot air on the surfaces of the fins is sucked into the air inlet holes of the fan, and is exhausted from the air outlet 66 after being exhausted to the air outlet channel 280 by the fan. The fin radiator 23 is installed at one end of the air inlet hole of the fan 25, and the pressing plate 29 and the sealing member 8 are located between the fin radiator 23 and the fan 25.

In this embodiment, the fan 25 and the cavity 28 are used for both the heat dissipation of the light source module 3 and the heat dissipation process of the heat sink 23 of the semiconductor cooling fins, so as to draw in cold air (cold air) and discharge hot air (hot air). Specifically, the fan 25 is started, negative pressure is generated in the cavity 28, ambient cold air is sucked from the second air inlet 65 and the first air inlet 60 (i.e., the lateral air inlet 67/the air hole 68) respectively, the cold air sucked from the second air inlet 65 enters the air cooling cavity 33 on the surface of the lamp assembly, takes away heat on the surface of the lamp assembly, changes the heat into hot air, and then is sucked into the cavity 28, the cold air sucked from the air inlet 67/the air hole 68 absorbs heat on the surface of the heat sink, changes the heat into hot air, and then is sucked into the cavity 28, and finally the hot air is discharged to the air outlet channel 280 by the fan 25, and then is discharged to the external environment through the air outlet 66, so that heat dissipation of the lamp assembly 3 and heat dissipation of the heat sink 23 are realized, and the heat.

The semiconductor chilling plate 1 of the embodiment of the application comprises a cold surface 10, a semiconductor couple layer 11 formed by connecting a semiconductor couple through a metal conductor and a hot surface 12. A semiconductor couple layer 11 is located between the cold side 10 and the hot side 12. The cold surface 10 of the semiconductor refrigeration piece is formed by transparent crystals, so that a transparent crystal cold surface is formed; the inner surface of the transparent crystal cold surface 10 is fixedly connected with the metal conductor of the semiconductor electric double layer 11. The hot surface 12 of the semiconductor refrigeration sheet is composed of a ceramic substrate, and the inner side surface of the ceramic substrate is fixedly connected with the metal conductor of the semiconductor couple layer 11. The semiconductor refrigerating sheet 1 is formed by sandwiching a semiconductor electric double layer 11 between a ceramic substrate hot surface 12 and a transparent crystal cold surface 10. Positive and negative electrodes 113 are connected to the ends of the semiconductor couple layer 11. The transparent crystal is a transparent material with high light transmittance, high thermal conductivity and high heat resistance, such as natural spar or gem.

The fixed connection between the semiconductor couple layer 11 and the cold surface 10 of the transparent crystal and the hot surface 12 of the ceramic substrate can be realized by a mode applicable in the prior art. For example, the inner surfaces of the cold surface 10 of the transparent crystal and the hot surface 12 of the ceramic substrate are metallized, and then welded to the metal conductor of the semiconductor couple layer 11 to form a welded structure. Or, the semiconductor couple layer 11, the transparent crystal cold surface 10 and the ceramic substrate hot surface 12 are bonded by the heat conducting glue to form bonding fixation.

In this embodiment, the semiconductor couple layer 11 is ring-shaped, and its ring-shaped region 111 is used for arranging electronic components, and its inner hollow region 112 is used for light penetration. The semiconductor couple layer 11 is internally provided with an integral circuit which is connected with an NP semiconductor couple by a metal conductor, and when direct current passes through a couple formed by connecting N, P two different semiconductor materials in series, heat transfer can be generated between two ends by utilizing the Peltier effect of the semiconductor materials, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. The cold end adopts transparent crystal to form the cold face of semiconductor refrigeration piece, and the hot end still adopts ceramic substrate to form hot face 12 of semiconductor refrigeration piece, can also adopt other suitable materials as the hot face certainly.

The hot side 12 of the ceramic substrate is adapted in shape and size to the semiconductor couple layer 11, for example, also in the shape of a ring, the ring-shaped area 121 acting as a heat sink, and the hollow area 122 inside for light to penetrate. The ring shape of the hot surface 12 of the ceramic substrate is attached to the ring shape of the semiconductor electric double layer 11 in a matching way, so that the rapid heat dissipation is facilitated. The hot surface 12 of the ceramic substrate is communicated with the hollow inner area of the semiconductor couple layer 11, and the edges are aligned.

The transparent crystal cold surface 10 covers the whole surface of the semiconductor couple layer 11, so that whole surface refrigeration is formed. The transparent crystal cold face 10 is a whole or whole crystal with continuous surface. Preferably, the thickness of the cold face of transparent crystal is no less than 1mm to improve the intensity of semiconductor refrigeration piece 1, reduce the damage risk of assembly, increase of service life. The transparent crystal material of the embodiment has high light transmittance and high heat conductivity coefficient, so that pulsed light penetrates through the transparent crystal to perform unhairing operation, and the high heat conductivity coefficient is favorable for improving the refrigeration efficiency and the effect.

The middle region of the transparent crystal cold surface 10 is a light transmission region 102, and the peripheral annular region 101 is attached to the semiconductor electric double layer 11 in a matching manner. Accordingly, the transparent region 102 of the cold surface of the transparent crystal is covered on the inner hollow region 112 of the semiconductor electric double layer 11, so that the hollow region is covered and light can penetrate through the hollow region. The whole refrigerating area of the transparent crystal cold surface 10 comprises a light-transmitting area 102 and an annular area 101 at the periphery of the light-transmitting area. The whole surface of the crystal is refrigerated, so that the refrigerating area is increased, and the experience feeling is better.

Referring to fig. 12, the surface of the annular region 101 of the transparent crystal cold side 10 is subjected to a light shielding treatment to form an annular light shielding region (shaded portion in fig. 12) for shielding the electronic components inside. Specifically, the shading treatment may be to plate a shading film on one or both sides of the transparent crystal, and then remove the shading film at the corresponding position of the middle light-transmitting region; or, directly printing a shielding layer on the annular area of the transparent crystal, and keeping the light-transmitting area clear. The shading area is formed by carrying out surface treatment on the cold surface 10 of the transparent crystal, can be treated on the double surfaces or any single surface of the crystal, and can be treated by adopting the modes of coating, spraying, printing and the like.

The peripheral edge of the transparent crystal cold face 10 may be further processed to form an assembly site 103 (see fig. 13) for secure assembly with an external housing, such as an epilation working head housing. In a more specific example, the mounting location 103 may be a beveled edge or stepped surface that forms a snap fit with the working head housing 63.

In other embodiments, the semiconductor chilling plate 1 comprises a semiconductor electric double layer 11 and a hot surface 12 and a cold surface 10 at two ends of the semiconductor electric double layer. The cold side 10 is made of transparent crystals to form a transparent crystal cold side. One or more groups of the semiconductor electric double layers 11 and the hot surface 12 fixedly connected with the semiconductor electric double layers are fixedly connected to the surface of the transparent crystal. The semiconductor cooling plate has a light transmissive region 102, the light transmissive region 102 being provided by the transparent crystal.

The one or more groups of semiconductor electric double layers and the hot surface fixedly connected with the semiconductor electric double layers are arranged on one side, two opposite sides or multiple sides of the transparent crystal.

Referring to fig. 15, in the semiconductor chilling plate 1 according to the second embodiment of the present application, the chilling surface 10 is a square (not limited to a square) transparent crystal, and a set of semiconductor electric double layers 11 and a hot surface 12 fixedly connected to the semiconductor electric double layers are disposed on one side surface, for example, the left side surface, of the transparent crystal. The semiconductor electric double layer 11 is provided with a pair of electrodes (not shown). Two other pairs of surfaces of the transparent crystal, such as the front and back (or upper and lower) surfaces, may be used as light transmissive regions 102 for pulsed light transmission for depilatory treatment. In a specific example, the hot side 12 of the semiconductor cooling plate is formed of a ceramic substrate to form a ceramic substrate hot side. The inner surface of the ceramic substrate is fixedly connected to the metal conductor of the semiconductor couple layer 11. A semiconductor couple layer 11 is sandwiched between the ceramic substrate hot face 12 and the transparent crystal cold face 10. The hot surface 12 and the transparent crystal cold surface 10 are respectively attached and fixed to two opposite sides of the semiconductor electric double layer 11. The transparent crystal cold surface 10 covers the whole surface of the semiconductor couple layer 11 so as to form whole surface refrigeration.

With further reference to fig. 16(a) to 16(f), the semiconductor cooling plate 1 of the second embodiment of the present application is connected to the heat dissipation assembly 2, and the heat of the semiconductor cooling plate is conducted from the heat-generating surface 12 to the heat dissipation assembly for heat dissipation. The heat radiation module 2 includes a heat pipe 21 and a heat sink 23 connected to the heat pipe 21. The heat pipe is installed on the surface or inside the radiator. The heat pipe 21 is in direct contact with the hot side 12 of the semiconductor chilling plate 1 or in contact with the hot side through a heat conducting member. In this embodiment, one end 26 of the heat pipe is adapted to the shape of the hot surface 12 of the semiconductor chilling plate, and is in contact with each other; to facilitate a close contact between the end 26 of the heat pipe and the hot side 12, the end of the heat pipe 21 may be bent, for example, in an L-shape as shown in the drawings. The heat pipe 21 may be a capillary copper pipe having a refrigerant circulating therein. The radiator is one or a combination of a plurality of fin radiators, radiating fins or heat conducting plates. In the various heat sink structures shown in the figures, the heat sink 23 shown in fig. 16(a) and 16(e) is a heat sink, for example, one or more sets of heat sinks are arranged in parallel, and the heat pipe 21 is inserted and fixed in the parallel heat sinks. The heat sink 23 in fig. 16(b), 16(c), 16(d), and 16(f) includes a heat conductive plate 230 and a set of parallel fins 231 fixed to one side surface of the heat conductive plate 230. One end 26 of the heat pipe 21 is bent to contact with the hot surface 12 of the semiconductor chilling plate, and may have the same shape and size, and the heat pipe 21 is fixed on the other side surface of the heat conducting plate 230, or is inserted into or on the surface of one or more sets of parallel heat dissipation fins 231. The heat sink may be made of a metal sheet having high thermal conductivity.

Referring to fig. 17, in the semiconductor chilling plate 1 according to the third embodiment of the present application, the chilling surface 10 is a square (not limited to a square) transparent crystal, and a group of semiconductor electric double layers 11 and a hot surface 12 fixedly connected to the semiconductor electric double layers are respectively disposed on opposite side surfaces, for example, left and right sides, of the transparent crystal. Each semiconductor electric double layer 11 is provided with a pair of electrodes (not shown). Two other pairs of surfaces of the transparent crystal, such as the front and back surfaces (or upper and lower surfaces), may be used as the light-transmitting regions 102 for pulsed light transmission for depilatory treatment. In a specific example, the hot faces 12 of the two semiconductor chilling plates are formed by ceramic substrates to form ceramic substrate hot faces. The inner surface of each ceramic substrate is fixedly connected with the metal conductor of the corresponding semiconductor galvanic couple layer 11. A semiconductor couple layer 11 is sandwiched between the hot side 12 of the ceramic substrate and the side of the transparent crystal cold side 10. The left and right surfaces of the two hot surfaces 12 and the transparent crystal cold surface 10 are respectively attached and fixed to the two opposite side surfaces of the corresponding semiconductor couple layer 11. The two side surfaces of the transparent crystal cold surface 10 are respectively covered with the whole surface of a corresponding semiconductor couple layer 11 so as to form whole surface refrigeration.

With further reference to fig. 18(a) to 18(f), the semiconductor cooling plate 1 of the third embodiment of the present application is connected to the heat dissipation assembly 2, and the heat of the semiconductor cooling plate is conducted from the heat-generating surface 12 to the heat dissipation assembly for heat dissipation. In this embodiment, the heat dissipation assembly 2 includes two heat pipes 21 and a heat sink 23 connected to the heat pipes 21. The heat pipe is installed on the surface or inside the radiator. The heat pipe 21 is in direct contact with the hot side 12 of the semiconductor chilling plate 1 or in contact with the hot side through a heat conducting member. For example, one end 26 of each heat pipe is matched with the shape of the hot surface 12 of the semiconductor chilling plate, and the heat pipes are in contact with each other; to facilitate close contact between the end 26 of the heat pipe and the hot side 12, the end of the heat pipe 21 may be bent as desired, as shown in the drawings, and the bent portions are designed in L-shape. The heat pipe 21 may be a capillary copper pipe having a refrigerant circulating therein. The radiator is one or a combination of a plurality of fin radiators, radiating fins or heat conducting plates. In the various heat sink structures shown in the figures, the heat sink 23 shown in fig. 18(a) and 18(e) is one or more sets of parallel heat dissipation fins, and the two heat pipes 21 are inserted and fixed in the one or more sets of parallel heat dissipation fins. The heat sink 23 in fig. 18(b), 18(c), 18(d) and 18(f) includes a heat conductive plate 230 and a set of parallel fins 231 fixed to one side surface of the heat conductive plate 230. One end 26 of each heat pipe 21 is bent and then attached to and contacted with one hot surface 12 of the semiconductor chilling plate, the shape and the size of the heat pipe 21 are consistent, and the heat pipe 21 is fixed on the other side surface of the heat conducting plate 230 or is arranged in or on the surface of a group of parallel radiating fins 231 in a penetrating mode. The heat sink may be made of a metal sheet having high thermal conductivity. The heat conductive plate 230 may be provided in two pieces for fixing one heat pipe 21, respectively.

Referring to fig. 19, in a semiconductor chilling plate 1 according to the fourth embodiment of the present application, a chilling surface 10 is a square (not limited to a square) transparent crystal, and a set of semiconductor electric double layers 11 and a hot surface 12 fixedly connected to the semiconductor electric double layers are disposed on one side surface, for example, an upper surface, of the transparent crystal. The semiconductor electric double layer 11 is provided with a pair of electrodes (not shown). Two other pairs of surfaces of the transparent crystal, e.g., front and back (or left and right) surfaces, may be used as the light-transmitting regions 102 for pulsed light transmission for depilatory treatment. In a specific example, the hot surface 12 of the semiconductor cooling plate is a ceramic substrate hot surface 12. The inner surface of the hot surface 12 of the ceramic substrate and the upper surface of the transparent crystal are metalized and then welded and fixed with the metal conductor of the semiconductor galvanic couple layer 11, so that the ceramic substrate and the transparent crystal are respectively fixed on two end surfaces of the semiconductor galvanic couple layer 11. The transparent crystal cold surface 10 covers the whole surface of the semiconductor couple layer 11 so as to form whole surface refrigeration.

With further reference to fig. 20(a) to 20(h), the semiconductor cooling plate 1 of the fourth embodiment of the present application is connected to the heat dissipation assembly 2, and the heat of the semiconductor cooling plate is conducted from the heat-generating surface 12 to the heat dissipation assembly for heat dissipation. The heat radiation module 2 includes a heat pipe 21 and a heat sink 23 connected to the heat pipe 21. In the various heat sink structures shown in the figures, the heat sink 23 shown in fig. 20(a), 20(b), 20(e), and 20(f) is a set of parallel fins, and the heat pipe 21 is inserted and fixed on the parallel fins. The heat sink 23 in fig. 20(c), 20(d), 20(g) and 20(h) includes a heat conductive plate 230 and a set of parallel fins 231 fixed to one side surface of the heat conductive plate 230. One end 26 of the heat pipe 21 is in contact with the hot surface 12 of the semiconductor chilling plate, and may have the same shape and size, and the heat pipe 21 is fixed on the other side surface of the heat conducting plate 230, or is fixed in or on the surface of a set of parallel heat dissipation fins 231.

Referring to fig. 21, in a semiconductor chilling plate 1 according to a fifth embodiment of the present application, a chilling surface 10 is a square (not limited to a square) transparent crystal, and a set of semiconductor couple layers 11 and a hot surface 12 fixedly connected to the semiconductor couple layers are respectively disposed on two opposite side surfaces, for example, upper and lower surfaces, of the transparent crystal. Each semiconductor electric double layer 11 is provided with a pair of electrodes (not shown). Two other pairs of surfaces of the transparent crystal, e.g., front and back (or left and right) surfaces, may be used as the light-transmitting regions 102 for pulsed light transmission for depilatory treatment. In a specific example, the hot surfaces 12 of the two semiconductor cooling plates are the hot surfaces of the ceramic substrate, and the inner surfaces of the two semiconductor cooling plates are metalized and then welded with the corresponding metal conductors of the semiconductor galvanic couple layer 11. Two semiconductor couple layers 11 are sandwiched between a ceramic substrate hot surface 12 and the upper or lower surface of the transparent crystal cold surface 10, respectively. The upper and lower surfaces of the two hot surfaces 12 and the transparent crystal cold surface 10 are respectively bonded and fixed to the two opposite side surfaces of the corresponding semiconductor couple layer 11. Respectively covers the whole surface of the corresponding semiconductor couple layer 11 to form whole surface refrigeration.

With further reference to fig. 22(a) to 22(h), the semiconductor cooling plate 1 of the fifth embodiment of the present application is connected to the heat dissipation assembly 2, and conducts heat of the semiconductor cooling plate from the heat-radiating surface 12 to the heat dissipation assembly for heat dissipation. In this embodiment, the heat dissipation assembly 2 includes two heat pipes 21 and a heat sink 23 connected to the heat pipes 21. The heat pipe is installed on the surface or inside the radiator. One end 26 of the heat pipe is in close fitting contact with the hot side 12, and the heat pipe 21 may be L-shaped or U-shaped or other suitable shape. In the various heat sink structures shown in the figures, the heat sink 23 shown in fig. 22(a), 22(b), 22(e) and 22(g) is one or more sets of parallel fins, and two heat pipes 21 are inserted and fixed in the parallel fins. The heat sink 23 in fig. 22(c), 22(d), 22(f) and 22(h) includes a heat conductive plate 230 and a set of parallel fins 231 fixed to one side surface of the heat conductive plate 230. One end 26 of each heat pipe 21 is bent and then attached to and contacted with one hot surface 12 of the semiconductor chilling plate, and the shape and size of the heat pipe 21 are consistent, and the heat pipe 21 is fixed on the other side surface of the heat conducting plate 230 or is arranged in or on the surface of one or more groups of parallel radiating fins 231.

The semiconductor cooling plate 1 and the heat dissipation assembly 2 of the second to fifth embodiments (fig. 15 to 22 (h)) are applied to the depilating apparatus 1000 (fig. 1 to 7) of the foregoing embodiments, the semiconductor cooling plate 1 is mounted on the depilating working head of the depilating apparatus, and the active transparent crystal cooling surface is used as the depilating working surface. The heat dissipating module 2 is mounted inside the housing 6. Other structures refer to the foregoing embodiments and are not described herein.

The semiconductor refrigerating plate 1 is used as the refrigerating surface of the unhairing working head of the unhairing instrument, so that an excellent ice compress effect can be obtained, and the temperature of the refrigerating surface of the refrigerating plate can reach below an ice point. The transparent crystal can be directly contacted with the skin as a semiconductor refrigerating surface, so that the refrigerating efficiency and experience are improved to the maximum extent. The refrigeration rate loss is reduced, and the refrigeration speed is improved. Due to the improvement of refrigeration and heat dissipation efficiency, the pulse light intensity of the depilating instrument can be improved, and the depilating efficiency and effect are improved. The light-transmitting crystal is used as a semiconductor refrigerating surface, and meanwhile IPL strong pulse light can irradiate the skin through the light-transmitting area to perform depilation treatment. The refrigerating surface of the semiconductor refrigerating sheet 1 directly replaces the ceramic substrate in the prior art with transparent crystals, and the transparent crystals are directly and integrally refrigerated with the metal conductor connected with the NP semiconductor couple and can be directly contacted with the skin. The transparent crystal is directly used as the refrigerating surface of the semiconductor refrigerating sheet and the depilating working surface contacted with the skin, and has the following advantages:

1) the intermediate layer of the traditional refrigeration is eliminated, the loss of the refrigeration rate is reduced, and the refrigeration speed and efficiency are improved;

2) when the crystal is contacted with the skin or the contact surface, the whole surface of the crystal is refrigerated, so that the refrigerating area is increased, and the experience feeling is better;

3) the crystal is used as a refrigerating surface and a depilation working surface, pulsed light can directly penetrate through the transparent crystal and irradiate the skin, and the pain or discomfort caused by illumination is greatly reduced or eliminated after the light is cooled by the transparent crystal;

4) preferably, the refrigerating surface of the semiconductor refrigerating piece uses a transparent crystal with the thickness not less than 1mm, so that the strength of the semiconductor refrigerating piece can be improved, the damage risk of assembly is reduced, and the service life is prolonged.

In some embodiments, the epilating work head of the epilating apparatus 1000 is equipped with at least two sensors 9 for detecting whether the transparent crystal work surface is completely or almost completely covered by skin for activating or deactivating the light source. Wherein, two inductors 9 are arranged on the diagonal line or the position close to the diagonal line of the edge of the working surface 10 of the transparent crystal. The inductor 9 is connected with the control circuit board 5.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; the air passages can be communicated, mechanically connected or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Although embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the application, the scope of which is to be accorded the broadest interpretation so as to encompass all such modifications and alterations as is within the scope of the appended claims; the scope of the application is defined by the appended claims and equivalents thereof.

Claims

1. A depilating instrument comprises a depilating working head, a light source assembly, a heat dissipation assembly and a control circuit board; the control circuit board controls the light source assembly to generate pulse light for unhairing; the light source assembly, the heat dissipation assembly and the control circuit board are arranged inside a shell of the depilating instrument, and a first air inlet and an air outlet are formed in the shell; the method is characterized in that:

the heat dissipation assembly comprises a heat radiator and a fan;

the fan is arranged in a cavity, an air path at one side of the cavity extends through to form an air outlet channel, and the tail end of the air outlet channel is communicated with the air outlet;

the air passages among the first air inlet, the space on the surface of the radiator, the cavity for installing the fan, the air outlet channel and the air outlet are communicated to form an air-cooling radiating channel of the radiator; the fan is started to work to suck cold air to carry out air cooling heat dissipation on the radiator.

2. An epilating apparatus as claimed in claim 1, characterized in that:

one side of the cavity extends towards the air outlet in an inclined manner to form an inclined air outlet channel;

the shell is provided with an opening, and the radiator is arranged in the shell and is positioned behind the opening; the outer side of the opening is covered with a baffle plate; a gap is reserved between the baffle and the edge of the opening of the shell; the gap forms a lateral air inlet on the surface of the radiator; one or more groups of air holes are arranged on the baffle; the first air inlet comprises a lateral air inlet formed by the gap and/or one or more groups of air holes;

the air outlet is formed at one side of the gap between the baffle and the edge of the opening of the shell; the air outlet is connected with the tail end of an air outlet channel of the cavity and used for laterally and outwards discharging hot air;

the depilating instrument works by starting the fan, the first air inlet sucks cold air to the space on the surface of the radiator, the heat on the surface of the radiator is taken away to form hot air, the hot air is sucked into the cavity provided with the fan, the hot air is discharged to the air outlet channel by the fan, and the air outlet is discharged, so that air-cooling heat dissipation of the radiator is realized.

3. An epilating apparatus as claimed in claim 1, characterized in that:

the radiator is one or a combination of a plurality of fin radiators, a plurality of radiating fins, one or a plurality of groups of parallel radiating fins and a heat conducting plate;

the space on the surface of the radiator is communicated with an air inlet hole of the fan and is used for sucking hot air on the surface of the radiator into the cavity provided with the fan;

the heat sink and the fan are vertically installed.

4. An epilating apparatus as claimed in claim 1, characterized in that:

a second air inlet is formed in the position, corresponding to the light source component, of the shell, and the second air inlet is communicated with a space air path on the heat dissipation surface of the light source component; the second air inlet, the space of the heat dissipation surface of the light source component, the cavity for installing the fan, the air outlet channel and the air outlet are communicated through air passages to form an air-cooling heat dissipation channel of the light source component;

5. An epilating apparatus as claimed in claim 4, characterized in that:

the outside of the light source component is covered with an air guide cover, and an air cooling cavity for heat dissipation of the light source component is formed at the interval between the air guide cover and the light source component; the air cooling cavity is a space of the heat dissipation surface of the light source component;

the air cooling cavity is communicated with the cavity body provided with the fan through an air path and is also communicated with the air path between the second air inlets;

the light source component is arranged on the light source bracket; the light source bracket is arranged in the shell and is positioned behind the hair removal working head;

at least one ventilation pipeline is arranged in the light source support and communicated with the space between the second air inlet and the heat dissipation surface of the light source component.

6. An epilating apparatus as claimed in claim 5, characterized in that:

the light source component comprises a light source and a reflecting cup covered outside the light source; the air cooling cavity is a space defined between the air guide cover and the light reflecting cup of the light source; the light reflecting cup is made of heat conducting materials;

the shape and the size of the wind scooper are matched with those of the reflecting cup and are arranged close to the outer surface of the reflecting cup;

one side of the wind guide cover is covered outside the reflecting cup and is in a horn shape, and the other side of the wind guide cover is provided with a hollow connecting end; the hollow connecting end is communicated with the air cooling cavity and is also communicated with the air passage of the cavity for installing the fan;

the light source bracket is respectively provided with a wind shielding piece to shield two ends of the light source component; the wind shielding piece is obliquely arranged towards the surface of the reflecting cup and is used for guiding cold wind sucked by the second air inlet to the surface of the reflecting cup; the wind shield is also used for shielding light to avoid light leakage;

at least one ventilation pipeline is respectively arranged in the upper part and the lower part of the light source bracket, and correspondingly, at least one second air inlet is respectively arranged at the position of the upper shell and the lower shell corresponding to the light source component.

7. An epilating apparatus as claimed in claim 6, characterized in that:

the air guide cover is connected with a sealing element;

one side of the sealing element is provided with an air guide connecting pipe; one end of the air guide connecting pipe is communicated with the hollow connecting end of the air guide cover so as to be communicated with the air passage of the air cooling cavity; the other end of the air guide connecting pipe is connected with the cavity for installing the fan in an air path communication way;

the other side of the sealing element is provided with an annular sealing ring which is arranged at the outer edge of an air inlet hole of the fan to prevent lateral air leakage;

the outer side of the annular sealing ring is further provided with another annular sealing ring which is arranged at the edge of the tail end of the air outlet channel to prevent lateral air leakage;

the cavity for installing the fan is buckled with a pressing plate to fix the fan in the cavity; the pressing plate is provided with an opening which is aligned with the opening of the fan shell to form an air inlet of the fan.

8. An epilating apparatus as claimed in any one of claims 1 to 7, characterized in that:

the unhairing working head is provided with a semiconductor refrigeration sheet as an unhairing working surface;

the semiconductor refrigerating sheet comprises a semiconductor couple layer, and a hot surface and a cold surface at two ends of the semiconductor couple layer; the semiconductor refrigerating sheet adopts transparent crystals as a cold surface directly and as a depilating working surface of a skin contact surface;

the semiconductor refrigerating sheet is provided with a light transmitting area; the light-transmitting region is provided by the transparent crystal; performing a depilation treatment by controlling a light source assembly to generate pulsed light to be transmitted from a light-transmitting area of the semiconductor chilling plate to a contacted skin;

the radiator is used for radiating heat of the hot surface of the semiconductor refrigerating sheet.

9. An epilating apparatus as claimed in claim 8, characterized in that:

the heat dissipation assembly comprises a heat pipe, and the heat pipe conducts the heat of the hot surface to a radiator for heat dissipation;

the heat pipe is directly contacted with the hot surface or is contacted with the hot surface through a heat conducting piece; one end or one side of the heat conducting piece or the heat pipe is matched with the shape of the hot surface of the semiconductor refrigerating sheet and is in contact with the hot surface of the semiconductor refrigerating sheet in a mutually attached manner;

the heat pipe is arranged on the surface or inside the radiator;

the heat pipe has a refrigerant circulating therein.

10. An epilating apparatus as claimed in claim 9, characterized in that:

the depilating working head is provided with at least two sensors for detecting whether the depilating working surface is completely or almost completely covered by the skin so as to activate or shut off the light source; wherein, the two sensors are arranged on the diagonal line or the position close to the diagonal line of the edge of the depilating working surface;

the epilating apparatus further comprises a power supply unit; the light source assembly is electrically connected with the power supply unit; the power supply unit is a capacitor or a power supply conversion module;

the fan is electrically connected with the control circuit board.