CN115628569A

CN115628569A - Refrigeration structure and beauty instrument

Info

Publication number: CN115628569A
Application number: CN202210981562.3A
Authority: CN
Inventors: 李兵
Original assignee: Shenzhen Yuyi Electronic Technology Co Ltd
Current assignee: Shenzhen Yuyi Electronic Technology Co Ltd
Priority date: 2020-04-02
Filing date: 2020-11-08
Publication date: 2023-01-20
Also published as: CN214807922U; CN214807921U; CN213312969U; CN216258753U; CN213994603U; CN112484337A; CN214971202U; CN213432629U; CN213312973U; CN112484336A; CN214807926U

Abstract

The invention relates to a refrigeration structure and a beauty instrument. The refrigerating structure comprises a semiconductor refrigerating sheet, wherein the semiconductor refrigerating sheet comprises a PN galvanic couple particle layer, a cold surface and a hot surface; the cold surface and the hot surface are respectively arranged at the cold end and the hot end of the PN galvanic couple particle layer, and the PN galvanic couple particle layer is provided with a positive electrode and a negative electrode; the hot end of the PN galvanic couple particle layer forms the hot surface of the semiconductor refrigerating sheet by using a heat conducting plate; the heat conducting plate contains a refrigerant therein. The beauty instrument is internally provided with the refrigeration structure; the working surface of the beauty instrument is the cold surface of the semiconductor refrigeration sheet or is refrigerated by the cold surface of the semiconductor refrigeration sheet. By adopting the refrigeration structure, the middle ceramic plate and the heat-conducting silicone grease coating are omitted at the hot end, so that the resistance of heat transfer is reduced, and the heat-conducting/radiating efficiency is improved.

Description

Refrigeration structure and beauty instrument

The present application is a divisional application having an application number of 202011234826.6, an application date of 2020, 11/08, entitled "cooling structure and beauty apparatus".

Technical Field

The invention relates to the technical field of heat dissipation or refrigeration, in particular to a refrigeration structure and a beauty instrument.

Background

The process of the traditional heat pipe radiator comprises the steps of copper pipe, copper powder tank, sintering, liquid tank, vacuumizing and sintering, and the process is complete; after the heat pipe is finished, the pipe can be bent and flattened, and finally the pipe is welded or riveted with other radiating fins or heat pipes. The process is complex, and the bending part influences the heat dissipation efficiency.

The traditional heat pipe process comprises the following steps: the heat pipe is directly welded or riveted with the radiating fin. The heat absorption end of the heat pipe, namely the heating area of the evaporation end, is affected by the bending process of the copper pipe and cannot be completely attached, so that the heat absorption and heat conduction efficiency is relatively low.

The traditional process of the semiconductor chilling plate comprises the following steps: the P-type/N-type semiconductor particles are welded with the monolithic ceramic plate according to a predetermined circuit, and the hot end/cold end is a ceramic plate. From refrigeration end to heat dissipation end (hot junction) stack part is more, the serious loss of efficiency, wherein:

the heat pipe mode is as follows: ceramic plate-heat conducting silicone grease-copper plate-copper pipe-radiating fin-fan

VC mode: ceramic plate with heat-conducting silicone grease, VC, radiating fin and fan

The two methods are as follows: the contact area of the heat dissipation surface of the refrigeration piece is correspondingly reduced due to the influence of the product form, and the effective fitting with the heat dissipation surface of the refrigeration piece cannot be completed.

Disclosure of Invention

The invention aims to provide a refrigeration structure and a beauty instrument, and solves the problems of poor heat dissipation efficiency, complex structure, inconvenience in assembly and the like of the conventional refrigeration sheet.

In order to achieve the purpose, the invention adopts the following technical scheme:

a refrigeration structure comprises a semiconductor refrigeration sheet, wherein the semiconductor refrigeration sheet comprises a PN galvanic couple particle layer, a cold surface and a hot surface; the cold surface and the hot surface are respectively arranged at the cold end and the hot end of the PN galvanic couple particle layer; the hot end of the PN galvanic couple particle layer forms the hot surface of the semiconductor refrigerating sheet by using a heat conducting plate; the refrigeration structure further comprises a heat sink; the radiator is used for radiating heat for the heat conducting plate, and the semiconductor refrigeration piece and the radiator are designed in an integrated mode.

Further, the PN galvanic couple particle layer comprises P type/N type semiconductor particles; the heat conducting plate is directly contacted with the hot end or the P-type/N-type semiconductor particles, and the heat conducting plate directly absorbs and conducts the heat of the hot end; the PN galvanic couple particle layer is provided with a positive electrode and a negative electrode; a circuit is formed on the heat conducting plate and is used as a hot end circuit or is provided with a metal conductor; the hot end circuit or the metal conductor is connected with the P type/N type semiconductor particles to be communicated with an internal circuit of the semiconductor chilling plate, and the positive electrode and the negative electrode are connected with an external power supply.

Furthermore, P type/N type semiconductor particles of the PN galvanic couple particle layer are welded on the heat conduction plate, and one end of the P type/N type semiconductor particles is welded on the hot end circuit or the metal conductor and is connected in series by the hot end circuit or the metal conductor; the other end of the P-type/N-type semiconductor particles in the PN galvanic couple particle layer is welded on the cold surface of the semiconductor refrigerating sheet; and a cold end circuit or a metal conductor is arranged on the cold surface and is electrically connected with the other end of the P-type/N-type semiconductor particle.

Further, the heat conducting plate is a metal plate; the surface of the metal plate is provided with an insulating layer and the hot end circuit; the insulating layer is an electric insulating film covering the surface of the heat conducting plate, and the surface of the heat conducting plate is etched to form the hot end circuit.

Further, a space is formed inside the heat conductive plate for accommodating a refrigerant; the refrigeration structure further comprises a plurality of heat pipes; the heat pipe is connected with the heat conducting plate to dissipate heat together; a refrigerant is contained inside the heat pipe; the interior of the heat pipe is communicated with the interior of the heat conducting plate to form a communicated closed space; a refrigerant flows through the sealed space; the heat conducting plate is a metal plate; the heat pipe is a metal pipe.

Furthermore, the heat conducting plate comprises a heat conducting bottom plate and a heat conducting cover plate, the heat conducting bottom plate and the heat conducting cover plate are buckled with each other, and the space is formed inside the heat conducting plate; the surface of the heat conduction bottom plate is provided with a circuit or a metal conductor which is electrically connected with the PN galvanic couple particle layer; the heat conducting cover plate is provided with hole sites which are matched with the inner diameter or the outer diameter of the heat pipe, and one end of the heat pipe is inserted into the hole sites to be fixed and communicated with the space inside the heat conducting plate.

Furthermore, a closable vacuum nozzle is arranged on the heat conducting plate and/or the heat pipe, and the closable vacuum nozzle is communicated with the inside of the heat conducting plate and/or the inside of the heat pipe and is used for vacuumizing; the heat conducting plate is a copper plate or an aluminum plate; the refrigerant is a cooling liquid; the heat pipe is a copper pipe or an aluminum pipe; copper powder is contained in the space inside the heat conducting plate and/or the heat pipe so as to increase the heat conducting and absorbing area; copper powder is welded on the inner wall of the space and/or the inner wall of the pipe, or the copper powder is placed in the space inside the heat conducting plate and/or the heat pipe; inner ring sealing glue is arranged in the heat conduction plate to seal a joint gap between the heat conduction bottom plate and the heat conduction cover plate; the heat pipe and the heat conducting plate are welded or riveted into a whole; the heat-conducting bottom plate and the heat-conducting cover plate are welded or riveted into a whole; one end of the heat pipe is welded or riveted with the hole site.

Further, the cooling structure further comprises a radiator; the radiator is connected with the heat conducting plate or connected with the heat conducting plate through the heat pipe to form an integral structure for radiating heat for the heat conducting plate.

Further, the heat sink comprises a plurality of cooling fins; the radiating fins are metal radiating fins or graphene radiating fins; the radiating fins are connected and fixed through a connecting structure; or the plurality of radiating fins are of an integral structure integrally formed by graphene; the radiator comprises one or more groups of radiating fins which are arranged in parallel; the heat pipe is arranged in the channel of the one or more groups of radiating fins which are arranged in parallel in a penetrating way and is matched with the radiating fins in a close contact way, or the heat pipe is fixed on the heat conducting fins which are combined on the radiating fins and is matched with the radiating fins in a close contact way.

Further, the heat conducting plate is annular; the annular heat conducting plate is formed by buckling an annular heat conducting bottom plate and an annular heat conducting cover plate; the PN galvanic couple particle layer is annular or P-type/N-type semiconductor particles are arranged in an annular manner; the cold surface is a transparent crystal cold surface, the annular heat conduction plate is welded with a PN galvanic couple particle layer or P type/N type semiconductor particles and is welded with the annular edge of the transparent crystal cold surface, the transparent crystal is a whole piece and covers the whole surface of the annular heat conduction plate, and the hollow area of the annular heat conduction plate is covered by the transparent crystal and forms a light transmission area; or the cold surface is made of annular transparent or opaque materials, the annular heat conducting plate is welded with the PN galvanic couple particle layer or the P type/N type semiconductor particles and further welded with the annular cold surface, and the annular middle area forms a light transmitting area.

Furthermore, the cold end of the semiconductor refrigerating sheet adopts transparent crystals to form a transparent crystal cold surface, so that the transparent crystal cold surface of the semiconductor refrigerating sheet is formed.

Further, a cold end circuit or a conductive metal welding spot is formed on the cold surface of the transparent crystal, and is electrically connected with the PN galvanic particle layer and mutually welded; the heat conducting plate is annular; the PN galvanic couple particle layer is annular or P-type/N-type semiconductor particles are arranged in an annular manner; welding with the annular edge of the cold surface of the transparent crystal; the annular middle area forms a light transmission area; the transparent crystal is a whole crystal, and the annular hollow area of the heat conducting plate is covered by the sealing cover and used for transmitting light waves.

The invention also provides a beauty instrument, which is internally provided with a light source component, a power supply unit and a control circuit board; the power supply unit supplies power to the light source component; the front end surface of the beauty instrument is a working surface; the beauty instrument controls the power supply unit to excite the light source assembly to generate pulsed light through the control circuit board so as to be used for beauty treatment or treatment; the beauty instrument further comprises the refrigeration structure; the working surface of the beauty instrument is the cold surface of the semiconductor refrigeration sheet or is refrigerated by the cold surface of the semiconductor refrigeration sheet.

Furthermore, the semiconductor refrigeration piece of the heat dissipation structure is provided with a heat radiator structure; the beauty instrument comprises a shell, wherein an air inlet and an air outlet are formed in the shell; the light source component, the power supply unit, the control circuit board and the radiator of the heat dissipation structure are arranged in the shell; the air passages among the air inlet, the air duct of the radiator and the air outlet are communicated to form an air cooling channel; a fan is mounted on one side of the radiator and located in the air cooling channel and used for sucking cold air from an air inlet or discharging hot air to an air outlet.

The invention has the beneficial effects that:

compared with the heat dissipation structure of the traditional process, the refrigeration structure has the following outstanding effects:

1) The refrigerating sheet saves an intermediate ceramic plate and a heat-conducting silicone grease coating on a heat-radiating surface, namely a hot end, so that the resistance of heat transfer is reduced, the heat-conducting/heat-radiating efficiency is improved, and the volume of the product becomes smaller, so that the refrigerating sheet is more convenient and faster and more convenient to use;

2) The integrated design of the refrigerating sheet and the radiator is adopted, so that the process cost and the assembly cost are reduced; solves a series of problems caused by poor assembly, poor accumulated tolerance and poor manufacture. The product is assembled and manufactured more conveniently, and the efficiency is faster and higher.

The present invention is described in further detail below with reference to the attached drawing figures.

Drawings

FIGS. 1 (a) -1 (b) are exploded views of two different embodiments of a refrigeration structure according to embodiments of the present invention.

Fig. 2 is a perspective view of a refrigeration structure according to an embodiment of the present invention.

Fig. 3 (a) -3 (e) are process flow diagrams of a refrigeration structure according to an embodiment of the present invention.

Fig. 4 is a schematic circuit structure diagram of a semiconductor chilling plate according to an embodiment of the present invention.

Fig. 5 is a schematic diagram of a refrigeration configuration of an embodiment of the present invention.

Fig. 6 is a perspective view of an epilating apparatus in accordance with an embodiment of the invention.

Fig. 7 is a perspective view of another perspective of the epilating apparatus in accordance with the invention.

Figure 8 is an exploded view of a depilating apparatus in accordance with an embodiment of the present invention.

Fig. 9 is a schematic view of the internal structure of an epilating apparatus in accordance with an embodiment of the invention.

Fig. 10 is a perspective view of an epilating apparatus in accordance with an embodiment of the invention with part of the housing removed.

Fig. 11 is a schematic view of the internal structure of an epilating apparatus in accordance with another embodiment of the invention.

Detailed Description

It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict, and the present invention is further described in detail with reference to the accompanying drawings and specific embodiments.

Referring to fig. 1 (a) -5, the present invention relates to a cooling structure 100, preferably a semiconductor cooling plate system, comprising a semiconductor cooling plate 1, a heat pipe 21 and a heat sink 23, wherein the heat pipe 21 is connected to the semiconductor cooling plate 1 and the heat sink 23, forming an integral structure of the semiconductor cooling plate with the heat sink. In other embodiments, the heat sink 23 may be directly combined with the semiconductor chilling plate 1 to form an integral structure.

The semiconductor refrigeration piece 1 comprises a PN galvanic couple particle layer 11, a cold surface 10 and a hot surface 12. The cold surface 10 and the hot surface 12 are respectively arranged at the cold end and the hot end of the PN galvanic couple particle layer, and the PN galvanic couple particle layer is provided with a positive electrode and a negative electrode (refer to fig. 4).

The PN couple particle layer 11 includes P-type/N-type semiconductor particles (see fig. 4 to 5). In some embodiments, the P-type/N-type semiconductor particles may be directly welded to the cold surface 10 and the hot surface 12 of the semiconductor chilling plate in a granular form according to a predetermined circuit arrangement, so as to form a sandwich structure between the cold surface 10 and the hot surface 12 of the semiconductor chilling plate. During assembly, one end of the P-type/N-type semiconductor particles may be first soldered to one of the cold side 10 or the hot side 12, for example, the P-type/N-type semiconductor particles are first soldered to the hot side to be soldered and fixed, and then the cold side 10 is soldered to the other end of the P-type/N-type semiconductor particles to form the semiconductor cooling sheet structure, as shown in fig. 4 and fig. 3 (e). In other embodiments, the P-type/N-type semiconductor particles may be fixed into a whole structure with a predetermined shape, and corresponding circuits or electrical connection points are formed at two ends, as shown in fig. 1, the PN couple particle layer 11 is made into a predetermined shape, such as a ring shape, and two ends are correspondingly formed with circuits or electrical connection points and welding points (not shown), which are respectively welded and electrically connected with the cold surface 10 and the hot surface 12. The PN galvanic couple particle layer 11 can be set by the semiconductor galvanic couple layer of the semiconductor refrigeration sheet in the prior art.

The hot end of the PN galvanic couple particle layer forms the hot surface 12 of the semiconductor refrigerating sheet by using a heat conducting plate. For convenience of description, the semiconductor hot side and the heat conductive plate are denoted by reference numeral 12 in the present specification and the drawings. The heat conducting plate 12 is in direct contact with the P-type/N-type semiconductor particles, and the heat at the hot end is directly absorbed and conducted by the heat conducting plate 12. Heat-conducting plate 12 contains a refrigerant therein. Heat-conducting plate 12 has formed thereon circuit 122 as a hot-side circuit; the hot end circuit 122 is connected with the P type/N type semiconductor particles to be communicated with the internal circuit of the semiconductor chilling plate, and is connected with an external power supply through positive and negative electrodes.

Referring again to fig. 3 (e) and 4-5, one end of the P-type/N-type semiconductor particles of the pn couple particle layer 11 is soldered to the hot-side circuit 122 and connected in series by the hot-side circuit 122. The particle distribution diagram of the heat conducting plate of the semiconductor refrigeration sheet is shown, wherein the strip-shaped frame is a circuit formed on the heat conducting plate, for example, the heat conducting plate is a copper plate, and the circuit is obtained after etching and is used for welding the P/N type semiconductor particles. The surface of the heat conducting plate 12 is formed with metal conducting points, which are correspondingly welded and connected in series with the P-type/N-type semiconductor particles. During welding, the P-type semiconductor particles and the N-type semiconductor particles can be welded twice, and when the P-type semiconductor particles are loaded, the positions of the N-type semiconductor particles are shielded by the tool fixture.

The other end of the P type/N type semiconductor particles in the PN galvanic couple particle layer is welded on the cold surface 10 of the semiconductor refrigerating sheet. Referring to fig. 4 and 3 (e), a cold-side circuit 110 is provided on the cold surface and electrically connected to the other end of the P-type/N-type semiconductor particles. The cold-side circuit 110 may be a conductive pad formed of solder paste according to a predetermined circuit pattern or a solder paste printed according to a circuit pattern for bonding the other end of the P-type/N-type semiconductor particles.

After the cold surface 10 is assembled on the hot surface 11 of the welded P/N type semiconductor particle or PN galvanic couple particle layer 11, the circuits at the two ends of the P/N type semiconductor particle or PN galvanic couple particle layer 11 are communicated to form an internal circuit of the semiconductor refrigeration sheet, and the internal circuit is connected with an external power supply through the anode and the cathode 113.

In some embodiments, thermally conductive plate 12 is a metal plate, such as a copper or aluminum plate. Heat-conducting plate 12 is internally formed with a space for accommodating a refrigerant. The refrigerant is often a cooling fluid. The surface of the metal heat conducting plate is provided with an insulating layer 123 and a hot-end circuit 122. The insulating layer 123 is an electrical insulating film covering the surface of the metal heat conducting plate, and the surface of the metal heat conducting plate is etched to form a hot end circuit. Preferably, the heat conducting plate is a VC (Vapor Chambers) heat conducting plate, and specifically includes a heat conducting bottom plate 120 and a heat conducting cover plate 121, wherein the heat conducting bottom plate 120 and the heat conducting cover plate 121 are fastened to each other, and a space is formed inside. The surface of the heat conducting bottom plate 120 is provided with a circuit 122 which is electrically connected with the PN couple particle layer 11. The heat conducting cover plate 121 is provided with a hole site 124, the hole site 124 is matched with the inner diameter or the outer diameter of the heat pipe, and one end of the heat pipe is inserted into the hole site 124 to be fixed and communicated with the space inside the heat conducting plate.

Copper powder can be further placed in the heat conducting plate to increase the heat conducting and heat absorbing areas; the copper powder can be welded on the inner wall of the space, or the copper powder is directly placed in the space in the heat conducting plate. An inner ring sealant 125 may be further disposed inside the heat conducting plate for sealing the joint gap between the heat conducting bottom plate 120 and the heat conducting cover plate 121. Preferably, the heat conductive base plate 120 and the heat conductive cover plate 121 are welded or riveted at the connection portion to form an integral structure.

The shape of the heat-conducting plate 12 is designed according to the overall shape of the refrigeration plate and its application, and may be an overall plate-box structure or other shapes. In the embodiment shown in the figures, the heat conducting plate 12 is annular in whole and is formed by fastening an annular heat conducting base plate 120 and an annular heat conducting cover plate 121. The inner side of the heat conduction bottom plate forms a groove structure, after the heat conduction bottom plate is buckled with the cover plate 121, the groove corresponds to form an inner space, and the groove can also be provided with a boss supporting structure and can be matched and positioned with a clamping groove arranged on the corresponding surface of the cover plate. The center of the ring-shaped structure may define a light-transmissive region for transmitting pulsed light, in order to use the cooling structure as a cosmetic instrument (epilator). The annular heat conducting plate 12 forms an annular hot surface, the PN galvanic couple particle layer 11/P/N type semiconductor particles are also arranged in an annular mode, and the cold surface can be made of annular materials or be welded and assembled with the PN galvanic couple particle layer 11/P/N type semiconductor particles and the annular heat conducting plate 12 by adopting a whole transparent crystal.

The VC (Vapor Chambers) heat conducting plate can adopt copper/aluminum and other metal heat conducting materials, for example, a layer of insulating material is formed (for example, sprayed) on the surface of a copper plate contacted with the conductive layer particles of the refrigerating sheet, and corresponding circuits are formed by etching or printing and other modes and are used for electrically connecting P/N semiconductor particles so as to facilitate the movement of charges to achieve the heating/refrigerating effect. The interior of the heat conducting plate is processed into a solid space, and after the heat conducting base plate 120 and the heat conducting cover plate 121 are fastened, a closed space for accommodating copper powder and refrigerant is formed inside and is communicated with the space inside the heat pipe 21. After the heat-conducting bottom plate 120, the heat-conducting cover plate 121 and the heat pipe 21 are welded at high temperature, the heat pipe 21 or the heat-conducting plate 12 is vacuumized through a vacuum nozzle reserved thereon, and finally sintered to form a communicated closed space. In the invention, the heat conducting plate 12 is directly used as the hot end of the refrigerating sheet, and is communicated with the heat pipe or directly connected with the radiator to be used as a part of the heat pipe or the radiator, so that the refrigerating sheet and the radiator are combined into a whole, and the structure is simpler.

The refrigeration structure 100 of the present invention may employ a plurality of heat pipes 21; the heat pipe 21 is connected with the heat conducting plate 12 to dissipate heat together; the heat pipe 21 contains a refrigerant therein; the interior of the heat pipe is communicated with the interior of the heat conducting plate to form a communicated closed space; the refrigerant flows through the closed space. Typically, the heat pipe is a metal pipe, such as a copper pipe or an aluminum pipe. In the embodiment shown in the figures, one or two straight pipes are used as the heat pipe 12, one end is connected with the heat conducting plate 21, the other end is connected with the radiator 23, and two ends of the heat pipe 12 can be respectively welded or welded and fixed with the heat conducting plate 21 and the radiator 12 to form an integral inseparable structure.

The heat conducting plate 12 and/or the heat pipe 21 are provided with vacuum nozzles capable of being sintered and closed or fused, and the vacuum nozzles capable of being closed are communicated with the interior of the heat conducting plate and/or the interior of the heat pipe for vacuumizing.

Copper powder is contained in the heat pipe 21 to increase the heat conduction and heat absorption areas; copper powder is welded on the inner wall of the pipe, or copper powder particles are directly placed in the heat pipe and provided with a copper net. The heat pipe 21 and the heat conducting plate 12 can be welded, fused or riveted to form an integral structure. Specifically, one end of the heat pipe 21 is welded or riveted with the hole 124 provided on the heat conducting plate.

In the present invention, the cooling structure 100 further includes a radiator 23. The heat sink 23 is connected to the heat-conducting plate 12 or connected to the heat-conducting plate 12 through the heat pipe 21 to form an integral structure for dissipating heat to the heat-conducting plate.

The heat sink 23 may be a finned heat sink comprising a number of fins 233. In some embodiments, the heat sink is a metallic finned heat sink, and may be assembled by one or more sets of metallic fins 233, such as copper plates. One or more sets of the heat dissipation fins 233 may be connected and fixed by a connection structure. For example, each heat sink is provided with a clip and a clip hole, and the heat sinks are further fixed by the heat conductive sheet or the heat pipe 21 by forming a snap fit between the clip and the clip hole.

In the embodiment shown in the figures, the heat sink 23 comprises one or more sets of parallel arranged fins 233; the heat pipe 21 is inserted into the channel 230 of one or more sets of parallel arranged heat dissipation fins and tightly contacted and matched, and the heat pipe 21 and the channel 230 can be welded by soldering tin to increase the contact area and accelerate the heat transfer. In other embodiments, the heat pipe 21 may also be fixedly connected and closely contacted with one or more sets of heat conducting plates (heat conducting members) combined with the parallel heat dissipating plates.

In other embodiments, the heat spreader 23 is a graphene heat spreader, and is a unitary structure formed by integrally molding several graphene heat dissipation sheets 233 through graphene. The graphene heat sink 23 includes an integral inseparable structure formed by integrally forming one or more groups of graphene heat dissipation fins 233, and the manufacturing process can be directly formed by an injection molding process or a die pressing process. The graphene heatsink 23 may be an integrally formed independent heatsink, i.e., an integrally formed integral indivisible structure including one or more sets of graphene fins 233. The graphene heat sink 23 may also be used in combination with other heat dissipation elements, such as the heat pipe 21 or a heat conducting element. The heat pipe 21 may be mounted on the surface or inside of the graphene heat sink 23 and fitted in close contact to conduct heat quickly. The heat conducting member may be mounted on the graphene heat spreader 23, for example, the graphene heat spreader 23 formed by integrally molding one or more sets of parallel graphene fins 233 is located or mounted on one side of the heat conducting member; the graphene heat spreader 23 and other heat conducting plates may be integrally formed into an integral structure, that is, one or more sets of parallel graphene fins 233 and heat conducting plates may be integrally formed. The graphene radiator combination can be flexible and changeable, such as: the copper plate, the copper pipe and one or more graphene radiating fins 233; alternatively, a copper tube (flattened contact hot end) + graphene fins 233; or, the copper plate + graphene fins 233; alternatively, only the integrated graphene heat sink 233. For example, a heat sink for cooling a semiconductor cooling plate or a depilating work surface may be formed by copper plate + copper tube + graphene cooling plate 233.

The graphene heat spreader 23 may be integrally formed or combined with other structural components of the beauty instrument 1000 (e.g., a depilator), and may be an integral structure, for example, the graphene heat spreader 23 may be integrally formed with the structural components inside the beauty instrument (e.g., a depilator), such as a bracket, a heat conducting cover, a fan housing, etc., or may be integrally formed with the inside of the housing of the beauty instrument (e.g., a depilator).

The graphene radiating fin is integrally formed by directly forming through an injection molding process or a die pressing process, and when the graphene radiating fin is integrally formed or combined with other structural parts, the other structural parts can be placed in a mold during the injection molding process or the die pressing process, and the graphene radiating fin is formed at one time during injection molding or die pressing, so that the other structural parts and the graphene radiating fin are fixed into a whole. In the graphene radiator, a whole inseparable structure is formed between one group or multiple groups of radiating fins through an integrated ground type, a buckle structure for connecting the devices is not required to be arranged, a device alignment structure is not required to be arranged, and the process and the structure are simple.

The integrally formed graphene heat sink 23 may have any shape suitable for the internal space of the beauty instrument case, the graphene heat sink 23 is parallel graphene fins, a channel 230 for installing the heat pipe 21 may be integrally formed in the graphene heat sink, and the heat pipe 21 may be inserted into the channel 230 to be in close contact therewith.

The appearance of graphite alkene radiator 23 then does not receive beauty instrument inner space's influence, can be nimble can laminate in beauty instrument (if the appearance that moults) interior part shape according to designs such as beauty instrument inner space size and radian, better utilization the product inner space, improve the utilization ratio in space, the radiating area that also strengthens simultaneously more makes the heat source can be faster more high-efficient even derivation and give off. The graphene heat sink density is smaller and lighter than conventional heat sinks, greatly reducing the weight of the cosmetic apparatus 1000 (e.g., depilatory apparatus). The graphene radiator can be formed at one time by adopting an injection molding process or a die pressing process, the size precision is high, the consistency of parts is high, the deformation of a product is small, the graphene radiating fins can be made into a wave shape or a conductive shape according to requirements, the distance between every two graphene radiating fins is the same, the consistency of the heat conduction of the product radiation can be effectively ensured, and the quality consistency of the finished product of the beauty instrument is effectively improved. The graphene radiator has the advantages of simple preparation process, high productivity and low reject ratio, the efficiency of the finished product assembled on the beauty instrument 1000 (such as a depilator) is relatively improved, the production capacity is improved, and the cost of the beauty instrument 1000 (such as a depilator) is effectively reduced.

In other embodiments, the graphene heat spreader 23 may be effectively combined with other components, such as a two-in-one three-in-one all-in-one design, which can conduct and dissipate heat more quickly and uniformly. For example, the graphene radiator may be designed to be integrated with an internal mounting bracket, such as the tail of the bracket 7, integrally formed with the bracket, or integrally formed with one side of the sealing member 8; alternatively, the heat sink may be integrally formed with the outer housing of the fan, such as a two-in-one design with the pressure plate 29 or the housing of the fan 25, to facilitate the rapid and uniform heat conduction and dissipation. The graphene radiator 23 is also integrally formed with the housing or the bracket to form an integral structure, so that the beauty instrument 1000 (such as a depilator) is more convenient to mount and has higher efficiency.

The cooling structure 100 may be designed into a specific shape as required, and the cooling surface of the semiconductor cooling plate may be made of a cooling surface material suitable in the prior art, such as ceramic. According to the use needs, when the cold side needs to form a light transmission area, when the cold side made of opaque materials is adopted, a reserved hollow area, such as a central through hole of a ring core, needs to be arranged for transmitting light.

In the embodiment of the invention, the cold end of the PN galvanic couple particle layer uses the transparent crystal, so that the transparent crystal cold surface of the semiconductor refrigerating sheet is formed and the pulse light can be transmitted.

As described above and shown in fig. 3 (e) and fig. 4 to 5, the cold-end circuit 110 is formed on the transparent crystal cold surface 10, and is electrically connected to the PN galvanic couple layer 11 and welded to each other; the PN galvanic couple particle layers 11 are arranged in a ring shape; heat-conducting plate 12 is annular. The annular middle area forms a light-transmitting area of the semiconductor refrigerating sheet.

The annular PN galvanic couple particle layer is welded on the annular heat conducting plate 12 and further welded on the edge annular belt 101 of the transparent crystal cold surface; the annular middle region forms a light transmissive region 102.

The semiconductor refrigeration piece 1 of the embodiment comprises a cold surface 10, a PN galvanic couple particle layer 11 and a heat conducting plate hot surface 12. A PN galvanic couple layer 11 is located between the cold face 10 and the hot face 12. The cold surface 10 of the semiconductor refrigeration piece is formed by transparent crystals, so that a transparent crystal cold surface is formed; the inner side surface of the transparent crystal cold surface 10 is fixedly connected with the metal conductor of the PN galvanic couple particle layer 11. The hot surface 12 of the semiconductor refrigerating sheet is composed of a VC heat conducting plate, and the inner side surface of the VC heat conducting plate is fixedly connected with the metal conductor of the PN galvanic couple particle layer 11. The VC heat conduction plate hot surface 12 and the transparent crystal cold surface 10 sandwich the PN couple particle layer 11 to form the semiconductor refrigerating sheet 1. The positive and negative electrodes 113 are connected to the ends of the PN couple particle layer 11. The transparent crystal is a transparent material with high light transmittance, high thermal conductivity and high heat resistance, such as natural spar or gem.

The PN galvanic couple particle layer 11 can be a semiconductor galvanic couple layer formed by connecting a metal conductor with a semiconductor galvanic couple and is fixedly connected with the transparent crystal cold surface 10 and the VC heat conduction plate hot surface 12. As some embodiments, this may be done in a manner suitable in the art. For example, the inner surfaces of the transparent crystal cold surface 10 and the VC heat-conducting plate hot surface 12 are metallized to form the cold-end circuit 110 and the hot-end circuit 122 or metal conductors, and then welded to the metal conductors of the PN couple particle layer 11 to form a welded structure. Or the PN couple particle layer 11, the transparent crystal cold surface 10 and the VC heat conduction plate hot surface 12 are bonded by heat conduction glue to form bonding fixation.

In this embodiment, the PN couple particle layer 11 is annular, and an annular region thereof is used for disposing electronic components, and an inner hollow region thereof is used for light to penetrate. The inside of the PN couple particle layer 11 is an integral circuit which is formed by connecting a PN semiconductor couple by a metal conductor, and by utilizing the Peltier effect of semiconductor materials, when direct current passes through the couple formed by connecting N and P different semiconductor materials in series, heat transfer can be generated between two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. The cold end adopts transparent crystal to form the cold side of semiconductor refrigeration piece, and the hot end still adopts VC heat-conducting plate to form the hot side 12 of semiconductor refrigeration piece.

The shape and size of the hot surface 12 of the VC heat conducting plate are matched with those of the PN galvanic particle layer 11, for example, the shape and size are also annular, and a hollow area inside the annular area is used for light to penetrate through.

The transparent crystal cold surface 10 covers the whole surfaces of the PN galvanic couple particle layer 11 and the VC heat conduction plate 12, so that whole-surface refrigeration is formed. The transparent crystal cold face 10 is a whole or integrated crystal with continuous surface. Preferably, the thickness of the cold face of transparent crystal is no less than 1mm to improve the intensity of semiconductor refrigeration piece 1, reduce the damage risk of assembly, increase of service life. The transparent crystal material of the embodiment has high light transmittance and high heat conductivity coefficient, so that pulsed light penetrates through the transparent crystal to perform unhairing operation, and the high heat conductivity coefficient is favorable for improving the refrigeration efficiency and the effect.

The middle area of the transparent crystal cold surface 10 is a light transmission area, and the annular area is attached to the PN galvanic couple particle layer 11 in a matching mode. Correspondingly, the light transmission area of the cold surface of the transparent crystal is covered on the inner hollow area of the PN couple particle layer 11/VC heat conduction plate 12, so that the hollow area is covered and can be penetrated by light. The whole refrigerating area of the transparent crystal cold surface 10 comprises a light transmission area and an annular area at the periphery of the light transmission area. The whole surface of the crystal is refrigerated, so that the refrigerating area is increased, and the experience feeling is better.

The surface of the annular region of the transparent crystal cold surface 10 is subjected to light shielding treatment to form an annular light shielding region for shielding the internal electronic components. Specifically, the shading treatment may be to plate a shading film on one or both sides of the transparent crystal, and then remove the shading film at the corresponding position of the middle light-transmitting region; or, directly printing a shielding layer on the annular area of the transparent crystal, and keeping the light-transmitting area free. The shading area is formed by carrying out surface treatment on the cold surface 10 of the transparent crystal, can be treated on the double surfaces or any single surface of the crystal, and can be treated by adopting the modes of coating, spraying, printing and the like.

The peripheral edge of the transparent crystal cold face 10 can be further processed to form an assembly position for fixed assembly with an external housing, such as a working head housing of a beauty instrument (depilatory instrument). In a more specific example, the mounting location may be a beveled edge or stepped surface that forms a snap fit with the working head housing 63.

Referring again to fig. 3 (a) -3 (e), the assembly principle of the refrigeration structure 100 of the present invention is as follows:

referring to fig. 3 (a), a single heat pipe 21, such as a copper/aluminum pipe, is inserted into a corresponding hole 124 formed in the heat-conducting cover plate 121 of the refrigeration fin, and waits for the next processing step; copper/aluminum tubes are assembled with the heat conducting plate 21 after copper powder is added;

referring to fig. 3 (b), after the heat conducting plate is processed into a concave-convex three-dimensional space, copper powder or a copper mesh is placed in the space, and is subjected to high-temperature welding with the heat conducting plate cover plate 121+ conduit 21 group in the previous process, and after liquid is contained in the internal space, the heat pipe is vacuumized from a vacuum nozzle arranged at the tail end or other positions to form a whole with a closed space;

referring to fig. 3 (c), after the single fins 233 with teeth are buckled to form the radiator 23, the radiator is welded with the tail end of the heat pipe to form a whole, or a graphene radiator is adopted; the heat sink 23 cooperates with the fan in the particular application;

referring to fig. 3 (d), after the heat conducting plate 12 and the heat sink 23 are assembled, the P-type/N-type semiconductor particles are distributed according to a predetermined designed circuit and can be welded on the heat conducting plate 12 of the refrigerating plate by high temperature, for example, 150 to 300 ℃;

referring to fig. 3 (e), after the P-type/N-type semiconductor particles are welded on the heat conducting plate 12 of the refrigeration plate, they are welded and fixed with the transparent crystal hot surface 10, and the external and internal peripheral sealing compound can be further formed into the refrigeration plate peripheral sealing compound 104 (fig. 1 (a)) which mainly seals and fixes the periphery of the PN galvanic couple particle layer 11, thereby completing the assembly of the refrigeration structure.

In the refrigeration structure of the invention, the hot end of the ceramic plate and the intermediate heat conducting piece connected with the heat pipe are omitted from the refrigeration sheet 1, the P-type/N-type semiconductor particles are directly welded on the heat conducting plate 12, and the heat generated by the hot end of the refrigeration sheet 1 is directly conducted to the internal refrigerant by the heat conducting plate 12. The heat passes through the heat conducting plate 12, the radiating fins 233 and the fan, so that the heat does not need to pass through a ceramic plate and heat conducting silicone grease, intermediate links are reduced, the heat is effectively conducted on the whole surface without being influenced by the appearance of a product, and the heat is conducted more quickly and directly.

In other embodiments, the transparent crystal cold surface is adopted, so that the heat-conducting silicone grease and the cold conducting part layer are omitted, the transparent crystal cold surface can be directly contacted with the surface of the skin, the transparent crystal directly acts on the skin, the refrigeration efficiency is improved, and the cold conducting speed is accelerated.

The VC (Vapor Chambers) heat conducting plate can adopt copper/aluminum and other metal heat conducting materials, a layer of insulating material is formed (for example, sprayed) on the surface of the copper plate, which is contacted with the conducting layer particles of the refrigerating sheet, and corresponding circuits are formed in the modes of etching or printing and the like and are used for electrically connecting the P-type/N-type semiconductor particles to enable the charges to move so as to achieve the heating/refrigerating effect. The other side of the heat-conducting bottom plate needs to be processed into a three-dimensional space, a closed space for containing copper powder and a refrigerant is formed inside the heat-conducting bottom plate after the heat-conducting bottom plate is buckled with the heat-conducting cover plate, and the heat-conducting bottom plate is communicated with the space inside the heat pipe. The heat conducting bottom plate 120, the heat conducting cover plate 121 and the heat pipe 21 are welded at high temperature, and then are vacuumized through a vacuum nozzle reserved on the heat pipe or the heat conducting plate, and finally are sintered to form a communicated closed space. In the invention, the heat conducting plate is directly used as the hot end of the refrigerating sheet, and is also used as a radiator which is communicated with the heat pipe or directly connected with the heat pipe, and is used as a part of the heat pipe or the radiator, so that the refrigerating sheet and the radiator are combined into a whole, and the structure is simpler.

The cooling plate of the refrigerating plate is directly contacted with the P/N semiconductor particle layer and directly used as a hot end, so that the heat dissipation efficiency is high, the area is large, the loss is small, an intermediate link is omitted, and the heat conduction speed is accelerated.

In the refrigeration structure, the hot end of the ceramic plate and the intermediate heat conducting piece connected with the heat pipe are omitted from the refrigeration piece, the P-type/N-type semiconductor particles are directly welded on the heat conducting plate, and heat generated by the hot end of the refrigeration piece is directly conducted to the internal refrigerant by the heat conducting plate. The heat passes through the heat conducting plate, the radiating fin and the fan, the heat does not need to pass through a ceramic plate and heat conducting silicone grease, intermediate links are reduced, the whole surface is not influenced by the appearance of a product, and the heat is effectively conducted, so that the heat is conducted more quickly and directly.

In other embodiments, the transparent crystal cold surface is adopted, the heat-conducting silicone grease and the cold conducting part layer are omitted, the transparent crystal cold surface is directly contacted with the surface of the skin, and the transparent crystal is directly acted on the skin, so that the refrigeration efficiency is improved, and the cold conducting speed is accelerated.

The cooling structure 100 of the present invention is preferably applied to a cosmetic apparatus. Referring to fig. 6 to 10, a beauty instrument 1000 is provided with a light source assembly 3, a power supply unit 4, and a control circuit board 5; the power supply unit 4 supplies power to the light source assembly 3; the front end surface of the beauty instrument is a working surface; the beauty instrument controls the power supply unit 4 to excite the light source assembly 3 to generate pulsed light through the control circuit board 5 for beauty treatment or therapeutic treatment. The cooling structure 100 of the beauty instrument adopting the above embodiment; the working surface of the beauty instrument is the cold surface 10 of the semiconductor refrigeration sheet of the refrigeration structure 100 or is refrigerated by the semiconductor refrigeration sheet 1. The beauty instrument 1000 comprises a housing 6, on which

air inlets

60, 65 and an air outlet 66 are arranged.

The refrigeration structure 100 is that the semiconductor refrigeration sheet 1 is provided with a radiator 23, and after being installed on the beauty instrument 1000, the refrigeration sheet 1 is positioned on the working surface of the beauty instrument; the light source assembly 3, the power supply unit 4, the control circuit board 5 and the radiator 23 of the refrigeration structure 100 are positioned in the shell; the air passages among the air inlet, the air duct of the radiator and the air outlet are communicated to form an air cooling channel; fan 25 is installed to one side mounting of radiator 23, and fan 25 is arranged in the forced air cooling passageway for inhale cold wind from the air intake or to air outlet exhaust hot-blast. The beauty instrument (e.g. epilator) 1000 may also be provided with a power cord and/or a charging interface for connection to an external power source.

The fan 25 is installed in a cavity 28, one side of the cavity 28 extends to form an air outlet channel 280, and the end of the air outlet channel 280 is connected to the air outlet 66.

The first air inlet 60, the air-cooled channel on the surface of the radiator, the fan 25, the air outlet channel 280 and the air outlet 66 are in air path communication to form an air-cooled channel (arrows in fig. 9 and 11) of the radiator, namely a first air-cooled channel; by starting the fan to work, the first air inlet 60 sucks cold air to the surface of the radiator 23 to take away heat, and the fan 25 discharges the hot air to the outside of the air outlet channel 280 and the air outlet 66, so that air-cooled heat dissipation of the radiator is realized. The fan 25 is electrically connected to the control circuit board 5, and its operation is controlled by the control circuit board 5.

In a preferred embodiment, the working head of the beauty instrument (depilator) directly adopts the cold surface of the semiconductor refrigeration sheet 1 as the working surface, and of course, the working head can also be used as the refrigeration sheet of the working surface and is attached to the working surface. The semiconductor refrigerating plate 1 adopts transparent crystals to directly serve as a cold surface 10 and simultaneously serve as a working surface of a skin contact surface. The transparent crystal cold surface is positioned on the whole front end surface of the beauty instrument (depilating instrument), so that a transparent medium whole surface working surface is formed and is directly contacted with the skin, the whole surface is refrigerated, and the effect is better.

The housing 6 comprises an upper shell 61 and a lower shell 62 (in a top-bottom orientation, relative to each other, for convenience of description only), and a cosmetic instrument (epilator) working head housing 63. In the first embodiment of the beauty instrument (hair removal device), the upper casing 61 and/or the lower casing 62 are provided with second air inlets 65 at positions corresponding to the light source assembly 3, and preferably, the upper and lower casings are provided with the second air inlets 65. The second air inlet 65 is communicated with a space air passage of the heat dissipation surface of the light source assembly 3, and is used for sucking cold air (cold air) from the outside inwards to perform air cooling heat dissipation on the light source assembly 3.

The lower case 62 is provided with an opening 69, and the heat sink 23 is located at a position behind the opening; the outer side of the opening 69 is covered with a baffle plate 64, and the baffle plate 64 is buckled on the opening 69 of the lower shell. The baffle is provided with air holes 68, and the air holes 68 can be one group or a plurality of groups of through holes which are densely arranged. The air holes 68 are used for communicating the external environment with the air passage inside the housing, specifically, the air passage in the space on the surface of the heat sink, and are used for sucking the ambient cold air into the surface of the heat sink 23 for air cooling and heat dissipation.

The gap between the edge of the baffle plate 64 and the edge of the lower shell opening 69 is used as an air outlet 66 and a lateral air inlet 67, the air outlet 66 is connected with the tail end of the air outlet channel 280, and the lateral air inlet 67 is used for forming lateral air inlet to the surface of the radiator. As shown in fig. 1 and 7, a gap is formed between the baffle 64 and the peripheral edge of the opening 69 of the lower shell 62, wherein a gap between one side edge forms an air outlet 66, and gaps between the other edges form a lateral air inlet 67, and the lateral air inlet 67 is communicated with an air path of an air cooling channel on the surface of the heat sink 23 behind the lower shell 62, and is used for laterally feeding air to the surface of the heat sink 23, thereby improving the entering amount and the air feeding speed of the cooling air. The lateral air inlet can also effectively avoid that the control circuit board 5 is easily eroded by water mist or water drops due to the front air inlet mode of the lower shell. The air hole 68 on the shell is used for positive air inlet, and the lateral air inlet 67 is combined for lateral air inlet, so that the first air inlet 60 for multi-directional air inlet is formed, the surface of the radiator is cooled by air, and the heat dissipation efficiency is improved. The first air inlet 60 is used for introducing cold air to the surface of the radiator, and preferably comprises a lateral air inlet 67 formed by a gap between the baffle plate 64 and the edge of the opening of the lower shell, and one or more groups of air holes 68 on the baffle plate. In other embodiments, the first air inlet 60 is not limited to the lateral air inlet 67 and the air hole 68.

The upper case 61 is equipped with keys or a key sheet. The control circuit board 5 is mounted on the inner side of the upper case 61.

The light source assembly 3 includes a light source 31 and a reflector 32 covering the light source. When the light source 31 is powered on, pulsed light is generated, the control circuit board 5 controls the power supply unit 4 to supply power to the light source, and the pulsed light is transmitted from the light source component to the working head of the beauty instrument (depilating instrument) and acts on the surface of skin, so that ablation and depilation are performed. In this embodiment, the heat generated by the operation of the light source assembly 3 is also dissipated through the heat sink. The light reflecting cup 32 is made of a heat conducting material, and heat generated by the light source 31 is conducted to the light reflecting cup 32 to dissipate heat. The light source 31 may be a lamp tube. The power supply unit 4 may adopt a capacitor or a power supply conversion module.

In the first embodiment of the present invention, the light source assembly 3 is mounted on the light source bracket 7, the light source bracket 7 is mounted in the housing 6 and is located behind the working head of the beauty instrument (hair removal instrument), the working head of the beauty instrument (hair removal instrument) is connected to the light source bracket 7 by the mirror surface cover 71, and pulsed light generated by the light source assembly 3 is transmitted to the working head of the beauty instrument (hair removal instrument) through the mirror surface cover 71 for hair removal treatment. Two ends of the light source component 3 are arranged on the light source bracket 7, and the light source bracket 7 is respectively provided with a shading sleeve for shading two ends of the light source component; the light shielding sleeve is obliquely arranged towards the surface of the light source reflecting cup 32, so that cold air sucked by the second air inlet 65 is guided to the surface of the reflecting cup to be beneficial to heat dissipation. The shading cover is used for guiding cold air and shading light, and light leakage at two mounting ends of the light source component is avoided. The light-shielding sleeve may be plate-shaped, and the plate surface is inclined to the surface of the light-reflecting cup 32. The shading sleeve can also be a sealing sleeve which is sleeved outside the two ends of the light source component.

In this embodiment, at least one ventilation pipeline 70 is disposed in the light source bracket 7, and each ventilation pipeline 70 is communicated with the surface of the light reflecting cup of the light source through the second air inlet 65, and is in air path communication with the space on the surface of the light source assembly, i.e., the air cooling cavity 33 described below. The end of the ventilation pipeline 70 is communicated with the second air inlet 65 arranged on the housing, and the cold air sucked by the second air inlet 65 is guided to the surface of the light source assembly for heat dissipation. Preferably, at least one ventilation pipeline 70 is respectively disposed in the upper and lower portions of the light source bracket 7, and correspondingly, the second air inlet 65 is disposed at a corresponding position of the upper and

lower housings

61, 62 and connected to the ventilation pipeline 70.

The light source assembly 3 and the mirror cover 71 are mounted on the light source bracket 7, and gaskets 73 are respectively sleeved on the peripheries of the outer portions of the light source assembly 3 and the mirror cover 71 and used for mounting and fixing and preventing light leakage.

In this embodiment, the light source assembly 3 is covered with an air guiding cover 30, and an air cooling cavity 33 for dissipating heat of the light source assembly is formed in a space between the air guiding cover 30 and the surface of the light source assembly 3. The air-cooling chamber 33 corresponds to the space of the surface of the light source assembly. The air cooling chamber 33 is in air path communication with a ventilation pipeline 70 arranged in the light source bracket 7, and further in air path communication with a second air inlet 65 arranged on the housing 6. The air passage between the air cooling cavity 33 and the cavity 28 for installing the fan is communicated. An air-cooling chamber 33 surrounds the light source assembly 3. Specifically, the inner side of the air guiding cover 30 is covered outside the light reflecting cup 32 of the light source, the air cooling cavity 33 is a space defined between the air guiding cover 30 and the surface of the light reflecting cup 32 of the light source, and cold air sucked into the air cooling cavity dissipates heat to the light reflecting cup 32 of the light source. The shape and size of the wind scooper 30 are matched with the light source reflection cup 32 and are installed close to the outer wall of the light source reflection cup to limit the air cooling chamber 33, and the configuration mode is to reduce the height of the gap and maximize the surface area of the opposite surface, so that a stronger negative pressure can be formed in the air cooling chamber 33 when the fan is started, and the strength of cold air sucked by the second air inlet 65 is improved. Preferably, one side of the wind scooper 30 is covered outside the reflector 32 and has a trumpet shape, and the other side is provided with a hollow connecting end 34. The trumpet-shaped edge is clamped and arranged on the light source bracket 7. The hollow connecting end 34 is communicated with the air cooling cavity 33 and is also communicated with the air channel between the cavities inside the fan 25; the width of the hollow connecting end 34 is designed on the maximum principle to facilitate the rapid gas flow.

The second air inlet 65 on the housing 6, the space on the surface of the light source assembly, i.e. the air cooling cavity 33, the cavity 28 for installing the fan, the air outlet channel 280 and the air outlet 66 are communicated with each other through air passages to form an air cooling channel of the light source assembly 3, i.e. a second air cooling channel. Through the work of starting fan 25, realize from second air intake 65 suction cold wind to the light source subassembly surface, take away the heat on light source subassembly surface and form hot-blastly, arrange to air-out passageway 280 by the fan in the hot-blastly suction cavity 28, discharge by air outlet 66 at last to realize the forced air cooling heat dissipation of light source subassembly 3.

The sealing member 8 is connected to the outside of the wind scooper 30. One side of the sealing element 8 is provided with an air guide connecting pipe; is connected with the hollow connecting end 34 of the wind scooper 30 so as to be communicated with the air cooling cavity 33; the other end of the connecting pipe is connected with an air inlet hole of the fan 25, and the air passage is communicated. The other side of the sealing member 8 forms an annular sealing ring which is mounted on the edge of the air inlet at one end of the fan 25 to prevent lateral air leakage.

In this embodiment, the fan 25 is mounted within a cavity 28, and the cavity 28 includes a circular cavity portion that snaps over the platen 29 to secure the fan 25 within the cavity. One side of the cavity 28 extends obliquely towards the air outlet 66 to form an oblique air outlet channel 280, which can prevent air from flowing backwards. The air outlet 250 of the fan, the air outlet channel 280 defined by the cavity 28 and the air outlet 66 are in air path communication. The central opening of the pressure plate 29 is aligned with an opening in the top or bottom of the fan housing, together forming the air inlet opening of the fan.

In other embodiments, the cavity 28 may not be provided, or the fan 25 may be located outside the cavity 28.

The working head of the beauty instrument (such as a depilator) adopts the transparent crystal to refrigerate the whole surface, the ice compress effect is good, and the customer experience is good.

Furthermore, the refrigerating surface of the semiconductor refrigerating sheet directly replaces a ceramic sheet with transparent crystals, the transparent crystals are directly fixedly connected with a metal conductor connected with an NP semiconductor couple, a novel semiconductor refrigerating sheet is integrally formed, and meanwhile, the transparent crystals can be directly contacted with the skin to be used as a working surface of the head of a beauty instrument (such as a depilator). The crystal is directly used as the refrigerating surface and the working surface of the semiconductor refrigerating sheet, and the following effects can be obtained:

1) The intermediate layer of the traditional refrigeration is eliminated, the loss of the refrigeration rate is reduced, and the refrigeration speed and efficiency are improved;

2) When the crystal is contacted with the skin or the contact surface, the whole surface of the crystal is refrigerated, so that the refrigerating area is increased, and the experience feeling is better;

3) The crystal is used as a refrigerating surface, pulsed light can directly penetrate through the transparent crystal to irradiate the skin, and the pain or discomfort caused by illumination is greatly reduced or eliminated after the light is cooled by the transparent crystal.

The beauty instrument 1000 of the present embodiment is mainly composed of a depilating apparatus, and can perform a depilating process by generating IPL pulsed light. If the filter with different wave bands is arranged on the machine head, the IPL pulse light is transmitted after being filtered, and other beauty functions or treatment functions can be realized.

Referring to fig. 11, the beauty treatment apparatus (depilating apparatus) 1000 of the present embodiment includes a working head, a cooling structure 100, a light source assembly 3, a light source heat dissipation system, a power supply unit 4, a control circuit board 5, and the like, as in the previous embodiments. In this embodiment, the cooling plate 1 and the transparent crystal (or transparent dielectric) 10' of the cooling structure 100 are mounted on the hair removal head of the beauty treatment apparatus (hair removal apparatus) 1000. The transparent crystal (or transparent dielectric body) 10' is located as a working surface over the entire front face of the working head (or epilator), thus forming a transparent dielectric working surface, in direct contact with the skin. The control circuit board 5 controls the power supply unit 4 to start the light source assembly 3 to work to generate pulse light, and the pulse light penetrates through the working surface to perform depilation treatment. The cooling plate 1 is cooled by the radiator. The housing 6 is provided with a first air inlet 60 and an air outlet 66. The beauty instrument (depilating instrument) 1000 may also be provided with a power cord and/or a charging interface to connect with an external power source.

The main difference between the present embodiment and the above embodiments is that the working head is different, and in the present embodiment, the transparent crystal (or transparent dielectric body) 10' is directly used as the working surface contacting with the skin. Preferably, the transparent crystal (or transparent medium body) 10' is the whole face of the working face, so as to form a front-end whole-face refrigeration effect. The transparent crystal (or transparent medium body) 10' is refrigerated by the refrigerating sheet 1 attached to the back surface. The working head casing 63 of the beauty instrument (depilating instrument) is a ring casing, and the transparent crystal (or transparent medium body) 10' is tightly installed in the ring edge of the casing. The refrigerating plate 1 is also clamped in the working head shell 63 and is attached to the back of the transparent crystal (or transparent medium body) 10'. The refrigerating sheet 1' arranged on the working head of the beauty instrument (depilatory instrument) can adopt the refrigerating sheet applicable to the prior art to refrigerate the working surface of the transparent crystal (or the transparent medium body). In this case, the cooling fins 1 of the cooling structure 100 may be ring-shaped, the hollow area inside forms a light-transmitting area, and the material of the cooling surface of the semiconductor cooling fin is not limited. The semiconductor refrigerating sheet with the transparent crystal cold surface can also be adopted.

As some embodiments, the working head of the cosmetic instrument (epilator) 1000 is equipped with at least two sensors 9 for detecting whether the transparent crystal working surface is completely or almost completely covered by skin to activate or deactivate the light source. Wherein, two inductors 9 are arranged on the diagonal line or the position close to the diagonal line of the edge of the working surface 10 of the transparent crystal. The inductor 9 is connected with the control circuit board 5.

In other embodiments, the light filter is arranged on the head of the beauty instrument (depilatory instrument) and is used for filtering the pulse wave generated by the light source, so that the beauty instrument product with different efficacies such as beauty or treatment efficacies can be obtained. Can adopt external removable work head, establish outside cosmetic instrument (appearance of mouling) work head, install the light filter in the removable work head to make the removable head of cosmetic instrument (appearance of mouling), obtain the pulse light of wave band, correspond and possess multiple functions. The head of the beauty instrument (depilator) is provided with a plug-in slot, and the optical filter can be inserted in a plug-in way, so that the beauty instrument with different beauty or treatment efficacies can be obtained.

In some embodiments, the wavelength of the light exiting the filter (the light wave filtered by the filter) may be: 510nm-1200nm, 530nm-1200nm, 560nm-1200nm, 590nm-1200nm, 610nm-1200nm, 640nm-1200nm and 645-750nm.

The filter used in the beauty instrument 1000 with depilation function preferably has a wavelength of 610nm or more, for example, a filter in the range of 610 to 1200nm is used, and light having a wavelength of more than 610nm is transmitted to the working face 10. In other embodiments, the light wave of at least one filter is 645nm to 750nm, i.e. the two-band filter is used to filter the light waves below 645nm and above 750nm, and the wavelength of the emergent light is 645nm to 750nm.

Examples of the wavelength of the filter and the cosmetic efficacy of the cosmetic instrument include, but are not limited to:

an optical filter of 430-1200nm for treating inflammatory acne;

480-1200nm filter for treating acne and vascular lesions;

530-1200nm filter for treating vascular (superficial fine blood vessel) and pigmentary lesion;

560-1200nm filter for wrinkle reduction, and for treatment of pigment and vascular lesions (deep and thick blood vessels);

the optical filter with the wavelength of 640-1200nm can be used for hair removal, skin tendering and deep red removal;

690-1200nm filter for depilation, deep red removal, etc.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, and are intended to be within the scope of the invention; the scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A refrigeration structure comprises a semiconductor refrigeration sheet, wherein the semiconductor refrigeration sheet comprises a PN galvanic couple particle layer, a cold surface and a hot surface; the cold surface and the hot surface are respectively arranged at the cold end and the hot end of the PN galvanic couple particle layer; the method is characterized in that: the hot end of the PN galvanic couple particle layer forms the hot surface of the semiconductor refrigerating sheet by using a heat conducting plate;

the heat conduction plate is a VC heat conduction plate, and a refrigerant is contained in the heat conduction plate;

the PN galvanic couple particle layer comprises P-type/N-type semiconductor particles; the heat conducting plate is directly contacted with the hot end or the P-type/N-type semiconductor particles, and the heat of the hot end is directly absorbed and conducted by the heat conducting plate;

a circuit is formed on the heat conducting plate and is used as a hot end circuit or is provided with a metal conductor; the hot end circuit or the metal conductor is connected with one end of the P type/N type semiconductor particles.

2. The refrigeration structure of claim 1 wherein:

p type/N type semiconductor particles of the PN galvanic couple particle layer are welded on the heat conducting plate, and one end of the P type/N type semiconductor particles is welded on a hot end circuit or a metal conductor;

the other end of the P-type/N-type semiconductor particles in the PN galvanic couple particle layer is welded on the cold surface of the semiconductor refrigerating sheet; a cold end circuit or a metal conductor is arranged on the cold surface and is electrically connected with the other end of the P-type/N-type semiconductor particle;

the PN galvanic couple particle layer is provided with a positive electrode and a negative electrode;

the hot end or cold end circuit or the metal conductor is connected in series with the internal circuit of the semiconductor refrigerating sheet, and the positive electrode and the negative electrode are connected with an external power supply;

the heat conducting plate is a metal plate; the surface of the metal plate is provided with an insulating layer and the hot-end circuit;

the insulating layer is an electric insulating film covering the surface of the heat conducting plate, and the surface of the heat conducting plate is etched to form the hot end circuit.

3. The refrigeration structure of claim 2 wherein:

a space is formed inside the heat conducting plate and used for containing a refrigerant;

the refrigeration structure further comprises a plurality of heat pipes; the heat pipe is connected with the heat conducting plate to dissipate heat together; a refrigerant is contained inside the heat pipe;

the interior of the heat pipe is communicated with the interior of the heat conducting plate to form a communicated closed space; a refrigerant flows through the sealed space;

the heat conducting plate is a metal plate; the heat pipe is a metal pipe;

the heat conducting plate comprises a heat conducting bottom plate and a heat conducting cover plate, the heat conducting bottom plate and the heat conducting cover plate are buckled with each other, and the space is formed inside the heat conducting plate;

the surface of the heat conducting bottom plate is provided with the hot end circuit or the metal conductor which is electrically connected with one end of the P-type/N-type semiconductor particles;

the heat conducting cover plate is provided with a hole site, the hole site is matched with the inner diameter or the outer diameter of the heat pipe, and one end of the heat pipe is fixedly inserted into the hole site and is communicated with the space inside the heat conducting plate.

4. A refrigeration structure according to claim 3, wherein:

the heat conducting plate and/or the heat pipe are/is provided with a closable vacuum nozzle which is communicated with the inside of the heat conducting plate and/or the inside of the heat pipe and is used for vacuumizing;

the heat conducting plate is a copper plate or an aluminum plate; the refrigerant is cooling liquid; the heat pipe is a copper pipe or an aluminum pipe;

copper powder is contained in the space inside the heat conducting plate and/or the heat pipe so as to increase the heat conducting and absorbing area;

inner ring sealing glue is arranged in the heat conduction plate to seal a joint gap between the heat conduction bottom plate and the heat conduction cover plate;

the heat-conducting bottom plate and the heat-conducting cover plate are welded or riveted into a whole;

one end of the heat pipe is welded or riveted with the hole site to be fixed into a whole.

5. The refrigeration structure of claim 1 wherein: the refrigeration structure further comprises a heat sink; the radiator is connected with the heat conducting plate or connected with the heat conducting plate through a heat pipe to form an integral structure and used for radiating heat for the heat conducting plate;

the radiator comprises a plurality of radiating fins; the radiating fins are metal radiating fins or graphene radiating fins;

the radiating fins are connected and fixed by a connecting structure; or the plurality of radiating fins are of an integral structure integrally formed by graphene;

the radiator comprises one or more groups of radiating fins which are arranged in parallel;

the heat pipe is arranged in the channel of the one or more groups of radiating fins which are arranged in parallel in a penetrating way and is matched with the radiating fins in a close contact way, or the heat pipe is fixed on the heat conducting fins which are combined on the radiating fins and is matched with the radiating fins in a close contact way.

6. The refrigeration structure of claim 2 wherein:

the heat conducting plate is annular;

the PN galvanic couple particle layer is annular, and the P-type/N-type semiconductor particles are arranged in the annular;

the cold surface is a transparent crystal cold surface, the other end of the P-type/N-type semiconductor particle is welded with the annular edge of the transparent crystal cold surface, the transparent crystal is a whole piece, the whole surface of the annular heat conducting plate is sealed, and the hollow area of the annular heat conducting plate is covered by the transparent crystal and forms a light transmitting area; or the cold surface is annular and made of transparent or non-transparent materials, and the annular middle area forms a light transmission area.

7. The refrigeration structure of claim 1 wherein:

the cold end of the semiconductor refrigerating sheet adopts transparent crystals to form a transparent crystal cold surface; the VC heat-conducting plate hot surface and the transparent crystal cold surface clamp a PN galvanic couple particle layer or P-type/N-type semiconductor particles inside to form a semiconductor refrigerating sheet.

8. A beauty instrument is provided with a light source component, a power supply unit and a control circuit board; the power supply unit supplies power to the light source component; the front end surface of the beauty instrument is a working surface; the beauty instrument controls the power supply unit to excite the light source assembly to generate pulse light through the control circuit board, so that the pulse light generated by the light source assembly penetrates through a working surface to perform beauty treatment; the method is characterized in that: the beauty instrument further comprises a refrigeration structure as claimed in any one of claims 1 to 7; the working surface of the beauty instrument is the cold surface of the semiconductor refrigerating sheet or is refrigerated by the cold surface of the semiconductor refrigerating sheet.

9. The cosmetic instrument of claim 8, wherein:

the beauty instrument takes a depilating instrument as a main body;

the semiconductor refrigerating sheet is provided with a radiator;

the beauty instrument comprises a shell, wherein an air inlet and an air outlet are formed in the shell; the light source assembly, the power supply unit, the control circuit board and the radiator of the radiating structure are arranged in the shell; the air passages among the air inlet, the air duct of the radiator and the air outlet are communicated to form an air cooling channel;

one side of radiator is installed and is had the fan, and the fan is located in the forced air cooling passageway for inhale cold wind or to air outlet exhaust hot-blast from the air intake.

10. The cosmetic instrument of claim 9 wherein: the optical filter is arranged on the head of the depilating instrument and is used for filtering the pulse wave generated by the light source component so as to obtain the beauty instrument with different efficacies of beauty treatment or treatment; or,

the beauty instrument is externally connected with a replaceable working head part, is sleeved outside the working head part of the depilating instrument, and is internally provided with an optical filter so that the replaceable head part of the depilating instrument can obtain pulsed light of a corresponding wave band; or

The head of the depilating instrument is provided with a plug-in slot for plug-in insertion of the optical filter, thereby obtaining the beauty instrument with different beauty or treatment efficacies.