CN113509261A - Hand-held semiconductor laser depilator with refrigeration - Google Patents

Hand-held semiconductor laser depilator with refrigeration Download PDF

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Publication number
CN113509261A
CN113509261A CN202111068682.6A CN202111068682A CN113509261A CN 113509261 A CN113509261 A CN 113509261A CN 202111068682 A CN202111068682 A CN 202111068682A CN 113509261 A CN113509261 A CN 113509261A
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CN
China
Prior art keywords
laser
pipe
radiator
refrigeration
heat dissipation
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111068682.6A
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Chinese (zh)
Inventor
杨林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan Lotuxs Technology Co ltd
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Wuhan Lotuxs Technology Co ltd
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Priority to CN202111068682.6A priority Critical patent/CN113509261A/en
Publication of CN113509261A publication Critical patent/CN113509261A/en
Priority to CN202123007700.8U priority patent/CN216724728U/en
Pending legal-status Critical Current

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B18/18—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves
    • A61B18/20—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B18/18—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves
    • A61B18/20—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser
    • A61B18/201—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser with beam delivery through a hollow tube, e.g. forming an articulated arm ; Hand-pieces therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B2018/00005—Cooling or heating of the probe or tissue immediately surrounding the probe
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B2018/00315—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body for treatment of particular body parts
    • A61B2018/00452—Skin
    • A61B2018/00476—Hair follicles
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B2018/00636—Sensing and controlling the application of energy
    • A61B2018/00773—Sensed parameters

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Surgery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Thermal Sciences (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Veterinary Medicine (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Biomedical Technology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Otolaryngology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiation-Therapy Devices (AREA)
  • Semiconductor Lasers (AREA)

Abstract

The invention discloses a hand-held semiconductor laser depilator with refrigeration, which comprises a shell, wherein a laser component and a heat dissipation component are arranged in the shell; the laser component comprises a laser and an optical waveguide, and laser generated by the laser is emitted after passing through the optical waveguide; the heat dissipation assembly comprises a semiconductor refrigeration sheet, a TEC radiator and a laser radiator, wherein the cold end of the semiconductor refrigeration sheet is attached to the optical waveguide, the hot end of the semiconductor refrigeration sheet is connected with the TEC radiator, and the laser radiator is attached to the laser; and a fan is arranged between the TEC radiator and the laser radiator to form a radiating air channel. The invention has simple structure and good heat dissipation effect.

Description

Hand-held semiconductor laser depilator with refrigeration
Technical Field
The invention relates to the field of household medical equipment, in particular to a handheld semiconductor laser depilator with refrigeration.
Background
Most of the existing household depilating instruments are IPL depilating instruments, high energy is output by discharging through a flash capacitor to polish a high-pressure xenon lamp, and then strong pulse light is output to depilate.
A relatively perfect laser depilating instrument product is not available in the market of the household depilating instrument, and because the laser can emit a large amount of heat during working, the service life of the household depilating instrument can be influenced if the laser cannot timely and effectively dissipate the heat.
In addition, as laser depilation is to use laser to penetrate the root of the hair follicle to destroy the hair follicle tissue, slight stabbing pain can be generated when in use, and if the temperature is not reduced timely, the stabbing pain can be enhanced.
Disclosure of Invention
The invention mainly aims to provide a handheld semiconductor laser depilating instrument with refrigeration, which can quickly dissipate heat and reduce the pain feeling of skin through cooling.
The technical scheme adopted by the invention is as follows:
the hand-held semiconductor laser depilator with refrigeration comprises a shell, wherein a laser component and a heat dissipation component are arranged in the shell;
the laser component comprises a laser and an optical waveguide, and laser generated by the laser is emitted after passing through the optical waveguide;
the heat dissipation assembly comprises a semiconductor refrigeration sheet, a TEC radiator and a laser radiator, wherein the cold end of the semiconductor refrigeration sheet is attached to the optical waveguide, the hot end of the semiconductor refrigeration sheet is connected with the TEC radiator, and the laser radiator is attached to the laser; and a fan is arranged between the TEC radiator and the laser radiator to form a radiating air channel.
According to the technical scheme, the TEC radiator comprises a first radiating pipe, a plurality of first radiating fins are fixed on the first radiating pipe, and the first radiating pipe is also connected with the hot end of the semiconductor refrigerating fin; the laser radiator comprises a second radiating pipe, wherein a plurality of second radiating fins are fixed on the second radiating pipe, and the first radiating fins and the second radiating fins are arranged on two sides of the fan to form an air channel.
According to the technical scheme, the first radiating pipe and the second radiating pipe are both U-shaped pipes, the bottom of the U-shaped pipe of the first radiating pipe is connected with the hot end of the semiconductor refrigerating sheet, and a plurality of first radiating fins arranged at intervals are fixed on two pipe parts of the U-shaped pipe of the first radiating pipe; the bottom of the U-shaped pipe of the second radiating pipe is connected with the laser, and a plurality of second radiating fins which are arranged at intervals are fixed on two pipe parts of the U-shaped pipe of the second radiating pipe.
According to the technical scheme, the parts of the shell, which correspond to the TEC radiator and the laser radiator, are provided with the vent holes.
According to the technical scheme, the drive board is further arranged in the shell and connected with the laser, the light emitting key used for adjusting the light emitting interval of the laser is arranged on the surface of the shell, and the light emitting key is connected with the drive board.
In connection with the above technical scheme, the surface of the shell is also provided with a rapid light-emitting decorative lamp.
According to the technical scheme, the shell comprises two half shells, and a middle shell is arranged between the two half shells.
According to the technical scheme, the middle shell is provided with the switch key.
According to the technical scheme, the laser is provided with the dust cover.
And a skin color sensor is arranged beside the light outlet of the optical waveguide.
According to the technical scheme, the light guide piece is further arranged in the light outgoing direction of the light guide.
The invention has the following beneficial effects: the TEC radiator and the laser radiator of the hand-held semiconductor laser depilation instrument with refrigeration share one fan to form a heat dissipation air duct penetrating through the whole depilation instrument, and the hand-held semiconductor laser depilation instrument with refrigeration has a compact structure and a good heat dissipation effect.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a perspective view of a hand-held semiconductor laser epilator with cooling according to an embodiment of the invention;
FIG. 2 is an exploded view of a hand-held semiconductor laser epilator with cooling according to an embodiment of the invention;
FIG. 3 is a schematic diagram of a heat dissipation structure of an optical waveguide according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a heat dissipation structure of a laser according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the invention.
In the figure: 10. a housing; 11. a vent hole; 12. a light emitting key; 13. a light-emitting decorative lamp; 131. switching a key; 14. a middle shell; 15. a light emitting key sheet; 16. a rapid light-emitting decorative lamp; 17. a front housing; 18. a rear housing; 21. a laser; 22. an optical waveguide; 23. a dust cover; 31. a semiconductor refrigeration sheet; 32. a TEC radiator; 321. a first radiating pipe; 322. a first heat sink; 33. a laser radiator; 331. a second heat dissipation pipe; 332. a second heat sink; 34. a fan; 40. a drive plate; 35. a fan windshield; 51. a skin color sensor; 52. a detection circuit; 53. a light guide.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1 and 2, the handheld semiconductor laser hair removal device with refrigeration of the embodiment of the invention comprises a housing 10, wherein a laser component and a heat dissipation component are arranged in the housing 10;
the laser module includes a laser 21 and an optical waveguide 22, and laser light generated by the laser 21 is emitted through the optical waveguide 22.
The heat dissipation assembly comprises a semiconductor refrigeration piece 31, a TEC radiator 32 and a laser radiator 33, wherein the cold end of the semiconductor refrigeration piece 31 is attached to the optical waveguide 22, the hot end of the semiconductor refrigeration piece is connected with the TEC radiator 32, and the laser radiator 33 is attached to the laser 21; a fan 34 is further arranged between the TEC heat sink 32 and the laser heat sink 33 to form a heat dissipation air duct.
Specifically, as shown in fig. 3, 4 and 5, the TEC radiator 32 includes a first radiating pipe 321 on which a plurality of first radiating fins 322 are fixed, the first radiating pipe 321 is further connected to the hot end of the semiconductor chilling plate 31; the laser radiator 33 includes a second radiating pipe 331 on which a plurality of second radiating fins 332 are fixed, and a plurality of first radiating fins 322 and a plurality of second radiating fins 332 are disposed at both sides of the fan 34 to form a radiating air duct.
Further, the first radiating pipe 321 and the second radiating pipe 331 are both U-shaped pipes, the bottom of the U-shaped pipe of the first radiating pipe is connected with the hot end of the semiconductor chilling plate 31, and a plurality of first radiating fins 322 arranged at intervals are fixed on two pipe parts of the U-shaped pipe of the first radiating pipe 321; the bottom of the U-shaped pipe of the second heat pipe 331 is connected to the laser 21, and a plurality of second fins 332 arranged at intervals are fixed to both pipe portions of the U-shaped pipe of the second heat pipe 331. The first and second heat dissipating fins 322 and 332 are spaced apart from each other at the same interval and are communicated with each other, and heat is transferred to the outside along the heat dissipating air passage formed between the heat dissipating fins by the blowing of the intermediate fan 34.
Accordingly, the housing 10 is provided with a vent 11 at a portion corresponding to the TEC heat sink 32 and the laser heat sink 33, so as to facilitate heat transfer to the external environment.
Further, a driving board 40 is disposed in the housing 10 and connected to the laser 21, and the driving board 40 serves as a circuit control board for the whole depilating apparatus. The surface of the shell is provided with a light-emitting key 12 for adjusting the light-emitting interval of the laser, the light-emitting key 12 is connected with a light-emitting key board 15, and the light-emitting key board 15 is connected with a driving board 40. The casing 10 is also provided with a light-emitting decorative lamp 13 (connected with a light-emitting key board 15) for indicating when light is emitted.
The surface of the shell is also provided with a rapid light-emitting decorative lamp 16 which is connected with the light-emitting key board 15.
In particular, the casing 10 comprises two half-shells (a front shell 17 and a rear shell 18) between which a middle shell 14 is also provided. A plurality of mounting assemblies and slots are provided in the housing 10 to facilitate assembly of the various structures. The middle shell 14 is provided with a switch button 131 connected with the driving board 40.
In order to prevent the laser 21 from being contaminated, the present invention further provides a dust cover 23 on the laser 21. A fan shroud 35 is provided outside the fan 34.
In order to detect the light emitted by the laser when the skin of a human body is detected, the invention is provided with a skin color detection assembly, the skin color detection assembly comprises a skin color sensor 51, a detection circuit 52 and a light guide part 53, the skin color sensor 51 is connected with the detection circuit 52, and the light guide part 53 guides the sensed skin color light to the skin color sensor 51 on the skin color sensor 51. The skin color sensor 51 may be disposed near the light exit of the light guide 22, and when the skin color detection component does not detect skin, the laser 21 does not emit laser light, which is energy-saving and safe.
In conclusion, the hand-held semiconductor laser depilating instrument with refrigeration provided by the invention has the advantages that the TEC radiator and the laser radiator share one fan to form a heat dissipation air duct penetrating through the whole depilating instrument, the structure is compact, and the heat dissipation effect is good.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.

Claims (10)

1. A hand-held semiconductor laser depilator with refrigeration is characterized by comprising a shell, wherein a laser component and a heat dissipation component are arranged in the shell;
the laser component comprises a laser and an optical waveguide, and laser generated by the laser is emitted after passing through the optical waveguide;
the heat dissipation assembly comprises a semiconductor refrigeration sheet, a TEC radiator and a laser radiator, wherein the cold end of the semiconductor refrigeration sheet is attached to the optical waveguide, the hot end of the semiconductor refrigeration sheet is connected with the TEC radiator, and the laser radiator is attached to the laser; and a fan is arranged between the TEC radiator and the laser radiator to form a radiating air channel.
2. The portable semiconductor laser depilation instrument with refrigeration of claim 1, wherein the TEC radiator comprises a first radiation pipe on which a plurality of first radiation fins are fixed, the first radiation pipe being further connected to the hot end of the semiconductor refrigeration fin; the laser radiator comprises a second radiating pipe, wherein a plurality of second radiating fins are fixed on the second radiating pipe, and the first radiating fins and the second radiating fins are arranged on two sides of the fan to form an air channel.
3. The handheld semiconductor laser depilation instrument with refrigeration function as claimed in claim 2, wherein the first heat dissipation pipe and the second heat dissipation pipe are both U-shaped pipes, the bottom of the U-shaped pipe of the first heat dissipation pipe is connected with the hot end of the semiconductor refrigeration sheet, and a plurality of first heat dissipation fins arranged at intervals are fixed on two pipe parts of the U-shaped pipe of the first heat dissipation pipe; the bottom of the U-shaped pipe of the second radiating pipe is connected with the laser, and a plurality of second radiating fins which are arranged at intervals are fixed on two pipe parts of the U-shaped pipe of the second radiating pipe.
4. The portable semiconductor laser depilation instrument with cooling function as claimed in claim 1, wherein the housing has ventilation holes at portions corresponding to the TEC heat sink and the laser heat sink.
5. The portable semiconductor laser depilation instrument with refrigeration function as claimed in claim 1, wherein a driving board is further provided in the housing and connected to the laser, and a light-emitting button for adjusting a light-emitting interval of the laser is provided on a surface of the housing and connected to the driving board.
6. The portable semiconductor laser depilation instrument with refrigeration function as claimed in claim 5, wherein a rapid light-emitting decorative lamp is further provided on the surface of the housing.
7. The hand-held semiconductor laser hair removal device with cooling of claim 1, wherein the housing comprises two half shells, and a middle shell is further disposed between the two half shells.
8. The portable semiconductor laser hair removal device with cooling function as claimed in claim 7, wherein a switch button is provided on the middle housing.
9. The portable semiconductor laser hair removal device with refrigeration of claim 1, wherein a skin color sensor is further disposed near the light exit of the optical waveguide.
10. A hand-held semiconductor laser hair removal device with cooling as claimed in any one of claims 1-9, wherein a light guide is further provided in the light exit direction of the light guide.
CN202111068682.6A 2021-09-13 2021-09-13 Hand-held semiconductor laser depilator with refrigeration Pending CN113509261A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202111068682.6A CN113509261A (en) 2021-09-13 2021-09-13 Hand-held semiconductor laser depilator with refrigeration
CN202123007700.8U CN216724728U (en) 2021-09-13 2021-12-02 Handheld semiconductor laser depilator with refrigeration function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111068682.6A CN113509261A (en) 2021-09-13 2021-09-13 Hand-held semiconductor laser depilator with refrigeration

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CN113509261A true CN113509261A (en) 2021-10-19

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CN202123007700.8U Active CN216724728U (en) 2021-09-13 2021-12-02 Handheld semiconductor laser depilator with refrigeration function

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023077653A1 (en) * 2021-11-02 2023-05-11 武汉洛芙科技股份有限公司 Handheld household laser hair removal instrument and system thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102940529A (en) * 2012-11-22 2013-02-27 西安炬光科技有限公司 Semiconductor laser device system used for laser medical cosmetology
CN103877678A (en) * 2014-04-08 2014-06-25 山东杰美医疗科技有限公司 High-power semiconductor laser hair removal instrument
CN207640487U (en) * 2017-06-07 2018-07-24 北京康鼎医疗科技有限公司 A kind of semiconductor laser depilatory apparatus and its host system
CN208541701U (en) * 2017-09-12 2019-02-26 武汉博激世纪科技有限公司 A kind of hand-held freezing point depilatory apparatus
CN111000630A (en) * 2019-12-07 2020-04-14 北京芯动力激光科技有限公司 Hand-held semiconductor laser beauty device
CN213312973U (en) * 2020-04-02 2021-06-01 深圳市予一电子科技有限公司 Unhairing instrument
CN213722368U (en) * 2020-10-26 2021-07-20 深圳市吉瑞德隆电子科技有限公司 Heat pipe heat dissipation appearance that moults

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102940529A (en) * 2012-11-22 2013-02-27 西安炬光科技有限公司 Semiconductor laser device system used for laser medical cosmetology
CN103877678A (en) * 2014-04-08 2014-06-25 山东杰美医疗科技有限公司 High-power semiconductor laser hair removal instrument
CN207640487U (en) * 2017-06-07 2018-07-24 北京康鼎医疗科技有限公司 A kind of semiconductor laser depilatory apparatus and its host system
CN208541701U (en) * 2017-09-12 2019-02-26 武汉博激世纪科技有限公司 A kind of hand-held freezing point depilatory apparatus
CN111000630A (en) * 2019-12-07 2020-04-14 北京芯动力激光科技有限公司 Hand-held semiconductor laser beauty device
CN213312973U (en) * 2020-04-02 2021-06-01 深圳市予一电子科技有限公司 Unhairing instrument
CN213722368U (en) * 2020-10-26 2021-07-20 深圳市吉瑞德隆电子科技有限公司 Heat pipe heat dissipation appearance that moults

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023077653A1 (en) * 2021-11-02 2023-05-11 武汉洛芙科技股份有限公司 Handheld household laser hair removal instrument and system thereof

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Application publication date: 20211019