CN116839397A

CN116839397A - Photon radio frequency beauty instrument

Info

Publication number: CN116839397A
Application number: CN202211618875.9A
Authority: CN
Inventors: 周莹; 李兵
Original assignee: Shenzhen Yuyi Electronic Technology Co Ltd
Current assignee: Shenzhen Yuyi Electronic Technology Co Ltd
Priority date: 2022-10-17
Filing date: 2022-12-15
Publication date: 2023-10-03
Also published as: CN219390650U; CN219083434U; CN115854584A

Abstract

The application relates to a photon radio frequency beauty instrument, which comprises a shell, wherein a control module, a radio frequency module, a light source module, a cooling fan module and a power supply assembly are arranged in the shell; the shell is provided with a light outlet, and a light outlet panel is arranged in the light outlet. The photon radio frequency beauty instrument is a product integrating radio frequency and photon treatment, and photon auxiliary treatment is carried out at the same time of radio frequency treatment.

Description

Photon radio frequency beauty instrument

The application claims the priority of two prior applications in China, and the priority information is as follows: the prior application number is 202211269145.2, the prior application date is 2022-10-17, and the application is named as a refrigeration module and an optical beauty instrument; and, the prior application number is 202211479338.0, the prior application date is 2022-11-24, and the application is named as a cooling fan module. The specification, claims and drawings of these two priority classes are all incorporated into this application.

Technical Field

The application relates to the field of heat dissipation, in particular to a heat dissipation fan module.

Background

The radiating fan module realizes the beauty function by using pulse light or laser or other light sources, the light source module generates light waves, and the light waves are emitted from a light emitting window of a working head part of the radiating fan module so as to perform beauty treatment on the skin surface with the end face of the working head part in contact (or not in direct contact), such as the functions of dehairing, skin tendering, spot removal, anti-inflammation, software blood vessel removal, wrinkle removal, skin red removal, acne treatment, vascular lesions treatment, pigment lesions treatment and the like. Some portable or handheld cooling fan modules in the market at present have poor cooling effect in the machine body, influence the work of the beauty instrument and cannot achieve the expected beauty effect; the internal structure of the machine body is complex, the refrigeration effect of the working face is poor, the skin is burnt, and the user experience is poor.

The instruments for removing wrinkles, tightening, brightening, whitening and tendering the skin are single in the market. The effect produced by different instruments on the skin is singular; in terms of economy, timeliness and usability, different instruments are required to be purchased to achieve different effects, so that cost is wasted, treatment time is prolonged during use, and time intervals for showing effects are correspondingly prolonged.

Disclosure of Invention

The technical problems to be solved by the application are as follows: provides a photon radio frequency beauty instrument, which solves the problem of instrument singleness of removing wrinkles, tightening, brightening, whitening and tendering skin on the market.

The application aims to solve the other technical problems that: a cooling fan module is provided to solve the problems of cooling and working face refrigeration of the existing cooling fan module.

In order to solve the technical problems, the application adopts the following technical scheme:

a photon radio frequency beauty instrument comprises a shell, wherein a control module, a radio frequency module electrically connected with the control module, a light source module, a cooling fan module and a power supply assembly are arranged in the shell; the shell is provided with a light outlet, and a light outlet panel is arranged in the light outlet.

Further, the control module comprises a main control board; the radio frequency module comprises a radio frequency circuit board electrically connected with the main control board and a plurality of pairs of radio frequency electrodes electrically connected with the radio frequency circuit board; the outer wall surface of the light-emitting panel is a working surface and is used for being contacted with skin; the plurality of pairs of radio frequency electrodes are arranged on the working surface.

Further, the light source module comprises a light source lamp and a reflecting cup provided with the light source lamp; an air flow channel for radiating the light source lamp is formed in the reflecting cup, and the reflecting cup is provided with an air inlet and an air outlet of the air flow channel for radiating the light source lamp; an air flow channel is formed in the photon radio frequency beauty instrument shell, a plurality of ventilation openings are formed on the shell and are used as an air inlet and an air outlet of the air flow channel and communicated with the external environment so as to suck cold air from the external environment, and hot air subjected to heat exchange in the air flow channel is discharged out of the shell; the cooling fan module comprises a fan housing and an impeller, wherein the interior of the fan housing is a cavity, and the impeller is arranged in the cavity; the fan housing is provided with a plurality of ventilation openings which are used as an air inlet and an air outlet to communicate the cavity with an air path outside the fan to form an air flow passage of the fan;

the air flow passage for radiating the light source lamp is communicated with the air flow passage in the photon radio frequency beauty instrument shell; the air flow passage of the fan is communicated with the air flow passage in the photon radio frequency beauty instrument shell; the reflecting cup is arranged on the lamp holder bracket or the combined bracket thereof; the lamp holder support is internally provided with a light outlet channel, the front end of the light outlet channel is a light outlet, and the rear end of the light outlet channel is a light outlet window of the reflecting cup.

In some embodiments, an air outlet on the fan housing is communicated with an air inlet of an air flow channel for heat dissipation of the light source lamp; an air outlet of an air flow channel for radiating the light source lamp is communicated with an air outlet arranged on the photon radio frequency beauty instrument shell through a flow guide channel of the air guide cover; the air inlet of the fan housing is communicated with the air inlet arranged on the photon radio frequency beauty instrument shell; the outer wall of the reflecting cup is provided with a heat dissipation piece; the lamp holder support or the combined support thereof is internally provided with a cavity, an air inlet and an air outlet which are communicated with the air passage of the cavity, so as to form an air flow passage in the lamp holder support or the combined support thereof, and the air flow passage is communicated with the air flow passage for radiating the light source lamp; the reflecting cup and the radiating piece thereof are positioned in the air flow channel of the lamp holder bracket or the combined bracket; an air outlet on the fan housing and an inlet of a diversion channel of the air guide housing are respectively communicated with an air flow channel of the lamp holder bracket or the combined bracket thereof and an air flow channel of the light source lamp for radiating through the air inlet and the air outlet of the lamp holder bracket or the combined bracket thereof; the outlet of the diversion channel of the wind scooper is in butt joint with an air outlet arranged on the photon radio frequency beauty instrument shell.

In some embodiments, a first optical filter is arranged at the rear end of the light outlet channel or at the light outlet window of the light reflecting cup, and the light source lamp is covered in the cup Yu Fanguang and used for filtering light; the light source module is provided with a switching filter module; the switching optical filter module comprises a second optical filter, and the second optical filter is fixedly arranged on the optical filter bracket; the lamp holder support is provided with a space for switching the optical filter, so that the second optical filter can move in or out of the light outlet channel or the light outlet window; the switching filter module further includes a driving assembly.

In some embodiments, the driving assembly adopts a motor to drive the switching optical filter, and comprises a motor, a screw rod connected with an output shaft of the motor and a poking piece capable of linearly and reciprocally sliding on the screw rod; the poking plate is slidably arranged on the screw rod in a penetrating way and is connected with the optical filter bracket; the screw rod is driven to rotate forwards and backwards through the forward rotation and the backward rotation of the motor, and the poking plate moves in a reciprocating way along the screw rod to drive the optical filter support to move forwards and backwards, so that the second optical filter is moved into or out of the light outlet channel or the light outlet window; or alternatively, the process may be performed,

the driving assembly adopts an electromagnet, and the filter support and the second filter are driven to reciprocate by the on-off bidirectional adsorption of the electromagnet, so that the filter is switched; or alternatively

The driving assembly adopts a manual mode, and the shifting piece is moved by the manual mode or matched by the manual gear set, so that the optical filter support and the second optical filter are driven to reciprocate, and the optical filter is switched.

In some embodiments, the power assembly includes a plug-in interface electrically connected to the main control board and to an external power source to provide power; the power supply assembly also comprises an energy storage capacitor or a battery; the energy storage capacitor or the battery is electrically connected with the main control board and the light source lamp.

In some embodiments, the cooling fan module comprises a fan housing and an impeller, wherein the interior of the fan housing is a cavity, and the impeller is installed in the cavity; the fan housing is provided with a plurality of ventilation openings which are used as an air inlet and an air outlet to communicate the cavity with an air path outside the fan to form an air flow passage of the fan; the fan housing includes a thermally conductive housing; the heat conducting shell is a heat conducting element made of a heat conducting material, or is formed by a heat pipe or a super heat conducting plate or VC; the cooling fan module further comprises a refrigerating module; the refrigerating module comprises a semiconductor refrigerating sheet, the hot surface of the semiconductor refrigerating sheet is connected with the heat conducting shell in a rapid heat transfer mode, or the heat conducting shell is the hot surface of the semiconductor refrigerating sheet, so that heat generated by the hot surface can be rapidly radiated through an air flow channel of the fan; the cold face of the semiconductor refrigerating sheet is used for giving out light panel refrigeration: the light-emitting panel is a cold surface of the semiconductor refrigeration piece, or the cold surface of the semiconductor refrigeration piece is connected with the light-emitting panel in a rapid heat transfer mode, so that rapid cold conduction is realized.

In some embodiments, the cold surface of the semiconductor refrigeration sheet is connected with the light emitting panel in a rapid cold-conducting manner through a cold-conducting piece; the cold conducting piece is a heat conducting element made of heat conducting materials, or is formed by a heat pipe or a super heat conducting plate or VC.

In some embodiments, the super heat pipe is an aluminum superconducting pipe, and the super heat pipe is an aluminum superconducting plate; the through channels inside the aluminum superconducting pipe or the aluminum superconducting plate are single channels or multiple channels; more than one micro-groove is formed on the inner wall of the channel; the channels and the micro-groove flow paths on the inner walls of the channels are communicated; the material in the walls of the micro-grooves forms a porous structure; the two ends of the channel are sealed, and working fluid is encapsulated inside the channel.

In some embodiments, the outer wall of the heat conducting shell is provided with a semiconductor refrigerating sheet, the inner wall of the heat conducting shell is provided with a radiating sheet, and the radiating sheet is connected with the heat conducting shell in a rapid heat transfer way; the radiating fin is positioned in an air flow passage of the fan; the air channel of the radiating fin is consistent with the air flow direction of the rotation of the impeller.

In some embodiments, the fan housing comprises a side elevation shell outside the impeller, a bottom shell and an upper shell which are arranged at two ends in the axial direction, and a cavity which forms the inside of the fan in a surrounding manner; the side elevation shell at least partially comprises the heat conducting shell.

The beneficial effects of the application are as follows:

the photon radio frequency beauty instrument of the application is a photon radio frequency beauty instrument integrating radio frequency and photon treatment. The product is used for photon auxiliary treatment while being used for radio frequency treatment; the radio frequency heats the dermis layer of the skin, and utilizes the penetrability of red light wave band in photons to heat the deep skin at the same time, thereby rapidly heating the skin area to be treated currently. Effectively improving the treatment speed. Meanwhile, yellow light in photons and green light wave bands are absorbed by the epidermis layer due to the fact that the penetrability is weaker than that of red light, so that the effect of improving treatment is achieved by red blood filaments. Thereby achieving the effects of removing wrinkles, tightening, brightening, whitening and tendering skin.

Furthermore, at least part of the shell of the fan housing is arranged as a heat pipe or a super heat conducting plate or VC, so that the heat source is quickly transferred into the cavity of the fan by utilizing the phase change heat conduction characteristic of the heat pipe or the super heat conducting plate or VC, and the heat is dissipated by the air flow generated when the fan impeller rotates. The application effectively utilizes the internal space of the fan to ensure that the product volume is smaller and the heat dissipation efficiency is higher; the novel fan is more effectively combined with application products, and the original shell material cost of the fan is reduced. The contact area between the radiating fin and the air flow is enlarged. Under the condition of equal heat dissipation requirement, the heat dissipation efficiency is improved so that the speed, current, noise and the like of the fan can be reduced.

The present application will be described in further detail with reference to the accompanying drawings.

Drawings

Fig. 1 is a perspective view of a cooling fan module according to a first embodiment of the present application.

Fig. 2 is a perspective view of another view of the cooling fan module according to the first embodiment of the present application.

Fig. 3 is an exploded view of a radiator fan module according to a first embodiment of the present application.

Fig. 4 is a schematic cross-sectional view of a cooling fan module according to a first embodiment of the present application.

Fig. 5 is a schematic structural view of a side elevation volute of a radiator fan module according to a first embodiment of the present application.

Fig. 6 is a schematic diagram of an alternative configuration of the embodiment shown in fig. 5.

Fig. 7-8 are schematic views of alternative constructions of the embodiment of fig. 5. .

Fig. 9-10 are schematic structural views of alternative embodiments of the radiator fan module shown in fig. 1-2.

Fig. 11 is a perspective view of a cooling fan module according to a second embodiment of the present application.

Fig. 12 is a schematic diagram of an alternative embodiment of fig. 11.

Fig. 13 is a schematic cross-sectional view of a radiator fan module according to a second embodiment of the present application.

Fig. 14 is a perspective view of a radiator fan module according to a second embodiment of the present application with a housing portion outer wall removed.

Fig. 15 is an exploded view of a radiator fan module according to a second embodiment of the present application.

Fig. 16-17 are perspective views of a radiator fan module according to a third embodiment of the present application from different viewing angles.

Fig. 18 to 19 are schematic cross-sectional views of different positions of a radiator fan module according to a third embodiment of the present application.

Fig. 20 is a partially exploded view of a radiator fan module according to a third embodiment of the present application.

Fig. 21 is an exploded view of a radiator fan module according to a third embodiment of the present application.

Fig. 22 is an exploded view of a radiator fan module according to a third embodiment of the present application.

Fig. 23 is a schematic structural view of an embodiment of the semiconductor refrigeration module of the present application.

Fig. 24 is a perspective view of an embodiment of the semiconductor refrigeration module of the present application.

Fig. 25 is a partial exploded view of the semiconductor refrigeration module of the present application.

Fig. 26 is a perspective view of the semiconductor refrigeration module of the present application.

Fig. 27 is a partial exploded view of the semiconductor refrigeration module of the present application.

Fig. 28 is a schematic view of a part of the structure of the semiconductor refrigeration module of the present application.

Fig. 29 is a schematic diagram showing a conversion structure of an embodiment of the semiconductor refrigeration module according to the present application, wherein fig. 29 (a) and 29 (b) are respectively different viewing angles.

Fig. 30 is a schematic structural view of an alternative embodiment of the semiconductor refrigeration module of the present application, in which fig. 30 (a) and 30 (b) are different embodiments, respectively.

Fig. 31-32 are perspective views of a photonic radio frequency cosmetic instrument according to an embodiment of the present application.

Figures 33-34 are cross-sectional views of a photonic radio frequency cosmetic instrument according to embodiments of the present application.

Fig. 35 is an exploded view of a photon rf cosmetic device according to an embodiment of the present application.

Fig. 36-42 are block diagrams of a cooling fan module of a photon rf cosmetic instrument according to an embodiment of the application.

Fig. 43 is a structural diagram of a heat conductive housing of a cooling fan module of a photon rf cosmetic device according to an embodiment of the application.

Fig. 44-48 are schematic structural diagrams or state diagrams of a switching filter module of a photon rf cosmetic instrument according to an embodiment of the application.

Detailed Description

It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other, and the present application will be further described in detail with reference to the drawings and the specific embodiments.

The photon RF cosmetic instrument 200 of the present application integrates RF and photon therapy. The product can carry out photon auxiliary treatment (photon wave band can be carried out by switching and adjusting the optical filter) while carrying out radio frequency treatment; the radio frequency heats the dermis layer of the skin, and utilizes the penetrability of red light wave band (above 600 nm) in photons to heat the deep skin at the same time, thereby rapidly heating the skin area to be treated currently. Effectively improving the treatment speed. Meanwhile, yellow light and green light wave bands (480-600 nm) in photons are absorbed by the epidermis layer due to the fact that penetrability is weaker than that of red light, so that the effects of treatment improvement of the epidermis layer, spots and red blood filaments are achieved. Thereby achieving the effects of removing wrinkles, tightening, brightening, whitening and tendering skin.

The regeneration of the collagen needs to utilize the radio frequency high-frequency heating principle to accelerate the aging and metabolism of the original collagen, and then regenerate the new collagen through the repair mechanism of the human body. The three-strand molecular structure of the collagen needs to reach a certain temperature to be condensed; the radio frequency heating mode is a continuous heating and temperature rising process, so that the heating period is relatively longer; and experience feeling during continuous heating is poor; through photon auxiliary treatment mode, the temperature of the dermis layer can be instantly overlapped to reach the required treatment temperature, and simultaneously the sensitivity of the human body to temperature rise is reduced, so that the experience is improved. And the superfluous heat sensation on the body surface is reduced by the way of refrigerating ice sensation.

Referring to fig. 31-35, in a preferred embodiment, the photonic rf cosmetic apparatus 200 includes an rf module, a light source module, a cooling fan module combined with a cooling module, a switching filter module, a control module, and a power supply assembly, which are disposed inside or on the housing 210.

The inside of the shell 210 is a cavity, a plurality of ventilation openings 201 and 202 are arranged on the shell 210 and serve as an air inlet and an air outlet of an air flow channel in the photon radio frequency beauty instrument 200, cold air enters from the outside of the beauty instrument through the ventilation opening (air inlet) 201, heat in the beauty instrument (such as heat generated by a circuit board, a light source lamp, a hot end of a refrigerating piece or other heating elements) is taken away through the air flow channel, and finally the heat is discharged out of the shell through the ventilation opening (air outlet) 202 on the shell, and an air flow channel in the beauty instrument is shown by an arrow route in fig. 33-34. In this embodiment, the housing 210 is formed by buckling a left housing 211 and a left housing 212, and includes a handle portion and a head portion. The head is spherical (not limited to the spherical shape) and is provided with a light outlet, and a front decorative ring 213 is arranged at the light outlet. The right and left shells 211 and 212 are respectively provided with air ports 2110 and 2120, the air ports are respectively covered with air covers 2111 and 2121, and the edge gaps of the air covers 2111 and 2121 and the air covers form an air vent 201. The right shell 211 and/or the left shell 212 are/is provided with an opening 2112, the opening 2112 is covered by an air outlet cover 215, the air outlet cover 215 is provided with a ventilation groove, and the ventilation groove or a gap between the air outlet cover 215 and the opening 2112 forms a ventilation opening 202. It will be appreciated that the vents 201, 202 are not limited to the manner described herein and that any manner of holes or slots or gaps that allow for the ingress and egress of air may be suitable. The air guide cover 214 is arranged behind the air outlet cover 215, an air flow channel is defined in the air guide cover, the air guide cover is communicated with an air flow channel in the fan and a heat dissipation air flow channel in the light source module, air flow in the fan and the light source module is guided to the air outlet cover 215 through the air guide cover 214, and the air vent 202 formed by the air outlet cover 215 is discharged out of the photon radio frequency beauty instrument.

The light source module is arranged in the head and comprises a light source lamp 260, a light reflecting cup 261 for installing the light source lamp 260 and a lamp holder bracket 264, wherein a heat radiating piece 2610 is preferably arranged on the outer wall of the light reflecting cup 261, the heat radiating piece 2160 is made of a heat conducting material, heat radiating fins can be further arranged on the heat radiating piece 2160, and the heat conducting piece 2160 is attached to the outer wall of the light reflecting cup 261 so as to conduct heat rapidly. The light exit window of the reflector 261 is provided with a filter (first filter) 262, and the light source lamp is packaged in the reflector. The light-emitting channel 2640 is defined on the lamp holder support 264, the light-reflecting cup 261 and the light filter 262 are mounted on the lamp holder support 264, the mirror surface cover 265 with light-reflecting and light-guiding functions is arranged in the light-emitting channel 2640, the front end of the light-emitting channel is a light-emitting opening of the beauty instrument 200, the light-emitting opening is preferably internally provided with a light-emitting panel 267, and the cover is arranged at the front end of the light-emitting channel, namely the light-emitting opening. The light-emitting panel 267 can be made of transparent material such as transparent crystal, for example, sapphire, etc., for example, a whole transparent crystal 267 is covered at the light-emitting opening and is fixed by the front decorative ring 213; alternatively, the light-emitting panel 267 is a non-transparent material with light-emitting through holes, such as a heat conductive material, e.g., a metal material such as aluminum or copper. The outer wall surface of the light emitting panel 267 is a working surface 2671, and is in contact with the skin, and the rf electrode 291 is disposed on the working surface 2671. As an embodiment, the light emitting panel 267 is provided with a plurality of wire holes 2670, and the conductive columns 292 of the radio frequency electrode 291 pass through the wire holes 2670 and then are connected with the circuit inside the beauty instrument. The optical filter 262 and the light-emitting panel 267 are respectively covered at the rear end and the front end of the light-emitting channel 2640, and the light generated by the light source lamp 260 is filtered by the optical filter 262 and then guided to the light-emitting panel 267 by the mirror mask 265 in the light-emitting channel.

The light source lamp can be an IPL lamp tube, a halogen lamp or other light sources suitable for beauty or health care functions.

As an embodiment, the light source module is configured with a switching filter module. Referring to fig. 44-48 in combination, the switching filter module includes a filter (second filter) 263, the filter 263 is mounted and fixed on a filter support 2631, and a space for switching the filter 263 is provided on a lamp holder support 264, in this embodiment, the filter 263 moves back and forth on a platform 2641 on top of the lamp holder support 264, and moves into or out of a light outlet channel or a light outlet window. A pair of guide rails 2632 may be installed at both sides of the stage 2641 to guide the forward and backward movement of the filter 263. The platform is connected to the light exit channel 2640. When the optical filter 263 moves into the light outlet channel 2640, it is located on the upper and lower layers with the optical filter 262, and filters the light generated by the light source lamp 260 to obtain the light wave with the expected wavelength, and transmits the light wave to the light outlet through the light outlet channel 2640. The switching filter module further includes a driving component 250, in this embodiment, a motor is used to drive the switching filter, and fig. 45 and 47 show a state in which the filter 263 moves into the light-emitting channel or the light-emitting window, and fig. 46 and 48 show a state in which the filter 263 moves out of the light-emitting channel or the light-emitting window. Specifically, the driving device 250 includes a motor 251, a screw 252 coupled to an output shaft of the motor, and a paddle 253 linearly reciprocatingly slidable on the screw. The pulling piece 253 is slidably arranged on the screw 252 in a penetrating way, and the bottom of the pulling piece is connected with the optical filter bracket 2631. The motor 251 rotates forwards and backwards to drive the screw 252 to rotate forwards and backwards, and the poking plate 253 moves back and forth along the screw 252 to drive the optical filter support 2631 to move forwards to the light emergent channel 2640 or backwards to exit the light emergent channel 2640, so that the function of switching the optical filters is realized. The beauty instrument 200 is also provided with a bracket 254, and a plurality of cavities 2540, 2541 and a plurality of ventilation openings 2542 are arranged in the bracket 254. The support 254 is mounted above a platform 2641 of the burner support 264. The drive assembly 250 is mounted to the support 254, and in particular, is mounted within a cavity 2541 on one side of the support 254. The reflector 261 with the light source lamp 260 and the external heat sink 2610 are installed in the cavity 2540 of the bracket 254 and correspond to the light emitting channel. In this embodiment, two ventilation openings 2542 are provided on the support 254, as an air inlet and an air outlet, which are respectively communicated with the air inlet and the air outlet of an air flow channel (shown by arrow lines in fig. 33) inside the reflective cup, and are communicated with the air flow channel inside the photon rf beauty treatment instrument, and are used for air cooling and heat dissipation of the light source lamp and the reflective cup. The support 254 may be part of the lamp head support 264 or a separate support that is combined to collectively mount the light source module and the switching filter module.

In a non-limiting example, the wavelength band of filter 262 may be 400-1200nm and the filter segment of filter 263 may have a value within 400-1200 nm. Different bands can be obtained by configuring the bands of the filters 262 and 263. Therefore, the photon rf cosmetic device 200 of the present application can select different bands for adjuvant treatment for different skin problems.

The driving component 250 of the optical filter switching module can also use an electromagnet, and the on-off electricity of the electromagnet is used for bidirectionally adsorbing and driving the poking piece 253 so as to drive the optical filter bracket 2631 and the optical filter 263 to reciprocate, so that the optical filter switching is realized. Alternatively, the shifting piece 253 is manually moved, or engaged by a manual gear set, or by other driving means known in the art.

The control module includes a main control board 280 for controlling the operation of the photonic radio frequency cosmetic instrument 200. The light source lamp 260 is electrically connected to the main control board 280. The control module is integrated with a control module, and is also provided with a DC power supply module, a flash control module and other related functional modules which are of the prior art and can be purchased in the market.

The power supply assembly is electrically connected to the main control board 280. The power module includes a plug interface 241, which is fixed in the housing 210 through the tail cap 2, and is electrically connected to the power module on the main control board 280, and is connected to an external power source through a power line to provide power. The power supply assembly also includes a storage capacitor 220. The energy storage capacitor 220 is electrically connected with the main control board 280 and the light source lamp 260, and the main control board 280 controls the energy storage capacitor to charge and discharge to excite the light source lamp to work. In this embodiment, the external power supply is connected to the plug-in interface 241, and in other embodiments, a battery power supply mode may be further provided, for example, a rechargeable battery is provided to supply power to the photon radio-frequency beauty treatment device, the rechargeable battery is charged by the external power supply, or the external power supply or the battery may be selectively provided to supply power directly.

The rf module includes several pairs of rf electrodes 291 and an rf circuit board 290, and the rf circuit board 290 may be integrated on the main control board 280 or may be independently provided. The rf circuit board 290 is provided with functional modules such as a control module, a DC power module, and an rf driving module, which are conventional technologies and can be purchased in the market. When the radio frequency circuit board 290 is independently arranged, the radio frequency circuit board 290 is electrically connected with the main control board 280, and a DC power module of the radio frequency circuit board 290 is powered by a power module on the main control board in a shunt mode. Several pairs of RF electrodes 291 are electrically connected to the RF circuit board 290, each pair of electrodes comprising a positive electrode and a negative electrode. The electrode is strip-shaped or column-shaped or any suitable shape, is arranged on the working surface 2671, forms a radio frequency electrode point, is contacted with skin, and can be overlapped with the light outlet or arranged at the periphery of the light outlet, and is arranged in more than one pair. The rf electrodes 291 are electrically connected to the rf circuit board 290 through electrode posts (or conductive sheets or wires) 292 at both ends, and the working surface 2671 (light emitting panel 267) may be correspondingly provided with a wire through hole 2670, and the conductive posts 292 of the rf electrodes 291 pass through the wire through hole 2670 and are connected to a circuit inside the beauty instrument. The rf circuit board 290 supplies the voltage required for the corresponding gear to the rf driving module by controlling the DC power module, the rf driving module converts the DC power voltage into a high-voltage sine wave through the step-up transformer to the output control module, and the output control module transmits the rf current to the skin of the user through the rf electrode 291 to perform rf treatment on the skin.

The shell is also provided with a key assembly which comprises a plurality of key panels 2112 and keys 2113, and the functions realized by pressing are electrically connected with a main control board and/or a power supply assembly and/or a radio frequency module and/or a light source module and/or a cooling fan module so as to realize the functions related to the switch or the adjustment setting.

36-43, the photon radio frequency beauty treatment instrument of the application further comprises a cooling fan module combined with the refrigeration module, wherein the cooling fan module is used for cooling the light source module and the hot end of the refrigeration module.

The cooling fan module 100 comprises a fan housing 10 and an impeller 20, wherein a cavity is formed in the fan housing 10, and the impeller 20 is arranged in the cavity; the fan housing 10 is provided with a plurality of ventilation openings 101-103, the ventilation openings 101-103 serve as air inlet and air outlet to communicate the cavity with the air path outside the fan to form an air flow passage of the fan, and the air flow passage of the fan is communicated with the air flow passage inside the photon radio frequency beauty instrument and is communicated with the ventilation openings 201-202 arranged on the shell 210 of the photon radio frequency beauty instrument in a combined mode with reference to the air flow direction shown by arrows in fig. 36-38.

In this embodiment, the fan housing 10 includes a side elevation housing (volute) on the outer side of the impeller, and a bottom casing 14 and an upper casing 15 disposed at both ends in the axial direction, enclosing a cavity forming the inside of the fan; the bottom case 14 or the upper case 15 may be provided according to circumstances. In this embodiment, one end of the fan housing 10 is provided with a vent 101, or an upper housing 15 is provided with the vent 101, which is opposite to the vent 201 on one side of the housing 210 of the photon rf cosmetic instrument; the bottom shell 14 is provided with a vent 102, such as, but not limited to: the bottom chassis is provided with a plurality of passages, as shown in fig. 35 and 37-38, in which a plurality of through holes are arranged in a circle. The main control board 280 is provided with a plurality of ventilation holes 281, the main control board 280 and the fan bottom shell 14 are oppositely arranged in the photon radio frequency beauty treatment instrument shell (in the head of the photon radio frequency beauty treatment instrument), the ventilation holes 281 on the main control board 280 are communicated with a plurality of ventilation holes 102 arranged on the fan bottom shell 14 in an air flow mode, and are communicated with the ventilation holes 201 on the other side of the photon radio frequency beauty treatment instrument shell 210 in an air flow mode. The side elevation shell of the fan housing 10 is provided with a ventilation opening 103, a light source module is arranged outside the side elevation shell, the ventilation opening 103 is communicated with the air inlet of the reflecting cup 261 in an air flow mode, and the air outlet of the reflecting cup is communicated with the inlet of the air guide cover 214. Specifically, the light source lamp 260, the light reflecting cup 261 and the heat dissipating member 2610 are mounted outside the side elevation housing of the fan housing 10 by the lamp holder support 264 and the support 254 together, the ventilation opening 103 is in butt joint communication with the air inlet of the light reflecting cup 261 through one ventilation opening 2542 of the support 254, so as to communicate with the air flow passage in the light reflecting cup, and the air outlet of the light reflecting cup is communicated with the inlet of the air guiding cover 214 through the other ventilation opening 2542 of the support 254. The air inlet and outlet of the heat dissipation air flow channel of the light source lamp in the reflecting cup is respectively communicated with the air outlet 103 of the fan and the air vent 202 of the radiofrequency instrument shell 210 through two air vents 2542 formed on the support 254. The air outlet of the air channel serving as an air outlet vent or a reflecting cup on the support 254 is directionally guided to the air outlet vent 202 through a channel in the air guide cover 214 with the air outlet vent 202 of the radiofrequency instrument shell 210, and the outlet of the air guide cover 214 is opposite to the air outlet vent 202 and is in airflow communication.

The first air flow channel of the photon radio frequency beauty instrument is as follows: external cold air enters the shell from the ventilation opening 201 at one side of the photon radio frequency beauty instrument shell, absorbs heat through the main control board 280, enters the fan from the ventilation opening 102 on the ventilation hole 281 and the bottom shell 14 of the fan shell, passes through the air flow channel in the fan and the light source lamp heat dissipation air flow channel of the light source module, the air flow after heat absorption is guided to the air outlet cover 215 from the air guide cover 214, the outside of the shell is discharged from the ventilation opening 202, and the heat of the heating electronic components such as the main control board is dissipated from the first air flow channel. The second air flow passage is as follows: the external cold air enters the fan through the vent hole 201 at the other side of the photon radio frequency beauty instrument shell into the vent hole 101 defined by the opening at the other end of the fan shell or the upper shell 15, enters the fan, the impeller 20 rotates to promote the air to flow in the air flow channel, the air flow passes through the air flow channel in the fan and the light source lamp heat dissipation air flow channel of the light source module, the air flow after heat absorption is guided to the air outlet cover 215 through the air guide cover 214, and is discharged out of the shell through the vent hole 202. The air flow passage inside the fan and the light source lamp heat dissipation air flow passage of the light source module are communicated with each other: external air flows enter the fan housing 10 from the ventilation openings 101 and 102 at two ends (the bottom shell 14 and the upper shell 15) of the fan, the impeller 20 rotates to promote air to flow in the air flow channel, the air flow enters the light source lamp heat dissipation air flow channel in the light reflecting cup of the light source module through one ventilation opening 2542 of the support 254 and the air inlet of the light reflecting cup 261 from the ventilation opening (air outlet) 103 arranged on the side elevation housing (volute), heat generated by the light source is taken away, the air outlet of the light reflecting cup 261 is communicated with the air guide cover 214 through the other ventilation opening 2542 of the support 254, and the air flow after heat absorption is guided out of the housing from the ventilation opening 202 on the photon radio frequency beauty treatment device housing. The rotation of the impeller 20 promotes the flow of air within the flow channel to rapidly dissipate heat generated by the electronics within the photon rf cosmetic device.

At least part of the housing of the fan housing 10 is a heat conductive shell 11 formed by a heat pipe or super heat conductive plate or VC. Preferably, the super heat conduction pipe is an aluminum superconducting pipe, and the super heat conduction plate is an aluminum superconducting plate. The through channels inside the aluminum superconducting pipe or the aluminum superconducting plate are single channels or multiple channels; the inner wall of the channel is provided with a porous micro-groove, two ends of the channel are sealed, and working fluid is encapsulated inside the channel. The porous micro-groove channels on the inner wall of the aluminum superconducting pipe or the aluminum superconducting plate are more than two fine bone-shaped micro-grooves; the direction of the grooves of the micro grooves is preferably along the radial circumference of the rotation center of the impeller and is consistent with the direction of air flow generated by the rotation of the impeller. The wall material of the micro-groove forms a porous structure inside. The channel, micro groove and porous structure inside the material of the aluminum superconducting pipe or the aluminum superconducting plate are inherent structures formed by one-step molding of an aluminum extrusion molding process, and a large number of capillary structures are formed.

The side elevation housing (volute) is a thermally conductive enclosure 11 made up partly or entirely of heat pipes or super heat pipes or VC. Alternatively, the upper shell is a thermally conductive housing 11 formed partially or entirely of heat pipes or super heat pipes or VC. Alternatively, the bottom shell is a heat conductive shell 11 formed partially or entirely of heat pipes or super heat pipes or VC. The heat conducting shell 11 formed by the heat pipe or the super heat conducting plate or the VC is integrally monolithic or spliced by a plurality of pieces.

In this embodiment, a part of the side elevation housing of the fan housing 10 is a heat conductive housing 11 formed by a heat pipe or a super heat conductive plate or VC. The cooling fan module 100 further includes a cooling fin 12, where the cooling fin 12 is connected to the heat conductive housing 11 formed by a heat pipe or a super heat conductive plate or VC in a manner of fast heat transfer. The heat sink 12 is located within a cavity within the fan housing. The heat sink 12 includes one or more sets of fins of thermally conductive material; the air channels between adjacent fins, namely the air channels of the radiating fins, are communicated with the ventilation opening and the cavity of the fan. The radiating fins 12 are arranged on the inner wall of the heat conducting shell 11, and the air channels between the adjacent fins are consistent with the air flow direction generated by the rotation of the impeller.

Preferably, the radiator fan module 100 of the present application also incorporates a cooling module for cooling the working surface 2671. The refrigeration module includes a semiconductor refrigeration member 30. The semiconductor refrigeration sheet 30 includes a middle electric couple layer 33, and hot and cold faces 31 and 32 at both ends, and further includes a pair of electrodes 34. The electrodes of the semiconductor cooling sheet 30 are electrically connected to a main control board 280 in the photonic radio-frequency cosmetic instrument. The heat-conducting shell 11 formed by the heat pipe or super heat-conducting plate or VC is connected with the heat surface (heat-radiating surface or heat-end) 31 of the semiconductor refrigerating element 30 in a rapid heat-conducting manner. The heat-conducting shell 11 formed by the heat surface 31 of the semiconductor refrigeration piece 30 and the heat pipe or the super heat-conducting plate or the VC is mutually attached to be contacted and transferred or mutually attached to be contacted and transferred through the heat-conducting plate, referring to fig. 42; or, the heat conducting shell 11 formed by the heat surface 31 of the semiconductor refrigeration piece 30 and the heat pipe or the super heat conducting plate or the VC is respectively arranged at different parts of the fan housing, and the heat conducting shell and the heat pipe or the super heat conducting plate or the VC conduct heat quickly; alternatively, the semiconductor refrigeration member 30 and the heat conductive shell 11 formed by the heat pipe or the super heat conductive plate or the VC are in an integral structure, and a hot end circuit is arranged on the heat conductive shell 11 formed by the heat pipe or the super heat conductive plate or the VC, and is welded and electrically connected with the electric coupling layer, and is directly used as a hot surface, referring to fig. 43.

The cold surface 31 of the cooling plate 30 is in contact with the light emitting panel 267 of the photon rf cosmetic instrument 200, for example, disposed at the periphery of the light emitting panel 267. Alternatively, the cold face 31 of the cooling sheet 30 and the light-emitting panel 267 are in contact with the light-emitting panel 267 through a cold guide (heat transfer element or heat conductive member) 35. The cold guide 35 is a heat transfer structure, and can quickly transfer the heat of the light emitting panel 267 to the semiconductor refrigeration sheet, so as to achieve the effect of refrigerating the working surface 2671, thereby forming cold compress or precooling effect on the skin surface in contact with the working surface.

One end of the cold guide 35 is connected with the cold surface of the semiconductor refrigeration sheet in a rapid heat transfer manner, and the other end is used for being connected with the light emitting panel 267 in a rapid cold guide manner. The cold conducting member 35 is a heat pipe or a VC temperature equalizing plate or a super heat conducting pipe or a super heat conducting plate. Preferably, the super heat conduction pipe is an aluminum superconducting pipe, and the super heat conduction plate is an aluminum superconducting plate. Depending on the shape of the light-emitting panel 267 and the expected cooling effect, the end of the cold guide 35 contacting the light-emitting panel 267 may be designed or provided with a ring-shaped cold guide to closely contact the periphery of the light-emitting panel 267 so as to quickly absorb heat of the working surface 2671 or the surrounding environment of the working surface 2671. The light-emitting panel 267 is preferably made of a heat-conductive material, such as a transparent crystal, a metal material, or a heat-conductive silica gel, and the material is transparent or has openings.

The heat surface 31 of the semiconductor refrigeration sheet 30 is arranged on the outer wall of the heat conducting shell 11 formed by the heat pipe or the super heat conducting plate or the VC, or the heat conducting shell 11 formed by the heat pipe or the super heat conducting plate or the VC is directly used as the heat surface of the semiconductor refrigeration sheet. And the heat pipe or super heat conducting plate or VC is provided with cooling fins 12 on the inner wall of the heat conducting shell 11 to increase the heat radiating area, and the cooling fins 12 are positioned in the air flow passage inside the fan. The heat generated by the hot face 31 is quickly transferred to the heat sink 12 through the heat conductive housing 11, and the heat of the heat conductive housing 11 and the heat sink is taken away by the air in the air flow passage of the fan and is discharged through the ventilation opening (air outlet) 103 of the fan, see fig. 38. The cold face 32 of the semiconductor refrigeration sheet is connected to one end of the cold guide 35, preferably with maximum contact area or rapid thermal conduction, and the other end of the cold guide is bent and connected to an annular cold guide with maximum contact area, and the light emitting panel 267 is connected to the annular cold guide with maximum contact area. Cold guide direction referring to the route shown by the arrow of fig. 40, the cooling sheet 30 gives rapid cold guide of the light panel 267 by the cold guide 35. The annular cold conducting piece is a heat pipe or a VC temperature equalizing plate or a super heat conducting pipe or a super heat conducting plate. Preferably, the super heat conduction pipe is an aluminum superconducting pipe, and the super heat conduction plate is an aluminum superconducting plate. Preferably, the cold guide 35 is an aluminum superconducting tube or plate,

The cooling fan module 100 further includes a driving control circuit board and a driving module, which may be disposed at any suitable position inside or outside the fan housing. The drive control circuit is electrically connected with the drive module, and the drive control circuit board and the drive module are electrically connected with the main control board 280 through power lines; the driving module is used for driving the impeller to rotate.

The photon beauty instrument integrates radio frequency and photon treatment, and performs photon auxiliary treatment on the skin by the light generated by the light source module while performing radio frequency treatment on the skin by the radio frequency current generated by the radio frequency module; the radio frequency heats the dermis layer of the skin, and utilizes the penetrability of red light wave band (above 600 nm) in photons to heat the deep skin at the same time, thereby rapidly heating the skin area to be treated currently. Effectively improving the treatment speed. Meanwhile, yellow light and green light wave bands (480-600 nm) in photons are absorbed by the epidermis layer due to the fact that penetrability is weaker than that of red light, so that the effects of treatment improvement of the epidermis layer, spots and red blood filaments are achieved. Thereby achieving the effects of removing wrinkles, tightening, brightening, whitening and tendering skin.

The photon radio frequency beauty instrument 200 further comprises a switching filter module, filters light generated by the light source to obtain corresponding wave bands, realizes different photon auxiliary treatment or beauty function, and can select different wave band auxiliary treatments for different skin problems. The photon radio frequency beauty instrument 200 is internally provided with a cooling fan module, and a combined refrigeration module, wherein a heat pipe or a VC temperature equalizing plate or a super heat conducting pipe or a super heat conducting plate is used as a cooling conducting piece and a fan housing, so that the rapid and efficient cooling conduction and the efficient heat dissipation of a working surface can be realized.

Other embodiments of the cooling fan module 100 refer to fig. 1-30 and corresponding embodiments described below. The cooling fan module 100 of these embodiments can be applied to the photon rf cosmetic device 200 of the above embodiments.

Referring to various embodiments shown in fig. 1-22, a radiator fan module 100 includes a fan housing 10 and an impeller 20, wherein the interior of the fan housing 10 is a cavity, and the impeller 20 is installed in the cavity; the fan housing 10 is provided with a plurality of ventilation openings 101, the ventilation openings 101 are used for communicating the cavity with the air path outside the fan, and at least part of the housing of the fan housing 10 is composed of a heat pipe or a super heat conducting plate or VC 11. The fan housing 10 includes a side elevation housing, and top and bottom cases may be selectively provided with upper and bottom cases according to specific product needs, and the upper and bottom cases may be formed of upper fins or lower fins of a heat sink described below without being separately provided. The side elevation housing may be a volute or a portion of a housing of the volute outside the circumference of rotation of the impeller.

Preferably, the super heat conduction pipe is an aluminum superconducting pipe, and the super heat conduction plate is an aluminum superconducting plate. The through channel 110 inside the aluminum superconducting pipe or the aluminum superconducting plate is a single channel or multiple channels; the single channel or the multiple channels are porous micro-groove channels; the channels 110 and the porous micro grooves 111 on the inner walls thereof are communicated with each other; the two ends of the single channel or the multiple channels are sealed, and working fluid is encapsulated inside the single channel or the multiple channels.

The fan housing comprises a volute casing at the outer side of the impeller, and the volute casing encloses a cavity in the fan; the top of the volute can be provided with an upper shell or a vent 101 is formed at the top, and the bottom of the volute is a bottom shell or the vent 101 is formed at the bottom; the vent at the top can also be a plurality of through holes arranged on the upper shell, and the vent at the bottom can also be a plurality of through holes arranged on the bottom shell. The volute or upper or lower shell is partially or entirely formed of heat pipes or super heat pipes or VC 11. The heat pipe or super heat conducting plate or VC 11 is of integral single piece type or spliced by a plurality of pieces.

The cooling fan module 100 includes a cooling fin 12, and the cooling fin 12 is connected with a heat pipe or a super heat board or VC 12 in a fast heat transfer manner. The heat sink 12 is located within a cavity within the fan housing. The heat sink 12 includes one or more sets of fins of thermally conductive material; the air channels between adjacent fins, namely the air channels of the radiating fins, are communicated with the ventilation opening and the cavity of the fan.

Preferably, the side elevation of the fan housing, i.e. the volute, is provided with a heat pipe or super heat pipe or VC 11; the heat sink 12 is disposed on the inner wall of the side elevation and is spaced apart from the impeller 20 by a predetermined distance, without affecting the rotation of the impeller 20. More preferably, the side elevation of the volute forms a heat conducting shell by a single-channel or multi-channel aluminum superconducting pipe or an aluminum superconducting plate; the heat sink 12 is disposed on the inner wall of the thermally conductive housing. The fins are circumferentially arranged along the radial direction of the rotation center of the impeller; the air channels between the adjacent fins are consistent with the air flow direction generated by the rotation of the impeller.

The inner wall of the single channel or multi-channel 110 of the aluminum superconducting pipe or the aluminum superconducting plate forms more than two fine bone-shaped micro grooves 111; the direction of the grooves of the micro grooves 111 is along the radial circumference of the rotation center of the impeller, and is consistent with the direction of the air flow generated by the rotation of the impeller. The wall surface material of the micro groove 111 has a porous structure formed therein. The porous structure of the inside of the channel 110, the micro groove 111 and the material is formed by one-step molding through an aluminum extrusion molding process.

Preferably, the radiator fan module 100 of the present application includes a semiconductor refrigeration member 30, and a heat dissipating surface (hot surface) of the semiconductor refrigeration member 30 is connected to a heat pipe or a super heat conducting plate or VC 11 in a rapid heat conduction manner. The heat dissipation surface of the semiconductor refrigeration piece 30 and the heat pipe or the super heat conduction plate or the VC 11 are mutually in contact with each other or are mutually in contact with each other through the heat conduction plate for heat transfer, or the heat dissipation surface of the semiconductor refrigeration piece 30 and the heat pipe or the super heat conduction plate or the VC 11 are respectively arranged at different parts of the fan housing for quick heat conduction.

The cooling fan module 100 includes a driving control circuit board 40 and a driving module 50, the driving control circuit board 40 is electrically connected with the driving module 50, and the driving control circuit board 40 and the driving module 50 are electrically connected with an external power supply through a power line or a power component; the driving module 50 is used for driving the impeller 20 to rotate. The electrodes of the semiconductor cooling fin 30 are electrically connected to the drive control circuit board 40 or to an external circuit board.

In some embodiments, the drive control circuit board 40 is disposed outside the fan housing to provide waterproofing; the vent 101 is provided with a sealing ring for water resistance; the driving module 50 is disposed on the driving control circuit board 40 and is mounted outside the fan bottom case 14; since the drive control circuit board 40 and the drive module 50 are respectively installed on the inner and outer sides of the fan bottom case 14 and the fan impeller 20, the drive control circuit board 40 and the drive module 50 are not affected when water is sucked or introduced into the fan. The driving module 50 comprises a motor, and an output shaft of the motor is in shaft connection with the impeller to drive the impeller 20 to rotate; alternatively, the driving module 50 comprises a motor stator coil, the impeller is internally sleeved with the magnetic ring 25, the magnetic ring 25 is fixedly connected with the impeller 20, the driving module 50 generates a magnetic field after being electrified, and the magnetic ring 25 rotates to drive the fan impeller to rotate.

The cooling fan module 100 is a radial flow fan or an axial flow fan; in the radial flow fan, the air flow generated by the rotation of the impeller 20 can be exhausted through the vent on the volute after circulating along the radial circumference of the rotation center of the impeller; in the axial flow fan, the air flow generated by the rotation of the impeller 20 is exhausted from the vent hole at the top or the vent hole at the bottom of the scroll case in the direction of the central axis.

In some embodiments, the vent 101 of the fan is provided with a heat sink 12, the cavity of the fan communicating with the external environment by the air path of the heat sink.

The heat pipe (heat pipe) or the Vapor Chamber (VC) in the application rapidly transfers the heat of the heating object to the outside of the heat source through the heat pipe by utilizing the heat transfer principle and the rapid heat transfer property of the refrigeration medium. The heat is transferred through evaporation and condensation of liquid in the totally-enclosed vacuum tube or vacuum plate, and the refrigeration effect is achieved by utilizing the fluid principles such as capillary action, and the device has a series of advantages such as high heat conductivity, excellent isothermicity, heat flow density variability, heat flow direction reversibility and the like. The heat exchanger composed of heat pipes or vapor chamber has the advantages of high heat transfer efficiency, compact structure, small fluid resistance loss and the like.

The super heat pipe or super heat-conducting plate in the present application is preferably an aluminum heat pipe/aluminum heat-conducting plate. The (aluminum) superconducting heat pipe or (aluminum) superconducting hot plate, or called as ALVC superconducting pipe (plate), is characterized in that the heat is quickly conducted by utilizing evaporation refrigeration and gas-liquid phase change. In comparison with general heat pipes and VC Wen Banxiang, the aluminum superconducting heat pipe/plate can be formed with micro grooves or micro tooth-like or micro pore channels on the surface of the heat pipe or plate by aluminum processing (extrusion molding) process as capillary structures inside the heat pipe or plate. The aluminum superconducting tube (plate), namely the ALVC aluminum superconducting tube (plate), can be filled with aluminum powder or aluminum silicon powder without adding copper powder, can be filled with aluminum mesh, and can be sealed after being filled with refrigerant.

The following description of specific embodiments is provided as an enabling understanding of the present application and is not intended to limit the application to the specific embodiments described, and in connection with the accompanying figures. The protection scope of the application is subject to the claims. The following embodiments of the cooling fan module 100 can be replaced, combined or modified, which falls within the scope of the present disclosure.

Referring to fig. 1 to 8, a radiator fan module 100 according to a first embodiment of the present application is a blower module including a fan housing 10 having a cavity formed therein, an impeller 20 installed in the cavity, and a semiconductor refrigeration sheet 30 installed on the fan housing. The fan housing 10 comprises a volute with a side elevation, the volute is arranged outside the impeller 20, the volute is a heat conducting shell, the inner wall of the volute is provided with cooling fins 12, and the whole volute is composed of a heat pipe or a super heat conducting plate or VC 11. In this embodiment, the scroll casing is described by taking an aluminum superconducting pipe or an aluminum superconducting plate as an example.

The side elevation volute and the top of the fan housing 10 are provided with a ventilation opening 101, the ventilation opening 101 communicates the cavity with an external air path of the fan, for example, air can be introduced from the ventilation opening at the top, after entering the cavity, the impeller 20 is used for promoting airflow to circulate and take away heat on the surface of the radiating fin 12, and finally the heat is discharged from the ventilation opening at the side elevation. Referring to fig. 2, a plurality of ventilation openings 101 may be formed on the bottom of the fan housing 10, that is, the bottom shell 14, to assist in air intake, the fan of this embodiment is radial flow, air is taken in by the impeller or the top and bottom ventilation openings in the axial direction of the fan, air is taken out by the ventilation openings in the side elevation, and air intake and air outlet are also interchangeable, and air intake and air outlet are not limited.

In this embodiment, the fan housing 10 encloses a side elevation volute and a bottom casing, with the top open as a vent. The side elevation volute forms an integral heat conduction shell by a single heat pipe or a super heat conduction plate or VC 11 (shown in figures 3-5 and 7), or forms a heat conduction shell by a plurality of heat pipes or super heat conduction plates or VC 11 (figure 6), the heat pipes or super heat conduction plates or VC 11 are closely contacted with the radiating fins 12 of the inner layer for heat conduction, and the heat pipes or super heat conduction plates or VC 11 and the radiating fins 12 can be connected through welding or riveting or bonding or other modes, so that heat transfer is fast.

Preferably, the side elevation volute adopts an aluminum superconducting pipe or an aluminum superconducting plate 11, and can be formed into a heat conducting shell by splicing a single piece or a plurality of pieces, a through channel 110 in the length direction inside each piece of aluminum superconducting pipe or aluminum superconducting plate 11 is a single channel or multiple channels, two ends of each channel are sealed, and working fluid is filled inside each channel. The inner wall of each channel 110 forms a plurality of fine bone-shaped micro grooves 111, and the micro grooves 111 are communicated with the channels 110 of the channels for the working fluid to circulate. The material has a porous structure formed therein. Porous and micro-grooves 111 create capillary action within channels 110. Copper powder may not be added into the channel 110, aluminum powder or aluminum silicon powder may be poured into the channel, an aluminum mesh may be added into the channel, and the channel is sealed after the refrigerant is poured into the channel. The holes, the micro grooves 111 and the channels 110 can be simultaneously formed by forming the tubes by an aluminum processing (extrusion) molding process, and form a capillary structure inside the aluminum superconducting tube or the aluminum superconducting plate 11. The groove direction of the micro groove 111 and the length direction of the channel 110 may be the rotation direction of the impeller (as shown in fig. 4 to 7), or may be vertically arranged in the axial direction, as shown in fig. 8.

The heat sink 12 is one or more sets of fins of thermally conductive material, and the location and number and arrangement of the heat sinks may be set according to the fan housing space. One or more groups of fins 12 are integrally formed or welded or riveted or otherwise secured by other fastening means to form a unitary structure; alternatively, one or more sets of thermally conductive material fins (e.g., aluminum/copper/graphene or other thermally conductive fins) are provided on the thermally conductive plate to form the integrally structured heat sink 12. The shape of the cooling fin 12 is matched with the shape of the spiral case, the heat pipe, the super heat pipe or the VC 11, in this embodiment, the cooling fin 12 is in a cylinder or a ring shape, and is sleeved on the inner wall of the heat conducting shell formed by the ring-shaped heat pipe, the super heat pipe or the VC 11, and the heat conducting shell is directly attached to each other or attached to each other through the heat conducting piece so as to transfer heat rapidly. The ventilation opening of the side elevation can be a heat conduction shell inner wall formed by an air duct penetrating through the outside and the cavity inside among fins of the radiating fins 12, and the radiating fins 12 can be fixed outside the ventilation opening through a heat conduction plate or a fixing piece and fixed on a heat pipe or a super heat conduction plate or VC 11; or at the side elevation ventilation opening, the fin and the heat pipe or the super heat pipe or the VC 11 are disconnected to form a channel for communicating the fan housing with the outside. In this embodiment, the top layer of cooling fin is used as the upper shell of the fan, so that the upper shell, the bottom shell of the fan and the impeller set form an air channel, the upper shell of the fan can be omitted, and the top opening forms a ventilation opening.

The semiconductor refrigeration member 10 includes a middle electric couple layer and both ends of a hot face (heat radiation face) and a cold face. The radiating surface of the semiconductor refrigerating piece is connected with the heat pipe or the super heat conduction plate or the VC 11 in a rapid heat conduction way. The heat dissipation surface of the semiconductor refrigeration piece 30 is in contact with the heat pipe or the super heat conducting plate or the VC 11 for heat transfer or in contact with the heat transfer through the heat conducting plate, or the outer wall of the heat pipe or the super heat conducting plate or the VC 11 is directly used as the hot surface of the semiconductor refrigeration piece, a hot end circuit is arranged on the hot end circuit, and the hot end circuit is welded and electrically connected with the electric coupling layer to form the internal circuit of the semiconductor refrigeration piece. In this embodiment, the heat surface of the semiconductor refrigeration unit 30 is attached to the outer wall of the heat pipe or super heat pipe or VC 11.

The impeller 20, the drive control circuit board 40 and the drive module 50 are mounted on the fan bottom shell 14, the drive module 50 adopts a motor, an output shaft of the motor is in shaft connection with a central shaft 21 of the impeller, and the motor drives the impeller to rotate in forward and reverse directions.

Referring to fig. 9-10, as an alternative, the semiconductor refrigeration unit 10 is disposed on an outer wall of the fan bottom case 14, for example, the semiconductor refrigeration unit 10 is attached to the bottom case 14 in contact. The fan bottom case 14 is a heat conducting member, and may be made of a heat conducting material, such as a metal plate or a heat pipe or VC or a superconductive plate, and the fan bottom case 14 is connected to the heat pipe or super heat pipe or VC 11 on the side surface in a rapid heat transfer manner.

Referring to fig. 11 to 15, a radiator fan module 100 according to a second embodiment of the present application is an axial flow fan module including a fan housing 10 having a cavity formed therein, an impeller 20 installed in the cavity, and a semiconductor cooling fin 30 installed on the fan housing. The fan housing 10 comprises a side elevation volute, which is integrally formed by a heat pipe or super heat conducting plate or VC 11. The side elevation of the fan housing, namely the volute, is provided with a heat pipe or a super heat conducting plate or VC 11; more preferably, the volute side elevation forms a heat conducting shell by a single-channel or multi-channel aluminum superconducting pipe or an aluminum superconducting plate. The radiating fins 12 are arranged on the inner wall of the side elevation, the fins of the radiating fins 12 are annularly arranged along the diameter direction, and the air channels among the fins are communicated along the axial direction. In the cavity, a circle of fins are arranged above the impeller 20 to form a top radiating fin 12, a circle of fins are arranged below the impeller 20 to form a bottom radiating fin 12, air channels of the upper radiating fin and the lower radiating fin are preferably aligned, and ventilation openings at the top and the bottom of the fan are respectively formed and used for air inlet and air outlet, air sucked by the impeller 20 from the air channel (air inlet ventilation opening) of the top radiating fin is rotated to be discharged along the air channel (air outlet ventilation opening) of the bottom radiating fin 12 downwards along the axial direction, and the air inlet direction and the air outlet direction can be exchanged.

The radiator fan module 100 of the second embodiment is the same as the first embodiment, and the side elevation housing, i.e. the volute, is formed by integrally forming a single piece by a heat pipe or a super heat pipe or VC 11 or by splicing a plurality of pieces to form a heat conducting housing, and the heat dissipation fins of the inner wall can be connected in a rapid heat transfer manner by welding or riveting or bonding or other fixing modes. Preferably, the vertical surface volute forms a heat conduction shell by a single-channel or multi-channel aluminum superconducting pipe or an aluminum superconducting plate, and more than two fine bone-shaped micro grooves 111 are formed on the inner wall of a single channel or multi-channel 110 of the aluminum superconducting pipe or the aluminum superconducting plate; a plurality of micro-holes are formed in the material within the walls of micro-grooves 111. The channel 110 and the porous micro groove 111 are arranged in the axial direction of the rotation center of the impeller, and the direction of the air flow generated by the rotation of the impeller is consistent.

The semiconductor refrigeration member 30 is disposed on an outer wall of the side-elevation heat-conducting shell, and a heat-dissipating surface (hot surface) thereof is connected with a heat pipe or a super heat-conducting plate or VC 11 of the side elevation in a rapid heat-conducting manner, or the heat pipe or the super heat-conducting plate or the VC 11 is directly used as the heat-dissipating surface (hot surface) of the semiconductor refrigeration member 30, and a hot end circuit is disposed on the outer wall thereof and is electrically connected with and welded to the semiconductor electric coupling layer.

The impeller 20 is rotatably mounted by a fixed bracket 23 and a clamping ring 22 which are arranged in the cavity, a central shaft of the impeller is arranged on the fixed bracket 23, the central shaft is inserted into a central shaft hole of the impeller 20, and the top is clamped and fixed by the clamping ring 22.

The drive control circuit board 40 and the drive module 50 are arranged outside the bottom of the volute, in this embodiment, the drive module 50 adopts a motor, an output shaft of the motor is connected with a central shaft 21 of the impeller in a shaft way, and the motor drives the impeller to rotate in a forward and reverse rotation way.

The heat radiation fan module 100 of the application uses a heat pipe/VC/(aluminum) super heat conduction pipe/(aluminum) super heat conduction plate and the like as a fan shell (which can be a side elevation, an upper cover, a bottom cover and a volute), and uses the phase change heat conduction characteristic to quickly transfer a heat source into a cavity of the fan, and radiates heat through air flow generated when a fan impeller rotates. The application effectively utilizes the internal space of the fan to ensure that the product volume is smaller and the heat dissipation efficiency is higher; the novel fan is more effectively combined with application products, and the original shell material cost of the fan is reduced. The contact area between the radiating fin and the air flow is enlarged. The application improves the heat radiation efficiency under the condition of the same heat radiation requirement, thereby reducing the speed, current, noise and the like of the fan.

The cooling fan module 100 of the present application is further technically characterized in that when the application product is used for semiconductor refrigeration, the cooling surface of the refrigeration piece can be directly attached to (contacted with) the shell of the fan (i.e. the heat conducting piece: heat pipe/VC/(aluminum) super heat conducting pipe/(aluminum) super heat conducting plate); the distance of heat transfer is effectively shortened, and the heat transfer is quickened. The effect of the application product is better.

Referring to fig. 16-22, a radiator fan module 100 according to a third embodiment of the present application, which can be used as a waterproof fan, preferably a magnetic fan module, includes a fan housing 10 having a cavity formed therein, an impeller 20 mounted in the cavity, and a semiconductor cooling fin 30 mounted on the fan housing. The fan housing 10 includes a side elevation volute, an upper housing 15 at the top of the volute, and a bottom housing 14 at the bottom, and collectively enclose a cavity that forms the interior of the fan. The arc-shaped part of the volute consists of a heat pipe or a super heat-conducting plate or VC 11; more preferably, the side elevation of the volute, i.e. the volute, comprises an arc-shaped heat conducting housing formed by a single-channel or multi-channel aluminium superconducting pipe or plate. The radiating fins 12 are arranged on the inner wall of the side elevation arc-shaped heat conducting shell, the fins of the radiating fins 12 are distributed in an arc shape along the diameter direction, and the air channels among the fins are communicated in the radial arc direction. In this embodiment, the fan vent 101 is disposed on the side elevation scroll for intake and exhaust. The upper and lower cases are not provided with ventilation openings to facilitate waterproofing.

The radiator fan module 100 of the third embodiment is similar to the first and second embodiments, the arc-shaped heat conducting housing of the side elevation volute is formed by a heat pipe or a super heat conducting plate or VC 11, the heat conducting housing is formed by integral single-piece type or multi-piece type splicing, and the radiating fins of the inner wall can be connected in a rapid heat transfer manner by welding or riveting or bonding or other fixing modes. Preferably, the vertical surface volute forms an arc heat conduction shell by a single-channel or multi-channel aluminum superconducting pipe or an aluminum superconducting plate, and more than two fine bone-shaped micro grooves 111 are formed on the inner wall of a single channel or multi-channel 110 of the aluminum superconducting pipe or the aluminum superconducting plate; a plurality of micro-holes are formed in the material within the walls of micro-grooves 111. The channel 110 and the porous micro groove 111 are arranged in the radial arc direction of the rotation center of the impeller, and the direction of the air flow generated by the rotation of the impeller is consistent.

The semiconductor refrigeration member 30 is disposed on an outer wall of the side-elevation heat-conducting shell, and a heat-dissipating surface (hot surface) thereof is connected with a heat pipe or a super heat-conducting plate or VC 11 of the side elevation in a rapid heat-conducting manner, or the heat pipe or the super heat-conducting plate or the VC 11 is directly used as the heat-dissipating surface (hot surface) of the semiconductor refrigeration member 30, and a hot end circuit is disposed on the outer wall thereof and is electrically connected with and welded to the semiconductor electric coupling layer. Alternatively, the semiconductor refrigeration member 30 is disposed on the upper shell 15 or the bottom shell 14, and the upper shell 15 or the bottom shell 14 is connected with the arc-shaped heat conducting shell in a rapid heat transfer manner. The heat surface of the semiconductor refrigerating piece is arranged on the fan housing in a fitting contact manner.

The impeller 20 is located in the cavity and is installed on the bottom shell 14, a shaft hole is formed in the center of the impeller 20, a shaft sleeve 29 is fixedly arranged in the shaft hole, a convex ring is formed on the inner wall of the shaft sleeve 29, an upper bearing 28 and a lower bearing 26 are installed in the shaft sleeve 29 and are respectively located above and below the convex ring, a magnetic ring is sleeved in the impeller 20, specifically, an annular cavity is formed in the impeller and outside the shaft sleeve 29, and the inner wall of an outer ring of the annular cavity in the impeller is sleeved with the magnetic ring to be fixed with the impeller 20.

The bottom shell 14 is provided with a central shaft 21 of the impeller, a hollow annular boss is formed on the bottom shell, the central shaft is installed at the center of the boss, the bottom of the central shaft 21 is elastically clamped by a spring 27, the central shaft 21 is inserted into an inner shaft sleeve of a central shaft hole of the impeller 20 and is matched with a bearing and a convex ring, a clamping groove is formed at the top of the central shaft 21, and the clamping groove is clamped by a clamping ring 22 to prevent falling. The top of the hollow annular boss on the bottom shell 14 is fittingly inserted into the annular cavity inside the impeller 20, and the drive module 50 is mounted on the bottom shell 14 forming a hollow cavity defined by the hollow annular boss, and the drive control circuit board 40 is located outside the bottom shell 14. In this embodiment, the driving control circuit board 40 and the driving module 50 are disposed outside the bottom of the volute, the driving module 50 includes a motor stator coil 51, and the driving module generates a magnetic field after being electrified, so as to drive the fan impeller 20 to rotate, and the driving module 50 and the driving control circuit board 40 and the fan impeller 20 are respectively disposed on the inner and outer sides of the bottom shell 14, so that the driving module 50 and the driving control circuit board 40 are not affected when water is sucked or entered into the fan. In this embodiment, the driving module 50 and the driving control circuit board 40 are separated from the fan set, the driving control circuit board 40 is disposed outside the fan housing 10, so that water can be prevented, and the driving control circuit board 40 is not affected by water when wind passes through the wind channel. When the waterproof fan is applied to a product, the sealing ring can be arranged at the ventilation opening of the embodiment, so that the waterproof between the product and the fan module 100 can be realized.

Referring to fig. 23 to 29, the cooling fan module 1 according to the embodiment of the present application includes a semiconductor cooling fin 30, and the semiconductor cooling fin 30 includes a middle electric couple layer and a hot surface and a cold surface at both ends. The middle electric couple layer is an internal circuit of the semiconductor refrigerating sheet formed by arranging and electrically connecting a hot end circuit arranged on the PN electric couple particle pressing surface and a cold end circuit arranged on the cold surface

The semiconductor cooling fin 30 enhances the heat radiation effect by the heat sink. The radiator comprises a VC temperature-equalizing plate 11 and radiating fins 12 arranged on the VC temperature-equalizing plate 11, wherein the hot surface of the semiconductor refrigerating fin is arranged on the outer wall of the VC temperature-equalizing plate 11, or the VC temperature-equalizing plate 11 is directly used as the hot surface of the semiconductor refrigerating fin. The VC temperature-equalizing plate 11 is used for heat dissipation of the cooling fin 30. The refrigerating sheet 30 is arranged on the VC temperature equalizing plate 11, and the hot surface of the semiconductor refrigerating sheet is attached to the outer wall of the VC temperature equalizing plate, so that the heat of the hot surface is directly transmitted to the VC temperature equalizing plate 11; or, the heat of the semiconductor refrigerating sheet is quickly transferred to the VC temperature equalizing plate 11 through the heat conducting piece; or, the VC temperature equalizing plate 11 is provided with a hot end circuit of a semiconductor refrigerating sheet, and is welded and electrically connected with PN couple particles of the electric couple layer. The VC temperature equalization plate 11 is a closed flat plate cavity formed by a bottom plate, a frame and a cover plate, and a capillary structure is arranged in the cavity and contains working fluid. By way of non-limiting example, an extension platform is formed at one end of the VC temperature-equalizing plate 11 for setting or mounting the semiconductor refrigeration sheet 30, and the area of the VC temperature-equalizing plate 11 is larger than the electric couple layer and the cold surface, so that the hot surface of the semiconductor refrigeration sheet has the extended VC temperature-equalizing plate 11, and the heat dissipation area is increased.

The radiator also comprises radiating fins 12 arranged on the VC temperature equalizing plate 11 so as to increase the VC radiating area. The heat sink 12 can be arranged on the upper surface or the lower surface or both surfaces of the VC temperature equalization plate 11 according to the heat dissipation requirement of the product. Preferably, the VC temperature equalizing plate 11 is positioned behind the ventilation opening of the machine body; the cooling fins on the VC temperature equalizing plate 11 are opposite to the ventilation opening 111 of the machine body. The heat sink 12 is one or more groups of fins of thermally conductive material, and the positions and numbers and arrangement of the heat sinks can be set according to the internal space of the beauty instrument. Referring to fig. 10-15, on the surface of VC temperature-equalizing plate 11, heat sink 12 is a group of parallel linear heat sink fins arranged in a matrix; or, the VC temperature equalizing plate 11 is a fan skeleton, the radiating fins 12 are a set of curved radiating fins (fig. 30 (a)) on the inner wall of the spiral fan skeleton, and the air duct is consistent with the spiral direction of the fan skeleton; alternatively, the heat sink 12 may be a group of heat sink fins arranged in a circular matrix, and the heat sink fins may be arranged along a linear radiation direction, or the heat sink fins may be arranged at an angle to form a rotation direction (fig. 30 (b)).

The cooling fan module 1 of the present application further comprises a fan assembly 18, wherein the fan assembly 18 is located in the airflow channel of the body, so as to enhance the cooling (refrigerating) efficiency. The fan assembly 18 includes a fan housing 180 and a rotating impeller 181 mounted in the cavity inside the housing, the fan housing 180 being provided with openings as vents 182 of the fan assembly 18; the vents 182 of the fan assembly 18 serve as air intake and air outlet and communicate with the interior cavity of the fan housing 180 to form an air duct of the fan assembly 18 that communicates with the airflow channels in the fuselage. VC temperature plate 11 may be part of fan casing 180 or mounted on fan casing 180. VC temperature uniformity plate 11 and fins 12 are cooled by the air duct of fan assembly 18, which promotes air flow to impart cooling efficiency.

VC temperature plate 11 may be provided as part of the housing of fan assembly 18. The fan assembly 18 housing includes an upper shell, a lower shell 184, and a medial side elevation 183. The inner wall of the side elevation 183 may be provided with heat dissipation teeth to increase the heat dissipation area of the VC temperature uniformity plate 11. As shown in fig. 12-14, the VC temperature equalizing plate 11 is provided as an upper (or lower) case cover of the fan casing at the top (or bottom) of the annular side elevation; the VC temperature equalization plate 11 may be configured as an annular plate with a central through hole forming a vent for the fan assembly 18; the cooling fins 12 are arranged as a group of parallel cooling fins covered on the central through hole, and ventilation channels between the cooling fins are communicated with the central through hole of the VC temperature equalizing plate 11 and the inner cavity of the fan housing.

Referring to fig. 30 (b), the structure is different from that shown in fig. 27 to 29 in that the heat radiating fins are arranged at the annular edge of the center through hole of the VC temperature uniformity plate 11, radially arranged or all rotated by a certain angle.

Referring to fig. 30 (a), VC temperature equalization plate 11 is a side elevation outside the impeller, and heat sink 12 may be provided on the side elevation inner wall, and semiconductor refrigeration sheet 30 may be provided on the side elevation outer wall.

In the above embodiments, "cold-conducting" and "heat-conducting", "heat transfer" or "heat transfer" are to be construed as having the same meaning, and are used interchangeably.

It will be appreciated that in the foregoing embodiments, terms of orientations such as "upper", "lower", "top", "bottom", "left", "right", "vertical", "horizontal", "lateral", "front", "rear", etc., are used in relation to the relative positions of the components shown in the drawings and are not intended to be limiting as to absolute geographic orientations.

The technical features of the above embodiments may be combined, transformed or replaced to obtain different embodiments, which all fall within the scope of the disclosure of the embodiments of the present application. Some common structures or similar structures in the above embodiments are described in some embodiments, but not in other embodiments, and are equally applicable to these embodiments, which fall within the scope of the disclosure of the embodiments of the present application.

In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be a mechanical connection, or may be an electrical connection or a data transmissible connection; can be directly connected or indirectly connected through an intermediate medium, and can be communication between the two components or interaction relationship between the two components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made hereto without departing from the spirit and scope of the application as defined by the appended claims; the scope of the application is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a photon radio frequency beauty instrument, includes casing, its characterized in that: the shell is internally provided with a control module, a radio frequency module, a light source module, a cooling fan module and a power supply assembly which are electrically connected with the control module; the shell is provided with a light outlet, and a light outlet panel is arranged in the light outlet.

2. The photonic radio frequency cosmetic apparatus of claim 1, wherein: the control module comprises a main control board; the radio frequency module comprises a radio frequency circuit board electrically connected with the main control board and a plurality of pairs of radio frequency electrodes electrically connected with the radio frequency circuit board; the outer wall surface of the light-emitting panel is a working surface and is used for being contacted with skin; the plurality of pairs of radio frequency electrodes are arranged on the working surface.

3. The photonic radio frequency cosmetic apparatus of claim 2, wherein:

the light source module comprises a light source lamp and a reflecting cup provided with the light source lamp; an air flow channel for radiating the light source lamp is formed in the reflecting cup, and the reflecting cup is provided with an air inlet and an air outlet of the air flow channel for radiating the light source lamp;

An air flow channel is formed in the photon radio frequency beauty instrument shell, a plurality of ventilation openings are formed on the shell and are used as an air inlet and an air outlet of the air flow channel and communicated with the external environment so as to suck cold air from the external environment, and hot air subjected to heat exchange in the air flow channel is discharged out of the shell;

the cooling fan module comprises a fan housing and an impeller, wherein the interior of the fan housing is a cavity, and the impeller is arranged in the cavity; the fan housing is provided with a plurality of ventilation openings which are used as an air inlet and an air outlet to communicate the cavity with an air path outside the fan to form an air flow passage of the fan;

the air flow passage for radiating the light source lamp is communicated with the air flow passage in the photon radio frequency beauty instrument shell;

the air flow passage of the fan is communicated with the air flow passage in the photon radio frequency beauty instrument shell;

the reflecting cup is arranged on the lamp holder bracket or the combined bracket thereof; the lamp holder support is internally provided with a light outlet channel, the front end of the light outlet channel is a light outlet, and the rear end of the light outlet channel is a light outlet window of the reflecting cup.

4. A photonic radio frequency cosmetic apparatus according to claim 3, wherein:

an air outlet on the fan housing is communicated with an air inlet of an air flow channel for radiating the light source lamp; an air outlet of an air flow channel for radiating the light source lamp is communicated with an air outlet arranged on the photon radio frequency beauty instrument shell through a flow guide channel of the air guide cover;

The air inlet of the fan housing is communicated with the air inlet arranged on the photon radio frequency beauty instrument shell;

the outer wall of the reflecting cup is provided with a heat dissipation piece; the lamp holder support or the combined support thereof is internally provided with a cavity, an air inlet and an air outlet which are communicated with the air passage of the cavity, so as to form an air flow passage in the lamp holder support or the combined support thereof, and the air flow passage is communicated with the air flow passage for radiating the light source lamp; the reflecting cup and the radiating piece thereof are positioned in the air flow channel of the lamp holder bracket or the combined bracket;

an air outlet on the fan housing and an inlet of a diversion channel of the air guide housing are respectively communicated with an air flow channel of the lamp holder bracket or the combined bracket thereof and an air flow channel of the light source lamp for radiating through the air inlet and the air outlet of the lamp holder bracket or the combined bracket thereof;

the outlet of the diversion channel of the wind scooper is in butt joint with an air outlet arranged on the photon radio frequency beauty instrument shell.

5. A photonic radio frequency cosmetic apparatus according to claim 3, wherein:

a first optical filter is arranged at the rear end of the light outlet channel or at the light outlet window of the reflecting cup, and the light source lamp is covered in the Yu Fanguang cup and used for filtering light;

the light source module is provided with a switching filter module; the switching optical filter module comprises a second optical filter, and the second optical filter is fixedly arranged on the optical filter bracket; the lamp holder support is provided with a space for switching the optical filter, so that the second optical filter can move in or out of the light outlet channel or the light outlet window;

The switching filter module further includes a driving assembly.

6. The photonic radio frequency cosmetic apparatus of claim 5, wherein:

the driving assembly adopts a motor to drive the switching optical filter and comprises a motor, a screw rod connected with an output shaft of the motor and a poking piece capable of linearly and reciprocally sliding on the screw rod; the poking plate is slidably arranged on the screw rod in a penetrating way and is connected with the optical filter bracket; the screw rod is driven to rotate forwards and backwards through the forward rotation and the backward rotation of the motor, and the poking plate moves in a reciprocating way along the screw rod to drive the optical filter support to move forwards and backwards, so that the second optical filter is moved into or out of the light outlet channel or the light outlet window; or alternatively, the process may be performed,

7. A photonic radio frequency cosmetic apparatus according to claim 3, wherein:

the power supply assembly comprises an electric plug interface, wherein the electric plug interface is electrically connected with the main control board and is connected with an external power supply to provide power supply; the power supply assembly also comprises an energy storage capacitor or a battery; the energy storage capacitor or the battery is electrically connected with the main control board and the light source lamp.

8. The photonic radio frequency cosmetic apparatus according to any one of claims 1-7, wherein:

the fan housing includes a thermally conductive housing; the heat conducting shell is a heat conducting element made of a heat conducting material, or is formed by a heat pipe or a super heat conducting plate or VC;

the cooling fan module further comprises a refrigerating module; the refrigerating module comprises a semiconductor refrigerating sheet, the hot surface of the semiconductor refrigerating sheet is connected with the heat conducting shell in a rapid heat transfer mode, or the heat conducting shell is the hot surface of the semiconductor refrigerating sheet, so that heat generated by the hot surface can be rapidly radiated through an air flow channel of the fan;

the cold face of the semiconductor refrigerating sheet is used for giving out light panel refrigeration: the light-emitting panel is a cold surface of the semiconductor refrigeration piece, or the cold surface of the semiconductor refrigeration piece is connected with the light-emitting panel in a rapid heat transfer mode, so that rapid cold conduction is realized.

9. The photonic radio frequency cosmetic apparatus of claim 8, wherein:

The cold face of the semiconductor refrigeration sheet is connected with the light-emitting panel through a cold guide piece in a rapid cold guide way;

the cold conducting piece is a heat conducting element made of heat conducting materials, or is formed by a heat pipe or a super heat conducting plate or VC.

10. The photonic radio frequency cosmetic apparatus of claim 9, wherein:

the super heat conduction pipe is an aluminum superconducting pipe, and the super heat conduction plate is an aluminum superconducting plate;

the through channels inside the aluminum superconducting pipe or the aluminum superconducting plate are single channels or multiple channels; more than one micro-groove is formed on the inner wall of the channel; the channels and the micro-groove flow paths on the inner walls of the channels are communicated; the material in the walls of the micro-grooves forms a porous structure;

the two ends of the channel are sealed, and working fluid is encapsulated inside the channel.

11. The photonic radio frequency cosmetic apparatus of claim 8, wherein:

the outer wall of the heat conducting shell is provided with a semiconductor refrigerating sheet, the inner wall of the heat conducting shell is provided with a radiating sheet, and the radiating sheet is connected with the heat conducting shell in a rapid heat transfer manner; the radiating fin is positioned in an air flow passage of the fan; the air channel of the radiating fin is consistent with the air flow direction of the rotation of the impeller.

12. The radiator fan module of claim 11, wherein:

The fan housing comprises a side elevation shell at the outer side of the impeller, and a bottom shell and an upper shell which are arranged at two ends of the axial direction, and a cavity in the fan is formed by enclosing;

the side elevation shell at least partially comprises the heat conducting shell.