CN219083434U

CN219083434U - Two-stage refrigeration module and photon beauty instrument

Info

Publication number: CN219083434U
Application number: CN202223468451.7U
Authority: CN
Inventors: 周莹; 李兵
Original assignee: Shenzhen Jiayukang Medical Instrument Co ltd
Current assignee: Shenzhen Jiayukang Medical Instrument Co ltd
Priority date: 2022-10-17
Filing date: 2022-12-23
Publication date: 2023-05-26
Anticipated expiration: 2032-12-23
Also published as: CN219390650U; CN116839397A; CN115854584A

Abstract

The application relates to a two-stage refrigeration module and a photon beauty instrument, wherein the two-stage refrigeration module comprises a first-stage semiconductor refrigeration piece, a second-stage semiconductor piece and a cold guide piece; the first-stage semiconductor refrigerating piece and the second-stage semiconductor refrigerating piece both comprise an electric coupling layer in the middle and a hot surface and a cold surface at two ends; the cold guide piece is connected between the primary semiconductor refrigerating piece and the secondary semiconductor refrigerating piece in a rapid cold guide mode; the cold guide is a heat transfer structure. The photon beauty instrument adopts the two-stage refrigeration module, and the primary semiconductor refrigeration sheet is directly used as the front working surface of the photon beauty instrument or for refrigerating the front working surface of the photon beauty instrument. By adopting the secondary refrigeration module, the problems that the heat conduction efficiency is uneven, the heat conduction is slow, the heat conduction timeliness is poor, the refrigeration speed is reduced, and the heat is unbalanced at the front end and the rear end or the left end and the right end or the upper end and the lower end of the radiating fin when the heat is conducted to the radiating fin can be solved when the primary semiconductor refrigeration piece dissipates heat through the heat transfer structural member, and the radiating effect of the fan is influenced can be solved.

Description

Two-stage refrigeration module and photon beauty instrument

Technical Field

The utility model relates to the field of beauty equipment, in particular to a two-stage refrigeration module and a photon beauty instrument.

Background

The light source component generates light waves, and the light waves are emitted from a light emitting window of a working head part of the beauty instrument, so that the beauty treatment of the skin surface contacted (or not directly contacted) by the end surface of the working head part can be performed, such as dehairing, skin tendering, spot removing, anti-inflammation, software blood vessel removing, wrinkle removing, skin redness removing, acne treating, vascular lesion treating, pigment lesion treating, or functions of singly or combined with radio frequency physiotherapy and the like. Some portable or handheld beauty treatment instruments on the market at present have poor heat dissipation effect in the machine body, influence the work of the beauty treatment instrument and cannot achieve the expected beauty treatment effect; the internal structure of the machine body is complex, the refrigeration effect of the working face is poor, or the skin is burnt due to the fact that the temperature of the working face is too high, and the user experience is poor.

Disclosure of Invention

The technical problems to be solved by the utility model are as follows: provides a two-stage refrigeration module and a photon beauty instrument, which solve the problems of heat dissipation and working face refrigeration of the existing beauty instrument.

In order to solve the technical problems, the utility model adopts the following technical scheme:

a two-stage refrigeration module comprises a first-stage semiconductor refrigeration piece, a second-stage semiconductor refrigeration piece and a cold guide piece; the first-stage semiconductor refrigerating piece and the second-stage semiconductor refrigerating piece both comprise a middle electric coupling layer, and a hot surface and a cold surface at two ends; the cold guide piece is connected between the primary semiconductor refrigerating piece and the secondary semiconductor refrigerating piece in a rapid cold guide mode; the cold guide is a heat transfer structure.

Further, two ends of the cold guide piece are respectively connected with a hot surface of the primary semiconductor refrigeration piece and a cold surface of the secondary semiconductor refrigeration piece in a rapid heat transfer mode; the heat transfer structural member is one or a combination of a plurality of heat conduction elements, heat pipes, temperature equalization plates, super heat conduction pipes and super heat conduction plates which are made of heat conduction materials.

In some embodiments, the super heat pipe is an aluminum superconducting pipe, and the super heat pipe is an aluminum superconducting plate;

the two ends of the aluminum superconducting plate or the aluminum superconducting tube are sealed, and working liquid is encapsulated in the aluminum superconducting plate or the aluminum superconducting tube; forming more than two micro grooves on the inner wall of the aluminum superconducting plate or the aluminum superconducting pipe during aluminum material molding; and forming a microporous structure in the aluminum superconducting plate or the aluminum superconducting pipe material when the aluminum material is formed.

In some embodiments, the refrigeration module includes a thermally conductive structure and a heat sink; the heat conduction structure is one or a combination of a plurality of heat conduction elements, heat pipes, temperature equalization plates, super heat conduction pipes and super heat conduction plates which are made of heat conduction materials; the heat conducting structure is connected with the radiating fins in a rapid heat transfer way; the heat conducting structure is connected with the hot surface of the secondary semiconductor refrigerating piece in a rapid heat transfer manner, or is welded and electrically connected with the electric coupling layer of the secondary semiconductor refrigerating piece through arranging the hot end circuit of the secondary semiconductor refrigerating piece on the heat conducting structure, so that the heat conducting structure is directly used as the hot surface of the secondary semiconductor refrigerating piece, and the hot surface of the secondary semiconductor refrigerating piece can rapidly dissipate heat; the refrigerating module further comprises a fan; the fan comprises a housing and an impeller in the housing; the thermally conductive structure and/or the heat sink are disposed at a vent of the fan or as part of a housing of the fan.

In some embodiments, the heat conducting structure comprises a plurality of aluminum superconducting plates or aluminum superconducting pipes, wherein the aluminum superconducting plates or the aluminum superconducting pipes are single pipes, and a single channel is formed inside the aluminum superconducting plates or the aluminum superconducting pipes; the aluminum superconducting plate or the aluminum superconducting pipe is bent in a plane or in a special-shaped 3D mode and is matched with the installation space; the heat conduction structure further comprises a heat conduction plate, the aluminum superconducting plates or the aluminum superconducting pipes are combined with the heat conduction plate, and the aluminum superconducting plates or the aluminum superconducting pipes are arranged in at least two different directions or angles to reduce the defect that the heat conduction effect is poor due to the effect of the antigravity direction; the heat sink comprises one or more groups of fins of thermally conductive material; the heat conducting plate is arranged in the groove on the radiating fin or arranged at the top of the radiating fin, or the radiating fin and the heat conducting plate are arranged on another heat conducting piece.

In some embodiments, the heat-conducting plate is provided with a plurality of slots, the aluminum superconducting plates or the aluminum superconducting pipes are matched with the slots and correspondingly installed in the slots, and the wall surfaces are in contact with each other to transfer heat rapidly; welding or riveting the aluminum superconducting plate or the aluminum superconducting pipe with the slot so as to increase the contact area; the secondary semiconductor refrigerating piece is arranged on the heat conducting plate: the heat of the heat surface of the secondary semiconductor refrigerating piece is directly conducted to the heat conducting plate by being attached to the outer wall of the heat conducting plate; or the hot surface of the secondary semiconductor refrigerating piece is arranged on the outer wall of the heat conducting plate through the heat conducting piece, and the heat of the hot surface is quickly conducted to the heat conducting plate through the heat conducting piece; or the heat conducting plate is used as a hot surface, and a hot end circuit of the secondary semiconductor refrigerating piece is arranged on the heat conducting plate and is welded and electrically connected with PN galvanic couple particles of the galvanic couple layer; the aluminum superconducting plates or the aluminum superconducting pipes are designed in a ring shape or staggered or circulating mode by using two different directions or angles or intersecting lines with a certain angle on an XY plane.

In some embodiments, the secondary semiconductor refrigeration unit dissipates heat by a heat dissipation fan module; the cooling fan module comprises a fan shell and an impeller, wherein the interior of the fan shell is a cavity, and the impeller is arranged in the cavity; the fan shell is provided with a plurality of ventilation openings which are used for communicating the cavity with an external air path of the fan; at least part of the fan housing is formed by a thermally conductive housing selected from: one or more of the heat conducting elements, the heat pipes, the temperature equalizing plates, the super heat conducting pipes and the super heat conducting plates which are made of heat conducting materials are formed by splicing in a whole single piece or in a plurality of pieces; the heat surface of the secondary semiconductor refrigerating piece is connected with the heat conducting shell in a heat transfer way, or the heat conducting shell is directly used as the heat surface of the secondary semiconductor refrigerating piece.

In some embodiments, the super heat pipe is an aluminum superconducting pipe, and the super heat pipe is an aluminum superconducting plate; the radiating fan module comprises radiating fins which are connected with the heat conduction shell in a rapid heat transfer way; the air channel of the radiating fin is communicated with the ventilation opening and the cavity of the fan; a side elevation housing of the fan housing includes the thermally conductive enclosure.

In some embodiments, the side elevation housing of the fan housing comprises the thermally conductive enclosure comprised of single or multi-channel aluminum superconducting tubes or plates; the radiating fins are arranged on the inner wall of the side elevation shell of the fan shell; the air channel direction of the radiating fin is the rotation direction or the axial direction of the impeller.

The utility model also relates to a photon beauty instrument, which comprises a machine body provided with a plurality of ventilation openings, wherein a light source component, a power supply component and a control circuit board are arranged in the machine body; the light source component and the power supply component are electrically connected with the control circuit board; the ventilation openings of the machine body are used for air inlet and air outlet and form ventilation channels with the space in the machine body; the front end of the machine body is a working surface; the two-stage refrigeration module according to any one of the embodiments is further arranged in the machine body, and the one-stage semiconductor refrigeration sheet is directly used as the working surface or used for refrigerating the working surface.

Further, when the primary semiconductor refrigeration piece is directly used as a working surface: the primary semiconductor refrigerating piece takes a transparent crystal as a cold surface, the cold surface is directly taken as a working surface, and a heat surface and an electric coupling layer of the primary semiconductor refrigerating piece are provided with light-transmitting windows, so that the primary refrigerating piece has light transmittance; or the cold surface, the hot surface and the electric coupling layer of the primary semiconductor refrigeration sheet jointly define a light transmission window, and photons generated by the light source assembly are transmitted to the outside of the working surface from the light transmission window. When the primary semiconductor refrigerating sheet refrigerates the working surface: the cold surface of the primary semiconductor refrigerating sheet is in contact with the working surface for heat transfer; alternatively, the cold face of the primary refrigeration member is connected with the working face in a rapid heat transfer manner by a heat transfer structural member.

In some embodiments, the two-stage refrigeration module includes a fan positioned in a ventilation channel within the fuselage; the light source assembly comprises a lamp tube and a reflecting cup, the ventilating duct in the reflecting cup is communicated with the ventilating duct of the fan and is communicated with the ventilating duct in the machine body, so that a radiating ventilating duct of the light source assembly is formed, and the fan is used for promoting the radiation of the light source assembly; a radiating fin or a heat conducting piece is arranged on one side of the reflecting cup; a plurality of ventilation openings are formed on the shell of the fan; one ventilation opening is provided with a radiating fin or a heat conducting piece of the reflecting cup, and a ventilation channel of the fan is communicated with a ventilation channel in the machine body to form a first ventilation channel for radiating heat of the reflecting cup; the other ventilation opening of the fan is communicated with the air channel in the reflecting cup, and the ventilation channel of the fan is communicated with the ventilation channel in the machine body to form a second ventilation channel for radiating heat for the reflecting cup and the lamp tube.

In some embodiments, the photonics cosmetic is a depilatory device, a photonics skin rejuvenation device, an import export cosmetic device, or a radio frequency cosmetic device.

The beneficial effects of the utility model are as follows: the two-stage refrigeration module provided by the utility model realizes the effects of rapid refrigeration and heat dissipation.

The present utility model will be described in further detail with reference to the accompanying drawings.

Drawings

Fig. 1 is a perspective view of a cosmetic instrument according to a first embodiment of the present utility model.

Fig. 2 is a perspective view of the cosmetic instrument according to the first embodiment of the present utility model with the upper case removed.

Fig. 3 is a schematic view of the internal structure of the cosmetic instrument according to the first embodiment of the present utility model.

Fig. 4 is a schematic view of a beauty treatment instrument air path according to a first embodiment of the present utility model.

Figure 5 is a schematic view of another embodiment of a cosmetic instrument vent of the present utility model.

Fig. 6 is a schematic view of the beauty treatment instrument internal air passage in the embodiment shown in fig. 5.

Fig. 7 is an exploded view of the beauty instrument of the embodiment shown in fig. 1.

Fig. 8 is a schematic structural view of a first embodiment of the refrigeration module of the present utility model.

Fig. 9 is a perspective view of a first embodiment of the refrigeration module of the present utility model.

Fig. 10 is a partial exploded view of the refrigeration module of the present utility model.

Fig. 11 is a perspective view of the refrigeration module of the present utility model.

Fig. 12 is a partial exploded view of the refrigeration module of the present utility model.

Fig. 13 is a schematic view of a part of the structure of the refrigeration module of the present utility model.

Fig. 14 is a schematic diagram of a transformation structure of a first embodiment of the refrigeration module according to the present utility model, in which fig. 14 (a) and 14 (b) are respectively different views.

Fig. 15 is a schematic structural view of an alternative embodiment of the refrigeration module of the present utility model, in which fig. 15 (a) and 15 (b) are different embodiments, respectively.

Fig. 16 is a perspective view of a cosmetic instrument according to a second embodiment of the present utility model.

Fig. 17 is a perspective view of the cosmetic instrument according to the second embodiment of the present utility model with the upper case removed.

Fig. 18 is a schematic view of the internal structure of a cosmetic instrument according to a second embodiment of the present utility model.

Fig. 19 is an exploded view of a cosmetic instrument according to a second embodiment of the present utility model.

Fig. 20-22 are schematic views of several structures of a second embodiment of a refrigeration module according to the present utility model.

Fig. 23 is a schematic structural view of an aluminum superconducting plate or tube of a refrigeration module according to an embodiment of the present utility model, wherein fig. 23 (a) is a perspective view of a single aluminum superconducting plate or tube, and fig. 23 (b) is a cross-sectional view of 23 (a) taken along A-A.

Fig. 24-26 are schematic structural views of a third embodiment of a refrigeration module according to the present utility model.

Fig. 27 is a perspective view of a third embodiment of the cosmetic instrument of the present utility model after the front cover is removed.

Fig. 28 is a perspective view of the fourth embodiment of the present utility model with the front housing removed.

Fig. 29 is an exploded view of a fourth embodiment of the refrigeration module of the present utility model.

Fig. 30 is a perspective view of a fourth embodiment of the refrigeration module of the present utility model.

Fig. 31 is a schematic view of the internal structure of a cosmetic instrument according to a fifth embodiment of the present utility model.

Fig. 32 is an exploded view of a cosmetic instrument according to a fifth embodiment of the present utility model.

Fig. 33 is a perspective view of a cooling fan module according to an embodiment of the present utility model.

Fig. 34 is a perspective view of another view of a radiator fan module according to an embodiment of the utility model.

Fig. 35 is an exploded view of a radiator fan module according to an embodiment of the present utility model.

Fig. 36 is a schematic cross-sectional view of a radiator fan module according to an embodiment of the utility model.

Fig. 37 is a schematic structural view of a side elevation volute of a radiator fan module according to an embodiment of the utility model.

Fig. 38 is a schematic diagram of an alternative configuration of the embodiment shown in fig. 37.

Fig. 39-40 are schematic views of alternative constructions of the embodiment of fig. 37. .

Fig. 41-42 are schematic structural views of alternative embodiments of the radiator fan module shown in fig. 33-34.

Fig. 43 is a perspective view of a radiator fan module according to an alternative embodiment of the present utility model.

Fig. 44 is a schematic diagram of the alternate embodiment of fig. 33.

Fig. 45 is a schematic cross-sectional view of a radiator fan module according to an alternative embodiment of the utility model.

Fig. 46 is a perspective view of the radiator fan module shown in fig. 45 with a housing portion outer wall removed.

Fig. 47 is an exploded view of the cooling fan module shown in fig. 45.

Fig. 48-49 are perspective views of a radiator fan module according to another alternative embodiment of the utility model from different viewing angles.

Fig. 50-51 are schematic cross-sectional views of different positions of the radiator fan module shown in fig. 48-49.

Fig. 52 is an exploded view of a portion of the radiator fan module shown in fig. 48-49.

Fig. 53 is an exploded view of the radiator fan module shown in fig. 48-49.

Fig. 54 is an exploded view of the radiator fan module shown in fig. 48-49.

Detailed Description

It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other, and the present utility model will be further described in detail with reference to the drawings and the specific embodiments.

Referring to fig. 1 to 54, the present utility model provides a cooling module 1, a cooling fan module 200, and a photon beauty treatment device 100 using the cooling module/cooling fan module 200. The refrigeration module 1 comprises a semiconductor refrigeration piece 10/10', wherein the semiconductor refrigeration piece 10/10' comprises a middle electric couple layer 12, a hot surface 11' and a cold surface 13 at two ends; the refrigeration module 1 further comprises a cold guide piece 15, one end of the cold guide piece 15 is connected with the cold surface 13 of the semiconductor refrigeration piece in a rapid heat transfer mode, and the other end of the cold guide piece 15 is connected with the surface to be refrigerated in a rapid cold guide mode; the cold conducting member 15 is a heat transfer structure or a heat pipe or a VC temperature equalizing plate or a super heat conducting pipe or a super heat conducting plate. Preferably, the super heat conduction pipe is an aluminum superconducting pipe, and the super heat conduction plate is an aluminum superconducting plate. In some embodiments, the cold guide 15 is a first cold guide, and the refrigeration module 1 further includes a second cold guide 15'; the second cold guide piece 15' is arranged between the first cold guide piece 15 and the surface to be refrigerated and is connected with the surface to be refrigerated in a rapid cold guide way; the second cooling guide 15' is a heat conducting material pipe or a heat conducting material plate or an aluminum superconducting pipe or an aluminum superconducting plate or a heat pipe or VC.

As a preferred embodiment of the present utility model, a two-stage refrigeration module 1 is concerned, comprising a primary and a secondary semiconductor refrigeration member 10'/10 and a cold guide member 15; the primary and secondary semiconductor refrigerating elements 10'/10 each comprise a middle electric couple layer 12 and a hot surface 11' and a cold surface 13 at two ends; the cold guide 15 is connected between the primary semiconductor refrigerator 10' and the secondary semiconductor refrigerator 10 in a rapid cold guide manner; the cold guide 15 is a heat transfer structure. Two ends of the cold guide piece 15 are respectively connected with the hot surface 11 'of the primary semiconductor refrigeration piece 10' and the cold surface 13 of the secondary semiconductor refrigeration piece 10 in a rapid heat transfer mode; the heat transfer structural member is one or a combination of a plurality of heat conduction elements, heat pipes, temperature equalizing plates, super heat conduction pipes and super heat conduction plates which are made of heat conduction materials. Further, the refrigeration module 1 comprises a heat conducting structure 19 and a heat sink 16; the heat conducting structure 19 is one or a combination of several of heat conducting elements, heat pipes, temperature equalizing plates, super heat conducting pipes and super heat conducting plates made of heat conducting materials; the thermally conductive structure 19 is in rapid heat transfer connection with the heat sink 16. The heat conducting structure 19 is connected with the hot surface 11' of the secondary semiconductor refrigeration piece 10 in a rapid heat transfer manner; alternatively, the heat conducting structure 19 is directly used as the hot face 11' of the secondary semiconductor refrigeration piece 10 by providing a hot end circuit of the secondary semiconductor refrigeration piece 10 on the heat conducting structure 19 and welding and electrically connecting with the electric couple layer 12 of the secondary semiconductor refrigeration piece 10. The two-stage refrigeration module 1 further includes a fan 18 or a radiator fan assembly 200; the fan 18 or radiator fan assembly 200 includes a fan housing 180/210 and an impeller 181/220 within the housing. The thermally conductive structure 19 and/or the heat sink 16 are disposed at the fan vent 182/201 or as part of the fan housing 180/210.

Referring to fig. 33-53 in combination, in another preferred embodiment of the present utility model, the two-stage semiconductor refrigeration unit 10 of the two-stage refrigeration module 1 is cooled by the cooling fan module 200. The cooling fan module 200 includes a fan housing 210 and an impeller 220, wherein a cavity is formed inside the fan housing 210, and the impeller 220 is installed in the cavity; the fan shell 210 is provided with a plurality of ventilation openings 201, and the ventilation openings 201 are used for communicating the cavity with the air path outside the fan; at least part of the fan housing 210 is formed of a thermally conductive housing 211, the thermally conductive housing 211 being selected from: one or more of the heat conducting element, the heat pipe, the temperature equalizing plate, the super heat conducting pipe and the super heat conducting plate which are made of heat conducting materials are formed by splicing in a whole single piece or in a plurality of pieces. The heat transfer connection between the hot face 11' of the secondary semiconductor refrigeration element 10 and the heat-conducting housing 210; or, the heat-conducting shell 211 is provided with a hot end circuit of the secondary semiconductor refrigeration piece 10 and is welded and electrically connected with the electric couple layer 12 of the secondary semiconductor refrigeration piece 10, so that the heat-conducting shell 211 is directly used as the hot surface of the secondary semiconductor refrigeration piece 10.

The preferred embodiment of the utility model relates to a photon beauty treatment instrument 100, which comprises a body provided with a plurality of ventilation openings 101, wherein a refrigeration module 1, a light source assembly 2, a power source assembly 3 and a control circuit board 4 are arranged in the body. The light source component 2 and the power source component 3 are electrically connected with the control circuit board 4; the vents 111 of the fuselage serve as air intake and air outlet and form ventilation channels (lines shown by arrows in fig. 4-6) with the space within the fuselage to achieve heat dissipation inside the fuselage. The front end of the machine body is a working surface 113, the working surface 113 can be directly contacted with skin, and the light generated by the light source component 2 is transmitted to the working surface 113 to be emitted for carrying out cosmetic treatment on the skin. The two-stage refrigeration module 1 according to the above embodiment is also arranged in the machine body, wherein the one-stage semiconductor refrigeration piece 10' is directly used as the working surface 113 or is used for refrigerating the working surface 113. Specifically, when the primary semiconductor refrigeration sheet 10' is directly used as the working surface 113: the primary semiconductor refrigeration piece 10 'takes transparent crystals as a cold surface 13, the cold surface 13 is directly taken as a working surface 113, and a heat surface 11' and an electric couple layer 12 of the primary semiconductor refrigeration piece 10 'are provided with light transmission windows, so that the primary refrigeration piece 10' has light transmission; alternatively, the cold face 13, hot face 11 'and electric coupling layer 12 of the primary semiconductor refrigeration sheet 10' together define a light transmission window, and photons generated by the light source assembly are transmitted from the light transmission window to the outside of the working face 113, so that the photons act on the skin outside the working face. When the primary semiconductor refrigeration piece 10' refrigerates the working surface 113: the cold face 13 of the primary semiconductor refrigeration piece 10' is in contact with the working face 113 for heat transfer; alternatively, the cold face 13 of the primary refrigeration member 10' is connected to the working face by heat transfer structures in a rapid heat transfer manner. The two-stage refrigeration module 1 comprises a fan 18 or a radiator fan assembly 200 which is positioned in a ventilation channel in the machine body; the light source assembly 2 comprises a lamp tube 20 and a reflector cup 21, wherein an air channel inside the reflector cup 21 is communicated with an air channel of the fan 18 or the radiator fan assembly 200 and is communicated with an air channel in the machine body to form a radiating air channel of the light source assembly 2, and the fan 18 or the radiator fan assembly 200 promotes the radiation of the light source assembly. Wherein, a radiating fin or a heat conducting piece 22 is arranged on one side of the reflecting cup 21; fan housing 180/210 of fan 18/radiator fan assembly 200 has a plurality of vents 182/201 formed therein; a cooling fin or a heat conducting piece 22 of the reflector cup is arranged at one ventilation opening, and a ventilation channel of the fan 18/cooling fan assembly 200 is communicated with a ventilation channel in the machine body to form a first ventilation channel 101 for radiating heat of the reflector cup 21; the other ventilation opening of the fan 18/radiator fan assembly 200 is communicated with the air duct inside the reflector cup 21, and the ventilation duct of the fan 18/radiator fan assembly 200 is communicated with the ventilation duct inside the body to form a second ventilation duct 102 for radiating heat to the reflector cup 21 and the lamp tube 20.

The utility model adopts the secondary refrigeration module, and can solve the problems that when the primary semiconductor refrigeration piece dissipates heat through the heat transfer structural member, the heat conduction efficiency is uneven, the heat conduction is slow, the heat conduction timeliness is poor, the refrigeration speed is reduced, and when the heat is conducted to the radiating fin, the heat of the front end, the rear end, the left end, the right end, the upper end, the lower end of the radiating fin is unbalanced, the radiating effect of the fan is influenced, and the like.

The following are various embodiments of the refrigeration module, the cooling fan assembly 200, and the photon beauty treatment device 100, with reference to the accompanying drawings. Some of the following embodiments may be rearranged to obtain more embodiments, and are included in the scope of the present disclosure.

Referring to fig. 1 to 28, the present utility model provides a refrigeration module 1 and a cosmetic apparatus, wherein the refrigeration module 1 includes a semiconductor refrigeration member 10 for refrigeration of the cosmetic apparatus, the semiconductor refrigeration member 10 includes a middle electric couple layer and a hot surface 11' and a cold surface 13 at both ends; the refrigeration module further comprises a heat conducting structure 19 and a heat sink 16; the heat conducting structure 19 comprises a VC temperature equalizing plate or an aluminum superconducting pipe; the heat conducting structure is respectively connected with the radiating fin 16 and the hot surface 11' of the semiconductor refrigeration piece 10 in a rapid heat transfer manner, so that the hot surface can rapidly radiate heat.

The two ends of the aluminum superconducting plate or the aluminum superconducting tube are sealed, and the inside of the aluminum superconducting plate or the aluminum superconducting tube is encapsulated with working liquid; more than two fine bone-shaped micro grooves 1911 are formed on the inner wall; a microporous structure 1912 is formed within the aluminum superconducting plate or tube material.

Referring to fig. 1-19, an embodiment of the present utility model relates to a beauty treatment apparatus 100, which includes a main body provided with a plurality of ventilation openings 111, wherein the ventilation openings 111 may be disposed at different or the same positions of the casing 110, and may be disposed in different forms, including but not limited to: the housing 110 may have one or more air vents in the form of honeycomb holes, slits, notches, etc., and functionally allows ambient cool air or air to enter the interior of the fuselage from the air vents, remove heat from the interior of the fuselage, and be exhausted from the fuselage through the air vents. The inside refrigeration module 1, light source subassembly 2, power supply module 3 and control circuit board 4 that are provided with of fuselage. The light source component 2 and the power source component 3 are electrically connected with the control circuit board 4; the vents 111 of the fuselage serve as air intake and air outlet and form ventilation channels (lines shown by arrows in fig. 4-6) with the space within the fuselage to achieve heat dissipation inside the fuselage. The front end of the machine body is a working surface 113, the working surface 113 can be directly contacted with skin, and the light generated by the light source component 2 is transmitted to the working surface 113 to be emitted for carrying out cosmetic treatment on the skin.

Referring to fig. 8 to 14, the refrigeration module 1 of the embodiment of the utility model is mainly used for refrigerating the working surface 113 of the beauty instrument so as to achieve the effect of cold compress on the skin. The refrigeration module 1 comprises a semiconductor refrigeration piece 10, wherein the semiconductor refrigeration piece 10 comprises a middle electric couple layer 12, and a hot surface 11' and a cold surface 13 at two ends. The middle electric couple layer 12 is formed by arranging and electrically connecting a hot end circuit arranged on the PN electric couple particle heating surface and a cold end circuit arranged on the cold surface, and is electrically connected with the control circuit board 4 or controlled by an independent circuit to control the work of the semiconductor refrigeration piece. In particular embodiments, the refrigeration member 10 (specifically cold face 13) may be used directly as the working face 113 or to cool the working face 113. When the cooling element 10 is used directly as a working surface, a person skilled in the art can set an adapted shape, such as a transparent crystal or a ring shape, etc., as desired. When the cooling element 10 is used to cool the working surface 113, the cooling surface 13 of the cooling element 10 is in contact with the working surface 113, and is provided, for example, at the periphery of the working surface. Alternatively, the cold face 13 and the working face 113 of the refrigeration unit 10 are in contact with the working face 113 via a heat transfer element (or a heat conducting member). The cold guide member (first cold guide member) 15 is a heat transfer structure, and can rapidly transfer heat of the working surface to the semiconductor refrigerating member, thereby achieving the effect of refrigerating the working surface. The heat transfer structure may be a thermally conductive material such as (without limitation) a thermally conductive element made of a metallic material such as (without limitation) copper tubing or copper plate, etc.; alternatively, the heat transfer structure may be a heat pipe (heat pipe) or a Vapor Chamber (VC) or a super heat pipe or super heat plate or other type of heat transfer assembly, which may be used to connect the semiconductor cooler (cold side) to the working side. The cold guide 15 (first cold guide) can be designed to have a suitable shape on the basis of rapid heat dissipation, depending on the shape of the semiconductor cooling element 10, in particular, depending on the shape of the cold face 13 and the shape of the working face 113. The working surface 113 may be made of transparent crystal or other transparent material. The working surface 113 may be annular, and the annular central through hole is transparent, and is not limited by the material.

A heat pipe (heat pipe) or a vapor chamber (vapor chamber) rapidly transfers heat of a heat generating object to the outside of a heat source through the heat pipe by utilizing the rapid heat transfer property of a heat conduction principle and a refrigerant medium. The heat is transferred through evaporation and condensation of liquid in the totally-enclosed vacuum tube or vacuum plate, and the refrigeration effect is achieved by utilizing the fluid principles such as capillary action, and the device has a series of advantages such as high heat conductivity, excellent isothermicity, heat flow density variability, heat flow direction reversibility and the like. The heat exchanger composed of heat pipes (heat pipes) or vapor chamber (vapor chamber) has the advantages of high heat transfer efficiency, compact structure, small fluid resistance loss and the like.

Referring to fig. 7-11 in combination, as a preferred embodiment, the cold face 13 and the working face 113 of the refrigerating element 10 rapidly transfer heat on the working face 113 or ambient heat of the working face to the refrigerating element 10 (cold face 13) for heat dissipation through the cold guide 15, i.e., the heat pipe, and rapidly transfer heat to the refrigerating element. Depending on the shape of the working surface 113 and the intended cooling effect, the end of the cold guide (heat pipe) 15 contacting the working surface 113 may be designed to be annular and closely contact the periphery of the working surface to quickly absorb heat of the working surface 113 or the surrounding environment of the working surface 113; depending on the shape of the cooling element 10 or the cooling surface 13, the end of the cooling element (heat pipe) 15 that is in contact with the cooling element 10 can be designed as: a predetermined length extending from the annular bend is placed on the cold face 13 of the refrigerating member and is in close contact with the cold face 13.

The heat generated by the hot face 11' of the semiconductor refrigeration unit 10 is exhausted from the body through ventilation channels in the body. Preferably, the semiconductor refrigeration unit 10 enhances the heat dissipation effect by the heat dissipation assembly. The heat dissipation assembly comprises a VC temperature equalization plate 11 and heat dissipation fins 16 arranged on the VC temperature equalization plate 11, wherein the heat surface 11' of the semiconductor refrigeration piece is arranged on the outer wall of the VC temperature equalization plate 11, or the VC temperature equalization plate 11 is directly used as the heat surface of the semiconductor refrigeration piece. The VC temperature equalization plate 11 is used for heat dissipation of the refrigeration unit 10. The VC temperature equalizing plate 11 is positioned in a ventilation channel of the machine body; the refrigerating piece 10 is arranged on the VC temperature equalizing plate 11, and the hot surface 11' of the semiconductor refrigerating piece is attached to the outer wall of the VC temperature equalizing plate, so that the heat of the hot surface is directly transmitted to the VC temperature equalizing plate 11; or the heat surface 11 'of the semiconductor refrigeration piece is arranged on the outer wall of the VC temperature equalizing plate through the heat conducting piece, and the heat of the heat surface 11' is rapidly conducted to the VC temperature equalizing plate 11 through the heat conducting piece; or, the VC temperature equalizing plate 11 is provided with a hot end circuit of the semiconductor refrigerating element, and is welded and electrically connected with PN galvanic particles of the galvanic layer 12. The VC temperature equalization plate 11 is a closed flat plate cavity formed by a bottom plate, a frame and a cover plate, and a capillary structure is arranged in the cavity and contains working fluid. By way of non-limiting example, an extension platform is formed at one end of the VC temperature-equalizing plate 11 for setting or mounting the semiconductor refrigeration piece 10, and the area of the VC temperature-equalizing plate 11 is larger than the electric couple layer 12 and the cold surface 13, so that the hot surface 11' of the semiconductor refrigeration piece has the extended VC temperature-equalizing plate 11, and the heat dissipation area is increased.

The heat dissipation assembly further comprises a heat dissipation fin 16 arranged on the VC temperature equalization plate 11 so as to increase the heat dissipation area of VC. The heat sink 16 may be disposed on the upper surface or the lower surface or both surfaces of the VC temperature uniformity plate 11 according to the heat dissipation requirement of the product. Preferably, the VC temperature equalizing plate 11 is positioned behind the ventilation opening of the machine body; the cooling fins on the VC temperature equalizing plate 11 are opposite to the ventilation opening 111 of the machine body. The heat sink 16 is one or more groups of fins of thermally conductive material, and the position and number and arrangement of the heat sink may be set according to the interior space of the cosmetic instrument. Referring to fig. 10 to 15, on the surface of VC temperature-uniformity plate 11, heat sink 16 is a group of parallel linear heat sink fins arranged in a matrix; alternatively, the VC temperature equalization plate 11 is a fan skeleton, the heat sink 16 is a set of curved heat sink fins (fig. 15 (a)) on the inner wall of the spiral fan skeleton, and the air duct is consistent with the spiral direction of the fan skeleton; alternatively, the heat sink 16 may be a group of heat sink fins arranged in a circular matrix, and the heat sink fins may be arranged in a linear radiation direction, or the heat sink fins may be arranged at an angle to form a rotation direction (fig. 15 (b)).

The refrigeration module 1 of the present utility model further includes a fan 18, and the fan 18 is located in the ventilation channel of the body, for enhancing heat dissipation (refrigeration) efficiency. The fan 18 includes a fan housing 180 and an impeller 181 mounted in a cavity inside the housing, the fan housing 180 being provided with openings as vents 182 of the fan 18; the vents 182 of the fan 18 serve as air intake and air outlet, and communicate with the interior cavity of the fan housing 180 to form an air path for the fan 18, communicating with the air path in the fuselage. VC temperature plate 11 may be part of fan housing 180 or mounted to fan housing 180. The VC temperature uniformity plate 11 and the heat sink 16 are radiated by the air duct of the fan 18, which promotes the flow of the gas to submit the radiation efficiency.

VC temperature plate 11 may be provided as part of the housing of fan 18. The fan 18 housing includes an upper shell, a lower shell 184, and a central peripheral rib 183. The inner wall of the surrounding rib 183 can be provided with heat dissipation teeth to increase the heat dissipation area of the VC temperature equalization plate 11. As shown in fig. 12-14, the VC temperature uniformity plate 11 is provided as an upper (or lower) case cover of the fan case at the top (or bottom) of the annular surrounding bone; the VC temperature equalizing plate 11 may be configured as an annular plate, and a central through hole of the annular plate forms a ventilation opening of the fan 18; the heat sink 16 is provided as a set of parallel heat sink fins covering the central through hole, and the ventilation channels between the heat sink fins are communicated with the central through hole of the VC temperature uniformity plate 11 and the inner cavity of the fan housing.

Referring to fig. 15 (b), the structure is different from that shown in fig. 12 to 14 in that the radiating fins are arranged at the annular edge of the center through hole of the VC-homothermal plate 1, radially arranged orPerson(s)Rotated by a certain angle to arrange a circle。

Referring to fig. 15 (a), VC temperature uniformity plate 11 serves as a peripheral rib outside the fan blade, and heat sink 16 may be provided on the inner wall of the peripheral rib, and semiconductor refrigeration material 10 may be provided on the outer wall of the peripheral rib.

The refrigeration module is simultaneously used for radiating the light source assembly 2. The light source assembly 2 includes a lamp 20, a reflector cup 21 outside the lamp, and electrode pads 23 at both ends of the lamp, the lamp 20 is preferably an IPL lamp, generating IPL photons, or a halogen lamp, or other suitable light source. The ventilation channel of the light source assembly 2 is communicated with the ventilation channel of the fan 18 and is communicated with the ventilation channel in the machine body to form a heat dissipation ventilation channel of the light source assembly 2, and the fan 18 promotes heat dissipation of the light source assembly 2. One side of the reflector cup may be provided with a thermally conductive member 22, such as, but not limited to, a set of thermally conductive sheets (made of thermally conductive material) of thermally conductive member 22, one end of which is attached to the outer wall of the reflector cup and the other end of which extends to the vent 182 of the fan 18. The casing of the fan 18, specifically, on the periphery of the fan blade, a plurality of ventilation openings 182 are formed, as shown in fig. 13, three ventilation openings 182 are formed on the periphery of the fan blade, one (first) ventilation opening is provided with the heat conducting member of the reflector cup, the ventilation channel of the fan 18 is communicated with the ventilation channel in the machine body to form a first ventilation channel 101 (refer to the arrow mark line in fig. 4) for radiating heat of the heat conducting member 22 of the reflector cup and the VC temperature homogenizing plate 11, at this time, external air or cold air enters from the casing ventilation opening 111 (including but not limited to a group of honeycomb holes and gaps of the casing) opposite to the heat radiating plate 16, enters into the fan 18 from the central through hole of the temperature homogenizing plate 11 through the heat radiating plate 16 and the VC temperature homogenizing plate 11, the air circulates in the cavity inside the fan by the impeller and flows through the heat conducting member 22 of the reflector cup and the VC temperature homogenizing plate 11, the heat of the reflector cup 21 and the VC temperature homogenizing plate 11 is discharged from the other (second ventilation opening 182) on the periphery of the fan, and the air is taken away from the ventilation channel in the machine body end (including but not limited to the honeycomb holes and gaps of the casing) and the casing 111 of the heat radiating plate 11. A further (third) vent 182 on the fan rib communicates with the air duct inside the lamp tube and communicates the air duct of the fan 18 with the air duct inside the body to form a second air duct 102 for dissipating heat from the reflector cup 21 and the lamp tube 20. At this time, external air or cold air enters from the casing ventilation opening 111 opposite to the cooling fin 16, enters into the fan 18 through the cooling fin 16 and the VC temperature equalizing plate 11 and enters into the reflecting cup 21 through the fan through the central through hole of the temperature equalizing plate 11, and part of air flow is discharged from the fan through the other ventilation opening 182 on the fan surrounding rib by the impeller, so that heat of the lamp tube 20 in the reflecting lamp and the reflecting cup is taken away, discharged from the lamp tube and discharged from the outside of the machine body through the ventilation opening 111 at the end part of the machine body through the ventilation channel in the machine body, and heat dissipation of the lamp tube 20 and the reflecting cup 21 is further promoted.

The ventilation openings 111 on the body shell of the beauty instrument can be arranged at different positions and in different hole structures, for example, in fig. 5-6, ventilation openings are respectively arranged on the lower shell and the side surface of the body, the ventilation openings on the side surface serve as the outlets of the first ventilation channel 101 and the second ventilation channel 102, and the ventilation channels in the body are correspondingly communicated with the ventilation openings 111 on the side surface.

The beauty instrument 100 of the present utility model, which is applied to the refrigeration module 1 of each embodiment, is used for refrigerating the working surface 113 of the head of the machine body, and the fan of the refrigeration module 1 can also be used for heat dissipation of the light source assembly 2. The photon beauty treatment can be a depilatory instrument, a photon skin tendering instrument, a leading-in and leading-out beauty treatment instrument, a radio frequency beauty treatment instrument and the like, and the refrigerating module of the embodiment can be adopted.

The cosmetic device 100 shown in fig. 1-7 is illustrated as a bar-type device that can be used as an IPL photon depilatory device. Referring to fig. 1-19, an embodiment of the present utility model relates to a beauty treatment instrument 100, which includes a housing 110 provided with a plurality of ventilation openings 111. The housing 110 includes an upper shell 112 and a lower shell 118 that snap together to form a cavity within the fuselage. An upper bracket 114 and a lower bracket 115 are also arranged in the machine body and respectively matched with the upper shell 112 and the lower shell 118, and a lamp holder bracket 24 is arranged in the front end of the machine body so as to install the refrigeration module 1, the light source assembly 2, the power source assembly 3 and the control circuit board 4.

The vents 111 may be disposed at different or the same location of the housing 110 in different hole configurations. The vent 110 is shown disposed on a lower shell 118 or side or end of the enclosure. The cavity inside the fuselage is formed with ventilation channels. Ambient cool air or air enters the interior of the machine body from the ventilation openings to take away heat in the interior of the machine body, and is discharged out of the machine body through the ventilation openings 111 at the same or different positions. The vents 111 of the fuselage serve as air intake and air outlet and form ventilation channels (lines shown by arrows in fig. 4-6) with the space within the fuselage to achieve heat dissipation inside the fuselage. The front end of the machine body is a working surface 113, the working surface 113 can be directly contacted with skin, and the light generated by the light source component 2 is transmitted to the working surface 113 to be emitted for carrying out cosmetic treatment on the skin.

The light source assembly 2 is mounted at the front end of the body through a lamp holder bracket 24, and a light outlet channel and a light outlet window are formed in the lamp holder bracket 24 and used for transmitting light generated by the light source assembly. The working surface 113 is installed on the light-emitting window, the lamp tube 20 is installed on the rear part of the lamp holder bracket by the reflecting cup 21 and is positioned behind the light-emitting channel, and the light-emitting direction of the light source component is provided with the optical filter 25. The heat conducting member 22 of the reflector cup extends rearward to the vent of the fan. The lamp holder support 24 can be provided with an air channel as required, and is communicated with the air channel inside the reflecting cup so as to facilitate air cooling and heat dissipation.

The fan accommodation cavity is formed inside the front end of the buckling of the upper bracket 114 and the lower bracket 115 in the machine body, the refrigeration module 1 is correspondingly installed, the front end of the lower bracket 115 is provided with a window, the window is opposite to and communicated with a vent 111 formed on the lower shell 118, and the cooling fin 16 on the VC temperature equalizing plate 11 is positioned at the window and opposite to the vent 111 on the lower shell 118. The front end of the VC temperature equalization plate 11 is provided with a semiconductor refrigerating element 10, a heat transfer element (heat pipe) 15 which is a cold conducting element is supported by a lamp holder bracket, the front end (annular) is in contact connection with the working surface 113 in a rapid heat conduction manner, and the rear end (parallel straight pipe end) is covered on the cold surface of the semiconductor refrigerating element, so that the heat transfer is performed in close contact rapidly. The fan is arranged in the fan accommodating cavity, the ventilation opening 182 at the front end of the surrounding rib corresponds to the heat conducting piece 22 of the reflecting cup, and the ventilation opening at the rear end is communicated with the ventilation channel formed after the upper bracket and the lower bracket are buckled. The air duct of the fan is denoted by the inlet and outlet air in fig. 8.

The rear section of the upper bracket 114 and the lower bracket 115 inside the body is internally provided with a power supply assembly accommodating cavity, and the power supply assembly 3 is generally a battery, such as a rechargeable battery or a capacitor battery, and further comprises a charging seat 31 for connecting an external power supply to charge the battery or directly supply power to the beauty instrument. The charging stand 31 is electrically connected with the control circuit board 4, is mounted on the casing, and can be connected with a cable.

The ventilation channel 101/102 is defined in the buckled inner parts of the upper bracket 114 and the lower bracket 115 at one side of the accommodating cavity of the power supply assembly, the air channel 101/102 is communicated with the air channel of the fan, the air channel in the reflecting cup is communicated with the ventilation channel in the shell (air inlet and air outlet), and the ventilation channel in the machine body is formed.

The upper bracket 114 and the upper shell 112 are buckled to form a cavity, the control circuit board 4 is installed, and the control circuit board 4 is protected by the upper bracket 114 and the upper shell 112. The casing is also provided with a switch button 117 electrically connected with the control circuit board 4 and a corresponding switch circuit board 116 inside for controlling the on-off operation and the like.

Referring to the embodiment shown in fig. 16 to 19, the refrigerating module 1 of the foregoing embodiment is applied to an L-shaped cosmetic instrument, and functions and structures are the same as or similar to those of the board straightener type of fig. 1 to 7, and only the overall shape of the machine body is matched, so that the size, shape and position of the machine shell, the bracket, the power supply assembly 3, the light source assembly 2, the refrigerating module 1 and the control circuit board 4 are adaptively set. The L-shaped cosmetic instrument includes a handle 120 and a lamp head 130. The lamp cap 130 is rotatably connected to the top of the handle 120 through the knob 150, the knob seat 140 and the rotary pressing plate 151 at the top of the handle, and the rotary connection structure of the lamp cap 130 and the handle and the structure of the handle can adopt the structure of the prior art. The handle tail is a DC line 31', a handle bracket 160 is arranged inside, and the power supply assembly 3 is installed. The cavity on the top side of the handle holder 160 communicates with the interior of the base 130, and a base housing is rotatably mounted. The cap housing includes a front case 131 and a front case cover 132, and the cap 130 is rotatably coupled by the front case cover 132 cooperating with the knob 150, the knob seat 140, and the rotating press plate 151. The inner bracket 133 is mounted on the front shell cover 132 and matched with the front shell 131, one side is provided with the refrigeration module 1, and the other side is provided with the control circuit board 4. The front end of the lamp cap 130 is a working surface 113, which may be: the transparent crystal working surface, the annular semiconductor refrigerating piece or the semiconductor refrigerating piece with the transparent crystal cold surface are all structures in the prior art. The front end of the interior of the lamp cap 130 is provided with a lamp cap bracket 24, and similar to the structure of the embodiment of fig. 1-7, the light source assembly 2 is installed, one side of the heat conducting piece 22 of the reflecting cup of the light source assembly 2 is provided with a heat pipe and a cooling fin assembly 26, the ventilation opening 182 extending to the fan 18 is arranged on the front shell 131, and the ventilation opening is opposite to the cooling fin assembly 26. In this embodiment, the refrigeration module 1 is used to cool the working surface 113, and simultaneously, heat dissipation for the light source assembly 2 is achieved.

The utility model sets the semiconductor refrigeration piece 10 on the VC temperature equalization board 11, the cold face 13 of the refrigeration piece is connected with the working face 113 of the beauty instrument by the cold conducting piece, namely the heat transfer element (heat pipe) 15 to conduct cold rapidly, and the cold compress effect or the cooling effect is formed on the working face. The VC temperature equalizing plate 11 is provided with the radiating fins 16 to improve the radiating area. Further, the VC temperature equalizing plate 11 is combined with the fan, and the phase change effect of the VC temperature equalizing plate in evaporation and condensation is used for the upper shell or the lower shell or the surrounding rib of the fan, so that the heat dissipation efficiency and the speed of the fan during rotation are improved to a greater extent; the heat radiating fins are added on the upper surface of the VC, so that the heat radiating area of the VC can be increased, the contact area between air and the heat radiating fins in induced draft is effectively increased, and the heat radiating fins made of heat conducting materials are added on the lower surface (surrounding rib inner wall) of the upper casing of the VC fan, so that the contact area between air and the heat radiating fins can be increased to a greater extent, and the heat radiating effect is better. The upper surface or the lower surface or the two sides of the VC temperature equalizing plate can be provided with radiating fins according to the radiating requirement of the product.

Referring to fig. 20 to 23, the second embodiment of the refrigeration module 1 of the present utility model is mainly used for refrigerating the working surface 113 (refer to the foregoing embodiment) of the cosmetic apparatus to achieve the cold compress effect on the skin. The refrigeration module 1 includes a semiconductor refrigeration unit 10, where the semiconductor refrigeration unit 10 (refer to the foregoing embodiment) includes a middle electric couple layer 12 and two end hot surfaces 11' and cold surfaces 13, and in a specific embodiment, the refrigeration unit 10 (specifically, the cold surfaces 13) may be directly used as the working surfaces 113 or used to cool the working surfaces 113. When the cooling element 10 is used directly as a working surface, a person skilled in the art can set an adapted shape, such as a transparent crystal or a ring shape, etc., as desired. When the cooling element 10 is used to cool the working surface 113, the cooling surface 13 of the cooling element 10 is in contact with the working surface 113, and is provided, for example, at the periphery of the working surface. Alternatively, the cold face 13 and the working face 113 of the refrigeration unit 10 are in contact with the working face 113 via a heat transfer element (or a heat conducting member). The cold guide member 15 is a heat transfer structural member, and can quickly transfer heat of the working surface to the semiconductor refrigerating member, so that the effect of refrigerating the working surface is achieved. The heat transfer structure may be a thermally conductive material such as, but not limited to, a metallic material such as, but not limited to, copper/aluminum tube or copper/aluminum plate, etc., or a thermally conductive element made of other thermally conductive materials such as silicone grease/silicon wafer/elastic or soft thermally conductive materials; but also heat pipes (heat pipes) or VC (isopipe) or super heat pipes or other components that effect heat transfer. A heat pipe (heat pipe) or a vapor chamber (vapor chamber) uses the heat conduction principle and the rapid heat transfer property of a refrigeration medium to rapidly transfer the heat of a heating object to the outside of a heat source through the heat pipe. The super heat pipe or super heat plate is preferably an aluminum heat pipe/plate. The (aluminum) superconducting heat pipe or (aluminum) superconducting hot plate, or called as ALVC superconducting pipe (plate), is characterized in that the heat is quickly conducted by utilizing evaporation refrigeration and gas-liquid phase change. Referring to fig. 23 in combination, in comparison with the general heat pipe and VC Wen Banxiang, the aluminum heat pipe/plate may be formed with micro grooves or micro teeth or micro channels as capillary structures inside the heat pipe or plate by an aluminum material process molding process on the surface of the heat pipe or plate. Copper powder can be not added into the aluminum superconducting tube (plate), aluminum powder or aluminum silicon powder can be poured into the aluminum superconducting tube (plate), aluminum mesh can be added into the aluminum superconducting tube, and the aluminum superconducting tube (plate) is sealed after refrigerant is poured into the aluminum superconducting tube. The cold guide 15 is connected between the semiconductor refrigerating element (cold face) and the working face, and can be designed to be adapted according to the shape of the semiconductor refrigerating element 10, in particular, according to the shape of the cold face 13 and the shape of the working face 113, based on the principle of rapid heat dissipation. In this embodiment, the cold guide 15 is a copper tube or an ALVC aluminum superconducting tube (plate) or a heat tube or VC.

Depending on the shape of the working surface 113 and the expected cooling effect, the end of the cold guide 15 contacting the working surface 113 may be designed to be annular and directly and closely contact the periphery of the working surface to quickly absorb heat of the working surface 113 or the surrounding environment of the working surface 113; alternatively, a cold guide (second cold guide) 15' is further provided between the working surface 113 and the cold guide 15, and the heat is transferred by contact. The cold guide 15' is a copper pipe or an ALVC superconducting pipe (plate) or a heat pipe or VC, and may be provided in a ring shape, and is fitted to the periphery of the working surface 113 and the ring-shaped end of the cold guide 15, so as to rapidly transfer heat. Depending on the shape of the cooling element 10 or the cooling surface 13, the end of the cooling element 15 that is in contact with the cooling element 10 can be designed as: a predetermined length extending from the annular bend is placed on the cold face 13 of the refrigerating member and is in close contact with the cold face 13.

The heat generated by the hot face 11' of the semiconductor refrigeration unit 10 is exhausted from the body through ventilation channels in the body. Specifically, the semiconductor refrigeration member 10 enhances the heat dissipation effect by the heat dissipation assembly. The heat dissipation assembly comprises a heat conduction structure 19 and a heat dissipation fin 16, and is located in a ventilation channel of the body of the beauty instrument and used for rapidly dissipating heat of the hot surface 11' of the semiconductor refrigeration piece 10. The heat conducting structure 19 comprises a heat conducting plate 190 and a plurality of aluminum VC/ALVC superconductive tubes 191, wherein each aluminum VC/ALVC superconductive tube 191 is a single tube. The heat surface 11 'of the semiconductor refrigeration element is arranged on the outer wall of the heat conducting plate 190, or the heat conducting plate 190 is directly used as the heat surface 11' of the semiconductor refrigeration element 10. One side of the outer wall of the heat-conducting plate 190 is provided with a semiconductor refrigerating piece 10, the other side is provided with a plurality of grooves 192, the grooves 192 are matched with a plurality of aluminum VC/ALVC superconductive tubes 191, and the aluminum VC/ALVC superconductive tubes 191 are accommodated in the grooves 192. The heat-conducting plate slots 192 are connected, e.g., riveted/welded, to the aluminum VC/ALVC superconductive tube 191 to increase the contact area therebetween for rapid heat transfer.

Referring to fig. 23, an aluminum VC/ALVC superconducting pipe 191 is formed with micro grooves or micro teeth or micro holes on the inner wall surface of the aluminum VC/ALVC superconducting pipe by an aluminum processing molding process, and a capillary action is formed inside the aluminum VC/ALVC superconducting pipe. As shown in fig. 23 (b), when an aluminum material is extruded to form an aluminum VC/ALVC superconducting pipe, a single channel 1910 is formed in the pipe, two or more fine bone-shaped micro grooves 1911 are formed in the inner wall of the pipe, a large number of micro-pore structures 1912 can be formed in the pipe wall of the aluminum VC/ALVC superconducting pipe, after the aluminum material is formed into a pipe shape, aluminum powder or aluminum silicon powder and the like can be poured into the pipe by pumping and injecting liquid into the pipe, an aluminum net can be added, and after vacuumizing, the end part is sealed by sintering, so that the aluminum VC/ALVC superconducting pipe with super heat conductivity is obtained. Preferably, each aluminum VC/ALVC superconducting pipe is a single channel 1910, and has the advantages that: the plane bending or the special-shaped 3D bending can be realized, the shape can be changed according to the change of the product space shape, and the staggered combination of the longitudinal modes of a plurality of aluminum VC/ALVC superconducting pipes can be realized so as to overcome the influence of the gravity direction. In the example shown in fig. 23 (a), the aluminum VC/ALVC superconductive tube 191 is bent into an L shape, and accordingly, the slot 192 on the heat-conducting plate 190 is also L-shaped, the aluminum VC/ALVC superconductive tube 191 is just embedded into the slot 192, the L-shaped heat-conducting structure 19 is integrally formed, one end of the L-shape is placed on the hot surface 11' of the semiconductor refrigeration element 10 to be closely contacted for rapid heat transfer, and the other end of the L-shape is installed in the heat-dissipating fin 16. The heat generated by the hot face 11' of the semiconductor refrigeration member 10 is quickly transferred to the heat sink 16 by the heat conducting structure 19 for heat dissipation.

The refrigerating piece 10 is arranged on one side of the heat conducting plate 190, and the hot surface 11' of the semiconductor refrigerating piece is attached to the outer wall of the heat conducting plate 190, so that the heat of the hot surface is directly conducted to the heat conducting plate 190; or, the heat surface 11 'of the semiconductor refrigeration piece is arranged on the outer wall of the heat conducting plate 190 through the heat conducting piece, and the heat of the heat surface 11' is quickly conducted to the heat conducting plate 190 through the heat conducting piece; alternatively, the heat conductive plate 190 is provided with a hot end circuit of the semiconductor refrigerator, and is soldered and electrically connected with the PN galvanic particulates of the galvanic layer 12. The heat conductive plate 190 is a heat conductive member made of a heat conductive material such as, but not limited to, a metal material such as, but not limited to, copper/aluminum or other heat conductive materials such as silicone grease/silicon chip/elastic or soft heat conductive materials. Preferably, the thermally conductive plate 190 is made of a thermally conductive material such as copper/aluminum plate.

The heat sink 16 is disposed on the heat conductive plate 190 to increase a heat dissipation area. Preferably, the heat sink 16 is located behind the vent of the cosmetic instrument body; facing the ventilation opening 111 of the fuselage (see fig. 16, 27-28). The heat sink 16 is one or more groups of fins of thermally conductive material, and the position and number and arrangement of the heat sink may be set according to the interior space of the cosmetic instrument. One or more sets of fins 16 are integrally formed or welded or riveted or otherwise secured by other fastening means to form a unitary structure; alternatively, one or more sets of fins of thermally conductive material are disposed on the thermally conductive plate to form a unitary structure of heat sink 16. The top surface of the heat sink 16 is formed with a groove 161, and one end of the heat conducting structure 19 is inserted into the groove 161, so that rapid heat transfer can be achieved by riveting/welding to increase the contact area between the two.

In other embodiments, the heat conducting structure 19 may be directly disposed on the heat sink 16, or the heat conducting structure 19 may be connected to one side of the heat conducting plate of the heat sink 16 (see fig. 28).

Referring to fig. 24-26, the third embodiment of the refrigeration module 1 is mainly used for refrigerating the working surface 113 (refer to the previous embodiment) of the cosmetic apparatus to achieve the cold compress effect on the skin. The refrigeration module 1 comprises a semiconductor refrigeration member 10, a first cold guide member 15, a second cold guide member 15', a heat sink 16 and a heat conducting structure 19. The first cooling guide 15, the second cooling guide 15', and the heat sink 16 have the same or similar structure as the second embodiment of the refrigeration module 1, and are directly introduced into the above embodiments. The heat conducting structure 19 comprises a heat conducting plate 190 and a plurality of aluminum VC/ALVC superconductive tubes 191, wherein each aluminum VC/ALVC superconductive tube 191 is a single tube, and preferably a single tube. The heat surface 11 'of the semiconductor refrigeration element is arranged on the outer wall of the heat conducting plate 190, or the heat conducting plate 190 is directly used as the heat surface 11' of the semiconductor refrigeration element 10. One side of the outer wall of the heat-conducting plate 190 is provided with a semiconductor refrigerating piece 10, the other side is provided with a plurality of grooves 192, the grooves 192 are matched with a plurality of aluminum VC/ALVC superconductive tubes 191, and the aluminum VC/ALVC superconductive tubes 191 are accommodated in the grooves 192. The heat-conducting plate slots 192 are connected, e.g., riveted/welded, to the aluminum VC/ALVC superconductive tube 191 to increase the contact area therebetween for rapid heat transfer. In this embodiment, the heat-conducting plate 190 includes a circular (not limited to circular) region and a platform extending on one side, on which the semiconductor refrigeration device 10 is disposed. The circular area extends from the center to the circumferential edge and is provided with a plurality of slots 190, the slots 190 are uniformly distributed in the circular area at intervals, an aluminum VC/ALVC superconducting pipe 191 is placed in each slot 190, and the slots 190 and the aluminum VC/ALVC superconducting pipe 191 can be provided with a certain curvature or radian. In a non-limiting example, the plurality of aluminum VC/ALVC superconductive tubes 191 are arranged radially along the radius or approximately along the radius direction after being installed, so that the influence of the gravity direction can be overcome. In other embodiments, the plurality of aluminum VC/ALVC superconducting tubes 191 may be arranged in a longitudinally staggered combination to overcome the influence of the gravity direction. The heat conducting plate slot 190 is connected with the aluminum VC/ALVC superconducting pipe 191, and the contact area between the aluminum VC/ALVC superconducting pipe and the aluminum VC superconducting pipe can be increased through riveting/welding, so that heat transfer is accelerated.

As in the previous embodiments, the aluminum VC/ALVC superconducting pipe 191 preferably adopts a single channel, and micro grooves, micro teeth or micro holes are formed on the inner wall surface of the aluminum VC/ALVC superconducting pipe through an aluminum processing and molding process, cooling liquid is encapsulated inside, aluminum powder, aluminum silicon powder or the like can be filled, and an aluminum net can be added.

The refrigerating piece 10 is arranged on a platform at one side of the heat conducting plate 190, and the hot surface 11' of the semiconductor refrigerating piece is attached to the outer wall of the heat conducting plate 190, so that the heat of the hot surface is directly conducted to the heat conducting plate 190; or, the heat surface 11 'of the semiconductor refrigeration piece is arranged on the outer wall of the heat conducting plate 190 through the heat conducting piece, and the heat of the heat surface 11' is quickly conducted to the heat conducting plate 190 through the heat conducting piece; alternatively, the heat conductive plate 190 is provided with a hot end circuit of the semiconductor refrigerator, and is soldered and electrically connected with the PN galvanic particulates of the galvanic layer 12. Preferably, the heat conductive plate 190 is made of a heat conductive material such as copper/aluminum plate.

The heat sink 16 is disposed on the heat conductive plate 190 to increase a heat dissipation area. By way of non-limiting example, the circular area of the thermally conductive structure 19 may be directly disposed on top of the heat sink 16 or may be secured to the top of the heat sink 16 by welding or riveting to provide rapid heat transfer. A platform on one side of the heat conductive plate 190 extends beyond the heat sink 16 and the semiconductor refrigeration device 10 is disposed on the platform.

Referring to fig. 27, the refrigeration module 1 of the third embodiment is applied to a cosmetic apparatus, for example, a cosmetic apparatus of the shape shown in fig. 16 to 19, and other structural members of the cosmetic apparatus are the same as or similar to those of the embodiment shown in fig. 16 to 19, and are directly referred to. The heat conducting structure 19 is arranged on the ventilation opening at the top of the fan 18, specifically, the circular area of the heat conducting plate 190 is covered on the opening at the top of the fan, the aluminum VC/ALVC superconductive pipe 191 is arranged on the heat conducting plate and faces the fan, the radiating fins 16 are arranged at the ventilation opening 111 facing the side surface of the front shell 131, the heat conducting structure 19, the fan 18 and the radiating fins 16 are all arranged in ventilation channels in the machine body, the ventilation channels are communicated, cold air is input through the ventilation opening 111 of the machine body, and after heat is taken away in the ventilation channel in the machine body, the cold air is discharged to the outside of the machine body through the other ventilation opening 111.

The semiconductor refrigerating element 10 is arranged on the platform at one side of the heat conducting plate 190, and the cold surface of the refrigerating element 10 is connected with the working surface 113 of the beauty instrument by the cold conducting element (copper/ALVC/heat pipe/VC) 15 (and the second cold conducting element 15') to conduct cold rapidly, and the cold compress effect or the cooling effect is formed on the working surface.

The beauty instrument shown in fig. 27 has the same working principle as the previous embodiment, and is not described here.

The embodiment of the beauty apparatus shown in fig. 28 uses the refrigeration module 1 of the third embodiment to refrigerate the working surface 113 of the beauty apparatus, and other structural members of the beauty apparatus are the same as or similar to those of the embodiment shown in fig. 16 to 19, and are directly cited. The heat conducting structure 19 is L-shaped, and is mounted on a vent hole of the top of the fan 18 at one end cover of the heat radiating fin 16, the aluminum VC/ALVC superconductive pipe 191 is mounted on the heat conducting plate 190 to face inwards towards the fan, the semiconductor refrigerating element 10 is arranged at the other end of the heat conducting plate 190, and is positioned outside the vent hole of the top of the fan 18. The wind cooling fin 16 is located outside the ventilation opening 111 towards the side of the front shell 131, the heat conducting structure 19, the fan 18 and the cooling fin 16 are all located in the ventilation channels in the machine body, the ventilation channels are communicated, cold air is input through the ventilation opening 111 of the machine body, heat is taken away in the ventilation channels in the machine body, and then the heat is discharged to the outside of the machine body through the other ventilation opening 111.

The semiconductor refrigerating element 10 is arranged on the platform at one side of the heat conducting plate 190, and the cold surface of the refrigerating element 10 is connected with the working surface 113 of the beauty instrument by the cold conducting element (copper/ALVC/heat pipe/VC) 15 (and the cold conducting element 15') to conduct cold rapidly, and the cold compress effect or the cooling effect is formed on the working surface. In this embodiment, the heat pipe and fin assembly 26 disposed on the side of the heat conductive member 22 of the reflector cup of the light source assembly 2 may be omitted. The heat sink 16 is provided with grooves 161 (fig. 22), one end of the heat conducting plate 190 is installed, and ventilation channels are formed at the same time, and are communicated with the air channels between the adjacent fins of the heat sink 16 and the air channels of the fans, and are communicated with the reflector cups of the light source assembly 2 and the ventilation channels inside the reflector cups, and the heat conducting pieces 22 of the reflector cups of the light source assembly 2 are positioned in the ventilation openings of the fans 18 or the ventilation channels in the machine body, so that air cooling and heat dissipation of the reflector cups 21 and the lamp tubes 20 are realized. In this embodiment, the refrigeration module 1 is used to cool the working surface 113, and simultaneously, heat dissipation for the light source assembly 2 is achieved.

The heat conducting structure 19 of the above embodiment of the present utility model adopts a plurality of aluminum superconductive plates or aluminum superconductive tubes 191 single tube and the heat conducting plate (copper plate) 190 to be combined, so that the problem of the gravity direction of the product can be effectively solved, and the pipeline can be arranged in the XY plane or XYZ three-dimensional direction by using two or more different directions/angles. It is well known that heat and steam flow from bottom to top, so that when the beauty instrument is in use from bottom to top, the gravity effect of the heat conduction structure is obvious, the heat conduction effect in the state is poor due to the effect of the anti-gravity direction, and an ideal heat dissipation effect cannot be achieved.

Referring to fig. 29-30, a fourth embodiment of the refrigeration module 1 of the present utility model adopts a two-stage refrigeration mode, which is mainly used for refrigerating and internally radiating the working surface of the photon beauty treatment instrument, so as to improve the refrigeration efficiency. The specific implementation mode is as follows: the skin contact end, i.e. the working surface, is provided with a first-stage refrigerating piece which acts on skin refrigeration, heat of the first-stage refrigerating piece 10' absorbs the heat through the evaporation end of the cold guide piece (heat pipe/temperature equalizing plate/(aluminum) super heat pipe/(aluminum) super heat conducting plate) 15 and enters the heat pipe/temperature equalizing plate/(aluminum) super heat conducting pipe/(aluminum) super heat conducting plate internal channel to transfer the heat to the condensation end, the condensation end is provided with a second-stage refrigerating piece 10 to actively refrigerate the condensation end, and the temperature of the condensation end depends on the power of the second-stage refrigerating piece 10. The temperature of the condensing end is far lower than that of the ambient wind, so that the condensing speed and timeliness of the condensing end are greatly improved, and the internal phase change circulation of the cold guide (heat pipe/VC/(aluminum) super heat pipe or (aluminum) super heat-conducting plate) 15 is accelerated, thereby achieving the beneficial effect of improving front-end refrigeration; the heat dissipation surface (hot surface) 13 of the secondary refrigeration piece 10 is close to the air inlet or the air outlet of the fan, the heat dissipation of the secondary refrigeration piece 10 can be directly carried away by the fan through a copper/aluminum heat conduction sheet, or the heat on the heat dissipation surface 13 of the secondary refrigeration piece can be conducted to the fan shell through a heat pipe/temperature equalizing plate/(aluminum) super heat conduction pipe/(aluminum) super heat conduction plate, and the heat is carried away by the heat dissipation sheet 16 arranged on the wall of the fan shell through fan blowing or air suction. Compared with the embodiment of the refrigeration module 1 shown in fig. 8-15, the embodiment (fig. 29-30) provides two-stage refrigeration, which is equivalent to using the refrigeration piece 10 of the refrigeration module 1 shown in fig. 8-15 as a two-stage refrigeration piece for refrigerating the first-stage refrigeration piece 10' connected at the cold end. The two-stage refrigeration is mainly used for refrigerating the working face 113 of the beauty instrument so as to achieve the cold compress effect on the skin. The primary refrigeration piece 10' is connected with the working surface 113 or directly serves as the working surface 113, and the secondary refrigeration piece 10 is connected with the cooling fan assembly or directly arranged in the fan shell. The primary and secondary refrigeration members are preferably semiconductor refrigeration members, the semiconductor refrigeration member 10/10 'including a middle electric coupling layer 12 and two end hot and cold faces 11' and 13. The middle electric couple layer 12 is formed by arranging and electrically connecting a hot end circuit arranged on the PN electric couple particle heating surface and a cold end circuit arranged on the cold surface, and is electrically connected with the control circuit board 4 or controlled by an independent circuit to control the work of the semiconductor refrigeration piece.

In particular embodiments, primary refrigeration member 10' (specifically cold face 13) may be used directly as working face 113 or to cool working face 113. When the primary refrigeration piece 10' is directly used as a working surface, a person skilled in the art can set an adaptive shape according to needs, for example, a whole transparent crystal is used as a cold surface 13 to directly serve as a working surface 113, and the hot surface 11' and the electric couple layer 12 are provided with light transmission windows, so that the primary refrigeration piece 10' has light transmission; for example, the cold surface 13, the hot surface 11' and the electric coupling layer 12 are provided in a ring shape or together formed with a light-transmitting window, and are not limited by materials. When the primary refrigeration member 10 'is connected to the working surface 113 to perform refrigeration, the cold surface 13 thereof contacts the working surface 113, for example, disposed at the periphery of the working surface, or the cold surface 13 of the primary refrigeration member 10' contacts the working surface 113 via a heat transfer element (or a heat conducting member) with the working surface 113.

A cold guide member (first cold guide member) 15 is provided to be connected between the primary semiconductor refrigeration member 10 '(specifically, the hot surface 11') and the secondary semiconductor refrigeration member 10 (specifically, the cold surface 13) in a rapid cold guide manner; the heat of the primary semiconductor refrigerating element 10' can be quickly transferred to the secondary semiconductor refrigerating element 10, and the effect of refrigerating the working surface is realized. The cold guide 15 is a heat transfer structure, which may be a heat conductive material such as (but not limited to) a heat conductive element made of a metal material such as copper tube or plate or other heat transfer structure; preferably a heat pipe (heat pipe) or a vapor chamber (aluminum) or an (aluminum) super heat pipe. The cold guide 15 can be designed to be in an adaptive shape based on the principle of rapid heat dissipation according to the shapes of the primary semiconductor refrigerating element 10' and the secondary semiconductor refrigerating element 10. When the primary semiconductor refrigeration member 10' is directly used as the working surface 113, it has light transmittance or is provided with a light-transmitting window. One end of the cold guide member (heat pipe) 15, which is in contact with the working surface 113, may be designed as a ring shape, and closely contacts with the periphery of the hot surface 11 'of the primary semiconductor refrigeration member 10' to rapidly absorb heat of the primary semiconductor refrigeration member 10 'or the surrounding environment of the primary semiconductor refrigeration member 10'; the end of the cold guide (heat pipe) 15 contacting the secondary refrigerator 10 may be designed as: a predetermined length extending from the annular bend is placed on the cold face 13 of the secondary refrigeration member 10 and is in close contact with the cold face 13.

The secondary semiconductor refrigeration member 10 enhances the heat dissipation effect by the heat dissipation assembly. The heat dissipation component comprises a heat pipe or an (aluminum) super heat-conducting plate or a temperature-equalizing plate which are spliced to form a heat-conducting shell 11 in a whole single piece or in a plurality of pieces, and a heat dissipation sheet 16 arranged on the heat-conducting shell 11, wherein the hot surface 11' of the secondary semiconductor refrigerating piece is arranged on the outer wall of the heat-conducting shell 11, or the heat-conducting shell 11 is directly used as the hot surface of the semiconductor refrigerating piece. The heat-conducting shell 11 is used for heat dissipation of the secondary refrigeration member 10. When applied to a beauty instrument, the heat conducting shell 11 is positioned in a ventilation channel of the machine body; the second-stage refrigerating piece 10 is arranged on the heat-conducting shell 11, and a hot surface 11' of the second-stage semiconductor refrigerating piece is attached to the outer wall of the heat-conducting shell 11, so that the heat of the hot surface is directly conducted to the heat-conducting shell 11; or, the heat surface 11 'of the secondary semiconductor refrigeration piece 10 is arranged on the outer wall of the heat conduction shell 11 through a heat conduction piece, and the heat of the heat surface 11' is rapidly conducted to the heat conduction shell 11 through the heat conduction piece; or, a hot end circuit of the semiconductor refrigerating piece is arranged on the heat conducting shell 11, and is welded and electrically connected with PN galvanic particles of the galvanic layer 12. The heat conducting shell 11 is preferably formed by splicing a temperature equalizing plate/(aluminum) super heat conducting plate in a whole single piece or in a plurality of pieces, and is a closed flat cavity formed by a bottom plate, a frame and a cover plate, wherein a capillary structure is arranged in the cavity and is used for containing working fluid. As a non-limiting example, an extension platform is formed at one end of the heat conducting shell 11 for setting or mounting the secondary semiconductor refrigeration unit 10, and the area of the heat conducting shell 11 is larger than that of the electric couple layer 12 and the cold surface 13, so that the heat dissipation area of the hot surface 11' of the secondary semiconductor refrigeration unit 10 is increased.

The heat-conducting shell 11 is provided with heat-radiating fins 16 to increase the heat-radiating area. The heat sink 16 may be disposed on the upper surface or the lower surface or both surfaces of the heat conductive housing 11 according to the heat dissipation requirement of the product. Preferably, the heat conducting housing 11 is located behind the vent opening of the cosmetic device body with the upper heat sink facing the vent opening 111 of the body. The heat sink 16 is one or more sets of fins of thermally conductive material.

The heat dissipating assembly of the secondary refrigerator 10 further includes a fan 18, and the fan 18 is located in the ventilation passage of the body of the beauty treatment instrument for enhancing heat dissipating (cooling) efficiency. The configurations of the cooling fan 180, the secondary refrigeration unit 10, the heat-conducting housing 11 (heat pipe/temperature equalizing plate/(aluminum) super heat-conducting pipe/(aluminum) super heat-conducting plate) and the heat sink 16 in this embodiment are described above with reference to the embodiment shown in fig. 10-15, and are directly incorporated into this embodiment without redundant description. The fan 18 includes a fan housing 180 and an impeller 181 mounted in a cavity inside the housing, the fan housing 180 being provided with openings as vents 182 of the fan 18; the vents 182 of the fan 18 serve as air intake and air outlet, and communicate with the interior cavity of the fan housing 180 to form an air path for the fan 18, communicating with the air path in the fuselage. The (heat pipe/cold plate/(aluminum) super heat pipe/(aluminum) super heat plate) heat conductive housing 11 may be part of the fan housing 180 or mounted on the fan housing 180.

The two-stage refrigeration module 1 of the present embodiment is applied to refrigeration and heat dissipation of the photon beauty treatment instrument 100, and referring to fig. 31-32, the heat dissipation component of the two-stage refrigeration module 1 is simultaneously used for heat dissipation of the light source component 2. The light source assembly 2 includes a lamp 20, a reflector cup 21 outside the lamp, the lamp 20 generating IPL photons for the IPL lamp or being a halogen lamp or other suitable light source. The ventilation channel of the light source assembly 2 is communicated with the ventilation channel of the fan 18 and is communicated with the ventilation channel in the machine body to form a heat dissipation ventilation channel of the light source assembly 2, and the fan 18 promotes heat dissipation of the light source assembly 2. One side of the reflector cup may be provided with a thermally conductive member 22, such as, but not limited to, a set of thermally conductive sheets (made of thermally conductive material) of thermally conductive member 22, one end of which is attached to the outer wall of the reflector cup and the other end of which extends to the vent 182 of the fan 18. The casing of the fan 18, specifically, on the periphery of the fan blade, a plurality of ventilation openings 182 are formed, as shown in fig. 13, three ventilation openings 182 are formed on the periphery, one (first) ventilation opening is provided with the heat conducting member of the reflector cup, and the ventilation channel of the fan 18 is communicated with the ventilation channel in the machine body to form a first ventilation channel 101 (refer to the arrow mark line in fig. 4) for radiating heat from the heat conducting member 22 of the reflector cup and the heat conducting shell 11 of the (heat pipe/temperature equalizing plate/(aluminum) super heat conducting pipe/(aluminum) super heat conducting plate), at this time, external air or cold air enters from the ventilation opening 111 of the machine casing (including but not limited to a group of honeycomb holes and gaps of the casing) which are opposite to the heat radiating plate 16, the heat of the reflecting cup 21 and the heat of the heat conducting shell 11 of the heat (heat pipe/temperature equalizing plate/(aluminum) super heat conducting pipe/(aluminum) super heat conducting plate) are taken away by the heat conducting piece 22 of the air flow circulating in the cavity of the fan and flowing through the reflecting cup by the impeller and the heat conducting shell 11 of the heat (heat pipe/temperature equalizing plate/(aluminum) super heat conducting pipe/(aluminum) super heat conducting plate, and the heat of the heat conducting shell 11 of the heat reflecting cup 21 and the heat of the heat conducting shell 11 of the heat (heat pipe/temperature equalizing plate/(aluminum) super heat conducting pipe/(aluminum) super heat conducting plate) is discharged by the other (second) ventilation opening 182 on the surrounding bone of the fan, and is discharged from the outside of the body through ventilation channels (including but not limited to a group of honeycomb holes and gaps of the shell) 111 at the end of the body, so as to realize heat dissipation of the heat conducting piece 22 of the reflecting cup and the heat conducting shell 11 of the (heat pipe/temperature equalizing plate/(aluminum) super heat conducting pipe/(aluminum) super heat conducting plate). A further (third) vent 182 on the fan rib communicates with the air duct inside the lamp tube and communicates the air duct of the fan 18 with the air duct inside the body to form a second air duct 102 for dissipating heat from the reflector cup 21 and the lamp tube 20. At this time, external air or cold air enters from the casing ventilation opening 111 opposite to the cooling fin 16, enters into the fan 18 through the cooling fin 16 and the heat conducting shell 11 (heat pipe/temperature equalizing plate/(aluminum) super heat conducting pipe/(aluminum) super heat conducting plate), and is discharged from the fan through the central through hole of the temperature equalizing plate 11 to the inside of the reflecting cup 21 through the other ventilation opening 182 on the fan surrounding frame by the impeller, so as to take away the heat of the lamp tube 20 and the reflecting cup in the reflecting lamp, discharge the heat of the lamp tube and discharge the heat of the reflecting cup out of the machine body from the ventilation opening 111 at the end part of the machine body through the ventilation channel in the machine body, and further promote the heat dissipation of the lamp tube 20 and the reflecting cup 21. The heat dissipating assembly and heat dissipating principle are the same as the embodiments shown in fig. 1-14.

The face 113 of the cosmetic device 100 of the present utility model is formed by a transparent crystal cold face of the primary refrigeration member 10', as in the embodiment of figures 1-14. The photon beauty treatment can be a depilatory instrument, a photon skin tendering instrument, a leading-in and leading-out beauty treatment instrument, a photon radio frequency beauty treatment instrument and the like, and the refrigerating module of the embodiment can be adopted. The primary refrigeration piece 10 is arranged at the skin-contacting end, namely the working surface, in the photon beauty instrument, and is used for refrigerating skin, heat (specifically, the hot surface 11 ') of the primary refrigeration piece 10' is absorbed by the evaporation end of the cold conducting piece (heat pipe/temperature equalizing plate/(aluminum) super heat conducting pipe/(aluminum) super heat conducting plate) 15 and enters the internal channel to transfer the heat to the condensation end, the condensation end is provided with the secondary refrigeration piece 10 for actively refrigerating the condensation end, and the temperature of the condensation end at the moment depends on the power of the secondary refrigeration piece 10. The temperature of the condensing end is far lower than that of the ambient wind, so that the condensing speed and timeliness of the condensing end are greatly improved, and the internal phase change circulation of the cold guide (heat pipe/temperature equalizing plate/(aluminum) super heat pipe/(aluminum) super heat conducting plate) is quickened, thereby achieving the beneficial effect of improving the front-end refrigeration; the heat dissipation surface 11 'of the secondary refrigeration piece 10 is close to the air inlet or the air outlet of the fan, the heat dissipation of the secondary refrigeration piece can be directly carried away by adopting the copper/aluminum heat conduction sheet 16 through the fan, or the heat on the heat dissipation surface 11' of the secondary refrigeration piece 10 can be conducted to the fan shell through the heat pipe/the temperature equalizing plate/(the aluminum super heat conduction pipe/(the aluminum super heat conduction plate), and the heat is carried away by the heat dissipation sheet 16 arranged on the wall of the fan shell through the blowing or the suction of the fan.

The beauty apparatus 100 of the embodiment shown in fig. 31 to 32 is identical to other structures of the beauty apparatus of the embodiment shown in fig. 1 to 7, and the description of the corresponding embodiment is directly incorporated into the present embodiment, and the description is not repeated here. In terms of the principle of the heat pipe, the heat generated by the evaporation end of the cold guide 15 after being heated and vaporized needs to be "conducted" to the cooling fin 16 through the pipe wall of the condensation end, so that the heat is taken away by the fan 18, the condensation belongs to driven/passive heat dissipation, and the heat dissipation effect of the condensation end depends on the ambient temperature of the wind sucked by the fan; for example, the timeliness and speed of condensation are deteriorated, so that the effect of influencing the internal circulation of the heat pipe is deteriorated. The primary semiconductor refrigerating piece 10' is only adopted to refrigerate the skin, so that the heat conduction efficiency is uneven, the heat conduction is slow, the heat conduction timeliness is poor, the heat is uneven at the front end and the rear end or the left end and the right end or the upper end and the lower end of the radiating fin when the heat is conducted to the radiating fin, and the effect of the fan on sucking or blowing out partial wind to the maximum is also influenced; the two-stage refrigeration module 1 is adopted in the embodiment, the first-stage refrigeration piece 10 'is transferred to the second-stage refrigeration piece 10 by the cold guide piece 15, and the problems that only the first-stage refrigeration piece 10' is adopted are effectively solved.

In other embodiments, the secondary refrigeration member 10 uses the heat dissipation assembly of the refrigeration module of the embodiment shown in fig. 20-26 to perform rapid heat dissipation, that is, the primary refrigeration member 10' (specifically, the hot surface 11 ') is connected to the secondary refrigeration member 10 (specifically, the cold surface 13) through a rapid heat transfer manner by the cold guide member 15 (15 ') so as to rapidly guide the cold. The heat generated by the hot face 11' of the secondary semiconductor refrigeration member 10 is rapidly dissipated by the heat conducting structure 19 and the heat sink 16. The heat conducting structure 19 comprises a heat conducting plate 190 and a plurality of aluminum VC/ALVC superconductive tubes 191, wherein each aluminum VC/ALVC superconductive tube 191 is a single tube. The hot face 11 'of the secondary semiconductor refrigeration member 10 is disposed on the outer wall of the heat conducting plate 190, or the heat conducting plate 190 directly serves as the hot face 11' of the secondary semiconductor refrigeration member 10. One side of the outer wall of the heat-conducting plate 190 is provided with a second-level semiconductor refrigerating piece 10, the other side is provided with a plurality of grooves 192, the grooves 192 are matched with a plurality of aluminum VC/ALVC superconductive tubes 191, and the aluminum VC/ALVC superconductive tubes 191 are accommodated in the grooves 192. The heat-conducting plate slots 192 are connected, e.g., riveted/welded, to the aluminum VC/ALVC superconductive tube 191 to increase the contact area therebetween for rapid heat transfer. The heat dissipation assembly further comprises a heat dissipation fan assembly, and the heat dissipation fan can be realized by adopting the structure of each embodiment or a common fan.

In the following embodiments, referring to fig. 33-54, the heat dissipation fan module 200 is used to quickly dissipate heat from the secondary refrigerator 10 according to the above embodiments. In this embodiment, the cooling fan module 200 includes a fan housing 210 and an impeller 220, wherein a cavity is formed inside the fan housing 210, and the impeller 220 is installed in the cavity; the fan housing 210 is provided with a plurality of ventilation openings 201, the ventilation openings 201 communicate the cavity with the air path outside the fan, and at least part of the housing of the fan housing 210 is composed of a heat pipe or a super heat conducting plate or a VC 211. The fan housing 210 includes a side elevation housing, and the top and bottom may be selectively provided with an upper case and a bottom case according to specific product needs, and the upper case and the bottom case may be formed of upper fins or lower fins of a heat sink described below without being separately provided. The side elevation housing may be a volute or a portion of a housing of the volute outside the circumference of rotation of the impeller.

Preferably, the super heat conduction pipe is an aluminum superconducting pipe, and the super heat conduction plate is an aluminum superconducting plate. The through channel 2110 inside the aluminum superconducting pipe or the aluminum superconducting plate is a single channel or multiple channels; the single channel or the multiple channels are porous micro-groove channels; the channels 2110 and the porous micro grooves 2111 on the inner wall thereof are communicated with each other; the two ends of the single channel or the multiple channels are sealed, and working fluid is encapsulated inside the single channel or the multiple channels.

The fan shell comprises a volute casing at the outer side of the impeller, and the volute casing encloses a cavity in the fan; the top of the volute can be provided with an upper shell or a vent 201 is formed at the top, and the bottom is a bottom shell or the vent 201 is formed at the bottom; the vent at the top can also be a plurality of through holes arranged on the upper shell, and the vent at the bottom can also be a plurality of through holes arranged on the bottom shell. The volute or upper or lower shell is partially or entirely comprised of heat pipes or super heat pipes or VC 211. The heat pipe or super heat conducting plate or VC 211 is integrally monolithic or spliced by a plurality of pieces.

The cooling fan module 200 includes a cooling fin 212, and the cooling fin 212 is connected to a heat pipe or a super heat board or a VC 211 in a fast heat transfer manner. The heat sink 212 is located within a cavity within the fan housing. The heat sink 212 includes one or more sets of fins of thermally conductive material; the air channels between adjacent fins, namely the air channels of the radiating fins, are communicated with the ventilation opening and the cavity of the fan.

Preferably, the side elevation of the fan housing, i.e. the volute, is provided with a heat pipe or super heat pipe or VC 211; the heat sink 212 is disposed on the inner wall of the side elevation and is spaced apart from the impeller 220 by a predetermined distance, so as not to affect the rotation of the impeller 220. More preferably, the side elevation of the volute forms a heat conducting shell by a single-channel or multi-channel aluminum superconducting pipe or an aluminum superconducting plate; the heat sink 212 is disposed on the inner wall of the heat conductive housing. The fins are circumferentially arranged along the radial direction of the rotation center of the impeller; the air channels between the adjacent fins are consistent with the air flow direction generated by the rotation of the impeller.

The inner wall of the single channel or multi-channel 2110 of the aluminum superconducting pipe or the aluminum superconducting plate forms more than two fine bone-shaped micro grooves 2111; the direction of the grooves of the micro grooves 2111 is along the radial circumference of the rotation center of the impeller, and is consistent with the direction of the air flow generated by the rotation of the impeller. The interior of the wall material of the micro-groove 2111 forms a porous structure. The porous structures inside the channels 2110, micro grooves 2111 and the material are formed by one-step molding through an aluminum extrusion molding process.

Preferably, the cooling fan module 200 of the present utility model includes the secondary semiconductor refrigeration member 10, and the heat dissipating surface (hot surface) of the secondary semiconductor refrigeration member 10 is connected to the heat pipe or the super heat pipe or the VC 211 in a rapid heat conduction manner. The heat dissipation surface of the secondary semiconductor refrigeration piece 10 and the heat pipe or the super heat pipe or the VC 211 are mutually attached to be contacted with each other to transfer heat or are mutually attached to be contacted with each other through the heat conducting plate to transfer heat, or the heat dissipation surface of the secondary semiconductor refrigeration piece 10 and the heat pipe or the super heat conducting plate or the VC 211 are respectively arranged at different parts of the fan shell to mutually transfer heat conduction in an express way.

The cooling fan module 200 includes a driving control circuit board 240 and a driving module 250, the driving control circuit board 240 is electrically connected with the driving module 250, and the driving control circuit board 240 and the driving module 250 are electrically connected with an external power supply through a power line or a power module; the driving module 250 is used for driving the impeller 220 to rotate. The electrodes of the secondary semiconductor refrigeration unit 10 are electrically connected to the drive control circuit board 240 or to an external circuit board.

In some embodiments, the drive control circuit board 240 is disposed outside the fan housing to be waterproof; the vent 201 is provided with a sealing ring for preventing water; the driving module 250 is disposed on the driving control circuit board 240 and mounted outside the fan bottom case 214; since the driving control circuit board 240 and the driving module 250 are respectively installed inside and outside the fan bottom case 214, the driving control circuit board 240 and the driving module 250 are not affected when water is sucked or introduced into the fan. The driving module 250 comprises a motor, and an output shaft of the motor is in shaft connection with the impeller to drive the impeller 220 to rotate; alternatively, the driving module 250 includes a motor stator coil, the impeller is sleeved with a magnetic ring 25, the magnetic ring 25 is fixedly connected with the impeller 220, the driving module 250 generates a magnetic field after being electrified, and the magnetic ring 25 rotates to drive the fan impeller to rotate.

The heat radiation fan module 200 is a radial flow fan or an axial flow fan; in the radial flow fan, the air flow generated by the rotation of the impeller 220 can be exhausted through the vent on the volute after circulating along the radial circumference of the rotation center of the impeller; in the axial flow fan, the air flow generated by the rotation of the impeller 220 is exhausted from the vent hole at the top or the vent hole at the bottom of the scroll case in the direction of the central axis.

In some embodiments, the vent 201 of the fan is provided with a heat sink 212, the cavity of the fan communicating with the external environment by the air path of the heat sink.

The heat pipe (heat pipe) or the Vapor Chamber (VC) in the utility model rapidly transfers the heat of the heating object to the outside of the heat source through the heat pipe by utilizing the heat transfer principle and the rapid heat transfer property of the refrigeration medium. The heat is transferred through evaporation and condensation of liquid in the totally-enclosed vacuum tube or vacuum plate, and the refrigeration effect is achieved by utilizing the fluid principles such as capillary action, and the device has a series of advantages such as high heat conductivity, excellent isothermicity, heat flow density variability, heat flow direction reversibility and the like. The heat exchanger composed of heat pipes (heat pipes) or vapor chamber (vapor chamber) has the advantages of high heat transfer efficiency, compact structure, small fluid resistance loss and the like.

The super heat pipe or super heat-conducting plate in the present utility model is preferably an aluminum heat pipe/aluminum heat-conducting plate. The (aluminum) superconducting heat pipe or (aluminum) superconducting hot plate, or called as ALVC superconducting pipe (plate), is characterized in that the heat is quickly conducted by utilizing evaporation refrigeration and gas-liquid phase change. In comparison with general heat pipes and VC Wen Banxiang, the aluminum superconducting heat pipe/plate can be formed with micro grooves or micro tooth-like or micro pore channels on the surface of the heat pipe or plate by aluminum processing (extrusion molding) process as capillary structures inside the heat pipe or plate. The aluminum superconducting tube (plate), namely the ALVC aluminum superconducting tube (plate), can be filled with aluminum powder or aluminum silicon powder without adding copper powder, can be filled with aluminum mesh, and can be sealed after being filled with refrigerant.

The following description of specific embodiments is provided as an enabling understanding of the present utility model and is not intended to limit the utility model to the specific embodiments described, and in connection with the accompanying figures. The protection scope of the utility model is subject to the claims. The following structures of the cooling fan module 200 of the embodiments may be replaced, combined or modified, which falls within the scope of the disclosure.

Referring to fig. 33 to 40, a radiator fan module 200 according to a first embodiment of the present utility model is a blower module including a fan housing 210 having a cavity formed therein, an impeller 220 mounted in the cavity, and a secondary semiconductor refrigeration member 10 mounted on the fan housing. The fan housing 210 includes a side elevation scroll casing, the scroll casing is covered outside the impeller 220, the scroll casing is a heat conducting housing, the inner wall of the scroll casing is provided with a cooling fin 212, and the scroll casing is integrally formed by a heat pipe or a super heat conducting plate or a VC 211. In this embodiment, the scroll casing is described by taking an aluminum superconducting pipe or an aluminum superconducting plate as an example.

The side elevation volute and top of the fan housing 210 are provided with a ventilation opening 201, the ventilation opening 201 communicates the cavity with an external air path of the fan, for example, air can be introduced from the ventilation opening at the top, after entering the cavity, the impeller 220 is used for promoting airflow to circulate and take away heat on the surface of the cooling fin 212, and finally the heat is discharged from the ventilation opening at the side elevation. Referring to fig. 34, a plurality of ventilation openings 201 may be formed on the bottom of the fan housing 210, that is, the bottom case 214, to assist in air intake, the fan of this embodiment is radial flow, air is taken in by the impeller or the top and bottom ventilation openings in the axial direction of the fan, air is taken out by the ventilation openings in the side elevation, and air intake and air outlet are also interchangeable, and air intake and air outlet are not limited.

In this embodiment, the fan housing 210 encloses a side elevation volute and a bottom casing, with the top open as a vent. The side elevation volute forms an integral heat conduction shell by a single heat pipe or a super heat conduction plate or VC211 (shown in fig. 35-37 and 39), or forms a heat conduction shell by a plurality of heat pipes or super heat conduction plates or VC211 (shown in fig. 38), the heat pipe or super heat conduction plate or VC211 is closely contacted with the inner layer of the radiating fins 212 for heat conduction, and the heat pipe or super heat conduction plate or VC211 and the radiating fins 212 can be connected through welding or riveting or bonding or other modes, so that heat transfer is fast.

Preferably, the side elevation volute adopts an aluminum superconducting pipe or an aluminum superconducting plate 11, and can be formed into a heat conduction shell by splicing a single piece or a plurality of pieces, a through channel 2110 in the length direction inside each piece of aluminum superconducting pipe or aluminum superconducting plate 11 is a single channel or multiple channels, two ends of each channel are sealed, and working fluid is filled inside each channel. The inner wall of each channel 2110 forms a plurality of fine bone-shaped micro grooves 2111, and the micro grooves 2111 are communicated with the channels 2110 where the micro grooves 2111 are located for the circulation of working fluid. The material has a porous structure formed therein. The porous and micro-grooves 2111 form capillary action within the channels 2110. Copper powder, aluminum silicon powder or the like can be poured into the channel 2110, an aluminum mesh can be added, and the channel is sealed after being poured with a refrigerant. The holes, micro grooves 2111 and channels 2110 can be all formed simultaneously by forming the tube shape by an aluminum processing (extrusion) molding process, and form a capillary structure inside the aluminum superconducting tube or the aluminum superconducting plate 11. The direction of the grooves of the micro grooves 2111 and the length direction of the channels 2110 may be the direction of rotation of the impeller (as shown in fig. 36-39) or may be vertically arranged in the axial direction, as shown in fig. 40.

The fins 212 are one or more groups of fins of thermally conductive material, and the location and number and arrangement of the fins may be set according to the space of the fan cavity. One or more sets of fins 212 are integrally formed or welded or riveted or otherwise secured by other fastening mechanisms to form a unitary structure; alternatively, one or more sets of thermally conductive material fins (e.g., aluminum/copper/graphene or other thermally conductive fins) are disposed on the thermally conductive plate to form a unitary structure of heat sink 212. The shape of the heat sink 212 is adapted to the shape of the spiral case, the heat pipe, the super heat pipe, or the VC 211, in this embodiment, the heat sink 212 is in a cylinder or ring shape, and is sleeved on the inner wall of the heat conducting shell formed by the ring heat pipe, the super heat pipe, or the VC 211, and is directly attached to each other or attached to each other by heat conducting pieces, so as to transfer heat. The ventilation opening of the side elevation can be an inner wall of a heat conduction shell formed by a heat conduction plate or a super heat conduction pipe or a super heat conduction plate or VC 211, wherein the air passage among the fins of the heat dissipation plate 212 penetrates through the outside and the cavity inside, and the heat dissipation plate 212 is fixed outside the ventilation opening through the heat conduction plate or a fixing piece; or at the side elevation vent, the fin and the heat pipe or the super heat pipe or the VC 211 are disconnected to form a channel for communicating the fan cavity with the outside. In this embodiment, the top layer of cooling fin is used as the upper shell of the fan, so that the upper shell, the bottom shell of the fan and the impeller set form an air channel, the upper shell of the fan can be omitted, and the top opening forms a ventilation opening.

The two-stage semiconductor refrigeration unit 10 includes a middle electric couple layer and hot (radiating) and cold surfaces at both ends. The hot surface of the secondary semiconductor refrigerating piece is connected with the heat pipe or the super heat conducting plate or the VC211 in a rapid heat conduction way. The heat dissipation surface of the secondary semiconductor refrigeration piece 10 is in contact with the heat pipe or the super heat conduction plate or the VC211 for heat transfer or in contact with the heat conduction plate for heat transfer, or the outer wall of the heat pipe or the super heat conduction plate or the VC211 is directly used as the hot surface of the secondary semiconductor refrigeration piece, a hot end circuit is arranged on the hot end circuit, and the hot end circuit is welded with the electric coupling layer and electrically connected with the electric coupling layer to form the internal circuit of the secondary semiconductor refrigeration piece. In this embodiment, the heat surface of the secondary semiconductor refrigeration unit 10 is attached to the outer wall of the heat pipe or super heat conducting plate or VC 211.

Impeller 220, drive control circuit board 240 and drive module 250 are installed on fan drain pan 214, and drive module 250 adopts the motor, and the output shaft of motor links with the center pin 221 of impeller between the axle, and the motor just reverses and drives the impeller rotation.

Referring to fig. 41-42, as an alternative, the secondary semiconductor refrigeration unit 10 is disposed on an outer wall of the fan bottom case 214, for example, the secondary semiconductor refrigeration unit 10 is attached to the bottom case 214 and disposed in contact. The fan bottom case 214 is a heat conducting member, and may be made of a heat conducting material, such as a metal plate or a heat pipe or VC or a superconductive plate, and the fan bottom case 214 is connected to the heat pipe or super heat pipe or VC211 on the side surface in a rapid heat transfer manner.

Referring to fig. 33 to 47, a cooling fan module 200 according to a second embodiment of the present utility model is an axial flow fan module, and includes a fan housing 210 having a cavity formed therein, an impeller 220 mounted in the cavity, and a secondary semiconductor refrigerator 10 mounted on the fan housing. The fan housing 210 includes a side-elevation volute that is integrally formed of heat pipes or super heat pipes or VC 211. The side elevation of the fan shell, namely the volute, is provided with a heat pipe or a super heat conducting plate or VC 211; more preferably, the volute side elevation forms a heat conducting shell by a single-channel or multi-channel aluminum superconducting pipe or an aluminum superconducting plate. The cooling fins 212 are arranged on the inner walls of the side elevation, the fins of the cooling fins 212 are annularly arranged along the diameter direction, and the air channels among the fins are communicated along the axial direction. In the cavity, a circle of fins are arranged above the impeller 220 to form a top cooling fin 212, a circle of fins are arranged below the impeller 220 to form a bottom cooling fin 212, air channels of the upper cooling fin and the lower cooling fin are preferably aligned, and ventilation openings at the top and the bottom of the fan are respectively formed and used for air inlet and air outlet, air sucked by the impeller 220 from the air channel (air inlet ventilation opening) of the top cooling fin is rotated to be discharged along the air channel (air outlet ventilation opening) of the bottom cooling fin 212 downwards along the axial direction, and the air inlet direction and the air outlet direction can be exchanged.

The radiator fan module 200 of the second embodiment is the same as the first embodiment, and the side elevation housing, i.e. the volute, is formed by integrally forming a single piece by a heat pipe or a super heat pipe or a VC211 or by splicing a plurality of pieces to form a heat conducting housing, and the heat dissipation fins of the inner wall can be connected in a rapid heat transfer manner by welding or riveting or bonding or other fixing modes. Preferably, the vertical surface volute forms a heat conduction shell by a single-channel or multi-channel aluminum superconducting pipe or an aluminum superconducting plate, and more than two fine bone-shaped micro grooves 2111 are formed on the inner wall of the single-channel or multi-channel 2110 of the aluminum superconducting pipe or the aluminum superconducting plate; a plurality of micro-holes are formed in the material within the walls of micro-grooves 2111. The channel 2110 and the grooves of the porous micro grooves 2111 are arranged in the axial direction of the rotation center of the impeller, and the direction of the air flow generated by the rotation of the impeller is consistent.

The secondary semiconductor refrigeration member 10 is disposed on an outer wall of the side-elevation heat-conducting shell, and a heat radiating surface (hot surface) thereof is connected with a heat pipe or a super heat-conducting plate or a VC211 of the side elevation in a rapid heat conduction manner, or the heat pipe or the super heat-conducting plate or the VC211 is directly used as the heat radiating surface (hot surface) of the secondary semiconductor refrigeration member 10, and a hot end circuit is disposed on the outer wall thereof and is electrically connected with and welded to the semiconductor electric coupling layer.

The impeller 220 is rotatably mounted by a fixing bracket 223 and a clamping ring 222 which are arranged in the cavity, a central shaft of the impeller is arranged on the fixing bracket 223, the central shaft is inserted into a central shaft hole of the impeller 220, and the top is clamped and fixed by the clamping ring 222.

The drive control circuit board 240 and the drive module 250 are arranged outside the bottom of the volute, in this embodiment, the drive module 250 adopts a motor, an output shaft of the motor is connected with a central shaft 221 of the impeller in a shaft way, and the motor drives the impeller to rotate in a forward and reverse rotation way.

The heat radiation fan module 200 of the utility model uses a heat pipe/VC/(aluminum) super heat conduction pipe/(aluminum) super heat conduction plate and the like as a shell (which can be a side elevation, an upper cover, a bottom cover and a volute) of the fan, and uses the phase change heat conduction characteristic to quickly transfer a heat source into a cavity of the fan, and radiates heat through air flow generated when a fan impeller rotates. The utility model effectively utilizes the internal space of the fan to ensure that the product volume is smaller and the heat dissipation efficiency is higher; the novel fan is more effectively combined with application products, and the original shell material cost of the fan is reduced. The contact area between the radiating fin and the air flow is enlarged. The utility model improves the heat radiation efficiency under the condition of the same heat radiation requirement, thereby reducing the speed, current, noise and the like of the fan.

Another technical feature of the cooling fan module 200 of the present utility model is that when the application product is used for semiconductor refrigeration, the cooling surface of the refrigeration piece can be directly attached to (contact) the housing of the fan (i.e. the heat conducting piece: heat pipe/VC/(aluminum) super heat conducting pipe/(aluminum) super heat conducting plate); the distance of heat transfer is effectively shortened, and the heat transfer is quickened. The effect of the application product is better.

Referring to fig. 48-54, a radiator fan module 200 according to a third embodiment of the present utility model, which can be used as a waterproof fan, preferably a magnetic fan module, includes a fan housing 210 having a cavity formed therein, an impeller 220 mounted in the cavity, and a secondary semiconductor refrigeration member 10 mounted on the fan housing. The fan housing 210 includes a side-elevation volute, and an upper housing 215 at the top of the volute and a bottom housing 214 at the bottom, and collectively enclose a cavity that forms the interior of the fan. The arc-shaped part of the volute is formed by a heat pipe or a super heat-conducting plate or VC 211; more preferably, the side elevation of the volute, i.e. the volute, comprises an arc-shaped heat conducting housing formed by a single-channel or multi-channel aluminium superconducting pipe or plate. The cooling fins 212 are arranged on the inner wall of the side elevation arc-shaped heat conducting shell, fins of the cooling fins 212 are distributed in an arc shape along the diameter direction, and air channels among the fins are communicated in the radial arc direction. In this embodiment, the fan vent 201 is disposed on the side elevation scroll for intake and exhaust. The upper and lower cases are not provided with ventilation openings to facilitate waterproofing.

The third embodiment cooling fan module 200 is similar to the first and second embodiments, the arc-shaped heat conducting housing of the side elevation volute is formed by a heat pipe or super heat conducting plate or VC 211, the heat conducting housing is formed by integral single-piece or multi-piece splicing, and the cooling fins of the inner wall can be connected in a rapid heat transfer manner by welding or riveting or bonding or other fixing modes. Preferably, the vertical surface volute forms an arc heat conduction shell by a single-channel or multi-channel aluminum superconducting pipe or an aluminum superconducting plate, and more than two fine bone-shaped micro grooves 2111 are formed on the inner wall of the single-channel or multi-channel 2110 of the aluminum superconducting pipe or the aluminum superconducting plate; a plurality of micro-holes are formed in the material within the walls of micro-grooves 2111. The channel 2110 and the grooves of the porous micro grooves 2111 are arranged along the radial arc direction of the rotation center of the impeller, and are consistent with the direction of the air flow generated by the rotation of the impeller.

The secondary semiconductor refrigeration member 10 is disposed on an outer wall of the side-elevation heat-conducting shell, and a heat radiating surface (hot surface) thereof is connected with a heat pipe or a super heat-conducting plate or a VC 211 of the side elevation in a rapid heat conduction manner, or the heat pipe or the super heat-conducting plate or the VC 211 is directly used as the heat radiating surface (hot surface) of the secondary semiconductor refrigeration member 10, and a hot end circuit is disposed on the outer wall thereof and is electrically connected with and welded to the semiconductor electric coupling layer. Alternatively, the two-stage semiconductor refrigeration unit 10 is disposed on the upper shell 215 or the bottom shell 214, and the upper shell 215 or the bottom shell 214 is connected with the arc-shaped heat conducting shell in a rapid heat transfer manner. The hot surface of the second-stage semiconductor refrigerating piece is arranged on the fan shell in a fitting contact manner.

The impeller 220 is located in the cavity and is mounted on the bottom shell 214, a shaft hole is arranged in the center of the impeller 220, a shaft sleeve 229 is fixedly arranged in the shaft hole, a convex ring is formed on the inner wall of the shaft sleeve 229, an upper bearing 228 and a lower bearing 226 are mounted in the shaft sleeve 229 and are respectively located above and below the convex ring, a magnetic ring is sleeved in the impeller 220, and specifically, an annular cavity is formed in the impeller and outside the shaft sleeve 229, and the inner wall of an outer ring of the annular cavity in the impeller is sleeved with the magnetic ring to be fixed with the impeller 220.

The bottom shell 214 is provided with a central shaft 221 of the impeller, a hollow annular boss is formed on the bottom shell, the central shaft is installed at the center of the boss, the bottom of the central shaft 221 is elastically clamped by a spring 227, the central shaft 221 is inserted into a shaft sleeve in a central shaft hole of the impeller 220 and is matched with a bearing and a convex ring, a clamping groove is formed at the top of the central shaft 221, and the clamping groove is clamped by a clamping ring 222 to prevent falling. The top of the hollow annular boss on the bottom shell 214 is fittingly inserted into the annular cavity inside the impeller 220, and the drive module 250 is mounted on the bottom shell 214 forming a hollow cavity defined by the hollow annular boss, and the drive control circuit board 240 is located outside the bottom shell 214. In this embodiment, the driving control circuit board 240 and the driving module 250 are disposed outside the bottom of the volute, the driving module 250 includes a motor stator coil 251, and the driving module generates a magnetic field after being electrified, so as to drive the fan impeller 220 to rotate, and the driving module 250 and the driving control circuit board 240 and the fan impeller 220 are respectively disposed on the inner and outer sides of the bottom shell 214 of the fan, so that the driving module 250 and the driving control circuit board 240 are not affected when water is sucked or entered into the fan. In this embodiment, the driving module 250 and the driving control circuit board 240 are separated from the fan set, and the driving control circuit board 240 is disposed outside the fan housing 210, so that water can be prevented, and the driving control circuit board 240 is not affected by water when wind passes through the wind channel. When the waterproof fan is applied to a product, the sealing ring can be arranged at the ventilation opening of the embodiment, so that the waterproof between the product and the fan module 200 can be realized.

In the above embodiments, "cold-conducting" and "heat-conducting", "heat transfer" or "heat transfer" are to be construed as having the same meaning, and are used interchangeably. The symbol "/" means "or".

It will be appreciated that in the foregoing embodiments, terms of orientations such as "upper", "lower", "top", "bottom", "left", "right", "vertical", "horizontal", "lateral", "front", "rear", etc., are used in relation to the relative positions of the components shown in the drawings and are not intended to be limiting as to absolute geographic orientations.

The technical features of the above embodiments may be combined, transformed or replaced to obtain different embodiments, which all fall within the scope of the disclosure of the embodiments of the present utility model. Some common structures or similar structures in the above embodiments are described in some embodiments, but not in other embodiments, and are equally applicable to these embodiments, which fall within the scope of the disclosure of the embodiments of the present utility model.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be a mechanical connection, or may be an electrical connection or a data transmissible connection; can be directly connected or indirectly connected through an intermediate medium, and can be communication between the two components or interaction relationship between the two components. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made hereto without departing from the spirit and scope of the utility model as defined by the appended claims; the scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a two-stage refrigeration module, includes one-level semiconductor refrigeration spare, its characterized in that: the refrigerating module further comprises a secondary semiconductor refrigerating piece and a cold guide piece; the first-stage semiconductor refrigerating piece and the second-stage semiconductor refrigerating piece both comprise a middle electric coupling layer, and a hot surface and a cold surface at two ends; the cold guide piece is connected between the primary semiconductor refrigerating piece and the secondary semiconductor refrigerating piece in a rapid cold guide mode; the cold guide is a heat transfer structure.

2. The two-stage refrigeration module of claim 1, wherein: the two ends of the cold guide piece are respectively connected with the hot surface of the primary semiconductor refrigeration piece and the cold surface of the secondary semiconductor refrigeration piece in a rapid heat transfer mode; the heat transfer structural member is one or a combination of a plurality of heat conduction elements, heat pipes, temperature equalization plates, super heat conduction pipes and super heat conduction plates which are made of heat conduction materials.

3. The two-stage refrigeration module as recited in claim 2 wherein:

the super heat conduction pipe is an aluminum superconducting pipe, and the super heat conduction plate is an aluminum superconducting plate;

the two ends of the aluminum superconducting plate or the aluminum superconducting tube are sealed, and working liquid is encapsulated in the aluminum superconducting plate or the aluminum superconducting tube;

forming more than two micro grooves on the inner wall of the aluminum superconducting plate or the aluminum superconducting pipe during aluminum material molding;

and forming a microporous structure in the aluminum superconducting plate or the aluminum superconducting pipe material when the aluminum material is formed.

4. A two-stage refrigeration module according to any one of claims 1 to 3 wherein:

the refrigerating module comprises a heat conducting structure and radiating fins; the heat conduction structure is one or a combination of a plurality of heat conduction elements, heat pipes, temperature equalization plates, super heat conduction pipes and super heat conduction plates which are made of heat conduction materials;

the heat conducting structure is connected with the radiating fins in a rapid heat transfer way;

the heat conduction structure is connected with the hot surface of the secondary semiconductor refrigeration piece in a rapid heat transfer manner; or, the heat-conducting structure is directly used as the hot surface of the secondary semiconductor refrigerating piece by arranging a hot end circuit of the secondary semiconductor refrigerating piece on the heat-conducting structure and welding and electrically connecting the hot end circuit with an electric couple layer of the secondary semiconductor refrigerating piece;

The refrigerating module further comprises a fan; the fan comprises a housing and an impeller in the housing;

the thermally conductive structure and/or the heat sink are disposed at a vent of the fan or as part of a housing of the fan.

5. The two-stage refrigeration module as recited in claim 4 wherein:

the heat conduction structure comprises a plurality of aluminum superconducting plates or aluminum superconducting pipes, wherein the aluminum superconducting plates or the aluminum superconducting pipes are single pipes, and a single channel is formed inside the aluminum superconducting plates or the aluminum superconducting pipes;

the aluminum superconducting plate or the aluminum superconducting pipe is bent in a plane or in a special-shaped 3D mode and is matched with the installation space;

the heat conduction structure further comprises a heat conduction plate, the aluminum superconducting plates or the aluminum superconducting pipes are combined with the heat conduction plate, and the aluminum superconducting plates or the aluminum superconducting pipes are arranged in at least two different directions or angles to reduce the defect that the heat conduction effect is poor due to the effect of the antigravity direction;

the heat sink comprises one or more groups of fins of thermally conductive material; the heat conducting plate is arranged in the groove on the radiating fin or arranged at the top of the radiating fin, or the radiating fin and the heat conducting plate are arranged on another heat conducting piece.

6. The two-stage refrigeration module as recited in claim 5 wherein:

the heat conducting plate is provided with a plurality of grooves, the aluminum superconducting plates or the aluminum superconducting pipes are matched with the grooves and correspondingly arranged in the grooves, and the wall surfaces are contacted with each other to realize rapid heat transfer;

Welding or riveting the aluminum superconducting plate or the aluminum superconducting pipe with the slot so as to increase the contact area;

the secondary semiconductor refrigerating piece is arranged on the heat conducting plate: the heat of the heat surface of the secondary semiconductor refrigerating piece is directly conducted to the heat conducting plate by being attached to the outer wall of the heat conducting plate; or the hot surface of the secondary semiconductor refrigerating piece is arranged on the outer wall of the heat conducting plate through the heat conducting piece, and the heat of the hot surface is quickly conducted to the heat conducting plate through the heat conducting piece; or the heat conducting plate is used as a hot surface, and a hot end circuit of the secondary semiconductor refrigerating piece is arranged on the heat conducting plate and is welded and electrically connected with PN galvanic couple particles of the galvanic couple layer;

the aluminum superconducting plates or the aluminum superconducting pipes are designed in a ring shape or staggered or circulating mode by using two different directions or angles or intersecting lines with a certain angle on an XY plane.

7. A two-stage refrigeration module according to any one of claims 1 to 3 wherein:

the secondary semiconductor refrigerating piece is subjected to heat dissipation by the heat dissipation fan module;

the cooling fan module comprises a fan shell and an impeller, wherein the interior of the fan shell is a cavity, and the impeller is arranged in the cavity; the fan shell is provided with a plurality of ventilation openings which are used for communicating the cavity with an external air path of the fan;

At least part of the fan housing is formed by a thermally conductive housing selected from: one or more of the heat conducting elements, the heat pipes, the temperature equalizing plates, the super heat conducting pipes and the super heat conducting plates which are made of heat conducting materials are formed by splicing in a whole single piece or in a plurality of pieces;

the hot surface of the secondary semiconductor refrigeration piece is connected with the heat conduction shell in a heat transfer way; or the heat-conducting shell is provided with a hot end circuit of the secondary semiconductor refrigerating piece and an electric coupling layer of the secondary semiconductor refrigerating piece to be welded and electrically connected, so that the heat-conducting shell is directly used as a hot surface of the secondary semiconductor refrigerating piece.

8. The two-stage refrigeration module as recited in claim 7 wherein: the super heat conduction pipe is an aluminum superconducting pipe, and the super heat conduction plate is an aluminum superconducting plate; the radiating fan module comprises radiating fins which are connected with the heat conduction shell in a rapid heat transfer way; the air channel of the radiating fin is communicated with the ventilation opening and the cavity of the fan; a side elevation housing of the fan housing includes the thermally conductive enclosure.

9. The two-stage refrigeration module as recited in claim 8 wherein:

the side elevation shell of the fan shell comprises the heat conduction shell which is composed of a single-channel or multi-channel aluminum superconducting pipe or aluminum superconducting plate;

The radiating fins are arranged on the inner wall of the side elevation shell of the fan shell; the air channel direction of the radiating fin is the rotation direction or the axial direction of the impeller.

10. A photon beauty instrument comprises a machine body provided with a plurality of ventilation openings, wherein a light source component, a power supply component and a control circuit board are arranged in the machine body; the light source component and the power supply component are electrically connected with the control circuit board; the ventilation openings of the machine body are used for air inlet and air outlet and form ventilation channels with the space in the machine body; the front end of the machine body is a working surface; the method is characterized in that: the two-stage refrigeration module according to any one of claims 1 to 9 is further arranged in the machine body, and the one-stage semiconductor refrigeration sheet is directly used as the working surface or used for refrigerating the working surface.

11. The photon beauty treatment instrument according to claim 10, wherein:

when the primary semiconductor refrigerating sheet is directly used as a working surface: the primary semiconductor refrigerating piece takes a transparent crystal as a cold surface, the cold surface is directly taken as a working surface, and a heat surface and an electric coupling layer of the primary semiconductor refrigerating piece are provided with light-transmitting windows, so that the primary refrigerating piece has light transmittance; or the cold surface, the hot surface and the electric coupling layer of the primary semiconductor refrigeration sheet jointly define a light transmission window, and photons generated by the light source assembly are transmitted to the outside of the working surface from the light transmission window;

When the primary semiconductor refrigerating sheet refrigerates the working surface: the cold surface of the primary semiconductor refrigerating sheet is in contact with the working surface for heat transfer; alternatively, the cold face of the primary refrigeration member is connected with the working face in a rapid heat transfer manner by a heat transfer structural member.

12. The photon beauty treatment instrument according to claim 10, wherein:

the two-stage refrigeration module comprises a fan and is positioned in a ventilation channel in the machine body;

the light source assembly comprises a lamp tube and a reflecting cup, the ventilating duct in the reflecting cup is communicated with the ventilating duct of the fan and is communicated with the ventilating duct in the machine body, so that a radiating ventilating duct of the light source assembly is formed, and the fan is used for promoting the radiation of the light source assembly;

a radiating fin or a heat conducting piece is arranged on one side of the reflecting cup; a plurality of ventilation openings are formed on the shell of the fan; one ventilation opening is provided with a radiating fin or a heat conducting piece of the reflecting cup, and a ventilation channel of the fan is communicated with a ventilation channel in the machine body to form a first ventilation channel for radiating heat of the reflecting cup; the other ventilation opening of the fan is communicated with the air channel in the reflecting cup, and the ventilation channel of the fan is communicated with the ventilation channel in the machine body to form a second ventilation channel for radiating heat for the reflecting cup and the lamp tube;

The photon beauty treatment is a depilatory instrument, a photon skin tendering instrument, a leading-in and leading-out beauty treatment instrument or a radio frequency beauty treatment instrument.