CN115854584A - Two-stage refrigeration module and photon beauty instrument - Google Patents

Abstract

The invention relates to a two-stage refrigeration module and a photon beauty instrument, wherein the two-stage refrigeration module comprises a first-stage semiconductor refrigeration piece, a second-stage semiconductor piece and a cold conduction piece; the primary and secondary semiconductor refrigerating elements comprise a middle galvanic couple layer, and hot surfaces and cold surfaces at two ends; the cold guide piece is connected between the primary semiconductor refrigerating piece and the secondary semiconductor refrigerating piece in a quick cold guide mode; the cold conducting piece is a heat transfer structural piece. The photon beauty instrument adopts the two-stage refrigeration module, and the one-stage semiconductor refrigeration piece is directly used as the front working face of the photon beauty instrument or used for refrigerating the front working face of the photon beauty instrument. By adopting the secondary refrigeration module, the problems that the cooling effect of the fan is influenced and the like due to the uneven heat conduction efficiency, slow heat conduction, poor heat conduction timeliness, reduction of the refrigeration speed, imbalance of the heat at the front end, the rear end, the left end, the right end or the upper end and the lower end of the radiating fin when the heat is conducted to the radiating fin of the primary semiconductor refrigeration piece through the heat transfer structural piece can be solved.

Description

A two-stage refrigeration module and photon beauty instrument

technical field

The invention relates to the field of beauty equipment, in particular to a two-stage refrigeration module and a photon beauty instrument.

Background technique

A beauty instrument that uses pulsed light or laser or halogen lamp or other light sources or radio frequency to achieve beauty functions. The light source component generates light waves, which are emitted from the light outlet window of the working head of the beauty instrument to make contact with the end surface of the working head (or indirect contact) Cosmetic treatment of the skin surface, such as hair removal, skin rejuvenation, speckle removal, anti-inflammatory, anti-vascular, anti-wrinkle, skin redness, acne treatment, treatment of vascular lesions, treatment of pigmented lesions or alone or in combination with radiofrequency physiotherapy and other functions. At present, some portable or handheld beauty instruments on the market have poor heat dissipation inside the fuselage, which affects the work of the beauty instrument and fails to achieve the expected beauty effect; the internal structure of the body is complex, the cooling effect of the working surface is not good, or the work The surface temperature is too high, causing skin burns, and the user experience is not good.

Contents of the invention

The technical problem to be solved by the present invention is to provide a two-stage refrigeration module and a photon beauty instrument to solve the heat dissipation and cooling problems of the working surface of the existing beauty instrument.

In order to solve the problems of the technologies described above, the present invention adopts the following technical solutions:

A two-stage refrigerating module, including a first-stage semi-conductor cooling element, a second-level semi-conductive cooling element, and a cooling guide; both the first-level and second-level semiconductor cooling elements include a galvanic couple layer in the middle and hot and cold surfaces at both ends ; The cold conducting part is connected between the first-stage semiconductive cooling part and the second semiconducting cooling part in a rapid cooling manner; the cold conducting part is a heat transfer structure.

Further, the two ends of the cold conduction element are respectively connected to the hot surface of the first-stage semiconductor refrigeration element and the cold surface of the second-stage semiconductor refrigeration element in a manner of rapid heat transfer; the heat transfer structure is selected from the heat conduction One or a combination of heat-conducting elements, heat pipes, vapor chambers, super heat-conducting pipes, and super heat-conducting plates made of materials.

In some embodiments, the super heat conducting tube is an aluminum superconducting pipe, and the super heat conducting plate is an aluminum superconducting plate;

The two ends of the aluminum superconducting plate or the aluminum superconducting tube are sealed, and the working liquid is encapsulated inside; when the aluminum superconducting plate or the aluminum superconducting tube is formed on the inner wall of the aluminum superconducting plate or the aluminum superconducting tube, more than two microgrooves are formed; At this time, a microporous structure is formed in the aluminum superconducting plate or the aluminum superconducting pipe material.

In some embodiments, the refrigeration module includes a heat conduction structure and a heat sink; the heat conduction structure is selected from one or more of heat conduction elements made of heat conduction materials, heat pipes, vapor chambers, super heat pipes, and super heat conduction plates. Combination of several types; fast heat transfer connection between the heat conduction structure and the heat sink; rapid heat transfer connection between the heat conduction structure and the thermal surface of the secondary semi-conductor cooling element, or, by connecting the heat conduction structure The hot end circuit of the secondary semiconductor cooling element is welded and electrically connected to the galvanic layer of the secondary semiconductor cooling element, so that the heat conduction structure directly serves as the hot surface of the secondary semiconductor cooling element, so that the heat of the secondary semiconductor cooling element The cooling module also includes a fan; the fan includes a casing and an impeller inside the casing; the heat conduction structure and/or cooling fins are arranged at the vent of the fan or as a part of the fan casing.

In some embodiments, the heat conduction structure includes several aluminum superconducting plates or aluminum superconducting pipes, and the aluminum superconducting plates or aluminum superconducting pipes are single tubes with a single channel formed inside; the aluminum superconducting plates or aluminum superconducting pipes Conduit plane bending or special-shaped 3D bending, suitable for the installation space; the heat conduction structure also includes a heat conduction plate, the plurality of aluminum superconducting plates or aluminum superconducting conduits are combined with the heat conducting plate, and several aluminum superconducting plates or The layout of the aluminum superconductor includes at least two different directions or angles to reduce the defect that the effect of the anti-gravity direction causes the heat conduction effect to deteriorate; the heat sink includes one or more sets of heat-conducting material fins; the heat-conducting plate is arranged on the The groove on the heat sink or the top of the heat sink, or the heat sink and the heat conduction plate are disposed on another heat conduction member.

In some embodiments, the heat conduction plate is provided with several slots, and the several aluminum superconducting plates or aluminum superconducting pipes are adapted to the several slots and correspondingly installed in the slots. The aluminum superconducting plate or the aluminum superconducting pipe is welded or riveted with the slot to increase the contact area; the secondary semiconductive refrigeration unit is arranged on the heat conduction plate: the secondary semiconductive refrigeration unit The hot surface is installed on the outer wall of the heat conduction plate, so that the heat on the hot surface is directly transferred to the heat conduction plate; or, the heat surface of the secondary semiconductor refrigeration unit is installed on the outer wall of the heat conduction plate through the heat conduction element, and the heat on the heat surface is transferred to the heat conduction plate through the heat conduction element. The heat is quickly conducted to the heat conduction plate; or, the heat conduction plate is used as a hot surface, on which the hot end circuit of the secondary semiconductor refrigeration element is arranged, and is welded and electrically connected with the PN galvanic couple particles of the galvanic couple layer; Several aluminum superconducting plates or aluminum superconducting tubes use two different directions or angles on the XY plane, or in the form of intersecting lines with a certain angle, or in a circular, staggered or circular design.

In some embodiments, the secondary semiconductor cooling element is dissipated by a heat dissipation fan module; the heat dissipation fan module includes a fan housing and an impeller, the interior of the fan housing is a cavity, and the impeller is installed in the cavity; The fan housing is provided with a number of vents, which communicate the cavity with the external air path of the fan; at least part of the fan housing is composed of a heat-conducting shell, and the heat-conducting shell is made of heat-conducting materials selected from: A combination of one or more of elements, heat pipes, vapor chambers, super heat pipes, and super heat conduction plates is formed as a whole in a single piece or in a multi-piece splicing; The shells are connected by heat conduction, or the heat conduction shell directly serves as the heat surface of the secondary semi-conductor cooling element.

In some embodiments, the super heat pipe is an aluminum superconducting pipe, the super heat conducting plate is an aluminum superconducting plate; Thermally connected; the air channel of the heat sink communicates with the vent and the cavity of the fan; the side elevation of the fan housing includes the heat conduction shell.

In some embodiments, the side elevation casing of the fan casing includes the heat conduction casing made of single-channel or multi-channel aluminum superconductors or aluminum superconducting plates; the side elevation casing inner wall of the fan casing is provided with The cooling fins; the air duct direction of the cooling fins is the rotation direction or the axial direction of the impeller.

The present invention also relates to a photon beauty instrument, which includes a fuselage provided with several vents, a light source assembly, a power supply assembly and a control circuit board are arranged inside the fuselage; the light source assembly, the power supply assembly and the control circuit board are electrically connected; the fuselage Several vents are used for air inlet and outlet and form a ventilation channel with the space in the fuselage; the front end of the fuselage is the working surface; the fuselage is also provided with a two-stage refrigeration module as described in any one of the above embodiments, The primary semi-conductor cooling sheet directly serves as the working surface or cools the working surface.

Further, when the first-stage semiconductor refrigerating sheet is directly used as the working surface: the first-stage semiconductor refrigerating sheet uses transparent crystals as the cold surface, and the cold surface is directly used as the working surface, and the hot surface and the galvanic layer of the first-stage semiconductor refrigerating sheet are set There is a light-transmitting window, so that the first-stage cooling element has light-transmitting properties; or, the cold surface, the hot surface and the galvanic layer of the first-stage semiconductor refrigeration sheet jointly define a light-transmitting window, and the photons generated by the light source assembly pass through the light-transmitting window. The window is transferred out of the working surface. When the first-stage semiconductor cooling piece cools the working surface: the cold surface of the first-level semiconductor cooling piece is in contact with the working surface to transfer heat; or, the cold surface of the first-level cooling element and the working surface It is connected by means of rapid heat transfer through a heat transfer structure.

In some embodiments, the two-stage refrigeration module includes a fan, which is located in the air passage in the fuselage; the light source assembly includes a lamp tube and a reflector, and the air passage inside the reflector communicates with the air passage of the fan, and is connected to the air passage of the machine. The ventilation channel in the body is connected to form a heat dissipation ventilation channel for the light source component, and the fan promotes the heat dissipation of the light source component; one side of the reflector cup is provided with a heat sink or a heat conducting member; a plurality of vents are formed on the fan housing; One of the air vents is equipped with a heat sink or a heat conducting member of the reflector, and the air duct of the fan is communicated with the air duct in the fuselage to form the first air duct, which is used to dissipate heat to the reflector; the other air vent of the fan It communicates with the air duct inside the reflector, and connects the air duct of the fan with the air duct in the fuselage to form a second air duct for cooling the reflector and the lamp tube.

In some embodiments, the photonic beauty treatment is a hair removal instrument, a photonic skin rejuvenation instrument, an import-export beauty instrument or a radio frequency beauty instrument.

The beneficial effects of the present invention are: the two-stage refrigeration module of the present invention realizes the effects of rapid cooling and heat dissipation.

The present invention will be described in further detail below in conjunction with the accompanying drawings.

Description of drawings

Fig. 1 is a perspective view of a beauty instrument according to a first embodiment of the present invention.

Fig. 2 is a perspective view of the beauty instrument according to the first embodiment of the present invention with the upper case removed.

Fig. 3 is a schematic diagram of the internal structure of the beauty instrument according to the first embodiment of the present invention.

Fig. 4 is a schematic diagram of the air duct of the beauty instrument according to the first embodiment of the present invention.

Fig. 5 is a schematic diagram of other embodiments of the air vent of the beauty instrument of the present invention.

Fig. 6 is a schematic view of the air passage inside the beauty instrument in the embodiment shown in Fig. 5 .

Fig. 7 is an exploded view of the beauty instrument of the embodiment shown in Fig. 1 .

Fig. 8 is a schematic structural view of the first embodiment of the refrigeration module of the present invention.

Fig. 9 is a perspective view of the first embodiment of the refrigeration module of the present invention.

Fig. 10 is a partially exploded view of the refrigeration module of the present invention.

Fig. 11 is a perspective view of the refrigeration module of the present invention.

Fig. 12 is a partially exploded view of the refrigeration module of the present invention.

Fig. 13 is a partial structural schematic diagram of the refrigeration module of the present invention.

Fig. 14 is a schematic view of the transformed structure of the first embodiment of the refrigeration module of the present invention, wherein Fig. 14(a) and Fig. 14(b) are different perspectives.

Fig. 15 is a schematic structural diagram of an alternative embodiment of the refrigeration module of the present invention, wherein Fig. 15(a) and Fig. 15(b) are different embodiments.

Fig. 16 is a perspective view of the beauty instrument according to the second embodiment of the present invention.

Fig. 17 is a perspective view of the beauty instrument according to the second embodiment of the present invention with the upper case removed.

Fig. 18 is a schematic diagram of the internal structure of the beauty instrument according to the second embodiment of the present invention.

Fig. 19 is an exploded view of the beauty instrument according to the second embodiment of the present invention.

20-22 are several structural schematic diagrams of the second embodiment of the refrigeration module of the present invention.

Fig. 23 is a schematic structural view of an aluminum superconducting plate or an aluminum superconducting conduit of a refrigeration module according to an embodiment of the present invention, wherein Fig. 23(a) is a perspective view of a single aluminum superconducting plate or an aluminum superconducting conduit, and Fig. 23(b) is 23(a) Sectional view along A-A.

24-26 are several structural schematic diagrams of the third embodiment of the refrigeration module of the present invention.

Fig. 27 is a perspective view of the beauty instrument according to the third embodiment of the present invention with the front shell removed.

Fig. 28 is a perspective view of the beauty instrument according to the fourth embodiment of the present invention with the front shell removed.

Fig. 29 is an exploded view of the fourth embodiment of the refrigeration module of the present invention.

Fig. 30 is a perspective view of a fourth embodiment of the refrigeration module of the present invention.

Fig. 31 is a schematic diagram of the internal structure of the beauty instrument according to the fifth embodiment of the present invention.

Fig. 32 is an exploded view of the beauty instrument according to the fifth embodiment of the present invention.

FIG. 33 is a perspective view of a cooling fan module according to an embodiment of the present invention.

FIG. 34 is a perspective view of another viewing angle of the cooling fan module according to the embodiment of the present invention.

Fig. 35 is an exploded view of the cooling fan module according to the embodiment of the present invention.

FIG. 36 is a schematic cross-sectional view of a cooling fan module according to an embodiment of the present invention.

Fig. 37 is a schematic structural view of the volute on the side elevation of the cooling fan module according to the embodiment of the present invention.

FIG. 38 is a schematic diagram of an alternative structure to the embodiment shown in FIG. 37 .

39-40 are schematic diagrams of another alternative structure to the embodiment shown in FIG. 37 . .

41-42 are structural schematic diagrams of alternative embodiments of the cooling fan module shown in FIGS. 33-34.

Fig. 43 is a perspective view of a cooling fan module according to an alternative embodiment of the present invention.

FIG. 44 is a schematic structural view of an alternative embodiment of FIG. 33 .

Fig. 45 is a schematic cross-sectional view of a cooling fan module according to an alternative embodiment of the present invention.

FIG. 46 is a perspective view of the heat dissipation fan module shown in FIG. 45 without the outer wall of the housing.

FIG. 47 is an exploded view of the cooling fan module shown in FIG. 45 .

48-49 are perspective views from different angles of view of the heat dissipation fan module of another alternative embodiment of the present invention.

50-51 are schematic cross-sectional views of different positions of the cooling fan module shown in FIGS. 48-49.

Fig. 52 is a partially exploded view of the cooling fan module shown in Figs. 48-49.

Figure 53 is an exploded view of the cooling fan module shown in Figures 48-49.

Fig. 54 is an exploded view of the cooling fan module shown in Figs. 48-49.

Detailed ways

It should be noted that, in the case of no conflict, the various embodiments and the features in the embodiments of the present invention can be combined with each other. The present invention will be further described in detail below in conjunction with the drawings and specific embodiments.

1-54, the present invention provides a refrigeration module 1, a heat dissipation fan module 200, and a photon beauty instrument 100 using the refrigeration module/radiation fan module 200. The refrigeration module 1 includes a semiconductor cooling element 10/10', and the semiconductor cooling element 10/10' includes a galvanic couple layer 12 in the middle and a hot surface 11' and a cold surface 13 at both ends; the refrigeration module 1 also includes a cooling guide 15, One end of the cooling guide 15 is connected to the cold surface 13 of the semi-conductor refrigeration unit in a manner of rapid heat transfer, and the other end is used to connect with the surface to be refrigerated in a manner of rapid conduction of cooling; the cooling guide 15 is a heat transfer structure parts or heat pipes or VC vapor chambers or super heat pipes or super heat conduction plates. Preferably, the super heat conducting tube is an aluminum superconducting pipe, and the super heat conducting plate is an aluminum superconducting plate. In some embodiments, the cooling guide 15 is a first cooling guide, and the refrigeration module 1 further includes a second cooling guide 15'; the second cooling guide 15' is arranged on the first cooling guide 15 and the surface to be refrigerated The second cooling member 15' is a heat-conducting material tube or a heat-conducting material plate or an aluminum superconducting pipe or an aluminum superconducting plate or a heat pipe or VC.

As a preferred embodiment of the present invention, it relates to a two-stage refrigeration module 1, including a primary and secondary semiconductor cooling element 10'/10 and a cooling guide 15; the primary and secondary semiconductor cooling elements 10'/10 are both Including the galvanic layer 12 in the middle and the hot surface 11' and the cold surface 13 at both ends; the cold conduction element 15 is connected between the primary semiconductor refrigeration element 10' and the secondary semiconductor refrigeration element 10 in a rapid conduction manner; Part 15 is a heat transfer structure. The two ends of the cooling member 15 are respectively connected to the hot surface 11 ′ of the primary semiconductor cooling element 10 ′ and the cold surface 13 of the secondary semiconductor cooling element 10 in a manner of rapid heat transfer; the heat transfer structure is selected from the heat conducting One or a combination of heat-conducting elements, heat pipes, vapor chambers, super heat-conducting pipes, and super heat-conducting plates made of materials. Further, the refrigeration module 1 includes a heat conduction structure 19 and a heat sink 16; the heat conduction structure 19 is selected from one or more of heat conduction elements made of heat conduction materials, heat pipes, vapor chambers, super heat conduction pipes, and super heat conduction plates Combination; the heat conduction structure 19 and the heat sink 16 are connected in a rapid heat transfer. The heat conduction structure 19 is connected to the hot surface 11' of the secondary semiconductor cooling element 10 by rapid heat transfer; or, by setting the hot end circuit of the secondary semiconductor cooling element 10 on the heat conducting structure 19 and The galvanic couple layer 12 is welded and electrically connected, so that the heat conduction structure 19 directly serves as the thermal surface 11 ′ of the secondary semiconductor cooling element 10 . The two-stage refrigeration module 1 also includes a fan 18 or a cooling fan assembly 200; the fan 18 or the cooling fan assembly 200 includes a fan casing 180/210 and an impeller 181/220 inside the casing. The heat conducting structure 19 and/or the cooling fins 16 are disposed at the vent 182/201 of the fan or as a part of the fan casing 180/210.

Referring to FIGS. 33-53 , in another preferred embodiment of the present invention, the second-stage semiconductor cooling element 10 of the two-stage refrigeration module 1 is radiated by a cooling fan module 200 . The cooling fan module 200 includes a fan housing 210 and an impeller 220. The inside of the fan housing 210 is a cavity, and the impeller 220 is installed in the cavity; the fan housing 210 is provided with a number of vents 201, and the vents 201 connect the cavity and the The external air path of the fan is communicated; at least part of the housing of the fan housing 210 is composed of a heat-conducting shell 211, and the heat-conducting shell 211 is made of a heat-conducting element made of a heat-conducting material, a heat pipe, a vapor chamber, a super heat-conducting tube, a super heat-conducting plate A combination of one or more of them is formed as a whole single piece or as a multi-piece splicing. The thermal surface 11' of the secondary semiconductor cooling element 10 is connected to the heat conduction shell 210 in a heat transfer manner; or, the hot end circuit of the secondary semiconductor cooling element 10 and the galvanic couple of the secondary semiconductor cooling element 10 are arranged on the heat conducting shell 211 The layers 12 are welded and electrically connected, so that the heat conduction shell 211 directly serves as the thermal surface of the secondary peltier element 10 .

The preferred embodiment of the present invention relates to a photon beauty instrument 100, which includes a body with several vents 101, and a cooling module 1, a light source assembly 2, a power supply assembly 3 and a control circuit board 4 are arranged inside the body. The light source assembly 2 and the power supply assembly 3 are electrically connected to the control circuit board 4; several air vents 111 of the fuselage are used for air intake and air outlet and form a ventilation channel with the space in the fuselage (the circuit shown by the arrow in Figure 4-6 ) to achieve heat dissipation inside the fuselage. The front end of the fuselage is the working surface 113, which can directly contact with the skin, and the light generated by the light source assembly 2 is transmitted to the working surface 113 and emitted to perform cosmetic treatment on the skin. The body is also provided with a two-stage cooling module 1 as described in the above embodiment, wherein the first-stage semiconductor cooling sheet 10' directly serves as the working surface 113 or cools the working surface 113. Specifically, when the primary semiconductor refrigeration sheet 10' is directly used as the working surface 113: the primary semiconductor refrigeration sheet 10' uses transparent crystals as the cold surface 13, and the cold surface 13 is directly used as the working surface 113, and the heat of the primary semiconductor refrigeration sheet 10' The surface 11' and the galvanic layer 12 are provided with light-transmitting windows, so that the primary refrigeration element 10' has light transmission; or, the cold surface 13, the hot surface 11' and the galvanic layer 12 of the primary semiconductor refrigeration sheet 10' are in common The light-transmitting window is defined, and the photons generated by the light source component are transmitted from the light-transmitting window to the outside of the working surface 113, so that the photons act on the skin outside the working surface. When the primary semiconductor cooling sheet 10' cools the working surface 113: the cold surface 13 of the primary semiconductor cooling sheet 10' is in contact with the working surface 113 to transfer heat; or, between the cold surface 13 of the primary cooling element 10' and the working surface It is connected by means of rapid heat transfer through a heat transfer structure. The two-stage refrigeration module 1 includes a fan 18 or a heat dissipation fan assembly 200, which is located in the ventilation passage in the fuselage; the light source assembly 2 includes a lamp tube 20 and a reflector 21, and the air passage inside the reflector 21 is connected with the fan 18 or the heat dissipation fan assembly. The ventilation channel of 200 communicates with the ventilation channel in the fuselage to form the heat dissipation air channel of the light source assembly 2 , and the fan 18 or the heat dissipation fan assembly 200 promotes the heat dissipation of the light source assembly. Wherein, one side of the reflector 21 is provided with a cooling fin or a heat conducting member 22; a plurality of vents 182/201 are formed on the fan housing 180/210 of the fan 18/radiating fan assembly 200; Radiating fins or heat conduction members 22, and the air passage of fan 18/radiating fan assembly 200 is communicated with the air passage in the fuselage to form the first air passage 101, which is used to dissipate heat to reflector 21; the fan 18/radiating fan assembly 200 The other vent communicates with the air duct inside the reflector 21, and connects the air duct of the fan 18/radiating fan assembly 200 with the air duct in the fuselage to form a second air duct 102 for feeding the reflector 21 and the lamp tube. 20 heat dissipation.

The invention adopts a secondary refrigeration module, which can solve the problem of uneven heat conduction efficiency, slow heat conduction, and poor timeliness of heat conduction when the first-level semiconductor refrigeration element dissipates heat through the heat transfer structure. The problem of heat imbalance at the end or the left and right ends or the upper and lower ends affects the cooling effect of the fan and so on.

Various specific embodiments of the refrigeration module, cooling fan assembly 200 and photon beauty instrument 100 are as follows, with reference to the accompanying drawings. Some structures of the following specific embodiments can be recombined to obtain more embodiments, all of which are included in the scope of the disclosure of the present invention.

Referring to Figures 1-28, the present invention provides a refrigeration module 1 and a beauty instrument, wherein the refrigeration module 1 includes a semiconductor cooling element 10 for refrigeration of the beauty instrument, and the semiconductor cooling element 10 includes a middle galvanic layer and two The hot surface 11' and the cold surface 13 at the end; the refrigeration module also includes a heat conduction structure 19 and a heat sink 16; the heat conduction structure 19 includes a VC vapor chamber or an aluminum superconducting plate or an aluminum superconductor; the heat conduction structure is connected with the heat sink 16 and the semiconductor The thermal surfaces 11 ′ of the refrigeration element 10 are connected with each other in a rapid heat transfer, so that the thermal surfaces dissipate heat rapidly.

The two ends of the aluminum superconducting plate or the aluminum superconducting tube are sealed, and the working liquid is encapsulated inside; more than two fine bone-shaped microgrooves 1911 are formed on the inner wall; a multi-microporous structure 1912 is formed in the aluminum superconducting plate or the aluminum superconducting tube material.

Please refer to Figures 1-19, the embodiment of the present invention relates to a beauty instrument 100, including a body provided with several vents 111, and several vents 111 can be set at different or the same position of the casing 110, with different Form setting, including but not limited to: honeycomb holes, slits, gaps and other forms formed on the casing 110, one or more vents, and functionally realize the cold wind or air from the environment entering the interior of the fuselage through the vents, Take away the heat inside the fuselage and discharge it out of the fuselage through the vents. A refrigeration module 1 , a light source assembly 2 , a power supply assembly 3 and a control circuit board 4 are arranged inside the fuselage. The light source assembly 2 and the power supply assembly 3 are electrically connected to the control circuit board 4; several air vents 111 of the fuselage are used for air intake and air outlet and form a ventilation channel with the space in the fuselage (the circuit shown by the arrow in Figure 4-6 ) to achieve heat dissipation inside the fuselage. The front end of the fuselage is the working surface 113, which can directly contact with the skin, and the light generated by the light source assembly 2 is transmitted to the working surface 113 and emitted to perform cosmetic treatment on the skin.

Referring to Figures 8-14, the refrigeration module 1 of the embodiment of the present invention is mainly used for cooling the working surface 113 of the beauty instrument, so as to achieve the effect of cold compress on the skin. The refrigeration module 1 includes a semiconductor cooling element 10, and the semiconductor cooling element 10 includes a galvanic couple layer 12 in the middle and a hot surface 11' and a cold surface 13 at both ends. The galvanic couple layer 12 in the middle is PN galvanic couple particles arranged according to the hot-end circuit arranged on the hot surface and the cold-end circuit arranged on the cold surface and electrically connected to form the internal circuit of the semi-conductor cooling element. The positive and negative poles are connected with the control circuit board 4 Electric connection or separate circuit control to control the work of semiconductor refrigeration components. In a specific embodiment, the cooling element 10 (specifically, the cold surface 13 ) can be directly used as the working surface 113 , or used to cool the working surface 113 . When the refrigeration element 10 is directly used as a working surface, those skilled in the art can set an appropriate shape as required, such as transparent crystal or ring shape. When the cooling element 10 is used to cool the working surface 113 , the cold surface 13 of the cooling element 10 is in contact with the working surface 113 , for example, it is arranged around the working surface. Alternatively, the cold surface 13 of the cooling element 10 and the working surface 113 are in contact with the working surface 113 through a heat transfer element (or heat conduction element). The cooling guide (the first cooling guide) 15 is a heat transfer structure, which can quickly transfer the heat of the working surface to the semiconductor refrigeration unit, so as to realize the effect of cooling the working surface. The heat transfer structure can be a heat conduction material such as (not limited to) a heat conduction element made of a metal material such as (not limited to) a copper tube or a copper plate, etc.; pipe) or uniform temperature plate (VC, vapor chamber) or super heat pipe or super heat conduction plate or other types of heat transfer components, connecting the semi-conductive cooling element (cold surface) and the working surface. The cooling guide (first cooling guide) 15 can be designed according to the shape of the semi-conductor cooling unit 10, especially the shape of the cold surface 13, and the shape of the working surface 113, based on the principle of rapid heat dissipation. The working surface 113 can be made of transparent crystal or other transparent materials. The working surface 113 can also be ring-shaped, and the central through hole of the ring is light-transmitting, and the material is not limited at this time.

Heat pipe (heat pipe) or vapor chamber (vapor chamber) is to quickly transfer the heat of the heating object to the heat source through the heat pipe by using the principle of heat conduction and the rapid heat transfer property of the cooling medium. The heat is transferred through the evaporation and condensation of the liquid in the fully enclosed vacuum tube or vacuum plate, and the fluid principle such as capillary action is used to achieve the effect of refrigeration. It has high thermal conductivity, excellent isothermal property, heat flux density variability, heat flow A series of advantages such as direction reversibility. The heat exchanger composed of heat pipe or vapor chamber has the advantages of high heat transfer efficiency, compact structure, and small fluid resistance loss.

Referring to Figures 7-11, as a preferred embodiment, the cold surface 13 and the working surface 113 of the cooling element 10 transfer the heat on the working surface 113 or the ambient heat of the working surface to the refrigeration unit quickly through the cooling guide 15, that is, the heat pipe. The component 10 (cold surface 13) dissipates heat and quickly transfers the heat to the cooling component. According to the shape of the working surface 113 and the expected cooling effect, the end of the cooling guide (heat pipe) 15 in contact with the working surface 113 can be designed as a ring, which is in close contact with the periphery of the working surface to quickly absorb the working surface 113 or the working surface 113 The heat of the surrounding environment; according to the shape of the cooling element 10 or the cold surface 13, the end of the cooling member (heat pipe) 15 that is in contact with the cooling element 10 can be designed to be placed on the cold surface 13 of the cooling element by extending a predetermined length from the circular bend And it is in close contact with the cold surface 13 .

The heat generated by the hot surface 11' of the semiconductor cooling element 10 is discharged out of the fuselage by the ventilation channel in the fuselage. Preferably, the semiconductor cooling element 10 enhances the heat dissipation effect through a heat dissipation component. The heat dissipation assembly includes a VC vapor chamber 11 and a heat sink 16 provided on the VC vapor chamber 11. The hot surface 11' of the semiconductor cooling element is arranged on the outer wall of the VC vapor chamber 11, or the VC vapor chamber 11 Directly used as the hot surface of the semiconductor refrigeration unit. The VC vapor chamber 11 is used for heat dissipation of the cooling element 10 . The VC vapor chamber 11 is located in the ventilation channel of the fuselage; the cooling element 10 is set on the VC vapor chamber 11, and the hot surface 11' of the semiconductor refrigeration element is attached to the outer wall of the VC vapor chamber, so that the heat of the hot surface Direct conduction to the VC vapor chamber 11; or, the heat surface 11' of the semiconductor refrigeration element is installed on the outer wall of the VC vapor chamber through the heat conduction element, and the heat of the heat surface 11' is quickly transferred to the VC vapor chamber 11 through the heat conduction element; Alternatively, the VC chamber 11 is provided with a hot end circuit of a semiconductor cooling element, which is welded and electrically connected to the PN galvanic couple particles of the galvanic couple layer 12 . The VC vapor chamber 11 is a closed flat cavity formed by a base plate, a frame and a cover plate, and a capillary structure is arranged in the cavity and a working fluid is contained in the cavity. As a non-limiting example, one end of the VC vapor chamber 11 forms an extended platform for setting or installing the semiconductor refrigeration unit 10, and the area of the VC chamber 11 is larger than the galvanic couple layer 12 and the cold surface 13, so that the hot surface of the semiconductor refrigeration unit 11' has an extended VC vapor chamber 11 to increase the heat dissipation area.

The heat dissipation assembly also includes heat dissipation fins 16 arranged on the VC uniform temperature plate 11 to increase the heat dissipation area of the VC. Heat sinks 16 can be provided on the upper or lower surface or both sides of the VC vapor chamber 11 according to the heat dissipation requirements of the product. Preferably, the VC vapor chamber 11 is located behind the air vent of the fuselage; the cooling fins on the VC vapor chamber 11 are facing the air vent 111 of the fuselage. The cooling fins 16 are one or more sets of thermal conductive material fins, and the position, quantity and arrangement of the cooling fins can be set according to the internal space of the beauty instrument. Combined with Figures 10-15, on the surface of the VC uniform temperature plate 11, the heat sink 16 is a group of parallel linear heat dissipation fins arranged in a matrix; or, the VC uniform temperature plate 11 is the fan bone circumference, and the heat sink 16 is spiral A set of curvilinear heat dissipation fins on the inner wall of the fan bone (Figure 15(a)), the air duct is in the same direction as the spiral direction of the fan bone; or, the heat sink 16 is a group of heat dissipation fins arranged in a circular matrix to dissipate heat The fins can be arranged in a straight radiating direction, or the cooling fins can be arranged at a certain angle to form a rotating direction (Fig. 15(b)).

The refrigeration module 1 of the present invention further includes a fan 18, which is located in the ventilation channel of the fuselage, and is used to enhance heat dissipation (cooling) efficiency. The fan 18 includes a fan housing 180 and an impeller 181 installed in the inner cavity of the housing. The fan housing 180 is provided with several openings as some vents 182 of the fan 18; , communicating with the inner cavity of the fan casing 180 to form an air passage of the fan 18, and communicating with the air passage in the fuselage. The VC vapor chamber 11 may be a part of the fan casing 180 or installed on the fan casing 180 . The VC vapor chamber 11 and the cooling fins 16 dissipate heat through the ventilation channel of the fan 18, and the fan promotes the gas flow to improve the heat dissipation efficiency.

The VC vapor chamber 11 can be set as a part of the housing of the fan 18 . The casing of the fan 18 includes an upper casing, a lower casing 184 and a surrounding rib 183 in the middle. Radiating teeth can be provided on the inner wall of the surrounding bone 183 to increase the heat dissipation area of the VC vapor chamber 11 . As shown in Figures 12-14, the VC uniform temperature plate 11 is used as the upper shell (or lower shell) of the fan casing and is set on the top (or bottom) of the annular surrounding bone; the VC uniform temperature plate 11 can be set as an annular flat plate, and the annular flat plate The central through hole forms an air vent of the fan 18; the cooling fins 16 are arranged as a group of parallel cooling fins covering the central through hole, the air passage between the cooling fins and the central through hole of the VC uniform temperature plate 11 and The inner cavities of the fan casing are communicated.

Referring to Figure 15(b), the difference from the structure shown in Figures 12-14 is that the cooling fins are arranged on the circular edge of the central through hole of the VC uniform temperature plate 1, arranged radially or rotated at a certain angle.

Referring to Fig. 15(a), the VC vapor chamber 11 is used as the outer wall of the fan blade, the heat sink 16 can be arranged on the inner wall of the outer wall, and the semiconductor cooling element 10 can be arranged on the outer wall of the outer wall.

The refrigeration module of the present invention is also used for heat dissipation of the light source assembly 2 . The light source assembly 2 includes a lamp tube 20, a reflector 21 outside the lamp tube, and electrode sheets 23 at both ends of the lamp tube. The lamp tube 20 is preferably an IPL lamp tube that generates IPL photons, or a halogen lamp, or other suitable light sources. The air passage of the light source assembly 2 communicates with the air passage of the fan 18 , and communicates with the air passage in the fuselage to form a heat dissipation air passage of the light source assembly 2 , and the fan 18 promotes heat dissipation of the light source assembly 2 . One side of the reflector can be provided with a heat conduction member 22, for example (but not limited to) the heat conduction member 22 is a set of heat conduction sheets (made of heat conduction material), one end of the heat conduction member is connected to the outer wall of the reflector cup, and the other end extends to the fan 18 There are 182 air vents. On the housing of the fan 18, specifically on the bone circumference outside the fan blade, a plurality of ventilation openings 182 are formed, as shown in Figure 13, three ventilation openings 182 are arranged on the surrounding bone, one of the (first) ventilation openings Install the heat-conducting part of the reflector, and connect the ventilation channel of the fan 18 with the ventilation channel in the fuselage to form the first ventilation channel 101 (refer to the arrow marking line in Figure 4), which is used for the heat-conducting part 22 of the reflector. and VC vapor chamber 11 to dissipate heat. At this time, external air or cold wind enters from the casing vent (including but not limited to a group of honeycomb holes and the gap of the housing) 111 facing the heat sink 16, and passes through the heat sink 16 and The VC uniform temperature plate 11 enters the fan 18 from the central through hole of the uniform temperature plate 11, and the impeller makes the air flow circulate in the inner cavity of the fan and flows through the heat conduction member 22 of the reflective cup and the VC uniform temperature plate 11, and the reflective cup 21 and the heat from the VC vapor chamber 11 is taken away, and the fan is exhausted from another (second) vent 182 on the surrounding bone of the fan, and passes through the ventilation channel in the fuselage from the vent at the end of the fuselage (including but not limited to A group of honeycomb holes and gaps in the housing) 111 are exhausted from the outside of the fuselage to realize the heat dissipation of the heat conducting member 22 of the reflector and the VC vapor chamber 11. Another (third) air vent 182 on the fan surround communicates with the air duct inside the lamp tube, and connects the air duct of the fan 18 with the air duct in the fuselage to form a second air duct 102, which is used to feed the reflector 21 and the lamp tube 20 dissipate heat. At this time, external air or cold air enters from the casing vent 111 facing the heat sink 16, passes through the heat sink 16 and the VC uniform temperature plate 11, and enters the fan 18 from the central through hole of the uniform temperature plate 11, and is driven by the impeller. Part of the air flows out of the fan through another vent 182 on the surrounding frame of the fan and enters the interior of the reflector 21, taking away the heat of the internal lamp tube 20 of the reflector and the reflector cup, exhausting the lamp tube and passing through the ventilation channel in the fuselage from the fuselage end The air vent 111 on the top exhausts the outside of the fuselage to further promote the heat dissipation of the lamp tube 20 and the reflector 21 .

The air vents 111 on the body shell of the beauty instrument can be set at different positions and with different hole structures, such as Figure 5-6, where the air vents are respectively set on the lower shell and the side of the body, and the air vents on the side are used as the first air passage 101 and the outlet of the second air passage 102, the air passage in the fuselage communicates with the air vent 111 on the side correspondingly.

The beauty instrument 100 of the present invention uses the refrigeration module 1 of the above-mentioned embodiments to cool the working surface 113 of the fuselage head, and the fan of the refrigeration module 1 can also be used for heat dissipation of the light source assembly 2 at the same time. The photonic beauty treatment can be a hair removal instrument, a photonic skin rejuvenation instrument, an import and export beauty instrument, a radio frequency beauty instrument, etc., all of which can use the refrigeration module of the above-mentioned embodiment.

The beauty instrument 100 shown in Figs. 1-7 is illustrated by taking a straight-type complete machine as an example, which can be used as an IPL photon hair removal instrument. Referring to FIGS. 1-19 , the embodiment of the present invention relates to a beauty instrument 100 , which includes a casing 110 provided with several vents 111 . The casing 110 includes an upper casing 112 and a lower casing 118 that are fastened together to form a cavity inside the fuselage. The fuselage is also provided with an upper bracket 114 and a lower bracket 115 to cooperate with the upper shell 112 and the lower shell 118 respectively, and a lamp bracket 24 is arranged inside the front end of the fuselage to install the cooling module 1, the light source assembly 2, the power supply assembly 3 and the control unit. circuit board4.

Several vents 111 may be disposed at different or the same position of the casing 110 in different hole structures. The air vent 110 shown in the figure is disposed on the lower shell 118 or the side or the end of the casing. The cavity inside the fuselage is formed with ventilation channels. The cold wind or air from the environment enters the interior of the fuselage through the vents, takes away the heat inside the fuselage, and is exhausted out of the fuselage through the vents 111 at the same or different positions. Several air vents 111 of the fuselage are used for air inlet and outlet and form a ventilation channel with the space inside the fuselage (as indicated by arrows in Figures 4-6) to achieve heat dissipation inside the fuselage. The front end of the fuselage is the working surface 113, which can directly contact with the skin, and the light generated by the light source assembly 2 is transmitted to the working surface 113 and emitted to perform cosmetic treatment on the skin.

The light source assembly 2 is installed on the front end of the fuselage through the lamp holder 24, and the lamp holder 24 is formed with a light outlet channel and a light outlet window for transmitting the light generated by the light source assembly. The working surface 113 is installed on the light exit window, and the lamp tube 20 is installed on the rear of the lamp head bracket by the reflector 21, behind the light exit passage, and the light exit direction of the light source assembly is provided with a filter 25. The heat conducting part 22 of the reflector extends backward to the air vent of the fan. An air passage can be arranged on the lamp holder 24 as required, and communicate with the air passage inside the reflector cup, so as to facilitate air cooling and heat dissipation.

The front end of the upper bracket 114 and the lower bracket 115 inside the fuselage is fastened to form a fan accommodation cavity, corresponding to the installation of the refrigeration module 1, and the front end of the lower bracket 115 forms a window, which is directly opposite to a vent 111 formed on the lower shell 118 and communicates , the cooling fins 16 on the VC vapor chamber 11 are located at the windows facing the vents 111 on the lower shell 118 . The semiconductor cooling element 10 is set on the platform extending from the front end of the VC chamber 11. The cooling element, that is, the heat transfer element (heat pipe) 15 is supported by the lamp bracket. (Parallel straight tube ends) Cover the cold surface of the semi-conductor refrigeration unit, and can be in close contact for rapid heat transfer. The fan is installed in the fan housing cavity, the front vent 182 of the surrounding bone corresponds to the heat conduction element 22 of the reflector, and the rear vent communicates with the ventilation channel formed by buckling the upper and lower brackets. Refer to the air inlet and outlet marks shown in Figure 8 for the air duct of the fan.

The inside of the back section where the upper bracket 114 and the lower bracket 115 are fastened together inside the fuselage forms a power supply component accommodating cavity. The power supply component 3 is generally a battery, such as a rechargeable battery or a capacitor battery. The power supply component also includes a charging stand 31 for connecting to an external The power supply charges the battery, or directly supplies power to the beauty instrument. The charging stand 31 is electrically connected with the control circuit board 4, installed on the casing, and can be connected with cables.

On one side of the power supply assembly cavity, the inside of the fastening of the upper bracket 114 and the lower bracket 115 also defines a ventilation channel 101/102, the wind, the ventilation channel 101/102 communicates with the ventilation channel of the fan, and communicates with the ventilation channel in the reflector cup , communicate with the vents (inlet and outlet) of the casing to form a ventilation channel inside the fuselage.

The cavity formed by the fastening of the upper bracket 114 and the upper shell 112 is used for installing the control circuit board 4 , and the control circuit board 4 is protected by the upper bracket 114 and the upper shell 112 . The switch button 117 electrically connected with the control circuit board 4 and the corresponding switch circuit board 116 inside are also installed on the casing, which are used for switch machine control and the like.

Referring to the embodiment shown in Figures 16-19, the refrigeration module 1 of the previous embodiment is applied to the L-shaped beauty instrument. Adaptively set the size and shape of the casing, the bracket, the power supply assembly 3 , the light source assembly 2 , the refrigeration module 1 and the control circuit board 4 , and match their positions. The L-shaped beauty instrument includes a handle 120 and a lamp head 130 . The lamp head 130 is rotatably connected to the top of the handle 120 through the knob 150 on the top of the handle, the knob seat 140 and the rotating pressure plate 151. The structure of the rotary connection between the lamp head 130 and the handle and the structure of the handle can adopt the structure of the prior art. The tail of the handle is a DC line 31', and the handle part bracket 160 is arranged inside, and the power supply assembly 3 is installed. The cavity on the top side of the handle bracket 160 communicates with the interior of the lamp cap 130, and the lamp cap housing is rotatably installed. The lamp cap housing includes a front case 131 and a front case cover 132 , and the lamp cap 130 is rotatably connected through the cooperation of the front case cover 132 with the knob 150 , the knob seat 140 , and the rotating pressure plate 151 . The lamp head inner bracket 133 is installed on the front shell cover 132 and cooperates with the front shell 131 , the refrigeration module 1 is installed on one side, and the control circuit board 4 is installed on the other side. The front end of the lamp holder 130 is a working surface 113, which can be: a transparent crystal working surface, or an annular working surface, or an annular semiconductor cooling element, or a semiconductor cooling element with a transparent crystal cold surface, all of which are structures in the prior art. The front end inside the lamp holder 130 is provided with a lamp holder 24, which is similar to the structure of the embodiment in Fig. The air vent 182 of the fan 18 is provided on the front shell 131 to face the heat sink assembly 26 . In this embodiment, the cooling module 1 is used to cool the working surface 113 and at the same time realize heat dissipation for the light source assembly 2 .

In the present invention, a semi-conductor refrigeration unit 10 is arranged on the VC uniform temperature plate 11, and the cold surface 13 of the refrigeration unit is connected to the working surface 113 of the beauty instrument by the cooling member, that is, the heat transfer element (heat pipe) 15, and the cold surface 13 of the cooling unit is quickly conducted to conduct cooling on the working surface. Cold compress effect or cooling effect. Radiating fins 16 are arranged on the VC uniform temperature plate 11 to increase the heat dissipation area. Furthermore, the VC vapor chamber 11 is combined with the fan, and utilizes the phase change effect of evaporation and condensation of the VC vapor chamber to be used in the upper casing or the lower casing or the surrounding frame of the fan, which greatly improves the heat dissipation efficiency and cooling efficiency of the fan when it rotates. Speed; adding heat sinks on the upper surface of VC can increase the heat dissipation area of VC, effectively increasing the contact area between air and heat sinks during air suction, and increasing the heat dissipation of heat-conducting materials on the lower surface of the upper shell of the VC fan (the inner wall of the surrounding bone) The fins can increase the contact area between the air and the heat sink to a greater extent, so that the heat dissipation effect is better. Heat sinks can be installed on the upper or lower surface or both sides of the VC vapor chamber according to the heat dissipation requirements of the product.

Referring to Figures 20-23, the second embodiment of the refrigeration module 1 of the present invention is mainly used for cooling the working surface 113 (refer to the previous embodiment) of the beauty instrument, so as to achieve the effect of cold compress on the skin. The cooling module 1 includes a semiconductor cooling element 10, and the semiconductor cooling element 10 (refer to the foregoing embodiment) includes a galvanic couple layer 12 in the middle and a hot surface 11' and a cold surface 13 at both ends. In a specific embodiment, the cooling element 10 (specifically The cold surface 13 ) can be directly used as the working surface 113 , or used to cool the working surface 113 . When the refrigeration element 10 is directly used as a working surface, those skilled in the art can set an appropriate shape as required, such as transparent crystal or ring shape. When the cooling element 10 is used to cool the working surface 113 , the cold surface 13 of the cooling element 10 is in contact with the working surface 113 , for example, it is arranged around the working surface. Alternatively, the cold surface 13 of the cooling element 10 and the working surface 113 are in contact with the working surface 113 through a heat transfer element (or heat conduction element). The cooling guide 15 is a heat transfer structural part, which can quickly transfer the heat of the working surface to the semiconductor cooling element, so as to realize the effect of cooling the working surface. The heat transfer structure can be made of thermally conductive materials such as (not limited to) metal materials such as (not limited to) copper/aluminum tubes or copper/aluminum plates, etc., or other thermally conductive materials such as silicone grease/silicon wafer/elastic or soft thermally conductive materials. Component; it can also be heat pipe or VC (chamber or uniform temperature tube) or super heat pipe or super heat conduction plate or other components that realize heat transfer. A heat pipe or vapor chamber uses the principle of heat conduction and the rapid heat transfer properties of the cooling medium to quickly transfer the heat of the heating object to the outside of the heat source through the heat pipe. The super heat pipe or the super heat conduction plate is preferably an aluminum super heat conduction pipe/aluminum super heat conduction plate. (Aluminum) superconducting heat pipe or (aluminum) superconducting heat plate, or ALVC superconducting pipe (plate), uses evaporative cooling and gas-liquid phase change to conduct heat quickly. Referring to Figure 23, compared with general heat pipes and VC vapor chambers, aluminum superconducting heat pipes/aluminum superconducting plates can form microgrooves or Microdentate or microporous channels act as capillary structures inside the superconducting conduit or superconducting plate. The aluminum superconductor (plate) may not be filled with copper powder, but may be filled with aluminum powder or aluminum-silicon powder, etc., or aluminum mesh may be added, and sealed after being filled with refrigerant. The cooling guide 15 is connected between the semi-conductive cooling unit (cold surface) and the working surface, and can be based on the shape of the semiconductor cooling unit 10, especially the shape of the cold surface 13, and the shape of the working surface 113, based on the principle of rapid heat dissipation Design the shape to fit. In this embodiment, the cooling member 15 is copper pipe or ALVC aluminum superconductor (plate) or heat pipe or VC.

According to the shape of the working surface 113 and the expected cooling effect, the end of the cooling guide 15 in contact with the working surface 113 can be designed as a ring, which is in direct and close contact with the periphery of the working surface, so as to quickly absorb the working surface 113 or the surrounding environment of the working surface 113 heat; or, a cooling member (second cooling member) 15 ′ is further provided on the working surface 113 and the cooling member 15 to conduct heat transfer in contact. The cooling guide 15' is a copper tube or ALVC superconductor (plate) or heat pipe or VC, which can be arranged in a ring shape, and is fitted to the periphery of the working surface 113 and the ring end of the cooling guide 15 for rapid heat transfer. According to the shape of the cooling element 10 or the cold surface 13, the end of the cooling guide element 15 in contact with the cooling element 10 can be designed to be placed on the cold surface 13 of the cooling element and in close contact with the cold surface 13 by extending a predetermined length from the ring-shaped bend.

The heat generated by the hot surface 11' of the semiconductor cooling element 10 is discharged out of the fuselage by the ventilation channel in the fuselage. Specifically, the semiconductor cooling element 10 enhances the heat dissipation effect through the heat dissipation component. The heat dissipation assembly includes a heat conduction structure 19 and a heat dissipation fin 16, which are located in the ventilation channel of the body of the beauty instrument, and are used to quickly dissipate heat to the heat surface 11' of the semiconductor cooling element 10. The heat conduction structure 19 includes a heat conduction plate 190 and several aluminum VC/ALVC superconductors 191, and each aluminum VC/ALVC superconductor 191 is a single tube. The thermal surface 11' of the semiconductor cooling element is arranged on the outer wall of the heat conduction plate 190, or the heat conducting plate 190 is directly used as the thermal surface 11' of the semiconductor cooling element 10. One side of the outer wall of the heat conduction plate 190 is provided with a semiconductor cooling element 10, and the other side is provided with several slots 192, and the several slots 192 are adapted to several aluminum VC/ALVC superconductors 191, and the aluminum VC/ALVC superconductors 191 is accommodated in the slot 192. The slot 192 of the heat conducting plate is connected with the aluminum VC/ALVC superconductor 191, for example, by riveting/welding, so as to increase the contact area between the two to realize rapid heat transfer.

Combined with Fig. 23, the aluminum VC/ALVC superconductor 191 forms micro-grooves or micro-tooths or micro-holes on the inner wall surface of the aluminum VC/ALVC superconductor through the aluminum material processing and forming process, and forms capillary holes inside the aluminum VC/ALVC superconductor. effect. As shown in Figure 23(b), when the aluminum material is extruded into an aluminum VC/ALVC supercatheter, a single channel 1910 is formed in the tube, and more than two thin bone-shaped microgrooves 1911 are formed on the inner wall of the tube, and it can also be formed in the aluminum VC/ALVC supercatheter. A large number of microporous structures 1912 are formed inside the tube wall of the catheter. After the aluminum material is formed into a tube shape, aluminum powder or aluminum silicon powder can be poured into the tube by pumping liquid into the tube, and aluminum mesh can also be added, and the end is sintered and sealed after vacuuming , Aluminum VC/ALVC superconductor with super thermal conductivity. Preferably, each aluminum VC/ALVC superconductor is a single-channel 1910. The advantages are: it can realize plane bending or special-shaped 3D bending, and can change shape according to the change of product space shape, and can realize multiple aluminum VC/ALVC The superconducting longitudinal modes are staggered and combined to overcome the influence of the direction of gravity. In the example shown in Figure 23 (a), the aluminum VC/ALVC superconductor 191 is bent into an L shape, and correspondingly, the slot 192 on the heat conducting plate 190 is also L-shaped, and the aluminum VC/ALVC superconductor 191 is just inserted into the opening. In the groove 192 , an L-shaped heat conduction structure 19 is formed as a whole. One end of the L-shape is placed on the hot surface 11 ′ of the peltier refrigerating element 10 in close contact with rapid heat transfer, and the other end of the L-shape is installed in the heat sink 16 . The heat generated by the thermal surface 11' of the semiconductor cooling element 10 is quickly transferred to the heat sink 16 by the heat conduction structure 19 for heat dissipation.

The cooling element 10 is arranged on one side of the heat conducting plate 190, and the hot surface 11' of the semiconductor cooling element is attached to the outer wall of the heat conducting plate 190, so that the heat on the hot surface is directly transferred to the heat conducting plate 190; or, the heat of the semiconductor cooling element The surface 11' is installed on the outer wall of the heat conduction plate 190 through the heat conduction element, and the heat of the heat surface 11' is quickly transferred to the heat conduction plate 190 through the heat conduction element; or, the heat conduction plate 190 is provided with a hot end circuit of a semiconductor refrigeration element, and the galvanic couple The PN galvanic particles of layer 12 are soldered and electrically connected. The heat conduction plate 190 is a heat conduction element made of heat conduction materials such as (not limited to) metal materials such as (not limited to) copper/aluminum or other heat conduction materials such as silicone grease/silicon chip/elastic or soft heat conduction material. Preferably, the heat conducting plate 190 is made of heat conducting material such as copper/aluminum plate.

The heat sink 16 is disposed on the heat conducting plate 190 to increase the heat dissipation area. Preferably, the heat sink 16 is located behind the air vent of the body of the beauty instrument; facing the air vent 111 of the body (combined with Fig. 16 and Fig. 27-28). The cooling fins 16 are one or more sets of thermal conductive material fins, and the position, quantity and arrangement of the cooling fins can be set according to the internal space of the beauty instrument. One or more sets of heat dissipation fins are integrally formed or welded or riveted or fixed by other fastening mechanisms to form a heat sink 16 of an integral structure; or, one or more sets of heat-conducting material fins are arranged on a heat-conducting plate to form an integral structure The heat sink 16. A groove 161 is formed on the top surface of the heat sink 16, and one end of the heat conducting structure 19 is inserted into the groove 161, and the contact area between the two can be increased by riveting/welding to realize rapid heat transfer.

In other embodiments, the heat conduction structure 19 can also be directly placed on the heat sink 16 , or the heat conduction structure 19 is connected to one side of the heat conduction plate of the heat sink 16 (refer to FIG. 28 ).

Referring to Figures 24-26, the third embodiment of the refrigeration module 1 is mainly used for cooling the working surface 113 (refer to the previous embodiments) of the beauty instrument, so as to achieve the effect of cold compress on the skin. The cooling module 1 includes a semiconductor cooling element 10, a first cooling element 15, a second cooling element 15', a heat sink 16 and a heat conducting structure 19. The structures of the first cold guide member 15, the second cold guide member 15', and the heat sink 16 are the same or similar to those of the second embodiment of the refrigeration module 1 above, and the above embodiment is directly cited. The heat conduction structure 19 includes a heat conduction plate 190 and several aluminum VC/ALVC superconductors 191, each aluminum VC/ALVC superconductor 191 is a single tube, preferably a single channel in the tube. The thermal surface 11' of the semiconductor cooling element is arranged on the outer wall of the heat conduction plate 190, or the heat conducting plate 190 is directly used as the thermal surface 11' of the semiconductor cooling element 10. One side of the outer wall of the heat conduction plate 190 is provided with a semiconductor cooling element 10, and the other side is provided with several slots 192, and the several slots 192 are adapted to several aluminum VC/ALVC superconductors 191, and the aluminum VC/ALVC superconductors 191 is accommodated in the slot 192. The slot 192 of the heat conducting plate is connected with the aluminum VC/ALVC superconductor 191, for example, by riveting/welding, so as to increase the contact area between the two to realize rapid heat transfer. In this embodiment, the heat conduction plate 190 includes a circular (not limited to a circular) area and a platform extending on one side, on which the semiconductor cooling element 10 is arranged. A number of slots 190 are arranged in the circular area from the center of the circle to the periphery of the circle, and the intervals are evenly arranged in the circular area. An aluminum VC/ALVC superconductor 191 is placed in each slot 190, and the slots 190 and aluminum VC/ The ALVC supercatheter 191 can be set with a certain curvature or radian. In a non-limiting example, after installation, multiple aluminum VC/ALVC superconductors 191 are arranged radially or approximately along the radius, which can overcome the influence of the direction of gravity. In other embodiments, a plurality of aluminum VC/ALVC superconductors 191 can be arranged in a staggered longitudinal mode to overcome the influence of the direction of gravity. The slot 190 of the heat conduction plate is connected with the aluminum VC/ALVC superconductor 191, and the contact area between the two can be increased by riveting/welding to accelerate heat transfer.

Same as the foregoing embodiments, the aluminum VC/ALVC superconductor 191 preferably adopts a single channel, and microgrooves or microtooths or micropores are formed on the inner wall surface of the aluminum VC/ALVC superconductor through the aluminum material processing and forming process, and the internal package is equipped with cooling channels. Liquid can be poured into aluminum powder or aluminum silicon powder, etc., and aluminum mesh can also be added.

The cooling element 10 is arranged on a platform on one side of the heat conduction plate 190, and the thermal surface 11' of the semiconductor refrigeration element is attached to the outer wall of the heat conduction plate 190, so that the heat of the heat surface is directly transferred to the heat conduction plate 190; or, the semiconductor refrigeration The heat surface 11' of the element is installed on the outer wall of the heat conduction plate 190 through the heat conduction element, and the heat of the heat surface 11' is quickly transferred to the heat conduction plate 190 through the heat conduction element; or, the heat conduction plate 190 is provided with a hot end circuit of a semiconductor refrigeration element, The PN galvanic particles of the galvanic layer 12 are welded and electrically connected. Preferably, the heat conducting plate 190 is made of heat conducting material such as copper/aluminum plate.

The heat sink 16 is disposed on the heat conducting plate 190 to increase the heat dissipation area. In a non-limiting example, the circular area of the heat conduction structure 19 can be directly disposed on the top of the heat sink 16 , or fixed to the top of the heat sink 16 by welding or riveting, so as to transfer heat quickly. The platform on one side of the heat conduction plate 190 protrudes from the cooling fins 16, and the semiconductor cooling element 10 is disposed on the platform.

Referring to Fig. 27, the refrigeration module 1 of the above-mentioned third embodiment is applied to a beauty instrument, for example, to a beauty instrument with the shape shown in Fig. Same or similar, direct reference. The heat conduction structure 19 is arranged on the air vent on the top of the fan 18, specifically, the circular area of the heat conduction plate 190 is covered on the opening on the top of the fan, the aluminum VC/ALVC superconductor 191 is installed on the heat conduction plate facing the fan, and the heat sink 16 is located on the outside facing The air vent 111 on the side of the front shell 131, the heat conduction structure 19, the fan 18, and the heat sink 16 are all located in the air passages in the fuselage, and the respective air passages are connected, and the cold air is input from the air vents 111 of the fuselage. The heat is taken away in the ventilation channel inside and then discharged to the outside of the fuselage through another vent 111.

A semi-conductor refrigeration unit 10 is arranged on the platform on one side of the heat conduction plate 190, and the cold surface of the refrigeration unit 10 is connected to the work of the beauty instrument by the cold conduction unit (copper/ALVC/heat pipe/VC) 15 (and the second cold conduction unit 15′). The connection of the surface 113 conducts cooling quickly, forming a cold compress effect or a cooling effect on the working surface.

The working principle of the beauty instrument shown in Fig. 27 is the same as that of the foregoing embodiments, so details are not repeated here.

The beauty instrument of the embodiment shown in Figure 28 uses the cooling module 1 of the third embodiment above to cool the working surface 113 of the beauty instrument, and the other structural parts of the beauty instrument are the same or similar to those of the embodiment shown in Figures 16-19. direct quote. The heat conduction structure 19 is L-shaped, and one end cover installed on the heat sink 16 is set on the air vent on the top of the fan 18. The aluminum VC/ALVC superconductor 191 is installed on the heat conduction plate 190 to face the fan inwardly, and the other end of the heat conduction plate 190 is provided with a semiconductor refrigeration unit. Part 10 is located on the outside of the vent at the top of the fan 18. The wind cooling fin 16 is located at the air vent 111 on the side of the front shell 131, the heat conduction structure 19, the fan 18, and the heat sink 16 are all located in the air passage in the fuselage, and the respective air passages communicate with each other, and the air vent 111 of the fuselage The cold air is input, and the heat is taken away in the ventilation channel in the fuselage, and then discharged to the outside of the fuselage through another vent 111 .

A semi-conductor cooling element 10 is arranged on the platform on one side of the heat conducting plate 190, and the cooling surface of the cooling element 10 and the working surface 113 of the beauty instrument are connected by the cooling element (copper/ALVC/heat pipe/VC) 15 (and the cooling element 15'). The connection quickly conducts cooling, forming a cold compress or cooling effect on the working surface. In this embodiment, the heat pipe and heat sink assembly 26 provided on the side of the heat conducting member 22 of the reflector cup of the light source assembly 2 may be omitted. The groove 161 (Fig. 22) opened on the heat sink 16 is installed with one end of the heat conducting plate 190, and at the same time forms a ventilation channel, which communicates with the air duct between the adjacent fins of the heat sink 16 and the air duct of the fan, and connects with the light source assembly 2 The reflector and its internal ventilation channel are connected, and the heat conduction part 22 of the reflector of the light source assembly 2 is located in the vent of the fan 18 or in the ventilation channel in the fuselage, so as to realize the air cooling and heat dissipation of the reflector 21 and the lamp tube 20 . In this embodiment, the cooling module 1 is used to cool the working surface 113 and at the same time realize heat dissipation for the light source assembly 2 .

The heat conduction structure 19 of the above embodiment of the present invention adopts multiple aluminum superconducting plates or aluminum superconducting pipes 191 combined with a heat conducting plate (copper plate) 190, which can effectively solve the problem of the gravity direction of the product, and the pipeline can be in the XY plane or XYZ three-dimensional side using two or more different orientation/angle settings. It is well known that heat and steam flow/flow from bottom to top. In this way, when the beauty instrument is used from bottom to top, the gravity effect of the heat conduction structure will be more obvious. Due to the effect of anti-gravity direction, the heat conduction in this state The effect becomes worse, and the ideal heat dissipation effect cannot be achieved. The present invention is designed to be arranged horizontally and vertically (or in the form of intersecting lines with a certain angle, or in the form of a ring (Fig. 24-26). The staggered and circular design can better solve the heat dissipation problem. .The heat conduction structure 19 significantly improves the heat dissipation efficiency.

Referring to Figures 29-30, the fourth embodiment of the refrigeration module 1 of the present invention adopts a two-stage refrigeration method, which is mainly used for cooling the working surface of the photon beauty instrument and internal heat dissipation, so as to improve the cooling efficiency. The specific implementation method is: a first-level cooling element is set on the contacting skin end, that is, the working surface, and acts on the skin to cool the skin. ) Super heat conduction plate) The evaporating end of 15 absorbs heat and enters the heat pipe/chamber/(aluminum) super heat conduction tube/(aluminum) super heat conduction plate internal channel to transfer heat to the condensation end, and the condensation end is equipped with 10 pairs of secondary refrigeration components Active refrigeration is performed at the end, and the temperature at the condensation end at this time depends on the power of the secondary refrigeration element 10 . Since the temperature of the condensation end is much lower than the temperature of the ambient wind, the condensation speed and timeliness of the condensation end are greatly improved, so that the internal phase of the cooling member (heat pipe/VC/(aluminum) super heat conduction pipe or (aluminum) super heat conduction plate) 15 The variable cycle is accelerated to achieve the beneficial effect of improving the front-end cooling; the heat dissipation surface (hot surface) 13 of the secondary refrigeration unit 10 is close to the air inlet or air outlet of the fan, and the heat dissipation of the secondary refrigeration unit 10 can be directly adopted by the copper/aluminum heat conducting sheet by the fan. The heat is taken away directly, and the heat on the heat dissipation surface 13 of the secondary cooling element can be conducted to the fan casing through the heat pipe/chamber/(aluminum) super heat pipe/(aluminum) super heat conduction plate, and the fan casing is arranged The cooling fins 16 on the body wall take away the heat through fan blowing or air suction. Compared with the embodiment of the refrigeration module 1 shown in Figures 8-15, this embodiment (Figures 29-30) is equipped with two-stage refrigeration, which is equivalent to the cooling element 10 of the refrigeration module 1 shown in Figures 8-15 As a secondary refrigeration unit, it is used for refrigeration of the primary refrigeration unit 10 ′ connected to the cold end. It adopts two-stage refrigeration, which is mainly used for cooling the working surface 113 of the beauty instrument, so as to achieve the effect of cold compress on the skin. The primary cooling element 10' is connected to the working surface 113 or directly used as the working surface 113, and the secondary cooling element 10 is connected to the cooling fan assembly or directly arranged on the fan casing. The primary cooling element and the second cooling element preferably refer to semiconductor cooling elements, and the semiconductor cooling elements 10/10' include a galvanic couple layer 12 in the middle and hot surfaces 11' and cold surfaces 13 at both ends. The galvanic couple layer 12 in the middle is PN galvanic couple particles arranged according to the hot-end circuit arranged on the hot surface and the cold-end circuit arranged on the cold surface and electrically connected to form the internal circuit of the semi-conductor cooling element. The positive and negative poles are connected with the control circuit board 4 Electric connection or separate circuit control to control the work of semiconductor refrigeration components.

In a specific embodiment, the primary cooling element 10' (specifically, the cold surface 13) can be directly used as the working surface 113, or used to cool the working surface 113. When the primary cooling element 10' is directly used as a working surface, those skilled in the art can set an adapted shape according to needs, for example, using a whole piece of transparent crystal as the cold surface 13 directly as the working surface 113, the hot surface 11' and the galvanic layer 12 is provided with a light-transmitting window, so that the primary refrigeration element 10' has light-transmitting properties; limited. When the primary cooling element 10' is connected to the working surface 113 for cooling, its cold surface 13 is in contact with the working surface 113, for example, it is arranged on the periphery of the working surface, or the cold surface 13 of the primary cooling element 10' and the working surface 113 pass heat The element (or thermal conductor) is in contact with the working surface 113 .

The cooling guide (the first cooling guide) 15 is set to be connected to the first-level semiconductor cooling unit 10' (specifically, its hot surface 11') and the second-level semiconductor cooling unit 10 (specifically, its cold surface 13) in a rapid cooling manner. Between; can quickly transfer the heat of the primary semiconductor cooling element 10' to the secondary semiconductor cooling element 10, so as to achieve the effect of cooling the working surface. The cooling member 15 is a heat transfer structure, and the heat transfer structure can be a heat conduction material such as (not limited to) a heat conduction element made of a metal material such as a copper tube or a copper plate or other heat transfer structures, etc.; preferably a heat pipe (heat pipe) Or vapor chamber or (aluminum) super heat pipe or (aluminum) super heat plate. The cooling guide 15 can be designed in an adapted shape based on the shape of the first-stage semi-conductor cooling unit 10' and the second-level semi-conductor cooling unit 10 based on the principle of rapid heat dissipation. When the primary semiconductor cooling element 10' is directly used as the working surface 113, it has light transmission or is provided with a light transmission window. The end of the cooling guide (heat pipe) 15 in contact with the working surface 113 can be designed as a ring, which is in close contact with the periphery of the hot surface 11' of the primary semiconductor cooling element 10', so as to quickly absorb the primary semiconductor cooling element 10' or a The heat of the surrounding environment of the primary semiconductor cooling element 10'; the end of the cold conducting element (heat pipe) 15 in contact with the secondary cooling element 10 can be designed to be placed on the cold surface 13 of the secondary cooling element 10 by extending a predetermined length from the circular bend And it is in close contact with the cold surface 13 .

The secondary semiconductor cooling element 10 enhances the heat dissipation effect through the heat dissipation assembly. The heat dissipation assembly includes heat pipes or (aluminum) super heat conduction pipes or (aluminum) super heat conduction plates or vapor chambers to form a heat conduction shell 11 in a single piece or spliced in multiple pieces, and heat sinks 16 arranged on the heat conduction shell 11, so The thermal surface 11' of the secondary semiconductor cooling element is arranged on the outer wall of the heat conduction shell 11, or the heat conductive shell 11 is directly used as the thermal surface of the semiconductor cooling element. The heat conduction shell 11 is used for heat dissipation of the secondary cooling element 10 . When applied to a beauty instrument, the heat conduction shell 11 is located in the ventilation channel of the fuselage; the secondary refrigeration element 10 is arranged on the heat conduction shell 11, and the hot surface 11' of the secondary semiconductor refrigeration element is attached to the outer wall of the heat conduction shell 11. The heat from the hot surface is directly conducted to the heat conduction shell 11; or, the heat surface 11' of the secondary semiconductor cooling element 10 is installed on (heat pipe/chamber/(aluminum) super heat pipe/(aluminum) super heat conduction plate through heat conduction ) the outer wall of the heat conduction shell 11, and quickly conduct the heat of the heat surface 11' to the (heat pipe/chamber/(aluminum) super heat pipe/(aluminum) super heat conduction plate) heat conduction shell 11 through the heat conduction member; or, (heat pipe/ Vapor chamber/(aluminum) super heat conduction tube/(aluminum) super heat conduction plate) The heat conduction shell 11 is provided with the hot end circuit of the semiconductor cooling element, which is welded and electrically connected to the PN galvanic couple particles of the galvanic couple layer 12. It is preferable to use a uniform temperature plate/(aluminum) super heat conduction plate to form a heat conduction shell 11 as a whole single piece or spliced in multiple pieces. It is a closed flat plate cavity formed by a bottom plate, a frame and a cover plate. capillary structure and contains working fluid. As a non-limiting example, one end of the heat conduction shell 11 forms an extended platform for setting or installing the secondary semiconductor cooling element 10. The area of the heat conduction shell 11 is larger than the galvanic couple layer 12 and the cold surface 13, so that the heat of the secondary semiconductor refrigeration element 10 The heat dissipation area of the surface 11' increases.

Radiating fins 16 are arranged on the heat conducting shell 11 to increase the heat dissipation area. Radiating fins 16 can be provided on the upper or lower surface or both sides of the heat conduction housing 11 according to the heat dissipation requirements of the product. Preferably, the heat conduction shell 11 is located behind the air vent of the body of the beauty instrument, and the cooling fins on it face the air vent 111 of the body. The fins 16 are one or more sets of fins of thermally conductive material.

The heat dissipation assembly of the secondary refrigeration unit 10 also includes a fan 18, which is located in the ventilation channel of the body of the beauty instrument to enhance heat dissipation (cooling) efficiency. In this embodiment, the configuration of the heat dissipation fan 180, the secondary refrigeration unit 10, (heat pipe/chamber/(aluminum) super heat pipe/(aluminum) super heat conduction plate) heat conduction shell 11 and heat sink 16 is shown in Figure 10-15. The illustrated embodiment and the above descriptions are directly quoted in this embodiment, and will not be described in detail. The fan 18 includes a fan housing 180 and an impeller 181 installed in the inner cavity of the housing. The fan housing 180 is provided with several openings as some vents 182 of the fan 18; , communicating with the inner cavity of the fan casing 180 to form an air passage of the fan 18, and communicating with the air passage in the fuselage. (Heat Pipe/Vapor Chamber/(Aluminum) Super Heat Conductor/(Aluminum) Super Heat Conductor Plate) The heat conduction shell 11 can be a part of the fan casing 180 or be installed on the fan casing 180 .

The two-stage refrigeration module 1 of this embodiment is applied to the cooling and heat dissipation of the photon beauty instrument 100. Referring to FIGS. The light source assembly 2 includes a lamp tube 20 and a reflector 21 outside the lamp tube. The lamp tube 20 is an IPL lamp tube that generates IPL photons or is a halogen lamp or other suitable light sources. The air passage of the light source assembly 2 communicates with the air passage of the fan 18 , and communicates with the air passage in the fuselage to form a heat dissipation air passage of the light source assembly 2 , and the fan 18 promotes heat dissipation of the light source assembly 2 . One side of the reflector can be provided with a heat conduction member 22, for example (but not limited to) the heat conduction member 22 is a set of heat conduction sheets (made of heat conduction material), one end of the heat conduction member is connected to the outer wall of the reflector cup, and the other end extends to the fan 18 There are 182 air vents. On the housing of the fan 18, specifically on the bone circumference outside the fan blade, a plurality of ventilation openings 182 are formed, as shown in Figure 13, three ventilation openings 182 are arranged on the surrounding bone, one of the (first) ventilation openings Install the heat-conducting part of the reflector, and connect the ventilation channel of the fan 18 with the ventilation channel in the fuselage to form the first ventilation channel 101 (refer to the arrow marking line in Figure 4), which is used for the heat-conducting part 22 of the reflector. and (heat pipe/chamber/(aluminum) super heat pipe/(aluminum) super heat conduction plate) heat conduction shell 11 to dissipate heat, at this time, the outside air or cold wind comes from the casing vent (including but not Limited to a group of honeycomb holes and gaps in the shell) 111 enters, through the heat sink 16 and (heat pipe/chamber/(aluminum) super heat pipe/(aluminum) super heat pipe) heat conduction shell 11, from (heat pipe/uniform temperature Plate/(aluminum) super heat pipe/(aluminum) super heat conduction plate) The central through hole of the heat conduction shell 11 enters the fan 18, and the impeller makes the air flow circulate in the inner cavity of the fan and flows through the heat conduction member 22 of the reflector cup and (heat pipe /Vapor chamber/(aluminum) super heat conduction tube/(aluminum) super heat conduction plate) heat conducting shell 11, reflector cup 21 and (heat pipe/evaporation plate/(aluminum) super heat conduction pipe/(aluminum) super heat conduction plate) heat conduction The heat of the shell 11 is taken away, and the fan is exhausted by another (second) vent 182 on the surrounding bone of the fan, and the vents (including but not limited to a group of honeycomb holes) at the end of the fuselage are passed through the ventilation channel in the fuselage. And the shell gap) 111 is exhausted from the outside of the fuselage to realize the heat dissipation of the heat conduction member 22 of the reflector and the (heat pipe/chamber/(aluminum) super heat pipe/(aluminum) super heat conduction plate) heat conduction shell 11. Another (third) air vent 182 on the fan surround communicates with the air duct inside the lamp tube, and connects the air duct of the fan 18 with the air duct in the fuselage to form a second air duct 102, which is used to feed the reflector 21 and the lamp tube 20 dissipate heat. At this time, external air or cold air enters from the casing vent 111 facing the heat sink 16, and passes through the heat sink 16 and (heat pipe/chamber/(aluminum) super heat pipe/(aluminum) super heat conduction plate) heat conduction shell 11. It enters the fan 18 from the central through hole of the uniform temperature plate 11, and the impeller makes part of the air flow through another vent 182 on the fan surround to be discharged from the fan and enter the interior of the reflector 21, taking away the internal lamp tube 20 of the reflector and The heat of the reflector is exhausted from the lamp tube and exhausted from the air vent 111 at the end of the fuselage through the ventilation channel in the fuselage to further promote the heat dissipation of the lamp tube 20 and the reflector 21 . The heat dissipation component and heat dissipation principle are the same as those of the embodiment shown in Fig. 1-14.

The beauty instrument 100 of the present invention is the same as the embodiment shown in Figures 1-14, and the working surface 113 is formed by the transparent crystal cold surface of the primary cooling element 10'. The photonic beauty treatment can be a hair removal instrument, a photonic skin rejuvenation instrument, an import and export beauty instrument, a photon radio frequency beauty instrument, etc., all of which can use the refrigeration module of the above-mentioned embodiment. The end of the photon beauty instrument that contacts the skin, that is, the working surface, is provided with a first-level cooling element 10, which acts on skin cooling, and the heat of the first-level cooling element 10' (specifically, its hot surface 11') passes through the cooling element (heat pipe/uniform temperature plate/ The evaporation end of (aluminum) super heat conduction tube/(aluminum) super heat conduction plate) 15 absorbs heat and enters the internal channel to transfer the heat to the condensation end, and the condensation end is equipped with a secondary cooling element 10 to actively cool the condensation end. At this time, the condensation The temperature at the end depends on the power of the secondary cooling element 10. Since the temperature of the condensation end is much lower than the temperature of the ambient wind, the condensation speed and timeliness of the condensation end are greatly improved, so that the inside of the cooling member (heat pipe/chamber/(aluminum) super heat pipe/(aluminum) super heat conduction plate) The phase change cycle is accelerated to achieve the beneficial effect of improving the front-end cooling; the heat dissipation surface 11' of the secondary cooling element 10 is close to the air inlet or outlet of the fan, and the heat dissipation of the secondary cooling element can directly use the copper/aluminum heat conducting sheet 16 to transfer the heat to the fan. Take it away directly, or conduct the heat on the heat dissipation surface 11' of the secondary refrigeration unit 10 to the fan casing through the heat pipe/chamber/(aluminum) super heat pipe/(aluminum) super heat conduction plate, and set it on the fan casing The cooling fins 16 on the body wall take away the heat through fan blowing or air suction.

The beauty instrument 100 of the embodiment shown in Figures 31-32 has the same structure as the beauty instrument 100 of the embodiment shown in Figures 1-7, and the descriptions of the corresponding embodiments are directly quoted in this embodiment, and will not be repeated here. From the principle of the heat pipe, the heat vaporized at the evaporating end of the cooling member 15 needs to be "conducted" through the tube wall at the condensing end to the heat sink 16, and the heat is taken away by the fan 18. Condensation belongs to driven/passive heat dissipation, and condensation The heat dissipation effect of the end depends on the ambient temperature of the wind sucked by the fan; if the timeliness and speed of condensation will become worse, the effect of affecting the internal circulation of the heat pipe will become worse. Only using the first-level semiconductor cooling element 10' to cool the skin has uneven heat conduction efficiency, slow heat conduction, and poor timeliness of heat conduction, and there is a problem of unbalanced heat at the front and rear ends or left and right ends or upper and lower ends of the heat sink when the heat is transferred to the heat sink. The effect of causing the fan to maximize the part of the air sucked in or blown out will also affect the effect of heat dissipation; this embodiment adopts a two-stage refrigeration module 1, and the first-stage refrigeration element 10' is transferred to the second-stage refrigeration by the cooling guide 15 The component 10 effectively solves the above problems of using only the primary refrigeration component 10'.

In other embodiments, it is the secondary cooling element 10 that adopts the heat dissipation assembly of the refrigeration module shown in the embodiment shown in Fig. The cooling element 15 ( 15 ′) is connected to the secondary cooling element 10 (specifically, its cold surface 13 ) in a rapid heat transfer manner, so as to rapidly conduct cooling. The heat generated by the thermal surface 11' of the secondary semiconductor cooling element 10 is quickly dissipated by the heat conduction structure 19 and the heat sink 16. The heat conduction structure 19 includes a heat conduction plate 190 and several aluminum VC/ALVC superconductors 191, and each aluminum VC/ALVC superconductor 191 is a single tube. The thermal surface 11' of the secondary semiconductor cooling element 10 is arranged on the outer wall of the heat conduction plate 190, or the heat conducting plate 190 is directly used as the thermal surface 11' of the secondary semiconductor cooling element 10. One side of the outer wall of the heat conduction plate 190 is provided with a secondary semiconductor cooling element 10, and the other side is provided with several slots 192, and the several slots 192 are adapted to several aluminum VC/ALVC superconductors 191, and the aluminum VC/ALVC The superconductor 191 is accommodated in the slot 192 . The slot 192 of the heat conducting plate is connected with the aluminum VC/ALVC superconductor 191, for example, by riveting/welding, so as to increase the contact area between the two to realize rapid heat transfer. The heat dissipation assembly also includes a heat dissipation fan assembly, and the heat dissipation fan can be realized by adopting the structures of the above-mentioned embodiments or a common fan.

The following implementation, referring to Figs. 33-54, is to use the heat dissipation fan module 200 to quickly dissipate heat from the secondary refrigeration unit 10 of the above embodiment. In this embodiment, the cooling fan module 200 includes a fan housing 210 and an impeller 220. The inside of the fan housing 210 is a cavity, and the impeller 220 is installed in the cavity; 201 connects the cavity with the air path outside the fan, and at least part of the fan casing 210 is composed of heat pipes or super heat conducting pipes or super heat conducting plates or VC 211 . The fan casing 210 includes a side facade casing, and the top and bottom can be selectively provided with an upper casing and a bottom casing according to specific product requirements. The upper casing and the bottom casing can also be formed by the upper fins or lower fins of the following heat sinks. Set separately. The side facade casing may be a volute or a partial casing of the volute outside the rotation circumference of the impeller.

Preferably, the super heat conducting tube is an aluminum superconducting pipe, and the super heat conducting plate is an aluminum superconducting plate. The through channel 2110 inside the aluminum superconductor or the aluminum superconducting plate is a single channel or multiple channels; the single channel or multiple channels are porous microgroove channels; The ends are sealed and the working fluid is encapsulated inside.

The fan casing includes a volute on the outside of the impeller, which encloses and forms the cavity inside the fan; the top of the volute can be provided with an upper shell or the top can form a vent 201, and the bottom can be a bottom shell or form a vent 201; the top vent can also be It may be a plurality of through holes arranged on the upper case, and the vent at the bottom may also be a plurality of through holes arranged on the bottom case. Part or all of the volute or the upper shell or the bottom shell is composed of heat pipes or super heat conducting pipes or super heat conducting plates or VC 211 . The heat pipe or super heat conduction pipe or super heat conduction plate or VC 211 is a whole single piece or spliced by multiple pieces.

The cooling fan module 200 includes a cooling fin 212 , and the cooling fin 212 is connected to a heat pipe or a super heat conducting pipe or a super heat conducting plate or a VC 211 in a fast heat transfer manner. The cooling fins 212 are located within cavities within the fan housing. The heat sink 212 includes one or more sets of heat-conducting material fins; the air duct between adjacent fins, that is, the air duct of the heat sink communicates with the air vent and the cavity of the fan.

Preferably, the side elevation of the fan housing, that is, the volute, is provided with heat pipes or super heat conduction pipes or super heat conduction plates or VC211; the cooling fins 212 are arranged on the inner wall of the side elevation, with a predetermined distance from the impeller 220, without affecting the rotation of the impeller 220. More preferably, the side facade of the volute is made of a single-channel or multi-channel aluminum superconductor or an aluminum superconducting plate to form a heat-conducting shell; the cooling fins 212 are arranged on the inner wall of the heat-conducting shell. The fins are arranged along the radial circumference of the impeller rotation center; the air duct between adjacent fins is in the same direction as the airflow generated by the impeller rotation.

The inner wall of the single-channel or multi-channel 2110 of the aluminum superconductor or the aluminum superconducting plate forms more than two fine bone-like microgrooves 2111; the groove direction of the microgrooves 2111 is along the radial circumference of the impeller rotation center, and the direction of the airflow generated by the impeller rotation unanimous. A porous structure is formed inside the wall material of the microgroove 2111. The channel 2110, the micro-groove 2111 and the porous structure inside the material are formed by one-time molding through the extrusion molding process of aluminum material.

Preferably, the heat dissipation fan module 200 of the present invention includes a secondary semiconductive cooling element 10, and the heat dissipation surface (hot surface) of the secondary semiconductive cooling element 10 is connected to the heat pipe or super heat conducting pipe or super heat conducting plate or VC 211 in a rapid thermal conduction manner . The heat dissipation surface of the secondary semi-conductor cooling element 10 and the heat pipe or super heat-conducting tube or super heat-conducting plate or VC 211 are in contact with each other for heat transfer or through the heat-conducting plate in contact with each other for heat transfer, or the heat dissipation of the secondary semi-conductor cooling element 10 Surfaces and heat pipes or super heat conduction pipes or super heat conduction plates or VC 211 are respectively arranged in different parts of the fan housing to express heat conduction between each other.

The cooling fan module 200 includes a drive control circuit board 240 and a drive module 250, the drive control circuit board 240 is electrically connected to the drive module 250, and the drive control circuit board 240 and the drive module 250 are electrically connected to an external power supply through a power cord or a power module; The module 250 is used to drive the impeller 220 to rotate. The electrodes of the secondary peltier element 10 are electrically connected to the drive control circuit board 240 or to an external circuit board.

In some embodiments, the drive control circuit board 240 is arranged on the outside of the fan housing to achieve waterproofing; the vent 201 is provided with a sealing ring for waterproofing; the drive module 250 is arranged on the drive control circuit board 240 and installed on the outside of the fan bottom case 214; The drive control circuit board 240, the drive module 250 and the fan impeller 220 are respectively set up on the inside and outside of the fan bottom case 214. When the fan sucks or enters water, the drive control circuit board 240 and the drive module 250 are not affected. The drive module 250 includes a motor, and the output shaft of the motor is coupled with the impeller shaft to drive the impeller 220 to rotate; or, the drive module 250 includes a motor stator coil, and a magnetic ring 25 is set inside the impeller, and the magnetic ring 25 is fixedly connected to the impeller 220, and the drive module 250 is energized Finally, a magnetic field is generated, and the rotation of the magnetic ring 25 drives the fan impeller to rotate.

The cooling fan module 200 is a radial flow fan or an axial flow fan; in the radial flow fan, the airflow generated by the rotation of the impeller 220 can be exhausted through the air vent on the volute after the airflow generated by the rotation of the impeller 220 circulates along the radial circle of the impeller rotation center; in the axial flow fan , the airflow generated by the rotation of the impeller 220 is exhausted from the vent at the top or the vent at the bottom of the volute along the direction of the central axis.

In some embodiments, the air vent 201 of the fan is provided with a cooling fin 212 , and the air duct of the cooling fin communicates with the cavity of the fan and the external environment.

The heat pipe (heat pipe) or vapor chamber (VC) in the present invention utilizes the heat conduction principle and the rapid heat transfer property of the cooling medium to quickly transfer the heat of the heating object to the outside of the heat source through the heat pipe. The heat is transferred through the evaporation and condensation of the liquid in the fully enclosed vacuum tube or vacuum plate, and the fluid principle such as capillary action is used to achieve the effect of refrigeration. It has high thermal conductivity, excellent isothermal property, heat flux density variability, heat flow A series of advantages such as direction reversibility. The heat exchanger composed of heat pipe or vapor chamber has the advantages of high heat transfer efficiency, compact structure, and small fluid resistance loss.

The super heat-conducting tube or super heat-conducting plate in the present invention is preferably an aluminum super-conducting heat-conducting tube/aluminum super-conducting heat-conducting plate. (Aluminum) superconducting heat pipe or (aluminum) superconducting heat plate, or ALVC superconducting pipe (plate), uses evaporative cooling and gas-liquid phase change to conduct heat quickly. Compared with general heat pipes and VC vapor chambers, aluminum superconducting heat pipes/aluminum superconducting plates can form microgrooves or Microdentate or microporous channels act as capillary structures inside the superconducting conduit or superconducting plate. Aluminum superconductor (plate), that is, ALVC aluminum superconductor (plate), does not need to add copper powder inside, but can be filled with aluminum powder or aluminum silicon powder, etc., can be added with aluminum mesh, and sealed after being filled with refrigerant.

The specific embodiments are described below with reference to the accompanying drawings. The following embodiments are only technical solutions for those skilled in the art to understand and implement the present invention, and do not limit the present invention. The protection scope of the present invention shall be determined by the claims. The structures in the cooling fan module 200 of the following embodiments can be replaced, combined or improved, all of which belong to the scope of the disclosure of the present invention.

33-40, the cooling fan module 200 of the first embodiment of the present invention is a blower module, including a fan housing 210 with a cavity formed inside, an impeller 220 installed in the cavity, and an impeller 220 installed in the fan housing. The secondary semiconductor cooling element 10 on the top. The fan casing 210 includes a volute on the side elevation. The volute cover is arranged outside the impeller 220. The volute is a heat-conducting shell, and its inner wall is provided with a heat sink 212. constitute. In this embodiment, the volute as a whole is described as an example of an aluminum superconducting conduit or an aluminum superconducting plate.

Ventilation openings 201 are provided on the volute and top of the fan casing 210. The ventilation openings 201 connect the cavity with the external air path of the fan. The heat on the surface of the heat sink 212 is taken away, and finally discharged from the vents on the side elevation. Referring to Fig. 34, a number of vents 201 can also be formed on the bottom of the fan housing 210, that is, the bottom case 214, to assist the air intake. The air intake and the air outlet on the side elevation can also be interchanged, and there is no limit to the air intake and outlet.

In this embodiment, the fan casing 210 covers the side elevation volute and the bottom casing, and the top is opened as a vent. The side facade volute is formed by a single piece of heat pipe or super heat pipe or super heat conduction plate or VC 211 (as shown in Figure 35-37, Figure 39) to form an integral heat conduction shell, or it is made of multiple heat pipes or super heat conduction pipes or super heat conduction plates Or VC 211 (Figure 38) constitutes a heat conduction shell, heat pipe or super heat conduction pipe or super heat conduction plate or VC 211 is in close contact with heat sink 212 on the inner layer for heat conduction, heat pipe or super heat conduction pipe or super heat conduction plate or VC 211 and heat sink 212 They can be connected by welding or riveting or bonding or other methods for rapid heat transfer.

Preferably, the side facade volute is made of aluminum superconductor or aluminum superconducting plate 11, which can be spliced in one piece or multiple pieces to form a heat-conducting shell, and the through passage along the length direction inside each piece of aluminum superconducting conduit or aluminum superconducting plate 11 2110 is single-channel or multi-channel, each channel is sealed at both ends and filled with working fluid inside. The inner wall of each channel 2110 forms a plurality of fine bone-shaped microgrooves 2111, and the microgrooves 2111 communicate with the channel 2110 where the working fluid flows. A porous structure is formed inside the material. The pores and microgrooves 2111 create capillary action within the channel 2110. The channel 2110 does not need to add copper powder, but can be filled with aluminum powder or aluminum silicon powder, etc., can be added with aluminum mesh, and sealed after being filled with refrigerant. The holes, the microgrooves 2111 and the channels 2110 can all be formed simultaneously when the tube is formed through the aluminum material processing (extrusion) molding process, and form the capillary structure inside the aluminum superconducting tube or the aluminum superconducting plate 11 . The groove direction of the microgroove 2111 and the length direction of the channel 2110 can be arranged in the direction of impeller rotation (as shown in Figures 36-39 ), or vertically along the axial direction, as shown in Figure 40 .

The cooling fins 212 are one or more sets of heat conducting material fins, and the position, number and arrangement of the cooling fins can be set according to the space of the fan cavity. One or more groups of heat dissipation fins are integrally formed or welded or riveted or fixed by other fastening mechanisms to form a heat sink 212 of an integral structure; or one or more groups of heat-conducting material fins (such as aluminum/copper/graphene or other heat conduction fins) are arranged on the heat conduction plate to form a heat sink 212 of an integral structure. The shape of the heat sink 212 is adapted to the shape of the volute or heat pipe or super heat pipe or super heat conduction plate or VC 211. In this embodiment, the heat sink 212 is in the shape of a cylinder or ring as a whole, and is sleeved on the ring heat pipe or super heat pipe Or the inner wall of the heat conduction shell composed of super heat conduction plate or VC 211 is directly attached to each other or arranged through heat conduction parts to express heat transfer. The air vents on the side facade can be through the air duct between the fins of the cooling fins 212 to penetrate the outside and the inside of the cavity. The cooling fins 212 can be fixed outside the vents by a heat conducting plate or fixed on a heat pipe or a super heat conducting The inner wall of the heat conduction shell composed of tubes or super heat conduction plates or VC 211; or at the side elevation vents, the fins and heat pipes or super heat conduction pipes or super heat conduction plates or VC 211 are disconnected to form a channel connecting the fan cavity with the outside . In this embodiment, the uppermost heat sink is used as the upper casing of the fan to form an air passage with the bottom casing of the fan and the impeller group. The upper casing of the fan may not be provided separately, and the top is opened to form a vent.

The secondary semiconductor cooling element 10 includes a galvanic couple layer in the middle and hot surfaces (radiation surfaces) and cold surfaces at both ends. The heat surface of the secondary peltier cooling element is connected to the heat pipe or the super heat conduction pipe or the super heat conduction plate or the VC 211 in a rapid thermal conduction manner. The heat dissipation surface of the secondary semi-conductor cooling element 10 and the heat pipe or the super heat conduction pipe or the super heat conduction plate or VC 211 are attached to each other for heat transfer or the heat conduction plate is attached to each other for heat transfer, or the heat pipe or the super heat conduction tube or the super heat conduction plate The board or the outer wall of VC211 is directly used as the hot surface of the secondary semiconductor refrigeration unit, and the hot end circuit is arranged on it, which is welded and electrically connected with the galvanic layer to form the internal circuit of the second semiconductor refrigeration unit. In this embodiment, the thermal surface of the secondary semiconductor cooling element 10 is attached to the outer wall of the heat pipe or super heat conduction pipe or super heat conduction plate or VC 211 .

The impeller 220, the driving control circuit board 240 and the driving module 250 are installed on the fan bottom case 214. The driving module 250 adopts a motor, the output shaft of the motor is coupled with the central shaft 221 of the impeller, and the motor rotates forward and reversely to drive the impeller.

Referring to FIGS. 41-42 as an alternative, the secondary semiconductor cooling element 10 is arranged on the outer wall of the fan bottom case 214 , for example, the secondary semiconductor cooling element 10 is attached to the bottom casing 214 and arranged in contact. The fan bottom case 214 is a heat conduction member, which can be made of a heat conduction material such as a metal plate or a heat pipe or a VC or a superconducting plate, and a fast connection between the fan bottom case 214 and the heat pipe or super heat conduction pipe or super heat conduction plate or VC 211 on the side elevation thermally connected.

33-47, the cooling fan module 200 of the second embodiment of the present invention is an axial flow fan module, including a fan housing 210 with a cavity formed inside, an impeller 220 installed in the cavity, and an impeller 220 installed in the cavity. The secondary semiconductor cooling element 10 on the fan casing. The fan casing 210 includes a volute on the side elevation, and the volute as a whole is composed of a heat pipe or a super heat conducting pipe or a super heat conducting plate or VC 211 . The side elevation of the fan casing, that is, the volute is provided with heat pipes or super heat-conducting pipes or super heat-conducting plates or VC211; more preferably, the side elevation of the volute is composed of single-channel or multi-channel aluminum superconducting pipes or aluminum superconducting plates for heat conduction shell. The cooling fins 212 are arranged on the inner wall of the side elevation, and the fins of the cooling fins 212 are arranged circularly along the diameter direction, and the air ducts between the fins are connected along the axial direction. In the cavity, a circle of fins is arranged above the impeller 220 to form the top heat sink 212, and a circle of fins is arranged below to form the bottom heat sink 212. The air ducts of the upper and lower heat sinks are preferably aligned to form the top of the fan and The vent at the bottom is used for air inlet and outlet, and the impeller 220 rotates from the air channel of the top heat sink (inlet air vent) to suck air axially downward along the air channel of the bottom heat sink 212 (air outlet vent) Exhaust, air inlet and outlet directions can be reversed.

The cooling fan module 200 of the second embodiment is the same as that of the first embodiment. The side elevation housing, namely the volute, is formed by heat pipes or super heat conduction pipes or super heat conduction plates or VC 211 as a whole single piece or by splicing multiple pieces to form heat conduction. The shell and the cooling fins on the inner wall can be connected by welding or riveting or bonding or other fixing methods for rapid heat transfer. Preferably, the façade volute is made of a single-channel or multi-channel aluminum superconductor or aluminum superconducting plate to form a heat-conducting shell, and the inner wall of the single-channel or multi-channel 2110 of the aluminum superconducting tube or aluminum superconducting plate forms more than two fine bone shapes. Microgroove 2111; a plurality of micropores are formed in the wall material of the microgroove 2111. The channel 2110 and the groove direction of the porous microgroove 2111 are arranged along the axial direction of the rotation center of the impeller, which is consistent with the direction of the airflow generated by the rotation of the impeller.

The secondary semi-conductor cooling element 10 is arranged on the outer wall of the heat conduction shell of the side elevation, and its heat dissipation surface (heat surface) is connected with the heat pipe or super heat conduction pipe or super heat conduction plate or VC 211 of the side elevation in a rapid thermal conduction connection, or the heat pipe or The super heat conduction tube or super heat conduction plate or VC 211 is directly used as the heat dissipation surface (hot surface) of the secondary semiconductor refrigeration unit 10, and the outer wall is provided with a hot end circuit, which is electrically connected and welded with the semiconductor galvanic layer.

The impeller 220 is rotatably mounted by a fixed bracket 223 and a snap ring 222 provided in the cavity.

A drive control circuit board 240 and a drive module 250 are arranged outside the bottom of the volute. In this embodiment, the drive module 250 uses a motor, the output shaft of the motor is coupled to the central shaft 221 of the impeller, and the motor rotates forward and reverse to drive the impeller.

The heat dissipation fan module 200 of the present invention uses heat pipe/VC/(aluminum) super heat pipe/(aluminum) super heat conduction plate as the housing of the fan (it can be a side elevation, an upper cover, a bottom cover, a volute), and utilizes The characteristics of its phase change heat conduction make it quickly transfer the heat source to the cavity of the fan, and dissipate heat through the air flow generated when the fan impeller rotates. The invention effectively utilizes the internal space of the fan to make the product smaller in size and higher in heat dissipation efficiency; it is more effectively combined with the applied product and reduces the original shell material cost of the fan. The contact area between the heat sink and the air flow is enlarged. Under the condition of the same heat dissipation requirement, the present invention improves heat dissipation efficiency so as to reduce fan speed, current, noise and the like.

Another technical feature of the heat dissipation fan module 200 of the present invention is that when the application product is used for semiconductor refrigeration, the heat dissipation surface of the cooling element can be directly connected to the casing of the fan (that is, the heat conducting element: heat pipe/VC/(aluminum) super heat pipe / (aluminum) super heat conduction plate) fit (contact); effectively shorten the distance of heat transfer and speed up the transfer of heat. Make the effect of the applied product better.

Referring to Figures 48-54, the cooling fan module 200 of the third embodiment of the present invention can be used as a waterproof fan, preferably a magnetic fan module, including a fan housing 210 with a cavity formed inside, and a fan housing 210 installed in the cavity. The impeller 220 and the secondary semiconductor cooling element 10 installed on the fan casing. The fan case 210 includes a volute on the side elevation, an upper case 215 on the top of the volute, and a bottom case 214 on the bottom, which together enclose a cavity inside the fan. The arc part of the volute is composed of heat pipes or super heat-conducting pipes or super-conducting plates or VC 211; more preferably, the side elevation of the volute, that is, the volute, consists of single-channel or multi-channel aluminum superconductors or aluminum superconducting plates Curved heat conduction shell. The cooling fins 212 are arranged on the inner wall of the arc-shaped heat-conducting housing on the side elevation. The fins of the cooling fins 212 are arranged in an arc shape along the diameter direction, and the air ducts between the fins pass through along the arc shape direction in the radial direction. In this embodiment, the fan vents 201 are arranged on the side elevation volute, and are used for air inlet and outlet. The upper case and the lower case are not provided with vents to facilitate waterproofing.

The heat dissipation fan module 200 of the third embodiment is similar to the first and second embodiments. The arc-shaped heat conduction shell of the side elevation volute is composed of a heat pipe or a super heat conduction pipe or a super heat conduction plate or VC 211, which is made of a whole single piece or made of Multi-piece splicing forms a heat-conducting shell, and the heat sinks on the inner wall can be connected by welding or riveting or bonding or other fixing methods for rapid heat transfer. Preferably, the façade volute is made of a single-channel or multi-channel aluminum superconductor or an aluminum superconducting plate to form an arc-shaped heat-conducting shell, and the inner wall of the single-channel or multi-channel 2110 of the aluminum superconductor or the aluminum superconducting plate forms more than two fine lines. Bone-shaped microgrooves 2111; a plurality of micropores are formed in the wall material of the microgrooves 2111. The channel 2110 and the groove direction of the porous microgroove 2111 are arranged along the radial arc direction of the rotation center of the impeller, which is consistent with the direction of the airflow generated by the rotation of the impeller.

The secondary semi-conductor cooling element 10 is arranged on the outer wall of the heat conduction shell of the side elevation, and its heat dissipation surface (heat surface) is connected with the heat pipe or super heat conduction pipe or super heat conduction plate or VC 211 of the side elevation in a rapid thermal conduction connection, or the heat pipe or The super heat conduction tube or super heat conduction plate or VC 211 is directly used as the heat dissipation surface (hot surface) of the secondary semiconductor refrigeration unit 10, and the outer wall is provided with a hot end circuit, which is electrically connected and welded with the semiconductor galvanic layer. Alternatively, the secondary peltier element 10 is disposed on the upper shell 215 or the bottom shell 214, and the upper shell 215 or the bottom shell 214 is connected to the arc-shaped heat conduction shell through rapid heat transfer. The hot surface of the secondary semi-conductor cooling element is arranged on the fan casing in adhering and contacting manner.

The impeller 220 is located in the cavity and installed on the bottom shell 214, the center of the impeller 220 is provided with a shaft hole, the shaft hole is fixed with a shaft sleeve 229, the inner wall of the shaft sleeve 229 is formed with a convex ring, the upper bearing 228 and the lower bearing 226 are installed on the The sleeve 229 is located above and below the protruding ring respectively. The inside of the impeller 220 is provided with a magnetic ring. Specifically, an annular cavity is formed outside the shaft sleeve 229 inside the impeller. The magnetic ring is sleeved on the inner wall of the outer ring of the annular cavity inside the impeller. The impeller 220 is fixed.

The central shaft 221 of the impeller is arranged on the bottom shell 214, and a hollow annular boss is formed on the bottom shell. In the inner shaft sleeve, it cooperates with the bearing and the protruding ring, and the top of the central shaft 221 is formed with a slot, which is locked by the snap ring 222 to prevent it from coming off. The top of the hollow annular boss on the bottom case 214 is fitfully inserted into the annular cavity inside the impeller 220, the drive module 250 is installed in the hollow cavity defined by the hollow annular boss on the bottom case 214, and the drive control circuit board 240 is located at outside the bottom case 214. In this embodiment, a drive control circuit board 240 and a drive module 250 are arranged outside the bottom of the volute. The drive module 250 includes a motor stator coil 251. After the drive module is powered on, a magnetic field is generated to drive the fan impeller 220 to rotate. The circuit board 240 and the fan impeller 220 are respectively installed on the inside and outside of the fan bottom case 214, so when the fan sucks or enters water, the driving module 250 and the driving control circuit board 240 are not affected. In this embodiment, the drive module 250 and the drive control circuit board 240 are separated from the fan group, and the drive control circuit board 240 is arranged outside the fan housing 210 to achieve waterproofing. When the wind passes through the air duct, water will not affect the drive control circuit board 240. make an impact. When applied to a product, a sealing ring may be provided at the vent in this embodiment, so as to realize waterproof between the product and the fan module 200 .

In the above embodiments, "cooling conduction" and "heat conduction", "heat transfer" or "heat transfer" can be interpreted as having the same meaning, both are heat transfer, and can be used interchangeably. The symbol "/" means "or".

It can be understood that in the foregoing embodiments, the orientation words used are for example "up", "down", "top", "bottom", "left", "right", "vertical", "horizontal", "horizontal", "front", "rear", etc. The relative positions of the components shown in the drawings are used, and are not limited to absolute geographical orientations.

The technical features of the above embodiments can be combined, transformed or replaced to obtain different embodiments, and these embodiments all belong to the disclosure scope of the embodiments of the present invention. Some common structures or similar structures in the above embodiments are described in some embodiments, but not described in other embodiments, these common structures or similar structures are also applicable to these embodiments, and all belong to the disclosure scope of the embodiments of the present invention.

In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it can be a mechanical connection, an electrical connection or a connection that can transmit data; it can be a direct connection or an indirect connection through an intermediary, it can be the internal communication of two components or the interaction of two components relation. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes, modifications and substitutions can be made to these embodiments without departing from the principle and spirit of the present invention. All modifications and variations shall belong to the scope of the present invention; the protection scope of the present invention is defined by the appended claims and their equivalent scope.

Claims (12)

1. The utility model provides a two-stage refrigeration module, includes one-level semiconductor refrigeration spare, its characterized in that: the refrigeration module also comprises a secondary semiconductor part and a cold conducting part; the primary and secondary semiconductor refrigerating pieces comprise a middle galvanic couple layer and hot surfaces and cold surfaces at two ends; the cold guide piece is connected between the primary semiconductor refrigerating piece and the secondary semiconductor refrigerating piece in a rapid cold guide mode; the cold conducting piece is a heat transfer structural piece.

2. A two-stage refrigeration module as set forth in claim 1 wherein: the two ends of the cold conducting piece are respectively connected with the hot surface of the primary semiconductor refrigerating piece and the cold surface of the secondary semiconductor refrigerating piece in a rapid heat transfer mode; the heat transfer structural part is one or a combination of a plurality of heat conduction elements, heat pipes, temperature equalizing plates, super heat conduction pipes and super heat conduction plates which are made of heat conduction materials.

3. A two-stage refrigeration module as recited in claim 2 wherein:

the super heat conduction pipe is an aluminum superconducting pipe, and the super heat conduction plate is an aluminum superconducting plate;

two ends of the aluminum superconducting plate or the aluminum superconducting pipe are sealed, and working liquid is packaged inside the aluminum superconducting plate or the aluminum superconducting pipe;

more than two microgrooves are formed on the inner wall of the aluminum superconducting plate or the aluminum superconducting pipe during aluminum material forming;

and forming a microporous structure in the aluminum superconducting plate or the aluminum superconducting pipe material during aluminum material forming.

4. A two-stage refrigeration module as recited in any of claims 1-3 wherein:

the refrigeration module comprises a heat conduction structure and a radiating fin; the heat conduction structure is one or a combination of a plurality of heat conduction elements, heat pipes, temperature equalization plates, super heat conduction pipes and super heat conduction plates which are made of heat conduction materials;

the heat conducting structure is connected with the radiating fin in a rapid heat transfer mode;

the heat conducting structure is connected with the hot surface of the secondary semiconductor refrigerating piece in a rapid heat transfer mode; or, the heat conducting structure is directly used as the hot surface of the secondary semiconductor refrigerating piece by arranging a hot end circuit of the secondary semiconductor refrigerating piece on the heat conducting structure and welding and electrically connecting the hot end circuit with the galvanic couple layer of the secondary semiconductor refrigerating piece;

the refrigeration module also comprises a fan; the fan comprises a shell and an impeller in the shell;

the heat conducting structure and/or the heat sink is disposed at the air vent of the fan or as a part of the fan housing.

5. The two-stage refrigeration module of claim 4, wherein:

the heat conduction structure comprises a plurality of aluminum superconducting plates or aluminum superconducting pipes, the aluminum superconducting plates or the aluminum superconducting pipes are single pipes, and a single channel is formed inside the aluminum superconducting plates or the aluminum superconducting pipes;

the aluminum superconducting plate or the aluminum superconducting pipe is bent in a plane or in a special-shaped 3D manner and is matched with the installation space;

the heat conduction structure also comprises a heat conduction plate, the plurality of aluminum superconducting plates or aluminum superconducting pipes are combined with the heat conduction plate, and the plurality of aluminum superconducting plates or aluminum superconducting pipes are distributed to comprise at least two different directions or angles so as to reduce the defect that the heat conduction effect is poor due to the effect of the antigravity direction;

the heat sink comprises one or more groups of fins of heat conductive material; the heat conducting plate is arranged in the groove on the radiating fin or at the top of the radiating fin, or the radiating fin and the heat conducting plate are arranged on another heat conducting part.

6. The two-stage refrigeration module of claim 5, wherein:

the heat conducting plate is provided with a plurality of open grooves, the aluminum superconducting plates or the aluminum superconducting pipes are matched with the open grooves and correspondingly arranged in the open grooves, and the wall surfaces are mutually contacted to realize rapid heat transfer;

the aluminum superconducting plate or the aluminum superconducting pipe is welded or riveted with the slot to increase the contact area;

the second-level semiconductor refrigeration piece is arranged on the heat conducting plate: the hot surface of the secondary semiconductor refrigerating piece is attached to the outer wall of the heat conducting plate, so that the heat of the hot surface is directly conducted to the heat conducting plate; or the hot surface of the secondary semiconductor refrigeration piece is arranged on the outer wall of the heat conducting plate through the heat conducting piece, and the heat of the hot surface is quickly conducted to the heat conducting plate through the heat conducting piece; or the heat conducting plate is used as a hot surface, and a hot end circuit of the secondary semiconductor refrigerating piece is arranged on the heat conducting plate and is welded and electrically connected with the PN galvanic couple particles of the galvanic couple layer;

the plurality of aluminum superconducting plates or aluminum superconducting pipes use two different directions or angles on an XY plane, or have a certain angle of intersecting line form, or annular or staggered or circulating design.

7. A two stage refrigeration module as recited in any of claims 1-3 wherein:

the secondary semiconductor refrigerating piece is used for dissipating heat by the cooling fan module;

the radiating fan module comprises a fan shell and an impeller, wherein a cavity is formed in the fan shell, and the impeller is arranged in the cavity; a plurality of ventilation openings are formed in the fan shell, and the ventilation openings are used for communicating the cavity with an external air path of the fan;

at least part of the fan housing is formed by a heat-conducting casing made of a material selected from the group consisting of: one or more of a heat conducting element, a heat pipe, a temperature equalizing plate, a super heat conducting pipe and a super heat conducting plate made of heat conducting materials are integrally formed in a single-piece mode or spliced in multiple pieces;

the hot surface of the secondary semiconductor refrigeration piece is in heat transfer connection with the heat conduction shell; or the heat-conducting shell is provided with a hot-end circuit of the secondary semiconductor refrigerating piece, and the hot-end circuit is welded and electrically connected with the galvanic couple layer of the secondary semiconductor refrigerating piece, so that the heat-conducting shell is directly used as the hot surface of the secondary semiconductor refrigerating piece.

8. The two stage refrigeration module of claim 7, wherein: the super heat conduction pipe is an aluminum superconducting pipe, and the super heat conduction plate is an aluminum superconducting plate; the heat dissipation fan module comprises a heat dissipation fin, and the heat dissipation fin is connected with the heat conduction shell in a rapid heat transfer mode; the air channel of the radiating fin is communicated with the ventilation opening and the cavity of the fan; the side facade shell of the fan shell comprises the heat-conducting shell.

9. The two-stage refrigeration module of claim 8, wherein:

the side vertical surface shell of the fan shell comprises the heat-conducting shell consisting of single-channel or multi-channel aluminum superconducting pipes or aluminum superconducting plates;

the radiating fins are arranged on the inner wall of the side vertical surface shell of the fan shell; the air duct direction of the radiating fins is the rotating direction or the axial direction of the impeller.

10. A photon beauty instrument comprises a machine body provided with a plurality of ventilation openings, wherein a light source component, a power supply component and a control circuit board are arranged in the machine body; the light source component and the power supply component are electrically connected with the control circuit board; a plurality of ventilation openings of the machine body are used for air inlet and air outlet and form a ventilation channel with the space in the machine body; the front end of the machine body is a working surface; the method is characterized in that: the fuselage is also provided with a two-stage refrigeration module as claimed in any one of claims 1~9, and the one-stage semiconductor refrigeration sheet is directly used as the working surface or used for refrigerating the working surface.

11. The photonic cosmetic apparatus of claim 10, wherein:

when the first-level semiconductor refrigerating sheet is directly used as a working face: the first-stage semiconductor refrigerating piece takes a transparent crystal as a cold surface, the cold surface is directly taken as a working surface, and a hot surface and a galvanic couple layer of the first-stage semiconductor refrigerating piece are provided with light transmission windows to ensure that the first-stage refrigerating piece has light transmission; or the cold surface, the hot surface and the galvanic couple layer of the primary semiconductor refrigerating sheet jointly define a light-transmitting window, and photons generated by the light source component are transmitted out of the working surface from the light-transmitting window;

when the first-stage semiconductor refrigerating piece refrigerates the working surface: the cold surface of the primary semiconductor refrigerating sheet is in contact with the working surface for heat transfer; or the cold surface of the primary refrigeration piece is connected with the working surface in a rapid heat transfer mode through a heat transfer structural piece.

12. The photonic cosmetic apparatus of claim 10, wherein:

the two-stage refrigeration module comprises a fan and is positioned in a ventilation channel in the machine body;

the light source component comprises a lamp tube and a reflecting cup, a ventilation channel in the reflecting cup is communicated with a ventilation channel of the fan and is communicated with the ventilation channel in the machine body to form a heat dissipation ventilation channel of the light source component, and the fan promotes the heat dissipation of the light source component;

one side of the reflecting cup is provided with a radiating fin or a heat conducting piece; a plurality of ventilation openings are formed on the shell of the fan; one of the ventilation openings is provided with a radiating fin or a heat conducting piece of the reflecting cup, and a ventilation channel of the fan is communicated with a ventilation channel in the machine body to form a first ventilation channel for radiating heat for the reflecting cup; the other ventilation opening of the fan is communicated with the air channel in the reflecting cup, and the ventilation channel of the fan is communicated with the ventilation channel in the machine body to form a second ventilation channel which is used for radiating heat for the reflecting cup and the lamp tube;

the photon beauty treatment is a hair removal instrument, a photon skin tendering instrument, a leading-in and leading-out beauty treatment instrument or a radio frequency beauty treatment instrument.

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