CN115854584A

CN115854584A - Two-stage refrigeration module and photon beauty instrument

Info

Publication number: CN115854584A
Application number: CN202211666154.5A
Authority: CN
Inventors: 周莹; 李兵
Original assignee: Shenzhen Jiayukang Medical Instrument Co ltd
Current assignee: Shenzhen Jiayukang Medical Instrument Co ltd
Priority date: 2022-10-17
Filing date: 2022-12-23
Publication date: 2023-03-28
Also published as: CN219390650U; CN116839397A; CN219083434U

Abstract

The invention relates to a two-stage refrigeration module and a photon beauty instrument, wherein the two-stage refrigeration module comprises a first-stage semiconductor refrigeration piece, a second-stage semiconductor piece and a cold conduction piece; the primary and secondary semiconductor refrigerating elements comprise a middle galvanic couple layer, and hot surfaces and cold surfaces at two ends; the cold guide piece is connected between the primary semiconductor refrigerating piece and the secondary semiconductor refrigerating piece in a quick cold guide mode; the cold conducting piece is a heat transfer structural piece. The photon beauty instrument adopts the two-stage refrigeration module, and the one-stage semiconductor refrigeration piece is directly used as the front working face of the photon beauty instrument or used for refrigerating the front working face of the photon beauty instrument. By adopting the secondary refrigeration module, the problems that the cooling effect of the fan is influenced and the like due to the uneven heat conduction efficiency, slow heat conduction, poor heat conduction timeliness, reduction of the refrigeration speed, imbalance of the heat at the front end, the rear end, the left end, the right end or the upper end and the lower end of the radiating fin when the heat is conducted to the radiating fin of the primary semiconductor refrigeration piece through the heat transfer structural piece can be solved.

Description

Two-stage refrigeration module and photon beauty instrument

Technical Field

The invention relates to the field of beauty equipment, in particular to a two-stage refrigeration module and a photon beauty instrument.

Background

The light source component generates light waves which are emitted from a light-emitting window of a working head part of the beauty instrument to carry out beauty treatment on the skin surface contacted (or not directly contacted) with the end face of the working head part, such as depilation, skin tendering, speckle removal, inflammation diminishing, blood vessel softening, wrinkle removal, skin reddening, acne treatment, vascular lesion treatment, pigment lesion treatment or single or combined radio frequency physical therapy and other functions. Some portable or handheld beauty instruments on the market at present have poor heat dissipation effect inside the machine body, influence the work of the beauty instrument and fail to achieve the expected beauty effect; the fuselage inner structure is complicated, and the working face refrigeration effect is not good, perhaps the working face high temperature leads to the burning skin, and user experience is not good enough.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: the utility model provides a two-stage refrigeration module and photon beauty instrument, solves current beauty instrument heat dissipation and working face refrigeration problem.

In order to solve the technical problems, the invention adopts the following technical scheme:

a two-stage refrigeration module comprises a first-stage semiconductor refrigeration piece, a second-stage semiconductor piece and a cold conducting piece; the primary and secondary semiconductor refrigerating pieces comprise a middle galvanic couple layer and hot surfaces and cold surfaces at two ends; the cold guide piece is connected between the primary semiconductor refrigerating piece and the secondary semiconductor refrigerating piece in a rapid cold guide mode; the cold conducting piece is a heat transfer structural piece.

Furthermore, two ends of the cold guide piece are respectively connected with the hot surface of the primary semiconductor refrigerating piece and the cold surface of the secondary semiconductor refrigerating piece in a rapid heat transfer mode; the heat transfer structural part is one or a combination of a plurality of heat conduction elements, heat pipes, temperature equalizing plates, super heat conduction pipes and super heat conduction plates which are made of heat conduction materials.

In some embodiments, the super heat conducting tube is an aluminum superconducting tube and the super heat conducting plate is an aluminum superconducting plate;

two ends of the aluminum superconducting plate or the aluminum superconducting pipe are sealed, and working liquid is packaged inside the aluminum superconducting plate or the aluminum superconducting pipe; more than two microgrooves are formed on the inner wall of the aluminum superconducting plate or the aluminum superconducting pipe during aluminum material forming; and forming a microporous structure in the aluminum superconducting plate or the aluminum superconducting pipe material during aluminum material forming.

In some embodiments, the refrigeration module comprises a thermally conductive structure and a heat sink; the heat conduction structure is one or a combination of a plurality of heat conduction elements, heat pipes, temperature equalization plates, super heat conduction pipes and super heat conduction plates which are made of heat conduction materials; the heat conducting structure is connected with the radiating fin in a rapid heat transfer mode; the heat conducting structure is connected with the hot surface of the secondary semiconductor refrigerating piece in a rapid heat transfer mode, or the heat conducting structure is directly used as the hot surface of the secondary semiconductor refrigerating piece through arranging a hot end circuit of the secondary semiconductor refrigerating piece on the heat conducting structure to be welded and electrically connected with an electric coupling layer of the secondary semiconductor refrigerating piece, so that the hot surface of the secondary semiconductor refrigerating piece can rapidly dissipate heat; the refrigeration module also comprises a fan; the fan comprises a shell and an impeller in the shell; the heat conducting structure and/or the heat sink is disposed at the air vent of the fan or as a part of the fan housing.

In some embodiments, the heat conducting structure comprises a plurality of aluminum superconducting plates or aluminum superconducting pipes, and the aluminum superconducting plates or the aluminum superconducting pipes are single pipes and form a single channel inside; the aluminum superconducting plate or the aluminum superconducting pipe is bent in a plane or in a special-shaped 3D manner and is matched with the installation space; the heat conduction structure also comprises a heat conduction plate, the plurality of aluminum superconducting plates or aluminum superconducting pipes are combined with the heat conduction plate, and the plurality of aluminum superconducting plates or aluminum superconducting pipes are distributed to comprise at least two different directions or angles so as to reduce the defect that the heat conduction effect is poor due to the effect of the antigravity direction; the heat sink comprises one or more groups of heat conductive material fins; the heat conducting plate is arranged in the groove on the radiating fin or at the top of the radiating fin, or the radiating fin and the heat conducting plate are arranged on another heat conducting part.

In some embodiments, the heat conducting plate is provided with a plurality of open grooves, the plurality of aluminum superconducting plates or aluminum superconducting pipes are matched with the open grooves and correspondingly arranged in the open grooves, and the wall surfaces are mutually contacted to realize rapid heat transfer; the aluminum superconducting plate or the aluminum superconducting pipe is welded or riveted with the slot to increase the contact area; the second-level semiconductor refrigeration piece is arranged on the heat conducting plate: the hot surface of the secondary semiconductor refrigerating piece is attached to the outer wall of the heat conducting plate, so that the heat of the hot surface is directly conducted to the heat conducting plate; or the hot surface of the secondary semiconductor refrigeration piece is arranged on the outer wall of the heat conducting plate through the heat conducting piece, and the heat of the hot surface is quickly conducted to the heat conducting plate through the heat conducting piece; or the heat conducting plate is used as a hot surface, and a hot end circuit of the secondary semiconductor refrigerating piece is arranged on the heat conducting plate and is welded and electrically connected with the PN galvanic couple particles of the galvanic couple layer; the plurality of aluminum superconducting plates or aluminum superconducting pipes use two different directions or angles on an XY plane, or have a certain angle of intersecting line form, or annular or staggered or circulating design.

In some embodiments, the secondary semiconductor refrigeration element is cooled by a cooling fan module; the radiating fan module comprises a fan shell and an impeller, wherein a cavity is formed in the fan shell, and the impeller is arranged in the cavity; the fan shell is provided with a plurality of ventilation openings which communicate the cavity with an external air path of the fan; at least part of the fan housing is formed by a heat-conducting casing made of a material selected from the group consisting of: one or more of a heat conducting element, a heat pipe, a temperature equalizing plate, a super heat conducting pipe and a super heat conducting plate made of heat conducting materials are integrally formed in a single-piece mode or spliced in multiple pieces; the heat surface of the secondary semiconductor refrigeration piece is in heat transfer connection with the heat conduction shell, or the heat conduction shell is directly used as the heat surface of the secondary semiconductor refrigeration piece.

In some embodiments, the super heat conducting pipe is an aluminum superconducting pipe, and the super heat conducting plate is an aluminum superconducting plate; the heat dissipation fan module comprises a heat dissipation sheet, and the heat dissipation sheet is connected with the heat conduction shell in a rapid heat transfer mode; the air duct of the radiating fin is communicated with the ventilation opening of the fan and the cavity; the side facade shell of the fan shell comprises the heat-conducting shell.

In some embodiments, the side facade housing of the fan housing comprises said thermally conductive shell of single or multiple channel aluminum superconducting pipes or plates; the radiating fins are arranged on the inner wall of the side vertical surface shell of the fan shell; the air duct direction of the radiating fins is the rotating direction or the axial direction of the impeller.

The invention also relates to a photon beauty instrument, which comprises a machine body provided with a plurality of ventilation openings, wherein a light source component, a power supply component and a control circuit board are arranged in the machine body; the light source component and the power supply component are electrically connected with the control circuit board; a plurality of ventilation openings of the machine body are used for air inlet and air outlet and form a ventilation channel with the space in the machine body; the front end of the machine body is a working surface; the machine body is also internally provided with the two-stage refrigeration module, and the one-stage semiconductor refrigeration piece is directly used as the working surface or used for refrigerating the working surface.

Further, when the primary semiconductor refrigeration piece is directly used as a working face: the first-stage semiconductor refrigerating piece takes transparent crystals as a cold surface, the cold surface is directly taken as a working surface, and light transmission windows are arranged on a hot surface and a galvanic couple layer of the first-stage semiconductor refrigerating piece, so that the first-stage refrigerating piece has light transmission; or the cold surface, the hot surface and the galvanic couple layer of the primary semiconductor refrigerating sheet jointly define a light transmission window, and photons generated by the light source component are transmitted out of the working surface from the light transmission window. When the first-stage semiconductor refrigerating piece refrigerates the working surface: the cold surface of the primary semiconductor refrigerating sheet is in contact with the working surface for heat transfer; or the cold surface of the primary refrigeration piece is connected with the working surface in a rapid heat transfer mode through a heat transfer structural piece.

In some embodiments, the two-stage refrigeration module includes a fan located in a ventilation channel within the fuselage; the light source component comprises a lamp tube and a reflecting cup, a ventilation channel in the reflecting cup is communicated with a ventilation channel of the fan and is communicated with the ventilation channel in the machine body to form a heat dissipation ventilation channel of the light source component, and the fan promotes the heat dissipation of the light source component; one side of the reflecting cup is provided with a radiating fin or a heat conducting piece; a plurality of ventilation openings are formed on the shell of the fan; one of the ventilation openings is provided with a radiating fin or a heat conducting piece of the reflecting cup, and a ventilation channel of the fan is communicated with a ventilation channel in the machine body to form a first ventilation channel for radiating heat for the reflecting cup; the other ventilation opening of the fan is communicated with the air channel in the reflecting cup, and the ventilation channel of the fan is communicated with the ventilation channel in the machine body to form a second ventilation channel which is used for radiating heat for the reflecting cup and the lamp tube.

In some embodiments, the photonic beauty instrument is a hair removal instrument, a photonic skin rejuvenation instrument, an introduction and removal beauty instrument, or a radio frequency beauty instrument.

The invention has the beneficial effects that: the two-stage refrigeration module realizes the effects of rapid refrigeration and heat dissipation.

The present invention is described in further detail below with reference to the attached drawing figures.

Drawings

Fig. 1 is a perspective view of a beauty instrument according to a first embodiment of the present invention.

Fig. 2 is a perspective view of the beauty instrument of the first embodiment of the present invention with the upper case removed.

Fig. 3 is a schematic view of the internal structure of the beauty instrument according to the first embodiment of the present invention.

Fig. 4 is a schematic view of an air duct of the beauty instrument according to the first embodiment of the present invention.

Fig. 5 is a schematic view of another embodiment of the cosmetic instrument vent of the present invention.

Fig. 6 is a schematic view of an internal air duct of the beauty instrument in the embodiment shown in fig. 5.

Fig. 7 is an exploded view of the beauty instrument of the embodiment shown in fig. 1.

Fig. 8 is a schematic structural diagram of a refrigeration module according to a first embodiment of the present invention.

Figure 9 is a perspective view of a first embodiment of the refrigeration module of the present invention.

Figure 10 is a partial exploded view of the refrigeration module of the present invention.

Fig. 11 is a perspective view of the refrigeration module of the present invention.

Figure 12 is a partial exploded view of the refrigeration module of the present invention.

Fig. 13 is a schematic view of a part of the structure of the refrigeration module of the present invention.

Fig. 14 is a schematic view of a first embodiment of a refrigeration module according to the present invention, wherein fig. 14 (a) and 14 (b) are respectively shown from different viewing angles.

Fig. 15 is a schematic structural view of an alternative embodiment of the refrigeration module of the present invention, wherein fig. 15 (a) and 15 (b) are different embodiments, respectively.

Fig. 16 is a perspective view of a beauty instrument according to a second embodiment of the present invention.

Fig. 17 is a perspective view of the beauty instrument of the second embodiment of the present invention with the upper case removed.

Fig. 18 is a schematic view of the internal structure of the beauty instrument according to the second embodiment of the present invention.

Fig. 19 is an exploded view of the beauty instrument according to the second embodiment of the present invention.

Fig. 20-22 are schematic structural views of a second embodiment of the refrigeration module of the present invention.

Fig. 23 isbase:Sub>A schematic structural view of an aluminum superconducting plate or an aluminum superconducting tube of the refrigeration module according to the embodiment of the present invention, in which fig. 23 (base:Sub>A) isbase:Sub>A perspective view ofbase:Sub>A single aluminum superconducting plate or aluminum superconducting tube, and fig. 23 (b) isbase:Sub>A sectional view of fig. 23 (base:Sub>A) taken alongbase:Sub>A-base:Sub>A.

Fig. 24-26 are schematic structural views of a refrigeration module according to a third embodiment of the present invention.

Fig. 27 is a perspective view of the beauty instrument of the third embodiment of the present invention with the front case removed.

Fig. 28 is a perspective view of the beauty instrument of the fourth embodiment of the present invention with the front shell removed.

Figure 29 is an exploded view of a fourth embodiment of the refrigeration module of the present invention.

Fig. 30 is a perspective view of a refrigeration module according to a fourth embodiment of the present invention.

Fig. 31 is a schematic view of the internal structure of the beauty instrument according to the fifth embodiment of the present invention.

Fig. 32 is an exploded view of the beauty instrument according to the fifth embodiment of the present invention.

Fig. 33 is a perspective view of the cooling fan module according to the embodiment of the invention.

Fig. 34 is a perspective view of another perspective view of the cooling fan module according to the embodiment of the invention.

Fig. 35 is an exploded view of the heat dissipation fan module according to the embodiment of the invention.

Fig. 36 is a schematic cross-sectional view of a heat dissipation fan module according to an embodiment of the invention.

Fig. 37 is a schematic structural view of a side elevational volute of the cooling fan module according to the embodiment of the invention.

Fig. 38 is a schematic view of an alternative configuration to the embodiment shown in fig. 37.

Fig. 39-40 are schematic views of alternative configurations of the embodiment shown in fig. 37. .

Fig. 41-42 are schematic structural views of alternative embodiments of the heat dissipation fan module shown in fig. 33-34.

Fig. 43 is a perspective view of a heat dissipation fan module according to an alternative embodiment of the invention.

Fig. 44 is a schematic diagram of the structure of the alternative embodiment of fig. 33.

Fig. 45 is a schematic cross-sectional view of a heat dissipation fan module according to an alternative embodiment of the invention.

Fig. 46 is a perspective view of the heat dissipating fan module of fig. 45 with a housing portion removed from an outer wall thereof.

Fig. 47 is an exploded view of the heat dissipation fan module shown in fig. 45.

Fig. 48-49 are perspective views of different viewing angles of a cooling fan module according to another alternative embodiment of the present invention.

Fig. 50-51 are cross-sectional views of the cooling fan module shown in fig. 48-49 at different positions.

Fig. 52 is an exploded view of a portion of the radiator fan module shown in fig. 48-49.

Fig. 53 is an exploded view of the radiator fan module of fig. 48-49.

Fig. 54 is an exploded view of the radiator fan module of fig. 48-49.

Detailed Description

It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict, and the present invention is further described in detail with reference to the accompanying drawings and specific embodiments.

Referring to fig. 1 to 54, the present invention provides a refrigeration module 1, a cooling fan module 200, and a photonic beauty instrument 100 using the refrigeration module/cooling fan module 200. The refrigeration module 1 comprises a semiconductor refrigeration piece 10/10', wherein the semiconductor refrigeration piece 10/10' comprises a middle galvanic couple layer 12, a hot surface 11' and a cold surface 13 at two ends; the refrigeration module 1 further comprises a cold guide piece 15, one end of the cold guide piece 15 is connected with the cold surface 13 of the semiconductor refrigeration piece in a rapid heat transfer mode, and the other end of the cold guide piece 15 is used for being connected with a surface to be refrigerated in a rapid cold guide mode; the cold conducting part 15 is a heat transfer structural part or a heat pipe or a VC temperature equalizing plate or a super heat conducting pipe or a super heat conducting plate. Preferably, the super heat conduction pipe is an aluminum superconducting pipe, and the super heat conduction plate is an aluminum superconducting plate. In some embodiments, the cold-conducting piece 15 is a first cold-conducting piece, and the refrigeration module 1 further includes a second cold-conducting piece 15'; the second cold guide piece 15' is arranged between the first cold guide piece 15 and the surface to be cooled and is connected with the first cold guide piece 15 in a quick cold guide way; the second heat conducting and cooling member 15' is a heat conducting material pipe or a heat conducting material plate or an aluminum superconducting pipe or an aluminum superconducting plate or a heat pipe or VC.

As a preferred embodiment of the present invention, it relates to a two-stage refrigeration module 1, comprising first and second semiconductor refrigeration parts 10'/10 and a cold conducting part 15; the primary and secondary semiconductor refrigerating elements 10'/10 respectively comprise a middle galvanic couple layer 12, and hot surfaces 11' and cold surfaces 13 at two ends; the cold guide piece 15 is connected between the primary semiconductor refrigerating piece 10' and the secondary semiconductor refrigerating piece 10 in a quick cold guide mode; the cold conductive member 15 is a heat transfer structural member. The two ends of the cold conducting piece 15 are respectively connected with the hot surface 11 'of the primary semiconductor refrigerating piece 10' and the cold surface 13 of the secondary semiconductor refrigerating piece 10 in a rapid heat transfer mode; the heat transfer structure is one or a combination of more of a heat conduction element, a heat pipe, a temperature equalizing plate, a super heat conduction pipe and a super heat conduction plate which are made of heat conduction materials. Further, the refrigeration module 1 includes a heat conducting structure 19 and a heat sink 16; the heat conducting structure 19 is one or a combination of several heat conducting elements, heat pipes, temperature equalizing plates, super heat conducting pipes and super heat conducting plates made of heat conducting materials; the heat conducting structure 19 is connected to the heat sink 16 in a rapid heat transfer manner. The heat-conducting structure 19 is connected in rapid heat-transferring manner to the hot side 11' of the secondary semiconductor cooling element 10; or, the heat-end circuit of the secondary semiconductor refrigerating element 10 is arranged on the heat-conducting structure 19 and is welded and electrically connected with the electric coupling layer 12 of the secondary semiconductor refrigerating element 10, so that the heat-conducting structure 19 is directly used as the hot surface 11' of the secondary semiconductor refrigerating element 10. The two-stage refrigeration module 1 further comprises a fan 18 or a cooling fan assembly 200; fan 18 or heat sink fan assembly 200 includes a fan housing 180/210 and an impeller 181/220 within the housing. The heat conducting structure 19 and/or the heat sink 16 are disposed at the vents 182/201 of the fan or as part of the fan housing 180/210.

Referring to fig. 33-53 in combination, in another preferred embodiment of the present invention, the two-stage semiconductor cooling device 10 of the two-stage refrigeration module 1 is cooled by the cooling fan module 200. The heat dissipation fan module 200 includes a fan housing 210 and an impeller 220, wherein the fan housing 210 has a cavity therein, and the impeller 220 is mounted in the cavity; a plurality of ventilation openings 201 are formed in the fan shell 210, and the ventilation openings 201 communicate the cavity with an external air path of the fan; at least a portion of the fan housing 210 is formed by a thermally conductive outer shell 211, the thermally conductive outer shell 211 being formed of a material selected from the group consisting of: one or more of heat conducting elements, heat pipes, temperature equalizing plates, super heat conducting pipes and super heat conducting plates made of heat conducting materials are formed by integrally and monolithically splicing or by multiple pieces. The hot side 11' of the secondary semiconductor cooling element 10 is in heat-transferring connection with the heat-conducting housing 210; or, the heat-end circuit of the secondary semiconductor refrigerating element 10 arranged on the heat-conducting shell 211 is welded and electrically connected with the electric coupling layer 12 of the secondary semiconductor refrigerating element 10, so that the heat-conducting shell 211 is directly used as the hot surface of the secondary semiconductor refrigerating element 10.

The preferred embodiment of the present invention relates to a photon beauty instrument 100, which comprises a body provided with a plurality of ventilation openings 101, wherein a refrigeration module 1, a light source assembly 2, a power supply assembly 3 and a control circuit board 4 are arranged in the body. The light source component 2 and the power supply component 3 are electrically connected with the control circuit board 4; the plurality of ventilation openings 111 of the body serve as intake and exhaust air and form ventilation channels (as indicated by arrows in fig. 4 to 6) with the space inside the body to dissipate heat from the inside of the body. The front end of the body is a working surface 113, the working surface 113 can be directly contacted with the skin, and the light generated by the light source component 2 is transmitted to the working surface 113 to be emitted out to carry out the beauty treatment on the skin. The machine body is also internally provided with the two-stage refrigeration module 1 as described in the above embodiment, wherein the one-stage semiconductor refrigeration piece 10' is directly used as the working surface 113 or used for refrigerating the working surface 113. Specifically, when the primary semiconductor chilling plate 10' directly serves as the working surface 113: the first-stage semiconductor refrigerating piece 10 'takes transparent crystals as a cold surface 13, the cold surface 13 directly serves as a working surface 113, and the hot surface 11' and the galvanic couple layer 12 of the first-stage semiconductor refrigerating piece 10 'are provided with light transmitting windows, so that the first-stage refrigerating piece 10' has light transmission; alternatively, the cold surface 13, the hot surface 11 'and the electric couple layer 12 of the primary semiconductor chilling plate 10' jointly define a light-transmitting window, and photons generated by the light source component are transmitted out of the working surface 113 from the light-transmitting window, so that the photons act on the skin outside the working surface. When the primary semiconductor refrigerating sheet 10' refrigerates the working surface 113: the cold surface 13 of the primary semiconductor refrigerating sheet 10' is in contact with the working surface 113 for heat transfer; alternatively, the cold side 13 of the primary refrigeration member 10' is connected to the working side by a heat transfer structure in a rapid heat transfer manner. The two-stage refrigeration module 1 comprises a fan 18 or a cooling fan assembly 200 which is positioned in a ventilation channel in the machine body; the light source assembly 2 includes a lamp tube 20 and a reflective cup 21, the ventilation channel inside the reflective cup 21 is communicated with the ventilation channel of the fan 18 or the heat dissipation fan assembly 200, and is communicated with the ventilation channel inside the body to form the heat dissipation ventilation channel of the light source assembly 2, and the heat dissipation of the light source assembly is promoted by the fan 18 or the heat dissipation fan assembly 200. Wherein, one side of the reflecting cup 21 is provided with a radiating fin or a heat conducting piece 22; a plurality of ventilation openings 182/201 are formed on the fan housing 180/210 of the fan 18/heat dissipation fan assembly 200; one of the air vents is provided with a heat sink or a heat conducting member 22 of the reflector, and the air duct of the fan 18/heat dissipation fan assembly 200 is communicated with the air duct in the machine body to form a first air duct 101 for dissipating heat to the reflector 21; the other ventilation opening of the fan 18/heat dissipation fan assembly 200 is communicated with the air duct inside the reflector cup 21, and the ventilation duct of the fan 18/heat dissipation fan assembly 200 is communicated with the ventilation duct inside the body to form a second ventilation duct 102 for dissipating heat to the reflector cup 21 and the lamp tube 20.

The invention adopts the two-stage refrigeration module, and can solve the problems that when the first-stage semiconductor refrigeration piece radiates through the heat transfer structural piece, the heat conduction efficiency is uneven, the heat conduction is slow, the heat conduction timeliness is poor, so that the refrigeration speed is reduced, the heat at the front end, the rear end, the left end, the right end or the upper end and the lower end of the radiating fin is unbalanced when the heat is conducted to the radiating fin, the radiating effect of the fan is influenced, and the like.

Various embodiments of the refrigeration module, the cooling fan assembly 200 and the photonic beauty apparatus 100 are described below with reference to the accompanying drawings. Portions of the structures of the various embodiments described below may be rearranged to obtain additional embodiments, and such further embodiments are intended to be encompassed within the scope of the present disclosure.

Referring to fig. 1-28, the invention provides a refrigeration module 1 and a beauty instrument, wherein the refrigeration module 1 comprises a semiconductor refrigeration piece 10 for refrigeration of the beauty instrument, the semiconductor refrigeration piece 10 comprises a middle galvanic couple layer, and a hot surface 11' and a cold surface 13 at two ends; the refrigeration module further comprises a heat conducting structure 19 and a heat radiating fin 16; the heat conducting structure 19 comprises a VC temperature equalizing plate or an aluminum superconducting pipe; the heat conducting structure is connected in rapid heat transfer with the heat sink 16 and the hot side 11' of the semiconductor cooling element 10, respectively, to allow rapid heat dissipation from the hot side.

Two ends of the aluminum superconducting plate or the aluminum superconducting pipe are sealed, and working liquid is packaged inside the aluminum superconducting plate or the aluminum superconducting pipe; more than two thin bone-shaped microgrooves 1911 are formed on the inner wall; a microporous structure 1912 is formed within the aluminum superconductor sheet or material.

Referring to fig. 1-19, an embodiment of the present invention relates to a beauty instrument 100, which includes a body having a plurality of ventilation openings 111, wherein the plurality of ventilation openings 111 can be disposed at different positions or the same position of a housing 110, and disposed in different forms, including but not limited to: the ventilation openings can be one or more than one in the form of honeycomb holes, slits, notches and the like formed on the shell 110, and the function of realizing that cold air or air of the environment enters the inside of the machine body from the ventilation openings, takes away heat inside the machine body and is discharged out of the machine body from the ventilation openings. The interior of the machine body is provided with a refrigeration module 1, a light source component 2, a power supply component 3 and a control circuit board 4. The light source component 2 and the power supply component 3 are electrically connected with the control circuit board 4; the plurality of ventilation openings 111 of the body serve as intake and exhaust air and form ventilation channels (as indicated by arrows in fig. 4 to 6) with the space inside the body to dissipate heat from the inside of the body. The front end of the body is a working surface 113, the working surface 113 can be directly contacted with the skin, and the light generated by the light source component 2 is transmitted to the working surface 113 to be emitted out to carry out the beauty treatment on the skin.

Referring to fig. 8 to 14, the refrigeration module 1 of the embodiment of the present invention is mainly used for refrigerating the working surface 113 of the beauty instrument to achieve a cold compress effect on the skin. The refrigeration module 1 comprises a semiconductor refrigeration piece 10, wherein the semiconductor refrigeration piece 10 comprises a middle galvanic couple layer 12, and a hot surface 11' and a cold surface 13 at two ends. The middle galvanic couple layer 12 is an internal circuit of the semiconductor refrigerating element formed by arranging and electrically connecting PN galvanic couple particles according to a hot end circuit arranged on a hot surface and a cold end circuit arranged on a cold surface, and is controlled by an anode and a cathode electrically connected with the control circuit board 4 or an independent circuit so as to control the semiconductor refrigerating element to work. In particular embodiments, the cooling member 10 (specifically the cold side 13) may be used directly as the work surface 113 or to cool the work surface 113. When the refrigeration element 10 is used directly as a working surface, the skilled person can set the shape of the element, such as a transparent crystal or a ring, as required. When the refrigeration member 10 is used to refrigerate the working surface 113, the cold side 13 of the refrigeration member 10 is in contact with the working surface 113, for example, is disposed at the periphery of the working surface. Alternatively, the cold side 13 of the cooling member 10 and the working side 113 are in contact with the working side 113 through a heat transfer element (or heat conducting member). The cold conducting piece (first cold conducting piece) 15 is a heat transfer structural piece, and can quickly transfer heat of the working surface to the semiconductor refrigerating piece, so that the effect of refrigerating the working surface is achieved. The heat transfer structure may be a thermally conductive material such as, without limitation, a thermally conductive element made of a metallic material such as, without limitation, a copper tube or plate, etc.; alternatively, the heat transfer structure may be a heat pipe or a Vapor Chamber (VC) or a super heat pipe or a super heat conducting plate or other heat transfer component for transferring heat, and the heat transfer structure is connected between the semiconductor cooling element (cold side) and the working side. The heat sink (first heat sink) 15 can be adapted to the shape of the semiconductor cooler 10, in particular to the shape of the cold side 13, and to the shape of the working side 113, so that rapid heat dissipation is possible. The working surface 113 may be made of a transparent crystal or other light-transmissive material. The working surface 113 may also be annular, and the annular central through hole is transparent, and is not limited by material.

The heat pipe (heat pipe) or vapor chamber (vapor chamber) is used to rapidly transfer the heat of the heat generating object out of the heat source through the heat pipe by utilizing the heat conduction principle and the rapid heat transfer property of the refrigeration medium. The heat is transferred by evaporation and condensation of liquid in the totally-enclosed vacuum tube or the vacuum plate, the refrigeration effect is achieved by utilizing fluid principles such as capillary action and the like, and the heat pump has a series of advantages of high heat conductivity, excellent isothermality, heat flow density variability, heat flow direction reversibility and the like. The heat exchanger composed of the heat pipe (heat pipe) or the vapor chamber (vapor chamber) has the advantages of high heat transfer efficiency, compact structure, small fluid resistance loss and the like.

Referring to fig. 7-11 in combination, as a preferred embodiment, the cold side 13 and the working side 113 of the refrigeration member 10 rapidly transfer heat from the working side 113 or ambient heat of the working side to the refrigeration member 10 (the cold side 13) for heat dissipation via the cold conducting member 15, i.e., the heat pipe, and rapidly transfer heat to the refrigeration member. Depending on the shape of the working surface 113 and the expected cooling effect, the end of the cold conducting member (heat pipe) 15 contacting the working surface 113 may be designed into a ring shape, and closely contact with the periphery of the working surface, so as to quickly absorb heat from the working surface 113 or the environment around the working surface 113; depending on the shape of the refrigeration element 10 or the cold surface 13, the end of the cold conducting element (heat pipe) 15 in contact with the refrigeration element 10 can be designed as follows: extending from the annular bend for a predetermined length is placed on the cold face 13 of the refrigeration member and in intimate contact with the cold face 13.

The heat generated from the hot side 11' of the semiconductor cooling element 10 is discharged outside the body through the ventilation channel in the body. Preferably, the semiconductor cooling device 10 enhances the heat dissipation effect through the heat dissipation component. The heat dissipation assembly comprises a VC temperature equalizing plate 11 and heat dissipation fins 16 arranged on the VC temperature equalizing plate 11, wherein a hot surface 11' of the semiconductor refrigerating piece is arranged on the outer wall of the VC temperature equalizing plate 11, or the VC temperature equalizing plate 11 is directly used as the hot surface of the semiconductor refrigerating piece. The VC vapor chamber 11 is used for heat dissipation of the refrigeration unit 10. The VC temperature-uniforming plate 11 is positioned in a ventilation channel of the machine body; the refrigeration piece 10 is arranged on the VC temperature-uniforming plate 11, and the hot surface 11' of the semiconductor refrigeration piece is attached to the outer wall of the VC temperature-uniforming plate, so that the heat of the hot surface is directly transmitted to the VC temperature-uniforming plate 11; or the hot surface 11 'of the semiconductor refrigerating element is arranged on the outer wall of the VC temperature-equalizing plate through the heat conducting element, and the heat of the hot surface 11' is quickly conducted to the VC temperature-equalizing plate 11 through the heat conducting element; or a hot end circuit of the semiconductor refrigerating element is arranged on the VC temperature equalizing plate 11 and is welded and electrically connected with PN galvanic couple particles of the galvanic couple layer 12. The VC temperature equalization plate 11 is a closed flat plate cavity formed by a bottom plate, a frame and a cover plate, and a capillary structure and a working fluid are arranged in the cavity. By way of non-limiting example, one end of the VC temperature-equalizing plate 11 forms an extension platform for arranging or mounting the semiconductor refrigeration element 10, the area of the VC temperature-equalizing plate 11 is larger than that of the galvanic couple layer 12 and the cold surface 13, so that the hot surface 11' of the semiconductor refrigeration element has the extended VC temperature-equalizing plate 11, and the heat dissipation area is increased.

The heat dissipation assembly further comprises a heat dissipation fin 16 arranged on the VC temperature equalization plate 11 so as to increase the heat dissipation area of VC. The heat sink 16 may be disposed on the upper surface or the lower surface or both surfaces of the VC temperature equalization plate 11 according to the heat dissipation requirement of the product. Preferably, the VC temperature equalization plate 11 is located behind the ventilation opening of the fuselage; the radiating fins on the VC temperature equalizing plate 11 are opposite to the ventilation openings 111 of the machine body. The heat sink 16 is one or more groups of heat conductive material fins, and the position, number and arrangement of the heat sink can be set according to the internal space of the beauty instrument. Referring to fig. 10-15, on the surface of the VC temperature-uniforming plate 11, the heat dissipation fins 16 are a set of parallel linear heat dissipation fins arranged in a matrix; or, the VC temperature equalization plate 11 is a fan rib, the heat sink 16 is a set of curved heat sink fins on the inner wall of the spiral fan rib (fig. 15 (a)), and the air channel is in the same spiral direction with the fan rib; alternatively, the heat sink 16 is a group of heat dissipating fins arranged in a circular matrix, and the heat dissipating fins may be arranged along a linear radiation direction or arranged at a certain angle to form a rotation direction (fig. 15 (b)).

The refrigeration module 1 of the present invention further comprises a fan 18, and the fan 18 is located in the ventilation channel of the body for enhancing the heat dissipation (refrigeration) efficiency. The fan 18 comprises a fan shell 180 and an impeller 181 arranged in the cavity inside the shell, and the fan shell 180 is provided with a plurality of openings as a plurality of ventilation openings 182 of the fan 18; the plurality of ventilation openings 182 of the fan 18 are used for air intake and air outtake, and are communicated with the inner cavity of the fan housing 180 to form a ventilation channel of the fan 18, and communicated with a ventilation channel in the machine body. The VC temperature equalization plate 11 may be part of the fan housing 180 or mounted to the fan housing 180. The VC temperature equalization plate 11 and the heat sink 16 dissipate heat by the air channel of the fan 18, which promotes air flow to deliver heat dissipation efficiency.

The VC temperature equalization plate 11 may be provided as part of the housing of the fan 18. The fan 18 housing includes an upper shell, a lower shell 184, and a central surround 183. The inner wall of the surrounding bone 183 can be provided with heat dissipation teeth to increase the heat dissipation area of the VC temperature equalization plate 11. As shown in fig. 12-14, the VC temperature-uniforming plate 11 is used as the upper shell (or lower shell) of the fan housing to cover the top (or bottom) of the ring-shaped enclosure; the VC temperature-uniforming plate 11 can be arranged as an annular flat plate, and a central through hole of the annular flat plate forms a ventilation opening of the fan 18; the heat dissipation fins 16 are a group of parallel heat dissipation fins covering the central through hole, and the air passages between the heat dissipation fins are communicated with the central through hole of the VC temperature equalization plate 11 and the internal cavity of the fan housing.

Referring to fig. 15 (b), the difference from the structure shown in fig. 12-14 is that the heat dissipation fins are arranged at the annular edge of the central through hole of the VC temperature equalization plate 1, and are arranged in a radial manner orARotate a certain angle and arrange a circle.

Referring to fig. 15 (a), the VC temperature-uniforming plates 11 serve as the ribs outside the fan blades, the heat sink 16 may be disposed on the inner wall of the ribs, and the semiconductor cooling device 10 may be disposed on the outer wall of the ribs.

The refrigeration module is also used for radiating the light source component 2. The light source assembly 2 includes a lamp tube 20, a reflector 21 outside the lamp tube, and electrode plates 23 at two ends of the lamp tube, wherein the lamp tube 20 is preferably an IPL lamp tube, which generates IPL photons, or a halogen lamp, or other suitable light source. The air duct of light source subassembly 2 and the air duct intercommunication of fan 18, and with in the fuselage the air duct intercommunication forms the heat dissipation air duct of light source subassembly 2, promotes the heat dissipation of light source subassembly 2 by fan 18. The reflector may be provided with a heat conducting member 22 on one side, such as (but not limited to) the heat conducting member 22 being a set of heat conducting fins (made of heat conducting material), one end of the heat conducting member being connected to the outer wall of the reflector, and the other end of the heat conducting member extending to the ventilation opening 182 of the fan 18. A plurality of ventilation openings 182 are formed in the casing of the fan 18, specifically, on the periphery of the frame outside the fan blades, as shown in fig. 13, three ventilation openings 182 are formed in the periphery, one (first) ventilation opening is provided with the heat conducting member of the reflector cup, and the ventilation passage in the casing is communicated with the ventilation passage in the casing to form a first ventilation passage 101 (refer to the arrow mark line in fig. 4) for dissipating heat to the heat conducting member 22 of the reflector cup and the VC temperature equalizing plate 11, at this time, external air or cold air enters from the casing ventilation opening (including but not limited to a set of honeycomb holes and the gaps of the casing) 111 opposite to the heat dissipating fin 16, enters the fan 18 from the central through hole of the temperature equalizing plate 11 through the heat dissipating fin 16 and the VC temperature equalizing plate 11, and air circulates in the fan inner cavity of the fan by an impeller and flows through the heat conducting member 22 of the reflector cup and the VC temperature equalizing plate 11, takes heat of the reflector cup 21 and the VC temperature equalizing plate 11 away, and is exhausted from the other (second) ventilation opening on the periphery of the fan 182, and is realized by the passage in the casing including but not limited to the heat dissipating heat conducting member 22 and the heat dissipating heat of the heat radiating fins and the heat radiating fins 11. The third air vent 182 on the fan rib is communicated with the air channel inside the lamp tube, and the air channel of the fan 18 is communicated with the air channel inside the body to form a second air channel 102 for dissipating heat to the reflector cup 21 and the lamp tube 20. At this time, external air or cold air enters from the ventilation opening 111 of the housing opposite to the heat sink 16, passes through the heat sink 16 and the VC temperature-uniforming plate 11, enters into the fan 18 from the central through hole of the temperature-uniforming plate 11, is partially exhausted out of the fan through another ventilation opening 182 on the fan surrounding rib by the impeller and enters into the reflective cup 21, takes away heat of the lamp tube 20 and the reflective cup inside the reflective lamp, and is exhausted out of the lamp tube and out of the housing through the ventilation opening 111 at the end of the housing through the ventilation channel inside the housing, thereby further promoting heat dissipation of the lamp tube 20 and the reflective cup 21.

The ventilation opening 111 on the beauty instrument body shell can be arranged at different positions and with different hole structures, for example, as shown in fig. 5-6, the ventilation openings are respectively arranged on the lower shell and the side surface of the body, the ventilation openings on the side surface are used as the outlets of the first ventilation channel 101 and the second ventilation channel 102, and the ventilation channel in the body is correspondingly communicated with the ventilation opening 111 on the side surface.

The beauty instrument 100 of the present invention employs the refrigeration module 1 of each of the above embodiments to refrigerate the working surface 113 of the head of the body, and the fan of the refrigeration module 1 can also be used as the heat dissipation of the light source assembly 2. The photon beauty treatment can be a depilation instrument, a photon skin tendering instrument, a leading-in and leading-out beauty instrument, a radio frequency beauty treatment instrument and the like, and the refrigeration module of the embodiment can be adopted.

The cosmetic apparatus 100 shown in fig. 1-7 is illustrated as a bar-type whole machine, and may be used as an IPL photon depilator. Referring to fig. 1-19, an embodiment of the present invention relates to a beauty instrument 100, which includes a housing 110 having a plurality of ventilation openings 111. The housing 110 includes an upper shell 112 and a lower shell 118, which are fastened to each other and form a cavity inside the body. An upper bracket 114 and a lower bracket 115 are further arranged in the machine body and are respectively matched with the upper shell 112 and the lower shell 118, and a lamp holder bracket 24 is arranged in the front end of the machine body so as to install the refrigeration module 1, the light source assembly 2, the power supply assembly 3 and the control circuit board 4.

The plurality of ventilation openings 111 may be disposed at different or the same positions of the housing 110 in different hole structures. The vent 110 is shown disposed on the lower shell 118 or side or end of the housing. The cavity in the interior of the machine body is formed with a ventilation channel. The cold air or air of the environment enters the inside of the machine body from the ventilation opening, takes away the heat inside the machine body, and is exhausted out of the machine body through the ventilation opening 111 at the same or different positions. The plurality of ventilation openings 111 of the body are used for air intake and air outtake and form ventilation channels (such as lines shown by arrows in fig. 4-6) with the space in the body to realize heat dissipation in the body. The front end of the body is a working surface 113, the working surface 113 can be directly contacted with the skin, and the light generated by the light source component 2 is transmitted to the working surface 113 to be emitted out to carry out the beauty treatment on the skin.

The light source assembly 2 is installed at the front end of the body through a lamp holder support 24, and a light outlet channel and a light outlet window are formed in the lamp holder support 24 and used for transmitting light generated by the light source assembly. The working surface 113 is installed on the light-emitting window, the lamp tube 20 is installed on the rear portion of the lamp holder support by the reflection cup 21 and is located behind the light-emitting channel, and the light-emitting direction of the light source component is provided with the optical filter 25. The heat-conducting member 22 of the reflector cup extends rearward to the vent of the fan. The lamp holder support 24 can be provided with a ventilation channel as required, and the ventilation channel is communicated with the ventilation channel inside the reflection cup, so that air cooling and heat dissipation are facilitated.

The inside fan that forms of the front end of the inside upper bracket 114 of fuselage and the buckling of lower carriage 115 holds the chamber, and the corresponding installation refrigeration module 1, lower carriage 115 front end form the window, just face a ventilation opening 111 that forms on the lower casing 118 and communicate, and the fin 16 on the VC samming board 11 is located window department and just faces ventilation opening 111 on the lower casing 118. The semiconductor refrigerating element 10 is arranged on the platform extending from the front end of the VC temperature-equalizing plate 11, the heat-conducting element (heat pipe) 15 is supported by the lamp holder bracket, the front end (ring shape) is in contact connection with the working surface 113 in a rapid heat-conducting manner, and the rear end (end part of the parallel straight pipe) covers the cold surface of the semiconductor refrigerating element and can be in close contact with the cold surface in a rapid heat-conducting manner. In the fan accommodating cavity, the front end ventilation opening 182 of the surrounding bone corresponds to the heat conducting piece 22 of the reflecting cup, and the ventilation opening at the rear end is communicated with a ventilation channel formed after the upper bracket and the lower bracket are buckled. The air duct of the fan is indicated with reference to the inlet and outlet air shown in fig. 8.

The power supply module accommodating cavity is formed inside the rear section where the upper bracket 114 and the lower bracket 115 are buckled inside the body, the power supply module 3 is generally a battery, such as a rechargeable battery or a capacitor battery, and the power supply module further comprises a charging seat 31 for connecting an external power supply to charge the battery or directly supply power to the beauty instrument. The charging base 31 is electrically connected with the control circuit board 4, is installed on the casing, and can be connected with a cable.

The inside of the power supply component accommodating cavity, the buckled upper support 114 and the lower support 115 is further limited with a ventilation channel 101/102, and the ventilation channel 101/102 is communicated with the ventilation channel of the fan, communicated with the ventilation channel in the reflecting cup and communicated with the ventilation opening (air inlet and air outlet) of the shell to form a ventilation channel in the machine body.

The upper bracket 114 is fastened with the upper casing 112 to form a cavity for mounting the control circuit board 4, and the control circuit board 4 is protected by the upper bracket 114 and the upper casing 112. The casing is also provided with a switch button 117 electrically connected with the control circuit board 4 and a switch circuit board 116 corresponding to the inside for controlling the switch and the like.

Referring to the embodiment shown in fig. 16 to 19, the refrigeration module 1 of the foregoing embodiment is applied to an L-shaped beauty instrument, and functions and structures thereof are the same as or similar to those of the bar type of fig. 1 to 7, and the size, shape and position of the casing, the bracket, the power supply module 3, the light source module 2, the refrigeration module 1 and the control circuit board 4 are adaptively set in accordance with only the overall shape of the body. The L-shaped cosmetic instrument includes a handle 120 and a light head 130. The lamp head 130 is rotatably connected to the top of the handle 120 through the knob 150, the knob holder 140 and the rotary pressing plate 151 on the top of the handle, and the rotary connection structure of the lamp head 130 and the handle and the structure of the handle can adopt the prior art structure. The tail part of the handle is provided with a DC wire 31', the inside of the handle is provided with a handle bracket 160, and the power supply component 3 is installed. The cavity at the top side of the handle holder 160 communicates with the interior of the lamp head 130, and the lamp head housing is rotatably mounted. The lamp cap housing comprises a front shell 131 and a front shell cover 132, and the lamp cap 130 is rotatably connected through the front shell cover 132 in cooperation with a knob 150, a knob base 140 and a rotary pressing plate 151. The inner lamp holder bracket 133 is mounted on the front shell cover 132 to be matched with the front shell 131, one side of the inner lamp holder bracket is provided with the refrigeration module 1, and the other side of the inner lamp holder bracket is provided with the control circuit board 4. The front end of the lamp head 130 is a working surface 113, which can be: the transparent crystal working surface, or the annular semiconductor refrigerating piece, or the semiconductor refrigerating piece with the transparent crystal working surface are all structures in the prior art. The front end of the inner part of the lamp holder 130 is provided with a lamp holder bracket 24, the structure is similar to that of the embodiment shown in fig. 1-7, the light source assembly 2 is installed, one side of the heat conducting piece 22 of the reflecting cup of the light source assembly 2 is provided with a heat pipe and a heat radiating fin assembly 26, the heat pipe and the heat radiating fin assembly extend out of the ventilation opening 182 of the fan 18, and the ventilation opening arranged on the front shell 131 is opposite to the heat radiating fin assembly 26. In this embodiment, the refrigeration module 1 is adopted to refrigerate the working surface 113, and meanwhile, the light source assembly 2 is cooled.

The semiconductor refrigerating piece 10 is arranged on the VC temperature-equalizing plate 11, and the cold surface 13 of the refrigerating piece is connected with the working surface 113 of the beauty instrument by the cold-conducting piece, namely the heat-conducting element (heat pipe) 15 to conduct cold quickly, so that the cold compress effect or the cooling effect is formed on the working surface. The VC temperature equalizing plate 11 is provided with radiating fins 16 to increase the radiating area. Furthermore, the VC temperature-uniforming plate 11 is combined with the fan, and is used for an upper shell or a lower shell or a surrounding frame of the fan by utilizing the phase change effect of evaporation and condensation of the VC temperature-uniforming plate, so that the heat dissipation efficiency and speed of the fan during rotation are improved to a greater extent; the radiating fins are added on the upper surface of the VC, so that the radiating area of the VC can be increased, the contact area between air and the radiating fins is effectively increased when air is sucked, and the radiating fins made of heat conducting materials are added on the lower surface (the inner wall of the surrounding bone) of the upper shell of the VC fan, so that the contact area between the air and the radiating fins can be increased to a greater extent, and the radiating effect is better. The heat radiating fins can be arranged on the upper surface or the lower surface or the two surfaces of the VC temperature-equalizing plate according to the heat radiating requirement of a product.

Referring to fig. 20 to 23, the cooling module 1 according to the second embodiment of the present invention is mainly used for cooling the working surface 113 (refer to the previous embodiments) of the beauty instrument to achieve the effect of cold compress on the skin. The refrigeration module 1 includes a semiconductor refrigeration member 10, the semiconductor refrigeration member 10 (refer to the foregoing embodiment) includes a middle galvanic couple layer 12, and a hot surface 11' and a cold surface 13 at two ends, and in a specific embodiment, the refrigeration member 10 (specifically, the cold surface 13) may be directly used as the working surface 113, or used for refrigerating the working surface 113. When the refrigeration element 10 is used directly as a working surface, the skilled person can, if desired, provide a suitable shape, for example a transparent crystal or a ring. When the cooling member 10 is used to cool the work surface 113, the cold surface 13 of the cooling member 10 is in contact with the work surface 113, for example, is disposed around the work surface. Alternatively, the cold side 13 of the cooling member 10 and the working side 113 are in contact with the working side 113 through a heat transfer element (or heat conducting member). The cold conducting piece 15 is a heat transfer structural piece, and can quickly transfer heat of the working face to the semiconductor refrigerating piece, so that the effect of refrigerating the working face is achieved. The heat transfer structure may be a heat conductive material such as (without limitation) a metal material such as (without limitation) copper/aluminum tubing or the like or other heat conductive material such as silicone/silicon wafer/elastic or soft heat conductive material; it can also be a heat pipe (heat pipe) or a VC (temperature equalizing plate or temperature equalizing pipe) or a super heat conducting pipe or a super heat conducting plate or other components for realizing heat transfer. The heat pipe (heat pipe) or vapor chamber (vapor chamber) utilizes the heat conduction principle and the rapid heat transfer property of the refrigeration medium to rapidly transfer the heat of the heating object out of the heat source through the heat pipe. The super heat conducting pipe or the super heat conducting plate is preferably an aluminum super heat conducting pipe/an aluminum super heat conducting plate. The (aluminum) superconductive heat pipe or (aluminum) superconductive plate, or ALVC superconductive pipe (plate), utilizes evaporation refrigeration and gas-liquid phase change to make heat quickly conducted. Referring to fig. 23, compared with a general heat pipe and a VC uniform temperature plate, an aluminum superconducting heat pipe/aluminum superconducting heat plate may form microgrooves or microporous channels on the surface of the superconducting heat pipe or the superconducting heat plate by an aluminum material forming process as a capillary structure inside the superconducting pipe or the superconducting plate. Copper powder can not be added into the aluminum superconducting pipe (plate), aluminum powder or aluminum-silicon powder and the like can be filled, an aluminum net can be added, and a refrigerant is filled and then sealed. The cold conducting member 15 is connected between the semiconductor cooling member (cold surface) and the working surface, and the shape adapted to the shape of the semiconductor cooling member 10, particularly the shape of the cold surface 13, and the shape of the working surface 113 can be designed based on the principle of rapid heat dissipation. In this embodiment, the cold conducting element 15 is a copper tube or an ALVC aluminum superconducting tube (plate) or a heat pipe or VC.

According to the shape of the working surface 113 and the expected cooling effect, the end of the cold conducting member 15 contacting with the working surface 113 can be designed into a ring shape, and directly and closely contacts with the periphery of the working surface, so as to rapidly absorb the heat of the working surface 113 or the environment around the working surface 113; alternatively, a cold guide member (second cold guide member) 15' is further provided on the working surface 113 and the cold guide member 15 to be in contact with each other for heat transfer. The cold conducting piece 15' is a copper pipe or an ALVC superconducting pipe (plate) or a heat pipe or a VC, can be arranged in a ring shape, and is attached to the periphery of the working surface 113 and the ring-shaped end of the cold conducting piece 15 so as to conduct heat quickly. Depending on the shape of the refrigeration element 10 or the cold face 13, the end of the cold conductor 15 in contact with the refrigeration element 10 can be designed as: the ring-shaped bend extends for a predetermined length to be placed on the cold face 13 of the refrigeration piece and is in close contact with the cold face 13.

The heat generated from the hot side 11' of the semiconductor cooling element 10 is discharged outside the body through the ventilation channel in the body. Specifically, the semiconductor cooling device 10 enhances the heat dissipation effect by the heat dissipation assembly. The heat dissipation assembly comprises a heat conducting structure 19 and heat sink fins 16 located in the ventilation channel of the cosmetic instrument body for rapidly dissipating heat from the hot side 11' of the semiconductor cooling element 10. The heat conducting structure 19 comprises a heat conducting plate 190 and a plurality of aluminum VC/ALVC superconducting tubes 191, wherein each aluminum VC/ALVC superconducting tube 191 is a single tube. The hot side 11 'of the semiconductor refrigeration piece is arranged on the outer wall of the heat conducting plate 190, or the heat conducting plate 190 is directly used as the hot side 11' of the semiconductor refrigeration piece 10. The semiconductor refrigeration piece 10 is arranged on one side of the outer wall of the heat conduction plate 190, the plurality of open grooves 192 are arranged on the other side of the outer wall of the heat conduction plate 190, the plurality of open grooves 192 are matched with the plurality of aluminum VC/ALVC superconducting pipes 191, and the aluminum VC/ALVC superconducting pipes 191 are accommodated in the open grooves 192. The heat-conducting plate slots 192 are connected, e.g., riveted/welded, to the aluminum VC/ALVC superconducting tubes 191 to increase the contact area between the two for rapid heat transfer.

With reference to fig. 23, the aluminum VC/ALVC superconducting tube 191 forms microgrooves or microteeth or micropores on the inner wall surface of the aluminum VC/ALVC superconducting tube by an aluminum material processing and forming process, and forms a capillary action inside the aluminum VC/ALVC superconducting tube. As shown in fig. 23 (b), when the aluminum material is extruded to form the aluminum VC/ALVC superconducting pipe, a single channel 1910 is formed in the pipe, two or more fine bone-shaped microgrooves 1911 are formed on the inner wall of the pipe, a large number of microporous structures 1912 can be formed in the pipe wall of the aluminum VC/ALVC superconducting pipe, after the aluminum material is formed into a pipe shape, aluminum powder or aluminum silicon powder and the like can be poured into the pipe by pumping liquid into the pipe, an aluminum mesh can also be added, and after the pipe is vacuumized, the sealed end portion is sintered to obtain the aluminum VC/ALVC superconducting pipe with super thermal conductivity. Preferably, each aluminum VC/ALVC superconducting tube is a single channel 1910, and has the advantages that: the plane bending or the special-shaped 3D bending can be realized, the shape can be changed according to the change of the product space form, and the longitudinal mode staggered combination of a plurality of aluminum VC/ALVC superconducting pipes can be realized to overcome the influence of the gravity direction. In the example shown in fig. 23 (a), the aluminum VC/ALVC superconducting tube 191 is bent into an L-shape, accordingly, the slot 192 on the heat conducting plate 190 is also L-shaped, the aluminum VC/ALVC superconducting tube 191 is just embedded into the slot 192, the L-shaped heat conducting structure 19 is integrally formed, one end of the L-shape is placed on the hot surface 11' of the semiconductor cooling element 10 to be in close contact with the heat to be rapidly transferred, and the other end of the L-shape is installed in the heat radiating fin 16. The heat generated by the hot side 11' of the semiconductor cooling element 10 is quickly transferred by the heat conducting structure 19 to the heat sink 16 for heat dissipation.

The refrigeration piece 10 is arranged on one side of the heat conducting plate 190, and the hot surface 11' of the semiconductor refrigeration piece is attached to the outer wall of the heat conducting plate 190, so that the heat of the hot surface is directly conducted to the heat conducting plate 190; or, the hot side 11 'of the semiconductor refrigeration piece is installed on the outer wall of the heat conducting plate 190 through the heat conducting piece, and the heat of the hot side 11' is rapidly conducted to the heat conducting plate 190 through the heat conducting piece; or, the heat conducting plate 190 is provided with a hot end circuit of the semiconductor refrigerating element, and the hot end circuit is welded and electrically connected with the PN galvanic couple particles of the galvanic couple layer 12. The heat conductive plate 190 is a heat conductive element made of a heat conductive material such as (without limitation) a metal material such as (without limitation) copper/aluminum or other heat conductive materials such as silicone/silicon wafer/elastic or soft heat conductive material. Preferably, the heat conducting plate 190 is made of a heat conducting material such as copper/aluminum plate.

The heat sink 16 is disposed on the heat conducting plate 190 to increase the heat dissipation area. Preferably, the heat sink 16 is located behind the ventilation opening of the cosmetic instrument body; facing the fuselage, vents 111 (see fig. 16, 27-28). The heat sink 16 is one or more groups of heat conductive material fins, and the position, number and arrangement of the heat sink can be set according to the internal space of the beauty instrument. One or more groups of radiating fins are integrally formed or welded or riveted or fixed by other fastening mechanisms to form an integral radiating fin 16; alternatively, one or more sets of fins of thermally conductive material are provided on the plate to form the fins 16 of unitary construction. The top surface of the heat sink 16 is formed with a groove 161, and one end of the heat conducting structure 19 is inserted into the groove 161, so that the heat can be rapidly transferred by riveting/welding to increase the contact area between the two.

In other embodiments, the heat conducting structure 19 may be directly disposed on the heat sink 16, or the heat conducting structure 19 may be attached to one side of the heat conducting plate of the heat sink 16 (see fig. 28).

Referring to fig. 24 to 26, the third embodiment of the cooling module 1 is mainly used for cooling the working surface 113 (refer to the previous embodiments) of the beauty instrument to achieve the effect of cold compress on the skin. The refrigeration module 1 comprises a semiconductor refrigeration piece 10, a first cold conduction piece 15, a second cold conduction piece 15', a heat dissipation sheet 16 and a heat conduction structure 19. The first and second cold guides 15, 15', and the heat sink 16 have the same or similar structure as the second embodiment of the refrigeration module 1, and are directly cited in the above embodiment. The heat conducting structure 19 includes a heat conducting plate 190 and a plurality of aluminum VC/ALVC superconducting tubes 191, each aluminum VC/ALVC superconducting tube 191 is a single tube, preferably a single channel. The hot side 11 'of the semiconductor refrigeration piece is arranged on the outer wall of the heat conducting plate 190, or the heat conducting plate 190 is directly used as the hot side 11' of the semiconductor refrigeration piece 10. The semiconductor refrigeration piece 10 is arranged on one side of the outer wall of the heat conduction plate 190, the plurality of open grooves 192 are arranged on the other side of the outer wall of the heat conduction plate 190, the plurality of open grooves 192 are matched with the plurality of aluminum VC/ALVC superconducting pipes 191, and the aluminum VC/ALVC superconducting pipes 191 are accommodated in the open grooves 192. The heat-conducting plate slots 192 are connected, e.g., riveted/welded, to the aluminum VC/ALVC superconducting tubes 191 to increase the contact area between the two for rapid heat transfer. In this embodiment, the heat conducting plate 190 includes a circular (not limited to circular) area and a platform extending from one side, on which the semiconductor cooling element 10 is disposed. The circular area is provided with a plurality of slots 190 extending from the center of a circle to the edge of the circle, the slots 190 are evenly distributed in the circular area at intervals, one aluminum VC/ALVC superconducting pipe 191 is placed in each slot 190, and the slots 190 and the aluminum VC/ALVC superconducting pipes 191 can be provided with certain curvature or radian. In a non-limiting example, the plurality of aluminum VC/ALVC superconducting tubes 191 are installed to form a radial arrangement along a radius or approximately along the radius direction, so as to overcome the influence of the gravity direction. In other embodiments, the plurality of aluminum VC/ALVC superconducting tubes 191 may be arranged in a longitudinal mode staggered combination to overcome the influence of the direction of gravity. The heat conducting plate slot 190 is connected with the aluminum VC/ALVC superconducting pipe 191, and the contact area between the aluminum VC/ALVC superconducting pipe and the aluminum VC/ALVC superconducting pipe can be increased through riveting/welding, so that the heat transfer is accelerated.

As in the previous embodiment, the aluminum VC/ALVC superconducting tube 191 preferably uses a single channel, and microgrooves or microteeth or micropores are formed on the inner wall surface of the aluminum VC/ALVC superconducting tube by an aluminum material processing and forming process, and the inside of the tube is encapsulated with a cooling liquid, and aluminum powder or aluminum silicon powder, etc. may be filled in the tube, and an aluminum mesh may be added.

The refrigeration piece 10 is arranged on the platform at one side of the heat conduction plate 190, and the hot surface 11' of the semiconductor refrigeration piece is attached to the outer wall of the heat conduction plate 190, so that the heat of the hot surface is directly conducted to the heat conduction plate 190; or, the hot side 11 'of the semiconductor refrigeration piece is installed on the outer wall of the heat conducting plate 190 through the heat conducting piece, and the heat of the hot side 11' is rapidly conducted to the heat conducting plate 190 through the heat conducting piece; or, the heat conducting plate 190 is provided with a hot end circuit of the semiconductor refrigerating element, and the hot end circuit is welded and electrically connected with the PN galvanic couple particles of the galvanic couple layer 12. Preferably, the thermally conductive plate 190 is made of a thermally conductive material, such as a copper/aluminum plate.

The heat sink 16 is disposed on the heat conducting plate 190 to increase the heat dissipation area. By way of non-limiting example, the circular area of the thermally conductive structure 19 may be placed directly on top of the heat sink 16 or may be attached to the top of the heat sink 16 by welding or riveting for rapid heat transfer. The heat sink 16 extends from the platform on one side of the heat conducting plate 190, and the semiconductor cooler 10 is disposed on the platform.

Referring to fig. 27, the refrigeration module 1 of the third embodiment is applied to a beauty instrument, for example, a beauty instrument having a shape shown in fig. 16 to 19, and other structural members of the beauty instrument are the same as or similar to those of the embodiment shown in fig. 16 to 19, and are directly cited. The heat conducting structure 19 is arranged on a ventilation opening at the top of the fan 18, specifically, a circular area of the heat conducting plate 190 covers the opening at the top of the fan, the heat conducting plate is provided with an aluminum VC/ALVC superconducting pipe 191 facing the fan, the radiating fin 16 is positioned outside and faces a ventilation opening 111 on the side surface of the front shell 131, the heat conducting structure 19, the fan 18 and the radiating fin 16 are all positioned in a ventilation channel in the machine body, and the respective ventilation channels are communicated, cold air is input from the ventilation opening 111 of the machine body, and heat is taken away in the ventilation channel in the machine body and then is exhausted to the outside of the machine body through another ventilation opening 111.

The semiconductor refrigerating element 10 is arranged on the platform on one side of the heat conducting plate 190, the cold surface of the refrigerating element 10 is connected with the working surface 113 of the beauty instrument by the cold conducting element (copper/ALVC/heat pipe/VC) 15 (and a second cold conducting element 15') to conduct cold rapidly, and the cold compress effect or the cooling effect is formed on the working surface.

The operation principle of the beauty instrument shown in fig. 27 is the same as that of the previous embodiment, and the detailed description thereof is omitted.

The beauty instrument of the embodiment shown in fig. 28 adopts the refrigeration module 1 of the third embodiment to refrigerate the working surface 113 of the beauty instrument, and other structural components of the beauty instrument are the same as or similar to those of the embodiment shown in fig. 16-19, and are directly cited. The heat conducting structure 19 is L-shaped, and is mounted on a vent hole at the top of the fan 18 at one end cover of the heat radiating fin 16, the heat conducting plate 190 is mounted with an aluminum VC/ALVC superconducting pipe 191 facing inwards towards the fan, and the other end of the heat conducting plate 190 is provided with the semiconductor refrigerating element 10 which is positioned outside the vent hole at the top of the fan 18. The wind heat dissipation plate 16 is located at the ventilation opening 111 on the side of the front shell 131 facing the outside, the heat conducting structure 19, the fan 18 and the heat dissipation plate 16 are all located in the ventilation channel in the body, and the respective ventilation channels are communicated, cold air is input from the ventilation opening 111 in the body, and the cold air is discharged to the outside of the body from the other ventilation opening 111 after taking away heat in the ventilation channel in the body.

The semiconductor refrigerating member 10 is provided on the platform on one side of the heat conducting plate 190, and the cold face of the refrigerating member 10 is connected to the working face 113 of the beauty instrument by the cold conducting member (copper/ALVC/heat pipe/VC) 15 (and the cold conducting member 15') to conduct cold rapidly, thereby forming a cold compress effect or a cooling effect on the working face. In this embodiment, the heat pipe and heat sink assembly 26 disposed on the heat-conducting member 22 side of the reflective cup of the light source assembly 2 may be omitted. The groove 161 (fig. 22) formed on the heat sink 16 mounts one end of the heat conducting plate 190, and forms a ventilation channel at the same time, the ventilation channel is communicated with the air channel between the adjacent fins of the heat sink 16 and the air channel of the fan, and is communicated with the reflective cup of the light source assembly 2 and the ventilation channel inside the reflective cup, the heat conducting member 22 of the reflective cup of the light source assembly 2 is located at the ventilation opening of the fan 18 or in the ventilation channel inside the body, so as to realize the air cooling heat dissipation of the reflective cup 21 and the lamp tube 20. In this embodiment, the refrigeration module 1 is adopted to refrigerate the working surface 113, and meanwhile, the light source assembly 2 is cooled.

The heat conducting structure 19 of the above embodiment of the present invention employs a plurality of aluminum superconducting plates or single tubes of aluminum superconducting tubes 191 to combine with the heat conducting plate (copper plate) 190, which can effectively solve the problem of the gravity direction of the product, and the pipeline can be arranged in two or more different directions/angles in the XY plane or the XYZ three-dimensional direction. It is known that heat and steam flow from bottom to top, so that when the beauty instrument is used from bottom to top, the gravity effect of the heat-conducting structure is more obvious, and the heat-conducting effect in this state is deteriorated due to the effect of the antigravity direction, and an ideal heat-dissipating effect cannot be achieved.

Referring to fig. 29 to 30, the fourth embodiment of the refrigeration module 1 of the present invention adopts a two-stage refrigeration method, which is mainly used for cooling the working surface and dissipating heat from the interior of the photonic beauty apparatus, thereby improving the refrigeration efficiency. The specific implementation mode is as follows: the end that contacts the skin, namely the working face, is provided with a primary refrigerating part which acts on the skin for refrigeration, the heat of the primary refrigerating part 10' absorbs the heat through the evaporation end of the cold guide part (heat pipe/temperature equalizing plate/(aluminum) super heat conducting pipe/(aluminum) super heat conducting plate) 15 and enters the heat pipe/temperature equalizing plate/(aluminum) super heat conducting pipe/(aluminum) super heat conducting plate internal channel to transfer the heat to the condensation end, the condensation end is provided with a secondary refrigerating part 10 to carry out active refrigeration on the condensation end, and the temperature of the condensation end at the moment depends on the power of the secondary refrigerating part 10. Because the temperature of the condensation end is far lower than the temperature of the ambient wind, the condensation speed and the timeliness of the condensation end are greatly improved, so that the internal phase change circulation of the cold guide piece (heat pipe/VC/(aluminum) super heat conduction pipe or (aluminum) super heat conduction plate) 15 is accelerated, and the beneficial effect of improving the front-end refrigeration is achieved; the heat dissipation surface (hot surface) 13 of the secondary refrigeration part 10 is close to the air inlet or the air outlet of the fan, the heat dissipation of the secondary refrigeration part 10 can directly take away the heat by the fan by adopting a copper/aluminum heat conduction sheet, the heat on the heat dissipation surface 13 of the secondary refrigeration part can be conducted to the fan shell by a heat pipe/temperature equalizing plate/(aluminum) super heat conduction plate, and the heat is taken away by the heat dissipation sheet 16 arranged on the wall of the fan shell through blowing or induced draft of the fan. Compared with the embodiment of the refrigeration module 1 shown in fig. 8 to 15, the embodiment (fig. 29 to 30) provides two-stage refrigeration, which is equivalent to using the refrigeration element 10 of the refrigeration module 1 shown in fig. 8 to 15 as a two-stage refrigeration element for refrigerating the primary refrigeration element 10' connected at the cold end. Two-stage refrigeration is adopted, and the cold compress device is mainly used for refrigerating the working surface 113 of the beauty instrument so as to achieve the cold compress effect on the skin. The primary refrigeration member 10' is connected to the working surface 113 or directly serves as the working surface 113, and the secondary refrigeration member 10 is connected to the heat dissipation fan assembly or directly provided to the fan housing. The first-stage refrigerating element and the second-stage refrigerating element are preferably semiconductor refrigerating elements, and the semiconductor refrigerating element 10/10 'comprises a middle electric coupling layer 12, and a hot surface 11' and a cold surface 13 at two ends. The middle galvanic couple layer 12 is an internal circuit of the semiconductor refrigerating element formed by arranging and electrically connecting PN galvanic couple particles according to a hot end circuit arranged on a hot surface and a cold end circuit arranged on a cold surface, and is controlled by an anode and a cathode electrically connected with the control circuit board 4 or an independent circuit so as to control the semiconductor refrigerating element to work.

In particular embodiments, the primary cooling member 10' (and in particular the cold side 13) may be used directly as the work surface 113 or to cool the work surface 113. When the primary refrigerating element 10' is directly used as a working surface, a person skilled in the art can set an adaptive shape according to needs, for example, a whole transparent crystal is used as the cold surface 13 to be directly used as the working surface 113, and the hot surface 11' and the galvanic couple layer 12 are provided with light-transmitting windows, so that the primary refrigerating element 10' has light-transmitting property; for example, the cold surface 13, the hot surface 11' and the galvanic couple layer 12 are arranged in a ring shape or are collectively formed with a light-transmitting window, and in this case, the material is not limited. When the primary refrigeration member 10 'is connected to the working surface 113 for refrigeration, the cold surface 13 thereof is in contact with the working surface 113, for example, disposed at the periphery of the working surface, or the cold surface 13 of the primary refrigeration member 10' and the working surface 113 are in contact with the working surface 113 through a heat transfer element (or a heat conduction member).

A cold conducting piece (a first cold conducting piece) 15 is arranged to be connected between the primary semiconductor refrigerating piece 10 '(specifically, the hot surface 11') and the secondary semiconductor refrigerating piece 10 (specifically, the cold surface 13) in a rapid cold conducting manner; the heat of the primary semiconductor refrigerating piece 10' can be quickly transferred to the secondary semiconductor refrigerating piece 10, and the effect of refrigerating the working surface is achieved. The cold conducting member 15 is a heat transfer structural member, which may be a heat conducting material such as (without limitation) a heat conducting element made of a metal material, such as a copper pipe or a copper plate, or other heat transfer structure; preferably a heat pipe (heat pipe) or vapor chamber (vapor chamber) or (aluminum) super heat conducting pipe or (aluminum) super heat conducting plate. The cold conducting piece 15 can be designed to be in a shape adapted according to the shapes of the primary semiconductor refrigerating piece 10' and the secondary semiconductor refrigerating piece 10 by taking rapid heat dissipation as a principle. When the primary semiconductor refrigerating device 10' is directly used as the working surface 113, it has light transmittance or is provided with a light-transmitting window. One end of the cold conducting piece (heat pipe) 15, which is contacted with the working surface 113, can be designed into a ring shape and is closely contacted with the periphery of the hot surface 11 'of the primary semiconductor refrigerating piece 10' so as to quickly absorb the heat of the surrounding environment of the primary semiconductor refrigerating piece 10 'or the primary semiconductor refrigerating piece 10'; the end of the cold conducting member (heat pipe) 15 contacting the secondary cooling member 10 may be designed as follows: the secondary refrigerant member 10 is placed on the cold face 13 with a predetermined length extending from the annular bend and in intimate contact with the cold face 13.

The secondary semiconductor refrigerating element 10 enhances the heat dissipation effect by the heat dissipation component. The heat dissipation assembly comprises a heat pipe or an (aluminum) super heat conduction plate or a temperature equalizing plate, wherein the heat conduction shell 11 and the heat dissipation fins 16 arranged on the heat conduction shell 11 are formed by integrally splicing a single piece or a plurality of pieces, and the hot surface 11' of the secondary semiconductor refrigeration piece is arranged on the outer wall of the heat conduction shell 11, or the heat conduction shell 11 is directly used as the hot surface of the semiconductor refrigeration piece. The thermally conductive housing 11 serves to dissipate heat from the secondary refrigeration element 10. When the heat conducting shell is applied to the beauty instrument, the heat conducting shell 11 is positioned in a ventilation channel of the machine body; the secondary refrigeration piece 10 is arranged on the heat conduction shell 11, and the hot surface 11' of the secondary semiconductor refrigeration piece is attached to the outer wall of the heat conduction shell 11, so that the heat of the hot surface is directly conducted to the heat conduction shell 11; or, the hot side 11 'of the secondary semiconductor refrigeration part 10 is installed on the outer wall of the heat conduction shell 11 (heat pipe/temperature-uniforming plate/(aluminum) super heat conduction pipe/(aluminum) super heat conduction plate) through the heat conduction part, and the heat of the hot side 11' is quickly conducted to the heat conduction shell 11 (heat pipe/temperature-uniforming plate/(aluminum) super heat conduction pipe/(aluminum) super heat conduction plate) through the heat conduction part; or a hot end circuit of a semiconductor refrigerating part is arranged on the heat conducting shell 11 (the heat pipe/the temperature equalizing plate/(the aluminum) super heat conducting pipe/(the aluminum) super heat conducting plate) and is welded and electrically connected with PN galvanic couple particles of the galvanic couple layer 12. The heat conducting shell 11 is preferably formed by splicing a temperature equalizing plate/(aluminum) super heat conducting plate in an integral single sheet manner or in multiple sheet manners, and is a closed flat plate type cavity formed by a bottom plate, a frame and a cover plate, wherein a capillary structure is arranged in the cavity and contains working fluid. As a non-limiting example, one end of the heat conducting housing 11 forms an extending platform for installing or mounting the secondary semiconductor cooler 10, and the area of the heat conducting housing 11 is larger than the electric coupling layer 12 and the cold surface 13, so that the heat dissipation area of the hot surface 11' of the secondary semiconductor cooler 10 is increased.

The heat conductive housing 11 is provided with heat radiating fins 16 to increase a heat radiating area. The heat sink 16 may be disposed on the upper surface or the lower surface or both surfaces of the heat conductive housing 11 according to the heat dissipation requirement of the product. Preferably, the heat conductive housing 11 is located behind the ventilation opening of the cosmetic instrument body, and the upper heat sink thereof faces the ventilation opening 111 of the body. The heat sink 16 is one or more sets of fins of thermally conductive material.

The heat dissipating assembly of the secondary cooling member 10 further includes a fan 18, the fan 18 being located in the ventilation passage of the cosmetic instrument body for enhancing the heat dissipating (cooling) efficiency. In this embodiment, the configurations of the cooling fan 180, the secondary cooling element 10, the heat conducting shell 11 (heat pipe/temperature equalizing plate/(aluminum) super heat conducting plate), and the cooling fins 16 refer to the embodiments shown in fig. 10-15 and the above description, which are directly incorporated into this embodiment and not repeated herein. The fan 18 comprises a fan shell 180 and an impeller 181 arranged in the cavity inside the shell, and the fan shell 180 is provided with a plurality of openings as a plurality of ventilation openings 182 of the fan 18; the plurality of ventilation openings 182 of the fan 18 are used for air intake and air outtake, and are communicated with the inner cavity of the fan housing 180 to form a ventilation channel of the fan 18, and communicated with a ventilation channel in the machine body. The heat conductive housing 11 (heat pipe/vapor chamber/(aluminum) super heat pipe) may be part of the fan housing 180 or mounted on the fan housing 180.

The two-stage refrigeration module 1 of the present embodiment is applied to refrigeration and heat dissipation of the photon beauty instrument 100, and referring to fig. 31 to 32, the heat dissipation component of the two-stage refrigeration module 1 is simultaneously used for heat dissipation of the light source component 2. The light source assembly 2 includes a lamp tube 20, a reflector 21 outside the lamp tube, the lamp tube 20 is an IPL lamp tube for generating IPL photons or a halogen lamp or other suitable light source. The air duct of light source subassembly 2 and the air duct intercommunication of fan 18, and with in the fuselage the air duct intercommunication forms the heat dissipation air duct of light source subassembly 2, promotes the heat dissipation of light source subassembly 2 by fan 18. The reflector may be provided with a heat conducting member 22 on one side, such as (but not limited to) the heat conducting member 22 being a set of heat conducting fins (made of heat conducting material), one end of the heat conducting member being connected to the outer wall of the reflector, and the other end of the heat conducting member extending to the ventilation opening 182 of the fan 18. A plurality of ventilation openings 182 are formed on the casing of the fan 18, specifically on the periphery of the frame outside the fan blades, as shown in fig. 13, three ventilation openings 182 are formed on the periphery, one (first) ventilation opening is installed with the heat conducting member of the reflective cup, and the ventilation channel of the fan 18 is communicated with the ventilation channel in the machine body to form a first ventilation channel 101 (refer to arrow mark line in fig. 4) for dissipating heat for the heat conducting member 22 of the reflective cup and the heat conducting shell 11 (heat pipe/temperature equalizing plate/(aluminum) super heat conducting pipe/(aluminum) super heat conducting plate), at this time, external air or cold air enters from the ventilation openings 111 (including but not limited to a group of honeycomb holes and the gaps of the casing) opposite to the heat dissipating fins 16, enters the fan 18 through the heat-conducting shell 11 of the heat sink 16 and the (heat pipe/temperature-uniforming plate/(aluminum) super heat-conducting pipe/(aluminum) super heat-conducting plate), the impeller makes the air flow circulate in the inner cavity of the fan and flow through the heat-conducting part 22 of the reflector cup and the heat-conducting shell 11 of the (heat pipe/temperature-uniforming plate/(aluminum) super heat-conducting pipe/(aluminum) super heat-conducting plate), the heat of the reflector cup 21 and the heat-conducting shell 11 of the (heat pipe/temperature-uniforming plate/(aluminum) super heat-conducting plate) is taken away, the air is exhausted from the fan through another (second) vent 182 on the fan frame, and the air passes through the vent in the machine body from the end of the machine body (including but not limited to a group of honeycomb holes and the heat-conducting pipe/(aluminum) super heat-conducting plate) and the vent in the machine body Gap of body) 111 is discharged outside the machine body, so that the heat conducting piece 22 of the reflecting cup and the (heat pipe/temperature equalizing plate/(aluminum) super heat conducting pipe/(aluminum) super heat conducting plate) heat conducting shell 11 dissipate heat. The third air vent 182 on the fan rib is communicated with the air channel inside the lamp tube, and the air channel of the fan 18 is communicated with the air channel inside the body to form a second air channel 102 for dissipating heat to the reflector cup 21 and the lamp tube 20. At this time, external air or cold air enters from the ventilation opening 111 of the housing opposite to the heat sink 16, passes through the heat sink 16 and the (heat pipe/temperature equalization plate/(aluminum) super heat conduction pipe/(aluminum) super heat conduction plate) heat conduction shell 11, enters into the fan 18 from the central through hole of the temperature equalization plate 11, part of the air flow is discharged out of the fan through another ventilation opening 182 on the fan surrounding bone by the impeller and enters into the reflective cup 21, the heat taking away from the lamp tube 20 and the reflective cup inside the reflective lamp is discharged out of the lamp tube and is discharged out of the housing through the ventilation channel inside the housing from the ventilation opening 111 at the end of the housing, and the heat dissipation of the lamp tube 20 and the reflective cup 21 is further promoted. The heat sink assembly and heat dissipation principles are the same as in the embodiment of fig. 1-14.

In the beauty apparatus 100 of the present invention, the working surface 113 is formed by the transparent crystal cold surface of the primary cooling member 10', as in the embodiment shown in fig. 1 to 14. The photon beauty treatment can be a depilating instrument, a photon skin tendering instrument, a leading-in and leading-out beauty treatment instrument, a photon radio frequency beauty treatment instrument and the like, and the refrigeration module of the embodiment can be adopted. The primary refrigerating part 10 is arranged at the end, namely the working surface, contacting the skin in the photon beauty instrument and acts on the skin for refrigeration, the heat of the primary refrigerating part 10 '(particularly the hot surface 11') absorbs the heat through the evaporation end of the cold guide part (heat pipe/temperature equalizing plate/(aluminum) super heat conduction pipe/(aluminum) super heat conduction plate) 15 and enters the internal channel to transfer the heat to the condensation end, the condensation end is provided with the secondary refrigerating part 10 to carry out active refrigeration on the condensation end, and the temperature of the condensation end at the moment depends on the power of the secondary refrigerating part 10. Because the temperature of the condensation end is far lower than the temperature of the ambient wind, the condensation speed and the timeliness of the condensation end are greatly improved, so that the internal phase change circulation of the cold guide piece (heat pipe/temperature equalizing plate/(aluminum) super heat conduction pipe/(aluminum) super heat conduction plate) is accelerated, and the beneficial effect of improving the front-end refrigeration is achieved; the heat dissipation surface 11 'of the secondary refrigeration part 10 is close to the air inlet or the air outlet of the fan, the heat dissipation of the secondary refrigeration part can directly take away the heat by the fan by adopting a copper/aluminum heat conduction sheet 16, the heat on the heat dissipation surface 11' of the secondary refrigeration part 10 can be conducted to the fan shell by a heat pipe/temperature equalizing plate/(aluminum) super heat conduction plate, and the heat is taken away by the heat dissipation sheet 16 arranged on the wall of the fan shell through blowing or induced draft of the fan.

The beauty instrument 100 of the embodiment shown in fig. 31-32 has the same structure as the beauty instrument of the embodiment shown in fig. 1-7, and the description of the corresponding embodiment is directly incorporated into the present embodiment and will not be repeated here. Based on the principle of heat pipes, the heat vaporized at the evaporation end of the cold conducting member 15 needs to be "conducted" to the heat sink 16 through the pipe wall at the condensation end, and then taken away by the fan 18, the condensation is driven/passive heat dissipation, and the heat dissipation effect at the condensation end depends on the ambient temperature of the wind sucked by the fan; such as aging and speed of condensation, may be deteriorated to thereby affect the internal circulation of the heat pipe. Only the primary semiconductor refrigerating element 10' is adopted to refrigerate the skin, so that the heat conduction efficiency is uneven, the heat conduction is slow, the heat conduction timeliness is poor, and the problem of uneven heat at the front end, the rear end, the left end, the right end or the upper end and the lower end of the radiating fin exists when the heat is conducted to the radiating fin, so that the fan can influence the heat dissipation effect when the fan can achieve the maximum effect on partial wind sucked or blown out; in the embodiment, the two-stage refrigeration module 1 is adopted, and the first-stage refrigeration piece 10 'is transmitted to the second-stage refrigeration piece 10 by the cold guide piece 15, so that the problem that only the first-stage refrigeration piece 10' is adopted is effectively solved.

In other embodiments, the secondary cooling member 10 is rapidly cooled using the heat sink assembly of the refrigeration module of the embodiment shown in fig. 20-26, i.e., the primary cooling member 10' (and in particular the hot side 11' thereof) is rapidly heat-conductively coupled to the secondary cooling member 10 (and in particular the cold side 13 thereof) via the cold conductive member 15 (15 ') to rapidly conduct cold. The heat generated at the hot side 11' of the secondary semiconductor cooling device 10 is rapidly dissipated by the heat conducting structure 19 and the heat sink 16. The heat conducting structure 19 comprises a heat conducting plate 190 and a plurality of aluminum VC/ALVC superconducting tubes 191, wherein each aluminum VC/ALVC superconducting tube 191 is a single tube. The hot side 11 'of the secondary semiconductor refrigerating element 10 is disposed on the outer wall of the heat conducting plate 190, or the heat conducting plate 190 directly serves as the hot side 11' of the secondary semiconductor refrigerating element 10. The secondary semiconductor refrigerating element 10 is arranged on one side of the outer wall of the heat conducting plate 190, the plurality of open grooves 192 are arranged on the other side of the outer wall of the heat conducting plate 190, the plurality of open grooves 192 are matched with the plurality of aluminum VC/ALVC superconducting pipes 191, and the aluminum VC/ALVC superconducting pipes 191 are accommodated in the open grooves 192. The heat-conducting plate slots 192 are connected, e.g., riveted/welded, to the aluminum VC/ALVC superconducting tubes 191 to increase the contact area between the two for rapid heat transfer. The heat dissipation assembly further comprises a heat dissipation fan assembly, and the heat dissipation fan can be implemented by adopting the structures of the above embodiments or a common fan.

In the following embodiments, referring to fig. 33 to 54, the secondary cooling member 10 of the above embodiment is used to dissipate heat quickly by using the cooling fan module 200. In this embodiment, the heat dissipation fan module 200 includes a fan housing 210 and an impeller 220, wherein the fan housing 210 has a cavity therein, and the impeller 220 is mounted in the cavity; the fan shell 210 is provided with a plurality of vents 201, the vents 201 communicate the cavity with the external air path of the fan, and at least part of the shell of the fan shell 210 is composed of a heat pipe or a super heat conducting plate or VC 211. The fan housing 210 includes a side elevation housing, and an upper case and a bottom case may be selectively disposed at the top and the bottom according to specific product requirements, and may be formed of an upper fin or a lower fin of a heat sink as described below, and are not separately disposed. The side elevation housing may be a volute outside the circumference of rotation of the impeller or a partial housing of the volute.

Preferably, the super heat conduction pipe is an aluminum superconducting pipe, and the super heat conduction plate is an aluminum superconducting plate. The through channel 2110 in the aluminum superconducting pipe or the aluminum superconducting plate is a single channel or a plurality of channels; the single channel or the multiple channels are porous microgroove channels; the channel 2110 and the porous microgrooves 2111 on the inner wall thereof are communicated with each other; the single channel or the multi-channel is sealed at two ends and internally packaged with working fluid.

The fan shell comprises a volute outside the impeller, and the volute surrounds to form a cavity inside the fan; the top of the volute can be provided with an upper shell or the top forms a ventilation opening 201, and the bottom is a bottom shell or forms the ventilation opening 201; the vent at the top can also be a plurality of through holes arranged on the upper shell, and the vent at the bottom can also be a plurality of through holes arranged on the bottom shell. The volute or the upper shell or the bottom shell is partially or completely composed of a heat pipe or a super heat conducting plate or VC 211. The heat pipe or super heat conducting plate or VC 211 is integrated in a single piece or spliced in multiple pieces.

The cooling fan module 200 comprises a heat sink 212, and the heat sink 212 is connected with the heat pipe or super heat conducting plate or VC 211 in a rapid heat transfer manner. The heat sink 212 is located within a cavity within the fan housing. The heat sink 212 includes one or more sets of fins of thermally conductive material; the air channels between the adjacent fins, namely the air channels of the radiating fins are communicated with the ventilation openings and the cavity of the fan.

Preferably, the side vertical surface of the fan shell, namely the volute is provided with a heat pipe or a super heat conducting plate or VC 211; the heat sink 212 is disposed on the inner wall of the side vertical surface, and is spaced from the impeller 220 by a predetermined distance, so that the rotation of the impeller 220 is not affected. More preferably, the volute side vertical surface is formed by a single-channel or multi-channel aluminum superconducting pipe or an aluminum superconducting plate to form a heat-conducting shell; the heat sink 212 is disposed on the inner wall of the heat conductive housing. The fins are arranged along the radial circumference of the rotation center of the impeller; the air duct between adjacent fins is in the same direction with the air flow generated by the rotation of the impeller.

More than two fine bone-shaped microgrooves 2111 are formed on the inner wall of a single channel or a plurality of channels 2110 of the aluminum superconducting pipe or the aluminum superconducting plate; the groove direction of the micro grooves 2111 is along the radial circumference of the rotation center of the impeller and is consistent with the direction of the air flow generated by the rotation of the impeller. The wall material of the micro grooves 2111 forms a porous structure therein. The channels 2110, the micro grooves 2111 and the porous structure inside the material are formed in one piece by an aluminum extrusion process.

Preferably, the cooling fan module 200 of the present invention includes a secondary semiconductor cooling element 10, and a cooling surface (hot surface) of the secondary semiconductor cooling element 10 is connected to a heat pipe or a super heat pipe or a VC 211 in a rapid heat conduction manner. The heat dissipation surface of the secondary semiconductor refrigeration piece 10 is in mutual laminating contact heat transfer with the heat pipe or the super heat conduction plate or the VC 211 or is in mutual laminating contact heat transfer through the heat conduction plates, or the heat dissipation surface of the secondary semiconductor refrigeration piece 10 and the heat pipe or the super heat conduction plate or the VC 211 are respectively arranged at different positions of the fan shell and are mutually and rapidly conducted in heat.

The cooling fan module 200 comprises a driving control circuit board 240 and a driving module 250, wherein the driving control circuit board 240 is electrically connected with the driving module 250, and the driving control circuit board 240 and the driving module 250 are electrically connected with an external power supply through a power line or a power module; the driving module 250 is used to drive the impeller 220 to rotate. The electrodes of the secondary semiconductor cooling member 10 are electrically connected to the driving control circuit board 240 or to an external circuit board.

In some embodiments, the driving control circuit board 240 is disposed outside the fan housing to be waterproof; the ventilation opening 201 is provided with a sealing ring for water proofing; the driving module 250 is disposed on the driving control circuit board 240 and is mounted outside the fan bottom case 214; since the driving control circuit board 240 and the driving module 250 and the fan impeller 220 are respectively installed inside and outside the fan bottom case 214, when water is sucked or entered into the fan, the driving control circuit board 240 and the driving module 250 are not affected. The drive module 250 includes a motor having an output shaft coupled to the impeller shaft to drive the impeller 220 to rotate; or, the driving module 250 includes a stator coil of the motor, the magnetic ring 25 is sleeved inside the impeller, the magnetic ring 25 is fixedly connected with the impeller 220, the driving module 250 generates a magnetic field after being electrified, and the magnetic ring 25 rotates to drive the fan impeller to rotate.

The heat dissipation fan module 200 is a radial flow fan or an axial flow fan; in the radial flow fan, the airflow generated by the rotation of the impeller 220 can be exhausted from a vent on the volute after circulating along the radial circumference of the rotation center of the impeller; in the axial flow fan, the airflow generated by the rotation of the impeller 220 is discharged from the top or bottom vent of the volute in the direction of the central axis.

In some embodiments, the ventilation opening 201 of the fan is provided with a heat sink 212, and the air duct of the heat sink is communicated with the cavity of the fan and the external environment.

The heat pipe (heat pipe) or the Vapor Chamber (VC) in the present invention utilizes the heat conduction principle and the fast heat transfer property of the refrigerant medium to quickly transfer the heat of the heat generating object out of the heat source through the heat pipe. The heat is transferred by evaporation and condensation of liquid in the totally-enclosed vacuum tube or the vacuum plate, the refrigeration effect is achieved by utilizing fluid principles such as capillary action and the like, and the heat pump has a series of advantages of high heat conductivity, excellent isothermality, heat flow density variability, heat flow direction reversibility and the like. The heat exchanger composed of the heat pipe (heat pipe) or the vapor chamber (vapor chamber) has the advantages of high heat transfer efficiency, compact structure, small fluid resistance loss and the like.

The super heat conducting pipe or the super heat conducting plate in the invention is preferably an aluminum super heat conducting pipe/aluminum super heat conducting plate. The (aluminum) superconductive heat pipe or (aluminum) superconductive plate, or ALVC superconductive pipe (plate), utilizes evaporation refrigeration and gas-liquid phase change to make heat quickly conducted. Compared with a common heat pipe and a VC temperature equalizing plate, the aluminum superconducting heat pipe/aluminum superconducting heat plate can form microgrooves, microteeth or micropore channels on the surface of the superconducting heat pipe or the superconducting heat plate through an aluminum material processing forming (extrusion forming) process to serve as a capillary structure inside the superconducting pipe or the superconducting plate. Copper powder can not be added into the aluminum superconducting pipe (plate), namely the ALVC aluminum superconducting pipe (plate), aluminum powder or aluminum-silicon powder and the like can be filled into the aluminum superconducting pipe (plate), an aluminum net can be added, and a refrigerant is filled into the aluminum superconducting pipe (plate) and then the aluminum superconducting pipe (plate) is sealed.

The following embodiments are described in conjunction with the accompanying drawings, and the embodiments are only for those skilled in the art to understand and implement the technical solutions of the present invention, and do not limit the present invention. The protection scope of the invention is subject to the claims. The structure of the fan module 200 of the following embodiments may be replaced, combined or modified, and all of them fall within the scope of the disclosure.

Referring to fig. 33 to 40, a heat dissipation fan module 200 according to a first embodiment of the present invention is a blower module, and includes a fan housing 210 having a cavity formed therein, an impeller 220 mounted in the cavity, and a secondary semiconductor cooling device 10 mounted on the fan housing. The fan housing 210 includes a volute casing on a side vertical surface, the volute casing is covered outside the impeller 220, the volute casing is a heat-conducting shell, the inner wall of the volute casing is provided with heat-radiating fins 212, and the volute casing is integrally formed by a heat pipe or a super heat-conducting plate or a VC 211. The present embodiment is described by taking an example in which the scroll casing is an aluminum superconducting pipe or an aluminum superconducting plate as a whole.

The volute casing and the top of the side elevation of the fan housing 210 are provided with air vents 201, the air vents 201 communicate the cavity with the air path outside the fan, for example, air can be fed from the air vents at the top, and after entering the cavity, the impeller 220 promotes the air flow to circulate to bring away the surface heat of the heat dissipation fins 212, and finally the heat is discharged from the air vents at the side elevation. Referring to fig. 34, a plurality of ventilation openings 201 may be formed at the bottom of the fan housing 210, that is, the bottom case 214, for auxiliary air intake, the fan of the present embodiment is radial flow, air is intake through the top and bottom ventilation openings in the direction of the impeller or the fan shaft, air is output through the ventilation openings of the side vertical surfaces, the air intake and the air output may be interchanged, and the air intake and the air output are not limited.

In this embodiment, the fan housing 210 houses a side elevation volute and a bottom housing, with the top open to act as a vent. The side vertical surface volute is an integral heat conduction shell formed by a single heat pipe or a super heat conduction plate or VC 211 (shown in figures 35-37 and 39), or a heat conduction shell formed by a plurality of heat pipes or super heat conduction plates or VC 211 (shown in figure 38), the heat pipes or the super heat conduction plates or VC 211 are tightly contacted with the heat dissipation fins 212 on the inner layer for heat conduction, and the heat pipes or the super heat conduction plates or the VC 211 and the heat dissipation fins 212 can be connected in a welding mode, a riveting mode, an adhering mode or other modes, so that heat is rapidly transferred.

Preferably, the side-elevation volute casing is made of an aluminum superconducting pipe or an aluminum superconducting plate 11, and can be formed by splicing a single piece or multiple pieces to form a heat-conducting casing, a through channel 2110 in the length direction in each piece of aluminum superconducting pipe or aluminum superconducting plate 11 is a single channel or multiple channels, two ends of each channel are sealed, and the inside of each channel is filled with working fluid. The inner wall of each channel 2110 forms a plurality of thin bone-shaped microgrooves 2111, and the microgrooves 2111 are communicated with the channel 2110 in which the microgrooves 2111 are located, so that the working fluid can flow through the microgrooves. The interior of the material forms a porous structure. The pores and microgrooves 2111 form a capillary action within the channel 2110. Copper powder can not be added into the channel 2110, aluminum powder or aluminum-silicon powder and the like can be filled, an aluminum net can be added, and the channel is sealed after a refrigerant is filled. The multiple holes, the microgrooves 2111 and the channels 2110 can be simultaneously formed by aluminum processing (extrusion) and molding to form a tube shape, and form a capillary structure inside the aluminum superconducting tube or the aluminum superconducting plate 11. The groove direction of the micro-grooves 2111 and the length direction of the channel 2110 may be in the direction of impeller rotation (as shown in fig. 36-39), or may be vertically oriented in the axial direction, as shown in fig. 40.

The heat sink 212 is one or more sets of fins of heat conductive material, and the position, number and arrangement of the heat sink can be set according to the space of the fan cavity. One or more sets of fins are integrally formed or welded or riveted or fixed by other fastening mechanisms to form an integral structure of the heat sink 212; alternatively, one or more sets of thermally conductive material fins (e.g., aluminum/copper/graphene or other thermally conductive fins) are disposed on the thermally conductive plate to form an integral structure of the heat sink 212. The shape of the heat sink 212 is matched with the shape of the volute, the heat pipe, the super heat conducting plate or the VC 211, in this embodiment, the heat sink 212 is integrally a cylinder or a ring, and is sleeved on the inner wall of the heat conducting shell formed by the ring heat pipe, the super heat conducting plate or the VC 211, and is directly attached to the inner wall or is attached to the inner wall through the heat conducting pieces, so as to achieve heat transfer in an express manner. The ventilation opening of the side vertical surface can be formed by enabling an air channel between fins of the radiating fin 212 to penetrate through the outside and the inside of the cavity, and the radiating fin 212 outside the ventilation opening can be fixed through a heat conducting plate or a fixing piece to be fixed on the inner wall of a heat conducting shell formed by a heat pipe, a super heat conducting plate or VC 211; or at the ventilation opening of the side vertical surface, the fin and the heat pipe or the super heat conduction plate or the VC 211 are disconnected to form a channel for communicating the fan cavity with the outside. In this embodiment, the top heat sink is used as the top casing of the fan, so that the top casing, the bottom casing of the fan and the impeller assembly form an air duct, and the top opening forms an air vent without separately installing the top casing of the fan.

The secondary semiconductor refrigeration device 10 includes a middle galvanic couple layer, and a hot surface (heat dissipation surface) and a cold surface at both ends. The hot surface of the secondary semiconductor refrigerating part is connected with the heat pipe or the super heat conducting plate or the VC 211 in a rapid heat conducting manner. The heat dissipation surface of the secondary semiconductor refrigeration piece 10 is in mutual joint contact with the heat pipe or the super heat conduction plate or the VC 211 for heat transfer or is in mutual joint contact heat transfer through the heat conduction plates, or the outer wall of the heat pipe or the super heat conduction plate or the VC 211 is directly used as the hot surface of the secondary semiconductor refrigeration piece, a hot end circuit is arranged on the hot end circuit, and the hot end circuit is welded with the galvanic couple layer and is electrically connected with the galvanic couple layer to form an internal circuit of the secondary semiconductor refrigeration piece. In this embodiment, the hot surface of the secondary semiconductor refrigeration device 10 is attached to the outer wall of the heat pipe, the super heat conducting plate, or the VC 211.

The impeller 220, the drive control circuit board 240 and the drive module 250 are mounted on the fan bottom case 214, the drive module 250 is a motor, an output shaft of the motor is coupled to a central shaft 221 of the impeller, and the impeller is driven to rotate by the forward and reverse rotation of the motor.

Referring to fig. 41-42 as an alternative, the secondary semiconductor cooling element 10 is disposed on the outer wall of the bottom casing 214 of the fan, for example, the secondary semiconductor cooling element 10 is attached to the bottom casing 214 in a contact manner. The fan bottom case 214 is a heat conducting member, which may be made of a heat conducting material such as a metal plate or a heat pipe or a VC or a superconducting plate, and the fan bottom case 214 is connected with the heat pipe or a super heat conducting plate of the side elevation or the VC 211 in a rapid heat transfer manner.

Referring to fig. 33 to 47, the heat dissipating fan module 200 according to the second embodiment of the present invention is an axial fan module, and includes a fan housing 210 forming a cavity therein, an impeller 220 installed in the cavity, and a secondary semiconductor cooling device 10 installed on the fan housing. The fan housing 210 includes a volute of a side elevation, and the volute is integrally formed by a heat pipe or a super heat conducting plate or a VC 211. The side elevation of the fan shell, namely the volute is provided with a heat pipe or a super heat conducting plate or VC 211; more preferably, the volute side elevation is formed by a single-channel or multi-channel aluminum superconducting pipe or an aluminum superconducting plate to form a heat-conducting shell. The radiating fins 212 are arranged on the inner wall of the side vertical face, the fins of the radiating fins 212 are annularly arranged along the diameter direction, and the air channels among the fins are communicated along the axial direction. In the cavity, a circle of fins are arranged above the impeller 220 to form top radiating fins 212, a circle of fins are arranged below the impeller 220 to form bottom radiating fins 212, air channels of the upper radiating fins and the lower radiating fins are aligned better, ventilation openings at the top and the bottom of the fan are formed respectively and used for air inlet and air outlet, the impeller 220 rotates to suck air from the air channels (air inlet ventilation openings) of the top radiating fins and discharge the air downwards along the air channels (air outlet ventilation openings) of the bottom radiating fins 212 in the axial direction, and the air inlet direction and the air outlet direction can be interchanged.

The second embodiment of the cooling fan module 200 is the same as the first embodiment, the heat pipe or super heat conducting plate or VC 211 is used as an integral single piece or a heat conducting shell formed by multi-piece splicing, and the cooling fins on the inner wall can be connected in a quick heat transfer manner by welding, riveting, bonding or other fixing methods. Preferably, the vertical volute casing is a heat-conducting shell formed by single-channel or multi-channel aluminum superconducting pipes or aluminum superconducting plates, and more than two fine bone-shaped microgrooves 2111 are formed on the inner wall of the single-channel or multi-channel 2110 of the aluminum superconducting pipes or aluminum superconducting plates; a plurality of micropores are formed in the material within the walls of the microchannels 2111. The channel 2110 and the groove direction of the porous micro grooves 2111 are arranged in the axial direction of the rotation center of the impeller, and coincide with the direction of the air flow generated by the rotation of the impeller.

The second-stage semiconductor refrigeration piece 10 is arranged on the outer wall of the side vertical face heat conduction shell, the heat dissipation surface (hot surface) of the second-stage semiconductor refrigeration piece is in quick heat conduction connection with the heat pipe or the super heat conduction plate or the VC 211 of the side vertical face, or the heat pipe or the super heat conduction plate or the VC 211 is directly used as the heat dissipation surface (hot surface) of the second-stage semiconductor refrigeration piece 10, and the outer wall of the second-stage semiconductor refrigeration piece is provided with a heat end circuit which is electrically connected with the semiconductor galvanic couple layer and is welded.

The impeller 220 is rotatably mounted by a fixing bracket 223 and a clamping ring 222 which are arranged in the cavity, the fixing bracket 223 is provided with a central shaft of the impeller, the central shaft is inserted into a central shaft hole of the impeller 220, and the top of the impeller is clamped and fixed by the clamping ring 222.

The drive control circuit board 240 and the drive module 250 are disposed outside the bottom of the volute, in this embodiment, the drive module 250 is a motor, an output shaft of the motor is coupled to the central shaft 221 of the impeller, and the impeller is driven to rotate by the forward and reverse rotation of the motor.

The heat dissipation fan module 200 of the present invention utilizes the heat pipe/VC/(aluminum) super heat conduction pipe/(aluminum) super heat conduction plate, etc. as the casing (which may be a side vertical surface, an upper cover, a bottom cover, a volute) of the fan, and utilizes the characteristic of phase change heat conduction to rapidly transfer the heat source to the cavity of the fan, and the heat dissipation is performed by the air flow generated when the fan impeller rotates. The invention effectively utilizes the internal space of the fan to ensure that the product volume is smaller and the heat dissipation efficiency is higher; more effectively combines with the application product, and reduces the original shell material cost of the fan. The contact area of the radiating fins and the air flow is enlarged. The invention improves the heat dissipation efficiency under the condition of the same heat dissipation requirement, thereby reducing the speed, the current, the noise and the like of the fan.

Another technical feature of the cooling fan module 200 of the present invention is that when the application product is used for semiconductor refrigeration, the cooling surface of the refrigeration member can be directly attached (contacted) with the casing of the fan (i.e., the heat conducting member: heat pipe/VC/(aluminum) super heat conducting pipe/(aluminum) super heat conducting plate); the heat transfer distance is effectively shortened, and the heat transfer is accelerated. The effect of the application product is better.

Referring to fig. 48 to 54, the heat dissipation fan module 200 of the third embodiment of the present invention, which can be used as a waterproof fan, preferably a magnetic fan module, includes a fan housing 210 forming a cavity therein, an impeller 220 installed in the cavity, and a secondary semiconductor cooling device 10 installed on the fan housing. The fan housing 210 includes a volute on a side elevation, an upper shell 215 on the top of the volute, and a bottom shell 214 on the bottom, and together enclose a cavity forming the interior of the fan. The arc-shaped part of the volute is composed of a heat pipe, a super heat conducting plate or VC 211; more preferably, the volute side elevation, i.e. the volute, comprises an arc-shaped heat-conducting shell formed by single-channel or multi-channel aluminum superconducting pipes or aluminum superconducting plates. The radiating fins 212 are arranged on the inner wall of the arc-shaped heat conducting shell of the side vertical face, fins of the radiating fins 212 are arranged in an arc shape along the diameter direction, and an air channel between the fins is communicated along the radial arc direction. In this embodiment, the fan vent 201 is disposed on the side vertical volute for air intake and air exhaust. The upper and lower shells are not provided with vents to facilitate waterproofing.

The cooling fan module 200 of the third embodiment is similar to the first and second embodiments, the arc-shaped heat-conducting casing of the side-elevation volute casing is composed of heat pipes or super heat-conducting plates or VC 211, the heat-conducting casing is formed by integral single-piece or multi-piece splicing, and the cooling fins on the inner wall can be connected in a quick heat-transferring manner by welding, riveting, bonding or other fixing methods. Preferably, the vertical volute casing is an arc-shaped heat-conducting shell formed by single-channel or multi-channel aluminum superconducting pipes or aluminum superconducting plates, and more than two fine bone-shaped microgrooves 2111 are formed on the inner wall of the single-channel or multi-channel 2110 of the aluminum superconducting pipes or the aluminum superconducting plates; a plurality of micro-holes are formed in the material within the walls of the micro-grooves 2111. The channel 2110 and the groove direction of the porous micro grooves 2111 are arranged along the radial arc direction of the rotation center of the impeller, and coincide with the direction of the air flow generated by the rotation of the impeller.

The second-stage semiconductor refrigerating part 10 is arranged on the outer wall of the side vertical face heat conduction shell, a heat dissipation surface (hot surface) of the second-stage semiconductor refrigerating part is connected with a heat pipe or a super heat conduction plate or VC 211 of the side vertical face in a rapid heat conduction mode, or the heat pipe or the super heat conduction plate or the VC 211 is directly used as the heat dissipation surface (hot surface) of the second-stage semiconductor refrigerating part 10, and a hot end circuit is arranged on the outer wall of the second-stage semiconductor refrigerating part and is electrically connected with and welded with the semiconductor galvanic couple layer. Alternatively, the secondary semiconductor cooling element 10 is disposed on the upper shell 215 or the bottom shell 214, and the upper shell 215 or the bottom shell 214 is connected to the arc-shaped heat-conducting shell in a rapid heat-transferring manner. The hot surface of the secondary semiconductor refrigerating piece is arranged on the fan shell in a fitting contact manner.

The impeller 220 is located in the cavity and mounted on the bottom shell 214, a shaft hole is formed in the center of the impeller 220, a shaft sleeve 229 is fixedly arranged in the shaft hole, a convex ring is formed on the inner wall of the shaft sleeve 229, an upper bearing 228 and a lower bearing 226 are mounted in the shaft sleeve 229 and located above and below the convex ring respectively, a magnetic ring is sleeved in the impeller 220, specifically, an annular cavity is formed in the impeller in the shaft sleeve 229, and the inner wall of an outer ring of the annular cavity in the impeller, which is sleeved with the magnetic ring, is fixed with the impeller 220.

The bottom shell 214 is provided with a central shaft 221 of the impeller, a hollow annular boss is formed on the bottom shell, the central shaft is arranged in the center of the boss, the bottom of the central shaft 221 is elastically clamped by a spring 227, the central shaft 221 is inserted into an inner shaft sleeve of a central shaft hole of the impeller 220 and is matched with a bearing and a convex ring, a clamping groove is formed in the top of the central shaft 221, and the clamping groove is clamped by a clamping ring 222 to prevent the central shaft from falling off. The top of the hollow annular boss on the bottom case 214 is fittingly inserted into the annular cavity inside the impeller 220, the driving module 250 is installed in the hollow cavity defined by the hollow annular boss formed on the bottom case 214, and the driving control circuit board 240 is located outside the bottom case 214. In this embodiment, the driving control circuit board 240 and the driving module 250 are disposed outside the bottom of the volute, the driving module 250 includes a motor stator coil 251, and the driving module generates a magnetic field after being powered on, so as to drive the fan impeller 220 to rotate, and since the driving module 250, the driving control circuit board 240 and the fan impeller 220 are respectively disposed inside and outside the fan bottom case 214, when water is sucked into or entered into the fan, the driving module 250 and the driving control circuit board 240 are not affected. In this embodiment, the driving module 250 and the driving control circuit board 240 are separated from the fan assembly, and the driving control circuit board 240 is disposed outside the fan housing 210, so that water is prevented from being leaked from the air duct, and the driving control circuit board 240 is not affected by the water. When being applied to the product, the vent department of this embodiment can set up the sealing washer to can realize the waterproof between product and the fan module 200.

In the above embodiments, "cold conduction" and "heat conduction", "heat transfer" or "heat transfer" are to be interpreted as having the same meaning, both heat transfer and are used interchangeably. The symbol "/" denotes "or".

It should be understood that, in the foregoing embodiments, the terms of orientation such as "upper", "lower", "top", "bottom", "left", "right", "vertical", "horizontal", "transverse", "front", "back", etc. are used, and are not limited to absolute geographic orientations with respect to the relative positions of the components shown in the drawings.

Features of the above embodiments may be combined, interchanged or substituted for one another to yield different embodiments, which are within the scope of the disclosure of the embodiments of the present invention. In the embodiments described above, some common structures or the like are described in some embodiments, but not in other embodiments, and these common structures or the like are also applicable to these embodiments, and all of them belong to the disclosure of the embodiments of the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be a mechanical connection, and can also be an electrical connection or a connection capable of transmitting data; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other or mutually interacted. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, and these embodiments are to be considered within the scope of the invention; the scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a two-stage refrigeration module, includes one-level semiconductor refrigeration spare, its characterized in that: the refrigeration module also comprises a secondary semiconductor part and a cold conducting part; the primary and secondary semiconductor refrigerating pieces comprise a middle galvanic couple layer and hot surfaces and cold surfaces at two ends; the cold guide piece is connected between the primary semiconductor refrigerating piece and the secondary semiconductor refrigerating piece in a rapid cold guide mode; the cold conducting piece is a heat transfer structural piece.

2. A two-stage refrigeration module as set forth in claim 1 wherein: the two ends of the cold conducting piece are respectively connected with the hot surface of the primary semiconductor refrigerating piece and the cold surface of the secondary semiconductor refrigerating piece in a rapid heat transfer mode; the heat transfer structural part is one or a combination of a plurality of heat conduction elements, heat pipes, temperature equalizing plates, super heat conduction pipes and super heat conduction plates which are made of heat conduction materials.

3. A two-stage refrigeration module as recited in claim 2 wherein:

the super heat conduction pipe is an aluminum superconducting pipe, and the super heat conduction plate is an aluminum superconducting plate;

two ends of the aluminum superconducting plate or the aluminum superconducting pipe are sealed, and working liquid is packaged inside the aluminum superconducting plate or the aluminum superconducting pipe;

more than two microgrooves are formed on the inner wall of the aluminum superconducting plate or the aluminum superconducting pipe during aluminum material forming;

and forming a microporous structure in the aluminum superconducting plate or the aluminum superconducting pipe material during aluminum material forming.

4. A two-stage refrigeration module as recited in any of claims 1-3 wherein:

the refrigeration module comprises a heat conduction structure and a radiating fin; the heat conduction structure is one or a combination of a plurality of heat conduction elements, heat pipes, temperature equalization plates, super heat conduction pipes and super heat conduction plates which are made of heat conduction materials;

the heat conducting structure is connected with the radiating fin in a rapid heat transfer mode;

the heat conducting structure is connected with the hot surface of the secondary semiconductor refrigerating piece in a rapid heat transfer mode; or, the heat conducting structure is directly used as the hot surface of the secondary semiconductor refrigerating piece by arranging a hot end circuit of the secondary semiconductor refrigerating piece on the heat conducting structure and welding and electrically connecting the hot end circuit with the galvanic couple layer of the secondary semiconductor refrigerating piece;

the refrigeration module also comprises a fan; the fan comprises a shell and an impeller in the shell;

the heat conducting structure and/or the heat sink is disposed at the air vent of the fan or as a part of the fan housing.

5. The two-stage refrigeration module of claim 4, wherein:

the heat conduction structure comprises a plurality of aluminum superconducting plates or aluminum superconducting pipes, the aluminum superconducting plates or the aluminum superconducting pipes are single pipes, and a single channel is formed inside the aluminum superconducting plates or the aluminum superconducting pipes;

the aluminum superconducting plate or the aluminum superconducting pipe is bent in a plane or in a special-shaped 3D manner and is matched with the installation space;

the heat conduction structure also comprises a heat conduction plate, the plurality of aluminum superconducting plates or aluminum superconducting pipes are combined with the heat conduction plate, and the plurality of aluminum superconducting plates or aluminum superconducting pipes are distributed to comprise at least two different directions or angles so as to reduce the defect that the heat conduction effect is poor due to the effect of the antigravity direction;

the heat sink comprises one or more groups of fins of heat conductive material; the heat conducting plate is arranged in the groove on the radiating fin or at the top of the radiating fin, or the radiating fin and the heat conducting plate are arranged on another heat conducting part.

6. The two-stage refrigeration module of claim 5, wherein:

the heat conducting plate is provided with a plurality of open grooves, the aluminum superconducting plates or the aluminum superconducting pipes are matched with the open grooves and correspondingly arranged in the open grooves, and the wall surfaces are mutually contacted to realize rapid heat transfer;

the aluminum superconducting plate or the aluminum superconducting pipe is welded or riveted with the slot to increase the contact area;

the second-level semiconductor refrigeration piece is arranged on the heat conducting plate: the hot surface of the secondary semiconductor refrigerating piece is attached to the outer wall of the heat conducting plate, so that the heat of the hot surface is directly conducted to the heat conducting plate; or the hot surface of the secondary semiconductor refrigeration piece is arranged on the outer wall of the heat conducting plate through the heat conducting piece, and the heat of the hot surface is quickly conducted to the heat conducting plate through the heat conducting piece; or the heat conducting plate is used as a hot surface, and a hot end circuit of the secondary semiconductor refrigerating piece is arranged on the heat conducting plate and is welded and electrically connected with the PN galvanic couple particles of the galvanic couple layer;

the plurality of aluminum superconducting plates or aluminum superconducting pipes use two different directions or angles on an XY plane, or have a certain angle of intersecting line form, or annular or staggered or circulating design.

7. A two stage refrigeration module as recited in any of claims 1-3 wherein:

the secondary semiconductor refrigerating piece is used for dissipating heat by the cooling fan module;

the radiating fan module comprises a fan shell and an impeller, wherein a cavity is formed in the fan shell, and the impeller is arranged in the cavity; a plurality of ventilation openings are formed in the fan shell, and the ventilation openings are used for communicating the cavity with an external air path of the fan;

at least part of the fan housing is formed by a heat-conducting casing made of a material selected from the group consisting of: one or more of a heat conducting element, a heat pipe, a temperature equalizing plate, a super heat conducting pipe and a super heat conducting plate made of heat conducting materials are integrally formed in a single-piece mode or spliced in multiple pieces;

the hot surface of the secondary semiconductor refrigeration piece is in heat transfer connection with the heat conduction shell; or the heat-conducting shell is provided with a hot-end circuit of the secondary semiconductor refrigerating piece, and the hot-end circuit is welded and electrically connected with the galvanic couple layer of the secondary semiconductor refrigerating piece, so that the heat-conducting shell is directly used as the hot surface of the secondary semiconductor refrigerating piece.

8. The two stage refrigeration module of claim 7, wherein: the super heat conduction pipe is an aluminum superconducting pipe, and the super heat conduction plate is an aluminum superconducting plate; the heat dissipation fan module comprises a heat dissipation fin, and the heat dissipation fin is connected with the heat conduction shell in a rapid heat transfer mode; the air channel of the radiating fin is communicated with the ventilation opening and the cavity of the fan; the side facade shell of the fan shell comprises the heat-conducting shell.

9. The two-stage refrigeration module of claim 8, wherein:

the side vertical surface shell of the fan shell comprises the heat-conducting shell consisting of single-channel or multi-channel aluminum superconducting pipes or aluminum superconducting plates;

the radiating fins are arranged on the inner wall of the side vertical surface shell of the fan shell; the air duct direction of the radiating fins is the rotating direction or the axial direction of the impeller.

10. A photon beauty instrument comprises a machine body provided with a plurality of ventilation openings, wherein a light source component, a power supply component and a control circuit board are arranged in the machine body; the light source component and the power supply component are electrically connected with the control circuit board; a plurality of ventilation openings of the machine body are used for air inlet and air outlet and form a ventilation channel with the space in the machine body; the front end of the machine body is a working surface; the method is characterized in that: the fuselage is also provided with a two-stage refrigeration module as claimed in any one of claims 1~9, and the one-stage semiconductor refrigeration sheet is directly used as the working surface or used for refrigerating the working surface.

11. The photonic cosmetic apparatus of claim 10, wherein:

when the first-level semiconductor refrigerating sheet is directly used as a working face: the first-stage semiconductor refrigerating piece takes a transparent crystal as a cold surface, the cold surface is directly taken as a working surface, and a hot surface and a galvanic couple layer of the first-stage semiconductor refrigerating piece are provided with light transmission windows to ensure that the first-stage refrigerating piece has light transmission; or the cold surface, the hot surface and the galvanic couple layer of the primary semiconductor refrigerating sheet jointly define a light-transmitting window, and photons generated by the light source component are transmitted out of the working surface from the light-transmitting window;

when the first-stage semiconductor refrigerating piece refrigerates the working surface: the cold surface of the primary semiconductor refrigerating sheet is in contact with the working surface for heat transfer; or the cold surface of the primary refrigeration piece is connected with the working surface in a rapid heat transfer mode through a heat transfer structural piece.

12. The photonic cosmetic apparatus of claim 10, wherein:

the two-stage refrigeration module comprises a fan and is positioned in a ventilation channel in the machine body;

the light source component comprises a lamp tube and a reflecting cup, a ventilation channel in the reflecting cup is communicated with a ventilation channel of the fan and is communicated with the ventilation channel in the machine body to form a heat dissipation ventilation channel of the light source component, and the fan promotes the heat dissipation of the light source component;

one side of the reflecting cup is provided with a radiating fin or a heat conducting piece; a plurality of ventilation openings are formed on the shell of the fan; one of the ventilation openings is provided with a radiating fin or a heat conducting piece of the reflecting cup, and a ventilation channel of the fan is communicated with a ventilation channel in the machine body to form a first ventilation channel for radiating heat for the reflecting cup; the other ventilation opening of the fan is communicated with the air channel in the reflecting cup, and the ventilation channel of the fan is communicated with the ventilation channel in the machine body to form a second ventilation channel which is used for radiating heat for the reflecting cup and the lamp tube;

the photon beauty treatment is a hair removal instrument, a photon skin tendering instrument, a leading-in and leading-out beauty treatment instrument or a radio frequency beauty treatment instrument.