CN214795315U - Optical module - Google Patents

Abstract

The application provides an optical module, including: circuit board and tosa, wherein, tosa includes: a cover plate; the shell is covered with the cover plate to form a light emission cavity; an opening is formed in one side of the shell. One end of the circuit board extends into the light emission cavity through the opening; a colloid part is arranged between the circuit board and the opening for connection; a first coupling layer is arranged between the opening and the colloid part; the side of the first coupling layer, which is hydrophilic to the inorganic group, is connected with the side wall of the opening, and the other side of the first coupling layer is connected with the colloid part. One side of the coupling layer is an inorganic group which is connected with the shell, the other side of the coupling layer is an organic group which is connected with a colloid part formed by the sealant, so that the interface bonding strength of the sealant and the surface of the shell is increased, the stress resistance is increased, the interface damage is not easy to occur, water vapor is effectively prevented from entering from a gap between the surface of the shell and the colloid layer, and the performance cracking risk of the optical engine is reduced.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

The optical communication technology can be applied to novel services and application modes such as cloud computing, mobile internet, video and the like. The optical module realizes the function of photoelectric conversion in the technical field of optical communication, is one of key devices in optical communication equipment, and the intensity of an optical signal input into an external optical fiber by the optical module directly influences the quality of optical fiber communication.

The light emitting part of the optical module is packaged by micro-optical morphology, namely, the light emitted by the optical chip enters the air, devices such as a lens, an optical fiber adapter and the like are arranged on an optical path, the light emitted by the optical chip is coupled into the optical fiber adapter after passing through the lens, and the optical fiber adapter is connected with the optical fiber. The airtightness of the light emitting portion affects the optical power of an optical signal, and thus the airtightness is particularly important for an optical module of a micro optical morphology package structure.

SUMMERY OF THE UTILITY MODEL

The application provides an optical module to improve the light emission part your gas tightness of optical module gas tightness encapsulation.

In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:

the embodiment of the application discloses an optical module, includes: a circuit board;

a tosa, comprising:

a cover plate;

the shell is covered with the cover plate to form a light emission cavity; an opening is formed in one side of the shell;

one end of the circuit board extends into the light emission cavity through the opening;

a colloid part is arranged between the circuit board and the opening for connection;

a first coupling layer is arranged between the opening and the colloid part;

the side of the first coupling layer, which is hydrophilic to the inorganic group, is connected with the side wall of the opening, and the other side of the first coupling layer is connected with the colloid part.

Compared with the prior art, the beneficial effect of this application is:

the application provides an optical module, including: circuit board and tosa, wherein, tosa includes: a cover plate; the shell is covered with the cover plate to form a light emission cavity; an opening is formed in one side of the shell. One end of the circuit board extends into the light emission cavity through the opening; a colloid part is arranged between the circuit board and the opening for connection; a first coupling layer is arranged between the opening and the colloid part; the side of the first coupling layer, which is hydrophilic to the inorganic group, is connected with the side wall of the opening, and the other side of the first coupling layer is connected with the colloid part. One side of the coupling layer is an inorganic group which is connected with the shell, the other side of the coupling layer is an organic group which is connected with a colloid part formed by the sealant, so that the interface bonding strength of the sealant and the surface of the shell is increased, the stress resistance is increased, the interface damage is not easy to occur, water vapor is effectively prevented from entering from a gap between the surface of the shell and the colloid layer, and the performance cracking risk of the optical engine is reduced.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;

fig. 4 is an exploded structural diagram of an optical module according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of an tosa according to an embodiment of the present disclosure;

fig. 6 is an exploded schematic view of an tosa according to an embodiment of the present disclosure;

fig. 7 is a schematic diagram of another exploded structure of an tosa according to an embodiment of the present disclosure;

fig. 8 is an external structural diagram of an tosa according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of a housing and a circuit board according to an embodiment of the present disclosure;

fig. 10 is an exploded view of a housing and a circuit board according to an embodiment of the present disclosure;

FIG. 11 is a schematic cross-sectional view of a housing and a circuit board according to an embodiment of the present application;

fig. 12 is a first schematic structural diagram of a housing according to an embodiment of the present disclosure;

fig. 13 is a second schematic structural diagram of a housing according to an embodiment of the present disclosure;

fig. 14 is a cross-sectional partial schematic view of a housing and a circuit board according to an embodiment of the disclosure;

fig. 15 is a schematic structural diagram of a colloid part according to an embodiment of the present application;

FIG. 16 is a schematic structural view of a first coupling layer provided in an embodiment of the present application;

fig. 17 is a schematic structural diagram of a circuit board according to an embodiment of the present application.

Detailed Description

In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical communication is the interconversion of optical and electrical signals. Optical communication uses optical signals carrying information to transmit in information transmission equipment such as optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fiber/optical waveguide; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical network unit 100 having the optical module 200.

The optical port of the optical module 200 is connected to the optical fiber 101, and establishes a bidirectional optical signal connection with the optical fiber. The electrical port of the optical module 200 is connected to the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit. The optical module realizes the interconversion between an optical signal and an electrical signal, thereby realizing the connection between the optical fiber 101 and the optical network unit 100.

Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input to the optical fiber 101. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and in the photoelectric conversion process, the carrier of the information is converted between the light and the electricity, but the information itself is not changed.

The optical network unit 100 has an optical module interface 102 for accessing the optical module 200 and establishing a bidirectional electrical signal connection with the optical module 200. The optical network unit is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through an optical network unit. Specifically, the optical network unit transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network unit serves as an upper computer of the optical module to monitor the operation of the optical module.

To this end, the remote server establishes a bidirectional signal transmission channel with the local information processing device sequentially through the optical fiber 101, the optical module 200, the optical network unit 100, and the network cable 103.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an Optical Line Terminal (OLT) and the like.

Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electrical connector connected to the circuit board 105 is provided in the cage 106, and is used for connecting an electrical port of an optical module such as a gold finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.

The optical module 200 is inserted into the optical network unit 100, specifically, an electrical port of the optical module is inserted into an electrical connector in the cage 106, and an optical port of the optical module is connected to the optical fiber 101.

The cage 106 is located on the circuit board 105 of the optical network unit 100, and the electrical connectors on the circuit board 105 are wrapped in the cage; the optical module is inserted into the cage, the cage fixes the optical module, and heat generated by the optical module is conducted to the cage through the optical module housing and finally diffused through the heat sink 107 on the cage.

Fig. 3 is a schematic diagram of an optical module structure provided in an embodiment of the present application, and fig. 4 is an exploded schematic diagram of an optical module structure provided in an embodiment of the present application, as shown in fig. 3 and fig. 4, an optical module 200 provided in an embodiment of the present invention includes an upper housing 201, a lower housing 202, an unlocking handle 203, a circuit board 300, a tosa 400, a tosa 500, and an optical fiber adapter 600, where a transmitting optical fiber ribbon of the tosa 400 and a receiving optical fiber ribbon of the tosa 500 are both connected to the optical fiber adapter 600, and the optical fiber adapter 600 is used for optically connecting the transmitting optical fiber ribbon and the receiving optical fiber ribbon with an external optical fiber.

The upper shell 201 and the lower shell 202 form a wrapping shell with two ports, specifically two ports (204, 205) in the same direction, or two ports in different directions; one of the ports is an electrical port 204 which is used for being inserted into an upper computer such as an optical network unit; the other port is an optical port 205 for connecting an external optical fiber 101; the optoelectronic devices such as the circuit board 300, the transmitter sub-module 400 and the receiver sub-module 500 are disposed in the packaging housing formed by the upper and lower housings.

The upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; the assembly mode that adopts upper housing, casing combination down is convenient for install devices such as circuit board in the casing, generally can not make the casing of optical module structure as an organic whole, like this when devices such as assembly circuit board, locating part, heat dissipation and electromagnetic shield structure are not convenient for install, are unfavorable for production automation.

The unlocking handle 203 is positioned on the outer wall of the wrapping shell/lower shell 202, and the tail end of the unlocking handle is pulled to enable the unlocking handle to move relatively on the surface of the outer wall; when the optical module is inserted into the upper computer, the cage 106 is clamped by the unlocking handle 203, so that the optical module is fixed in the upper computer; by pulling the unlocking handle, the engagement between the optical module 200 and the cage 106 is released, and the optical module can be pulled out from the upper computer.

The circuit board 300 is located in a casing formed by the upper casing and the casing, the circuit board 300 is electrically connected with the transmitter sub-module 400 and the receiver sub-module 500 respectively, and the circuit board is provided with chips, capacitors, resistors and other electric devices. The method comprises the following steps of selecting corresponding chips according to the requirements of products, wherein common chips comprise a microprocessor MCU, a clock data recovery chip CDR, a laser driving chip, a transimpedance amplifier TIA chip, a limiting amplifier LA chip, a power management chip and the like. The transimpedance amplifier is closely associated with the optical detection chip, and the transimpedance amplifier and the optical detection chip can be packaged together by a part of products, such as in the same TO (TO optical) tube shell or the same shell; the optical detection chip and the transimpedance amplifier can be separately packaged, and the transimpedance amplifier is arranged on the circuit board.

The chip on the circuit board 300 may be a multifunctional integrated chip, for example, a laser driver chip and an MCU chip are integrated into one chip, or a laser driver chip, a limiting amplifier chip and an MCU chip are integrated into one chip, and the chip is an integrated circuit, but the functions of the circuits do not disappear due to the integration, and only the circuit appears and changes, and the chip still has the circuit form. Therefore, when the circuit board is provided with three independent chips, namely, the MCU, the laser driver chip and the limiting amplifier chip, the scheme is equivalent to that when the circuit board 300 is provided with a single chip with three functions in one.

The surface of the end part of the circuit board 300 is provided with a golden finger, the golden finger consists of one pin which is mutually independent, the circuit board is inserted into an electric connector in the cage, and the golden finger is in conductive connection with a clamping elastic sheet in the electric connector; the golden fingers can be arranged on the surface of one side of the circuit board, and the golden fingers are generally arranged on the upper surface and the lower surface of the circuit board in consideration of the large requirement on the number of pins; the golden finger is used for establishing electrical connection with the upper computer, and the specific electrical connection can be power supply, grounding, I2C signals, communication data signals and the like.

The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.

Fig. 5 is a schematic structural diagram of an tosa according to an embodiment of the present disclosure; fig. 6 is an exploded schematic view of an tosa according to an embodiment of the present disclosure; fig. 7 is a schematic diagram of another exploded structure of an tosa according to an embodiment of the present disclosure; the overall structure of the light emitting portion of the optical module of the present application will be described with reference to fig. 5 to 7. As shown in fig. 5-7, the tosa 400 includes a cover plate 401 and a housing 402, the cover plate 401 and the housing 402 are connected in a covering manner, specifically, the cover plate 401 covers the housing 402 from above, one side wall of the housing 402 has an opening 403 for inserting the circuit board 300, and the other side wall of the housing 402 has a through hole 410 for inserting the fiber adapter 600.

Specifically, the circuit board 300 extends into the housing 402 through the opening 403, and the circuit board 300 is fixed to the lower housing 202; the circuit board 300 is plated with metal traces, and the optical device can be electrically connected to the corresponding metal traces by wire bonding, so as to electrically connect the optical device in the housing 402 to the circuit board 300.

The signal light emitted by the light emitting device is emitted into the through hole 410, the optical fiber adapter 600 extends into the through hole 410 to be coupled and received with the signal light, the assembling structure design can enable the optical fiber adapter 600 to move back and forth in the through hole 410, the required size of the optical fiber between the light emitting sub-module and the optical fiber plug can be adjusted, and when the optical fiber is short, the optical fiber adapter can be moved backwards (towards the outer direction of the shell) in the through hole to meet the requirement of the connection size; when the optical fiber is long, the optical fiber adapter can be moved forwards (towards the inner direction of the shell) in the through hole to straighten the optical fiber and avoid bending the optical fiber. The fiber optic adapter 600 is inserted into the through hole 410 to realize the fixation with the tosa 400; during assembly, the fiber optic adapter 600 may be moved within the through-hole 410 to select a fixed position.

Fig. 8 is an external structural schematic diagram of an tosa according to an embodiment of the present disclosure. As shown in fig. 8, the housing 402 includes a bottom plate and four side plates disposed perpendicular to the bottom plate, wherein the side plates are disposed at the edge of the bottom plate, and the four side plates are sequentially connected end to end. One side plate of the housing 402 has an opening 403 for insertion of the circuit board 300, and the other side plate of the housing 402 has a through hole 410 for insertion of the fiber optic adapter 600.

In this embodiment, the optical device disposed in the housing 402 may optionally be connected to the circuit board 300 through a pin, where the pin is designed to have a shape adapted to the lower housing, one end of the pin is inserted into the lower housing, and a metal trace is plated on the end of the pin, the optical device may be electrically connected to the corresponding metal trace in a wire bonding manner, one end of the pin disposed in the housing 402 is provided with a plurality of pins electrically connected to the metal trace, the pins are inserted into the circuit board 300 and welded together, so as to achieve electrical connection between the optical device in the housing 402 and the circuit board 300, and of course, the pins on the pins may also be directly welded to the circuit board 300, so as to achieve electrical connection between the optical device in the housing 402 and the circuit board 300.

In the process of signal transmission, after receiving the electrical signal transmitted from the circuit board 300, the light emitting device in the housing 402 converts the electrical signal into an optical signal, and then the optical signal enters the optical fiber adapter 600 and is transmitted to the outside of the optical module.

The transmitter optical subassembly module is provided with a packaging structure for packaging laser chips and the like, and the existing packaging structure comprises a coaxial packaging TO-CAN, a silicon optical packaging, a chip-on-board LENS assembly packaging COB-LENS and a micro-optical XMD packaging. The package is further divided into hermetic package and non-hermetic package, which provides a stable and reliable working environment for the laser chip on one hand and forms external electrical connection and optical output on the other hand.

According to product design and process, the optical module can adopt different packages to manufacture the transmitter optical subassembly. The laser chip has vertical cavity surface light emitting and edge light emitting, and the different light emitting directions of the laser chip can influence the selection of the packaging form. The various packages have obvious technical differences, whether they are different from the structure or from the process, and those skilled in the art know that although different packages achieve the same purpose, different packages belong to different technical routes, and different packaging technologies do not give technical suggestions to each other.

The application discloses light emission part adopts the encapsulation of little optics form, and during the light that the optical chip sent got into the air promptly, set up devices such as lens, fiber adapter on optical path, couple to fiber adapter behind the light that sends the optical chip behind the lens, fiber adapter and fiber connection. The airtightness of the light emitting portion affects the optical power of an optical signal, and thus the airtightness is particularly important for an optical module of a micro optical morphology package structure.

Fig. 9 is a schematic structural diagram of a housing and a circuit board according to an embodiment of the present disclosure; fig. 10 is an exploded view of a housing and a circuit board according to an embodiment of the present disclosure; fig. 11 is a schematic cross-sectional view of a housing and a circuit board according to an embodiment of the present application.

Referring to fig. 9, 10 and 11, the tosa in the present application is encapsulated in a glue-sealing airtight manner, one end of the circuit board 300 is inserted into the opening 403, and the housing 402 is provided therein with a TEC, a laser chip carrier disposed on the surface of the TEC, and a laser chip disposed on the laser chip carrier. Specifically, the laser chip carrier is used for supporting and carrying the laser chip; the upper surface of the TEC is in direct contact with the lower surface of the laser chip carrier, that is, one heat exchange surface of the TEC is directly attached to the inner tube shell of the housing 402, and the other heat exchange surface is directly attached to the lower surface of the laser chip carrier; the material of the laser chip carrier includes, but is not limited to, tungsten copper, raft alloy, SPCC (Steel Plate Cold rolled Commercial, Cold rolled carbon Steel), copper, etc., which facilitates heat generated by the optoelectronic device to be transferred to the TEC for heat dissipation. One end of the circuit board 300 is provided with a gold finger, which is connected with an electric device inside the shell through a routing. To achieve hermeticity of the tosa, the joint between the circuit board 300 and the housing 402 is filled with an encapsulant portion 404.

Since the housing 402 is nickel-plated to prevent oxidation, the surface of the housing 402 is an inert metal layer and is an inorganic material. The sealant is usually an organic material, and the connection bonding strength of the inorganic material and the organic material is low, so that cracking and degumming phenomena are easy to occur. In order to improve the bonding strength between the housing 402 and the circuit board 300, the tosa further includes: the first coupling layer 405 is disposed between the opening 403 and the colloid portion 404.

Fig. 12 is a first schematic structural diagram of a housing provided in the embodiment of the present application, and fig. 13 is a second schematic structural diagram of the housing provided in the embodiment of the present application. Fig. 12 and 13 show the housing structure from a different angle as shown in fig. 12 and 13, the housing 402 includes: the bottom plate 4021 is used for bearing internal photoelectric devices, and the first side plate 4022 is vertically arranged at one side edge of the bottom plate 4021; the second side plate 4023 is disposed opposite to the first side plate 4022, and is perpendicular to the bottom plate 4021. The third side plate 4024 and the fourth side plate 4025 are symmetrically disposed on the other two sides of the bottom plate 4021. The opening penetrates the horizontal direction of the first side plate 4022, and extends toward the inside of the housing along the third side plate 4024 and the fourth side plate 4025.

The opening is provided with an extension slot, which is recessed towards the interior of the light emission cavity, and the circuit board 300 is inserted into the bottom of the extension slot and connected with the shell through a glue part 404.

Specifically, the opening 403 includes: an upper side wall 4031, a lower side wall 4032, a left side wall 4033 and a right side wall 4034, wherein the upper side wall 4031 and the lower side wall 4032 are horizontally disposed, and the left side wall 4033 and the right side wall 4034 are vertically disposed.

Wherein the upper sidewall 4031 includes: the first main side wall 40311 is horizontally arranged on the first side plate 4022 and penetrates through the first side plate 4022 in the horizontal direction; the first extension wall 40312 is horizontally disposed on the third side plate 4024, and has one end vertically connected to the first major side wall 40311 and the other end vertically connected to the left side wall 4033. And a second extension wall horizontally provided to the fourth side plate 4025, having one end vertically connected to the first major side wall 40311 and the other end vertically connected to the right side wall 4034.

The lower sidewall 4032 includes: the second main side wall 40321 is horizontally arranged on the first side plate 4022 and penetrates through the first side plate 4022 in the horizontal direction; and a third extension wall 40322 horizontally disposed on the third side plate, one end of which is vertically connected to the second major side wall 40321 and the other end of which is vertically connected to the left side wall 4033. And a fourth extension wall 40323 horizontally disposed on the fourth side plate, one end of which is vertically connected to the second major side wall 40321, and the other end of which is vertically connected to the right side wall 4034. The provision of the first extension wall 40312, the second extension wall 40313, the third extension wall 40322 and the fourth extension wall enables the opening to be recessed inward of the housing 402.

Fig. 14 is a partial cross-sectional schematic view of a housing and a circuit board provided in an embodiment of the present application, and fig. 15 is a schematic structural view of a colloid part provided in an embodiment of the present application, and referring to fig. 11 to fig. 15, a colloid part 404 is provided between the circuit board and the housing, and includes: an upper adhesive layer 4041, a lower adhesive layer 4042, a left adhesive layer 4043, and a right adhesive layer 4044, respectively, are attached to the edges of the opening 403. The upper adhesive layer 4041 is disposed between the upper sidewall 4031 and the upper surface of the circuit board 300, the lower adhesive layer 4042 is disposed between the lower sidewall 4032 and the lower surface of the circuit board 300, the left adhesive layer 4043 is disposed between the left sidewall 4033 and the side surface of the circuit board 300, and the right adhesive layer 4044 is disposed between the right sidewall 4034 and the side surface of the circuit board 300.

Wherein, rubberizing layer 4041 parcel upper side wall 4031 includes: a first main adhesive layer 40411 disposed between the first major sidewall 40311 and the circuit board; the first adhesive layer 40412 is disposed between the first extension wall 40312 and the upper surface of the circuit board, and the second adhesive layer 40413 is disposed between the second extension wall 40313 and the sidewall of the circuit board 300.

The structure of the lower adhesive layer 4042 is disposed corresponding to the structure of the upper adhesive layer 4041, and is not described herein again.

Fig. 16 is a schematic structural view of a first coupling layer according to an embodiment of the present disclosure, and referring to fig. 11 to 16, the first coupling layer 405 is disposed between the opening 403 and the colloid portion 404, so that the first coupling layer 405 may cover a sidewall of the opening edge or cover the entire surface of the housing. The first coupling layer 405 may be formed by surface chemical treatment of the shell with a silane coupling agent. Specifically, a shell (a non-photoelectric device) is placed in a container, a solution with a certain pH value (the pH value is determined by a adopted silane coupling agent) is added, then the silane coupling agent with a proper proportion is added into the container, the container is placed in a constant temperature tank for ultrasonic treatment, and the shell is continuously stirred; after the reaction is finished, the metal shell subjected to surface chemical treatment is washed by absolute ethyl alcohol/water; and drying the washed shell in a constant-temperature oven to obtain the shell with active groups attached to the surface. Through the steps, the coupling layer covering the whole shell surface can be prepared, and the coupling layer covering the side wall of the opening edge can be prepared by performing surface chemical treatment or coating after shielding the part which does not need to be coupled. One side of the coupling layer is an inorganic group which is connected with the shell, the other side of the coupling layer is an organic group which is connected with the colloid part 404 formed by the sealant, so that the interface bonding strength between the sealant and the surface of the shell is increased, the stress resistance is increased, the interface damage is not easy to occur, water vapor is effectively prevented from entering from a gap between the surface of the shell and the colloid layer, and the performance cracking risk of the optical engine is reduced.

In the present embodiment, the first coupling layer 405 covers the opening edge sidewalls, including: a first upper coupling layer 4051 disposed between the upper sidewall 4031 and the upper adhesive layer, wherein the side of the organophilic group is connected to the upper sidewall 4031 and the side of the organophilic group is connected to the upper adhesive layer; a left coupling layer 4053 disposed between the left sidewall 4033 and the left glue layer; and a right coupling layer 4054 disposed between the right sidewall 4034 and the right bondline. A first lower coupling layer 4052 covering the opening edge sidewall is disposed between the lower sidewall 4032 and the circuit board.

Further, the upper side wall 4031 includes: the first main side wall 40311 is horizontally arranged on the first side plate 4022 and penetrates through the first side plate 4022 in the horizontal direction; the first extension wall 40312 is horizontally disposed on the third side plate, and has one end vertically connected to the upper side wall 4031 and the other end vertically connected to the left side wall 4033. And a second extension wall 40313 horizontally disposed on the fourth side plate, one end of which is vertically connected to the upper side wall 4031 and the other end of which is vertically connected to the right side wall 4034. And a third extending wall 40322 horizontally disposed on the third side plate, one end of which is vertically connected to the lower side wall 4032, and the other end of which is vertically connected to the lower side wall 4032. And a fourth extension wall 40323 horizontally disposed on the fourth side plate, one end of which is vertically connected to the lower side wall 4032, and the other end of which is vertically connected to the right side wall 4034. The provision of the first extension wall 40312, the second extension wall 40313, the third extension wall 40322 and the fourth extension wall enables the opening to be recessed toward the inside of the housing.

The first upper coupling layer 4051 includes: a first main coupling layer disposed between the first major sidewall 40311 and the first main adhesive layer, wherein the side of the first main coupling layer having an organophilic group is connected to the first major sidewall 40311, and the side of the first main coupling layer having an organophilic group is connected to the first main adhesive layer; a first extended coupling layer disposed between the first extended wall 40312 and the first glue extension layer 40412; the second extension coupling layer is disposed between the second extension wall 40313 and the second glue extension layer 40413.

Further, in some embodiments of the present application, a second coupling layer 406 is disposed between the circuit board and the glue portion 404. The second coupling layer 406 is formed by bonding and applying a coupling agent to the surface of the metal layer. The second coupling layer 406 may cover the entire metal layer or only the connection portion of the circuit board and the glue portion 404.

The second coupling layer 406 may be formed by surface chemical treatment of the shell with a silane coupling agent. Specifically, one end of the circuit board is placed in a container, a solution with a certain pH value (the pH value is determined by the adopted silane coupling agent) is added, then the silane coupling agent with a proper proportion is added into the container, the container is placed in a constant temperature tank for ultrasonic treatment, and the shell is continuously stirred; after the reaction is finished, the metal shell subjected to surface chemical treatment is washed by absolute ethyl alcohol/water; and drying the washed shell in a constant-temperature oven to obtain the shell with active groups attached to the surface. Through the steps, the coupling layer covering the whole shell surface can be prepared, and the coupling layer covering the side wall of the opening edge can be prepared by performing surface chemical treatment or coating after shielding the part which does not need to be coupled. One side of the second coupling layer 406 is an inorganic group connected with the circuit board, and the other side is an organic group connected with the colloidal part 404 formed by the sealant, so that the interface bonding strength between the sealant and the surface of the shell is increased, the stress resistance is increased, the interface damage is not easy to occur, water vapor is effectively prevented from entering from a gap between the surface of the shell and the colloidal layer, and the performance cracking risk of the optical engine is reduced. Meanwhile, the firmness of connection between the circuit board and the shell is improved, and the phenomenon that the circuit board and the shell are dislocated and moved to influence the photoelectric performance is avoided.

Fig. 17 is a schematic structural diagram of a circuit board according to an embodiment of the present application. As shown in fig. 17, in order to ensure the surface flatness of the circuit board, a metal layer is disposed on the surface of the circuit board, and the structure of the metal layer is consistent with the sidewall of the opening, as can be seen from the figure, the metal layer includes: an upper metal region and a lower metal region. The second coupling layer 406 is disposed between the circuit board and the glue portion 404. The second coupling layer 406 has an inorganic group on one side connected to the metal layer on the surface of the circuit board, and an organic group on the other side connected to the colloidal part 404 formed by the sealant, so that the interface bonding strength between the sealant and the surface of the housing is increased, the stress resistance is increased, the interface damage is not easy to occur, the water vapor permeation is effectively prevented, the cracking risk of the optical engine performance is reduced, the air tightness of the optical emission sub-module is improved, and the optical module performance is improved.

Specifically, the second coupling layer 406 includes: a secondary upper coupling layer and a secondary lower coupling layer. The secondary upper coupling layer is disposed between the upper metal region and the colloid portion 404, the specific secondary upper coupling layer is disposed between the upper metal region and the first main colloid layer, the side of the organophilic group is connected to the first main colloid layer, and the side of the organophilic group is connected to the upper metal region.

In the embodiment of the present application, as shown in the cross-sectional view, the first coupling layer 405 is disposed between the housing and the colloid portion 404, and the second coupling layer 406 is disposed between the circuit board and the colloid portion 404. Through the arrangement of the first coupling layer 405 and the second coupling layer 406, the interface bonding strength between the surface of the shell and the sealant, the sealant and the circuit board is enhanced, the stress resistance is increased, the interface damage is not easy to occur, the water vapor is effectively prevented from permeating, and the performance cracking risk of the light engine is reduced. One side of the coupling layer is an inorganic group which is connected with the circuit board and the shell, and the other side of the coupling layer is an organic group which is connected with the colloid part 404 formed by the sealant, so that the interface bonding strength between the sealant and the surface of the shell is increased, the stress resistance is increased, the interface damage is not easy to occur, water vapor is effectively prevented from entering from a gap between the surface of the shell and the colloid layer, and the performance cracking risk of the optical engine is reduced. Meanwhile, the firmness of connection between the circuit board and the shell is improved, and the phenomenon that the circuit board and the shell are dislocated and moved to influence the photoelectric performance is avoided.

Since the above embodiments are all described by referring to and combining with other embodiments, the same portions are provided between different embodiments, and the same and similar portions between the various embodiments in this specification may be referred to each other. And will not be described in detail herein.

It is noted that, in this specification, relational terms such as "first" and "second," and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the presence of an element identified by the phrase "comprising an … …" does not exclude the presence of other like elements in a circuit structure, article or device comprising the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the present disclosure. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application do not limit the scope of the present application.

Claims (10)

1. A light module, comprising: a circuit board;

a tosa, comprising:

a cover plate;

the shell is covered with the cover plate to form a light emission cavity; an opening is formed in one side of the shell;

one end of the circuit board extends into the light emission cavity through the opening;

a colloid part is arranged between the circuit board and the opening for connection;

a first coupling layer is arranged between the opening and the colloid part;

the side of the first coupling layer, which is hydrophilic to the inorganic group, is connected with the side wall of the opening, and the other side of the first coupling layer is connected with the colloid part.

2. The optical module of claim 1, further comprising: and the second coupling layer is arranged between the colloid part and the circuit board, one side of the second coupling layer is an inorganic group-hydrophilic side and is connected with the circuit board, and the other side of the second coupling layer is connected with the colloid part.

3. The optical module according to claim 2, wherein the surface of the circuit board is provided with a metal area, and the metal area covers the shadow of the opening sidewall on the upper surface and the lower surface of the circuit board;

the second coupling layer is arranged between the metal area and the colloid part.

4. The light module of claim 1, wherein the housing comprises:

a base plate;

the first side plate is vertically arranged at the edge of one side of the bottom plate;

the second side plate is arranged on the opposite side of the first side plate and is perpendicular to the bottom plate;

the third side plate is arranged on the adjacent side of the first side plate and is vertical to the bottom plate;

the fourth side plate is arranged on the opposite side of the third side plate and is perpendicular to the bottom plate;

wherein, the opening is arranged on the side wall of the first side plate.

5. The light module of claim 4, wherein the opening is provided with an extension slot extending towards the light emission cavity; the circuit board is connected with the bottom of the extension groove.

6. The light module of claim 4, wherein the opening comprises:

the upper side wall is arranged on the surface of the shell and is positioned above the circuit board;

the left side wall is arranged on the surface of the third side plate and is positioned on one side of one end of the circuit board;

the right side wall is arranged on the surface of the fourth side plate and is symmetrically arranged on the left side wall;

the lower side wall is arranged on the surface of the shell and is symmetrically arranged with the upper side wall;

wherein the upper sidewall includes:

the first main side wall is horizontally arranged on the first side plate and penetrates through the first side plate in the horizontal direction;

a first extension wall horizontally disposed on the third side plate, one end of which is vertically connected to the first main side wall and the other end of which is vertically connected to the left side wall;

and the second extension wall is horizontally arranged on the fourth side plate, one end of the second extension wall is vertically connected with the first main side wall, and the other end of the second extension wall is vertically connected with the right side wall.

7. The optical module of claim 6, wherein the glue portion covers a sidewall of the opening.

8. The optical module of claim 6, wherein the glue portion comprises:

the upper adhesive layer is arranged between the upper side wall and the circuit board;

the lower adhesive layer is arranged between the lower side wall and the circuit board;

the left adhesive layer is arranged between the left side wall and the circuit board;

and the right adhesive layer is arranged between the right side wall and the circuit board.

9. The optical module of claim 1, wherein the first coupling layer covers the housing surface.

10. The optical module of claim 1, wherein the first coupling layer covers the opening sidewall.

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