CN214753756U

CN214753756U - LED packaging structure with controllable fluorescent glue amount

Info

Publication number: CN214753756U
Application number: CN202121432263.1U
Authority: CN
Inventors: 胡良峰; 周维; 王桂; 陈波
Original assignee: Jiangxi Tianyou Semiconductor Co Ltd
Current assignee: Jiangxi Tianyou Semiconductor Co Ltd
Priority date: 2021-06-27
Filing date: 2021-06-27
Publication date: 2021-11-16
Anticipated expiration: 2031-06-27

Abstract

The utility model discloses a controllable type LED packaging structure of fluorescence volume in packaging technology field, including the LED base plate, hemisphere light-emitting slot has been seted up to LED base plate upper surface, hemisphere light-emitting slot bottom fixedly connected with insulation board, fixed surface is connected with the LED wafer on the insulation board, and LED wafer fixedly connected with gold thread, LED base plate bottom have been seted up and have been connect the electricity groove, connect electricity groove lateral wall fixedly connected with terminal, hemisphere light-emitting slot lateral wall fixedly connected with fluorescence glue film, the control flume has been seted up to semi-circular light-emitting slot lateral wall, and LED base plate bottom is seted up flutedly. The utility model discloses when going on the point to the LED wafer and gluing, under the too much condition of play glue volume, unnecessary fluorescent glue can flow and reach rotor plate upper portion from the control flume of hemisphere light-emitting groove lateral wall, drives the rotor plate through extension spring and rotates along the axis of rotation, opens the control flume, makes unnecessary fluorescent glue flow out, prevents to cause the problem that the light transmissivity of LED lamp descends because fluorescent glue is too much.

Description

LED packaging structure with controllable fluorescent glue amount

Technical Field

The utility model relates to the field of packaging technology, specifically be a controllable type LED packaging structure of fluorescent glue volume.

Background

The LED is a green illumination light source with the greatest development prospect in the 21 st century because of the advantages of high brightness, low heat, long service life, no toxicity, recyclability and the like, and the packaging function of the LED is to provide enough protection for an LED wafer and prevent the chip from losing efficacy due to long-term exposure or mechanical damage in the air so as to improve the stability of the chip; for LED packaging, it is also desirable to have good light extraction efficiency, which can allow LEDs to have better luminous efficiency and thus improved brightness.

Traditional LED lamp packaging structure is when encapsulating the LED wafer, although current point gum machine's precision is higher, but at the point gum machine during operation, go out to glue the mouth and often can remain many fluorescent glues, lead to actually going out to glue the volume inconsistent with the required volume of gluing of predetermineeing, have LED lamp packaging structure's fluorescent glue volume uncontrollable problem to lead to LED quality problems, based on this, the utility model designs a controllable type LED packaging structure of fluorescent glue volume, with the solution to the aforesaid problem.

Disclosure of Invention

An object of the utility model is to provide a controllable type LED packaging structure of fluorescent glue volume to the fluorescent glue goes out the problem that the volume is different at every turn that proposes in solving above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a controllable type LED packaging structure of fluorescence volume, includes the LED base plate, hemisphere light-emitting slot has been seted up to LED base plate upper surface, hemisphere light-emitting slot bottom fixedly connected with insulation board, surface fixedly connected with LED wafer on the insulation board, LED wafer fixedly connected with gold thread, the electricity connection groove has been seted up to LED base plate bottom, electricity connection groove lateral wall fixedly connected with terminal, hemisphere light-emitting slot lateral wall fixedly connected with fluorescence glue film, the control flume has been seted up to hemisphere light-emitting slot lateral wall, LED base plate bottom is seted up flutedly, recess lateral wall fixedly connected with axis of rotation, the axis of rotation lateral wall has cup jointed the rotor plate, rotor plate upper portion fixedly connected with spring, circular recess has been seted up to the lateral wall on the recess, and the spring is built-in inside the circular recess.

Preferably, a lens is fixedly connected to the upper side wall of the hemispherical light-emitting groove, the diameter of the lens is slightly larger than that of the hemispherical light-emitting groove, and the lens is made of a transparent epoxy resin material.

Preferably, the control groove is of a T-shaped structure, the bottom of the control groove penetrates through the LED substrate, and the control groove is flush with the upper portion of the fluorescent glue layer.

Preferably, the bottom of the LED substrate is fixedly connected with a heat sink, a fixing groove penetrating through the heat sink is formed in the middle of the heat sink, and the upper portion of the fixing groove corresponds to the groove.

Preferably, the heat sink both ends fixedly connected with radiating block, the rectangular channel has been seted up to the radiating block lateral wall, rectangular channel bottom fixedly connected with expanding spring, expanding spring is close to the one end fixedly connected with splint of LED base plate.

Preferably, two round holes are formed in the upper surface of the insulating plate, gold wires penetrate through the round holes and extend to the bottom side of the insulating plate, and the LED wafer is connected with the wiring terminal through the gold wires.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) the utility model discloses when using the point gum machine to glue LED wafer and gluing, under the too much condition of play gum volume, unnecessary fluorescent glue can flow from the control flume of hemisphere light-emitting groove lateral wall and reachs rotor plate upper portion, drives the rotor plate through extension spring and rotates along the axis of rotation, opens the control flume, makes unnecessary fluorescent glue flow out, prevents to cause the problem that LED lamp light transmissivity descends because fluorescent glue is too much.

(2) The utility model discloses when gluing LED wafer point, through LED base plate extrusion splint, make splint extrusion expanding spring, can drive splint and remove in the rectangular channel to fix the LED base plate, prevent to glue the in-process LED base plate removal of gluing, the position that leads to the point to glue is inaccurate.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is the external structure schematic diagram of the LED package structure with controllable amount of fluorescent glue of the present invention.

Fig. 2 is an exploded view of the clamping device of the present invention.

Fig. 3 is a schematic partial sectional view of the present invention.

Fig. 4 is a schematic sectional view of the present invention.

Fig. 5 is an enlarged view of a portion a in fig. 4 according to the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1. a heat dissipating block; 2. a splint; 3. an LED substrate; 4. a fluorescent glue layer; 5. an LED wafer; 6. a heat sink; 7. a tension spring; 8. fixing grooves; 9. a rectangular groove; 10. gold thread; 11. a lens; 12. a circular groove; 13. a control slot; 14. an insulating plate; 15. a binding post; 16. a rotating shaft; 17. a rotating plate; 18. a spring.

Detailed Description

In order to make the above objects, features and advantages of the present invention more clearly understood, the present invention will be further described with reference to the accompanying drawings and examples. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, which may be embodied in other ways than those set forth herein, and therefore the present invention is not limited to the limitations of the specific embodiments described in the following disclosure.

The utility model provides a technical scheme: the utility model provides a controllable type LED packaging structure of fluorescence volume, including LED base plate 3, hemisphere light-emitting slot has been seted up to 3 upper surfaces of LED base plate, hemisphere light-emitting slot bottom fixedly connected with insulation board 14, surface fixedly connected with LED wafer 5 on insulation board 14, LED wafer 5 fixedly connected with gold thread 10, the electricity groove has been seted up to 3 bottoms of LED base plate, connect electricity groove lateral wall fixedly connected with terminal 15, two round holes have been seted up to insulation board 14 upper surface, and gold thread 10 pierces through the round hole and extends to insulation board 14 bottom side, LED wafer 5 and terminal 15 are connected through gold thread 10, hemisphere light-emitting slot lateral wall fixedly connected with fluorescence glue layer 4, lateral wall fixedly connected with lens 11 on the hemisphere light-emitting slot, lens 11 diameter slightly is greater than hemisphere light-emitting slot, and lens 11 is transparent epoxy material, can make LED wafer 5's light more diffuse, illuminate more places.

Control groove 13 has been seted up to hemisphere luminous groove lateral wall, control groove 13 is T type structure, and control groove 13 bottom runs through LED base plate 3, control groove 13 flushes with 4 upper portions of fluorescence glue film, LED base plate 3 bottoms are seted up flutedly, 3 bottom fixedly connected with heat sink 6 of LED base plate, heat sink 6 middle parts are seted up and are run through fixed slot 8 of heat sink 6, and fixed slot 8 upper portion and recess are corresponding, recess lateral wall fixedly connected with axis of

rotation

16, 16 lateral walls of axis of rotation have cup jointed rotor plate 17, rotor plate 17 upper portion fixedly connected with spring 18, circular recess 12 has been seted up to the lateral wall on the recess, and spring 18 embeds inside circular recess 12.

6 both ends fixedly connected with radiating block 1 on the heat sink dispels the heat that the during operation produced LED wafer 5, and rectangular channel 9 has been seted up to 1 lateral wall of radiating block, and rectangular channel 9 bottom fixedly connected with expanding spring 7, expanding spring 7 are close to the one end fixedly connected with splint 2 of LED base plate 3, carry out the centre gripping to LED base plate 3, prevent to glue 3 positions of in-process LED base plate and take place the skew, lead to the point to glue the position inaccurate.

The overall working principle is as follows: the utility model discloses when using the point gum machine to glue LED wafer 5 and glue, extrude splint 2 through LED base plate 3, make splint 2 extrude expanding spring 7, can drive

splint

2 and 9 remove in the rectangular channel, thereby fix LED base plate 3, prevent to glue in-process LED base plate 3 and remove, the position that leads to the point to glue is inaccurate, when reacing certain gluey volume, unnecessary fluorescent glue can flow out and reachs rotor plate 17 upper portion from the control flume 13 of hemisphere light-emitting groove lateral wall, it rotates along axis of rotation 16 to produce weight extension spring 18 and drive rotor plate 17, make control flume 13 open, unnecessary fluorescent glue flows out from control flume 13 bottom, prevent to cause the light transmissivity problem that the LED lamp descends because fluorescent glue is too much.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. The utility model provides a controllable type LED packaging structure of fluorescence volume, includes LED base plate (3), its characterized in that: the upper surface of the LED substrate (3) is provided with a hemispherical luminous groove, the bottom of the hemispherical luminous groove is fixedly connected with an insulating plate (14), the upper surface of the insulating plate (14) is fixedly connected with an LED wafer (5), the LED wafer (5) is fixedly connected with a gold wire (10), the bottom of the LED substrate (3) is provided with an electricity receiving groove, the side wall of the electricity receiving groove is fixedly connected with a binding post (15), the side wall of the hemispherical luminous groove is fixedly connected with a fluorescent glue layer (4), the side wall of the hemispherical luminous groove is provided with a control groove (13), a groove is arranged at the bottom of the LED substrate (3), a rotating shaft (16) is fixedly connected with the side wall of the groove, a rotating plate (17) is sleeved on the side wall of the rotating shaft (16), a spring (18) is fixedly connected to the upper part of the rotating plate (17), the upper side wall of the groove is provided with a circular groove (12), and a spring (18) is arranged in the circular groove (12).

2. The LED package structure with controllable amount of fluorescent glue according to claim 1, wherein: the LED lamp is characterized in that a lens (11) is fixedly connected to the upper side wall of the hemispherical light-emitting groove, the diameter of the lens (11) is slightly larger than that of the hemispherical light-emitting groove, and the lens (11) is made of transparent epoxy resin materials.

3. The LED package structure with controllable amount of fluorescent glue according to claim 1, wherein: the control groove (13) is of a T-shaped structure, the bottom of the control groove (13) penetrates through the LED substrate (3), and the control groove (13) is flush with the upper portion of the fluorescent glue layer (4).

4. The LED package structure with controllable amount of fluorescent glue according to claim 1, wherein: the LED lamp is characterized in that a heat sink (6) is fixedly connected to the bottom of the LED substrate (3), a fixing groove (8) penetrating through the heat sink (6) is formed in the middle of the heat sink (6), and the upper portion of the fixing groove (8) corresponds to the groove.

5. The LED package structure with controllable amount of fluorescent glue according to claim 4, wherein: heat sink (6) both ends fixedly connected with radiating block (1), rectangular channel (9) have been seted up to radiating block (1) lateral wall, rectangular channel (9) bottom fixedly connected with expanding spring (7), one end fixedly connected with splint (2) that expanding spring (7) are close to LED base plate (3).

6. The LED package structure with controllable amount of fluorescent glue according to claim 1, wherein: two round holes are formed in the upper surface of the insulating plate (14), a gold thread (10) penetrates through the round holes and extends to the bottom side of the insulating plate (14), and the LED wafer (5) is connected with the wiring terminal (15) through the gold thread (10).