CN214672523U - Cooling device - Google Patents

Cooling device Download PDF

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Publication number
CN214672523U
CN214672523U CN202120527687.XU CN202120527687U CN214672523U CN 214672523 U CN214672523 U CN 214672523U CN 202120527687 U CN202120527687 U CN 202120527687U CN 214672523 U CN214672523 U CN 214672523U
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China
Prior art keywords
water
water inlet
outlet
pipelines
disc
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Active
Application number
CN202120527687.XU
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Chinese (zh)
Inventor
廖海涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Yiwen Microelectronics Technology Co ltd
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Advanced Materials Technology and Engineering Inc
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Priority to CN202120527687.XU priority Critical patent/CN214672523U/en
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Publication of CN214672523U publication Critical patent/CN214672523U/en
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Abstract

The utility model relates to a semiconductor production facility field, in particular to cooling device. The device comprises an upper plate, a lower plate, a water inlet and outlet pipeline, a water outlet joint, a water inlet joint and a sealing water block; the improved water-saving device is characterized in that the upper disc is welded on the lower disc in a vacuum mode, a planar spiral water channel is formed in the bottom surface of the upper disc, a water outlet and a water inlet are formed in two ends, corresponding to the water channel, of the lower disc, two water outlet pipelines and two water inlet pipelines are arranged in the water inlet and outlet pipelines in parallel and vertically, the top ends of the water outlet pipelines are communicated through the water outlet and the water channel, the top ends of the water inlet pipelines are communicated through the water inlet and the water channel, the bottom ends of the water outlet pipelines are connected with water outlet connectors, sealing water blocks are arranged on the water inlet and outlet pipelines, and the water inlet connectors are communicated with the bottom ends of the water inlet pipelines through the sealing water blocks. The utility model discloses a sealed water receiving piece is removable design, greatly provides the convenience of maintaining. The positioning holes can be compatible with wafers of different sizes.

Description

Cooling device
Technical Field
The utility model relates to a semiconductor production facility field, in particular to cooling device.
Background
In a semiconductor machine, the cooling plate body has a cooling function. The cooling effect of cooling disk body is realized through inside water course, and the water course that inside leakproofness is good leads to full cooling water, can take away the inside heat of cavity at the in-process of cooling water circulation, plays refrigerated effect. However, the water inlet and outlet interface below the existing cooling device is difficult to disassemble, inconvenient to maintain and high in maintenance cost; difficulty in compatibility with wafers of different sizes; welding defects may occur.
Disclosure of Invention
The utility model aims at overcoming the defects existing in the prior art and providing a cooling device.
Realize the utility model discloses the technical scheme of purpose is: a cooling device comprises an upper plate, a lower plate, a water inlet and outlet pipeline, a water outlet joint, a water inlet joint and a sealing water block; the improved water-saving device is characterized in that the upper disc is welded on the lower disc in a vacuum mode, a planar spiral water channel is formed in the bottom surface of the upper disc, a water outlet and a water inlet are formed in two ends, corresponding to the water channel, of the lower disc, two water outlet pipelines and two water inlet pipelines are arranged in the water inlet and outlet pipelines in parallel and vertically, the top ends of the water outlet pipelines are communicated through the water outlet and the water channel, the top ends of the water inlet pipelines are communicated through the water inlet and the water channel, the bottom ends of the water outlet pipelines are connected with water outlet connectors, sealing water blocks are arranged on the water inlet and outlet pipelines, and the water inlet connectors are communicated with the bottom ends of the water inlet pipelines through the sealing water blocks.
Furthermore, a plurality of positioning holes for positioning the wafer are formed in the upper surface of the upper disc.
Further, the water channels are arranged in a circular shape at equal intervals.
Furthermore, the lower wall is provided with mounting grooves at positions of the water outlet and the water inlet, the top ends of the water inlet and outlet pipelines are provided with mounting blocks matched with the mounting grooves, and the water inlet and outlet pipelines are fixed on the mounting grooves through the mounting blocks at the top ends.
Further, the upper disc is provided with a cross-shaped groove.
Furthermore, a sealing ring is arranged at the contact position of the sealing water block and the inlet and outlet pipeline openings.
Furthermore, the upper disc and the lower disc are respectively and correspondingly provided with a plurality of upper positioning through holes and a plurality of lower positioning through holes.
Furthermore, an upper straight edge and a lower straight edge are correspondingly arranged on the edges of the upper disc and the lower disc respectively.
Furthermore, the water inlet and outlet pipeline is positioned above the sealed water receiving block, a fixing piece used for fixing the water inlet and outlet pipeline at the bottom of the machine table is mounted in a sealing manner, and a section of sleeve is arranged at the upper end of the fixing piece.
After the technical scheme is adopted, the utility model discloses following positive effect has:
(1) the utility model discloses a sealed water receiving piece is removable design, greatly provides the convenience of maintaining.
(2) The utility model discloses a locating hole can compatible not unidimensional wafer.
(3) The utility model discloses a water route design has reduced the usage space effectively, has reduced the materials, the cost is reduced.
(4) The utility model discloses a business turn over water pipe way can wear out in narrow and small hole from the board through the mounting, erection joint again.
Drawings
In order that the present invention may be more readily and clearly understood, the following detailed description of the present invention is given in conjunction with the accompanying drawings, in which
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional view of the present invention taken along the axis of the outlet conduit and the inlet conduit;
FIG. 3 is a schematic diagram of a water channel structure;
FIG. 4 is a schematic view of the structure under the lower plate;
FIG. 5 is a schematic view of the water outlet pipeline;
fig. 6 is a schematic structural diagram of the utility model after the machine is installed.
Detailed Description
Referring to fig. 1 to 5, the utility model has an upper plate 1, a lower plate 2, a water inlet and outlet pipeline 3, a water outlet joint 4, a water inlet joint 5 and a sealed water receiving block 6; the upper disc 1 is welded on the lower disc 2 in a vacuum mode, the bottom surface of the upper disc 1 is provided with planar spiral water channels 11 which are arranged in a circular mode at equal intervals. The lower disc 2 is provided with a water outlet 21 and a water inlet 22 corresponding to two ends of the water channel 11, two parallel and vertically arranged water outlet pipelines 31 and water inlet pipelines 32 are arranged in the water inlet and outlet pipelines 3, the top end of the water outlet pipeline 31 is communicated with the water channel 11 through the water outlet 21, the top end of the water inlet pipeline 32 is communicated with the water channel 11 through the water inlet 22, the bottom end of the water outlet pipeline 31 is connected with a water outlet connector 4, the water inlet and outlet pipelines 3 are provided with sealing water blocks 6, and the water inlet connector 5 is communicated with the bottom end of the water inlet pipeline 32 through the sealing water blocks 6. A sealing ring 61 is arranged at the contact position of the sealing water block 6 and the pipeline port of the water inlet and outlet pipeline 3. The upper surface of the upper plate 1 is provided with a plurality of positioning holes 12 for positioning the wafer. The upper tray 1 is provided with a cross-shaped recess 13. The upper plate 1 and the lower plate 2 are respectively provided with a plurality of upper positioning through holes 14 and a plurality of lower positioning through holes 24. The upper disc 1 and the lower disc 2 are provided with an upper straight edge 15 and a lower straight edge 25 respectively. The lower disc 2 is provided with a mounting groove 23 at the positions of the water outlet 21 and the water inlet 22, the top end of the water inlet and outlet pipeline 3 is provided with a mounting block 33 matched with the mounting groove 23, and the water inlet and outlet pipeline 3 is fixed on the mounting groove 23 through the mounting block 33 at the top end. The water inlet and outlet pipeline 3 is positioned above the sealing water block 6 and is provided with a fixing piece 7 for fixing the water inlet and outlet pipeline 3 at the bottom of the machine table in a sealing way, and the upper end of the fixing piece 7 is provided with a section of sleeve. The water inlet and outlet pipeline 3 can penetrate out of a narrow hole in the machine table through the fixing part 7, and then the joint is installed.
The utility model discloses a theory of operation does: cooling water enters the spirally arranged water channel 11 from the water inlet joint 5 to cool the wafer placed on the upper disc 1, and the cooled cooling water is discharged from the water outlet joint 4. The sealing water block 6 is designed in a detachable mode, and therefore convenience in maintenance is greatly improved. The positioning holes 12 can be compatible with wafers of different sizes. The design of the water channel 11 effectively reduces the use space, reduces the material consumption and reduces the cost.
The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims (9)

1. A cooling device, characterized by: the water-saving device is provided with an upper disc (1), a lower disc (2), a water inlet and outlet pipeline (3), a water outlet joint (4), a water inlet joint (5) and a sealing water receiving block (6); the improved water inlet and outlet device is characterized in that the upper disc (1) is welded on the lower disc (2) in a vacuum mode, a plane spiral water channel (11) is formed in the bottom surface of the upper disc (1), a water outlet (21) and a water inlet (22) are formed in the two ends, corresponding to the water channel (11), of the lower disc (2), two water outlet pipelines (31) and two water inlet pipelines (32) are arranged in the water inlet and outlet pipeline (3) in parallel and vertically arranged, the top ends of the water outlet pipelines (31) are communicated with the water channel (11) through the water outlet (21), the top ends of the water inlet pipelines (32) are communicated with the water channel (11) through the water inlet (22), the bottom ends of the water outlet pipelines (31) are connected with water outlet connectors (4), sealing water blocks (6) are arranged on the water inlet and outlet pipeline (3), and the water inlet connectors (5) are communicated with the bottom ends of the water inlet pipelines (32) through the sealing water blocks (6).
2. The cooling apparatus according to claim 1, wherein: the upper surface of the upper disc (1) is provided with a plurality of positioning holes (12) for positioning wafer wafers.
3. The cooling apparatus according to claim 1, wherein: the water channels are arranged in a circular shape at equal intervals.
4. The cooling apparatus according to claim 1, wherein: the water inlet and outlet device is characterized in that mounting grooves (23) are formed in positions, located at the water outlet (21) and the water inlet (22), of the lower disc (2), mounting blocks (33) matched with the mounting grooves (23) are arranged at the top ends of the water inlet and outlet pipelines (3), and the water inlet and outlet pipelines (3) are fixed on the mounting grooves (23) through the mounting blocks (33) on the top ends.
5. The cooling apparatus according to any one of claims 1 to 4, wherein: the upper disc (1) is provided with a cross-shaped groove (13).
6. The cooling apparatus according to claim 5, wherein: and a sealing ring (61) is arranged at the contact position of the sealing water block (6) and the pipeline port of the water inlet and outlet pipeline (3).
7. The cooling apparatus according to claim 6, wherein: the upper disc (1) and the lower disc (2) are respectively and correspondingly provided with a plurality of upper positioning through holes (14) and a plurality of lower positioning through holes (24).
8. The cooling apparatus according to claim 7, wherein: the edges of the upper disc (1) and the lower disc (2) are respectively and correspondingly provided with an upper straight edge (15) and a lower straight edge (25).
9. The cooling apparatus according to claim 7, wherein: the water inlet and outlet pipeline (3) is positioned above the sealing water block (6) and is hermetically sleeved with a fixing piece (7) used for fixing the water inlet and outlet pipeline (3) at the bottom of the machine table, and the upper end of the fixing piece (7) is provided with a section of sleeve.
CN202120527687.XU 2021-03-15 2021-03-15 Cooling device Active CN214672523U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120527687.XU CN214672523U (en) 2021-03-15 2021-03-15 Cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120527687.XU CN214672523U (en) 2021-03-15 2021-03-15 Cooling device

Publications (1)

Publication Number Publication Date
CN214672523U true CN214672523U (en) 2021-11-09

Family

ID=78452934

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120527687.XU Active CN214672523U (en) 2021-03-15 2021-03-15 Cooling device

Country Status (1)

Country Link
CN (1) CN214672523U (en)

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Address after: 214028 No.1 Guanshan Road, Xinwu District, Wuxi City, Jiangsu Province

Patentee after: Wuxi Yiwen Microelectronics Technology Co.,Ltd.

Address before: 214028 No.1 Guanshan Road, Xinwu District, Wuxi City, Jiangsu Province

Patentee before: WUXI YIWEN ELECTRONIC TECHNOLOGY Co.,Ltd.