CN214923370U - Semiconductor grinding and polishing circulating stirring barrel device - Google Patents
Semiconductor grinding and polishing circulating stirring barrel device Download PDFInfo
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- CN214923370U CN214923370U CN202121620981.1U CN202121620981U CN214923370U CN 214923370 U CN214923370 U CN 214923370U CN 202121620981 U CN202121620981 U CN 202121620981U CN 214923370 U CN214923370 U CN 214923370U
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- stirring barrel
- cooling water
- pipe
- stirring
- agitator
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Abstract
The utility model discloses a semiconductor grinding and polishing circulating stirring barrel device, which comprises a stirring barrel body, wherein the top end of the stirring barrel body is connected with a top cover through a thread, the top end of the top cover is fixedly provided with a motor, the output end of the motor is fixedly connected with a shaft rod extending to the inside of the stirring barrel body, the bottom end of the shaft rod is fixedly connected with a connecting shaft, and the outer side of the connecting shaft is provided with a plurality of clamping grooves. The damage of the metal particles to system equipment and the damage of processing precision are reduced.
Description
Technical Field
The utility model relates to a semiconductor processing technology field specifically is a semiconductor grinds polishing circulation agitator device.
Background
SIC is used as a third-generation semiconductor material, has the characteristics of large forbidden band width, high breakdown field strength, high thermal conductivity, high electron saturation drift velocity, strong radiation resistance, good chemical stability and the like, and becomes a key material of a new-generation electronic device. Has a trillion market in the aspects of energy conservation and emission reduction, national defense construction, electronic information and the like. Meanwhile, SIC and GaN which is an important material for manufacturing high-power microwave, power electronics and photoelectronic devices have very small lattice mismatch and thermal expansion coefficient difference, so that the SIC becomes an important substrate material of a new generation of wide bandgap semiconductor devices, stirring, polishing and grinding are needed in the processing process of the SIC, most stirring in the market at present is gas circulation stirring and barrel circulation stirring, and the stirring device cannot meet the requirements of the existing grinding and polishing circulation system.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor lapping and polishing circulation agitator device to the problem that can not satisfy lapping and polishing liquid circulation that proposes in solving above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor grinding and polishing circulating stirring barrel device comprises a stirring barrel body, wherein the top end of the stirring barrel body is in threaded connection with a top cover, a motor is fixedly mounted at the top end of the top cover, the output end of the motor is fixedly connected with a shaft rod extending to the inside of the stirring barrel body, the bottom end of the shaft rod is fixedly connected with a connecting shaft, a plurality of clamping grooves are formed in the outer side of the connecting shaft, stirring blades are clamped and connected inside the clamping grooves, a cooling pipeline is fixedly arranged on the inner side of the stirring barrel body, a cooling water inlet pipe, a cooling water outlet pipe and an inflation pipe are respectively and fixedly communicated with two sides of the surface of the stirring barrel body, a first valve, a fourth valve and a third valve are respectively and fixedly mounted at the joint of the stirring barrel body and the cooling water inlet pipe, the joint of the stirring barrel body and the cooling water outlet pipe and the joint of the stirring barrel body and the inflation pipe, just cooling water inlet pipe and cooling water outlet pipe all with the fixed intercommunication of cooling pipeline, the cooling pipeline has been seted up to the bottom of agitator body inner wall, the fixed intercommunication in inside of cooling pipeline has the circulating pipe, the fixed intercommunication in one side of circulating pipe has the delivery pipe, the middle part fixed mounting of circulating pipe has the second valve.
As an optimal technical scheme of the utility model, the sealing washer is all fixed to be provided with the junction of agitator body and cooling water inlet tube, the junction of agitator body and cooling water outlet pipe, the junction of agitator body and gas tube and the junction of leakage fluid dram and circulating pipe.
As a preferred technical scheme of the utility model, a plurality of the spacing groove, a plurality of have all been seted up to the top and the bottom of stirring leaf the equal threaded connection in spacing groove has fixing bolt, a plurality of the stirring leaf pass through fixing bolt respectively with a plurality of draw-in groove fixed connection.
As an optimized technical scheme of the utility model, the bottom of agitator body is the toper.
As an optimal technical scheme of the utility model, a plurality of the stirring leaf is located the inner wall of agitator body inside center and with the agitator body and keeps perpendicular.
As the utility model discloses a preferred technical scheme, cooling water inlet tube and first valve set up the both sides at agitator body surface top respectively, the gas tube sets up the bottom on agitator body surface.
Compared with the prior art, the beneficial effects of the utility model are that: the device can reduce the deposit of polishing solution miropowder granule at the bottom of the barrel and make things convenient for the cleanness of timely blowdown and agitator through the setting of barrel head toper design and gas tube setting, the lapping polishing solution after coming the separation can in time get into circulation system work once more through the circulating pipe, rotate through a plurality of stirring leaf of motor drive and circulate the stirring, grind the polishing to the miropowder granule, the harm of metal particles to system equipment and the destruction of machining precision have been reduced, come to cool off polishing solution temperature in the course of working completely through being provided with the cooling pipeline inside the agitator, can carry out the control of PCW end temperature according to actual technology demand temperature.
Drawings
Fig. 1 is a perspective view of the present invention;
fig. 2 is a front sectional view of the present invention;
fig. 3 is an enlarged view of a portion a of the present invention.
In the figure: 1. a stirring barrel body; 2. a cooling water inlet pipe; 3. a first valve; 4. a cooling pipeline; 5. a liquid discharge port; 6. a second valve; 7. a discharge pipe; 8. a circulation pipe; 9. a third valve; 10. an inflation tube; 11. a fourth valve; 12. a cooling water outlet pipe; 13. stirring blades; 14. a shaft lever; 15. a top cover; 16. a motor; 17. a connecting shaft; 18. fixing the bolt; 19. a card slot; 20. a limiting groove.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1-3, the utility model provides a semiconductor grinding and polishing circulation agitator device, including agitator body 1, the top threaded connection of agitator body 1 has top cap 15, the top fixed mounting of top cap 15 has motor 16, the output fixedly connected with of motor 16 extends to the inside axostylus axostyle 14 of agitator body 1, the bottom fixedly connected with connecting axle 17 of axostylus axostyle 14, a plurality of draw-in groove 19 has been seted up in the outside of connecting axle 17, the equal block in inside of a plurality of draw-in groove 19 is connected with stirring leaf 13, the inboard fixed cooling tube 4 that is provided with of agitator body 1, the both sides on agitator body 1 surface are fixed respectively to be communicated with cooling water inlet tube 2, cooling water outlet pipe 12 and gas tube 10, the junction of agitator body 1 and cooling water inlet tube 2, the junction of agitator body 1 and cooling water outlet pipe 12 and the junction of agitator body 1 and gas tube 10 respectively fixed mounting have first valve 3, A fourth valve 11 and a third valve 9, a cooling water inlet pipe 2 and a cooling water outlet pipe 12 are both fixedly communicated with a cooling pipeline 4, the bottom end of the inner wall of the stirring barrel body 1 is provided with the cooling pipeline 4, the cooling pipeline 4 is fixedly communicated with a circulating pipe 8, one side of the circulating pipe 8 is fixedly communicated with a discharge pipe 7, the middle part of the circulating pipe 8 is fixedly provided with the second valve 6, the device can reduce the deposition of polishing solution micro powder particles at the barrel bottom and facilitate the timely pollution discharge and the cleaning of the stirring barrel through the conical design of the barrel bottom and the arrangement of an inflation pipe 10, the separated grinding and polishing solution can enter a circulating system to work again in time through the circulating pipe 8, a plurality of stirring blades 13 are driven by a motor 16 to rotate for circular stirring, the grinding and polishing are carried out on the micro powder particles, and the damage of metal particles to system equipment and the damage of processing precision are reduced, the polishing liquid temperature is completely cooled in the processing process by the cooling pipeline 4 arranged in the stirring barrel, and the PCW end water temperature can be controlled according to the actual process requirement temperature.
Preferably, the sealing rings are fixedly arranged at the joint of the stirring barrel body 1 and the cooling water inlet pipe 2, the joint of the stirring barrel body 1 and the cooling water outlet pipe 12, the joint of the stirring barrel body 1 and the gas charging pipe 10 and the joint of the liquid discharge port 5 and the circulating pipe 8, and the sealing rings can improve the sealing performance of the stirring barrel body 1.
Preferably, the spacing groove 20 has all been seted up to the top and the bottom of a plurality of stirring leaf 13, the equal threaded connection in a plurality of spacing groove 20 has fixing bolt 18, a plurality of stirring leaf 13 pass through fixing bolt 18 respectively with a plurality of draw-in groove 19 fixed connection, the spacing block through fixing bolt 18 and spacing groove 20 comes to stir leaf 13 and closely fixes in draw-in groove 19, avoid stirring leaf 13 at the in-process of stirring to drop, can be through not hard up fixing bolt 18, make its and spacing groove 20 separation, and then be convenient for dismantle the washing and change stirring leaf 13.
Preferably, the bottom of the stirring barrel body 1 is conical, so that the problem of barrel bottom precipitation can be reduced.
Preferably, the plurality of stirring blades 13 are positioned in the center of the interior of the stirring barrel body 1 and are perpendicular to the inner wall of the stirring barrel body 1.
Preferably, the cooling water inlet pipe 2 and the first valve 3 are respectively arranged at two sides of the top of the surface of the stirring barrel body 1, the gas filling pipe 10 is arranged at the bottom of the surface of the stirring barrel body 1, and the precipitation at the bottom of the stirring barrel is reduced by increasing the gas stirring.
When the semiconductor grinding and polishing circulating stirring barrel device is used, an operator firstly pours polishing solution and micro powder particles into the stirring barrel, the motor 16 is started, the motor 16 drives the stirring blades 13 to rotate to circularly stir, and grinds and polishes the micro powder particles, so that the damage of metal particles to system equipment and the damage of processing precision are reduced, the device is provided with the cooling pipeline 4 inside the stirring barrel to completely cool the temperature of the polishing solution in the processing process, can control the temperature of PCW end water according to the actual process requirement temperature, can reduce the sedimentation of the polishing solution micro powder particles at the barrel bottom and facilitate the timely pollution discharge and the cleaning of the stirring barrel through the barrel bottom conical design and the arrangement of the gas filling pipe 10, and can make the separated grinding and polishing solution enter the circulating system to work again through the circulating pipe 8, in the use process, the stirring blade 13 is tightly fixed in the clamping groove 19 through the limiting clamping of the fixing bolt 18 and the limiting groove 20, the stirring blade 13 is prevented from falling off in the stirring process, the fixing bolt 18 can be loosened to separate the stirring blade from the limiting groove 20, and the stirring blade 13 is convenient to disassemble, clean and replace.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (6)
1. The utility model provides a semiconductor grinding polishing circulation agitator device, includes agitator body (1), its characterized in that: the top end threaded connection of agitator body (1) has top cap (15), the top fixed mounting of top cap (15) has motor (16), the output fixedly connected with of motor (16) extends to inside axostylus axostyle (14) of agitator body (1), the bottom fixedly connected with connecting axle (17) of axostylus axostyle (14), a plurality of draw-in groove (19), a plurality of have been seted up in the outside of connecting axle (17) the equal block in inside of draw-in groove (19) is connected with stirring leaf (13), the inboard of agitator body (1) is fixed and is provided with cooling line (4), the both sides on agitator body (1) surface are fixed the intercommunication respectively have cooling water inlet tube (2), cooling water outlet pipe (12) and gas tube (10), the junction of agitator body (1) and cooling water inlet tube (2), the junction of agitator body (1) and cooling water outlet pipe (12) and agitator body (1) and gas tube (10), the junction of agitator body (1) and gas tube (10) ) The junction respectively fixed mounting have first valve (3), fourth valve (11) and third valve (9), just cooling water inlet tube (2) and cooling water outlet pipe (12) all with cooling pipeline (4) fixed intercommunication, cooling pipeline (4) have been seted up to the bottom of agitator body (1) inner wall, the inside fixed intercommunication of cooling pipeline (4) has circulating pipe (8), the fixed intercommunication in one side of circulating pipe (8) has delivery pipe (7), the middle part fixed mounting of circulating pipe (8) has second valve (6).
2. The semiconductor grinding and polishing circulation stirring barrel device as claimed in claim 1, wherein: the sealing rings are fixedly arranged at the joint of the stirring barrel body (1) and the cooling water inlet pipe (2), the joint of the stirring barrel body (1) and the cooling water outlet pipe (12), the joint of the stirring barrel body (1) and the gas charging pipe (10) and the joint of the liquid discharge port (5) and the circulating pipe (8).
3. The semiconductor grinding and polishing circulation stirring barrel device as claimed in claim 1, wherein: the top and the bottom of a plurality of stirring leaf (13) have all been seted up spacing groove (20), a plurality of the equal threaded connection in spacing groove (20) has fixing bolt (18), a plurality of stirring leaf (13) pass through fixing bolt (18) respectively with a plurality of draw-in groove (19) fixed connection.
4. The semiconductor grinding and polishing circulation stirring barrel device as claimed in claim 1, wherein: the bottom of the stirring barrel body (1) is conical.
5. The semiconductor grinding and polishing circulation stirring barrel device as claimed in claim 1, wherein: the stirring blades (13) are positioned in the center of the inner part of the stirring barrel body (1) and are vertical to the inner wall of the stirring barrel body (1).
6. The semiconductor grinding and polishing circulation stirring barrel device as claimed in claim 1, wherein: the cooling water inlet pipe (2) and the first valve (3) are respectively arranged on two sides of the top of the surface of the stirring barrel body (1), and the inflation pipe (10) is arranged at the bottom of the surface of the stirring barrel body (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202121620981.1U CN214923370U (en) | 2021-07-16 | 2021-07-16 | Semiconductor grinding and polishing circulating stirring barrel device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202121620981.1U CN214923370U (en) | 2021-07-16 | 2021-07-16 | Semiconductor grinding and polishing circulating stirring barrel device |
Publications (1)
Publication Number | Publication Date |
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CN214923370U true CN214923370U (en) | 2021-11-30 |
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CN202121620981.1U Active CN214923370U (en) | 2021-07-16 | 2021-07-16 | Semiconductor grinding and polishing circulating stirring barrel device |
Country Status (1)
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CN (1) | CN214923370U (en) |
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2021
- 2021-07-16 CN CN202121620981.1U patent/CN214923370U/en active Active
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