CN214627491U

CN214627491U - Rigid-flex board structure

Info

Publication number: CN214627491U
Application number: CN202120128123.9U
Authority: CN
Inventors: 丁克渝; 王文剑; 刘会敏
Original assignee: Shenzhen Threetek Technology Co ltd
Current assignee: Shenzhen Threetek Technology Co ltd
Priority date: 2021-01-18
Filing date: 2021-01-18
Publication date: 2021-11-05
Anticipated expiration: 2031-01-18

Abstract

The utility model discloses a rigid-flex board structure, including top-down flexible board, first dielectric layer, second dielectric layer, third dielectric layer and the rigid plate of pressfitting in proper order, the processing of windowing is carried out to first dielectric layer, the coating has the release agent rete on the position of windowing of first dielectric layer the printing has resin printing ink layer on the release agent rete, resin printing ink layer fills completely the position of windowing of first dielectric layer. The utility model discloses can make and take off the lid quality and effectively promote, form the orderly section of taking off the lid, prevent the excessive glue, the fracture scheduling problem of taking off the lid position of rigid-flex printed circuit board.

Description

Rigid-flex board structure

Technical Field

The utility model relates to a rigid-flex board makes the field, in particular to rigid-flex board structure.

Background

The flexible region of the rigid-flex printed circuit board is formed by removing the rigid board region of the specific layer to expose the flexible region, and the process of removing the rigid board of the specific layer is called a uncovering process.

The existing rigid-flex board uncovering cover is generally manufactured in a mode of directly controlling depth milling grooves, and for rigid-flex boards with large rigid-flex combination position fall, if the depth of the depth-controlled milling grooves is directly controlled, the depth of the depth-controlled milling grooves is not easy to determine probably due to the deviation of the thickness of the board surface, but the internal depth cannot be observed from the surface of a circuit board, so that the problem that the uncovering cover is not easy to peel off due to insufficient depth of the milling grooves is easily caused by directly controlling the depth of the depth-controlled milling grooves, or the problem that the flexible board layer is damaged due to overlarge depth of the milling grooves.

Based on above problem, need provide a novel rigid-flex printed circuit board structure, solve direct accuse dark milling flutes degree of depth and be not enough or the too big problem of degree of depth, realize the accurate accuse dark milling flutes preparation that rigid-flex printed circuit board uncovered, improve product quality.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide a rigid-flex printed circuit board structure divide into the three-layer with the one deck dielectric layer and carries out the pressfitting, can provide good preparation structure basis for rigid-flex printed circuit board, prevent that the excessive glue, the fracture scheduling problem of the position of taking off the cover of rigid-flex printed circuit board from, improve the yield and the quality of taking off the cover preparation.

The utility model provides a rigid-flex board structure, including top-down flexible board, first dielectric layer, second dielectric layer, third dielectric layer and the rigid plate of pressfitting in proper order.

The method comprises the steps that windowing is conducted on a first medium layer, a release agent film layer is coated on the windowing position of the first medium layer, a resin ink layer is printed on the release agent film layer, and the windowing position of the first medium layer is completely filled with the resin ink layer.

Furthermore, the rigid-flex printed circuit board structure further comprises a supporting layer, and the supporting layer is attached to one surface, opposite to the first medium layer, of the flexible board.

Furthermore, the thickness of the resin ink layer is larger than that of the first medium layer, and the resin ink layer and the second medium layer are mutually extruded.

Further, the first dielectric layer is a non-flowing prepreg.

Further, the second dielectric layer and the third dielectric layer are flowing prepregs.

Furthermore, the material of the release agent film layer is silicone oil release agent or fluorine release agent.

Furthermore, the material of the support layer is polyimide or polytetrafluoroethylene.

By adopting the technical scheme, the two layers close to the rigid plate adopt flowing prepreg dielectric layers, the layer close to the flexible plate adopts non-flowing prepreg dielectric layers, the supporting force of the flexible board during pressing can be effectively given, the phenomenon that the flexible board is too large in expansion and contraction due to too large expansion and contraction of the medium layer in the pressing process can be prevented, the parting agent is coated on the windowing position of the first medium layer, an effective parting agent film layer convenient to peel is provided for subsequent uncovering, the resin ink layer is printed on the windowing position of the first medium layer, and the nano carbon black powder is added in the resin ink layer, which is beneficial to detecting the depth when a subsequent milling cutter mills the plate, the discharge of the black resin ink layer can be used as a mark for qualified depth, this rigid-flex printed circuit board structure can make and take off the lid quality and effectively promote, forms the orderly section of taking off the lid, has prevented excessive gluey, the fracture scheduling problem of taking off the lid position of rigid-flex printed circuit board.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic view of a rigid-flex board structure of the present invention;

FIG. 2 is a schematic view of the cover opening of the rigid-flex board structure of the present invention by depth-controlled milling;

FIG. 3 is a schematic view of the controlled depth milling of FIG. 2 after the cover is removed;

fig. 4 is a schematic diagram of the rigid-flex printed circuit board structure of the present invention after the cover is removed.

The reference numerals are explained below:

the manufacturing method comprises the following steps of 1-a flexible plate, 2-a first medium layer, 3-a second medium layer, 4-a third medium layer, 5-a rigid plate, 6-a windowing position, 7-a release agent film layer, 8-a resin ink layer, 9-a supporting layer and 10-a milling cutter.

Detailed Description

The following describes the present invention with reference to the accompanying drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features related to the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

As shown in fig. 1, the present embodiment provides a rigid-flex board structure, which includes a flexible board 1, a first dielectric layer 2, a second dielectric layer 3, a third dielectric layer 4, and a rigid board 5 laminated in sequence from top to bottom.

And carrying out windowing treatment on the first medium layer 2, wherein the size of the window is consistent with that of a subsequent region to be uncovered. The window-opening position 6 of the first medium layer 2 is coated with a release agent film layer 7, a resin ink layer 8 is printed on the release agent film layer 7, and the window-opening position 6 of the first medium layer 2 is completely filled with the resin ink layer 8. The release agent film layer 7 is made of silicone oil release agent or fluorine release agent, and provides an effective stripping effect for subsequent cover uncovering.

In this embodiment, the rigid-flex printed circuit board structure further includes a supporting layer 9, the supporting layer 9 is attached to one surface of the flexible board 1 opposite to the first medium layer 2, the strength of the flexible board 1 and the first medium layer 2 in the subsequent processing process is enhanced by the supporting layer 9, and the supporting layer 9 is made of polyimide or polytetrafluoroethylene and can be easily peeled off after the cover is removed.

Referring to fig. 2, the thickness of the resin ink layer 8 is greater than that of the first medium layer 2, and the resin ink layer 8 and the second medium layer 3 are pressed against each other. In this embodiment, nano carbon black powder is added to the resin ink layer 8, and optionally, the volume ratio of the nano carbon black powder to the resin ink layer 8 is 1-5%. The carbon black powder is added into the resin ink layer 8, so that when the resin ink layer 8 containing the nano carbon black powder is subsequently milled in a depth-controlled manner by a milling cutter 10, the black resin can be observed to be discharged from a chip groove of the milling cutter 10, the downward-extending depth of the milling cutter 10 can be conveniently positioned, the milling cutter 10 can mill a plate conveniently, the milling cutter 10 is prevented from underextending or excessive downward-extending, at the moment, the plate can be milled according to a plate-milling figure for uncovering, and the uncovering is carried out after the plate-milling is completed.

Referring to fig. 3 and 4, the resin ink layer 8 and the release agent film layer 7 that are not peeled off at the windowing position 6 of the first dielectric layer 2 are peeled off, and if the resin ink layer 8 is difficult to peel off in the peeling process, the resin ink layer can be properly heated and peeled off, optionally, the heating temperature and time are 75 ℃ x 10min, a rigid-flex printed circuit board with the cover being uncovered is formed, and the support layer 9 is removed, so that the rigid-flex printed circuit board shown in fig. 4 is obtained.

In this embodiment, the first dielectric layer 2 is a non-flowing prepreg, and the second dielectric layer 3 and the third dielectric layer 4 are flowing prepregs, so that a supporting force during pressing the flexible board 1 can be effectively given, excessive expansion and contraction of the flexible board 1 due to excessive expansion and contraction of the dielectric layers can be prevented from being influenced during pressing, and a relatively hard foundation can be provided for subsequent manufacturing of the release agent film layer 7 and the resin ink layer 8.

The utility model discloses a coating from type agent rete 7, for the follow-up preparation of taking off the lid provides effectual separation rete structure, adopt the printing to contain nanometer carbon black powder resin printing ink layer 8 can be for the accuse deeply mill provide effectual sense of hearing and the visual location foundation, the utility model discloses a rigid-flex printed circuit board structure has effectively realized the location of the accurate detection degree of depth of accuse deeply milling, provides good preparation structure basis for rigid-flex printed circuit board, has improved the yield and the quality of taking off the lid preparation.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention, and the scope of the invention is to be accorded the full scope of the claims.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", "row", etc. indicate the orientation or positional relationship indicated based on the drawings, and are only for the convenience of describing and simplifying the present invention, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present patent application, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "fixed," "secured," and the like are to be construed broadly, e.g., as a fixed connection, a detachable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present patent application, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Claims

1. A rigid-flex board structure is characterized by comprising a flexible board, a first medium layer, a second medium layer, a third medium layer and a rigid board which are sequentially laminated from top to bottom, wherein the first medium layer is subjected to windowing treatment, a release agent film layer is coated on the windowing position of the first medium layer, a resin ink layer is printed on the release agent film layer, and the windowing position of the first medium layer is completely filled with the resin ink layer.

2. The rigid-flex board structure according to claim 1, further comprising a support layer attached to a surface of the flexible board opposite to the first dielectric layer.

3. The rigid-flex board structure of claim 1, wherein the thickness of the resin ink layer is greater than the thickness of the first dielectric layer, and the resin ink layer and the second dielectric layer are extruded with each other.

4. The rigid-flex board structure according to claim 1, wherein the first dielectric layer is a no-flow prepreg.

5. The rigid-flex board structure of claim 1, wherein the second dielectric layer and the third dielectric layer are flow prepregs.

6. The rigid-flexible printed board structure of claim 1, wherein the release agent film layer is made of silicone oil release agent or fluorine release agent.

7. A rigid-flex board structure according to claim 2, wherein the material of the support layer is polyimide or polytetrafluoroethylene.