CN214540668U - Water-cooling circulation heat dissipation formula computer mainframe - Google Patents
Water-cooling circulation heat dissipation formula computer mainframe Download PDFInfo
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- CN214540668U CN214540668U CN202121212474.4U CN202121212474U CN214540668U CN 214540668 U CN214540668 U CN 214540668U CN 202121212474 U CN202121212474 U CN 202121212474U CN 214540668 U CN214540668 U CN 214540668U
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Abstract
The utility model discloses a water-cooling circulation heat dissipation type computer mainframe box, which comprises a case shell and a water-cooling heat dissipation mechanism; a case shell: the bottom surface of the machine box is provided with a water storage base, the opening of the right side surface of the machine box shell is connected with a detachable machine box plate through bolt threads, and the right side surface of the detachable machine box plate is provided with uniformly distributed heat dissipation fin openings; water-cooling heat dissipation mechanism: the water-cooling heat dissipation mechanism extends into the case shell; wherein: the front side surface of the case shell is provided with a control switch group, and the input end of the control switch group is electrically connected with an external power supply; wherein: a frame plate is arranged at the upper end inside the case shell; this water-cooling circulation heat dissipation formula computer mainframe box can effectively reduce the temperature of the quick-witted case shell internal environment, prevents that the host computer from receiving high temperature to influence and the machine of dying, can also realize the self-loopa of cooling water, provides lasting effectual radiating action for the host computer.
Description
Technical Field
The utility model relates to a computer fittings technical field specifically is a water-cooling circulation heat dissipation formula computer mainframe box.
Background
The computer is commonly called as computer, is a modern electronic computing machine for high-speed computation, can perform numerical computation and logic computation, and also has the function of storage and memory. The intelligent electronic device can be operated according to a program, and can automatically process mass data at a high speed.
The computer case is used as one part of computer fittings and has the main functions of holding and fixing computer fittings to play a role in bearing and protecting.
The existing computer mainframe box generally only adopts an air cooling mode to realize the cooling work of the computer mainframe, the temperature of the internal environment of the computer case shell cannot be effectively reduced, the computer mainframe is easily affected by high temperature to be down, and the use of the computer is not facilitated.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to overcome current defect, provide a water-cooling circulation heat dissipation formula computer mainframe box, can effectively reduce the temperature of computer case shell internal environment, prevent that the host computer from receiving the high temperature influence and being shut down, can also realize the self-circulation of cooling water, for the host computer provides and lasts effectual radiating action, can effectively solve the problem in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: a water-cooling circulation heat dissipation type computer mainframe box comprises a case shell and a water-cooling heat dissipation mechanism;
a case shell: the bottom surface of the machine box is provided with a water storage base, the opening of the right side surface of the machine box shell is connected with a detachable machine box plate through bolt threads, and the right side surface of the detachable machine box plate is provided with uniformly distributed heat dissipation fin openings;
water-cooling heat dissipation mechanism: set up in the inside of water storage base, water-cooling heat dissipation mechanism extends to the inside of computer shell, can effectively reduce the temperature of computer shell internal environment, prevents that the host computer from receiving high temperature to influence and shut down, can also realize the self-loopa of cooling water, provides lasting effectual radiating action for the host computer.
Furthermore, a control switch group is arranged on the front side face of the case shell, and an input end of the control switch group is electrically connected with an external power supply, so that the running state of each electric appliance can be freely regulated and controlled.
Further, the inside upper end of case shell is equipped with the frame plate, all is equipped with the fan in the mounting hole of frame plate middle part evenly distributed, and the output of control switch group is connected to the input electricity of fan, can accelerate the flow rate of air, makes the inside heat of case shell discharge fast, carries out preliminary heat dissipation cooling to the main frame.
Furthermore, the water-cooling heat dissipation mechanism comprises a micro water pump, a circulation pipeline, a partition plate and semiconductor refrigeration pieces, the micro water pump is arranged at the rear end of the inner bottom surface of the water storage base, the inside of the case shell is provided with the circulation pipeline, a rear side water inlet pipe of the circulation pipeline penetrates through the bottom plate of the case shell and the top wall of the water storage base from top to bottom and is connected with a water outlet of the micro water pump, a front side water return pipe of the circulation pipeline penetrates through the bottom plate of the case shell and the top wall of the water storage base from top to bottom and extends to the inner lower end of the water storage base, the partition plate is arranged at the rear side inside the water storage base, a water pumping pipe at the front side of the micro water pump penetrates through the partition plate and extends to the front side of the partition plate, the semiconductor refrigeration pieces are arranged in notches symmetrically arranged at the left side surface and the right side surface of the water storage base, the inner side ends of the four semiconductor refrigeration pieces all extend to the inside of the water storage base, and the input ends of the micro water pump and the semiconductor refrigeration pieces are all electrically connected with the output end of the control switch group, the temperature of the internal environment of the case shell can be effectively reduced, the host computer is prevented from being affected by high temperature and downtime, self-circulation of cooling water can be realized, and continuous and effective heat dissipation effect is provided for the host computer.
Further, the water-cooling heat dissipation mechanism still includes the overflow weir, the overflow weir sets up in the inside center department of water storage base, can ensure that the inside cooling water of backward flow to water storage base has sufficient time to cool down once more, guarantees the quality of follow-up heat dissipation work.
Further, the bottom surface of frame plate is equipped with bilateral symmetry's U-shaped frame, and the inside bottom surface of U-shaped frame all is equipped with evenly distributed's conduit saddle, and the conduit saddle all overlaps the snakelike body outside of locating circulating line, can provide for circulating line and support limiting displacement, prevents that circulating line from taking place the skew and influencing the radiating efficiency.
Furthermore, all be equipped with the dust screen in the air inlet that the left and right symmetry of casing upper surface set up, can prevent that outside dust from getting into the inside influence computer mainframe work of casing.
Compared with the prior art, the beneficial effects of the utility model are that: this water-cooling circulation heat dissipation formula computer mainframe has following benefit:
1. install the computer mainframe in the inside back of casing, will dismantle the casing board through the bolt and install in the opening of casing right flank, when the computer operation needs the heat dissipation, through the regulation and control of control switch group, the flow speed of air is accelerated in the fan operation, makes the inside heat of casing through the quick discharge of heat dissipation fin mouth, plays the preliminary heat dissipation cooling to the computer mainframe.
2. By controlling the regulation and control of the switch group, the micro water pump operates to convey cooling water injected into the interior of the water storage base from the water injection pipe on the front side of the water storage base in advance to the interior of the circulating pipeline, so that air generated by the fan and the cooling water in the serpentine interior of the circulating pipeline are subjected to heat exchange and temperature reduction to form cold air, the temperature of the internal environment of the case shell can be further reduced, the host computer is prevented from falling down due to high temperature, when the cooling water heated due to heat exchange in the circulating pipeline enters the interior of the water storage base again, the heat end of the semiconductor refrigeration piece is positioned in the interior of the water storage base, and the hot end of the semiconductor refrigeration piece is positioned outside the water storage base, so that the heat of the cooling water returning to the interior of the water storage base can be absorbed when the semiconductor refrigeration piece is electrified by controlling the switch group, the heated cooling water is cooled again, and the self circulation of the cooling water is realized, the continuous effective heat dissipation effect is provided for the computer host, the influence of the overflow weir is received, the process that the cooling water flowing back to the inside of the water storage base through the circulating pipeline is pumped away by the micro water pump again can be postponed, the cooling water flowing back to the inside of the water storage base is ensured to have sufficient time to be affected by the work of the semiconductor refrigeration piece to reduce the temperature, and the quality of the subsequent heat dissipation work is ensured.
3. Evenly distributed's conduit saddle can support limiting displacement for circulating line on the U-shaped frame, prevents that circulating line from taking place the offset and influencing the radiating efficiency, and the dust screen can prevent that outside dust from getting into the inside influence computer mainframe work of quick-witted case shell.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the inner cross-section structure of the present invention;
fig. 3 is the structure diagram of the right side view plane internal cutting structure of the utility model.
In the figure: the device comprises a machine box shell 1, a water storage base 2, a detachable machine box plate 3, a heat dissipation fin opening 4, a water cooling heat dissipation mechanism 5, a miniature water pump 51, a circulation pipeline 52, a partition plate 53, a semiconductor refrigeration piece 54, an overflow weir 55, a control switch group 6, a frame plate 7, a fan 8, a U-shaped frame 9, a pipe bracket 10 and a dust screen 11.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present embodiment provides a technical solution: a water-cooling circulation heat dissipation type computer mainframe box comprises a case shell 1 and a water-cooling heat dissipation mechanism 5;
case shell 1: the bottom surface of the machine box is provided with a water storage base 2, an opening on the right side surface of the machine box shell 1 is connected with a detachable machine box plate 3 through bolt threads, the right side surface of the detachable machine box plate 3 is provided with uniformly distributed heat dissipation fin openings 4, and the detachable machine box plate 3 can reserve a proper operation space for the installation work of a computer host;
water-cooling heat dissipation mechanism 5: the water-cooling heat dissipation mechanism 5 is arranged inside the water storage base 2, the water-cooling heat dissipation mechanism 5 extends to the inside of the cabinet shell 1, the water-cooling heat dissipation mechanism 5 comprises a micro water pump 51, a circulating pipeline 52, a partition plate 53 and semiconductor refrigerating sheets 54, the micro water pump 51 is arranged at the rear end of the inner bottom surface of the water storage base 2, the circulating pipeline 52 is arranged inside the cabinet shell 1, a rear side water inlet pipe of the circulating pipeline 52 penetrates through the bottom plate of the cabinet shell 1 and the top wall of the water storage base 2 from top to bottom and is connected with a water outlet of the micro water pump 51, a front side water return pipe of the circulating pipeline 52 penetrates through the bottom plate of the cabinet shell 1 and the top wall of the water storage base 2 from top to bottom and extends to the inner lower end of the water storage base 2, the partition plate 53 is arranged at the inner rear side of the water storage base 2, a water pumping pipe at the front side of the micro water pump 51 penetrates through the partition plate 53 and extends to the front side of the partition plate 53, the semiconductor refrigerating sheets 54 are arranged in notches symmetrically arranged at the left and right sides of the water storage base 2, the inner side ends of the four semiconductor refrigeration sheets 54 extend to the inside of the water storage base 2, the input ends of the micro water pump 51 and the semiconductor refrigeration sheets 54 are electrically connected with the output end of the control switch group 6, the water-cooling heat dissipation mechanism 5 further comprises an overflow weir 55, the overflow weir 55 is arranged at the center of the inside of the water storage base 2, the micro water pump 51 operates to convey cooling water injected in advance from a water injection pipe on the front side surface of the water storage base 2 to the inside of the circulating pipeline 52, so that the air generated by the fan 8 and the cooling water inside the serpentine shape of the circulating pipeline 52 exchange heat and cool air to form cold air, the temperature of the internal environment of the case 1 can be further reduced, the computer host is prevented from being shut down due to high temperature, when the cooling water heated due to heat exchange in the inside of the circulating pipeline 52 enters the inside of the water storage base 2 again, because the cold ends of the semiconductor refrigeration sheets 54 are positioned in the inside of the water storage base 2, the hot junction of semiconductor refrigeration piece 54 is located the outside of water storage base 2, when regulation and control through control switch group 6 made semiconductor refrigeration piece 54 circular telegram, can absorb the inside cooling water heat of getting back to water storage base 2, make the cooling water after the intensification cool down once more, realize the self-loopa of cooling water, for the computer mainframe provides and lasts effectual radiating action, receive the influence of overflow weir 55, the process that flows back to the inside cooling water of water storage base 2 through circulating line 52 is taken away by miniature pump 51 once more can be postponed, ensure to flow back to the inside cooling water of water storage base 2 and have sufficient time and receive semiconductor refrigeration piece 54's work influence and cooling, guarantee the quality of follow-up heat dissipation work.
Wherein: the front side of the housing 1 is provided with a control switch group 6, and the input end of the control switch group 6 is electrically connected with an external power supply.
Wherein: the inside upper end of casing 1 is equipped with frame plate 7, all be equipped with fan 8 in frame plate 7 middle part evenly distributed's the installing port, the output of control switch group 6 is connected to fan 8's input electricity, when the computer operation needs the heat dissipation, through the regulation and control of control switch group 6, the flow speed of air is accelerated in the operation of fan 8, make the inside heat of casing 1 discharge fast through heat dissipation fin mouth 4, play the preliminary heat dissipation cooling to the computer host computer.
Wherein: the bottom surface of frame plate 7 is equipped with bilateral symmetry's U-shaped frame 9, and the inside bottom surface of U-shaped frame 9 all is equipped with evenly distributed's conduit saddle 10, and the conduit saddle 10 all overlaps the snakelike body outside of locating circulating line 52, and evenly distributed's conduit saddle 10 can support limiting displacement for circulating line 52 provides on the U-shaped frame 9, prevents that circulating line 52 from taking place offset and influence the radiating efficiency.
Wherein: the air inlets that the left and right symmetry of casing 1 upper surface set up all are equipped with dust screen 11 in, and dust screen 11 can prevent that outside dust from getting into casing 1's inside influence computer mainframe work.
The utility model provides a pair of water-cooling circulation heat dissipation formula computer mainframe's theory of operation as follows: after the computer mainframe is arranged in the computer case 1, the detachable case plate 3 is arranged in the opening on the right side surface of the computer case 1 through bolts, when the computer needs to dissipate heat during operation, the fan 8 operates to accelerate the flow speed of air through the regulation and control of the control switch group 6, so that the heat in the computer case 1 is rapidly discharged through the heat dissipation fin opening 4, thereby achieving the primary heat dissipation and cooling of the computer mainframe, meanwhile, the micro water pump 51 operates to convey the cooling water injected in advance from the water injection pipe on the front side surface of the water storage base 2 in the water storage base 2 to the inside of the circulating pipeline 52, so that the air generated by the fan 8 and the cooling water in the snake-shaped inside of the circulating pipeline 52 exchange heat and cool to form cold air, thereby further reducing the temperature of the environment in the computer case 1, preventing the computer mainframe from falling down due to high temperature, when the cooling water heated due to heat exchange in the inside of the circulating pipeline 52 enters the water storage base 2 again, because the cold end of the semiconductor refrigeration sheet 54 is located inside the water storage base 2, the hot end of the semiconductor refrigeration sheet 54 is located outside the water storage base 2, when the semiconductor refrigeration sheet 54 is powered on through the control of the control switch group 6, the heat of the cooling water returning to the inside of the water storage base 2 can be absorbed, the cooling water after temperature rise is cooled again, the self-circulation of the cooling water is realized, the continuous and effective heat dissipation effect is provided for the computer host, the influence of the overflow weir 55 is realized, the process that the cooling water returning to the inside of the water storage base 2 through the circulating pipeline 52 is pumped away by the micro water pump 51 again is delayed, the cooling water returning to the inside of the water storage base 2 has sufficient time to be cooled by the work influence of the semiconductor refrigeration sheet 54, the quality of subsequent heat dissipation work is ensured, the pipe brackets 10 uniformly distributed on the U-shaped frame 9 can provide a supporting and limiting effect for the circulating pipeline 52, the circulating pipeline 52 is prevented from being displaced to influence the heat dissipation efficiency, and the dustproof net 11 can prevent external dust from entering the interior of the case shell 1 to influence the work of the computer host.
It should be noted that in the above embodiment, the fan 8 is a KYT-2501a electric fan, the micro water pump 51 is a 24V micro peristaltic pump, the semiconductor cooling plate 54 is a TEC1-12706 semiconductor cooling chip, and the control switch group 6 is provided with switch buttons corresponding to the fan 8, the micro water pump 51 and the semiconductor cooling plate 54 one by one for controlling the on-off operation thereof.
The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and the same principle is included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a water-cooling circulation heat dissipation formula computer mainframe which characterized in that: comprises a machine case shell (1) and a water-cooling heat dissipation mechanism (5);
chassis housing (1): a water storage base (2) is arranged on the bottom surface of the machine box, a detachable machine box plate (3) is connected to an opening on the right side surface of the machine box shell (1) through bolt threads, and radiating fins (4) which are uniformly distributed are arranged on the right side surface of the detachable machine box plate (3);
water-cooling heat dissipation mechanism (5): the water-cooling heat dissipation mechanism is arranged in the water storage base (2), and the water-cooling heat dissipation mechanism (5) extends to the interior of the cabinet shell (1).
2. The water-cooled circulation heat dissipation type computer mainframe box according to claim 1, wherein: the front side of the machine case shell (1) is provided with a control switch group (6), and the input end of the control switch group (6) is electrically connected with an external power supply.
3. The water-cooled circulation heat dissipation type computer mainframe box according to claim 2, wherein: frame plate (7) are arranged at the upper end of the inner part of the case shell (1), fans (8) are arranged in mounting holes uniformly distributed in the middle of the frame plate (7), and the input ends of the fans (8) are electrically connected with the output ends of the control switch groups (6).
4. The water-cooled circulation heat dissipation type computer mainframe box according to claim 3, wherein: the water-cooling heat dissipation mechanism (5) comprises a micro water pump (51), a circulating pipeline (52), a partition plate (53) and semiconductor refrigerating sheets (54), the micro water pump (51) is arranged at the rear end of the inner bottom surface of the water storage base (2), the circulating pipeline (52) is arranged in the machine box shell (1), a rear side water inlet pipe of the circulating pipeline (52) penetrates through the bottom plate of the machine box shell (1) and the top wall of the water storage base (2) from top to bottom and is connected with a water outlet of the micro water pump (51), a front side water return pipe of the circulating pipeline (52) penetrates through the bottom plate of the machine box shell (1) and the top wall of the water storage base (2) from top to bottom and extends to the inner lower end of the water storage base (2), the partition plate (53) is arranged on the inner rear side of the water storage base (2), a water pumping pipe on the front side of the micro water pump (51) penetrates through the partition plate (53) and extends to the front side of the partition plate (53), the semiconductor refrigerating sheets (54) are arranged in notches symmetrically on the left and right sides of the water storage base (2), the inner side ends of the four semiconductor refrigeration pieces (54) all extend into the water storage base (2), and the input ends of the micro water pump (51) and the semiconductor refrigeration pieces (54) are all electrically connected with the output end of the control switch group (6).
5. The water-cooled circulation heat dissipation type computer mainframe box according to claim 1, wherein: the water-cooling heat dissipation mechanism (5) further comprises an overflow weir (55), and the overflow weir (55) is arranged in the center of the interior of the water storage base (2).
6. The water-cooled circulation heat dissipation type computer mainframe box according to claim 4, wherein: the bottom surface of frame plate (7) is equipped with bilateral symmetry's U-shaped frame (9), and the inside bottom surface of U-shaped frame (9) all is equipped with evenly distributed's conduit saddle (10), and the snakelike body outside that circulating line (52) were all located in conduit saddle (10).
7. The water-cooled circulation heat dissipation type computer mainframe box according to claim 1, wherein: dust screens (11) are arranged in air inlets which are symmetrically arranged on the left and right of the upper surface of the case shell (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121212474.4U CN214540668U (en) | 2021-06-01 | 2021-06-01 | Water-cooling circulation heat dissipation formula computer mainframe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121212474.4U CN214540668U (en) | 2021-06-01 | 2021-06-01 | Water-cooling circulation heat dissipation formula computer mainframe |
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| Publication Number | Publication Date |
|---|---|
| CN214540668U true CN214540668U (en) | 2021-10-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121212474.4U Active CN214540668U (en) | 2021-06-01 | 2021-06-01 | Water-cooling circulation heat dissipation formula computer mainframe |
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| CN (1) | CN214540668U (en) |
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2021
- 2021-06-01 CN CN202121212474.4U patent/CN214540668U/en active Active
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