CN212135356U - Heat radiation structure for CPU chip - Google Patents
Heat radiation structure for CPU chip Download PDFInfo
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- CN212135356U CN212135356U CN202020651004.7U CN202020651004U CN212135356U CN 212135356 U CN212135356 U CN 212135356U CN 202020651004 U CN202020651004 U CN 202020651004U CN 212135356 U CN212135356 U CN 212135356U
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- fixed mounting
- heat dissipation
- fan
- cpu chip
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Abstract
The utility model discloses a heat radiation structure for CPU chip, including the quick-witted box, the inside fixed mounting of quick-witted box has the mainboard, the upper end fixed mounting of mainboard has chip protection frame, the lower extreme fixed mounting of chip protection frame has the CPU chip, the upper end fixed mounting of chip protection frame has the fan hot support, two legs department fixed connection of fan hot support has the buckle, the chip protection frame, the both sides outer wall of has seted up the buckle groove, and the buckle with the buckle groove cooperatees, the upper end fixed mounting of fan hot support has the fan frame; this a fan thermal structure for CPU chip through adding the water-cooling pipeline in CPU chip upper end, circulates cold water through the circulating pump, is discharging air conditioning to the CPU chip fast through the fan of water-cooling pipeline upper end, makes its quick heat dissipation, and overall structure is simple, convenient to detach is fit for promoting on a large scale.
Description
Technical Field
The utility model relates to the technical field of motors, specifically be a heat radiation structure for CPU chip.
Background
The computer is in operation, CPU self operation can produce a large amount of waste heat, other equipment in the computer case also can produce a large amount of heats simultaneously, external environment temperature changes in addition, therefore very easily cause CPU operational environment high temperature, thereby lead to CPU equipment operating performance to descend, lead to equipment damage phenomenon even when serious, so very important to CPU's heat dissipation, the fastest radiating is the water-cooling in prior art, but water-cooling equipment is too much the volume great, the structure is complicated, be not convenient for dismantle the scheduling problem, consequently need improve current water-cooling equipment.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat radiation structure for CPU chip to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat radiation structure for CPU chip, includes the quick-witted box, the inside fixed mounting of quick-witted box has the mainboard, the upper end fixed mounting of mainboard has chip protection frame, the lower extreme fixed mounting of chip protection frame has the CPU chip, the upper end fixed mounting of chip protection frame has the heat dissipation support, two legs department fixedly connected with buckles of heat dissipation support, the both sides outer wall of chip protection frame has seted up the buckle groove, just the buckle with the buckle groove cooperatees, the upper end fixed mounting of heat dissipation support has the fan frame.
Preferably, the inside left side fixed mounting of quick-witted box has the water tank, the inside fixed mounting of water tank has the circulating pump, the intermediate position fixedly connected with cooling tube of heat dissipation support, drainage pipe is passed through to cooling tube's one end, with the water tank is connected.
Preferably, the fan frame is fixedly connected with the heat dissipation support through a screw, and a driving fan is rotatably mounted in the middle of the fan frame.
Preferably, the driving fan and the circulating pump are electrically connected with a power supply inside the case body, and the heat dissipation support and the fan frame are integrated.
Compared with the prior art, the beneficial effects of the utility model are that: this a heat radiation structure for CPU chip through adding the water-cooling pipeline in CPU chip upper end, circulates cold water through the circulating pump, arranges the CPU chip with air conditioning fast through the fan of water-cooling pipeline upper end, makes its quick heat dissipation, and overall structure is simple, convenient to detach is fit for promoting on a large scale.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a top view of the fan case of the present invention;
fig. 3 is a schematic structural diagram of part a of the present invention.
In the figure: 1 machine box, 2 circulating pumps, 3 water tanks, 4 drainage pipelines, 5 heat dissipation supports, 6 fan racks, 8CPU chips, 9 chip protection racks, 10 main boards, 11 buckles, 12 buckle grooves, 13 cooling pipelines, 14 driving fans and 15 screws.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, fig. 2 and fig. 3, the present invention provides a technical solution: a heat dissipation structure for a CPU chip comprises a case body 1, wherein a main board 10 is fixedly installed inside the case body 1, a chip protection frame 9 is fixedly installed at the upper end of the main board 10, a CPU chip 8 is fixedly installed at the lower end of the chip protection frame 9, a heat dissipation support 5 is fixedly installed at the upper end of the chip protection frame 9, buckles 11 are fixedly connected to two legs of the heat dissipation support 5, buckle grooves 12 are formed in the outer walls of two sides of the chip protection frame 9, the buckles 11 are matched with the buckle grooves 12, and a fan frame 6 is fixedly installed at the upper end of the heat dissipation support 5;
specifically, the fan case 6 is welded on the heat dissipation bracket 5 as a whole, the buckle 11 of the heat dissipation bracket 5 is matched with the buckle groove 12, so that the heat dissipation bracket can be conveniently disassembled and assembled, and the chip protection frame 9 is welded on the main board 10;
a water tank 3 is fixedly arranged on the left side inside the machine box body 1, a circulating pump 2 is fixedly arranged inside the water tank 3, a cooling pipeline 13 is fixedly connected to the middle position of the heat dissipation support 5, and one end of the cooling pipeline 13 is connected with the water tank 3 through a drainage pipeline 4;
specifically, when the CPU runs at a high speed and needs heat dissipation, the circulation pump 2 circulates cold water through the water discharge pipeline 4 to circulate the cooling liquid in the cooling pipeline 13, and discharges the cold water into the cooling pipeline 3 for cooling;
the fan frame 5 is fixedly connected with the radiating bracket 5 through a screw 15, and a driving fan 14 is rotatably arranged at the middle position of the fan frame 6;
specifically, the driving fan 14 rotates to circularly blow the cold air in the cooling duct 3 in the whole CPU area, so as to accelerate the cooling speed;
the driving fan 14 and the circulating pump 3 are electrically connected with a power supply inside the case body 1, and the heat dissipation bracket 5 and the fan bracket 6 are integrated;
specifically, the electronic components such as the driving fan 14 are powered by the power supply in the housing 1, the main board 10 is powered on, and the electronic components can be powered on.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (4)
1. The utility model provides a heat radiation structure for CPU chip, includes quick-witted box (1), its characterized in that: the internal fixed mounting of quick-witted box (1) has mainboard (10), the upper end fixed mounting of mainboard (10) has chip protection frame (9), the lower extreme fixed mounting of chip protection frame (9) has CPU chip (8), the upper end fixed mounting of chip protection frame (9) has heat dissipation support (5), two legs department fixedly connected with buckles (11) of heat dissipation support (5), buckle groove (12) have been seted up to the both sides outer wall of chip protection frame (9), just buckle (11) with buckle groove (12) cooperate, the upper end fixed mounting of heat dissipation support (5) has fan frame (6).
2. The heat dissipation structure for a CPU chip according to claim 1, wherein: the inside left side fixed mounting of machine box (1) has water tank (3), the inside fixed mounting of water tank (3) has circulating pump (2), the intermediate position fixedly connected with cooling tube (13) of heat dissipation support (5), the one end of cooling tube (13) is passed through drainage pipe (4), with water tank (3) are connected.
3. The heat dissipation structure for a CPU chip according to claim 2, wherein: the fan frame (6) is fixedly connected with the heat dissipation support (5) through a screw (15), and a driving fan (14) is rotatably installed in the middle of the fan frame (6).
4. The heat dissipation structure for a CPU chip according to claim 3, wherein: the driving fan (14) is electrically connected with the circulating pump (2) and a power supply inside the case body (1), and the heat dissipation support (5) and the fan frame (6) are integrated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020651004.7U CN212135356U (en) | 2020-04-26 | 2020-04-26 | Heat radiation structure for CPU chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020651004.7U CN212135356U (en) | 2020-04-26 | 2020-04-26 | Heat radiation structure for CPU chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212135356U true CN212135356U (en) | 2020-12-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020651004.7U Active CN212135356U (en) | 2020-04-26 | 2020-04-26 | Heat radiation structure for CPU chip |
Country Status (1)
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| CN (1) | CN212135356U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112894885A (en) * | 2021-01-29 | 2021-06-04 | 重庆特斯联智慧科技股份有限公司 | Intelligent robot heat dissipation structure and heat dissipation method |
-
2020
- 2020-04-26 CN CN202020651004.7U patent/CN212135356U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112894885A (en) * | 2021-01-29 | 2021-06-04 | 重庆特斯联智慧科技股份有限公司 | Intelligent robot heat dissipation structure and heat dissipation method |
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| TR01 | Transfer of patent right |
Effective date of registration: 20220803 Address after: 558 FenHu Avenue, Lili Town, Wujiang District, Suzhou City, Jiangsu Province Patentee after: Suzhou Emerging Intelligent Technology Co.,Ltd. Address before: Room 801, Block B, Tengfei Building, No. 88 Jiangmiao Road, Yanchuang Park, Jiangbei New District, Nanjing City, Jiangsu Province, 210043 Patentee before: Emerging (Nanjing) chip technology Co.,Ltd. |