CN214529285U - 用于pcb微孔电镀的电镀水刀 - Google Patents
用于pcb微孔电镀的电镀水刀 Download PDFInfo
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- CN214529285U CN214529285U CN202023351930.1U CN202023351930U CN214529285U CN 214529285 U CN214529285 U CN 214529285U CN 202023351930 U CN202023351930 U CN 202023351930U CN 214529285 U CN214529285 U CN 214529285U
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- CN
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- Prior art keywords
- electroplating
- flow equalizing
- groove
- equalizing plate
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000009713 electroplating Methods 0.000 title claims abstract description 100
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 46
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims abstract description 25
- 235000017491 Bambusa tulda Nutrition 0.000 claims abstract description 25
- 241001330002 Bambuseae Species 0.000 claims abstract description 25
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims abstract description 25
- 239000011425 bamboo Substances 0.000 claims abstract description 25
- 239000007788 liquid Substances 0.000 claims description 90
- 238000007747 plating Methods 0.000 abstract description 36
- 230000000694 effects Effects 0.000 abstract description 10
- 239000000243 solution Substances 0.000 description 46
- 230000002349 favourable effect Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003079 width control Methods 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202023351930.1U CN214529285U (zh) | 2020-12-31 | 2020-12-31 | 用于pcb微孔电镀的电镀水刀 |
Applications Claiming Priority (1)
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CN202023351930.1U CN214529285U (zh) | 2020-12-31 | 2020-12-31 | 用于pcb微孔电镀的电镀水刀 |
Publications (1)
Publication Number | Publication Date |
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CN214529285U true CN214529285U (zh) | 2021-10-29 |
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CN202023351930.1U Active CN214529285U (zh) | 2020-12-31 | 2020-12-31 | 用于pcb微孔电镀的电镀水刀 |
Country Status (1)
Country | Link |
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CN (1) | CN214529285U (zh) |
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2020
- 2020-12-31 CN CN202023351930.1U patent/CN214529285U/zh active Active
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Legal Events
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: No. 383 Ronghe East Road, Fushan Industrial Park, Qianwu Town, Doumen District, Zhuhai City, Guangdong Province, 519100 Patentee after: ZHUHAI SONGBAI TECHNOLOGY Co.,Ltd. Country or region after: China Patentee after: Shenzhen Songbai Science and Technology Co.,Ltd. Patentee after: SHANGHAI FUBAI CHEMICAL Co.,Ltd. Address before: 519000 room 209, No.6 West, Zhufeng Avenue, Doumen District, Zhuhai City, Guangdong Province Patentee before: ZHUHAI SONGBAI TECHNOLOGY Co.,Ltd. Country or region before: China Patentee before: SHENZHEN CYPRESS INDUSTRIAL DEVELOPMENT Co.,Ltd. Patentee before: SHANGHAI FUBAI CHEMICAL Co.,Ltd. |
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CP03 | Change of name, title or address |