CN214422552U - High-voltage-resistant double-sided covering film - Google Patents
High-voltage-resistant double-sided covering film Download PDFInfo
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- CN214422552U CN214422552U CN202022529851.9U CN202022529851U CN214422552U CN 214422552 U CN214422552 U CN 214422552U CN 202022529851 U CN202022529851 U CN 202022529851U CN 214422552 U CN214422552 U CN 214422552U
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Abstract
The utility model provides a high voltage resistant double-sided cover membrane, including the first type layer, polyimide film composite bed and the second of stacking gradually the setting from the type layer, the second is the biaxial stretching polypropylene film from the type layer or from the type membrane, the upper surface on polyimide film composite bed pass through the glue film with first type layer bonding from the type, the lower surface on polyimide film composite bed pass through the glue film with the second is from the type layer bonding. After polyimide films with different thicknesses are compounded into a required polyimide film composite layer by coating adhesive, adhesive layers are coated on the upper surface and the lower surface of the polyimide film composite layer, so that the high voltage resistance, the size stability, the mechanical strength and other properties are improved, the working efficiency and the product yield of customers are improved, and the two surfaces have good insulativity and adhesiveness.
Description
Technical Field
The utility model relates to a flexible copper-clad plate material technical field especially relates to a high voltage resistant double-sided cover membrane.
Background
At present, the cover film used in the Flexible Circuit board industry mostly uses a PI film (polyimide film) as a carrier, coats epoxy resin or acrylic resin as an adhesive, compounds release paper to protect an adhesive surface, is mainly applied to the surface of a copper foil Circuit of a Flexible Printed Circuit board (Flexible Printed Circuit board), and plays roles of covering the Circuit, preventing oxidation and insulating protection, and part of the cover film is also applied to the surface bonding protection of electronic hardware, such as a metal connecting sheet of a notebook computer pool, a metal connecting sheet of a new energy automobile battery, an electric power battery bus bar, the insulating protection of metal pieces such as a transformer, but the common cover film only has one-side coated with the adhesive, and can play a role of double-side bonding only by firstly pressing the cover film on a plurality of layers of Circuit boards or hardware which need to be bonded up and down simultaneously and then attaching a layer of pure adhesive bonding layer from the PI surface of the cover film, however, this operation is inefficient, low in yield, time consuming and costly.
With the development of the industry, particularly the popularization and popularization of the rapid charging of mobile phones and the rapid charging of new energy automobile batteries, the FPC multilayer board and the rigid-flex board applied to the FPC multilayer board and the rigid-flex board require a circuit to be capable of passing large current and resisting high voltage breakdown in a short time, and the breakdown voltage generally requires more than 8000V. This requires not only higher withstand voltage requirements for the substrate used, but also higher withstand voltage requirements for the cover film, and prevention of breakdown. The thickness of the PI used in the common covering film is generally 13-50um, the requirement of high voltage breakdown resistance cannot be met, and the PI has an adhesive on only one side, so that the PI cannot play a role in double-sided adhesion.
If multiple overlapping is adopted and the PI film thickness is increased to meet the requirement of high voltage resistance, the requirement can be met only by laminating a covering film on the base material, then pasting a layer of pure glue adhesive on the PI surface of the covering film, then pasting a layer of PI film and then pasting a layer of pure glue adhesive. The multilayer board or rigid-flexible board manufactured by the repeated overlapping process has low efficiency and yield and unstable product performance.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention has been made in order to provide a high voltage resistant double-sided cover film that overcomes or at least partially solves the above problems.
In order to solve the problem, the utility model discloses a high voltage resistant double-sided cover membrane, from type layer, polyimide film composite bed and second including the first type layer, polyimide film composite bed and the second that stack gradually the setting, the second is from the type layer for biaxial stretching polypropylene film or from the type membrane, the upper surface of polyimide film composite bed pass through the glue film with first type layer bonding from the type layer, the lower surface of polyimide film composite bed pass through the glue film with the second is from the type layer bonding.
Further, the first release layer is set to be release paper or release film.
Further, the glue layer is made of epoxy or acrylic glue.
Furthermore, the glue thickness of the glue layer is 8-50 μm.
Furthermore, the thickness of the polyimide film composite layer is 75-200 mu m, and the polyimide film composite layer is formed by combining polyimide films with different thicknesses.
Further, the thickness of the biaxially oriented polypropylene film is 25-75 μm.
Furthermore, the thickness of the first release layer is 38-130 μm.
The utility model discloses a following advantage: the problems of complex operation of repeated overlapping, low efficiency and unstable performance when the common polyimide cover film is applied to a multilayer board or a rigid-flexible board can be solved. High voltage resistant two-sided cover membrane in this application utilizes full-automatic coating machine, and after polyimide film with different thickness passes through the compound required polyimide film composite bed of coating adhesive, at polyimide film composite bed upper and lower coating glue film, improve high voltage resistant performance, dimensional stability and performance such as mechanical strength, improve customer's operating efficiency and product yield, and two-sided good insulating nature and the adhesion that all has.
Drawings
Fig. 1 is a schematic structural view of a high voltage resistant double-sided cover film of the present invention.
1 polyimide film composite layer, 2 glue films, 3 first release layers and 4 second release layers.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the accompanying drawings and the detailed description.
The utility model discloses an one of the core design lies in, provides a high voltage resistant double-sided cover membrane, including the first type layer 3, polyimide film composite bed 1 and the second of stacking gradually the setting from type layer 4, the second is from type layer 4 for biaxial stretching polypropylene film or from the type membrane, polyimide film composite bed 1's upper surface pass through the glue film 2 with first type layer 3 bonding from type, polyimide film composite bed 1's lower surface pass through glue film 2 with the second is from type layer 4 bonding. The problems of complex operation of repeated overlapping, low efficiency and unstable performance when the common polyimide cover film is applied to a multilayer board or a rigid-flexible board can be solved.
Referring to fig. 1, the structural schematic diagram of a high voltage resistant double-sided cover film of the present invention is shown, which specifically includes: the first type layer 3, polyimide film composite bed 1 and the second of range upon range of setting in proper order are from type layer 4, the second is from type layer 4 for biaxial stretching polypropylene film or from the type membrane, polyimide film composite bed 1's upper surface pass through the glue film 2 with first type layer 3 bonding from type, polyimide film composite bed 1's lower surface pass through the glue film 2 with the second is from type layer 4 bonding. The polyimide film composite layer 1 in this embodiment includes a plurality of polyimide films having different thicknesses, and by combining the polyimide films having different thicknesses, a certain thickness requirement can be met, and requirements for high voltage resistance, dimensional stability, mechanical strength and other properties are met.
In this embodiment, the first release layer 3 is configured as a release paper or a release film.
In the present embodiment, the glue layer 2 is made of epoxy or acrylic glue.
In this embodiment, the thickness of the adhesive layer 2 is 8 to 50 μm.
In the embodiment, the thickness of the polyimide film composite layer 1 is 75 to 200 μm, and the polyimide film composite layer 1 is formed by combining polyimide films with different thicknesses.
In this embodiment, the biaxially oriented polypropylene film has a thickness of 25 to 75 μm.
In the embodiment, the thickness of the first release layer 3 is 38 to 130 μm.
In a specific embodiment, the glue thickness is 8 μm, the thickness of the polyimide film composite layer 1 is 75 μm, the thickness of the biaxially oriented polypropylene film is 25 μm, and the thickness of the first release layer 3 is 38 μm.
In a specific embodiment, the glue thickness is 50 μm, the thickness of the polyimide film composite layer 1 is 200 μm, the thickness of the biaxially oriented polypropylene film is 75 μm, and the thickness of the first release layer 3 is 130 μm.
In a specific embodiment, the glue thickness is 25 μm, the thickness of the polyimide film composite layer 1 is 150 μm, the thickness of the biaxially oriented polypropylene film is 50 μm, and the thickness of the first release layer 3 is 90 μm.
The high voltage resistant double-sided cover film that this application provided utilizes the PI membrane as the substrate, through the PI membrane combination to different thickness, reaches certain thickness requirement, realizes the requirement to performances such as high voltage resistant performance, dimensional stability, and mechanical strength, and needs two-sided cover film requirements that all have functions such as insulating nature and adhesion.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The above detailed description is given to the high voltage resistant double-sided cover film provided by the present invention, and the specific examples are applied herein to explain the principle and the implementation of the present invention, and the description of the above examples is only used to help understand the method and the core idea of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, to sum up, the content of the present specification should not be understood as the limitation of the present invention.
Claims (7)
1. The utility model provides a two-sided cover membrane of high voltage resistant which characterized in that, is including the first type layer, polyimide film composite bed and the second type layer of stacking gradually the setting, the second is for biaxial stretching polypropylene film or from the type membrane from the type layer, the upper surface on polyimide film composite bed pass through the glue film with first type layer bonding from the type, the lower surface on polyimide film composite bed pass through the glue film with the second is from the type layer bonding.
2. The high voltage resistant double-sided mulch film according to claim 1 wherein the first release layer is provided as a release paper or a release film.
3. The high voltage resistant double sided mulch film according to claim 1 wherein the glue layer is comprised of epoxy or acrylic glue.
4. The high-voltage-resistant double-sided covering film according to claim 1, wherein the adhesive thickness of the adhesive layer is 8-50 μm.
5. The high-voltage-resistant double-sided coverlay according to claim 1, wherein the thickness of the polyimide film composite layer is 75-200 μm, and the polyimide film composite layer is formed by combining polyimide films with different thicknesses.
6. The high-voltage-resistant double-sided coverlay film according to claim 1, wherein the biaxially oriented polypropylene film has a thickness of 25 to 75 μm.
7. The high-voltage-resistant double-sided coverlay film according to claim 1, wherein the thickness of the first release layer is 38-130 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022529851.9U CN214422552U (en) | 2020-11-04 | 2020-11-04 | High-voltage-resistant double-sided covering film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022529851.9U CN214422552U (en) | 2020-11-04 | 2020-11-04 | High-voltage-resistant double-sided covering film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214422552U true CN214422552U (en) | 2021-10-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022529851.9U Active CN214422552U (en) | 2020-11-04 | 2020-11-04 | High-voltage-resistant double-sided covering film |
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| Country | Link |
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| CN (1) | CN214422552U (en) |
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2020
- 2020-11-04 CN CN202022529851.9U patent/CN214422552U/en active Active
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