CN214381545U - Composite PCB (printed circuit board) - Google Patents
Composite PCB (printed circuit board) Download PDFInfo
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- CN214381545U CN214381545U CN202022709427.2U CN202022709427U CN214381545U CN 214381545 U CN214381545 U CN 214381545U CN 202022709427 U CN202022709427 U CN 202022709427U CN 214381545 U CN214381545 U CN 214381545U
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Abstract
The utility model relates to a PCB circuit board technical field specifically is a compound PCB circuit board, including the circuit board body, locate many upper shock absorber posts of circuit board body top and set up in many lower shock absorber posts of circuit board body below, the circuit board body includes upper circuit layer and lower floor's circuit layer that from top to bottom sets gradually, and adjacent be provided with the buffer layer between upper circuit layer and the lower floor's circuit layer, vertically seted up the upper mounting through-hole in the upper circuit layer, the buffer layer upper surface is just right the upper mounting through-hole is provided with the upper mounting post; in practical application, when the shock absorber is vibrated, the upper circuit layer and the lower circuit layer are effectively prevented from being mutually extruded to cause damage through the shock absorbing layer; the circuit board body is effectively protected through the upper shock absorption column and the lower shock absorption column, and the heat dissipation effect is good; the utility model discloses stability is strong, and is rationally distributed, and the radiating effect is good, and the shock attenuation is effectual.
Description
Technical Field
The utility model relates to a PCB circuit board technical field specifically is a compound PCB circuit board.
Background
The PCB is also called as a printed circuit board and a printed circuit board, is an important electronic component, is a support body of an electronic component and is also a carrier for electrical connection of the electronic component, and along with the development of decades, the application of the PCB also relates to the aspect of the square; the double-sided PCB circuit board can greatly increase the circuit layout area in a limited space and improve the integration level; meanwhile, along with the increase of the integration level and the power consumption, the finished product, the weight, the heat dissipation capacity, the waterproofness and the damping effect of the double-sided PCB circuit board tend to increase, the increase of any one defect parameter can cause the instability of the inside of the whole double-sided PCB circuit board, and particularly when the double-sided PCB circuit board is vibrated, the damage caused by mutual extrusion of the upper layer circuit and the lower layer circuit which are directly bonded is also large.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to foretell not enough, provide a stability is strong, and is rationally distributed, and the radiating effect is good, the effectual compound PCB circuit board of shock attenuation.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a compound PCB circuit board, includes the circuit board body, locates many of circuit board body top go up the shock attenuation post with set up in many shock attenuation post down of circuit board body below, the circuit board body is including upper circuit layer and the lower floor circuit layer that from top to bottom sets gradually, and is adjacent be provided with the buffer layer between upper circuit layer and the lower floor circuit layer, the vertical installation through-hole of having seted up in the upper circuit layer, the buffer layer upper surface is just right it is provided with the erection column to go up the installation through-hole, the top fixed connection of going up the erection column go up the bottom of shock attenuation post, the vertical installation through-hole of having seted up down in the lower floor circuit layer, the buffer layer lower surface is just right the installation through-hole is provided with down the erection column down, the bottom fixed connection of erection column down the top of shock attenuation post down.
Further, the shock-absorbing layer comprises an upper heat-conducting silicone layer and a lower heat-conducting silicone layer which are vertically opposite to each other, a plurality of soft rubber shock-absorbing strips are arranged between the upper heat-conducting silicone layer and the lower heat-conducting silicone layer, the tops and the bottoms of the soft rubber shock-absorbing strips are respectively and fixedly connected with the upper heat-conducting silicone layer and the lower heat-conducting silicone layer, a heat dissipation channel is formed between the adjacent soft rubber shock-absorbing strips, the bottom end of the upper mounting column is fixedly connected with the upper heat-conducting silicone layer, the top end of the lower mounting column is fixedly connected with the lower heat-conducting silicone layer, the upper surface of the upper heat-conducting silicone layer is bonded with the lower surface of the upper circuit layer, and the lower surface of the lower heat-conducting silicone layer is bonded with the upper surface of the lower circuit layer.
Furthermore, a first mounting groove with a downward opening is formed in the bottom end of the upper damping column, an upper damping spring is arranged in the first mounting groove, the top end of the upper damping spring is fixedly connected with the top of the first mounting groove, and the bottom end of the upper damping spring is fixedly connected with the top end of the upper mounting column.
Further, a second mounting groove with an upward opening is formed in the top end of the lower damping column, a lower damping spring is arranged in the second mounting groove, the bottom end of the lower damping spring is fixedly connected with the bottom of the second mounting groove, and the top end of the lower damping spring is fixedly connected with the bottom end of the lower mounting column.
Furthermore, the upper surface and the bottom surface of the circuit board body are respectively provided with a waterproof oxidation-resistant layer.
The utility model has the advantages that:
in practical application, when the shock absorber is vibrated, the upper circuit layer and the lower circuit layer are effectively prevented from being mutually extruded to cause damage through the shock absorbing layer; the circuit board body is effectively protected through the upper shock absorption column and the lower shock absorption column, and the heat dissipation effect is good; the utility model discloses stability is strong, and is rationally distributed, and the radiating effect is good, and the shock attenuation is effectual.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
reference numerals: a circuit board body 1; an upper shock absorbing column 2; a first mounting groove 21; an upper damping spring 22; a lower shock-absorbing post 3; a second mounting groove 31; a lower damping spring 32; an upper circuit layer 41; a lower circuit layer 42; a shock-absorbing layer 5; an upper thermally conductive silicone layer 51; a lower thermally conductive silicone layer 52; a soft rubber shock-absorbing strip 53; a heat dissipation channel 54; an upper mounting post 61; a lower mounting post 62; a waterproof oxidation-resistant layer 7.
Detailed Description
As shown in FIG. 1, a composite PCB comprises a circuit board body 1, a plurality of upper shock-absorbing columns 2 arranged above the circuit board body 1 and a plurality of lower shock-absorbing columns 3 arranged below the circuit board body 1, the circuit board body 1 comprises an upper circuit layer 41 and a lower circuit layer 42 which are arranged from top to bottom in sequence, a damping layer 5 is arranged between the adjacent upper circuit layer 41 and the adjacent lower circuit layer 42, an upper mounting through hole is vertically arranged in the upper circuit layer 41, an upper mounting column 61 is arranged on the upper surface of the shock absorption layer 5 opposite to the upper mounting through hole, the top end of the upper mounting post 61 is fixedly connected with the bottom end of the upper shock absorption post 2, a lower mounting through hole is vertically arranged in the lower circuit layer 42, the lower surface of the shock absorption layer 5 is opposite to the lower mounting through hole and is provided with a lower mounting column 62, and the bottom end of the lower mounting column 62 is fixedly connected with the top end of the lower shock absorption column 3.
In practical application, the circuit board body 1 is installed by fixing the upper shock absorption column 2 and the lower shock absorption column 3, and when the circuit board is shocked, the upper circuit layer 41 and the lower circuit layer 42 are effectively prevented from being mutually extruded to damage through the shock absorption layer 5; the circuit board body 1 is effectively protected through the upper shock absorption column 2 and the lower shock absorption column 3, and the heat dissipation effect is good; the utility model discloses stability is strong, and is rationally distributed, and the radiating effect is good, and the shock attenuation is effectual.
As shown in fig. 1, the shock-absorbing layer 5 includes an upper thermal grease layer 51 and a lower thermal grease layer 52 which are arranged opposite to each other, and a plurality of soft rubber shock-absorbing strips 53 which are arranged between the upper thermal grease layer 51 and the lower thermal grease layer 52, wherein the top and the bottom of each soft rubber shock-absorbing strip 53 are respectively and fixedly connected with the upper thermal grease layer 51 and the lower thermal grease layer 52, a heat dissipation channel 54 is formed between the adjacent soft rubber shock-absorbing strips 53, the bottom end of the upper mounting column 61 is fixedly connected with the upper thermal grease layer 51, the top end of the lower mounting column 62 is fixedly connected with the lower thermal grease layer 52, the upper surface of the upper thermal grease layer 51 is bonded with the lower surface of the upper circuit layer 41, and the lower surface of the lower thermal grease layer 52 is bonded with the upper surface of the lower circuit layer 42; in this embodiment, when upper circuit layer 41 and lower floor's circuit layer 42 received the extrusion, flexible glue shock attenuation strip 53 produced deformation by pressure, alleviated the pressure that upper circuit layer 41 and lower floor's circuit layer 42 received, and the shock attenuation is effectual, dispels the heat for upper circuit layer 41 and lower floor's circuit layer 42 through heat dissipation channel 54, produces the space that deformation provided for flexible glue shock attenuation strip 53 simultaneously.
As shown in fig. 1, a first mounting groove 21 with a downward opening is formed at the bottom end of the upper shock absorbing column 2, an upper shock absorbing spring 22 is arranged in the first mounting groove 21, the top end of the upper shock absorbing spring 22 is fixedly connected to the top of the first mounting groove 21, and the bottom end of the upper shock absorbing spring 22 is fixedly connected to the top end of the upper mounting column 61; in this embodiment, when the circuit board body 1 receives the pressure of top or below, through last erection column 61 extrusion upper damping spring 22, upper damping spring 22 atress produces deformation, slows down the pressure or the vibrations that circuit board body 1 received.
As shown in fig. 1, a second mounting groove 31 with an upward opening is formed at the top end of the lower shock absorbing column 3, a lower shock absorbing spring 32 is arranged in the second mounting groove 31, the bottom end of the lower shock absorbing spring 32 is fixedly connected to the bottom of the second mounting groove 31, and the top end of the lower shock absorbing spring 32 is fixedly connected to the bottom end of the lower mounting column 62; in this embodiment, when circuit board body 1 receives the pressure of top or below, through damping spring 32 down of lower erection column 62 extrusion, damping spring 32 atress produces deformation down, slows down the pressure or the vibrations that circuit board body 1 received.
As shown in fig. 1, the upper surface and the bottom surface of the circuit board body 1 are respectively provided with a waterproof oxidation-resistant layer 7; in this embodiment, the waterproof oxidation-resistant layer 7 on the upper and lower surfaces prevents the circuit layer from being oxidized by water.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein will be apparent to those skilled in the art without departing from the scope and spirit of the invention as defined in the accompanying claims.
Claims (5)
1. The utility model provides a compound PCB circuit board which characterized in that: comprises a circuit board body (1), a plurality of upper shock absorption columns (2) arranged above the circuit board body (1) and a plurality of lower shock absorption columns (3) arranged below the circuit board body (1), wherein the circuit board body (1) comprises an upper circuit layer (41) and a lower circuit layer (42) which are sequentially arranged from top to bottom, a shock absorption layer (5) is arranged between the upper circuit layer (41) and the lower circuit layer (42) which are adjacent, an upper installation through hole is vertically arranged in the upper circuit layer (41), the upper surface of the shock absorption layer (5) is just opposite to the upper installation through hole and is provided with an upper installation column (61), the top end of the upper installation column (61) is fixedly connected with the bottom end of the upper shock absorption column (2), a lower installation through hole is vertically arranged in the lower circuit layer (42), the lower surface of the shock absorption layer (5) is just opposite to the lower installation through hole and is provided with a lower installation column (62), the bottom end of the lower mounting column (62) is fixedly connected with the top end of the lower shock absorption column (3).
2. A composite PCB board according to claim 1, wherein: the shock-absorbing layer (5) comprises an upper heat-conducting silicone grease layer (51) and a lower heat-conducting silicone grease layer (52) which are arranged oppositely up and down, and a plurality of soft rubber shock-absorbing strips (53) arranged between the upper heat-conducting silicone grease layer (51) and the lower heat-conducting silicone grease layer (52), the top and the bottom of the soft rubber shock-absorbing strip (53) are respectively and fixedly connected with the upper heat-conducting silicone layer (51) and the lower heat-conducting silicone layer (52), a heat-radiating channel (54) is formed between the adjacent soft rubber shock-absorbing strips (53), the bottom end of the upper mounting column (61) is fixedly connected with the upper heat-conducting silicone layer (51), the top end of the lower mounting column (62) is fixedly connected with the lower heat-conducting silicone layer (52), the upper surface of the upper heat-conducting silicone layer (51) is bonded with the lower surface of the upper circuit layer (41), the lower surface of the lower heat-conducting silicone layer (52) is bonded to the upper surface of the lower circuit layer (42).
3. A composite PCB board according to claim 1, wherein: go up the bottom of shock attenuation post (2) and seted up first mounting groove (21) that open side down, be provided with damping spring (22) in first mounting groove (21), the top fixed connection of going up damping spring (22) the groove top of first mounting groove (21), the bottom fixed connection of going up damping spring (22) go up the top of erection column (61).
4. A composite PCB board according to claim 1, wherein: lower shock absorber post (3) the top seted up second mounting groove (31) that the opening is up, be provided with down damping spring (32) in second mounting groove (31), the bottom fixed connection of lower damping spring (32) the tank bottom of second mounting groove (31), the top fixed connection of lower damping spring (32) the bottom of lower erection column (62).
5. A composite PCB board according to claim 1, wherein: the upper surface and the bottom surface of the circuit board body (1) are respectively provided with a waterproof oxidation-resistant layer (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022709427.2U CN214381545U (en) | 2020-11-20 | 2020-11-20 | Composite PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022709427.2U CN214381545U (en) | 2020-11-20 | 2020-11-20 | Composite PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214381545U true CN214381545U (en) | 2021-10-08 |
Family
ID=77978951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022709427.2U Active CN214381545U (en) | 2020-11-20 | 2020-11-20 | Composite PCB (printed circuit board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214381545U (en) |
-
2020
- 2020-11-20 CN CN202022709427.2U patent/CN214381545U/en active Active
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