CN211580300U - Mainboard with multiple welding pins for integrated circuit design - Google Patents
Mainboard with multiple welding pins for integrated circuit design Download PDFInfo
- Publication number
- CN211580300U CN211580300U CN202020617143.8U CN202020617143U CN211580300U CN 211580300 U CN211580300 U CN 211580300U CN 202020617143 U CN202020617143 U CN 202020617143U CN 211580300 U CN211580300 U CN 211580300U
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- Prior art keywords
- integrated circuit
- wall
- circuit board
- board body
- holes
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- 238000003466 welding Methods 0.000 title claims abstract description 28
- 230000001681 protective effect Effects 0.000 claims abstract description 11
- 238000013016 damping Methods 0.000 claims abstract description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 230000007797 corrosion Effects 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 7
- 230000035939 shock Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 208000034656 Contusions Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 208000034526 bruise Diseases 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model relates to the technical field of integrated circuit boards, in particular to a mainboard with a plurality of welding pins for integrated circuit design, which comprises an integrated circuit board body, wherein a protective ring is bonded on the peripheral outer wall of the integrated circuit board body, a plurality of through holes are arranged inside the protective ring, a bottom plate is arranged below the integrated circuit board body, a damping structure is arranged between the bottom plate and the integrated circuit board body and positioned at four corners, the damping structure comprises a fixed column and a sleeve, a fixed groove is arranged on the outer wall of the fixed column, a guide rod is arranged on the bottom wall of the fixed column, a guide hole is arranged at the central position of the top wall of the sleeve, the guide rod is inserted in the guide hole in a sliding way, a limit ring is bonded at the position of the outer wall of the guide rod which is positioned inside the sleeve, the mainboard with a plurality of welding pins, the service life of the device is prolonged.
Description
Technical Field
The utility model relates to an integrated circuit board technical field, specifically speaking relates to a take mainboard for integrated circuit design of a plurality of welding pins.
Background
An integrated circuit board is a carrier on which an integrated circuit is mounted. The simulation is used for producing, enlargiing and handling various analog signal, obtains extensive application in the electron field, but, current integrated circuit board protective properties is relatively poor, makes integrated circuit board corner collision damage easily when the transportation to integrated circuit board is direct directly through bolt fixed mounting in equipment mostly, can drive integrated circuit board vibrations together when equipment produces vibrations at work, can reduce integrated circuit board's life in the past for a long time.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a take mainboard for integrated circuit design of a plurality of welding pins to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a mainboard with a plurality of welding pins for integrated circuit design comprises an integrated circuit board body, wherein protective rings are bonded on the peripheral outer walls of the integrated circuit board body, a plurality of through holes are formed in the protective rings, a bottom plate is arranged below the integrated circuit board body, damping structures are arranged at four corners between the bottom plate and the integrated circuit board body and comprise fixed columns and sleeves, fixed grooves are formed in the outer walls of the fixed columns, guide rods are arranged on the bottom walls of the fixed columns, guide holes are formed in the central positions of the top walls of the sleeves, the guide rods are inserted into the guide holes in a sliding mode, limiting rings are bonded on the inner positions of the sleeves on the outer walls of the guide rods, and springs are sleeved on the lower positions of the guide rods on the limiting rings; the integrated circuit board body comprises a mainboard, the inside of mainboard is located four corners and has all seted up first fixed orifices, a plurality of first welding pin holes have still been seted up to the inside of mainboard, the roof of mainboard bonds and has had the welding dish, the inside of welding dish is located four corners and has all seted up the second fixed orifices, a plurality of second welding pin holes have still been seted up to the inside of welding dish.
Preferably, the positions of the first fixing holes correspond to the positions of the second fixing holes one to one, and the sizes of the first fixing holes and the second fixing holes are matched with the sizes of the fixing grooves.
Preferably, the sleeve is adhered to the top wall of the bottom plate, and the top end and the bottom end of the spring are respectively adhered to the limiting ring and the bottom plate.
Preferably, the mounting plates are bonded to the outer walls of the two sides of the bottom plate, and a plurality of mounting holes are formed in the mounting plates.
Preferably, the top wall and the bottom wall of the main plate are coated with corrosion-resistant layers.
Preferably, a plurality of radiating fins are bonded to the bottom wall of the main board, and a plurality of radiating holes are formed in the radiating fins.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the mainboard with the plurality of welding pins for designing the integrated circuit can well protect four sides of the integrated circuit board body through the arrangement of the protective ring, and avoids collision damage during transportation; through shock-absorbing structure's setting, can play fine shock attenuation effect, can carry out fine protection to the integrated circuit board body, prolong its life.
2. This take mainboard for integrated circuit design of a plurality of welding pins, through the setting of fin and louvre, can carry out fine heat dissipation to the integrated circuit board body, be convenient for its stable work.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is an exploded schematic view of the ic board body according to the present invention;
fig. 3 is a schematic view of the bottom structure of the main board of the present invention;
fig. 4 is an enlarged schematic structural view of a portion a in fig. 3 according to the present invention;
fig. 5 is an explosion structure diagram of the shock absorbing structure of the present invention.
In the figure: 1. an integrated circuit board body; 10. a main board; 100. a first fixing hole; 101. a first solder pin hole; 11. welding a disc; 110. a second fixing hole; 111. a second solder pin hole; 12. a corrosion-resistant layer; 13. a heat sink; 130. heat dissipation holes; 2. a guard ring; 20. a through hole; 3. a base plate; 30. mounting a plate; 300. mounting holes; 4. a shock-absorbing structure; 40. fixing a column; 400. fixing grooves; 41. a guide bar; 42. a limiting ring; 43. a sleeve; 430. a guide hole; 44. a spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1-5, the present invention provides a technical solution:
a mainboard with a plurality of welding pins for integrated circuit design comprises an integrated circuit board body 1, a protective ring 2 is bonded on the peripheral outer wall of the integrated circuit board body 1, a plurality of through holes 20 are formed in the protective ring 2, a bottom plate 3 is arranged below the integrated circuit board body 1, damping structures 4 are arranged between the bottom plate 3 and the integrated circuit board body 1 and located at four corners, each damping structure 4 comprises a fixed column 40 and a sleeve 43, a fixed groove 400 is formed in the outer wall of the fixed column 40, a guide rod 41 is arranged on the bottom wall of the fixed column 40, a guide hole 430 is formed in the center position of the top wall of the sleeve 43, the guide rod 41 is slidably inserted into the guide hole 430, a limiting ring 42 is bonded on the position, located below the limiting ring 42, of the outer wall of the guide rod 41, and a spring 44 is sleeved on the; integrated circuit board body 1 includes mainboard 10, and the inside of mainboard 10 is located four corners and has all seted up first fixed orifices 100, and a plurality of first welding pin hole 101 have still been seted up to the inside of mainboard 10, and the roof of mainboard 10 bonds has welding plate 11, and welding plate 11's inside is located four corners and has all seted up second fixed orifices 110, and a plurality of second welding pin hole 111 have still been seted up to welding plate 11's inside.
In this embodiment, the positions of the first fixing holes 100 correspond to the positions of the second fixing holes 110 one to one, and the sizes of the first fixing holes 100 and the second fixing holes 110 are matched with the size of the fixing slots 400, so that the first fixing holes 100 and the second fixing holes 110 are limited and clamped in the fixing slots 400 together, and the integrated circuit board body 1 can be stably fixed on the fixing posts 40.
Specifically, the sleeve 43 is adhered to the top wall of the bottom plate 3, so that the sleeve 43 is firmly fixed on the bottom plate 3, and the top end and the bottom end of the spring 44 are adhered to the limiting ring 42 and the bottom plate 3, respectively.
In the embodiment, the protective ring 2 is made of a silica gel material, has good impact resistance, and can protect the periphery of the integrated circuit board body 1 to prevent the integrated circuit board body from being damaged by collision or abrasion during transportation.
Further, all bond on the both sides outer wall of bottom plate 3 has mounting panel 30, and a plurality of mounting holes 300 have been seted up to mounting panel 30's inside, are convenient for install fixed bottom plate 3.
In addition, the corrosion-resistant layer 12 is coated on the top wall and the bottom wall of the main board 10, the corrosion-resistant layer 12 is a high molecular compound formed by polymerizing tetrafluoroethylene, and the main board 10 has excellent chemical stability, corrosion resistance, sealing property, high lubrication non-adhesiveness, electrical insulation property and good ageing resistance, and the service life of the main board 10 is prolonged.
It should be noted that, a plurality of heat dissipation fins 13 are adhered to the bottom wall of the motherboard 10, and a plurality of heat dissipation holes 130 are formed inside the heat dissipation fins 13, so as to facilitate heat dissipation of the motherboard 10 and facilitate stable operation thereof.
The mainboard is used in the integrated circuit design of taking a plurality of welding pins of this embodiment, can install integrated circuit board body 1 in equipment through mounting panel 30 and mounting hole 300, when equipment work vibrations, can drive integrated circuit board body 1 and rock together, can play fine shock attenuation effect through shock-absorbing structure 4, guarantee the stability of integrated circuit board body 1, be convenient for its stable work, and simultaneously, fin 13 and louvre 130 can carry out fine heat dissipation to integrated circuit board body 1, when transporting integrated circuit board body 1, can protect around integrated circuit board body 1 through guard ring 2, prevent it from being bruised or the wearing and tearing is hindered by the bruise when the transportation.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a take integrated circuit of a plurality of welding pin mainboard for design, includes integrated circuit board body (1), its characterized in that: the integrated circuit board comprises an integrated circuit board body (1), wherein a protective ring (2) is bonded on the outer wall of the periphery of the integrated circuit board body (1), a plurality of through holes (20) are formed in the protective ring (2), a bottom plate (3) is arranged below the integrated circuit board body (1), damping structures (4) are arranged at four corners between the bottom plate (3) and the integrated circuit board body (1), each damping structure (4) comprises a fixed column (40) and a sleeve (43), a fixed groove (400) is formed in the outer wall of each fixed column (40), a guide rod (41) is arranged on the bottom wall of each fixed column (40), a guide hole (430) is formed in the center of the top wall of each sleeve (43), each guide rod (41) is inserted into the corresponding guide hole (430) in a sliding mode, a limit ring (42) is bonded at the position, on the outer wall of each guide, a spring (44) is sleeved at the position, below the limiting ring (42), of the outer wall of the guide rod (41); the integrated circuit board body (1) comprises a main board (10), wherein the inside of the main board (10) is located at four corners and has been provided with first fixing holes (100), the inside of the main board (10) has been provided with a plurality of first welding pin holes (101), the top wall of the main board (10) is bonded with a welding disc (11), the inside of the welding disc (11) is located at four corners and has been provided with second fixing holes (110), and the inside of the welding disc (11) has been provided with a plurality of second welding pin holes (111).
2. The integrated circuit design motherboard with multiple solder pins of claim 1, wherein: the positions of the first fixing holes (100) correspond to the positions of the second fixing holes (110) in a one-to-one mode, and the sizes of the first fixing holes (100) and the second fixing holes (110) are matched with the size of the fixing groove (400).
3. The integrated circuit design motherboard with multiple solder pins of claim 1, wherein: the sleeve (43) is adhered to the top wall of the bottom plate (3), and the top end and the bottom end of the spring (44) are adhered to the limiting ring (42) and the bottom plate (3) respectively.
4. The integrated circuit design motherboard with multiple solder pins of claim 1, wherein: all bond on the both sides outer wall of bottom plate (3) and have mounting panel (30), a plurality of mounting holes (300) have been seted up to the inside of mounting panel (30).
5. The integrated circuit design motherboard with multiple solder pins of claim 1, wherein: the top wall and the bottom wall of the main board (10) are coated with corrosion-resistant layers (12).
6. The integrated circuit design motherboard with multiple solder pins of claim 1, wherein: the bottom wall of the main board (10) is bonded with a plurality of radiating fins (13), and a plurality of radiating holes (130) are formed in the radiating fins (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020617143.8U CN211580300U (en) | 2020-04-22 | 2020-04-22 | Mainboard with multiple welding pins for integrated circuit design |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020617143.8U CN211580300U (en) | 2020-04-22 | 2020-04-22 | Mainboard with multiple welding pins for integrated circuit design |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211580300U true CN211580300U (en) | 2020-09-25 |
Family
ID=72528060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020617143.8U Active CN211580300U (en) | 2020-04-22 | 2020-04-22 | Mainboard with multiple welding pins for integrated circuit design |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211580300U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112654139A (en) * | 2020-12-21 | 2021-04-13 | 安徽展新电子有限公司 | Circuit board convenient to fixed mounting |
-
2020
- 2020-04-22 CN CN202020617143.8U patent/CN211580300U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112654139A (en) * | 2020-12-21 | 2021-04-13 | 安徽展新电子有限公司 | Circuit board convenient to fixed mounting |
| CN112654139B (en) * | 2020-12-21 | 2021-12-07 | 安徽展新电子有限公司 | Circuit board convenient to fixed mounting |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240719 Address after: No. 201, Xinglong Decoration City Sales Office, No.1 Yingzhou South Road, Haizhou District, Lianyungang City, Jiangsu Province, 222000 Patentee after: Lianyungang Leigen Trading Co.,Ltd. Country or region after: China Address before: Room 1308, unit 2, Kangtai international, 3108 Fuxing Middle Road, Baoding, Hebei, 071000 Patentee before: Baoding Ludu Information Technology Service Co.,Ltd. Country or region before: China |