CN215342554U - Semiconductor discharge tube with protective sleeve - Google Patents
Semiconductor discharge tube with protective sleeve Download PDFInfo
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- CN215342554U CN215342554U CN202121202851.6U CN202121202851U CN215342554U CN 215342554 U CN215342554 U CN 215342554U CN 202121202851 U CN202121202851 U CN 202121202851U CN 215342554 U CN215342554 U CN 215342554U
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- discharge tube
- shell
- semiconductor discharge
- threaded
- plate
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 102
- 230000001681 protective Effects 0.000 title claims abstract description 21
- 238000010521 absorption reaction Methods 0.000 claims abstract description 10
- 239000007853 buffer solution Substances 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 1
- UIIMBOGNXHQVGW-UHFFFAOYSA-M buffer Substances [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 abstract description 13
- 238000000034 method Methods 0.000 description 10
- 238000005057 refrigeration Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 5
- 230000002349 favourable Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006011 modification reaction Methods 0.000 description 2
- 230000003139 buffering Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000001808 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000002035 prolonged Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Abstract
The application provides a take semiconductor discharge tube of protective sheath belongs to discharge tube technical field. The semiconductor discharge tube with the protective sleeve comprises a shell connecting component and a fixing component. Buffer bottom plate connects the inside below of first casing, the second casing sets up the top of first casing, threaded connection spare threaded connection first casing with between the buffer bottom plate, the connecting plate rotates to be connected the upper surface of second casing. The semiconductor discharge tube body is arranged above the buffer bottom plate, the fixing piece is in threaded connection with the first shell, the heat absorption positioning piece is in contact connection with the upper surface of the semiconductor discharge tube body, and the cable fixing piece is arranged between the first shell and the second shell. The semiconductor discharge tube protection circuit is beneficial to protecting the semiconductor discharge tube, prolongs the service life of the semiconductor discharge tube and ensures the safety of the circuit.
Description
Technical Field
The application relates to the field of discharge tubes, in particular to a semiconductor discharge tube with a protective sleeve.
Background
The semiconductor discharge tube is an overvoltage protection device, and can flow large surge current or pulse current, and the breakdown voltage range of the semiconductor discharge tube forms the overvoltage protection range.
Because the semiconductor discharge tube is fine and small in size, the semiconductor discharge tube is often damaged by external force due to lack of protection outside when in use, the safety of a circuit is influenced, the service life of the semiconductor discharge tube is shortened, and how to invent the semiconductor discharge tube with the protective sleeve to improve the problems becomes a problem to be solved at present.
SUMMERY OF THE UTILITY MODEL
In order to compensate above not enough, the application provides a take semiconductor discharge tube of protective sheath, aims at improving that semiconductor discharge tube is comparatively meticulous and the volume is less, because the outside lacks the protection when using, often can receive external force and cause the damage, has influenced the safety of circuit, has reduced semiconductor discharge tube life's problem.
The embodiment of the application provides a semiconductor discharge tube with a protective sleeve, which comprises a shell connecting assembly and a fixing assembly.
Casing coupling assembling includes first casing, buffer bottom plate, second casing, threaded connection spare and connecting plate, buffer bottom plate connects the inside below of first casing, the second casing sets up the top of first casing, threaded connection spare threaded connection be in first casing with between the buffer bottom plate, the connecting plate rotates to be connected the upper surface of second casing.
The fixing assembly comprises a semiconductor discharge tube body, a fixing piece, a heat absorption positioning piece and a cable fixing piece, the semiconductor discharge tube body is arranged above the buffer bottom plate, the fixing piece is in threaded connection with the first shell, one end of the fixing piece is in contact connection with the semiconductor discharge tube body, the heat absorption positioning piece is connected to the upper portion of the inside of the second shell, the heat absorption positioning piece is in contact connection with the upper surface of the semiconductor discharge tube body, and the cable fixing piece is arranged between the first shell and the second shell.
In the above implementation process, the semiconductor discharge tube body is placed on the buffer bottom plate, and the buffer bottom plate is arranged to buffer the bottom of the semiconductor discharge tube body. And rotating the fixing piece to enable the fixing piece to be in contact with the semiconductor discharge tube body, so that the semiconductor discharge tube body is fixed. Make first casing and second casing to connect through threaded connection spare, first casing and second casing provide the protection to semiconductor discharge tube body, and the heat absorption setting element is laminated with semiconductor discharge tube body's top, can absorb and give off the heat that semiconductor discharge tube body work produced, is favorable to cooling to semiconductor discharge tube body, and the heat absorption setting element can be fixed and protect semiconductor discharge tube body's top. The connecting plate is arranged to be convenient for checking the semiconductor discharge tube body, so that the semiconductor discharge tube body is protected, the service life of the semiconductor discharge tube is prolonged, and the safety of a circuit is guaranteed.
In a specific embodiment, the buffer bottom plate comprises a plate body and a first spring, wherein the plate body is connected to the inside of the first shell, and the first spring is connected between the first shell and the plate body.
In the implementation process, the plate body is arranged to support the semiconductor discharge tube body, and the first spring is arranged to buffer the bottom of the semiconductor discharge tube body.
In a specific implementation scheme, the two ends of the lower part of the second shell are connected with the inserting rods, and the upper part of the first shell is provided with connecting holes matched with the inserting rods.
In the implementation process, the insertion rod is arranged to be beneficial to positioning between the first shell and the second shell, and the firmness of connection between the first shell and the second shell is facilitated.
In a specific embodiment, the threaded connector comprises a threaded rod and a positioning sleeve, the positioning sleeve is connected above the plate body, and the threaded rod is in threaded connection between the first shell and the positioning sleeve.
In the implementation process, the first shell is connected with the second shell through the threaded rod, the positioning sleeve and the plate body in threaded connection, and the positioning sleeve is favorable for the threaded rod to be connected with the plate body.
In a specific embodiment, the first shell is provided with a threaded hole, and the threaded rod is in threaded connection with the threaded hole.
In the implementation process, the connection effect between the threaded rod and the first shell is improved by arranging the threaded hole.
In a specific embodiment, the connecting plate is provided with heat dissipation holes, and a lock catch is connected between the connecting plate and the first housing.
In the implementation process, the heat dissipation holes are arranged to facilitate the heat dissipated by the semiconductor discharge tube body to be dissipated from the first shell and the second shell, the semiconductor discharge tube body is cooled, and the lock catch is arranged to facilitate the connection plate to be fixed with the first shell.
In a specific embodiment, a non-slip pad is disposed below the semiconductor discharge tube body, and the non-slip pad is disposed above the plate body.
In the implementation process, the anti-slip pad is arranged to improve the placing stability of the semiconductor discharge tube body on the plate body, so that the semiconductor discharge tube body is favorably fixed.
In a specific embodiment, the fixing member includes a screw rod, a threaded sleeve and a clamping block, the threaded sleeve is connected to one side of the first shell, the screw rod is connected in the threaded sleeve in a threaded manner, the clamping block is fixed at one end of the screw rod, and the clamping block is connected with the semiconductor discharge tube body in a contact manner.
In the implementation process, the screw rod is rotated to drive the clamping block to move, and the clamping block is contacted with the semiconductor discharge tube body to realize the fixation of the semiconductor discharge tube body.
In a specific embodiment, the heat absorption setting element includes connecting rod, second spring and refrigeration piece, the connecting rod is connected the inside below of second casing, the refrigeration piece is connected the below of connecting rod, the refrigeration piece with the top laminating of semiconductor discharge tube body, the winding of second spring is in on the connecting rod.
In the above-mentioned realization process, set up the refrigeration piece and can absorb and give off the heat that semiconductor discharge tube body work produced, be favorable to cooling to semiconductor discharge tube body, connecting rod and second spring can be fixed and protect the top of semiconductor discharge tube body.
In a specific implementation scheme, a first groove body is formed in one side of the first shell, a second groove body is formed in one side of the second shell, third springs are connected into the first groove body and the second groove body respectively, and one end of each third spring is connected with a clamping plate.
In the implementation process, the electric wires connected with the two ends of the semiconductor discharge tube body can be fixed by arranging the third spring and the clamping plate, so that the protection of the semiconductor discharge tube body is facilitated.
Drawings
In order to more clearly explain the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that for those skilled in the art, other related drawings can be obtained from these drawings without inventive effort.
FIG. 1 is a schematic view of a semiconductor discharge tube with a protective sheath according to an embodiment of the present disclosure;
fig. 2 is a schematic view of a connecting structure of a housing connecting assembly and a fixing assembly provided in an embodiment of the present application;
FIG. 3 is a schematic illustration of a bayonet configuration provided in accordance with an embodiment of the present disclosure;
FIG. 4 is a schematic structural diagram of a connection plate according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a cable fixing member according to an embodiment of the present application.
In the figure: 100-a housing connection assembly; 110-a first housing; 120-a buffer floor; 122-a plate body; 124-a first spring; 130-a second housing; 132-a plunger; 140-a threaded connection; 142-a threaded rod; 144-a positioning sleeve; 146-a threaded hole; 150-a connecting plate; 152-locking; 154-heat dissipation holes; 200-a stationary component; 210-a semiconductor discharge tube body; 220-non-slip mat; 230-a fixing member; 232-screw rod; 234-thread bush; 236-a clamp block; 240-heat absorbing location; 242-connecting rod; 244-a second spring; 246-chilling plates; 250-a cable mount; 252-a first trough; 254-a second trough body; 256-third spring; 258-clamp plate.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.
To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.
Thus, the following detailed description of the embodiments of the present application, as presented in the figures, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and thus should not be considered limiting.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Referring to fig. 1-5, the present application provides a technical solution: a semiconductor discharge tube with a protective cover includes a housing connection assembly 100 and a fixing assembly 200.
Referring to fig. 1 to 5, the housing connecting assembly 100 includes a first housing 110, a buffer base plate 120, a second housing 130, a threaded connector 140, and a connecting plate 150, wherein the buffer base plate 120 is connected to the lower portion of the interior of the first housing 110, the buffer base plate 120 includes a plate body 122 and a first spring 124, the plate body 122 is connected to the interior of the first housing 110, and the first spring 124 is connected between the first housing 110 and the plate body 122. The mounting plate 122 can provide support to the semiconductor discharge tube body 210, and the first spring 124 can provide cushioning to the bottom of the semiconductor discharge tube body 210. The second housing 130 is disposed above the first housing 110, the two ends of the lower portion of the second housing 130 are connected with the insertion rod 132, and the upper portion of the first housing 110 is provided with a connection hole adapted to the insertion rod 132. The positioning of the insertion rod 132 between the first housing 110 and the second housing 130 is facilitated, and the connection between the first housing 110 and the second housing 130 is facilitated. The threaded connector 140 is screwed between the first housing 110 and the buffer base plate 120, the threaded connector 140 includes a threaded rod 142 and a positioning sleeve 144, the positioning sleeve 144 is connected above the plate body 122, and the threaded rod 142 is screwed between the first housing 110 and the positioning sleeve 144. The threaded rod 142 is in threaded connection with the positioning sleeve 144 and the plate body 122, so that the first shell 110 and the second shell 130 are connected, and the positioning sleeve 144 is arranged to facilitate the connection of the threaded rod 142 and the plate body 122. The first housing 110 has a threaded hole 146, and the threaded rod 142 is threadedly coupled in the threaded hole 146. The connection effect between the threaded rod 142 and the first housing 110 is improved by forming the threaded hole 146, and the connection plate 150 is rotatably connected to the upper surface of the second housing 130. The connecting plate 150 is provided with a heat dissipating hole 154, and a latch 152 is connected between the connecting plate 150 and the first housing 110. The heat dissipation holes 154 are arranged to dissipate heat dissipated from the semiconductor discharge tube body 210 from the first housing 110 and the second housing 130, so as to cool the semiconductor discharge tube body 210, and the latches 152 are arranged to fix the connection board 150 to the first housing 110.
Referring to fig. 1 to 5, the fixing assembly 200 includes a semiconductor discharge tube body 210, a fixing member 230, a heat sink positioning member 240 and a cable fixing member 250, wherein the semiconductor discharge tube body 210 is disposed above the buffer base plate 120, a non-slip pad 220 is disposed below the semiconductor discharge tube body 210, and the non-slip pad 220 is disposed above the plate body 122. The anti-slip pad 220 can improve the stability of the semiconductor discharge tube body 210 placed on the plate 122, which is beneficial to fixing the semiconductor discharge tube body 210. The fixing member 230 is in threaded connection with the first housing 110, one end of the fixing member 230 is in contact connection with the semiconductor discharge tube body 210, the fixing member 230 includes a screw 232, a threaded sleeve 234, and a clamping block 236, the threaded sleeve 234 is connected to one side of the first housing 110, the screw 232 is in threaded connection with the threaded sleeve 234, the clamping block 236 is fixed at one end of the screw 232, and the clamping block 236 is in contact connection with the semiconductor discharge tube body 210. The screw 232 is rotated to drive the clamping block 236 to move, and the clamping block 236 is contacted with the semiconductor discharge tube body 210, so that the semiconductor discharge tube body 210 is fixed. The heat absorbing positioning member 240 is connected to the upper portion of the inside of the second housing 130, the heat absorbing positioning member 240 is connected to the upper surface of the semiconductor discharge tube body 210 in contact therewith, the heat absorbing positioning member 240 includes a connection rod 242, a second spring 244 and a refrigerating plate 246, the connection rod 242 is connected to the lower portion of the inside of the second housing 130, the refrigerating plate 246 is connected to the lower portion of the connection rod 242, the refrigerating plate 246 is attached to the upper portion of the semiconductor discharge tube body 210, and the second spring 244 is wound around the connection rod 242. The refrigeration sheet 246 is arranged to absorb and dissipate heat generated by the operation of the semiconductor discharge tube body 210, so as to facilitate cooling of the semiconductor discharge tube body 210, and the connecting rod 242 and the second spring 244 can fix and protect the upper side of the semiconductor discharge tube body 210. The cable fixing member 250 is disposed between the first casing 110 and the second casing 130, a first groove 252 is formed in one side of the first casing 110, a second groove 254 is formed in one side of the second casing 130, third springs 256 are respectively connected to the first groove 252 and the second groove 254, and a clamping plate 258 is connected to one end of each third spring 256. The wires connected at both ends of the semiconductor discharge tube body 210 can be fixed by providing the third spring 256 and the clamping plate 258, which is advantageous for providing protection to the semiconductor discharge tube body 210.
The working principle of the semiconductor discharge tube with the protective sleeve is as follows: during the use, place semiconductor discharge tube body 210 on plate body 122, can improve the stability that semiconductor discharge tube body 210 placed on plate body 122 through setting up slipmat 220, set up first spring 124 and can provide the buffering to the bottom of semiconductor discharge tube body 210. The screw 232 is rotated to drive the clamping block 236 to move, and the clamping block 236 contacts with the semiconductor discharge tube body 210, so that the semiconductor discharge tube body 210 is fixed. The threaded rod 142 is in threaded connection with the positioning sleeve 144 and the plate body 122, so that the first shell 110 and the second shell 130 are connected, and the positioning sleeve 144 is arranged to facilitate the connection of the threaded rod 142 and the plate body 122. The first shell 110 and the second shell 130 provide protection for the semiconductor discharge tube body 210, the refrigeration piece 246 is attached to the top of the semiconductor discharge tube body 210, the refrigeration piece 246 is arranged to absorb and dissipate heat generated by the operation of the semiconductor discharge tube body 210, so that the semiconductor discharge tube body 210 is cooled, and the connecting rod 242 and the second spring 244 can fix and protect the top of the semiconductor discharge tube body 210. The connecting plate 150 is arranged to facilitate checking of the semiconductor discharge tube body 210, so that the problems that the semiconductor discharge tube is fine and small in size, and is damaged due to external force caused by the fact that protection is lacked outside when the semiconductor discharge tube is used are solved, the safety of a circuit is affected, and the service life of the semiconductor discharge tube is shortened.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A semiconductor discharge tube with a protective cover is characterized by comprising
The shell connecting assembly (100) comprises a first shell (110), a buffer base plate (120), a second shell (130), a threaded connector (140) and a connecting plate (150), wherein the buffer base plate (120) is connected below the inside of the first shell (110), the second shell (130) is arranged above the first shell (110), the threaded connector (140) is in threaded connection between the first shell (110) and the buffer base plate (120), and the connecting plate (150) is rotatably connected to the upper surface of the second shell (130);
the fixing assembly (200) comprises a semiconductor discharge tube body (210), a fixing piece (230), a heat absorption positioning piece (240) and a cable fixing piece (250), wherein the semiconductor discharge tube body (210) is placed above the buffer base plate (120), the fixing piece (230) is in threaded connection with the first shell (110), one end of the fixing piece (230) is in contact connection with the semiconductor discharge tube body (210), the heat absorption positioning piece (240) is connected above the inner part of the second shell (130), the heat absorption positioning piece (240) is in contact connection with the upper surface of the semiconductor discharge tube body (210), and the cable fixing piece (250) is arranged between the first shell (110) and the second shell (130).
2. A protective jacketing semiconductor discharge tube according to claim 1 wherein the cushioned substrate (120) comprises a plate (122) and a first spring (124), the plate (122) being attached to the interior of the first housing (110), the first spring (124) being attached between the first housing (110) and the plate (122).
3. The semiconductor discharge tube with the protective sleeve as claimed in claim 1, wherein an insertion rod (132) is connected to both lower ends of the second shell (130), and a connection hole adapted to the insertion rod (132) is formed above the first shell (110).
4. A protective jacketing semiconductor discharge tube according to claim 2 wherein the threaded connector (140) comprises a threaded rod (142) and a locating sleeve (144), the locating sleeve (144) being attached over the plate (122), the threaded rod (142) being threaded between the first body (110) and the locating sleeve (144).
5. A semiconductor discharge tube with protective sleeve as claimed in claim 4, wherein the first shell (110) has a threaded hole (146) formed therein, and the threaded rod (142) is screwed into the threaded hole (146).
6. The discharge tube with protective cover of claim 1, wherein said connecting plate (150) has heat dissipation holes (154), and a latch (152) is connected between said connecting plate (150) and said first shell (110).
7. A semiconductor discharge tube with protective cover according to claim 2, wherein a non-slip pad (220) is disposed below the semiconductor discharge tube body (210), and the non-slip pad (220) is disposed above the board body (122).
8. The discharge tube with protective sleeve of claim 1, wherein the fixing member (230) comprises a screw (232), a threaded sleeve (234) and a clamping block (236), the threaded sleeve (234) is connected to one side of the first shell (110), the screw (232) is screwed in the threaded sleeve (234), the clamping block (236) is fixed at one end of the screw (232), and the clamping block (236) is in contact connection with the discharge tube body (210).
9. The discharge tube with protective sleeve of claim 1, wherein the heat absorbing positioning member (240) comprises a connecting rod (242), a second spring (244) and a cooling plate (246), the connecting rod (242) is connected below the inside of the second shell (130), the cooling plate (246) is connected below the connecting rod (242), the cooling plate (246) is attached to the upper side of the discharge tube body (210), and the second spring (244) is wound on the connecting rod (242).
10. The semiconductor discharge tube with the protective sleeve as claimed in claim 1, wherein a first slot (252) is formed in one side of the first housing (110), a second slot (254) is formed in one side of the second housing (130), a third spring (256) is respectively connected to the first slot (252) and the second slot (254), and a clamping plate (258) is connected to one end of the third spring (256).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121202851.6U CN215342554U (en) | 2021-05-31 | 2021-05-31 | Semiconductor discharge tube with protective sleeve |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121202851.6U CN215342554U (en) | 2021-05-31 | 2021-05-31 | Semiconductor discharge tube with protective sleeve |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215342554U true CN215342554U (en) | 2021-12-28 |
Family
ID=79549647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121202851.6U Active CN215342554U (en) | 2021-05-31 | 2021-05-31 | Semiconductor discharge tube with protective sleeve |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215342554U (en) |
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2021
- 2021-05-31 CN CN202121202851.6U patent/CN215342554U/en active Active
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Address after: 300000 Haitai green industrial base k2-2-502-a, No. 6, Haitai development road, Huayuan Industrial Zone, Binhai New Area, Tianjin Patentee after: TIANJIN BLJ TECHNOLOGY DEVELOPMENT Co.,Ltd. Address before: K2-2-502-a, Haitai green industrial base, 6 Haitai development road, Huayuan Industrial Zone, Xiqing District, Tianjin Patentee before: TIANJIN BLJ TECHNOLOGY DEVELOPMENT Co.,Ltd. |