CN214223846U - Temperature-uniforming plate assembly with capillary structure - Google Patents
Temperature-uniforming plate assembly with capillary structure Download PDFInfo
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- CN214223846U CN214223846U CN202022423652.XU CN202022423652U CN214223846U CN 214223846 U CN214223846 U CN 214223846U CN 202022423652 U CN202022423652 U CN 202022423652U CN 214223846 U CN214223846 U CN 214223846U
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Abstract
The utility model provides a temperature-uniforming plate subassembly with capillary structure, including heat source spare and temperature-uniforming plate body, temperature-uniforming plate body includes the fixed part of free portion and with heat source spare contact, free portion and fixed part be integrated into one piece, close by two thin slice lids and form, two thin slices include the heating panel and with the heat absorbing plate of heat source spare contact surface, heat absorbing plate and heating panel all have the inner chamber, the inner chamber of heat absorbing plate is equipped with capillary structure, the capillary structure both ends are connected to the inner chamber wall, capillary structure is formed by sintering of sintering net and fine mesh, the heating panel is equipped with the support column with capillary structure butt; the increase temperature-uniforming plate body area has improved heat dissipation rate greatly, and the capillary structure is formed by sintering copper mesh and fine mesh, and the multilayer copper mesh staggered arrangement of sintering provides the circulation passageway of liquid between the upper and lower surface in the heat pipe to play the effect of supporting temperature-uniforming plate body inner space.
Description
Technical Field
The utility model relates to a temperature-uniforming plate technical field especially relates to a temperature-uniforming plate subassembly with capillary structure.
Background
As the operation speed of electronic components is increasing, the amount of heat generated by the electronic components is increasing, and in order to effectively solve the problem of high heat generation amount, a Vapor Chamber (Vapor Chamber) with good heat conduction property has been provided for the electronic components for heat conduction.
The known temperature-equalizing plate mainly comprises an upper plate, a lower plate, a capillary structure and a working fluid, wherein the capillary structure is firstly distributed in the upper plate and the lower plate during manufacturing, then the upper plate and the lower plate are combined through a welding process, a containing cavity is formed between the upper plate and the lower plate, then the working fluid is filled in the containing cavity, and finally degassing and sealing are carried out, so that the temperature-equalizing plate is manufactured.
When the temperature-equalizing plate is used, most of the temperature-equalizing plate is fixedly attached to a heat source part through fixing glue, the area of the temperature-equalizing plate is basically determined by the size of the heat source part, the size of the temperature-equalizing plate is limited by the size of the heat source part, but on a chip with large calculated amount, because the chip is made into a smaller size, the attachment surface of the chip and the temperature-equalizing plate is smaller, when the temperature-equalizing plate with a smaller area is attached, the temperature-reducing effect is poor, and the scalding phenomenon is easy to occur.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims at providing a temperature-uniforming plate subassembly with capillary structure aims at solving the technical problem that current temperature-uniforming plate size receives heat source spare size restriction.
In order to achieve the above object, the present invention provides a vapor chamber assembly with a capillary structure, including:
a heat source element;
the temperature-equalizing plate comprises a temperature-equalizing plate body, a heat source part and a heat source part, wherein the temperature-equalizing plate body comprises a free part and a fixed part which is in contact with the heat source part;
the free part and the fixed part are integrally formed and are covered by two sheets, the two sheets comprise a heat dissipation plate and a heat absorption plate on the contact surface of the heat absorption plate and the heat source part, the heat absorption plate and the heat dissipation plate are both provided with inner cavities, the inner cavity of the heat absorption plate is provided with a capillary structure, two ends of the capillary structure are connected to the wall of the inner cavity, the capillary structure is formed by sintering a sintering net and a fine mesh, and the heat dissipation plate is provided with a support column which is abutted against the capillary structure;
the fixing part is provided with a protruding part, and the protruding part is fixedly bonded with the heat source part through fixing glue.
Preferably, the capillary structure is a 3D capillary structure formed by winding a copper mesh, a steel mesh or a titanium alloy mesh.
Preferably, the capillary structure is formed by sintering a sintered copper mesh and a fine mesh together and then annealing; the sintered copper mesh is vertically arranged in the inner cavity of the heat absorbing plate in a length-length staggered mode, and the fine mesh surrounds the sintered copper mesh.
Preferably, the inner cavity of the heat absorbing plate is filled with liquid working medium.
Preferably, the fixing portion, the protrusion portion and the heat source element have the same area, and the protrusion portion is made of copper or copper alloy.
Preferably, the fixing glue is silicone rubber.
Compared with the prior art, the utility model discloses possess following beneficial effect:
the utility model provides a temperature-uniforming plate assembly with capillary structure, including heat source spare and temperature-uniforming plate body, the temperature-uniforming plate body is covered through absorber plate and heating panel and is closed, and the temperature-uniforming plate body divides into the fixed part of fixed laminating with heat source spare and places the free portion outside heat source spare, increases the temperature-uniforming plate body area, has improved the heat dissipation rate greatly; the inside support column that is equipped with the capillary structure and with the capillary structure butt of samming board body, the capillary structure is formed by sintering copper mesh and the sintering of fine mesh, the multilayer copper mesh staggered arrangement of sintering, provide the circulation passageway of liquid between the inside upper and lower surface of heat pipe, and play the effect of supporting samming board body inner space, the fine mesh provides the place of working medium evaporation and makes fixed part and free part intercommunication, make the absorptive heat of fixed part transmit the free part fast, the temperature that makes fixed part and free part is in equal permanent state fast.
Drawings
FIG. 1 is a schematic structural view of a vapor chamber assembly with a capillary structure according to the present invention;
fig. 2 is a schematic view of the internal structure of the vapor chamber body of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings.
The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention, and all other embodiments obtained by those skilled in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
The utility model provides a temperature-uniforming plate subassembly with capillary structure, in an embodiment, refer to fig. 1-2, this temperature-uniforming plate subassembly with capillary structure includes heat source piece 3 and temperature-uniforming plate body 1, temperature-uniforming plate body 1 includes free part A and the fixed part B of contacting with heat source piece 1, free part A and fixed part B are integrated into one piece, close by two thin slice lids and form, two thin slices include heating panel 120 and with heat source piece 3 contact surface's absorber plate 110, absorber plate 110 and heating panel 120 all have inner chamber C, absorber plate 110's inner chamber C is equipped with capillary structure 130, capillary structure 130 both ends are connected to the inner chamber wall, capillary structure 130 is formed by sintering net 131 and the sintering of micropore net 132, heating panel 120 is equipped with the support column 121 with capillary structure 130 butt; the fixing part B is provided with a convex part 2, and the convex part 2 is fixedly bonded with the heat source part 3 through fixing glue. The inner cavity C of the heat absorbing plate 110 is filled with liquid working medium 140.
In this embodiment, the protruding portion 2 of the fixing portion B is made of the same material as the heat absorbing plate 110 and is made of copper, the protruding portion 2 is added to increase the overall stability of the fixing portion B when the fixing portion B is fixed and attached to the heat source member 3, the temperature-uniforming plate body 1 is internally provided with the capillary structure 130 and the supporting pillar 121 abutted to the capillary structure 130, the capillary structure 130 is formed by sintering the sintered copper mesh 131 and the fine mesh 132, the sintered multiple layers of copper meshes are arranged in a staggered manner to provide a circulation channel for the working medium 140 liquid between the upper and lower surfaces inside the temperature-uniforming plate body 1 and play a role of supporting the internal space of the temperature-uniforming plate body 1, the fine mesh 132 provides a place for evaporation of the working medium 140 and enables the fixing portion B to communicate with the free portion a, so that the heat absorbed by the fixing portion B is rapidly transferred to the free portion a, the abutting heat-dissipating plate 120 is enabled to dissipate the heat to the air through the internal capillary structure 130 and the supporting pillar 121, and the temperature of the fixed part B and the free part A is rapidly in a uniform state. The temperature-uniforming plate body 1 is divided into a fixing part B fixedly attached to the heat source piece 3 and a free part A placed outside the heat source piece 3, the size of the free part A can be determined by the external space of the installed heat source piece 3, the area of the temperature-uniforming plate body 1 is increased, and the heat dissipation rate is greatly improved.
Referring to fig. 2, the capillary structure 130 may be a 3D capillary structure formed by winding a steel mesh or a titanium alloy mesh, in addition to a copper mesh. The 3D capillary structure is formed by sintering a sintered copper mesh 131 and a fine mesh 132 together and then annealing; the sintered copper mesh 131 is vertically arranged in the inner cavity C of the heat absorbing plate in a long and short staggered manner, and the fine mesh 132 surrounds the sintered copper mesh 131, so that heat absorbed by the fixing part B is quickly transferred to the free part a.
The fixing portion B, the protruding portion 2 and the heat source element 3 have the same area, and the protruding portion 2 is made of copper or copper alloy.
Referring to fig. 1, in the connection of the protruding portion 2 at the lower end of the fixing portion B and the heat source member 3, the fixing portion B is fixed by a fixing adhesive in a fitting manner, wherein the fixing adhesive is silicon rubber. The silicon rubber has higher thermal stability, good heat insulation, moisture resistance and shock resistance, and particularly has good shock resistance at high frequency, so the silicon rubber is an ideal light packaging material. The bonding stability of the heat source piece 3 and the fixing part B of the temperature-uniforming plate body 1 is improved by using silicon rubber as fixing rubber.
The above embodiments are only used for illustrating the present invention, and not for limiting the present invention, and those skilled in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the present invention, so that all equivalent technical solutions also belong to the scope of the present invention, and the protection scope of the present invention should be defined by the claims.
Claims (6)
1. A vapor chamber assembly having a capillary structure, comprising:
a heat source element;
the temperature-equalizing plate comprises a temperature-equalizing plate body, a heat source part and a heat source part, wherein the temperature-equalizing plate body comprises a free part and a fixed part which is in contact with the heat source part;
the free part and the fixed part are integrally formed and are covered by two sheets, the two sheets comprise a heat dissipation plate and a heat absorption plate on the contact surface of the heat absorption plate and the heat source part, the heat absorption plate and the heat dissipation plate are both provided with inner cavities, the inner cavity of the heat absorption plate is provided with a capillary structure, two ends of the capillary structure are connected to the wall of the inner cavity, the capillary structure is formed by sintering a sintering net and a fine mesh, and the heat dissipation plate is provided with a support column which is abutted against the capillary structure;
the fixing part is provided with a protruding part, and the protruding part is fixedly bonded with the heat source part through fixing glue.
2. The vapor-temperature plate assembly with a capillary structure according to claim 1, wherein the capillary structure is a 3D capillary structure formed by winding a copper mesh, a steel mesh or a titanium alloy mesh.
3. The vapor-chamber plate assembly with a capillary structure of claim 2, wherein the capillary structure is formed by sintering a sintered copper mesh and a fine mesh together and then annealing; the sintered copper mesh is vertically arranged in the inner cavity of the heat absorbing plate in a length-length staggered mode, and the fine mesh surrounds the sintered copper mesh.
4. The vapor chamber plate assembly with a capillary structure as claimed in claim 1, wherein the inner cavity of the heat absorbing plate is filled with a liquid working medium.
5. The vapor chamber assembly with a capillary structure as claimed in claim 1, wherein the fixing portion, the protrusion portion and the heat source member have the same area, and the protrusion portion is made of copper or copper alloy.
6. The vapor chamber assembly with a capillary structure as claimed in claim 1, wherein the fixing glue is silicone rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022423652.XU CN214223846U (en) | 2020-10-28 | 2020-10-28 | Temperature-uniforming plate assembly with capillary structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022423652.XU CN214223846U (en) | 2020-10-28 | 2020-10-28 | Temperature-uniforming plate assembly with capillary structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214223846U true CN214223846U (en) | 2021-09-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022423652.XU Active CN214223846U (en) | 2020-10-28 | 2020-10-28 | Temperature-uniforming plate assembly with capillary structure |
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| Country | Link |
|---|---|
| CN (1) | CN214223846U (en) |
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- 2020-10-28 CN CN202022423652.XU patent/CN214223846U/en active Active
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