CN213426727U - Natural cooling heat conduction assembly for power device - Google Patents

Abstract

The utility model relates to the technical field of heat conducting components, in particular to a natural cooling heat conducting component of a power device, which comprises a heat conducting mechanism, wherein the heat conducting mechanism comprises a heat radiating pad and a graphite radiating fin arranged at the bottom of the heat radiating pad, a plurality of heat radiating fins which are linearly arranged at equal intervals are arranged above the heat radiating pad, a damping mechanism is arranged below the graphite radiating fin, the damping mechanism comprises a damping pad, the upper surface of the damping pad is provided with a plurality of heat conducting silica gel sheets which are arranged in a matrix form, the peripheral edge of the top end of the damping pad is provided with a plurality of springs, one end of each spring is tightly bonded on the upper surface of the damping pad, the other end of each spring is tightly bonded on the lower bottom surface of the graphite radiating fin, the upper surface of each heat conducting silica gel sheet is tightly attached to the lower bottom surface of the graphite radiating fin, in the utility model, the damping mechanism is arranged, the heat conducting mechanism is more stably installed in the power device.

Description

Natural cooling heat conduction assembly for power device

Technical Field

The utility model relates to a heat-conducting component technical field specifically is a power device natural cooling heat-conducting component.

Background

The power device is an electronic component with larger output power, such as an electronic component in an output-stage power amplifier in a large-sound system, which belongs to the power device, and an IGBT in an electromagnetic oven is also the power device. When the power device is used, the temperature generated inside the power device is too high, the natural cooling heat conduction effect is poor, and the vibration force generated when the power device works can influence the heat conduction work during heat conduction.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a power device natural cooling heat-conducting component to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a power device natural cooling heat conduction subassembly, includes heat conduction mechanism, heat conduction mechanism includes the cooling pad and locates the graphite fin of cooling pad bottom, the top of cooling pad is equipped with the heat radiation fins that a plurality of is linear equidistant range, the below of graphite fin is equipped with damper, damper includes the shock pad, the upper surface of shock pad is equipped with the heat conduction silica gel piece that a plurality of is the matrix range, the top edge all around of shock pad is equipped with a plurality of spring, the one end of spring closely bonds the upper surface of shock pad, the other end closely bonds the lower bottom surface of graphite fin, the upper surface of heat conduction silica gel piece is hugged closely the lower bottom surface of graphite fin.

Preferably, the heat dissipation pad and the graphite heat dissipation fin are provided with first through holes at four corners.

Preferably, four corners of the shock pad are provided with second through holes which have the same size as the first through holes and are positioned on the same straight line.

Preferably, the first through hole and the second through hole are both provided with a connecting mechanism.

Preferably, the connecting mechanism comprises top covers arranged at four corners of the top end of the heat dissipation pad, through holes are formed in the bottom ends of the top covers, and internal threads are arranged on hole walls in the through holes.

Preferably, a connecting rod is arranged below the top cover, a bottom cover is integrally formed at one end, far away from the top cover, of the connecting rod, and an external thread in threaded connection with the internal thread is arranged above the connecting rod.

Preferably, the upper surface of the bottom cover is closely attached to the lower bottom surface of the shock pad.

Compared with the prior art, the beneficial effects of the utility model are that: this power device natural cooling heat conduction subassembly is through setting up damper in heat conduction mechanism below, when heat conduction mechanism carries out the heat conduction, damper reduces the vibrational force that the power device during operation produced, make heat conduction mechanism more stable of installation in the power device, and it is fixed through coupling mechanism between heat conduction mechanism and the damper, power device when using has been solved, the temperature that inside produced is too high, the natural cooling heat conduction effect is relatively poor, and when the heat conduction, the vibrational force that the power device during operation produced can influence the problem of going on of heat conduction work.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic structural view of the heat conducting mechanism of the present invention;

FIG. 3 is a schematic structural view of the damping mechanism of the present invention;

fig. 4 is a schematic structural view of the middle top cover of the present invention;

fig. 5 is a schematic structural view of the middle connecting rod of the present invention.

In the figure: 1. a heat conducting mechanism; 11. a heat dissipation pad; 12. a graphite heat sink; 13. a first perforation; 2. a damping mechanism; 21. a shock pad; 22. a heat-conducting silica gel sheet; 23. a second perforation; 24. a spring; 3. heat dissipation fins; 4. a connecting mechanism; 41. a top cover; 411. a through hole; 412. an internal thread; 42. a connecting rod; 421. an external thread; 422. a bottom cover.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1-5, the present invention provides a technical solution:

the utility model provides a power device natural cooling heat conduction assembly, including heat conduction mechanism 1, heat conduction mechanism 1 includes cooling pad 11 and locates the graphite fin 12 of 11 bottoms of cooling pad, the top of cooling pad 11 is equipped with the heat radiation fins 3 that a plurality of is linear equidistant range, the below of graphite fin 12 is equipped with damper 2, damper 2 includes shock pad 21, shock pad 21's upper surface is equipped with the heat conduction silica gel piece 22 that a plurality of is the matrix range, the top edge all around of shock pad 21 is equipped with a plurality of spring 24, the one end of spring 24 closely bonds at the upper surface of shock pad 21, the other end closely bonds at the lower bottom surface of graphite fin 12, heat conduction silica gel piece 22's upper surface is hugged closely at the lower bottom surface of graphite fin 12.

In this embodiment, the first through holes 13 are disposed at four corners of the heat dissipation pad 11 and the graphite heat dissipation plate 12, so that the whole device is more complete, and the connection rod 42 can conveniently pass through the first through holes 13.

Furthermore, four corners of the shock pad 21 are all provided with second through holes 23 which have the same size as the first through holes 13 and are located on the same straight line, so that the top ends of the connecting rods 42 can be fixed to the top cover 41 on the heat dissipation pad 11 through the second through holes 13.

Still further, all be equipped with coupling mechanism 4 in first perforation 13 and the second perforation 23, be convenient for with fixed between heat conduction mechanism 1 and the damper 2, when carrying out the cooling heat conduction to power device, can wholly carry out the shock attenuation to the device, improved the stability of device.

Specifically, the connecting mechanism 4 includes the top cover 41 disposed at four corners of the top end of the heat dissipation pad 11, a through hole 411 is disposed inside the bottom end of the top cover 41, and an internal thread 412 is disposed on a hole wall of the through hole 411, so as to fix the top cover 41 to the connecting rod 42.

Further, the connecting rod 42 is arranged below the top cover 41, the bottom cover 422 is integrally formed at one end, away from the top cover 41, of the connecting rod 42, the external thread 412 in threaded connection with the internal thread 412 is arranged above the connecting rod 42, the whole device is enabled to be more reasonable, and the internal thread 412 is in threaded connection with the external thread 412, so that the top cover 41 and the connecting rod 42 are fixed conveniently, and the heat conducting mechanism 1 and the damping mechanism 2 are fixed conveniently.

In addition, the upper surface of the bottom cover 422 is closely attached to the lower bottom surface of the shock pad 21, so that the shock pad 21 is prevented from sliding on the connecting rod 42, and the shock absorption effect is prevented from being affected.

When the natural cooling heat-conducting component of the power device of this embodiment is used, the heat-dissipating pad 11 is fixed above the graphite heat-dissipating fin 12, the heat-conducting silica gel sheet 22 is adhered to the shock-absorbing pad 21, the top end of the spring on the shock-absorbing pad 21 is fixed on the graphite heat-dissipating fin 12, after the first through hole 13 and the second through hole 23 are located on the same straight line, the top end of the connecting rod 42 is inserted into the first through hole 13 on the heat-dissipating pad 11 and the graphite heat-dissipating fin 12 from the second through hole 23 on the shock-absorbing pad 21, the bottom cover 422 is tightly attached to the bottom end of the shock-absorbing pad 21, and then the top cover 41 is rotated, since the internal thread 412 in the top cover 41 is in threaded connection with the external thread 421 on the connecting rod 42, the top cover 41 is fixed on the connecting rod 42 when being rotated, the heat-dissipating pad 11, the graphite heat-dissipating fin 12 and the shock-, the heat-conducting silica gel sheet 22 conducts heat to the inside of the shock pad 21, and heat in the shock pad 21 enters the graphite radiating fins 12 through the heat-conducting silica gel sheet 22 to be radiated.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (7)

1. A power device natural cooling heat conduction assembly comprises a heat conduction mechanism (1), and is characterized in that: the heat conducting mechanism (1) comprises a heat radiating pad (11) and a graphite heat radiating fin (12) arranged at the bottom of the heat radiating pad (11), a plurality of radiating fins (3) which are arranged linearly at equal intervals are arranged above the radiating pad (11), a damping mechanism (2) is arranged below the graphite radiating fin (12), the damping mechanism (2) comprises a damping pad (21), the upper surface of the shock pad (21) is provided with a plurality of heat-conducting silica gel sheets (22) arranged in a matrix form, a plurality of springs (24) are arranged at the peripheral edge of the top end of the shock pad (21), one end of the spring (24) is tightly adhered to the upper surface of the shock pad (21), the other end is tightly adhered to the lower bottom surface of the graphite radiating fin (12), the upper surface of the heat-conducting silica gel sheet (22) is tightly attached to the lower bottom surface of the graphite radiating sheet (12).

2. The power device free-cooling heat conducting assembly according to claim 1, wherein: first through holes (13) are formed in the four corners of the heat dissipation pad (11) and the graphite heat dissipation fins (12).

3. The power device free-cooling heat transfer assembly of claim 2, wherein: four corners of the shock pad (21) are provided with second through holes (23) which have the same size as the first through holes (13) and are positioned on the same straight line.

4. The power device free-cooling heat transfer assembly of claim 3, wherein: and connecting mechanisms (4) are arranged in the first through hole (13) and the second through hole (23).

5. The power device free-cooling heat conducting assembly according to claim 4, wherein: coupling mechanism (4) are including locating top cap (41) at four turnings in cooling pad (11) top, the inside through-hole (411) that is equipped with in bottom of top cap (41), be equipped with on the pore wall in through-hole (411) internal thread (412).

6. The power device free-cooling heat transfer assembly of claim 5, wherein: the connecting rod (42) is arranged below the top cover (41), a bottom cover (422) is integrally formed at one end, away from the top cover (41), of the connecting rod (42), and an external thread (421) in threaded connection with the internal thread (412) is arranged above the connecting rod (42).

7. The power device free-cooling heat transfer assembly of claim 6, wherein: the upper surface of the bottom cover (422) is closely attached to the lower bottom surface of the shock pad (21).

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