CN214172182U - High-power LED light source radiator - Google Patents
High-power LED light source radiator Download PDFInfo
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- CN214172182U CN214172182U CN202023060383.1U CN202023060383U CN214172182U CN 214172182 U CN214172182 U CN 214172182U CN 202023060383 U CN202023060383 U CN 202023060383U CN 214172182 U CN214172182 U CN 214172182U
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a high power LED light source radiator relates to heat abstractor technical field, include: the heat conduction structure comprises a fin mounting plate and a light source mounting plate, wherein the fin mounting plate is a curved plate, and two end faces of the fin mounting plate are attached to one plate surface of the light source mounting plate; the plurality of radiating fins are arranged on the plate surface of the fin mounting plate at intervals; one end of the phase-change heat pipe is a heat absorption end and is attached to the light source mounting plate; the other end of the phase-change heat pipe is a heat dissipation end, is attached to the fin mounting plate and is arranged adjacent to the heat dissipation fins; and a fluid phase-change working medium is sealed in the inner cavity of the phase-change heat pipe. The utility model discloses can effectively reduce the operating temperature of LED light source, prolong the life of LED light source.
Description
Technical Field
The utility model relates to a heat abstractor technical field especially relates to a high power LED light source radiator.
Background
An led (light Emitting diode) light source has the advantages of small volume, long service life, high efficiency, and the like, is a mainstream development technology in the field of illumination, and can be applied to various optical devices and instruments. One of the biggest technical difficulties of the current LED light source is the heat dissipation problem, and the heat and the heating density generated by the LED light source (especially a high-power LED light source) during lighting are very high, so that the premature senility caused by long-time high-temperature operation can be prevented only by fast heat dissipation. Because the LED light source itself has no radiation heat dissipation function, it is necessary to provide a heat sink with high heat dissipation efficiency to dissipate heat generated during lighting of the LED light source, reduce the operating temperature of the LED light source, and prolong the service life.
SUMMERY OF THE UTILITY MODEL
The utility model provides a high power LED light source radiator can high-efficient heat dissipation, prolongs the life of LED light source, the radiator includes: the heat conducting structure comprises a fin mounting plate and a light source mounting plate; the plurality of radiating fins are arranged on the plate surface of the fin mounting plate at intervals; one end of the phase-change heat pipe is a heat absorption end and is attached to the light source mounting plate; the other end of the phase-change heat pipe is a heat dissipation end, is attached to the fin mounting plate and is arranged adjacent to the heat dissipation fins; and a fluid phase-change working medium is sealed in the inner cavity of the phase-change heat pipe.
In the embodiment of the disclosure, the heat absorption ends of the plurality of phase change heat pipes are adjacently arranged on the light source mounting plate.
In the embodiment of the disclosure, the outer tube wall of the heat absorption end is in contact with the LED light source
In the embodiment of the present disclosure, the phase change heat pipe is a U-shaped metal pipe, and the two cantilevers of the U-shaped metal pipe are the heat absorption end and the heat dissipation end, respectively.
In the embodiment of the disclosure, a first mounting groove is formed in a side plate surface of the light source mounting plate facing the LED module, and the heat absorption end is embedded in the first mounting groove; and/or, a second mounting groove is formed in the fin mounting plate, and the heat dissipation end is embedded in the second mounting groove.
In the embodiment of the present disclosure, the outer tube wall of the heat absorption end on the side contacting with the LED light source is a flat plate structure.
In the embodiment of the disclosure, the outer surface of the heat dissipation fin is provided with an anticorrosive layer.
In the embodiment of the disclosure, the phase change heat pipe is a metal copper pipe or a metal pipe with a copper surface layer.
In the embodiment of the present disclosure, the heat conducting structure and the heat dissipating fins are aluminum alloy plates.
In the embodiment of the present disclosure, the fin mounting plate and the heat dissipating fin are integrally formed.
The utility model provides a high power LED light source radiator has following technological effect:
the utility model discloses utilize heat conduction that heat absorption end of heat conduction structure and phase transition heat pipe produced the LED light source to phase transition heat pipe's heat dissipation end and radiating fin, through fluid phase transition working medium and radiating fin realize with the quick heat exchange of air, effectively reduce the operating temperature of LED light source, prolong the life of LED light source.
Drawings
In order to more clearly illustrate the technical solutions and advantages of the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive work.
FIG. 1: the embodiment of the utility model provides a front view of high power LED light source radiator;
FIG. 2: the embodiment of the utility model provides a side view of high power LED light source radiator;
FIG. 3: the embodiment of the utility model provides a bottom view of high power LED light source radiator;
FIG. 4: the embodiment of the utility model provides a side view of the high power LED light source radiator with LED light source;
FIG. 5: the embodiment of the utility model provides a side view of the phase change heat pipe of high power LED light source radiator;
FIG. 6: the embodiment of the utility model provides a bottom view of another high power LED light source radiator.
In the figure: 100-a heat conduction structure, 110-a light source mounting plate, 111-a first mounting groove, 120-a fin mounting plate, 121-an arc surface mounting part, 122-a through hole, 123-a second mounting groove, 200-a phase change heat pipe, 210-a heat absorption end, 220-a heat dissipation end, 230-a bending part, 300-a heat dissipation fin, 310-a hoisting hole and 400-an LED light source.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, apparatus, product, or device that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, product, or device.
The embodiments are described below with reference to the drawings, which do not limit the scope of the invention described in the claims.
Referring to fig. 1 to 6, an embodiment of the present disclosure provides a high power LED light source heat sink, which includes: a heat conducting structure 100 including a fin mounting plate 120 and a light source mounting plate 110; a plurality of heat dissipating fins 300 arranged on the plate surface of the fin mounting plate 120 at intervals; a phase-change heat pipe 200, one end of the phase-change heat pipe 200 being a heat absorption end 210, and being attached to the light source mounting plate 110; the other end of the phase-change heat pipe 200 is a heat dissipation end 220, and is attached to the fin mounting plate 120 and arranged adjacent to the heat dissipation fin 300; the inner cavity of the phase-change heat pipe 200 is sealed with a fluid phase-change working medium.
The heat radiator of the present disclosure utilizes the heat conducting structure 100 and the heat absorbing end 210 of the phase change heat pipe 200 to conduct the heat generated by the LED light source 400 to the heat dissipating end 220 of the phase change heat pipe 200 and the heat dissipating fins 300, and realizes the rapid heat exchange with the air through the fluid phase change working medium and the heat dissipating fins 300, thereby effectively reducing the working temperature of the LED light source 400 and prolonging the service life of the LED light source.
In practical applications, the phase-change heat pipe 200 and the heat conducting structure 100 may be a split structure, and the phase-change heat pipe 200 may be connected to the heat conducting structure 100 after being formed and embedded in the heat conducting structure 100.
In some embodiments, referring to fig. 4, the fin mounting plate 120 is fixedly connected to the light source mounting plate 110, and two end surfaces of the fin mounting plate 120 are disposed on one plate surface of the light source mounting plate 110 in an abutting manner. In one embodiment, the fin mounting plate 120 and the light source mounting plate 110 are integrally formed; in another embodiment, the fin mounting plate 120 and the light source mounting plate 110 are fixedly connected by bonding, welding, or the like.
In other embodiments, referring to fig. 6, the fin mounting plate 120 and the light source mounting plate 110 are a split structure; after the phase-change heat pipe 200 is installed on the light source installation plate 110 and the fin installation plate 120, the relative positions of the light source installation plate 110 and the fin installation plate 120 are fixed.
In some embodiments, the fin mounting plate 120 may be a curved plate, see fig. 4 and 6.
Further, in some embodiments, the fin mounting plate 120 may be provided with an arc-shaped mounting portion 121, and the heat dissipation fins 300 are arranged on an outer arc surface of the arc-shaped mounting portion 121 at uniform intervals along the circumferential direction of the arc-shaped mounting portion 121. Thus, the installation area of the fin installation plate 120 is increased through the arc design, and then the sufficient amount of the heat dissipation fins 300 can be accommodated; and the uniformity of heat conduction is improved and the heat radiation speed is accelerated by arranging the heat radiation fins 300 at uniform intervals.
In some embodiments, the connection manner of the phase-change heat pipe 200 and the heat conducting structure 100 includes, but is not limited to, welding, clamping, or bonding.
In some embodiments, the phase-change heat pipe 200 has a capillary structure inside.
In some embodiments, the light source mounting board 110 and the fin mounting board 120 are a unitary structure.
In some embodiments, the heat dissipation fins 300 may be provided with corrugations to increase the heat dissipation area and improve the heat transfer coefficient.
Based on some or all of the above embodiments, in the embodiment of the present disclosure, the outer tube wall of the heat absorbing end 210 is disposed in contact with the LED light source 400, please refer to fig. 3. Therefore, the phase-change heat pipe 200 is directly contacted with the LED light source 400, so that the thermal resistance between the LED light source 400 and the phase-change heat pipe 200 is reduced, and the heat conduction efficiency is improved. Specifically, the LED light source 400 may be attached to the outer wall of the heat absorbing end 210.
In some embodiments, the region where the heat generated by the LED light source 400 during operation is relatively high is a heat source region of the LED light source 400, the heat source region is disposed in contact with the outer tube wall of the heat sink 210, and the heat source region may be a region where the LED chip is located.
Based on some or all of the above embodiments, in the embodiment of the present disclosure, the heat absorbing ends 210 of a plurality of phase change heat pipes 200 are adjacently arranged on the light source mounting board 110. Therefore, the heat absorption ends 210 of the phase-change heat pipes 200 are densely arranged, so that the contact area between the LED light source and the phase-change heat pipes 200 is increased, and the heat conduction efficiency is improved.
Based on some or all of the above embodiments, in the embodiment of the present disclosure, the phase-change heat pipe 200 is a U-shaped metal pipe, and two cantilevers of the U-shaped metal pipe are the heat absorption end 210 and the heat dissipation end 220, respectively, please refer to fig. 5. Therefore, the size of the radiator can be reduced, and the installation and the application are convenient.
In some embodiments, the U-shaped metal tube is formed by bending a straight metal tube.
Based on some or all of the above embodiments, in the embodiment of the present disclosure, a first installation groove 111 is formed on a side surface of the light source installation board 110 facing the LED light source 400, and the heat absorption end 210 is embedded in the first installation groove 111, please refer to fig. 4.
In one embodiment, the heat absorbing end 210 is tightly fitted to the first mounting groove 111.
In other embodiments, the first mounting groove 111 may be interference-fitted with the heat sink end 210. Thus, the contact area between the phase-change heat pipe 200 and the heat conducting structure 100 is increased, and the heat dissipation efficiency is further improved. In one embodiment, a plurality of heat conducting fins may be alternatively disposed on a wall of the heat absorbing end 210 and a wall of the first mounting groove 111, and another heat conducting fin is disposed with a plurality of grooves matching with the heat conducting fins, when the heat absorbing end 210 is embedded in the first mounting groove 111, the heat conducting fins and the grooves cooperate to realize an interference fit between the heat absorbing end 210 and the first mounting groove 111.
Based on some or all of the above embodiments, in the embodiment of the present disclosure, the fin mounting plate 120 is provided with a second mounting groove 123, and the heat dissipation end 220 is embedded in the second mounting groove 123.
In one embodiment, the heat dissipating end 220 is tightly fitted to the second mounting groove 123.
In some embodiments, the second mounting groove 123 is opened in the plate surface of the fin mounting plate 120, and the heat dissipating end 220 is embedded in the second mounting groove 123 and partially exposed on the plate surface.
In other embodiments, the second mounting groove 123 is opened in the plate of the fin mounting plate 120, and the portion of the heat dissipating end 220 embedded in the second mounting groove 123 is embedded in the fin mounting plate 120. As such, the contact area of the heat dissipation end 220 with the fin mounting plate 120 is increased.
In some embodiments, the second mounting groove 123 may have an interference fit with the heat dissipating end 220. Thus, the contact area between the phase-change heat pipe 200 and the heat conducting structure 100 is increased, and the heat dissipation efficiency is further improved. In an embodiment, the tube wall of the heat dissipating end 220 and the wall surface of the second mounting groove 123 can be alternatively provided with a plurality of heat conducting fins, and the other one is provided with a plurality of grooves matched with the heat conducting fins, when the heat dissipating end 220 is embedded in the first mounting groove 111, the heat conducting fins are matched with the grooves, so that the interference fit between the heat dissipating end 220 and the second mounting groove 123 is realized.
In some embodiments, referring to fig. 4, at least one side of the light source mounting board 110 is a plane to be attached to the LED light source, the fin mounting board 120 is a curved board, two opposite end faces of the fin mounting board 120 are attached to one side of the light source mounting board 110 opposite to the LED light source, the heat absorbing ends 210 are closely arranged on the light source mounting board 110, and the heat dissipating ends 220 are arranged on the fin mounting board 120 at a larger interval. Thus, the heat dissipating ends 220 uniformly conduct heat to the heat conducting structure 100 and the heat dissipating fins 300, and the heat dissipating performance is optimized.
Based on some or all of the above embodiments, in the embodiment of the present disclosure, the outer wall of the heat absorbing end 210 on the side contacting with the LED light source 400 is a flat plate structure, please refer to fig. 2 to 4, and can be obtained by flattening a metal tube. Therefore, the contact area between the LED light source 400 and the heat absorption end 210 is increased, the utilization rate of the phase-change heat pipe 200 is improved, and heat conduction is facilitated and the vaporization speed of the phase-change working medium is accelerated.
Based on some or all of the above embodiments, in the embodiment of the present disclosure, the outer surface of the heat dissipation fin 300 is provided with an anti-corrosion layer, and the material of the anti-corrosion layer may be the same as or different from that of the heat dissipation fin 300, so as to improve the corrosion resistance of the heat dissipation fin. In one embodiment, the corrosion protection layer may be a nickel corrosion protection layer.
In some embodiments, the outer surface of the heat conducting structure 100 is also provided with an anti-corrosion layer, and the material of the anti-corrosion layer may be the same as or different from that of the heat conducting structure 100. In one embodiment, the corrosion protection layer may be a nickel corrosion protection layer.
Based on some or all of the above embodiments, in the embodiment of the present disclosure, the phase-change heat pipe 200 is a metal copper pipe or a metal pipe with a copper surface layer. Thus, the heat conduction efficiency of the phase-change heat pipe 200 is improved.
In some embodiments, the phase-change heat pipe 200 is a copper metal pipe, and the copper metal pipe is formed by sintering copper powder, and the copper powder forms a capillary structure inside the copper metal pipe when being sintered.
Based on some or all of the above embodiments, in the embodiment of the present disclosure, the heat conducting structure 100 and the heat dissipating fins 300 are aluminum alloy plates.
Based on some or all of the above embodiments, in the embodiment of the present disclosure, the fin mounting plate 120 and the heat dissipation fin 300 are integrally formed, and the processing process is simple.
Based on some or all of the above embodiments, in the embodiment of the present disclosure, the light source mounting board 110 is further provided with a through hole 122, and the power line of the LED light source 400 can pass through the through hole 122 to connect to the driving power source.
In some embodiments, a portion of the heat sink fins 300 is provided with a mounting hole for connecting to a mounting structure.
In some embodiments, the entire exterior surface of the heat sink is subjected to an electrophoretic treatment to improve corrosion resistance.
This neotype radiator has higher radiating efficiency, can effectively reduce the operating temperature of LED light source, prolongs the life of LED light source, and processing technology is simple, and the cost of manufacture is low.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments.
All of the features described in the present application (including the features described in the different embodiments) may be combined arbitrarily and combined as appropriate to form a new technical solution within the scope of the present application.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (10)
1. A high power LED light source heat sink, the heat sink comprising:
a thermally conductive structure (100) comprising a fin mounting plate (120) and a light source mounting plate (110);
the heat dissipation fins (300) are arranged on the plate surface of the fin mounting plate (120) at intervals;
one end of the phase-change heat pipe (200) is a heat absorption end (210) and is attached to the light source mounting plate (110); the other end of the phase-change heat pipe (200) is a heat dissipation end (220), is attached to the fin mounting plate (120), and is arranged adjacent to the heat dissipation fin (300); and a fluid phase-change working medium is sealed in the inner cavity of the phase-change heat pipe (200).
2. The heat sink according to claim 1, wherein the heat absorbing ends (210) of a plurality of the phase-change heat pipes (200) are adjacently arranged on the light source mounting board (110).
3. A heat sink according to claim 1, wherein the outer tube wall of the heat sink end (210) is arranged in contact with the LED light source (400).
4. The heat sink according to claim 1, wherein the phase-change heat pipe (200) is a U-shaped metal pipe, and two cantilevers of the U-shaped metal pipe are the heat absorption end (210) and the heat dissipation end (220), respectively.
5. The heat sink according to any one of claims 1-4, wherein a first mounting groove (111) is formed on a side surface of the light source mounting board (110) facing the LED light source (400), and the heat absorbing end (210) is embedded in the first mounting groove (111); and/or the presence of a gas in the gas,
be provided with second mounting groove (123) on fin mounting panel (120), heat dissipation end (220) are inlayed and are established in second mounting groove (123).
6. A heat sink according to claim 3, wherein the outer tube wall of the heat sink end (210) on the side contacting the LED light source (400) is a flat plate structure.
7. The heat sink as recited in any one of claims 1 to 4 and 6, wherein the outer surface of the heat radiating fin (300) is provided with an anti-corrosion layer.
8. The heat sink according to any one of claims 1-4 and 6, wherein the phase-change heat pipe (200) is a metal copper pipe or a metal pipe with a copper surface layer.
9. The heat sink according to any one of claims 1-4 and 6, wherein the heat conducting structure (100) and the heat dissipating fins (300) are both aluminum alloy plates.
10. The heat sink according to any one of claims 1-4 and 6, wherein the fin mounting plate (120) and the heat radiating fins (300) are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023060383.1U CN214172182U (en) | 2020-12-17 | 2020-12-17 | High-power LED light source radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023060383.1U CN214172182U (en) | 2020-12-17 | 2020-12-17 | High-power LED light source radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214172182U true CN214172182U (en) | 2021-09-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023060383.1U Active CN214172182U (en) | 2020-12-17 | 2020-12-17 | High-power LED light source radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214172182U (en) |
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2020
- 2020-12-17 CN CN202023060383.1U patent/CN214172182U/en active Active
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