CN214122638U

CN214122638U - Conductive adhesive structure

Info

Publication number: CN214122638U
Application number: CN202022989645.6U
Authority: CN
Inventors: 张炳忠; 刘新
Original assignee: Shenzhen Runwo Automation Engineering Co ltd
Current assignee: Shenzhen Runwo Automation Engineering Co ltd
Priority date: 2020-12-14
Filing date: 2020-12-14
Publication date: 2021-09-03
Anticipated expiration: 2030-12-14

Abstract

The utility model discloses a conductive adhesive structure, including the bonding base member, the bonding base member runs through the slope through-hole that has a plurality of parallels, and a plurality of slope through-holes are parallel to each other, and the contained angle of slope through-hole and bonding base member lower surface is 0 degree ~ 90 degrees, is equipped with the conductor in the slope through-hole, and the outer parcel of conductor has the insulating layer, insulating layer and slope through-hole inner wall fixed connection. Its advantage is that the conducting resin structure presss from both sides tightly to paste between liquid crystal display and circuit board, and the one end and the liquid crystal display of conductor are connected, and the other end is connected with the circuit board, when ambient temperature changes, when solving cold and hot shrink, arouse contact failure's problem.

Description

Conductive adhesive structure

Technical Field

The utility model relates to a conductive adhesive structure.

Background

As shown in fig. 1 to 3, the conductive adhesive structure 10 is pressed and bonded between the liquid crystal display 40 and the circuit board 30, the conductive adhesive structure 10 includes the flexible glue 11 and locates the metal conductor 12 in the flexible glue 11, the metal conductor 12 is perpendicular to the flexible glue 11, the circuit board 30 forms an electric connection with the liquid crystal display 40 through the metal conductor 12, when the liquid crystal display 40 and the circuit board 30 are pressed, the flexible glue 11 can deform, the metal conductor 12 can be compressed, after the pressure is removed, because the deformation amount of the flexible glue 11 is inconsistent with the deformation amount of the metal conductor 12, when the flexible glue 11 recovers the deformation, the metal conductor 12 can not completely recover the deformation, there is a gap 13 between the metal conductor 12 and the circuit board 30 or the liquid crystal display 40, resulting in poor contact between the circuit board 30 and the liquid crystal display 40.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects of the prior art and providing a conductive adhesive structure.

The utility model discloses a technical scheme:

the utility model provides a conductive adhesive structure, includes the bonding base member, the bonding base member runs through the slope through-hole that has a plurality of parallels, and a plurality of slope through-holes are parallel to each other, the contained angle of slope through-hole and bonding base member lower surface is 0 degree ~ 90 degrees, be equipped with the conductor in the slope through-hole, the outer parcel of conductor has the insulating layer, insulating layer and slope through-hole inner wall fixed connection.

In a preferable scheme, the bonding matrix is a block structure, and the upper surface and the lower surface of the bonding matrix are respectively horizontal planes.

One preferable scheme is that the thickness of the bonding matrix is 0.01-015 mm.

One preferred scheme is that the included angle between the conductor and the horizontal plane is 30-60 degrees.

In a preferred embodiment, the conductor is a conductive wire and has a diameter of 0.005-0.01 mm.

One preferred solution is that the two ends of the conductor are provided with heads for increasing the contact area.

One preferred arrangement is that the head is an arcuate protuberance.

One preferred scheme is that the insulating layer is made of PU or silica gel material.

One preferable scheme is that the bonding matrix is a sticky soft glue.

In a preferred embodiment, the inclined through holes are arranged in an array.

Synthesize above-mentioned technical scheme, the beneficial effects of the utility model: the conducting resin structure presss from both sides tightly to be pasted between liquid crystal display and circuit board, the one end and the liquid crystal display of conductor are connected, the other end is connected with the circuit board, when ambient temperature changes, when ambient temperature risees, the meeting of bonding base member and conductor takes place the inflation, deformation can take place respectively for bonding base member and conductor, because the contained angle between conductor and the bonding base member is 0 degree ~ 90 degrees, the bonding base member produces the effect of a restoring force to the conductor, the bonding base member can make the conductor take place deformation with the bonding base member is synchronous, consequently can not influence the contact between conductor and liquid crystal display and the circuit board. When the outside temperature is reduced, the bonding matrix and the conductor can shrink; the problem of poor contact caused by cold and hot shrinkage is solved.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following preferred embodiments are described in detail with reference to the accompanying drawings.

Drawings

FIG. 1 is a cross-sectional view of a prior art conductive paste structure;

FIG. 2 is a cross-sectional view of a conventional conductive paste structure attached between a liquid crystal display panel and a circuit board;

fig. 3 is a cross-sectional view of a prior art conductive paste structure compressed between a liquid crystal display panel and a circuit board;

fig. 4 is a perspective view of the present invention;

fig. 5 is a first cross-sectional view of the present invention;

fig. 6 is a second cross-sectional view of the present invention;

FIG. 7 is a cross-sectional view of the bonding matrix of the present invention;

fig. 8 is a cross-sectional view of the present invention compressed between a liquid crystal display and a circuit board.

Detailed Description

For the purpose of illustrating the spirit and purposes of the present invention, the present invention will be further described with reference to the accompanying drawings and specific embodiments.

As shown in fig. 4 to 8, the conductive adhesive structure includes an adhesive base 20, the adhesive base 20 has a plurality of parallel inclined through holes 21 penetrating therethrough, the inclined through holes 21 are parallel to each other, an included angle between the inclined through holes 21 and the lower surface of the adhesive base 20 is 0 to 90 degrees, a conductor 22 is disposed in the inclined through hole 21, an insulating layer 23 is wrapped outside the conductor 22, and the insulating layer 23 is fixedly connected to the inner wall of the inclined through hole 21.

As shown in fig. 4 to 8, the conductive adhesive structure is tightly adhered between the liquid crystal display 50 and the circuit board 60, one end of the conductor 22 is connected with the liquid crystal display 50, and the other end is connected with the circuit board 60, when the external temperature changes, for example, when the external temperature rises, the bonding substrate 20 and the conductor 22 expand, the bonding substrate 20 and the conductor 22 respectively deform, because the included angle between the conductor 22 and the bonding substrate 20 is 0 to 90 degrees, the bonding substrate 20 generates a restoring force effect on the conductor 22, the bonding substrate 20 causes the conductor 22 and the bonding substrate 20 to synchronously deform, and the arrow in fig. 8 indicates the acting force generated by the bonding substrate 20 on the conductor 22, so that the contact between the conductor 22 and the liquid crystal display 50 and the circuit board 60 is not affected. When the outside temperature is lowered, shrinkage of the adhesive base 20 and the conductor 22 occurs. The bonding substrate 20 and the conductor 22 are deformed respectively, and because the included angle between the conductor 22 and the bonding substrate 20 is 0-90 degrees, the bonding substrate 20 exerts a restoring force on the conductor 22, and the bonding substrate 20 causes the conductor 22 and the bonding substrate 20 to be deformed synchronously, so that the contact between the conductor 22 and the liquid crystal display screen 50 and the circuit board 60 is not influenced.

As shown in fig. 4 to 8, when an external force presses the liquid crystal display panel 50 and the circuit board 60, the liquid crystal display panel 50 and the circuit board 60 respectively press the bonding substrate 20 and the conductor 22, the pressing bonding substrate 20 and the conductor 22 are respectively deformed, and when the external force is removed, the bonding substrate 20 and the conductor 22 are respectively restored to their original shapes, and meanwhile, since the included angle between the conductor 22 and the bonding substrate 20 is 0 to 90 degrees, the bonding substrate 20 exerts a restoring force on the conductor 22 to urge the conductor 22 to be restored to its original shape, so that one end of the conductor 22 can be in good contact with the liquid crystal display panel 50, and the other end of the conductor 22 can be in good contact with the circuit board 60. The conductor 22 does not have a contact failure or the like with the liquid crystal display panel 50 and the circuit board 60. Meanwhile, since the included angle between the conductor 22 and the bonding substrate 20 is 0 to 90 degrees, the area of one end surface and the other end surface of the conductor 22 is large, and the contact area with the liquid crystal display screen 50 and the circuit board 60 is increased.

As shown in fig. 4 to 8, the bonding base 20 has a block structure, and the upper surface and the lower surface of the bonding base 20 are horizontal surfaces, respectively. The upper surface of the adhesive substrate 20 is fixedly adhered to the liquid crystal display panel 50, and the lower surface of the adhesive substrate 20 is fixedly adhered to the circuit board 60. When the circuit board 60 or the liquid crystal display panel 50 applies pressure to the adhesive substrate 20, the adhesive substrate 20 is deformed. Because the included angle between the conductor 22 and the bonding substrate 20 is 0-90 degrees, the cross-sectional area of one end surface and the other end surface of the conductor 22 is larger than that of the conductor 22, and the contact area between the conductor 22 and the circuit board 60 is increased.

As shown in fig. 4 to 8, the thickness of the adhesive base 20 is 0.01 to 015 mm. The thickness of the adhesive base 20 may be set as desired.

As shown in fig. 4 to 8, the angle between the conductor 22 and the horizontal plane is preferably 30 to 60 degrees. The angle between the conductor 22 and the horizontal plane is 30 to 60 degrees, the restoring force of the adhesive base 20 to the conductor 22 is relatively large, the conductor 22 is more easily restored to its original shape, and the cross-sectional area of one end surface and the other end surface of the conductor 22 is relatively large compared to the cross-sectional area of the conductor 22.

As shown in fig. 4 to 8, the conductor 22 is a conductive wire and has a diameter of 0.005-0.01 mm. The diameter of the conductive wire is set as desired.

As shown in fig. 4 to 8, both ends of the conductor 22 are provided with heads for increasing a contact area. The head of one end of the conductor 22 contacts the liquid crystal display 50 and increases the contact area of the conductor 22 with the liquid crystal display 50, and the other end contacts the circuit board 60 and increases the contact area of the conductor 22 with the circuit board 60.

As shown in fig. 4 to 8, the head is an arc-shaped bulge. The arc-shaped bulge increases the contact area of the conductor 22 with the liquid crystal display panel 50 and increases the contact area of the conductor 22 with the circuit board 60.

As shown in fig. 4 to 8, the insulating layer 23 is made of PU or silicone material. The insulating layer 23 plays an insulating role.

As shown in fig. 4 to 8, the adhesive matrix 20 is a soft adhesive having viscosity. The adhesive soft glue has certain elasticity, and can prevent the liquid crystal display screen 50 and the circuit board 60 from being extruded.

As shown in fig. 4 to 8, the inclined through holes 21 are arranged in an array. The number of the inclined through holes 21 may be set as desired.

The above is a detailed implementation manner of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations are also considered as the protection scope of the present invention.

Claims

1. The utility model provides a conductive adhesive structure, its characterized in that, includes the bonding base member, the bonding base member runs through there are a plurality of slope through-holes, and a plurality of slope through-holes are parallel to each other, the contained angle of slope through-hole and bonding base member lower surface is 0 degree ~ 90 degrees, be equipped with the conductor in the slope through-hole, the conductor wraps up outward has the insulating layer, insulating layer and slope through-hole inner wall fixed connection.

2. The conductive paste structure according to claim 1, wherein the bonding substrate is a block structure, and the upper surface and the lower surface of the bonding substrate are horizontal surfaces, respectively.

3. The conductive paste structure according to claim 1, wherein the thickness of the adhesive base is 0.01 to 015 mm.

4. The conductive paste structure of claim 1 wherein the conductor is at an angle of 30 to 60 degrees from horizontal.

5. The conductive paste structure according to claim 1, wherein the conductor is a conductive wire having a diameter of 0.005 to 0.01 mm.

6. The conductive paste structure according to claim 1, wherein the conductor is provided at both ends with heads for increasing a contact area.

7. The conductive paste structure of claim 6 wherein said head is an arcuate protuberance.

8. The conductive paste structure of claim 1 wherein said insulating layer is made of PU or silicone material.

9. The conductive paste structure of claim 1 wherein the adhesive matrix is a soft adhesive with adhesive properties.

10. The conductive paste structure of claim 1 wherein said slanted via holes are arranged in an array.