CN204833208U - Touch -control product and electrical connector thereof - Google Patents

Touch -control product and electrical connector thereof Download PDF

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Publication number
CN204833208U
CN204833208U CN201520554553.1U CN201520554553U CN204833208U CN 204833208 U CN204833208 U CN 204833208U CN 201520554553 U CN201520554553 U CN 201520554553U CN 204833208 U CN204833208 U CN 204833208U
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CN
China
Prior art keywords
touch
dielectric base
conductive bumps
pin
arrangements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520554553.1U
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Chinese (zh)
Inventor
程小勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanchang OFilm Tech Co Ltd
Suzhou OFilm Tech Co Ltd
OFilm Group Co Ltd
Original Assignee
Nanchang OFilm Tech Co Ltd
Suzhou OFilm Tech Co Ltd
Shenzhen OFilm Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanchang OFilm Tech Co Ltd, Suzhou OFilm Tech Co Ltd, Shenzhen OFilm Tech Co Ltd filed Critical Nanchang OFilm Tech Co Ltd
Priority to CN201520554553.1U priority Critical patent/CN204833208U/en
Application granted granted Critical
Publication of CN204833208U publication Critical patent/CN204833208U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to a touch -control product and electrical connector thereof, this electrical connector includes: insulating substrate, the busbar is located on the insulating substrate, electrically conductive protruding, fixed connection is on one side of insulating substrate is kept away from to the busbar, wherein, electrically conductive bellied figure is many, and the figure of busbar is many, arranges in many busbar intervals, is equipped with an at least electrically conductive arch on each busbar. The condition that above -mentioned electrical connector can effectively avoid the appearance transversely to switch on increases the comprehensive yield of connecting. Because the ACF price is more expensive, it can effective reduce cost to leave out ACF. In addition, adopting ACF to realize connecting, need carrying out pre -compaction and press and fit process in proper order, the pre -compaction is all inequality with pressure with the temperature of pressfitting, and the connection process is complicated relatively. And when adopting above -mentioned electrical connector, only need paste insulating tie coat on above -mentioned electrical connector or other components, again the pressfitting can, do not need the heating, the connection process is simple relatively.

Description

Touch-control product and arrangements of electric connection thereof
Technical field
The utility model relates to technical field of touch control, particularly relates to touch-control product and arrangements of electric connection thereof.
Background technology
In touch-control product, electrical connection between element and element is normally realized by pin, need to use anisotropic conducting film (AnisotropicConductiveFilm in connection procedure, ACF), ACF mainly comprises conducting particles and insulating gel material two parts, and conducting particles is scattered in insulating gel material.Be described for the connection of flexible PCB (FlexiblePrintedCircuitBoard, FPC) with touch screen body below.
As shown in Figure 1, flexible PCB (FlexiblePrintedCircuitBoard, FPC) 11 has multiple the first pin 12 be intervally arranged, and touch screen body 13 has corresponding second pin 14.Concrete, first provide ACF15; Then ACF15 is pressed in advance the pin area of FPC under uniform temperature and pressure; Then will be pressed with the FPC of ACF and the precisely contraposition of the second pin 14 in advance under charge coupled cell (Charge-coupledDevice, CCD), make each second pin 14 and one first pin 12 just right.Pressing first pin 12 and the second pin 14 under heating and pressurized conditions afterwards, after a period of time, conducting particles 15a contacts with the first pin 12 and the second pin 14 respectively, and insulating gel material 15b solidifies, and finally forms the rock-steady structure of vertical conducting, lateral isolation.This process is desirable binding procedure.
But in actual production process, when pressing first pin 12 and the second pin 14, the ACF15 between the first pin 12 and the second pin 14 is squeezed between adjacent two first pins 12 and between adjacent two second pins 14.And ACF15 is containing conducting particles 15a, conducting particles 15a between adjacent two first pins 12 may cause adjacent two first pins 12 to be electrically connected, conducting particles 15a between adjacent two second pins 14 also may cause adjacent two second pins 14 to be electrically connected, thus causes the situation occurring horizontal conducting.
Utility model content
Based on this, be necessary to provide a kind of touch-control product and the arrangements of electric connection thereof that effectively can avoid horizontal conducting.
An arrangements of electric connection for touch-control product, comprising:
Dielectric base;
Bus, is located in described dielectric base; And
Conductive bumps, is fixedly connected on the side of described bus away from described dielectric base;
Wherein, the number of described conductive bumps is many, and the number of described bus is many, and many described buss are intervally arranged, and each bus is provided with at least one conductive bumps.
Wherein in an embodiment, many parallel equidistant arrangements of described bus.
Wherein in an embodiment, the orthogonal projection of described conductive bumps on corresponding bus is positioned at the edge extent of bus.
Wherein in an embodiment, described bus and described conductive bumps one-body molded.
Wherein in an embodiment, described arrangements of electric connection is flexible PCB.
Wherein in an embodiment, described arrangements of electric connection is touch screen body.
A kind of touch-control product, comprising:
Touch screen body, comprise the first dielectric base and be formed at the conductive layer in described first dielectric base, the contact conductor that described conductive layer comprises touch control electrode and is connected with described touch control electrode, described touch screen body is divided into visible area and rim area, described rim area comprises the first binding district, described touch control electrode is positioned at described visible area, described contact conductor is positioned at described rim area, and described contact conductor is positioned at described first binding district away from one end of described touch control electrode, the number of described touch control electrode and described contact conductor is many, the contact conductor being positioned at described first binding district is spaced,
Flexible PCB, comprise the second dielectric base and connect pin, described second dielectric base comprises the second binding district, and described connection pin is located in described second binding district, the number of described connection pin is many, and the connection pin being positioned at described second binding district is spaced;
Wherein, described contact conductor is provided with conductive bumps away from the side of described first dielectric base, and described first binding district and described second binds district and fits, and each contact conductor passes through described conductive bumps and is connected pin with one and is electrically connected;
Or described connection pin is provided with conductive bumps away from the side of described second dielectric base, and described first binding district and described second binds district and fits, and each contact conductor passes through described conductive bumps and is connected pin with one and is electrically connected.
Wherein in an embodiment, also comprise the first insulating bond, described first insulating bond is between adjacent two contact conductors, and the both sides of described first insulating bond are connected with described first dielectric base and described second dielectric base respectively.
Wherein in an embodiment, also comprise the second insulating bond, described second insulating bond the contact conductor corresponded to each other be connected between pin, and corresponding with it the respectively contact conductor in the both sides of described second insulating bond be connected pin and connect, described conductive bumps is arranged on described second insulating bond.
Wherein in an embodiment, described first insulating bond and the second insulating bond one-body molded.
When above-mentioned arrangements of electric connection connects (other elements are the element with the bus corresponding with the bus of above-mentioned arrangements of electric connection) to other elements, because bus self is with conductive bumps, do not need to use ACF, thus can effectively avoid conducting particles (conducting particles in ACF) to move between adjacent two buss, adjacent two buss are caused to be communicated with, also namely effectively can avoid the situation occurring horizontal conducting, increase the comprehensive yield connected.Because ACF price is more expensive, omitting ACF can effectively reduce costs.In addition, adopt ACF to realize connecting, need to carry out precompressed and bonding processes successively, precompressed is all not identical with pressure with the temperature of pressing, connection procedure relative complex.And when adopting above-mentioned arrangements of electric connection, only need on above-mentioned arrangements of electric connection or other elements, paste insulating bond, then pressing, do not need to heat, connection procedure is relatively simple.
Accompanying drawing explanation
Fig. 1 is the structural representation after existing flexible PCB is connected with element to be connected by ACF;
Fig. 2 is the structural representation of the arrangements of electric connection of an embodiment;
Fig. 3 is the assembled state figure of touch-control product;
Fig. 4 is the structural representation of the touch screen body in Fig. 3;
Fig. 5 is the structural representation of touch-control product.
Embodiment
Below in conjunction with drawings and the specific embodiments, touch-control product and arrangements of electric connection thereof are further described.
As shown in Figure 2, arrangements of electric connection 10 comprises dielectric base 100, bus 200 and conductive bumps 300.
Dielectric base 100 can be the glass sheet that rigidity is stronger, also can be flexible PET film preferably.
Bus 200 to be located in dielectric base 100.Bus 200 can be the metal conductive strips such as electric conductivity good silver, copper, also can be the good conductive polymer bar of electric conductivity.
Conductive bumps 300 is fixedly connected on the side of bus 200 away from dielectric base 100.In the present embodiment, conductive bumps 300 is spherical in shape.In other embodiments, the shape that conductive bumps 300 also can be regular in cuboid, cylindrical etc. also can be irregular shape.
Wherein, the number of conductive bumps 300 is many, and the number of bus 200 is many, and many buss 200 are intervally arranged, and each bus 200 is provided with at least one conductive bumps 300.Concrete, in the present embodiment, each bus 200 is provided with four conductive bumps 300.
When above-mentioned arrangements of electric connection 10 connects (other elements are the element with the bus corresponding with the bus 200 of above-mentioned arrangements of electric connection 10) to other elements, because bus 200 self is with conductive bumps 300, do not need to use ACF, thus can effectively avoid conducting particles (conducting particles in ACF) to move between adjacent two buss 200, adjacent two buss 200 are caused to be communicated with, also namely effectively can avoid the situation occurring horizontal conducting, increase the comprehensive yield connected.Because ACF price is more expensive, omitting ACF can effectively reduce costs.In addition, adopt ACF to realize connecting, need to carry out precompressed and bonding processes successively, precompressed is all not identical with pressure with the temperature of pressing, connection procedure relative complex.And when adopting above-mentioned arrangements of electric connection 10, only need on above-mentioned arrangements of electric connection 10 or other elements, paste insulating bond, then pressing, do not need to heat, connection procedure is relatively simple.
Further, in the present embodiment, many parallel equidistant arrangements of bus 200.
Further, in the present embodiment, the orthogonal projection of conductive bumps 300 on corresponding bus 200 is positioned at the edge extent of bus 200.Even if thus spacing between adjacent two buss 200 of above-mentioned arrangements of electric connection 10 is very little, also there will not be the situation of horizontal conducting.
Further, in the present embodiment, bus 200 is one-body molded with conductive bumps 300.Also namely bus 200 is identical with the material of conductive bumps 300.Be appreciated that in other embodiments, bus 200 also can not be identical with the material of conductive bumps 300.
Further, in the present embodiment, above-mentioned arrangements of electric connection 10 is applied in touch-control product.Arrangements of electric connection 10 can be flexible PCB, also can be touch screen body.
As shown in Figures 3 and 4, touch-control product 20 comprises touch screen body 400, flexible PCB 500 and insulating bond 600.
The conductive layer 420 that touch screen body 400 comprises the first dielectric base 410 and is formed in the first dielectric base 410.The contact conductor 424 that conductive layer 420 comprises touch control electrode 422 and is connected with touch control electrode 422.
Touch screen body 400 is divided into visible area 430 and rim area 440, and rim area 440 comprises the first binding district 442.Touch control electrode 422 is positioned at visible area 430.Contact conductor 424 is positioned at rim area 440, and contact conductor 424 is positioned at the first binding district 442 away from one end of touch control electrode 422.The number of touch control electrode 422 and contact conductor 424 is many, and the contact conductor 424 being positioned at the first binding district 442 is spaced.
Flexible PCB 500 comprises the second dielectric base 510 and connects pin 520.Second dielectric base 510 comprises the second binding district 512, connects pin 520 and is located in the second binding district 512.The number connecting pin 520 is many, and the connection pin 520 being positioned at the second binding district 512 is spaced.
Wherein, connection pin 520 is provided with conductive bumps 530 away from the side of the second dielectric base 510.And the first binding district 442 and second binds district 512 and fits, each contact conductor 424 is connected pin 520 by conductive bumps 530 with one and is electrically connected.Concrete, connecting pin 520 with the material of conductive bumps 530 is copper.
Be appreciated that, in his embodiment, contact conductor 424 is provided with conductive bumps 530 away from the side of the first dielectric base 410, and the first binding district 442 and second binds district 512 and fits, and each contact conductor 424 is connected pin 520 by conductive bumps 530 with one and is electrically connected.Concrete, contact conductor 424 and the material of conductive bumps 530 are silver.
As shown in Figure 5, in the present embodiment, insulating bond 600 comprises the first insulating bond 610 and the second insulating bond 620.
First insulating bond 610 is between adjacent two contact conductors 424, and the both sides of the first insulating bond 620 are connected with the first dielectric base 410 and the second dielectric base 510 respectively.
Second insulating bond 620 the contact conductor 424 corresponded to each other be connected between pin 520, and corresponding with it the respectively contact conductor 424 in the both sides of the second insulating bond 620 be connected pin 520 and connect.Conductive bumps 530 is arranged on the second insulating bond 620.
Concrete, in the present embodiment, a double faced adhesive tape is pasted in the first binding district 442 or the second binding district 512, then under CCD, contraposition is carried out, each contact conductor 424 is made to be connected pin 520 with one just right, pressing first is bound district 442 and second and is bound district 512 again, after double faced adhesive tape solidification, removes pressure.
Owing to can effectively avoid horizontal conducting when connecting touch screen body 400 and flexible PCB 500, above-mentioned touch-control product 20 has good touch-control sensitivity.
The above embodiment only have expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.

Claims (10)

1. an arrangements of electric connection for touch-control product, is characterized in that, comprising:
Dielectric base;
Bus, is located in described dielectric base; And
Conductive bumps, is fixedly connected on the side of described bus away from described dielectric base;
Wherein, the number of described conductive bumps is many, and the number of described bus is many, and many described buss are intervally arranged, and each bus is provided with at least one conductive bumps.
2. arrangements of electric connection according to claim 1, is characterized in that, many parallel equidistant arrangements of described bus.
3. arrangements of electric connection according to claim 1, is characterized in that, the orthogonal projection of described conductive bumps on corresponding bus is positioned at the edge extent of bus.
4. arrangements of electric connection according to claim 1, is characterized in that, described bus and described conductive bumps one-body molded.
5. arrangements of electric connection according to claim 1, is characterized in that, described arrangements of electric connection is flexible PCB.
6. arrangements of electric connection according to claim 1, is characterized in that, described arrangements of electric connection is touch screen body.
7. a touch-control product, is characterized in that, comprising:
Touch screen body, comprise the first dielectric base and be formed at the conductive layer in described first dielectric base, the contact conductor that described conductive layer comprises touch control electrode and is connected with described touch control electrode, described touch screen body is divided into visible area and rim area, described rim area comprises the first binding district, described touch control electrode is positioned at described visible area, described contact conductor is positioned at described rim area, and described contact conductor is positioned at described first binding district away from one end of described touch control electrode, the number of described touch control electrode and described contact conductor is many, the contact conductor being positioned at described first binding district is spaced,
Flexible PCB, comprise the second dielectric base and connect pin, described second dielectric base comprises the second binding district, and described connection pin is located in described second binding district, the number of described connection pin is many, and the connection pin being positioned at described second binding district is spaced;
Wherein, described contact conductor is provided with conductive bumps away from the side of described first dielectric base, and described first binding district and described second binds district and fits, and each contact conductor passes through described conductive bumps and is connected pin with one and is electrically connected;
Or described connection pin is provided with conductive bumps away from the side of described second dielectric base, and described first binding district and described second binds district and fits, and each contact conductor passes through described conductive bumps and is connected pin with one and is electrically connected.
8. touch-control product according to claim 7, it is characterized in that, also comprise the first insulating bond, described first insulating bond is between adjacent two contact conductors, and the both sides of described first insulating bond are connected with described first dielectric base and described second dielectric base respectively.
9. touch-control product according to claim 8, it is characterized in that, also comprise the second insulating bond, described second insulating bond the contact conductor corresponded to each other be connected between pin, and corresponding with it the respectively contact conductor in the both sides of described second insulating bond be connected pin and connect, described conductive bumps is arranged on described second insulating bond.
10. touch-control product according to claim 9, is characterized in that, described first insulating bond and the second insulating bond one-body molded.
CN201520554553.1U 2015-07-28 2015-07-28 Touch -control product and electrical connector thereof Expired - Fee Related CN204833208U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520554553.1U CN204833208U (en) 2015-07-28 2015-07-28 Touch -control product and electrical connector thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520554553.1U CN204833208U (en) 2015-07-28 2015-07-28 Touch -control product and electrical connector thereof

Publications (1)

Publication Number Publication Date
CN204833208U true CN204833208U (en) 2015-12-02

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106658988A (en) * 2017-02-07 2017-05-10 武汉华星光电技术有限公司 Display, circuit board, and pin structure of circuit board
CN108170326A (en) * 2018-01-19 2018-06-15 江苏迪佳电子有限公司 A kind of capacitance touch screen processing technology and its process equipment
CN109473038A (en) * 2018-12-12 2019-03-15 武汉华星光电半导体显示技术有限公司 Display panel assembly and display device
CN110544434A (en) * 2019-09-04 2019-12-06 云谷(固安)科技有限公司 display panel, manufacturing method thereof and display device
CN115483489A (en) * 2019-08-19 2022-12-16 上海移宇科技股份有限公司 Battery case integrated analyte detection device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106658988A (en) * 2017-02-07 2017-05-10 武汉华星光电技术有限公司 Display, circuit board, and pin structure of circuit board
WO2018145341A1 (en) * 2017-02-07 2018-08-16 武汉华星光电技术有限公司 Display, wiring board and pin structure thereof
CN108170326A (en) * 2018-01-19 2018-06-15 江苏迪佳电子有限公司 A kind of capacitance touch screen processing technology and its process equipment
CN109473038A (en) * 2018-12-12 2019-03-15 武汉华星光电半导体显示技术有限公司 Display panel assembly and display device
CN115483489A (en) * 2019-08-19 2022-12-16 上海移宇科技股份有限公司 Battery case integrated analyte detection device
CN115483485A (en) * 2019-08-19 2022-12-16 上海移宇科技股份有限公司 Battery case integrated analyte detection device
CN115483489B (en) * 2019-08-19 2023-11-21 上海移宇科技股份有限公司 Battery housing integrated analyte sensing device
CN115483485B (en) * 2019-08-19 2023-11-21 上海移宇科技股份有限公司 Battery housing integrated analyte sensing device
CN110544434A (en) * 2019-09-04 2019-12-06 云谷(固安)科技有限公司 display panel, manufacturing method thereof and display device
CN110544434B (en) * 2019-09-04 2022-02-22 云谷(固安)科技有限公司 Display panel, manufacturing method thereof and display device

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151202

Termination date: 20180728