CN214046544U - Shielding cover and processing jig thereof - Google Patents
Shielding cover and processing jig thereof Download PDFInfo
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- CN214046544U CN214046544U CN202021041544.XU CN202021041544U CN214046544U CN 214046544 U CN214046544 U CN 214046544U CN 202021041544 U CN202021041544 U CN 202021041544U CN 214046544 U CN214046544 U CN 214046544U
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- solder balls
- shielding case
- tin
- fixing plate
- hole
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Abstract
The utility model discloses a shield cover and processing tool thereof. The shielding case comprises a body, wherein the bottom of the body is provided with a plurality of solder balls, and the number of the solder balls is multiple. The shielding case is provided with the tin ball, the structure is novel, and when the shielding case is welded with a PCB, the tin paste does not need to be brushed on the PCB in advance, so that the space requirement is reduced, and the miniaturization of an electronic component is facilitated; compared with the traditional tin paste brushing mode, the shielding case can reduce the tin soldering amount and loss, and reduce the production cost.
Description
Technical Field
The utility model relates to an electromagnetic shield technical field especially relates to a shield cover and processing tool thereof.
Background
When the existing shielding case is welded, firstly, solder paste needs to be brushed on an external component (such as a PCB), then the shielding case is placed, and finally, the shielding case passes through a reflow oven for welding.
When brushing the tin cream, need laminate the otter board on the PCB board, have the mesh that corresponds on the otter board to supply the tin cream to pass through, when the mesh size is small partially, the tin cream is difficult for passing through the mesh, causes the mesh to block up, causes PCB board brushing tin district no tin or few tin, leads to shield cover and external member welding unstability.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: a shielding case with a novel structure and a processing jig thereof are provided.
In order to solve the technical problem, the utility model discloses a technical scheme be:
the shielding case comprises a body, wherein a plurality of solder balls are arranged at the bottom of the body, and the number of the solder balls is multiple.
Furthermore, the solder balls are arranged on the bottom surface of the body.
Furthermore, the bottom of the body is provided with a surrounding edge extending outwards, and the solder balls are arranged on the bottom surface of the surrounding edge.
Furthermore, the bottom surface of the body is provided with a plurality of pits, the pits are arranged in one-to-one correspondence with the solder balls, and a part of the solder balls are positioned in the pits.
Furthermore, the solder ball is welded on the body through laser heat energy.
In order to solve the technical problem, the utility model discloses still adopt following technical scheme:
the processing jig is used for processing the shielding case and comprises a fixing plate, wherein a plurality of accommodating grooves used for accommodating solder balls are formed in the top surface of the fixing plate, and the number of the accommodating grooves is multiple.
Furthermore, a through hole is formed in the fixing plate, one end of the through hole is communicated with the bottom of the accommodating groove, the other end of the through hole is communicated with the bottom face of the fixing plate, and the diameter of the through hole is smaller than that of the accommodating groove.
Furthermore, the number of the through holes is multiple, and the through holes and the accommodating grooves are arranged in a one-to-one correspondence mode.
The beneficial effects of the utility model reside in that: the shielding case is provided with the tin ball, the structure is novel, and when the shielding case is welded with a PCB, the tin paste does not need to be brushed on the PCB in advance, so that the space requirement is reduced, and the miniaturization of an electronic component is facilitated; compared with the traditional tin paste brushing mode, the shielding case can reduce the tin soldering amount and loss, and reduce the production cost.
Drawings
Fig. 1 is a schematic structural diagram of a shield according to a first embodiment of the present invention;
fig. 2 is a top view of a processing tool according to a first embodiment of the present invention;
fig. 3 is a schematic view illustrating the cooperation between the shielding case and the processing jig according to the first embodiment of the present invention;
FIG. 4 is an enlarged view of detail A in FIG. 3;
fig. 5 is a bottom view of the shield case according to the second embodiment of the present invention.
Description of reference numerals:
1. a body;
2. tin balls;
3. surrounding edges;
4. a fixing plate;
5. a containing groove;
6. a through hole;
7. a pit;
8. and a tin containing groove.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1 to 5, a shielding case includes a main body 1, a plurality of solder balls 2 are disposed at the bottom of the main body 1, and the plurality of solder balls 2 are disposed along the circumferential direction of the main body 1.
The structure/working principle of the utility model is as follows: when the shielding cover is welded with the PCB, the shielding cover is firstly placed at the preset position of the PCB, and then the PCB is placed in a reflow oven. When other components are welded on the PCB and the space is narrow, the shielding case can be adopted, so that the process of solder paste dotting around the components can be omitted, and the assembly efficiency is greatly improved.
From the above description, the beneficial effects of the present invention are: the shielding case is provided with the solder balls 2, the structure is novel, and when the shielding case is welded with a PCB, solder paste does not need to be brushed on the PCB in advance, so that the space requirement is reduced, and the miniaturization of an electronic component is facilitated; compared with the traditional tin paste brushing mode, the shielding case can reduce the tin soldering amount and loss, and reduce the production cost.
Furthermore, the solder ball 2 is arranged on the bottom surface of the body 1.
As can be seen from the above description, the solder balls 2 are disposed on the bottom surface of the body 1 to further ensure the stability of the connection between the body 1 and the PCB.
Furthermore, the bottom of the body 1 is provided with a surrounding edge 3 extending outwards, and the solder ball 2 is arranged on the bottom surface of the surrounding edge 3.
As can be seen from the above description, the surrounding edge 3 has a large area and more space for arranging the solder balls 2, so that the solder balls 2 can be more stably connected to the body 1, and the risk of accidental separation of the solder balls 2 from the body 1 in the transferring process of the shielding case is reduced.
Furthermore, the bottom surface of the body 1 is provided with a plurality of pits, the pits are arranged in one-to-one correspondence with the solder balls 2, and a part of the solder balls 2 is located in the pits.
From the above description, the provision of the concave can further reduce the risk of accidental separation of the solder ball 2 from the body 1.
Further, the solder ball 2 is welded on the body 1 through laser heat energy.
As can be seen from the above description, the solder ball 2 is easily connected to the main body 1.
The processing jig is used for processing the shielding case and comprises a fixing plate 4, wherein a plurality of accommodating grooves 5 used for accommodating solder balls 2 are formed in the top surface of the fixing plate 4, and the number of the accommodating grooves 5 is multiple, and the accommodating grooves 5 are arranged along the circumferential direction of the body 1.
From the above description, the specially-made processing jig can precisely connect the solder ball 2 to the predetermined position of the body 1, so as to precisely position the solder ball 2.
Furthermore, a through hole 6 is formed in the fixing plate 4, one end of the through hole 6 is communicated with the bottom of the accommodating groove 5, the other end of the through hole 6 is communicated with the bottom surface of the fixing plate 4, and the diameter of the through hole 6 is smaller than that of the accommodating groove 5.
Furthermore, the number of the through holes 6 is multiple, and the through holes 6 and the accommodating grooves 5 are arranged in a one-to-one correspondence manner.
As can be seen from the above description, the through hole 6 is penetrated by laser, so that the solder ball 2 can be melted and soldered on the body 1 by the laser heat energy.
Example one
Referring to fig. 1 to 4, a first embodiment of the present invention is: as shown in fig. 1, a shielding case includes a body 1, a plurality of solder balls 2 are connected to the bottom of the body 1, the plurality of solder balls 2 are arranged along the circumferential direction of the body 1, the solder balls 2 may be fixed on the inner sidewall of the body 1, or fixed on the outer sidewall of the body 1, but preferably, the solder balls 2 are fixed on the bottom surface of the body 1. In this embodiment, the body 1 is a hollow shell with an opening at the bottom.
In order to improve the connection stability of the solder ball 2 and the body 1, the bottom of the body 1 is provided with a surrounding edge 3 extending outwards, and the solder ball 2 is arranged on the bottom surface of the surrounding edge 3.
Because the bottom of the body 1 is provided with the solder balls 2, when the shielding cover is welded with the PCB, the shielding cover is only required to be placed at the preset position of the PCB, and then the shielding cover is welded with the PCB through the reflow oven.
In order to improve the assembly efficiency of the solder ball 2 and the body 1, the solder ball 2 is welded on the body 1 through laser heat energy.
Referring to fig. 1 to 4, in order to accurately connect the solder balls 2 to the main body 1, the present embodiment further provides a processing jig for processing the above-mentioned shielding can, the processing jig includes a fixing plate 4, a plurality of accommodating grooves 5 for accommodating the solder balls 2 are disposed on a top surface of the fixing plate 4, and the plurality of accommodating grooves 5 are disposed along a circumferential direction of the main body 1.
Furthermore, a through hole 6 is formed in the fixing plate 4, one end of the through hole 6 is communicated with the bottom of the accommodating groove 5, the other end of the through hole 6 is communicated with the bottom surface of the fixing plate 4, the diameter of the through hole 6 is smaller than that of the accommodating groove 5, the through holes 6 are arranged in a plurality, and the through holes 6 and the accommodating grooves 5 are arranged in a one-to-one correspondence manner.
The operation process of connecting the solder ball 2 to the main body 1 is briefly described as follows:
firstly, placing solder balls 2 in each accommodating groove 5 on a fixing plate 4, then covering a body 1 of a shielding case on the fixing plate 4 and enabling each solder ball 2 to abut against a surrounding edge 3 of the body 1, then melting the solder balls 2 by utilizing the heat energy of laser penetrating through holes 6, enabling the solder balls 2 to be welded on the surrounding edge 3 of the body 1, and finally taking down the body 1, wherein the solder balls 2 are transferred to the body 1 from the accommodating grooves 5.
Example two
Referring to fig. 5, a second embodiment of the present invention is a further improvement made on the basis of the first embodiment, and the difference from the first embodiment is that: the bottom surface of the body 1 is provided with a plurality of pits 7, the pits 7 are arranged in one-to-one correspondence with the solder balls 2, and a part of the solder balls 2 is positioned in the pits 7. Optionally, two adjacent pit 7 is linked together through holding tin groove 8, and so the structure can avoid tin ball 2 to melt the time, and the tin liquid spills over from the edge of surrounding edge 3, does benefit to the stability of guaranteeing body 1 and PCB board connection.
In summary, the shielding case provided by the utility model is provided with solder balls, has novel structure, does not need to brush solder paste on the PCB in advance when being welded with the PCB, reduces the space requirement, and is beneficial to the miniaturization of electronic components; compared with the traditional tin paste brushing mode, the shielding case can reduce the tin soldering amount and loss, and reduce the production cost.
The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.
Claims (6)
1. A shielding cage comprising a body, characterized in that: the bottom of the body is connected with a plurality of solder balls, and the solder balls in a plurality are arranged along the circumferential direction of the body; the solder ball is welded on the body through laser heat energy.
2. The shield of claim 1, wherein: the solder balls are arranged on the bottom surface of the body.
3. The shield of claim 2, wherein: the bottom of the body is provided with a surrounding edge extending outwards, and the solder balls are arranged on the bottom surface of the surrounding edge.
4. The shield of claim 2, wherein: the bottom surface of the body is provided with a plurality of pits, the pits and the solder balls are arranged in a one-to-one correspondence mode, and one part of the solder balls is located in the pits.
5. The processing jig is used for processing the shielding case of claim 1, and is characterized in that: the tin ball fixing device comprises a fixing plate, wherein the top surface of the fixing plate is provided with a plurality of accommodating grooves for accommodating tin balls, and the plurality of accommodating grooves are arranged along the circumferential direction of the body; the fixing plate is provided with a through hole, one end of the through hole is communicated with the bottom of the accommodating groove, the other end of the through hole is communicated with the bottom surface of the fixing plate, and the diameter of the through hole is smaller than that of the accommodating groove.
6. The processing jig according to claim 5, wherein: the number of the through holes is multiple, and the through holes and the accommodating grooves are arranged in a one-to-one correspondence mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021041544.XU CN214046544U (en) | 2020-06-09 | 2020-06-09 | Shielding cover and processing jig thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021041544.XU CN214046544U (en) | 2020-06-09 | 2020-06-09 | Shielding cover and processing jig thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214046544U true CN214046544U (en) | 2021-08-24 |
Family
ID=77331525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021041544.XU Active CN214046544U (en) | 2020-06-09 | 2020-06-09 | Shielding cover and processing jig thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214046544U (en) |
-
2020
- 2020-06-09 CN CN202021041544.XU patent/CN214046544U/en active Active
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