CN213845829U

CN213845829U - Semiconductor laser heat radiation structure and laser

Info

Publication number: CN213845829U
Application number: CN202022865971.6U
Authority: CN
Inventors: 耿庆; 朱晓峰; 汪秀
Original assignee: Wuhan Leijian Technology Co ltd
Current assignee: Wuhan Leijian Technology Co ltd
Priority date: 2020-12-02
Filing date: 2020-12-02
Publication date: 2021-07-30
Anticipated expiration: 2030-12-02

Abstract

The utility model relates to a semiconductor heat dissipation technical field for a semiconductor laser heat radiation structure and laser instrument, include the copper and the heat dissipation body with laser instrument body fixed connection, the heat dissipation body includes heat radiation fins, heat radiation fins with connect through the cooling tube between the copper, heat radiation fins with the laser instrument body is kept away from and each other becomes the contained angle. The semiconductor refrigerating sheet is clamped between the heat-radiating copper plate and the laser, the laser heat is brought into the heat-radiating fins to be radiated by the switch, and meanwhile, the fan is arranged beside the heat-radiating fins, so that the heat radiation can be further accelerated. The structure is ingenious and reasonable, the cost is low, the assembly and disassembly are convenient, and the environment is protected. On the other hand, the heat dissipation body is separated from the laser body and forms an angle with the laser body, so that the heat dissipation efficiency can be improved, and the space can be saved.

Description

Semiconductor laser heat radiation structure and laser

Technical Field

The utility model relates to a semiconductor heat dissipation technical field, concretely relates to semiconductor laser heat radiation structure and laser instrument.

Background

In the use of the semiconductor laser, when the heat of the chip is accumulated to a certain degree, the semiconductor laser can cause the laser cluster to be extinguished due to the overheating of the chip, so that the high-power laser output is limited, and the heat dissipation structure of the existing chip has poor heat dissipation effect and cannot meet the heat dissipation requirement of the chip. When the laser works, the heat dissipation of the laser is an important guarantee for ensuring the long-term reliable work of the laser.

The quality of light emitted by a laser is pure, the spectrum is stable, and the laser can be applied in many aspects, the laser is developed from the initial low temperature, the operation is performed at the lower part to the continuous operation at the room temperature, the low power type is changed to the high power type, the output power is improved from several milliwatts to several kilowatts, the laser takes a laser bar as the minimum unit, the output power is large, the working current is large, the heat loss is large, and the bottleneck problem that the development of the laser towards the miniaturization, the low power consumption and the high performance is always restricted and influenced, so the heat dissipation structure of the laser is urgently needed, but the heat dissipation structure of the traditional laser still has many problems in the using process, and the specific problems are as follows:

1. in the use process of the traditional heat dissipation structure of the laser, the disassembly of the laser shell is particularly inconvenient, and the disassembly process is often complicated and troublesome, so that the internal maintenance and cleaning of the laser cannot be convenient and simple, and the working difficulty is increased;

2. in the use process of the heat dissipation structure of the traditional laser, the surface of the shell of the laser has extremely high heat due to extremely high heat generated in the laser, so that workers can be scalded when moving or using the laser;

3. in the use process of the heat dissipation structure of the traditional laser, the heat dissipation structure in the device can not meet the heat dissipation requirement of the device, so that the performance and the characteristics of the laser can not be well exerted and embodied when the device is used.

Disclosure of Invention

The utility model provides a semiconductor laser heat radiation structure and laser instrument has solved above the poor technical problem of semiconductor laser chip heat dissipation.

The utility model provides a solve above-mentioned technical problem and provide a semiconductor laser heat radiation structure, include the copper and the heat dissipation body with laser instrument body fixed connection, the heat dissipation body includes heat radiation fins, heat radiation fins with connect through the cooling tube between the copper, heat radiation fins with the laser instrument body is kept away from and each other becomes the contained angle.

Preferably, a refrigerating sheet is clamped between the copper plate and the laser body.

Preferably, the heat radiating fins are separated from the copper plate and arranged at 90 °.

Preferably, the radiating pipe comprises a plurality of pipes arranged at intervals in a straight line shape.

Preferably, the heat dissipation body comprises a bracket, and the heat dissipation fins are arranged in the bracket.

Preferably, the bracket is connected with the heat radiating fins through bolts.

Preferably, the support is a hollow box body, and the heat dissipation fins are integrally clamped in the hollow box body.

Preferably, a heat dissipation fan is fixedly arranged on the outer side of the support, and the heat dissipation fins are located at an air inlet of the heat dissipation fan.

The utility model provides a semiconductor laser, including the laser instrument body, still include semiconductor laser heat radiation structure, the laser instrument body with copper bolted connection.

Has the advantages that: the utility model provides a semiconductor laser heat radiation structure and laser instrument, include the copper and the heat dissipation body with laser instrument body fixed connection, the heat dissipation body includes heat radiation fins, heat radiation fins with connect through the cooling tube between the copper, heat radiation fins with the laser instrument body is kept away from and each other becomes the contained angle. The semiconductor refrigerating sheet is clamped between the heat-radiating copper plate and the laser, the laser heat is brought into the heat-radiating fins to be radiated by the switch, and meanwhile, the fan is arranged beside the heat-radiating fins, so that the heat radiation can be further accelerated. The structure is ingenious and reasonable, the cost is low, the assembly and disassembly are convenient, and the environment is protected. On the other hand, the heat dissipation body is separated from the laser body and forms an angle with the laser body, so that the heat dissipation efficiency can be improved, and the space can be saved.

The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings. The detailed description of the present invention is given by the following examples and the accompanying drawings.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without undue limitation to the invention. In the drawings:

fig. 1 is a three-dimensional structure diagram of a semiconductor laser heat dissipation structure and a laser according to the present invention;

fig. 2 is a front view of the semiconductor laser heat dissipation structure and the laser of the present invention;

fig. 3 is a structural diagram of the heat dissipation structure of the semiconductor laser and the heat dissipation fins of the laser according to the present invention.

Description of reference numerals: the laser comprises a laser body 1, a copper plate 2, radiating fins 3, a radiating pipe 4, a refrigerating sheet 5, a support 6 and a fan 7.

Detailed Description

The principles and features of the present invention are described below in conjunction with the following drawings, the examples given are only intended to illustrate the present invention and are not intended to limit the scope of the present invention. The invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become more fully apparent from the following description and appended claims. It should be noted that the drawings are in simplified form and are not to precise scale, and are provided for convenience and clarity in order to facilitate the description of the embodiments of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1 to fig. 3, the utility model provides a semiconductor laser heat radiation structure, include with 1 fixed connection's of laser instrument copper 2 and heat dissipation body, the heat dissipation body includes heat radiation fin 3, heat radiation fin 3 with connect through cooling tube 4 between the copper 2, heat radiation fin 3 with laser instrument body 1 keeps away from and each other becomes the contained angle. The semiconductor refrigerating sheet 5 is clamped between the heat-radiating copper plate 2 and the laser, so that the heat of the laser is brought into the heat-radiating fins 3 to be radiated, and meanwhile, the fan 7 is arranged beside the heat-radiating fins 3, so that the heat radiation can be further accelerated. The structure is ingenious and reasonable, the cost is low, the assembly and disassembly are convenient, and the environment is protected. On the other hand, the heat dissipation body is separated from the laser body 1 and forms an angle with each other, so that the heat dissipation efficiency can be improved, and the space can be saved.

Wherein, copper 2 and 1 bolted connection of laser instrument body or bonding or welding are in the same place, and copper 2 absorbs the heat, then gives off the heat through the transmission of cooling tube 4, and copper pipe passes copper 2 from the side, and the two fully contacts, dispels the heat to heat radiation fins 3 along the copper pipe gradually with the heat. The heat is also partially dissipated in the process of transferring the copper tube, and the heat is mainly dissipated through the heat dissipation fins 3.

In the preferable scheme, a refrigerating sheet 5 is clamped between the copper plate 2 and the laser body 1. The copper 2 is closely attached to the refrigerating sheet 5, so that the contact area is increased, and heat transfer is more convenient.

Preferably, the heat dissipation fins 3 are separated from the copper plate 2 and arranged at 90 °. The vertical arrangement can save space and play a good role in heat dissipation.

In a preferred embodiment, the heat dissipation pipe 4 includes a plurality of pipes arranged in a line shape at intervals. The pipelines are separated from each other, so that heat can be dissipated, the area of a heat dissipation channel is increased, and the space is saved.

Preferably, the heat dissipation body comprises a bracket 6, and the heat dissipation fins 3 are arranged in the bracket 6. The support 6 plays a role in supporting and protecting the heat dissipation fins 3 from being exposed to the outside. The bracket 6 is a frame structure, and the heat dissipation fins 3 can be welded on the frame structure.

Preferably, the bracket 6 is connected with the heat dissipation fins 3 through bolts. The corners around the heat dissipation support 6 are provided with installation positioning holes, the same holes are also arranged around the heat dissipation fins 3, and the heat dissipation support is positioned by the installation positioning blocks during installation and then passes through bolts to be screwed down.

In the preferred scheme, the support 6 is a hollow box body, and the heat dissipation fins 3 are integrally clamped in the hollow box body. The fretwork box body can be upper and lower lid and close the mode, and the inside is equipped with the slot and supplies heat radiation fins 3 to prevent, closes upper and lower lid alright compress tightly heat radiation fins 3, and upper and lower lid can pass through bolted connection, and just upper and lower lid is the fretwork form, and worker heat radiation fins 3 heat distributes away.

In a preferable scheme, a heat dissipation fan 7 is fixedly arranged on the outer side of the support 6, and the heat dissipation fins 3 are located at an air inlet of the heat dissipation fan 7. The heat dissipation effect of the heat dissipation fins 3 can be accelerated by the heat dissipation fan 7, and the heat dissipation efficiency is improved.

The embodiment of the utility model provides a semiconductor laser is still provided, including laser instrument body 1, still include semiconductor laser heat radiation structure, laser instrument body 1 with 2 bolted connection of copper. The heat dissipation structure of the semiconductor laser is as described above, and will not be described in detail herein.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way; the present invention can be smoothly implemented by those skilled in the art according to the drawings and the above description; however, those skilled in the art should understand that changes, modifications and variations made by the above-described technology can be made without departing from the scope of the present invention, and all such changes, modifications and variations are equivalent embodiments of the present invention; meanwhile, any changes, modifications, evolutions, etc. of the above embodiments, which are equivalent to the actual techniques of the present invention, still belong to the protection scope of the technical solution of the present invention.

Claims

1. A semiconductor laser heat radiation structure is characterized in that: the laser comprises a copper plate fixedly connected with a laser body and a heat dissipation body, wherein the heat dissipation body comprises heat dissipation fins, the heat dissipation fins are connected with the copper plate through heat dissipation pipes, and the heat dissipation fins are far away from the laser body and form included angles with the laser body.

2. The semiconductor laser heat dissipation structure of claim 1, wherein a cooling plate is clamped between the copper plate and the laser body.

3. A semiconductor laser heat dissipation structure as defined in claim 1, wherein the heat sink fins are separated from the copper plate and arranged at 90 °.

4. A heat dissipation structure for a semiconductor laser as defined in claim 1, wherein the heat dissipation tube comprises a plurality of pipes arranged in a matrix at intervals.

5. A semiconductor laser heat dissipation structure as defined in claim 1, wherein the heat dissipation body comprises a cradle, the heat fins being embedded within the cradle.

6. A semiconductor laser heat dissipation structure as defined in claim 5, wherein the bracket is bolted to the heat sink fins.

7. The semiconductor laser heat dissipation structure of claim 5, wherein the support is a hollow box, and the heat dissipation fins are integrally clamped in the hollow box.

8. A heat dissipation structure for a semiconductor laser as defined in claim 5, wherein a heat dissipation fan is fixedly disposed outside the support, and the heat dissipation fins are located at an air inlet of the heat dissipation fan.

9. A semiconductor laser comprising a laser body, characterized in that: further comprising a semiconductor laser heat dissipation structure as defined in any one of claims 1 to 8, said laser body being bolted to said copper plate.