CN218550512U - Power supply module - Google Patents
Power supply module Download PDFInfo
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- CN218550512U CN218550512U CN202222590026.9U CN202222590026U CN218550512U CN 218550512 U CN218550512 U CN 218550512U CN 202222590026 U CN202222590026 U CN 202222590026U CN 218550512 U CN218550512 U CN 218550512U
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- power module
- heat dissipation
- power supply
- installation shell
- heat
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Abstract
The utility model discloses a power module, including power module installation shell, the inside fixed subassembly of power module that is equipped with of power module installation shell, the fixed subassembly one side of power module is equipped with intelligent radiator unit, and intelligent radiator unit one side is equipped with dustproof subassembly. Further, in order to reach the radiating mesh of power module intelligence, intelligence radiator unit includes the power module body, and power module body one side is equipped with temperature sensor, and temperature sensor installs and is connected at power module installation shell, and the laminating of power module body one side has the heat dissipation conducting strip, the utility model discloses make the improvement to prior art, not only can dispel the heat to power module to improve the radiating effect of this device, can support power module tightly fixed, in addition in actual practice, power module's heat dissipation can be so that power module's temperature is stable, and the heat-sinking capability improves, guarantees that power module's temperature improves power module's life in its operating temperature scope.
Description
Technical Field
The utility model relates to a power module field particularly, relates to a power module.
Background
Since the 21 st century, electrical systems have been systems consisting of low voltage power supply assemblies, also known as "low voltage power distribution systems" or "low voltage distribution lines", of which the power supply module is a component.
Prior publication No.: CN215421436U discloses a power module, including ceramic substrate and metal casing, the welding has metal casing above the ceramic substrate, heat abstractor is installed to the top of ceramic substrate. This power module through mutually supporting between structures such as metal casing, heating panel, power module, miniature transformer and inductor, can dispel the heat to miniature transformer and inductor through metal casing, dispels the heat to power module through heating panel and ceramic substrate cooperation.
The utility model discloses a though can dispel the heat to power module to the radiating effect of this device has been improved, and can support power module tightly fixed, but in practical application, power module's heat dissipation only dispels the heat through heating panel and ceramic substrate and outside air, and the heat-sinking capability is lower, is difficult to guarantee power module's temperature at its operating temperature scope, influences power module's life-span.
SUMMERY OF THE UTILITY MODEL
To the problem in the correlation technique, the utility model provides a power module to overcome the above-mentioned technical problem that current correlation technique exists.
Therefore, the utility model discloses a specific technical scheme as follows:
the utility model provides a power module, includes power module installation shell, and power module installation shell is inside to be equipped with the fixed subassembly of power module, and the fixed subassembly one side of power module is equipped with intelligent radiator unit, and intelligent radiator unit one side is equipped with dustproof subassembly.
Further, in order to reach the purpose of intelligent heat dissipation of the power module, the intelligent heat dissipation assembly comprises a power module body, a temperature sensor is arranged on one side of the power module body, the temperature sensor is installed on the power module installation shell and connected with the power module installation shell, a heat dissipation heat conduction piece is attached to one side of the power module body, a refrigeration installation shell is arranged on one side of the heat dissipation heat conduction piece, a semiconductor refrigeration piece is arranged inside the refrigeration installation shell, the cold end of the semiconductor refrigeration piece is connected with the heat dissipation heat conduction piece, and a control device is arranged on one side of the refrigeration installation shell.
Furthermore, the temperature sensor and the semiconductor refrigerating sheet are electrically connected with the control device.
Furthermore, the control device is a single chip microcomputer controller of the model MM32L0130, and the single chip microcomputer controller is electrically connected with an external power supply.
Furthermore, a heat exchange tube is arranged on one side of the refrigeration installation shell and connected with the refrigeration installation shell.
Furthermore, in order to achieve the purpose of preventing dust of the power module, the dust-proof assembly comprises a heat dissipation mounting hole, a heat dissipation fan is mounted inside the heat dissipation mounting hole, a dust-proof filter screen is mounted at the input end of the heat dissipation fan, and air outlet holes are symmetrically formed in two ends of the refrigeration mounting shell.
Furthermore, a dust sensor is arranged inside the power module mounting shell, and the dust sensor and the cooling fan are electrically connected with the control device.
Furthermore, in order to achieve the purpose of fixing the power module, the power module fixing component comprises a fixing screw rod, the fixing screw rod is movably connected with the power module mounting shell, a threaded sleeve is connected to the periphery of the fixing screw rod in a threaded manner, and a fixing frame is connected to one side of the threaded sleeve.
The beneficial effects of the utility model are that:
1. the utility model discloses improved prior art, not only can dispel the heat to power module to improve the radiating effect of this device, can support power module tightly fixed, in practical practicality moreover, power module's heat dissipation can be so that power module's temperature is stable, and the heat-sinking capability improves, guarantees power module's temperature at its operating temperature scope, improves power module's life-span.
2. In practical application, the heat dissipation mounting holes are arranged, so that the heat dissipation mounting holes are convenient for mounting a heat dissipation fan, the heat dissipation fan can blow air to the inside of the power module mounting shell, dust can be discharged from the air outlet holes, the dustproof filter screen can achieve the purpose of conveniently feeding air and filtering the dust,
drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic diagram of a main structure of a power module according to an embodiment of the present invention;
fig. 2 is a perspective view of a power module according to an embodiment of the present invention;
fig. 3 is one of partial schematic structural diagrams of a power module according to an embodiment of the present invention;
fig. 4 is a second partial schematic structural diagram of a power module according to an embodiment of the present invention.
In the figure:
1. the power supply module is arranged on the shell; 2. a power module fixing component; 201. fixing the screw rod; 202. a threaded sleeve; 203. a fixed mount; 3. an intelligent heat dissipation assembly; 301. a power module body; 302. a temperature sensor; 303. a heat dissipating and conducting fin; 304. a refrigerated mounting housing; 305. a semiconductor refrigeration sheet; 306. A control device; 4. a dust-proof component; 401. a heat dissipation mounting hole; 402. a heat radiation fan; 403. a dustproof filter screen; 404. an air outlet; 5. a heat exchange pipe; 6. a dust sensor.
Detailed Description
For further explanation of the embodiments, the drawings are provided as part of the disclosure and serve primarily to illustrate the embodiments and, together with the description, to explain the principles of operation of the embodiments, and to provide further explanation of the invention and advantages thereof, it will be understood by those skilled in the art that various other embodiments and advantages of the invention are possible, and that elements in the drawings are not to scale and that like reference numerals are generally used to designate like elements.
According to the utility model discloses an embodiment provides a power module.
Now combine the attached drawing and detailed description to the utility model discloses explain further, as shown in fig. 1-4, according to the utility model discloses a power module, including power module installation shell 1, power module installation shell 1 is inside to be equipped with power module fixed subassembly 2, and power module fixed subassembly 2 one side is equipped with intelligent radiator unit 3, and 3 one sides of intelligent radiator unit are equipped with dustproof subassembly 4.
Example one
As shown in fig. 1-4, for the intelligent heat dissipation assembly 3, the intelligent heat dissipation assembly 3 includes a power module body 301, a temperature sensor 302 is disposed on one side of the power module body 301, the temperature sensor 302 is mounted on the power module mounting housing 1 and connected thereto, a heat dissipation and conduction sheet 303 is attached to one side of the power module body 301, a refrigeration mounting housing 304 is disposed on one side of the heat dissipation and conduction sheet 303, a semiconductor chilling sheet 305 is disposed inside the refrigeration mounting housing 304, a cold end of the semiconductor chilling sheet 305 is connected to the heat dissipation and conduction sheet 303, a control device 306 is disposed on one side of the refrigeration mounting housing 304, the temperature sensor 302 and the semiconductor chilling sheet 305 are both electrically connected to the control device 306, the control device 306 is a single chip microcomputer controller of model MM32L0130, the single chip microcomputer controller is electrically connected to an external power source, a heat exchange tube 5 is disposed on one side of the refrigeration mounting housing 304, and the heat exchange tube 5 is connected to the refrigeration mounting housing 304.
Through the technical scheme, through setting up power module installation shell 1, thereby make power module installation shell 1 and reach the purpose of being convenient for install power module body 301, make refrigeration installation casing 304 reach the purpose of being convenient for install semiconductor refrigeration piece 305, temperature sensor 302 can detect the inside temperature of power module installation shell 1, thereby can change through the cold junction of controlling means 306 control semiconductor refrigeration piece 305 during the inside temperature variation of power module installation shell 1, thereby make the cold junction of semiconductor refrigeration piece 305 input the cold volume to heat dissipation conducting strip 303, thereby make heat dissipation conducting strip 303 carry out intelligent heat dissipation to power module body 301, make heat exchange tube 5 reach the purpose of being convenient for refrigeration semiconductor piece 305 hot junction and carrying out the heat dissipation with the external world.
Example two
As shown in fig. 1 to 4, for the dustproof assembly 4, the dustproof assembly 4 includes a heat dissipation mounting hole 401, a heat dissipation fan 402 is mounted inside the heat dissipation mounting hole 401, a dustproof filter screen 403 is mounted at an input end of the heat dissipation fan 402, air outlet holes 404 are symmetrically formed at two ends of the refrigeration mounting housing 304, a dust sensor 6 is disposed inside the power module mounting housing 1, and the dust sensor 6 and the heat dissipation fan 402 are electrically connected to the control device 306.
Through the technical scheme, through setting up heat dissipation mounting hole 401, thereby reach heat dissipation mounting hole 401 and be convenient for install cooling fan 402, thereby make cooling fan 402 can blow to power module installation shell 1 is inside, thereby make the dust can reach the purpose of venthole 404 air-out, make dustproof filter screen 403 reach the purpose of being convenient for the air inlet and filtering the dust, through setting up dust sensor 6, thereby be convenient for detect the purpose of the inside dust of power module installation shell 1, adjust cooling fan 402 through controlling means 306 to the purpose of wind speed.
EXAMPLE III
As shown in fig. 1-4, for the power module fixing assembly 2, the power module fixing assembly 2 includes a fixing screw 201, the fixing screw 201 is movably connected with the power module mounting housing 1, a threaded sleeve 202 is connected to the periphery of the fixing screw 201 through a thread, and a fixing frame 203 is connected to one side of the threaded sleeve 202.
Through the technical scheme, the fixing screw 201 is arranged, so that the fixing screw 201 can drive the threaded sleeve 202 to move, the threaded sleeve 202 can drive the fixing frame 203 to move, and the purpose of fixing the heat dissipation and heat conduction sheet 303 conveniently is achieved.
For the convenience of understanding the technical solution of the present invention, the following detailed description is made on the working principle or the operation mode of the present invention in the practical process.
The working principle is as follows: by setting the power module mounting case 1, thereby making the power module mounting case 1 and thus achieving the purpose of facilitating mounting the power module body 301, making the refrigeration mounting case 304 achieve the purpose of facilitating mounting the semiconductor chilling plate 305, the temperature sensor 302 can detect the temperature inside the power module mounting case 1, thereby making the cold end of the semiconductor chilling plate 305 controlled by the control device 306 to change when the temperature inside the power module mounting case 1 changes, thereby making the cold end of the semiconductor chilling plate 305 input the cold energy into the heat sink heat conduction plate 303, thereby making the heat sink heat conduction plate 303 perform intelligent heat dissipation on the power module body 301, making the heat exchange tube 5 achieve the purpose of facilitating heat dissipation of the hot end of the semiconductor chilling plate 305 and the outside, by setting the heat sink mounting hole 401, thereby achieving the purpose of facilitating mounting the heat sink fan 402, thereby making the heat sink fan 402 perform air blowing to the inside the power module mounting case 1, thereby making the dust achieve the purpose of air outlet hole 404, making the dust inlet air inlet achieve the purpose of facilitating dust filtration, by setting the dust sensor 6, thereby facilitating the heat sink screw 201 to move the screw 201 which is driven by the fixed screw 202, thereby facilitating the movement of the heat sink screw 202.
To sum up: the utility model discloses improved prior art, not only can dispel the heat to power module to improve the radiating effect of this device, can support power module tightly fixed, in practical practicality moreover, power module's heat dissipation can be so that power module's temperature is stable, and the heat-sinking capability improves, guarantees power module's temperature at its operating temperature scope, improves power module's life-span.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides a power module, its characterized in that includes power module installation shell (1), the inside fixed subassembly of power module (2) that is equipped with of power module installation shell (1), power module fixed subassembly (2) one side is equipped with intelligent radiator unit (3), intelligence radiator unit (3) one side is equipped with dustproof subassembly (4).
2. The power module according to claim 1, wherein the intelligent heat dissipation assembly (3) comprises a power module body (301), a temperature sensor (302) is arranged on one side of the power module body (301), the temperature sensor (302) is installed on the power module installation shell (1) and connected with the power module installation shell, a heat dissipation heat conduction sheet (303) is attached to one side of the power module body (301), a refrigeration installation shell (304) is arranged on one side of the heat dissipation heat conduction sheet (303), a semiconductor refrigeration sheet (305) is arranged inside the refrigeration installation shell (304), the cold end of the semiconductor refrigeration sheet (305) is connected with the heat dissipation heat conduction sheet (303), and a control device (306) is arranged on one side of the refrigeration installation shell (304).
3. A power supply module as claimed in claim 2, characterized in that the temperature sensor (302) and the semiconductor cooling plate (305) are electrically connected to the control device (306).
4. A power supply module according to claim 3, characterized in that the control device (306) is a model MM32L0130 one-chip microcomputer controller, and the one-chip microcomputer controller is electrically connected with an external power supply.
5. A power supply module according to claim 4, wherein the refrigerating installation case (304) is provided with a heat exchange pipe (5) at one side, and the heat exchange pipe (5) is connected with the refrigerating installation case (304).
6. The power module according to claim 5, wherein the dustproof assembly (4) comprises a heat dissipation mounting hole (401), a heat dissipation fan (402) is mounted in the heat dissipation mounting hole (401), a dustproof filter screen (403) is mounted at an input end of the heat dissipation fan (402), and air outlet holes (404) are symmetrically formed in two ends of the refrigeration mounting shell (304).
7. A power supply module according to claim 6, characterized in that a dust sensor (6) is arranged inside the power supply module mounting housing (1), and the dust sensor (6) and the heat dissipation fan (402) are electrically connected with the control device (306).
8. The power supply module according to claim 6, wherein the power supply module fixing component (2) comprises a fixing screw (201), the fixing screw (201) is movably connected with the power supply module mounting shell (1), a threaded sleeve (202) is connected to the periphery of the fixing screw (201) in a threaded manner, and a fixing frame (203) is connected to one side of the threaded sleeve (202).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222590026.9U CN218550512U (en) | 2022-09-29 | 2022-09-29 | Power supply module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222590026.9U CN218550512U (en) | 2022-09-29 | 2022-09-29 | Power supply module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218550512U true CN218550512U (en) | 2023-02-28 |
Family
ID=85274357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222590026.9U Active CN218550512U (en) | 2022-09-29 | 2022-09-29 | Power supply module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218550512U (en) |
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2022
- 2022-09-29 CN CN202222590026.9U patent/CN218550512U/en active Active
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