CN213816737U

CN213816737U - Microchannel semiconductor laser gas-liquid mixing refrigerating plant

Info

Publication number: CN213816737U
Application number: CN202022845177.5U
Authority: CN
Inventors: 王贞福; 李特
Original assignee: XiAn Institute of Optics and Precision Mechanics of CAS
Current assignee: XiAn Institute of Optics and Precision Mechanics of CAS
Priority date: 2020-11-30
Filing date: 2020-11-30
Publication date: 2021-07-27
Anticipated expiration: 2030-11-30

Abstract

The utility model provides a microchannel semiconductor laser gas-liquid mixture refrigerating plant. The device comprises a liquid refrigerant input pipeline, a high-speed airflow input pipeline and a mixing input pipeline; the input end of the high-speed airflow input pipeline is connected with a high-pressure air source, the output end of the high-speed airflow input pipeline and the output end of the liquid refrigerant input pipeline are communicated with the input end of the mixed input pipeline through a tee joint, the output end of the mixed input pipeline is communicated with the inlet pipeline of the microchannel heat sink, and the outlet pipeline of the microchannel heat sink is used for directly discharging a water-gas mixture; and the liquid refrigerant input pipeline and the high-speed airflow input pipeline are respectively provided with a first one-way valve and a second one-way valve. Utilize the utility model discloses, can obviously reduce laser chip's junction temperature, realize the higher peak output power of semiconductor laser.

Description

Microchannel semiconductor laser gas-liquid mixing refrigerating plant

Technical Field

The utility model relates to a microchannel semiconductor laser's refrigerating plant.

Background

The high-power semiconductor Laser (LD) and the array thereof are ideal laser sources in the fields of industry, medical treatment, basic research and the like, and have wide application. Semiconductor laser device development towards high average powerThe heat dissipation is the biggest problem that the generated heat power consumption is increased along with the increase of the injected current, the temperature rise of an active region caused by the heat power consumption can influence the performance parameters of the laser, the laser can be completely destroyed in serious conditions, the heat converted by the dissipated power can be effectively led out, and the problem of cooling and heat dissipation becomes one of key technologies which must be overcome for developing a high-power semiconductor laser. Currently, the electro-optic efficiency of high performance semiconductor lasers is about 50%, with the remainder of the energy being substantially converted to thermal energy. Therefore, the laser obtaining a certain energy is bound to generate about 1 time of heat energy, and in addition, a characteristic of heat generation in the high-power semiconductor laser is that the heat is very concentrated, and the heat with extremely high heat flux density is generated in a unit area or a volume (currently, the typical value is 1 multiplied by 10)⁷W/m²) Such heat and heat flux densities are surprising, as only efficient, low thermal resistance heat sinks/coolers (heat sinks for heat exchange between the laser heat source and the cooling fluid) are used to conduct concentrated heat away from the heat generating portion and only cause a reasonable temperature rise.

The microchannel cooling heat sink takes away heat quickly by forced convection when liquid flows through the microchannel, has strong heat dissipation capacity, is a main heat dissipation mode of the high-power semiconductor laser array chip at present, has a plurality of corresponding refrigeration systems/devices, mainly carries out various modification designs aiming at the inner wall structure and the integral assembly structure of the microchannel, and has higher requirements on the manufacturing process.

SUMMERY OF THE UTILITY MODEL

The utility model provides a microchannel semiconductor laser gas-liquid mixture refrigerating plant aims at improving microchannel semiconductor laser's refrigeration effect, and then improves microchannel semiconductor laser's output optical power.

In order to achieve the above object, the present invention provides the following solutions:

a gas-liquid mixing refrigerating device of a micro-channel semiconductor laser comprises a liquid refrigerant input pipeline, and is characterized by also comprising a high-speed airflow input pipeline and a mixing input pipeline; the input end of the high-speed airflow input pipeline is connected with a high-pressure air source, the output end of the high-speed airflow input pipeline and the output end of the liquid refrigerant input pipeline are communicated with the input end of the mixed input pipeline through a tee joint, the output end of the mixed input pipeline is communicated with the inlet pipeline of the microchannel heat sink, and the outlet pipeline of the microchannel heat sink is used for directly discharging a water-gas mixture; and the liquid refrigerant input pipeline and the high-speed airflow input pipeline are respectively provided with a first one-way valve and a second one-way valve.

Optionally, the liquid refrigerant is deionized water, absolute ethyl alcohol or heat-conducting silicone oil.

Optionally, the high pressure gas source employs air or nitrogen.

Optionally, for a single bar microchannel heat sink, the liquid refrigerant flow rate in the liquid refrigerant inlet line is 0.1-0.4L/min and the gas flow rate in the high velocity gas inlet line is 50-70L/min before the high velocity gas stream acts on the liquid refrigerant.

Further preferably, for a single bar microchannel heat sink, the liquid refrigerant flow in the liquid refrigerant input line is 0.2L/min and the gas flow in the high velocity gas input line is 60L/min.

Optionally, for a single bar microchannel heat sink, the inlet and outlet tubes of the microchannel heat sink are clear water tubes with a diameter of 10 mm.

Optionally, the high pressure air source is provided by an air compressor and is configured with an air pre-cooling system.

Optionally, a first flow valve, a liquid flowmeter, the first check valve, and a first pressure gauge are sequentially disposed on the liquid refrigerant input pipeline.

Optionally, a second flow valve, a gas flowmeter, the second one-way valve, and a second pressure gauge are disposed on the high-speed gas flow input pipeline.

Compared with the prior art, the utility model discloses following beneficial effect has:

the semiconductor laser device with the micro-channel packaging structure can be effectively cooled by carrying the deionized water through the high-speed gas, the two advantages of high flow rate of the gas and high heat conductivity coefficient of the deionized water are combined, the junction temperature of a laser chip can be obviously reduced, higher peak output power of the semiconductor laser is realized, and a new idea is provided for the application prospect of the micro-channel semiconductor laser.

Drawings

Fig. 1 is a schematic diagram of an embodiment of the present invention.

Fig. 2 shows control experimental data of an embodiment of the present invention.

The reference numbers illustrate:

1-liquid refrigerant input line;

2-high-speed airflow input pipeline;

3-a mixing input line;

4-liquid refrigerant supply system (pure water production system);

5-high pressure gas source (air compressor);

6-microchannel semiconductor laser (single bar or stacked array of multiple single bars);

101-a first flow valve; 102-a liquid flow meter; 103-a first one-way valve; 104-first pressure gauge.

201-a second flow valve; 202-a gas flow meter; 103-a second one-way valve; 104-second pressure gauge.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings by way of examples.

The microchannel structure can effectively dissipate heat of a semiconductor laser chip due to the capillary distribution of the channels, and is a packaging mode of a semiconductor laser with the highest heat dissipation efficiency at present, for example, deionized water (with a thermal conductivity coefficient of 0.6W/m × k) is adopted as a liquid refrigerant to perform circulating heat dissipation. However, deionized water depends on the circulation of a water cooler, and is influenced by pressure and flow, so that high-speed circulation heat dissipation of the microchannel packaged semiconductor laser is difficult to realize.

The embodiment provides a device for cooling a microchannel semiconductor laser by using high-speed gas carrying refrigerant, and although the thermal conductivity coefficient of air is low (0.026W/m × k), the device combines the advantages of high speed of high-speed gas and high thermal conductivity coefficient of deionized water, and performs a gas-liquid high-speed mixing type refrigeration mode on the microchannel packaging structure semiconductor laser by using the high-speed gas carrying liquid refrigerant, so that the heat dissipation efficiency can be effectively improved, and the output optical power of the microchannel packaging semiconductor laser can be further improved.

As shown in fig. 1, the high-speed gas and liquid refrigerants of the present embodiment are divided into two paths:

the first way is to provide deionized water through a pure water manufacturing system, the flow valve is used for controlling the water flow, the liquid flowmeter is used for monitoring the water flow of the pipeline, the one-way valve is used for avoiding the influence of compressed air on the water supply of the pure water manufacturing system, the pressure gauge is used for monitoring the pressure of the deionized water of the pipeline, the selection of the refrigerant is not limited to the deionized water, and the refrigerant with high heat conductivity coefficient can be selected, such as absolute ethyl alcohol, heat-conducting silicon oil and the like.

The second way is that high-speed gas is provided through an air compressor, the size of gas flow is controlled through a flow valve, a gas flow meter monitors the gas flow of a pipeline, a one-way valve prevents deionized water from flowing backwards to damage the air compressor, and a pressure gauge monitors the gas pressure of the pipeline.

For the microchannel heat sink of a single bar, the flow rate of the liquid refrigerant in the liquid refrigerant input pipeline is 0.1-0.4L/min before high-speed gas flow acts on the liquid refrigerant, and the flow rate of gas in the high-speed gas flow input pipeline is 50-70L/min. The inlet pipeline and the outlet pipeline of the microchannel heat sink are transparent water pipes with the diameter phi of 10 mm. If the laser stack array is adopted, the diameters of the inlet pipeline and the outlet pipeline of the microchannel heat sink are properly increased.

After the high-speed gas and the deionized water are mixed and enter the interior of the microchannel packaged semiconductor laser (the microchannel heat sink corresponding to each bar), the laser is efficiently radiated, and the water-gas mixture is directly discharged through an outlet pipeline of the microchannel heat sink.

The flow rate of the high-speed gas needs to be adjusted properly, and the effect of this embodiment is illustrated by the following control experiment:

the microchannel packaged semiconductor laser is tested at normal temperature, and under the quasi-continuous condition, the pulse width is 400 microseconds, the repetition frequency is 200Hz, and the duty ratio is 8%.

Control group: the traditional laser water chiller is used for heat dissipation, the flow of deionized water is 0.2L/min, and the peak power under the driving current of 500A is 550W.

In the first experimental group of this example:

the high-speed gas carries deionized water for heat dissipation, the flow rate of the high-speed gas is 60L/min, the flow rate of the deionized water is 0.2L/min, the peak power under the driving current of 500A is up to 563W, and the peak power is improved by 2.36 percent, so that the output optical power of the micro-channel semiconductor laser can be obviously improved by the heat dissipation mode that the high-speed gas carries a refrigerant under the condition.

Experimental group two of this example:

the heat dissipation mode of high-speed gas carrying deionized water is utilized, the flow rate of the high-speed gas is 50L/min, the flow rate of the deionized water is 0.1/min, the peak power under the driving current of 500A is about 558W, and the peak power is not changed greatly compared with a control group (the heat dissipation mode of a traditional laser water cooler is utilized).

Experimental group three of this example: the mode of radiating by using deionized water carried by high-speed gas is utilized, the flow rate of the high-speed gas is 20/min, the flow rate of the deionized water is 0.4/min, the peak power under the driving current of 500A is about 535W, and the peak power is reduced compared with a control group (the mode of radiating by using a traditional laser water cooler).

Therefore, the preferable flow rate range of the high-speed gas is about 60L/min by adopting the scheme of the embodiment.

The embodiment provides high-speed gas through the air compressor, utilizes the pure water manufacturing system to provide the deionized water refrigerant, carries the deionized water through high-speed gas and carries out effective heat dissipation to the semiconductor laser device of microchannel packaging structure, has combined two advantages of gaseous high velocity of flow and the high coefficient of thermal conductivity of deionized water, can obviously reduce the junction temperature of laser chip, realizes the higher peak output power of semiconductor laser.

Claims

1. A gas-liquid mixing refrigerating device of a micro-channel semiconductor laser comprises a liquid refrigerant input pipeline, and is characterized by also comprising a high-speed airflow input pipeline and a mixing input pipeline; the input end of the high-speed airflow input pipeline is connected with a high-pressure air source, the output end of the high-speed airflow input pipeline and the output end of the liquid refrigerant input pipeline are communicated with the input end of the mixed input pipeline through a tee joint, the output end of the mixed input pipeline is communicated with the inlet pipeline of the microchannel heat sink, and the outlet pipeline of the microchannel heat sink is used for directly discharging a water-gas mixture; and the liquid refrigerant input pipeline and the high-speed airflow input pipeline are respectively provided with a first one-way valve and a second one-way valve.

2. The gas-liquid mixing refrigerating device of the microchannel semiconductor laser as claimed in claim 1, wherein the liquid refrigerant is deionized water, absolute ethyl alcohol or heat-conducting silicone oil.

3. The micro-channel semiconductor laser gas-liquid mixing refrigerating device according to claim 1, wherein the high-pressure gas source adopts air or nitrogen.

4. A gas-liquid mixing refrigerating device of a microchannel semiconductor laser as claimed in claim 1, wherein for a single bar microchannel heat sink, the liquid refrigerant flow rate in the liquid refrigerant input pipeline is 0.1-0.4L/min, and the gas flow rate in the high-speed gas flow input pipeline is 50-70L/min.

5. The micro-channel semiconductor laser gas-liquid mixing refrigerating device as claimed in claim 4, wherein for a single bar micro-channel heat sink, the liquid refrigerant flow rate in the liquid refrigerant input pipeline is 0.2L/min, and the gas flow rate in the high-speed gas flow input pipeline is 60L/min.

6. The gas-liquid mixing and refrigerating device of the microchannel semiconductor laser as claimed in claim 4 or 5, wherein for the microchannel heat sink of a single bar, the inlet pipeline and the outlet pipeline of the microchannel heat sink are both water pipes with the diameter of 10 mm.

7. A micro-channel semiconductor laser gas-liquid mixing refrigerating device as claimed in claim 1, wherein the high pressure gas source is provided by an air compressor and is configured with an air pre-cooling system.

8. A gas-liquid mixing refrigerating device of a microchannel semiconductor laser as claimed in claim 1, wherein the liquid refrigerant input pipeline is provided with a first flow valve, a liquid flow meter, the first one-way valve and a first pressure gauge in sequence.

9. The gas-liquid mixing and refrigerating device of the microchannel semiconductor laser as claimed in claim 1, wherein the high-speed gas flow input pipeline is provided with a second flow valve, a gas flow meter, the second one-way valve and a second pressure gauge.