CN210470092U - Liquid cooling cold plate device - Google Patents
Liquid cooling cold plate device Download PDFInfo
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- CN210470092U CN210470092U CN201920942432.2U CN201920942432U CN210470092U CN 210470092 U CN210470092 U CN 210470092U CN 201920942432 U CN201920942432 U CN 201920942432U CN 210470092 U CN210470092 U CN 210470092U
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Abstract
The utility model provides a liquid cooling cold plate device, liquid cooling cold plate device includes: the micro-channel cold plate is used for radiating heat of the electronic system; at least 2 micro-channel groups arranged inside the micro-channel cold plate; the at least one liquid inlet is arranged on the micro-channel cold plate and used for flowing in cooling liquid; at least one liquid outlet arranged on the micro-channel cold plate and used for discharging cooling liquid; the cooling liquid entering the liquid inlet is divided into 1 cooling liquid branch; the coolant side stream traverses back and forth through the microchannel block. The utility model discloses a microchannel cold drawing combines together with microchannel group, has greatly improved the radiating efficiency, and the influence of thermal cascade around having reduced is favorable to realizing the high-efficient heat dissipation of electronic system.
Description
Technical Field
The utility model belongs to the technical field of the refrigeration, a cooling device is related to, especially relate to a liquid cooling cold plate device.
Background
With the development of electronic technology and the improvement of chip technology, the volume of an electronic component is smaller and smaller, and the amount of heat emitted per unit volume is also larger and larger. In order to maintain the normal operation of the electronic assembly, a good heat dissipation device is essential. At present, the mainstream server mainly depends on forced air cooling to dissipate heat of internal high-power consumption and high-temperature components, but with the increasing power consumption of electronic elements, the traditional forced air cooling mode cannot meet the heat dissipation specification requirement of a high-heat-density server, and the liquid cooling technology is gradually popularized in electronic systems and other application occasions as a novel heat dissipation solution and reflects the characteristics of high efficiency and economy. However, a plurality of heat sources often exist in an electronic system, the problem of thermal cascade among the plurality of heat sources is not considered in the heat dissipation process of the conventional liquid cooling device, and the thermal cascade can cause the reduction of the heat dissipation efficiency on one hand and also cause the imbalance of the temperature among different electronic components on the other hand, thereby greatly affecting the performance of the whole system.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned shortcomings of the prior art, it is an object of the present invention to provide a liquid-cooled cold plate apparatus for solving the problem of the prior art that does not consider thermal cascading.
In order to achieve the above objects and other related objects, the present invention provides a liquid cooling plate device, which comprises: the micro-channel cold plate is used for radiating heat of the electronic system; at least 2 micro-channel groups arranged inside the micro-channel cold plate; the at least one liquid inlet is arranged on the micro-channel cold plate and used for flowing in cooling liquid; at least one liquid outlet arranged on the micro-channel cold plate and used for discharging cooling liquid; the cooling liquid entering the liquid inlet is divided into 1 cooling liquid branch; the coolant side stream traverses back and forth through the microchannel block.
In an embodiment of the present invention, the micro-channel set is disposed inside the micro-channel cold plate and corresponding to the heat source.
In an embodiment of the present invention, the liquid cooling device further includes: the cooling unit is arranged between the liquid outlet and the liquid inlet and is used for cooling the cooling liquid; the water outlet pipeline is arranged between the liquid outlet and the cooling unit and used for conveying the cooling liquid flowing out of the liquid outlet to the cooling unit; and the water inlet pipeline is arranged between the liquid inlet and the cooling unit and used for conveying the cooling liquid cooled by the cooling unit to the liquid inlet.
The utility model also provides a liquid cooling cold plate device, liquid cooling cold plate device includes: the micro-channel cold plate is used for radiating heat of the electronic system; at least 2 micro-channel groups arranged inside the micro-channel cold plate; the at least one liquid inlet is arranged on the micro-channel cold plate and used for flowing in cooling liquid; at least one liquid outlet arranged on the micro-channel cold plate and used for discharging cooling liquid; the cooling liquid entering the liquid inlet is divided into at least 2 sub-streams of cooling liquid; the flow path of the coolant liquid substream passes through only 1 microchannel group; the coolant substream passes unidirectionally through the group of microchannels.
In an embodiment of the present invention, the micro-channel set is disposed inside the micro-channel cold plate and corresponding to the heat source.
In an embodiment of the present invention, the liquid cooling device further includes: the cooling unit is arranged between the liquid outlet and the liquid inlet and is used for cooling the cooling liquid; the water outlet pipeline is arranged between the liquid outlet and the cooling unit and used for conveying the cooling liquid flowing out of the liquid outlet to the cooling unit; and the water inlet pipeline is arranged between the liquid inlet and the cooling unit and used for conveying the cooling liquid cooled by the cooling unit to the liquid inlet.
The utility model also provides a liquid cooling cold plate device, liquid cooling cold plate device includes: the micro-channel cold plate is used for radiating heat of the electronic system; at least 2 micro-channel groups arranged inside the micro-channel cold plate; the at least one liquid inlet is arranged on the micro-channel cold plate and used for flowing in cooling liquid; at least one liquid outlet arranged on the micro-channel cold plate and used for discharging cooling liquid; the cooling liquid entering the liquid inlet is divided into at least 2 sub-streams of cooling liquid; the flow path of the coolant liquid substream passes through at least 1 microchannel group; at least 1 said coolant substream is passed back and forth across at least 1 microchannel group.
In an embodiment of the present invention, the micro-channel set is disposed inside the micro-channel cold plate and corresponding to the heat source.
In an embodiment of the present invention, the liquid cooling device further includes: the cooling unit is arranged between the liquid outlet and the liquid inlet and is used for cooling the cooling liquid; the water outlet pipeline is arranged between the liquid outlet and the cooling unit and used for conveying the cooling liquid flowing out of the liquid outlet to the cooling unit; and the water inlet pipeline is arranged between the liquid inlet and the cooling unit and used for conveying the cooling liquid cooled by the cooling unit to the liquid inlet.
In an embodiment of the present invention, the liquid cooling device further includes: the quick connector is arranged between the liquid outlet and the water outlet pipeline or/and between the liquid inlet and the water inlet pipeline.
In an embodiment of the present invention, the water inlet pipeline includes a main water inlet pipeline and a branch water inlet pipeline; one end of the water inlet main pipeline is connected with the cooling unit, and the other end of the water inlet main pipeline is connected with at least one water inlet branch pipeline; one end of the water inlet branch pipeline is connected with the water inlet main pipeline, and the other end of the water inlet branch pipeline is connected with the liquid inlet.
In an embodiment of the present invention, the water outlet pipeline includes a main water outlet pipeline and a branch water outlet pipeline; one end of the water outlet main pipeline is connected with at least one water outlet branch pipeline, and the other end of the water outlet main pipeline is connected with the cooling unit; one end of the water outlet branch pipeline is connected with the water outlet main pipeline, and the other end of the water outlet branch pipeline is connected with the liquid outlet.
In an embodiment of the present invention, the liquid cooling device is in contact with the electronic system through the heat conducting material pad.
In an embodiment of the present invention, the liquid cooling device is welded by brazing between different parts.
In an embodiment of the utility model, the liquid cooling cold plate device adopts the fix with screw mode to fix, the screw can utilize original hole site on the electronic system.
As described above, the utility model discloses a liquid cooling cold plate device has following beneficial effect:
the utility model adopts the combination of the micro-channel cold plate and the micro-channel group, thereby greatly improving the heat dissipation efficiency, and properly increasing the area of the micro-channel for the heat source with large area to improve the heat dissipation effect; the cooling liquid is divided into at least 1 branch cooling liquid in the microchannel cold plate and flows through the microchannel group according to respective flow paths, so that the influence of front and back thermal cascade is reduced, wherein the number and the flow paths of the branch cooling liquid and the flow rate of the cooling liquid in each branch are limited by the structure in the microchannel cold plate; different parts of the liquid cooling plate device are welded by adopting a copper welding technology, so that the risk of liquid leakage at the joint of the parts is reduced; the liquid cooling cold plate device is fixed in a screw fixing mode, original hole positions on the electronic system can be utilized by screws, and layout change of the original electronic system is less.
Drawings
Fig. 1 is a schematic structural view of a liquid cooling device according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view taken along line a-a of fig. 1.
Fig. 3 is a schematic structural view of a liquid cooling device according to another embodiment of the present invention.
Fig. 4 is a schematic structural view of a liquid cooling device according to another embodiment of the present invention.
Fig. 5 is a schematic structural view of a liquid cooling device according to another embodiment of the present invention.
Fig. 6 is a schematic structural view of a liquid cooling device according to another embodiment of the present invention.
Description of the element reference numerals
100 micro-channel cold plate
200 micro-channel set
211 first group of microchannels
212 second group of microchannels
221 first group of microchannels
222 second microchannel group
223 third group of microchannels
224 fourth microchannel group
225 fifth group of microchannels
231 first microchannel group
232 second group of microchannels
241 first microchannel group
242 second group of microchannels
243 third micro-channel group
251 first group of microchannels
252 second microchannel group
600 baffle
700 coolant circulation module
710 branch water inlet pipe
720 water inlet main pipeline
730 cooling unit
740 water outlet main pipe
750 water outlet branch pipeline
800 water inlet
900 water outlet
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, amount and ratio of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.
In order to maintain the normal operation of the electronic assembly, a good heat dissipation device is essential. In recent years, liquid cooling technology has been increasingly regarded as a novel heat dissipation scheme. However, the existing liquid cooling scheme has the problems of low heat dissipation efficiency and no consideration of thermal cascade, and restricts the application and development of the liquid cooling technology. To these problems, the utility model provides a liquid cooling cold plate device, liquid cooling cold plate device includes: the micro-channel cold plate is used for radiating heat of the electronic system; at least 2 micro-channel groups arranged inside the micro-channel cold plate; the at least one liquid inlet is arranged on the micro-channel cold plate and used for flowing in cooling liquid; at least one liquid outlet arranged on the micro-channel cold plate and used for discharging cooling liquid; the cooling liquid entering the liquid inlet is divided into at least one cooling liquid branch; if the flow path of the coolant substream passes through only 1 microchannel group, the coolant substream passes through the microchannel groups unidirectionally or reciprocally; if the flow path of the coolant substream passes through at least 2 microchannel groups, the coolant substream traverses back and forth through the at least 2 microchannel groups.
The utility model provides a basic principle of liquid cooling cold drawing device does: the cooling liquid enters the interior of the micro-channel cold plate through the liquid inlet, and then at least one branch flow of the cooling liquid flows through the micro-channel group according to the internal structure of the micro-channel cold plate. The micro-channel cold plate is in contact with a heat source in an electronic system through a heat conducting material pad, when a cooling liquid in the micro-channel group flows through the heat source and the cooling liquid, heat exchange is generated through the heat conducting material pad, the temperature of the cooling liquid is increased after the cooling liquid absorbs heat generated by the heat source, and the temperature of the heat source is reduced due to the fact that the heat is absorbed by the cooling liquid. When the cooling liquid continuously flows through the micro-channel group, the heat generated by the heat source is continuously taken away, so that the aim of reducing the temperature of the heat source is fulfilled. Particularly, the area of the micro-channel can be properly increased for a heat source with a large area so as to improve the heat dissipation effect.
In addition, to reduce the problem of thermal cascading between multiple heat sources, the coolant is divided into multiple coolant sub-streams and flows along respective paths, with the number, flow paths, and coolant flow rates of the coolant sub-streams being defined by the internal structure of the microchannel cold plate. The coolant side stream may flow through all of the microchannels in a given microchannel group or may flow through some of the microchannels in that microchannel group, both of which are referred to herein as coolant streams flowing through the microchannel group. The coolant substream may flow through the microchannel group in one direction, in a manner known as one-way crossing. The cooling fluid may also flow through some of the microchannels in the microchannel set before flowing through some of the microchannels in the microchannel set, in a manner known as a shuttle.
The utility model discloses in, can be through optimizing the inner structure of microchannel cold drawing is injectd quantity, flow path and the coolant liquid flow of coolant liquid tributary, and then reach the reinforcing heat dissipation and reduce the cascaded purpose of heat.
In one embodiment of the present invention, the coolant is divided into 1 coolant branch; the coolant side stream traverses back and forth through the microchannel block.
Fig. 1 is a schematic view of a liquid cooling cold plate device according to the present invention.
In this embodiment, the liquid cooling device includes: the micro-channel cold plate comprises a micro-channel cold plate 100, a liquid inlet 800, a liquid outlet 900, a micro-channel group 200 (comprising a first micro-channel group 211 and a first micro-channel group 212), a connecting copper pipe 400, a baffle 600 and a quick connector 500 (comprising a quick water inlet connector 510 and a quick water outlet connector 520). Fig. 2 is a cross-sectional view taken along line a-a of fig. 1, and as can be seen from fig. 1 and 2, the microchannel cold plate is in contact with a heat source through a pad 300 of a heat conductive material, and microchannel groups are respectively disposed inside the microchannel cold plate at positions corresponding to the heat source.
In this embodiment, the coolant is divided into 1 coolant substream (i.e., not split), and the coolant is passed through the microchannel group in a back-and-forth manner.
In this embodiment, each of the microchannel groups includes a forward microchannel and a reverse microchannel, and preferably, the number of the forward microchannels and the number of the reverse microchannels are the same.
In the present embodiment, the cooling liquid flows in the direction indicated by the arrow in fig. 1, and the specific flow paths are as follows:
1) the cooling liquid enters the connecting copper pipe 400 from the quick water inlet joint 510, then flows through the water inlet 800 and enters the micro-channel cold plate 100; thereafter split into 1 coolant substream, which 1 coolant substream first flows through the forward microchannels in the first microchannel group 211;
2) the 1 coolant side stream flows out of the forward microchannel of the first microchannel group 211 to the second microchannel group 212;
3) the 1 substream of coolant flows into the forward microchannels of the second microchannel group 212, then out of the forward microchannels in the second microchannel group 212, and then into the reverse microchannels of the second microchannel group 212;
4) the 1 coolant side stream flows out of the reverse microchannel of the second microchannel group 212 to the first microchannel group 211;
5) the 1 substream of coolant flows into the reverse microchannels of the first microchannel group 211 and then out of the reverse microchannels in the first microchannel group 211; then flows out of the liquid cooling cold plate device after sequentially flowing through the water outlet 900, the connecting copper pipe 400 and the quick water outlet joint 520.
In this embodiment, when the temperature of the cooling liquid in the first micro-channel set 211 is lower than the first heat source temperature, the first heat source temperature will decrease due to the heat exchange between the two; when the temperature of the coolant in the second microchannel group 212 is lower than the second heat source temperature, the second heat source temperature is lowered due to heat exchange therebetween. Therefore, as long as the temperature of the cooling liquid in the micro-channel set is lower than the temperature of the corresponding heat source, the liquid cooling cold plate device can effectively reduce the temperature of the heat source so as to achieve the purpose of heat dissipation.
In this embodiment, the temperature of the cooling liquid increases due to heat absorption at ②, ④, ⑥, ⑧, and decreases due to self-heat dissipation at ③, ⑤, ⑦, ⑨.
① below temperature ②;
② is higher than ③;
③ below temperature ④;
④ is higher than ⑤;
⑤ below temperature ⑥;
⑥ is higher than ⑦;
⑦ below temperature ⑧;
the temperature at ⑧ is higher than the temperature at ⑨.
The temperature of the first heat source is determined by the temperature of the cooling liquid at ② and ⑧, and the temperature of the second heat source is determined by the temperature of the cooling liquid at ④ and ⑥. since the temperature at ② is lower than ④ and the temperature at ⑥ is lower than ⑧, the temperature of the first heat source is not greatly different from the temperature of the second heat source.
In one embodiment of the present invention, the coolant is divided into at least 2 coolant streams; each of the coolant substreams passes unidirectionally through 1 microchannel group.
Fig. 3 is a schematic view of the liquid cooling cold plate device according to the present invention.
In this embodiment, the liquid cooling device includes: the micro-channel cold plate comprises a micro-channel cold plate 100, 3 liquid inlets 800, 3 liquid outlets 900, a micro-channel group (comprising a first micro-channel group 221, a second micro-channel group 222, a third micro-channel group 223, a fourth micro-channel group 224 and a fifth micro-channel group 225), a connecting copper pipe 400, a baffle 600 and a quick connector 500 (comprising a quick water inlet connector 510 and a quick water outlet connector 520), wherein the micro-channel cold plate is in contact with a heat source through a heat conducting material pad, and the micro-channel cold plate is internally provided with the micro-channel group corresponding to the heat source respectively.
In this embodiment, the coolant is divided into 5 coolant streams, each of which passes unidirectionally through one of the microchannel groups.
In this embodiment, each microchannel group includes only forward microchannels. Preferably, the number of forward microchannels is the number of microchannels contained in the entire microchannel group.
In this embodiment, the coolant flows in the direction indicated by the arrow in fig. 3:
the cooling liquid flows through the quick water inlet joint 510, the connecting copper pipe 400 and the water inlet 800 in sequence and then enters the micro-channel cold plate 100; thereafter the cooling liquid is divided into 5 substreams of the cooling liquid;
wherein 1 coolant branch flows through the first microchannel set 221 and then flows out of the water outlet 900, and flows through the connecting copper pipe 400 and the quick water outlet joint 520 in sequence and then flows out of the liquid cooling plate device;
wherein 1 coolant branch flows through the second microchannel set 222 and then flows out of the water outlet 900, and flows through the connecting copper pipe 400 and the quick water outlet joint 520 in sequence and then flows out of the liquid cooling plate device;
wherein 1 coolant branch flows through the third micro-channel group 223 and then flows out of the water outlet 900, and flows through the connecting copper pipe 400 and the quick water outlet joint 520 in sequence and then flows out of the liquid cooling plate device;
wherein 1 coolant branch flows through the fourth micro-channel set 224 and then flows out of the water outlet 900, and flows through the connecting copper pipe 400 and the quick water outlet joint 520 in sequence and then flows out of the liquid cooling plate device;
wherein 1 coolant branch flows through the fifth micro-channel set 225 and then flows out of the water outlet 900, and flows through the connecting copper pipe 400 and the quick water outlet joint 520 in sequence and then flows out of the liquid cooling plate device.
In one embodiment of the present invention, the coolant is divided into at least 2 coolant streams; the flow path of the coolant liquid substream passes through at least 1 microchannel group; at least 1 said coolant substream is passed back and forth across at least 1 microchannel group.
Fig. 4 is a schematic view of the liquid cooling cold plate device according to the present invention.
In this embodiment, the liquid cooling device includes: the micro-channel cold plate comprises a micro-channel cold plate 100, a liquid inlet 800, a liquid outlet 900, a micro-channel group (comprising a first micro-channel group 231 and a second micro-channel group 232), a connecting copper pipe 400, a baffle 600 and a quick connector 500 (comprising a quick water inlet connector 510 and a quick water outlet connector 520), wherein the micro-channel cold plate is in contact with a heat source through a heat conducting material pad.
In this embodiment, the coolant is divided into 2 coolant sub-streams that traverse the microchannel group in a back-and-forth manner.
In this embodiment, each microchannel group includes a forward microchannel and a reverse microchannel, and preferably, the number of the forward microchannels and the number of the reverse microchannels are the same.
In this embodiment, the coolant flows in the direction indicated by the arrow in fig. 4:
the cooling liquid flows through the quick water inlet joint 510, the connecting copper pipe 400 and the water inlet 800 in sequence and then enters the micro-channel cold plate 100; thereafter the cooling liquid is divided into 2 substreams of the cooling liquid;
wherein 1 coolant branch flows through the forward micro channel in the first micro channel group 231, then flows out of the forward micro channel in the first micro channel group 231, then flows into the reverse micro channel in the first micro channel group 231, then flows out of the reverse micro channel in the first micro channel group 231, and flows out of the liquid cooling cold plate device after passing through the water outlet 900, and then sequentially flows through the connecting copper pipe 400 and the quick water outlet connector 520;
wherein 1 coolant liquid tributary flows through the forward microchannel in the second microchannel group 232, then flows out the forward microchannel in the second microchannel group 232, then flows into the reverse microchannel in the second microchannel group 232, then flows out the reverse microchannel in the second microchannel group 232, and flows out the liquid cooling cold plate device after passing through the water outlet 900 and flowing through the connecting copper pipe 400 and the quick water outlet joint 520 in sequence.
In one embodiment of the present invention, the coolant is divided into at least 2 coolant streams; at least 1 said coolant substream is passed back and forth across at least 1 microchannel group, and at least 1 said coolant substream is passed unidirectionally across 1 microchannel group.
Fig. 5 is a schematic view of the liquid cooling cold plate device according to the present invention.
In this embodiment, the liquid cooling device includes: the micro-channel cold plate comprises a micro-channel cold plate 100, 1 liquid inlet 800, 2 liquid outlets 900, a micro-channel group (comprising a first micro-channel group 241, a second micro-channel group 242 and a third micro-channel group 243), a connecting copper pipe 400, a baffle 600 and a quick connector 500 (comprising a quick water inlet connector 510 and a quick water outlet connector 520), wherein the micro-channel cold plate is in contact with a heat source through a heat conducting material pad.
In this embodiment, the coolant is divided into 2 coolant streams, wherein 1 of the coolant streams traverses the second microchannel group 242 and the first microchannel group 241, and the other 1 of the coolant streams traverses the third microchannel group 243.
In this embodiment, the first microchannel set 241 includes a forward microchannel and a reverse microchannel, and preferably, the number of the forward microchannels is the same as that of the reverse microchannels. The second microchannel group 242 includes forward microchannels and reverse microchannels, and preferably, the forward microchannels and the reverse microchannels are the same in number. The third microchannel group 243 includes only forward microchannels, and preferably, the number of forward microchannels is the number of microchannels included in the entire microchannel group.
In this embodiment, the coolant flows in the direction indicated by the arrow in fig. 5:
the cooling liquid flows through the quick water inlet joint 510, the connecting copper pipe 400 and the water inlet 800 in sequence and then enters the micro-channel cold plate 100; thereafter the cooling liquid is divided into 2 substreams of the cooling liquid;
wherein 1 coolant tributaries flow through the forward microchannels in the second microchannel group 242, then flow through the forward microchannels in the first microchannel group 241, then flow through the reverse microchannels in the second microchannel group 242, and flow through the connecting copper pipe 400 and the quick water outlet joint 520 in sequence after passing through the water outlet 900 and then flow out of the liquid cooling cold plate apparatus;
the other 1 branch flow of the cooling liquid flows through the third micro-channel group 243 in a single direction, passes through the water outlet 900, sequentially flows through the connecting copper pipe 400 and the quick water outlet joint 520, and then flows out of the liquid cooling cold plate device.
Fig. 6 is a schematic view of a liquid-cooled cold plate apparatus according to another embodiment of the present invention.
In this embodiment, the liquid cooling device includes: the micro-channel cooling plate comprises a micro-channel cooling plate 100, a liquid inlet 800, a liquid outlet 900, a micro-channel group 200 (comprising a first micro-channel group 251 and a second micro-channel group 252), a connecting copper pipe 400, a baffle 600, a quick connector 500 (comprising a quick water inlet connector 510 and a quick water outlet connector 520), and a cooling liquid circulation module 700 (comprising a water inlet branch pipe 710, a water inlet main pipe 720, a cooling unit 730, a water outlet main pipe 740 and a water outlet branch pipe 750). The microchannel cold plate is in contact with a heat source through a heat conducting material pad.
In this embodiment, the coolant is divided into 1 coolant substream (i.e., not split), and the coolant is passed through the microchannel group in a back-and-forth manner.
In this embodiment, each microchannel group includes a forward microchannel and a reverse microchannel, and preferably, the number of the forward microchannels and the number of the reverse microchannels are the same.
In the present embodiment, the cooling liquid flows in the direction indicated by the arrow in fig. 6, and the specific flow paths are:
the cooling liquid flows through the quick water inlet joint 510, the connecting copper pipe 400 and the water inlet 800 in sequence and then enters the micro-channel cold plate 100; thereafter the coolant is divided into 1 of the coolant substreams (i.e., not split);
the coolant substream flows sequentially through the forward microchannels in the first microchannel group 251, the forward microchannels in the second microchannel group 252, the reverse microchannels in the second microchannel group 252, and the reverse microchannels in the first microchannel group 251;
the coolant branch flows through the water outlet 900, then sequentially flows through the connecting copper pipe 400 and the quick water outlet joint 520, flows into the water outlet branch pipes 750 in the coolant circulation module 700, and then the coolant in at least one of the water outlet branch pipes 750 is converged in the water outlet main pipe 740 and flows into the cooling unit 730; the cooling fluid flows into the main water inlet pipe 720 after being cooled in the cooling unit 730, then is divided into at least one branch water inlet pipe 720, finally flows out of the cooling fluid circulation module 700, then enters the quick water inlet joint 510, flows through the connecting copper pipe 400 and the water inlet 800, and then enters the micro-channel cold plate 100, and continues to participate in the heat dissipation and cooling process of the heat source. The embodiment realizes the recycling of the cooling liquid.
Liquid cold drawing device include but not limited to the structure of the liquid cold drawing device that above-mentioned embodiment enumerated, all according to the utility model discloses a prior art's that the principle was done structure warp and replacement, all include the utility model discloses a within the scope of protection.
The utility model adopts the combination of the micro-channel cold plate and the micro-channel group, thus greatly improving the heat dissipation efficiency; the cooling liquid is divided into at least 1 branch cooling liquid in the microchannel cold plate and flows through the microchannel group according to respective flow paths, so that the influence of front and rear thermal cascade is reduced; different parts of the liquid cooling plate device are welded by adopting a copper welding technology, so that the risk of liquid leakage at the joint of the parts is reduced; the liquid cooling cold plate device is fixed in a screw fixing mode, original hole positions on the electronic system can be utilized by screws, and layout change of the original electronic system is less. Furthermore, the utility model discloses an indirect liquid cooling mode, coolant liquid and heat dissipation object separation, heat transfer that gives off electronic device through liquid cooling board or other heat transfer parts gives the coolant liquid, and its main advantage lies in not high to the requirement of refrigerant to need not carry out great change to original electronic system, the maintenance cost and the degree of difficulty in later stage are lower. Therefore, the utility model discloses effectively overcome all kinds of defects among the prior art, possessed high industry value.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (15)
1. The utility model provides a liquid cooling cold plate device which characterized in that, liquid cooling cold plate device includes:
the micro-channel cold plate is used for radiating heat of the electronic system;
at least 2 micro-channel groups arranged inside the micro-channel cold plate;
the at least one liquid inlet is arranged on the micro-channel cold plate and used for flowing in cooling liquid;
at least one liquid outlet arranged on the micro-channel cold plate and used for discharging cooling liquid;
the cooling liquid entering the liquid inlet is divided into 1 cooling liquid branch;
the coolant side stream traverses back and forth through the microchannel block.
2. The liquid-cooled cold plate apparatus of claim 1, wherein said microchannel cold plate has respective microchannel groups disposed therein at locations corresponding to a heat source.
3. The liquid cold plate device of claim 1, further comprising:
the cooling unit is arranged between the liquid outlet and the liquid inlet and is used for cooling the cooling liquid;
the water outlet pipeline is arranged between the liquid outlet and the cooling unit and used for conveying the cooling liquid flowing out of the liquid outlet to the cooling unit;
and the water inlet pipeline is arranged between the liquid inlet and the cooling unit and used for conveying the cooling liquid cooled by the cooling unit to the liquid inlet.
4. The utility model provides a liquid cooling cold plate device which characterized in that, liquid cooling cold plate device includes:
the micro-channel cold plate is used for radiating heat of the electronic system;
at least 2 micro-channel groups arranged inside the micro-channel cold plate;
the at least one liquid inlet is arranged on the micro-channel cold plate and used for flowing in cooling liquid;
at least one liquid outlet arranged on the micro-channel cold plate and used for discharging cooling liquid;
the cooling liquid entering the liquid inlet is divided into at least 2 sub-streams of cooling liquid;
the flow path of the coolant liquid substream passes through only 1 microchannel group; the coolant substream passes unidirectionally through the group of microchannels.
5. The liquid cooling cold plate apparatus of claim 4, wherein said microchannel cold plate is provided with respective sets of microchannels at locations corresponding to heat sources.
6. The liquid cold plate device of claim 4, further comprising:
the cooling unit is arranged between the liquid outlet and the liquid inlet and is used for cooling the cooling liquid;
the water outlet pipeline is arranged between the liquid outlet and the cooling unit and used for conveying the cooling liquid flowing out of the liquid outlet to the cooling unit;
and the water inlet pipeline is arranged between the liquid inlet and the cooling unit and used for conveying the cooling liquid cooled by the cooling unit to the liquid inlet.
7. The utility model provides a liquid cooling cold plate device which characterized in that, liquid cooling cold plate device includes:
the micro-channel cold plate is used for radiating heat of the electronic system;
at least 2 micro-channel groups arranged inside the micro-channel cold plate;
the at least one liquid inlet is arranged on the micro-channel cold plate and used for flowing in cooling liquid;
at least one liquid outlet arranged on the micro-channel cold plate and used for discharging cooling liquid;
the cooling liquid entering the liquid inlet is divided into at least 2 sub-streams of cooling liquid;
the flow path of the coolant liquid substream passes through at least 1 microchannel group; at least 1 said coolant substream is passed back and forth across at least 1 microchannel group.
8. The liquid cooling cold plate apparatus of claim 7, wherein said microchannel cold plate is provided with respective sets of microchannels therein at locations corresponding to a source of heat.
9. The liquid cold plate device of claim 7, further comprising:
the cooling unit is arranged between the liquid outlet and the liquid inlet and is used for cooling the cooling liquid;
the water outlet pipeline is arranged between the liquid outlet and the cooling unit and used for conveying the cooling liquid flowing out of the liquid outlet to the cooling unit;
and the water inlet pipeline is arranged between the liquid inlet and the cooling unit and used for conveying the cooling liquid cooled by the cooling unit to the liquid inlet.
10. The liquid cold plate device of claim 9, further comprising:
the quick connector is arranged between the liquid outlet and the water outlet pipeline or/and between the liquid inlet and the water inlet pipeline.
11. The liquid cold plate apparatus of claim 9, wherein the water inlet conduit comprises a water inlet main conduit and a water inlet branch conduit; one end of the water inlet main pipeline is connected with the cooling unit, and the other end of the water inlet main pipeline is connected with at least one water inlet branch pipeline; one end of the water inlet branch pipeline is connected with the water inlet main pipeline, and the other end of the water inlet branch pipeline is connected with the liquid inlet.
12. The liquid cold plate apparatus of claim 9, wherein the water outlet conduit comprises a main water outlet conduit and a branch water outlet conduit; one end of the water outlet main pipeline is connected with at least one water outlet branch pipeline, and the other end of the water outlet main pipeline is connected with the cooling unit; one end of the water outlet branch pipeline is connected with the water outlet main pipeline, and the other end of the water outlet branch pipeline is connected with the liquid outlet.
13. The liquid cold plate device of claim 7, wherein said liquid cold plate device is in contact with said electronic system through a pad of thermally conductive material.
14. The liquid cold plate device of claim 7, wherein different parts of said liquid cold plate device are welded together using brazing.
15. The liquid-cooled cold plate apparatus of claim 7, wherein said liquid-cooled cold plate apparatus is secured by screws that utilize existing holes in said electronic system.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920942432.2U CN210470092U (en) | 2019-06-21 | 2019-06-21 | Liquid cooling cold plate device |
| US16/871,050 US11291136B2 (en) | 2019-06-21 | 2020-05-11 | Liquid-cooled cold plate device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920942432.2U CN210470092U (en) | 2019-06-21 | 2019-06-21 | Liquid cooling cold plate device |
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| CN210470092U true CN210470092U (en) | 2020-05-05 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110351980A (en) * | 2019-06-21 | 2019-10-18 | 加弘科技咨询(上海)有限公司 | A kind of liquid cold plate device |
| CN114126332A (en) * | 2020-08-26 | 2022-03-01 | 广东美的暖通设备有限公司 | Air conditioning system |
-
2019
- 2019-06-21 CN CN201920942432.2U patent/CN210470092U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110351980A (en) * | 2019-06-21 | 2019-10-18 | 加弘科技咨询(上海)有限公司 | A kind of liquid cold plate device |
| CN114126332A (en) * | 2020-08-26 | 2022-03-01 | 广东美的暖通设备有限公司 | Air conditioning system |
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