CN111911892A - Composite heat dissipation device adopting composite phase change material and micro-channel liquid cooling - Google Patents

Composite heat dissipation device adopting composite phase change material and micro-channel liquid cooling Download PDF

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CN111911892A
CN111911892A CN202010661909.7A CN202010661909A CN111911892A CN 111911892 A CN111911892 A CN 111911892A CN 202010661909 A CN202010661909 A CN 202010661909A CN 111911892 A CN111911892 A CN 111911892A
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flow channel
liquid
heat
cooling
phase change
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徐尚龙
周川翔
徐冲
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University of Electronic Science and Technology of China
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University of Electronic Science and Technology of China
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/57—Cooling arrangements using liquid coolants characterised by control arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model provides an adopt compound heat abstractor of compound phase change material and microchannel liquid cooling, relates to cold heat dissipation field, is the heat abstractor who adopts phase change material and liquid cooling to combine particularly. The heat dissipating double-fuselage includes: the phase change material heat radiator comprises a phase change area cover plate, a phase change material, a heat radiator and a liquid cooling area cover plate, wherein the heat radiator is of a plate-shaped structure, one side of the heat radiator is provided with a depressed area for placing the phase change material, and the other side, corresponding to the depressed area, of the heat radiator is provided with a micro channel; the phase-change material is packaged by adopting a phase-change area cover plate, the micro flow channel is packaged by adopting a liquid-cooling area cover plate, and the side, which is not packaged, of the liquid-cooling area cover plate is provided with a liquid injection port and a liquid outlet of cooling liquid; the heat source is arranged on the side, which is not packaged, of the phase change area cover plate; the heat radiator is characterized in that a plurality of columnar bulges made of foamed aluminum materials are arranged in the sunken area of the heat radiator in an array mode, a phase-change material fills gaps among the columnar bulges in the sunken area, and a circle of sealing groove is formed in the outer side of the sunken area. The heat dissipation device has the advantages of uniform heat dissipation and high heat dissipation efficiency.

Description

Composite heat dissipation device adopting composite phase change material and micro-channel liquid cooling
Technical Field
The invention relates to the field of cold heat dissipation, in particular to a heat dissipation device combining phase change materials and liquid cooling.
Background
A light Emitting diode (led), which is a solid semiconductor device that can directly convert electricity into light. With the gradual maturity of LED technology, its advantages of energy saving, low cost, ultra-long life, good durability, small element size, fast response speed, low brightness decay, etc. begin to draw attention. Therefore, LED lamps are also used more and more widely in various industries. At present, the LED is widely applied to places needing high lighting efficiency, such as street lamp lighting, wharf lighting, mine lighting and the like.
With the reduction of size, the great increase of power and the limitation of the current processing technology, when the LED light source is in a working state, the high-power LED can only convert 10-20% of input power into light energy, and the rest 80-90% of the input power is converted into heat energy. Because it is in a relatively closed and narrow-space environment. If the heat can not be timely and effectively dissipated, the temperature of the LED chip can be rapidly increased, the temperature has great influence on the working performance of the LED chip, the high temperature can lead to the reduction of emitted photons of the chip, the quality of color temperature is reduced, the aging of the chip is accelerated, the service life of a device is shortened, and other serious consequences are caused. Meanwhile, fog is generated inside the lamp at a high temperature, and the lighting effect is affected.
Therefore, the problem of heat dissipation of the LED is also a key problem, and the good heat dissipation is directly related to whether the LED lamp can work stably and reliably for a long time. At present, the traditional heat dissipation of the LED mainly depends on passive heat dissipation. I.e. heat is carried away by natural convection by means of heat-dissipating fins behind the LEDs. The heat dissipation effect is not ideal, and if the LED meets an external hot high-temperature environment, the heat dissipation effect is worse, and the service life of the LED is directly influenced. In recent years, phase change heat dissipation and liquid cooling heat dissipation have been widely used in industries such as automobiles, aircraft engines, electronic chips, and the like, due to their advantages in heat dissipation.
A substance absorbs or releases a large amount of latent heat during a Phase Change (melting/solidifying or evaporating/liquefying) process, and a Phase Change heat dissipation technology is to use the characteristic of PCM (Phase Change Material) to cool a heat-generating component. PCM is the core and foundation for developing phase change heat dissipation technologies, and is diverse and diverse. In practice, the choice of PCM should be emphasized depending on the application.
The paraffin has large phase change latent heat and wide phase change temperature range. Although paraffin is generated in a liquid phase and needs to be packaged by a container, the paraffin serving as a phase change material has the advantages of high phase change latent heat, almost no supercooling phenomenon, low vapor pressure during melting, difficult chemical reaction, good chemical stability, small change of phase change temperature and phase change latent heat after repeated heat absorption and release, self-nucleation, no phase separation and corrosivity and low price.
Graphene has very good heat conduction performance, single-layer graphene is a carbon material with the highest heat conduction coefficient so far, and when the graphene is used as a carrier, the heat conduction coefficient can reach 600W/(m.k), and the graphene can be used as an ideal filler of a composite phase change material.
The foam metal with an ultra-light structure is a novel functional material developed in recent years, and is often a porous metal with a pore diameter range of 0.1-10mm or more and a porosity of more than 45%, and has excellent characteristics of high porosity, low density, high thermal conductivity and the like. Metal foams are generally classified into closed-cell and open-cell, and open-cell metal foams are often used to enhance heat transfer. Due to the fact that the paraffin has extremely low heat conductivity coefficient, the heat storage rate of the paraffin is very low, and therefore foam metal with high heat conductivity, such as foam aluminum, foam copper, expanded graphene and the like, can be filled into pure paraffin frequently in a certain proportion, and therefore the composite phase change material is formed. Therefore, the equivalent heat conductivity coefficient of the paraffin can be greatly increased, and the phase change latent heat capacity of the paraffin is improved.
Compared with the traditional heat dissipation structure, the micro-channel heat dissipation structure has larger heat dissipation area, larger volume heat exchange coefficient and high heat exchange efficiency, meets higher energy efficiency standard, greatly improves the heat transfer performance of unit mass, and has excellent pressure resistance. Since graphene is the thinnest two-dimensional crystal material at present, the graphene has excellent properties such as high specific surface area, carrier mobility and heat conductivity, and is called as the king of new materials. Therefore, the heat dissipation capacity of the cooling liquid can be obviously improved by replacing the simple cooling liquid with the cooling liquid containing the graphene powder.
Disclosure of Invention
The invention aims to provide a composite heat dissipation device adopting a composite phase change material and micro-channel liquid cooling by combining phase change and micro-channel liquid cooling related heat dissipation technologies according to the defects of the existing LED heat dissipation technology. The device can greatly improve the heat dissipation capacity of the LED, ensure that the LED is in a stable and reliable working environment and prolong the service life of the LED.
The technical scheme adopted by the invention is as follows: a composite heat sink employing composite phase change material and microchannel liquid cooling, the heat sink comprising: the phase change material heat radiator comprises a phase change area cover plate, a phase change material, a heat radiator and a liquid cooling area cover plate, wherein the heat radiator is of a plate-shaped structure, one side of the heat radiator is provided with a depressed area for placing the phase change material, and the other side, corresponding to the depressed area, of the heat radiator is provided with a micro channel; the phase-change material is packaged by adopting a phase-change area cover plate, the micro flow channel is packaged by adopting a liquid-cooling area cover plate, and the side, which is not packaged, of the liquid-cooling area cover plate is provided with a liquid injection port and a liquid outlet of cooling liquid; the heat source is arranged on the side, which is not packaged, of the phase change area cover plate; the heat radiator is characterized in that a plurality of columnar bulges made of foamed aluminum materials are arranged in an array in a sunken area of the heat radiator, a phase-change material fills gaps among the columnar bulges in the sunken area, and a circle of sealing groove is arranged on the outer side of the sunken area;
the micro flow channel includes: the structure of the left tertiary runner and the structure of the right tertiary runner are completely symmetrical, and a symmetry axis is the central main runner; the tertiary runner in a left side includes: the central main runner, the first-stage runner, the second-stage runner and the third-stage runner are arranged in parallel, and the lengths of the central main runner, the first-stage runner, the second-stage runner and the third-stage runner are sequentially shortened; a row of isolating blocks are arranged in each stage of the left tertiary flow channel and the right tertiary flow channel in the direction of the downstream channel, the row of isolating blocks divides the flow channel into a cooling liquid inlet side and a cooling liquid outlet side, and the cooling liquid inlet and the cooling liquid outlet of each stage of the flow channel are positioned at the same end of the flow channel; the size of the isolation blocks in each flow channel from the cooling liquid inlet to the tail end of the flow channel and the distance between the adjacent isolation blocks are sequentially increased; the cooling liquid outlet of the upper stage runner is connected with the cooling liquid inlet of the lower stage runner; one end of the central main flow channel is a liquid filling port area, the other end of the central main flow channel is a cooling liquid outlet of the central main flow channel, and the cooling liquid is divided into a left path and a right path by the cooling liquid outlet of the central main flow channel and respectively flows into a first-stage flow channel of the left third-stage flow channel and a first-stage flow channel of the right third-stage flow channel; the third-stage flow channel outlet of the left third-stage flow channel and the third-stage flow channel outlet of the right third-stage flow channel are converged through a micro flow channel, and the converging position is a liquid outlet area of the micro flow channel and is positioned on the symmetry axis of the left third-stage flow channel and the right third-stage flow channel; a circle of sealing groove is arranged on the outer side of the micro channel;
the liquid injection port on the liquid cooling area cover plate is communicated with the liquid injection port area of the micro-channel in the radiator, and the liquid outlet on the liquid cooling area cover plate is communicated with the liquid outlet area of the micro-channel in the radiator.
Further, the phase-change material is a paraffin-graphene composite material.
Furthermore, a turbulence column is arranged on the central line of the central main flow channel along the direction of the flow channel, and the turbulence column is in a shuttle shape.
A heat dissipation system employing a composite heat dissipation device, the system comprising: the composite heat dissipation device, the water pump, the cooling water tank, the S-shaped cooling tube and the controller are connected into a circulating system through pipelines, the controller collects the temperature of a heat source through a temperature sensor, and the output power of the water pump is controlled according to the temperature information of the heat source.
In summary, the above is provided. Due to the adoption of the technical scheme, the invention has the beneficial effects that:
in the invention, the phase-change latent heat release medium in the heat dissipation device adopts paraffin solid-liquid phase-change material with low melting point. The paraffin absorbs a large amount of heat generated by the LED light source module in the melting process, so that the LED light source module is always at normal working temperature, and the paraffin has small volume change rate when solid-liquid phase changes, so that an reserved expansion space does not need to be overlarge, and the whole paraffin phase change cavity has a compact structure and small volume. In order to improve the thermal conductivity, melting and solidification rate of the paraffin material, foamed aluminum and certain-mass graphene particles are randomly arranged in the paraffin phase change cavity, so that the equivalent thermal conductivity and diffusion efficiency of paraffin are greatly improved, and heat absorbed by paraffin can be quickly transferred to the liquid cooling heat dissipation area of the micro-channel through the foamed metal framework.
In the invention, the micro-channel liquid cooling heat dissipation structure has the advantages of simple design, compact structure, smaller volume and small overall noise. The specific mode is to adopt uneven series-parallel flow channels for heat dissipation. Wherein, an arc-shaped flow disturbing column is arranged on the middle main runner, when the cooling liquid flows through the flow disturbing column, disturbance can be generated, a thermal boundary layer of the fluid in the middle area is damaged, the heat convection coefficient is enhanced, and the heat dissipation effect is improved. The arrangement in an arc shape can significantly reduce pressure loss. The uneven series-parallel flow channels on the two sides are symmetrically arranged, so that the temperature uniformity of the left part and the temperature uniformity of the right part are relatively consistent. The parallel flow channels adopt three short rectangular flow channels with different widths. The aim is to meet the requirement that the heat transmitted from the paraffin phase-change heat dissipation area can be dissipated in a targeted manner, so that the temperature uniformity of the heat dissipation device is further improved. In the invention, the circulating cooling liquid adopted by the whole micro-channel liquid cooling heat dissipation device is a graphene aqueous solution with a certain concentration. The graphene has excellent performances of high lubricity, high thermal conductivity, high specific surface area, corrosion resistance and the like. Therefore, after the graphene powder is added, the heat conduction performance of a single cooling liquid can be improved to a certain degree, the lubricating condition of the solid-liquid surface can be improved, the friction coefficient of the cooling liquid is reduced, the wear rate of the inner wall of the flow channel is obviously reduced, the energy consumption of the pump is reduced, and the overall heat dissipation capacity is improved to a certain extent compared with the prior art. Meanwhile, the graphene has strong hydrophilicity, so that the graphene can be uniformly and stably distributed in the polar solvent, and the heat conduction and heat transfer capacity of the cooling liquid is uniform.
In the invention, the temperature value of the LED light source module is monitored by the temperature sensor and is transmitted to the controller in real time. The controller can dynamically adjust the rotating speed of the water pump according to a set value. The whole heat dissipation device always maintains an optimal energy efficiency ratio state.
Drawings
FIG. 1 is a schematic diagram of a composite heat sink using composite phase change material and microchannel liquid cooling according to the present invention.
Fig. 2 is an exploded view of the composite heat dissipation device using composite phase change material and microchannel liquid cooling according to the present invention.
Fig. 3 is a partial cross-sectional view of fig. 2 in accordance with the present invention.
Fig. 4 is a schematic three-dimensional structure diagram of a paraffin-graphene latent heat-release region of the heat dissipation device of the present invention.
Fig. 5 is a front view of the heat dissipating device of the present invention.
FIG. 6 is a half sectional view taken along line A-A of FIG. 5 according to the present invention.
Fig. 7 is a partial cross-sectional view of fig. 6 in accordance with the present invention.
Fig. 8 is a cross-sectional view of B-B of fig. 6 in accordance with the present invention.
The labels in the figure are: 1-LED light source module, 2-phase change area cover plate, 3-paraffin-graphene composite phase change material, 4-radiator, 5-liquid cooling area cover plate, 6-temperature sensor, 7-foamed aluminum, 41-paraffin-graphene latent heat release area, 42-sealing groove, 43-external mounting hole, 44-liquid cooling area cover plate mounting hole, 45-heat source mounting hole, 46-liquid inlet area, 47-central main flow channel, 48-turbulence column, 49-three-stage uneven series-parallel flow channel, 410-liquid outlet area, 411-sealing groove, 51-liquid inlet, 52-liquid outlet
Detailed Description
A composite heat dissipation device adopting composite phase change materials and micro-channel liquid cooling comprises an LED light source module 1, a phase change area cover plate 2, a paraffin-graphene composite phase change material 3, a heat radiator 4, a liquid cooling area cover plate 5, a temperature sensor 6, foamed metal aluminum 7, a water pump, a cooling water tank, an external S-shaped heat dissipation pipe and a controller. The paraffin-graphene composite phase change material 3 is filled in the paraffin-graphene latent heat release area 41 in the radiator 4 and is sealed by the phase change area cover plate 2. The LED light source module 1 is closely attached to the heat sink 4 through a connecting piece. The microchannel liquid cooling zone of the heat sink 4 is sealed by a liquid cooling zone cover plate 5. The temperature sensor 6 is closely attached to the LED light source module 1 and electrically connected with the controller. The water pipe is used for completing the water path connection with the water pump, the cooling water tank, the external S-shaped radiating pipe and the radiating device. The concrete structure is shown in figures 1, 2 and 3.
The specific structure of the heat dissipation device comprises a liquid injection port 51, a liquid outlet 52, a sealing groove 42, an external mounting hole 43, a liquid cooling area cover plate mounting hole 44, a heat source mounting hole 45, a turbulence column 48, a three-stage uneven series-parallel flow channel 49, a sealing groove 411 and foamed aluminum 7. The concrete structure is shown in figures 4, 5, 6, 7 and 8.
When the LED lamp is in work, a large amount of heat generated by the LED light source module 1 is transferred in a way of 'the LED light source module 1, the phase change area cover plate 2, the paraffin wax-graphene latent heat release area 41, the foamed aluminum 7, the three-level uneven series-parallel flow channel 49, the cooling liquid and the external environment'. And the graphene cooling liquid is transmitted by a water pump-radiator 4-external S-shaped radiating pipe-cooling water tank-water pump. Thus completing the heat dissipation of the LED.
The specific structure of the paraffin-graphene phase change latent heat release region is as follows: the cavity is internally distributed with foamed aluminum with high thermal conductivity. Because the thermal conductivity of the pure paraffin is extremely low, the paraffin-graphene composite material is filled between the foamed metal aluminum and the inner wall of the latent heat release area and in the cavity of the foamed aluminum, so that the equivalent thermal conductivity of the paraffin-graphene composite material can be obviously improved, and the melting and solidification rate of the paraffin can be increased by adding the graphene. In order to ensure that the paraffin is not leaked due to the liquid state of the paraffin during melting, a certain space must be reserved at the upper part of the paraffin-graphene phase change latent heat release area. The integral latent heat release area is sealed by a phase change area cover plate. During the phase change process, a large amount of heat generated by the LED light source module is absorbed, the paraffin close to the heat source part is firstly melted into liquid paraffin, and the volume of the liquid paraffin is increased along with the volume expansion. In addition, the density of the liquid paraffin is lower than that of the solid paraffin, the molten high-temperature liquid paraffin rises to the upper surface of the solid paraffin due to the action of thermal buoyancy, and because the heat conductivity coefficient of the paraffin is extremely low, heat cannot be directly transferred to the low-temperature solid paraffin far away from a heat source, so that heat can be absorbed only by melting a large amount of the solid paraffin at the bottom, and further a large amount of high-temperature liquid paraffin is gathered on the upper part of the solid paraffin. Due to the low surface temperature of the foamed aluminum and the lower freezing point, the high-temperature liquid paraffin releases heat to the foamed aluminum, and the foamed aluminum is changed from a liquid state to a solid state. And sinks to the bottom to carry out melting heat absorption again. In the whole process, the graphene particles flow along with the flowing of the paraffin, and the melting rate and the solidification rate of the paraffin are accelerated, so that the latent heat release process is obviously accelerated, and the heat transfer is accelerated. A large amount of heat accumulated on the foamed aluminum can be conducted upwards along the foamed metal framework until the heat is transferred to a micro-channel liquid cooling heat dissipation area on the upper layer of the radiator.
The concrete structure of microchannel liquid cooling radiating area is: the upper surface of the bottom layer cold plate is provided with flow channels with symmetrical left and right structures, the middle of the area is provided with a central main flow channel, and the middle of the central main flow channel is provided with an arc-shaped flow disturbing column. The cooling liquid in the area with the highest temperature forms vortex, so that the local disturbance of the fluid is enhanced, a thermal boundary layer is damaged, and the overall heat dissipation capacity is improved. The micro-channels on two sides are divided into three series and three parallel flow channels, wherein the parallel micro-channels are composed of three short flow channels with different widths, the purpose is to better realize the heat dissipation requirements of different areas, and the short flow channels can obviously reduce the flow resistance, further reduce the pressure drop of an inlet and an outlet and reduce the power consumption. A circle of sealing groove is arranged around the micro-channel and used for sealing. The heat transferred from the paraffin-graphene latent heat release area is transferred to the external environment through the cooling liquid, and one-round heat dissipation of the heat dissipation device is completed.
Since the graphene has excellent performances such as high lubrication property, high thermal conductivity, high specific surface area and corrosion resistance, and the heat dissipation capacity of the graphene is greatly improved compared with that of the traditional cooling liquid, the graphene aqueous solution is used as the cooling liquid of the whole heat dissipation device system. In order to effectively adjust the flow of the cooling liquid, the temperature sensor is installed on the LED light source module, the controller adjusts the rotating speed of the water pump in real time according to the temperature of the sensor, and then the inlet flow of the radiator is controlled, so that the radiating strength and the radiating capacity are automatically adjusted, and the LED light source module has the characteristic of reducing the radiating energy consumption. When the LED light source module 1 is in operation, the LED chip has low electro-optic conversion efficiency, which causes a large amount of energy to be converted into heat and released to the outside, resulting in a rapid rise in LED temperature. With the highest heat density around the chip. Most of heat is transferred to the paraffin-graphene latent heat release area 41 through heat conduction, and paraffin in the paraffin-graphene composite phase change material 3 absorbs heat and is melted. Since the paraffin has a large latent heat of phase change, it absorbs a large amount of heat from the LED light source module 1. The solid paraffin close to the phase change area cover plate 2 is melted firstly, and the melted liquid paraffin rises to the upper surface of the solid paraffin by virtue of the action of thermal buoyancy because the density of the liquid paraffin is lower than that of the solid paraffin. Due to the low surface temperature of the aluminum foam 7, which is lower than the freezing point, the high temperature liquid paraffin releases heat to the upper surface of the aluminum foam 7. And it changes itself from a liquid state to a solid state and sinks to the lower surface of the paraffin wax, and so on. In the whole latent heat release process, the addition of the graphene particles can greatly accelerate the melting and solidification of paraffin and the equivalent heat conductivity coefficient. The heat is transferred along the foam metal skeleton to the microchannel liquid cooling zone of the heat sink 4. Firstly, the graphene cooling liquid flows into the liquid injection port 51 through the water pipe and enters the liquid injection port region 46, and when flowing through the central main flow channel 47, the graphene cooling liquid meets the turbulent flow column 48 to generate turbulent flow, so that the heat convection coefficient is enhanced. Then under the action of the baffle, the graphene cooling liquid is divided into two parts to enter the three-stage series-parallel flow channels 49 which are symmetrical at two sides, the graphene cooling liquid and the inner wall of the radiator 4 carry out heat convection in the period, and finally the two parts of cooling liquid are mixed in the liquid outlet area 410 and flow out from the liquid outlet 52. The graphene cooling liquid with the increased temperature flows into the external S-shaped radiating pipe through the connecting water pipe, and the cooling liquid exchanges external heat here. Thus, a round of phase change heat dissipation-micro-channel liquid cooling composite heat dissipation process is completed.
During the whole working period of the heat sink, the temperature sensor 6 can monitor the temperature condition of the LED light source module 1 in real time and transmit the temperature signal to the controller. The controller compares the set value with the detected actual value to further adjust the rotating speed of the water pump. Therefore, the whole heat dissipation device is always in a state with optimal efficiency ratio.
The application is mainly a composite heat dissipation device adopting composite phase change materials and micro-channel liquid cooling. The heat dissipation device adopts series composite heat dissipation. Firstly, the heat of the LED light source module 1 is transferred to the paraffin-graphene latent heat release area through heat conduction. The paraffin has the characteristics of large phase change latent heat and wide phase change temperature range. When the solid paraffin is melted into the liquid paraffin, a large amount of ambient heat is absorbed, so that the LED light source module 1 is always kept in a normal working environment. When the high-temperature liquid paraffin contacts the foamed aluminum with lower temperature, heat is transferred to the foamed aluminum 7, then the heat is transferred to the next heat dissipation area along the foamed metal framework, and the liquid paraffin of the liquid paraffin can be changed back to the solid paraffin due to heat release, and the process is repeated. When heat is transferred to the cold plate of the liquid cooled region of the microchannel. The cooling liquid enters from the liquid injection port 51, flows into the central main flow channel 47, passes through the flow disturbing columns 48, is divided into two flows under the action of the baffle plates, enters into the three-stage uneven series flow channels 49 which are symmetrical at two sides, is mixed at the liquid outlet area 410 and finally flows out from the liquid outlet 52. In the process that the cooling liquid flows into the micro-channel, the cooling liquid and the bottom layer cold plate of the micro-channel carry out heat convection so as to realize heat exchange. The paraffin phase change latent heat and the series composite heat dissipation of the micro-channel liquid cooling can enable heat generated by the LED light source module 1 to be quickly transferred to the cooling liquid and transmitted to the external environment through the cooling liquid, and therefore the heat dissipation process is completed.
In this application, a coolant of a composite heat dissipation device using a composite phase change material and microchannel liquid cooling is a coolant containing graphene particles. Due to the fact that the graphene has the advantages of being high in heat conductivity, high in lubricating property and the like, the performance of a single cooling liquid can be improved to a certain extent when the cooling liquid added with the graphene powder. For example, the heat transfer capacity of the cooling liquid is improved, and the friction coefficient of the solid-liquid surface is reduced, thereby reducing the energy consumption of the pump. In addition, due to the addition of the temperature sensor 6 and the controller, the rotating speed of the water pump can be adjusted in real time according to the working condition of the LED light source module 1, the energy efficiency ratio is improved, the energy consumption is further reduced, and the service life of the whole heat dissipation device is prolonged.
Example 1
A composite heat dissipation device adopting composite phase change materials and micro-channel liquid cooling comprises an LED light source module 1, a phase change area cover plate 2, a paraffin-graphene composite phase change material 3, a heat radiator 4, a liquid cooling area cover plate 5, a temperature sensor 6, a controller, a water pump, a cooling water tank and an external S-shaped heat dissipation pipe. The heat generated by the LED light source module 1 is transferred to the microchannel liquid cooling area through the paraffin-graphene latent heat release area 41, the graphene cooling liquid flows into the radiator 4, flows in from the liquid injection port 51, and flows out from the liquid outlet 52, thereby completing a round of heat dissipation.
Wherein, the length and width of the central main runner is 38mm x 5 mm; the widest part of the turbulence column is 1mm, the length of the turbulence column is 20mm, and the whole turbulence column is arc-shaped; the length and width of the first stage flow channel are 28mm x 2 mm; the length and width of the second-stage flow channel are 16.5mm x 2 mm; the length and width of the third stage flow channel are 16.5mm x 2 mm; the height of the whole flow channel is 1mm, and the maximum coverage area of the flow channel is 46mm x 40 mm.
The number of the first-stage flow channel isolation blocks is 14, the length, the width and the height of the 1 st isolation block and the 2 nd isolation block are respectively 2mm x 3mm x 1mm, and the two are separated by 1 mm; the 3 rd spacer block is 1.5mm 3mm 1mm in size and is spaced 1mm from the second spacer block; the size of the 4 th to 14 th spacer blocks is 1mm 3mm 1mm, and the 4 th spacer block is 0.5mm apart from the 3 rd spacer block by 0.5mm.
The number of the second-stage flow channel isolation blocks is 8, the length, width and height of the 1 st isolation block and the 2 nd isolation block are 1.5mm x 3mm x 1mm, and the two are separated by 1 mm; the 3 rd to 8 th spacer block had a size of 1mm 3mm 1mm, and the 3 rd spacer block was spaced 0.5mm apart from the 2 nd spacer block by 0.5mm.
The third stage flow channel isolation blocks are 7 in number, the length, width and height of the 1 st isolation block and the 2 nd isolation block are 1.5mm x 1mm, and the two are separated by 1 mm; the 3 rd to 7 th spacer blocks have a size of 1mm x 1mm, and the 3 rd spacer block is spaced 0.5mm apart from the 2 nd spacer block by 0.5mm.
Example 2
On the basis of embodiment 1, the rotating speed of the water pump can be adjusted in real time through the temperature sensor 6 and the controller, so that power loss can be reduced, optimal heat dissipation is achieved, cost is saved to the maximum extent, and the service life of the whole system is prolonged. Meanwhile, the paraffin latent heat release region 41 and the micro-channel liquid cooling region can be structurally optimized according to the requirements of different LED heat source densities, for example, the density distribution of foamed aluminum, the mass fraction of graphene, the volume of the paraffin-graphene latent heat release region, the width distribution of micro-channels and the like are adjusted, so that the optimal heat dissipation effect is achieved.

Claims (4)

1. A composite heat sink employing composite phase change material and microchannel liquid cooling, the heat sink comprising: the phase change material heat radiator comprises a phase change area cover plate, a phase change material, a heat radiator and a liquid cooling area cover plate, wherein the heat radiator is of a plate-shaped structure, one side of the heat radiator is provided with a depressed area for placing the phase change material, and the other side, corresponding to the depressed area, of the heat radiator is provided with a micro channel; the phase-change material is packaged by adopting a phase-change area cover plate, the micro flow channel is packaged by adopting a liquid-cooling area cover plate, and the side, which is not packaged, of the liquid-cooling area cover plate is provided with a liquid injection port and a liquid outlet of cooling liquid; the heat source is arranged on the side, which is not packaged, of the phase change area cover plate; the heat radiator is characterized in that a plurality of columnar bulges made of foamed aluminum materials are arranged in an array in a sunken area of the heat radiator, a phase-change material fills gaps among the columnar bulges in the sunken area, and a circle of sealing groove is arranged on the outer side of the sunken area;
the micro flow channel includes: the structure of the left tertiary runner and the structure of the right tertiary runner are completely symmetrical, and a symmetry axis is the central main runner; the tertiary runner in a left side includes: the central main runner, the first-stage runner, the second-stage runner and the third-stage runner are arranged in parallel, and the lengths of the central main runner, the first-stage runner, the second-stage runner and the third-stage runner are sequentially shortened; a row of isolating blocks are arranged in each stage of the left tertiary flow channel and the right tertiary flow channel in the direction of the downstream channel, the row of isolating blocks divides the flow channel into a cooling liquid inlet side and a cooling liquid outlet side, and the cooling liquid inlet and the cooling liquid outlet of each stage of the flow channel are positioned at the same end of the flow channel; the size of the isolation blocks in each flow channel from the cooling liquid inlet to the tail end of the flow channel and the distance between the adjacent isolation blocks are sequentially increased; the cooling liquid outlet of the upper stage runner is connected with the cooling liquid inlet of the lower stage runner; one end of the central main flow channel is a liquid filling port area, the other end of the central main flow channel is a cooling liquid outlet of the central main flow channel, and the cooling liquid is divided into a left path and a right path by the cooling liquid outlet of the central main flow channel and respectively flows into a first-stage flow channel of the left third-stage flow channel and a first-stage flow channel of the right third-stage flow channel; the third-stage flow channel outlet of the left third-stage flow channel and the third-stage flow channel outlet of the right third-stage flow channel are converged through a micro flow channel, and the converging position is a liquid outlet area of the micro flow channel and is positioned on the symmetry axis of the left third-stage flow channel and the right third-stage flow channel; a circle of sealing groove is arranged on the outer side of the micro channel;
the liquid injection port on the liquid cooling area cover plate is communicated with the liquid injection port area of the micro-channel in the radiator, and the liquid outlet on the liquid cooling area cover plate is communicated with the liquid outlet area of the micro-channel in the radiator.
2. The composite heat sink of claim 1, wherein the phase change material is a paraffin-graphene composite.
3. The composite heat dissipating device as claimed in claim 1, wherein a turbulent flow column is disposed along a center line of the central main channel along the channel direction, and the turbulent flow column is shuttle-shaped.
4. A heat dissipating system using the composite heat dissipating device of claim 1, the heat dissipating system comprising: the composite heat dissipation device, the water pump, the cooling water tank, the S-shaped cooling tube and the controller are connected into a circulating system through pipelines, the controller collects the temperature of a heat source through a temperature sensor, and the output power of the water pump is controlled according to the temperature information of the heat source.
CN202010661909.7A 2020-07-10 2020-07-10 Composite heat dissipation device adopting composite phase change material and micro-channel liquid cooling Pending CN111911892A (en)

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CN115831894B (en) * 2022-12-28 2023-09-19 江苏富乐华功率半导体研究院有限公司 Heat radiation module of circuit element

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