CN213662050U - High temperature resistance intelligence circuit board - Google Patents
High temperature resistance intelligence circuit board Download PDFInfo
- Publication number
- CN213662050U CN213662050U CN202022639541.2U CN202022639541U CN213662050U CN 213662050 U CN213662050 U CN 213662050U CN 202022639541 U CN202022639541 U CN 202022639541U CN 213662050 U CN213662050 U CN 213662050U
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- Prior art keywords
- circuit board
- heat dissipation
- intelligent circuit
- heat
- high temperature
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- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 24
- 238000001816 cooling Methods 0.000 abstract description 2
- 230000008878 coupling Effects 0.000 abstract description 2
- 238000010168 coupling process Methods 0.000 abstract description 2
- 238000005859 coupling reaction Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 239000000428 dust Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model relates to an intelligent circuit board technical field specifically is a high temperature resistance intelligent circuit board, including intelligent circuit board, intelligent circuit board be equipped with heat conduction oil pipe on the surface, the frame is installed to the edge of intelligent circuit board, and the inside of frame is equipped with the side pipe, and the side union coupling has the fin, and the fin is connected with the heat dissipation room, and the internally mounted of heat dissipation room has the fan, and the fin is connected with the circulation room, and circulation room internally mounted has the motor, and the motor is connected with the spiral leaf. The surface of the circuit board is provided with a plurality of heat conducting oil pipes which can absorb heat generated when the circuit board works, the heat conducting oil transmits the heat to the radiating fins through the side pipes, and finally the circuit board is cooled through air cooling of the fan; the structure such as be equipped with circulation room, motor, flight can realize the whole circulation of the inside conduction oil of frame, makes the radiating effect of circuit board better.
Description
Technical Field
The utility model relates to an intelligent circuit board technical field specifically is a high temperature resistance intelligent circuit board.
Background
The PCB (printed circuit board) is used as the parent of electronic components, is the most critical product component in the fields of electronics, communication and IT, and plays a role of a bridge. It decorates every bright spot in modern life. The intelligent circuit board is used for communicating circuit information at a high speed in the most reliable tiny space, intelligently optimizing each type of circuit product, and providing high-quality, reliable, low-carbon and environment-friendly products for global electronic manufacturers and one-stop product service for customers by using the most advanced technology and the most excellent equipment.
A plurality of electronic components are installed on the intelligent circuit board, and the mechanisms can generate a large amount of heat during working, so that when the equipment is overheated, the equipment can be damaged, and unnecessary loss is caused.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high temperature resistant intelligent circuit board to solve the problem of proposing in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high temperature resistance intelligent circuit board, includes intelligent circuit board, intelligent circuit board's being equipped with heat conduction oil pipe on the surface, the frame is installed to intelligent circuit board's edge, the inside of frame is equipped with the side pipe, the side union coupling has the fin, the fin is connected with the heat dissipation room, the internally mounted of heat dissipation room has the fan, the fin is connected with the circulation room, circulation room internally mounted has the motor, the motor is connected with the spiral leaf.
Preferably, the outer frame is a rectangular frame structure with a hollow inner part, a clamping groove is formed in the contact surface of the outer frame and the intelligent circuit board, and the intelligent circuit board is located inside the clamping groove.
Preferably, a plurality of heat conduction oil pipes are respectively installed on the front side and the back side of the intelligent circuit board, the heat conduction oil pipes are attached to the surface of the intelligent circuit board, two side pipes are arranged in the outer frames on the left side and the right side of the intelligent circuit board, and the heat conduction oil pipes are communicated with the side pipes.
Preferably, the four radiating fins are arranged on the two sides of the top surface and the bottom surface of the outer frame respectively, the radiating fins are of cuboid hollow plate structures, one surfaces of the radiating fins are welded on the outer frame, the other surfaces of the radiating fins are connected with the radiating chamber, the radiating chamber is a cuboid cavity, a filter screen is installed on one side of the radiating chamber, and two fans are installed inside each radiating chamber.
Preferably, the circulating chambers are provided with two circulating chambers which are respectively positioned inside the top surface and the bottom surface of the outer frame, and the circulating chambers are communicated with the radiating fins.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the surface of the circuit board is provided with a plurality of heat conducting oil pipes which can absorb heat generated when the circuit board works, the heat conducting oil transmits the heat to the radiating fins through the side pipes, and finally the circuit board is cooled through air cooling of the fan;
2. the structure such as be equipped with circulation room, motor, flight can realize the whole circulation of the inside conduction oil of frame, makes the radiating effect of circuit board better.
Drawings
FIG. 1 is a structural diagram of the device of the present invention;
FIG. 2 is a top view of the device of the present invention;
FIG. 3 is a cross-sectional view of FIG. 2;
fig. 4 is a side view of the structure of the device of the present invention.
In the figure: the intelligent circuit board comprises an intelligent circuit board 1, an outer frame 2, a side pipe 3, a fan 4, a heat dissipation chamber 5, a circulation chamber 6, a motor 7, a spiral blade 8, a heat conduction oil pipe 9, a filter screen 10 and a heat dissipation sheet 11.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 4, the present invention provides a technical solution: the utility model provides a high temperature resistance intelligent circuit board, includes intelligent circuit board 1, intelligent circuit board 1 is equipped with heat conduction oil pipe 9 on the surface, respectively installs a plurality of heat conduction oil pipe 9 on intelligent circuit board 1's the positive and negative, and the laminating of heat conduction oil pipe 9 is on intelligent circuit board 1's surface, and when equipment operation, intelligent circuit board 1 can produce a large amount of heats, and the heat can be absorbed by the inside conduction oil of heat conduction oil pipe 9.
The edge of the intelligent circuit board 1 is provided with an outer frame 2, the outer frame 2 is a rectangular frame structure with a hollow inner part, a clamping groove is arranged on the contact surface of the outer frame 2 and the intelligent circuit board 1, the intelligent circuit board 1 is positioned in the clamping groove, side pipes 3 are arranged in the outer frame 2, the side pipes 3 are provided with two and positioned in the outer frame 2 at the left side and the right side of the intelligent circuit board 1, heat conducting oil pipes 9 are communicated with the side pipes 3, the side pipes 3 are connected with radiating fins 11, the radiating fins 11 are provided with four and positioned at the two sides of the top surface and the bottom surface of the outer frame 2 respectively, the radiating fins 11 are of cuboid hollow plate structures, one surface of each radiating fin 11 is welded on the outer frame 2, the other surface of each radiating fin 11 is connected with a radiating chamber 5, heat conducting oil enters the radiating fins 11 through the side pipes 3, a filter screen 10 is installed on one side of the heat dissipation chamber 5, the filter screen 10 can prevent dust from entering the inside of the heat dissipation chamber 5, so that the dust is prevented from covering the heat dissipation fins 11 to reduce the heat dissipation efficiency, two fans 4 are installed inside each heat dissipation chamber 5, and the fans 4 are opened to discharge heat outside the device.
The fin 11 is connected with the circulation room 6, circulation room 6 is equipped with two altogether and is located the top surface of frame 2 and the inside of bottom surface respectively, circulation room 6 is linked together with fin 11, 6 internally mounted of circulation room has motor 7, motor 7 is connected with spiral leaf 8, the conduction oil flows into in the circulation room 6, motor 7 starts to drive spiral leaf 8 rotatory, make the inside conduction oil of device realize the circulation flow, consequently, the heat on intelligent circuit board 1 surface can be distributed away by better.
The working principle is as follows: when the equipment runs, the intelligent circuit board 1 can generate a large amount of heat, the heat can be absorbed by heat conduction oil in the heat conduction oil pipe 9, the heat conduction oil enters the radiating fin 11 through the side pipe 3, the surface area of the radiating fin 11 is large, the thickness of the radiating fin is thin, the heat is radiated into the radiating chamber 5, and the fan 4 is started to discharge the heat out of the device; in the conduction oil flowed into circulation room 6, motor 7 started and drives the spiral leaf 8 rotatory for the inside conduction oil of device realizes the circulation flow, consequently, and the heat on intelligent circuit board 1 surface can be distributed away by better.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a high temperature resistance intelligent circuit board, includes intelligent circuit board (1), its characterized in that: the utility model discloses a heat dissipation device, including intelligent circuit board (1), frame (2) are installed to the edge of intelligent circuit board (1), the inside of frame (2) is equipped with side pipe (3), side pipe (3) are connected with fin (11), fin (11) are connected with heat dissipation chamber (5), the internally mounted of heat dissipation chamber (5) has fan (4), fin (11) are connected with circulation chamber (6), circulation chamber (6) internally mounted has motor (7), motor (7) are connected with spiral leaf (8).
2. The high temperature resistant smart circuit board of claim 1, wherein: the outer frame (2) is a rectangular frame structure with a hollow inner part, a clamping groove is formed in the contact surface of the outer frame (2) and the intelligent circuit board (1), and the intelligent circuit board (1) is located inside the clamping groove.
3. The high temperature resistant smart circuit board of claim 1, wherein: a plurality of heat conduction oil pipes (9) are respectively installed on the front side and the back side of the intelligent circuit board (1), the heat conduction oil pipes (9) are attached to the surface of the intelligent circuit board (1), the side pipes (3) are provided with two heat conduction oil pipes and located inside the outer frames (2) on the left side and the right side of the intelligent circuit board (1), and the heat conduction oil pipes (9) are communicated with the side pipes (3).
4. The high temperature resistant smart circuit board of claim 1, wherein: the heat dissipation plate is characterized in that the heat dissipation plates (11) are provided with four heat dissipation plates and located on two sides of the top surface and the bottom surface of the outer frame (2) respectively, the heat dissipation plates (11) are of a cuboid hollow plate-shaped structure, one surfaces of the heat dissipation plates (11) are welded on the outer frame (2), the other surfaces of the heat dissipation plates (11) are connected with the heat dissipation chamber (5), the heat dissipation chamber (5) is a cuboid cavity, a filter screen (10) is installed on one side of the heat dissipation chamber (5), and two fans (4) are installed inside each heat dissipation.
5. The high temperature resistant smart circuit board of claim 1, wherein: the circulating chambers (6) are provided with two circulating chambers and are respectively positioned in the top surface and the bottom surface of the outer frame (2), and the circulating chambers (6) are communicated with the radiating fins (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022639541.2U CN213662050U (en) | 2020-11-16 | 2020-11-16 | High temperature resistance intelligence circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022639541.2U CN213662050U (en) | 2020-11-16 | 2020-11-16 | High temperature resistance intelligence circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213662050U true CN213662050U (en) | 2021-07-09 |
Family
ID=76684367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022639541.2U Expired - Fee Related CN213662050U (en) | 2020-11-16 | 2020-11-16 | High temperature resistance intelligence circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213662050U (en) |
-
2020
- 2020-11-16 CN CN202022639541.2U patent/CN213662050U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210709 |