CN218388442U - Water-cooling heat dissipation power module of high-power laser - Google Patents
Water-cooling heat dissipation power module of high-power laser Download PDFInfo
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- CN218388442U CN218388442U CN202222453241.4U CN202222453241U CN218388442U CN 218388442 U CN218388442 U CN 218388442U CN 202222453241 U CN202222453241 U CN 202222453241U CN 218388442 U CN218388442 U CN 218388442U
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- 238000001816 cooling Methods 0.000 title claims abstract description 123
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 71
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 86
- 238000010438 heat treatment Methods 0.000 claims abstract description 65
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 239000002274 desiccant Substances 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 230000006872 improvement Effects 0.000 description 11
- 239000000498 cooling water Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
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Abstract
The application discloses a water-cooling heat dissipation power supply module of a high-power laser, which comprises a shell, wherein a circuit board and a heat dissipation mechanism are arranged in the shell, and the circuit board is connected with the heat dissipation mechanism; the heat dissipation mechanism comprises a water cooling strip, the water cooling strip is connected with the shell, a first heating assembly, a second heating assembly and a third heating assembly are arranged on the circuit board, the first heating assembly is connected with the lower surface of the water cooling strip, the second heating assembly is connected with the left side surface of the water cooling strip, and the third heating assembly is connected with the right side surface of the water cooling strip. The heat dissipation mechanism adopts a structural mode of the water cooling strip, so that the overall size of the laser power supply module can be reduced; meanwhile, the characteristic that all four sides of the water cooling strip can dissipate heat is fully utilized, all heating devices are connected with the surface of the water cooling strip, the internal space of the power supply module is saved, and the heat dissipation efficiency is improved.
Description
Technical Field
The application belongs to the technical field of lasers, and particularly relates to a water-cooling heat dissipation power module of a high-power laser.
Background
The laser is a device capable of emitting laser, the internal structure of the laser can be divided into an optical part and an electrical part according to functions, wherein the electrical part mainly refers to a power supply module for supplying power to the laser. When the laser works, a large amount of heat is generated, so that the heat of the laser needs to be dissipated. Aiming at a heat dissipation mechanism of a power module in a laser, two modes of air cooling and water cooling heat dissipation mainly exist in the prior art; however, for a high-power laser, the air-cooled heat dissipation cannot achieve the required heat dissipation effect; therefore, the power module of the current high-power laser generally adopts a water-cooling heat dissipation mode.
The structure of the water-cooling heat dissipation power module of the existing high-power laser mainly comprises the following two types:
1. the power supply power heating device is welded on the PCB, the power heating device is installed on metal heat dissipation materials such as aluminum plates through the insulating heat conduction materials, and then the heat dissipation materials such as the aluminum plates are fixed on the water cooling plate. In the mode, the heat dissipation of the power device can be realized only by 3-4 layers of heat conduction links, the heat dissipation effect is not ideal, and the requirement of long-time working of the laser cannot be met.
2. The heating power device of the power module is directly fixed on the water-cooling heat dissipation plate through the heat conducting and insulating medium. The power device is fixed on the upper surface and the lower surface of the water cooling plate in a flat lying mode, and due to the fact that heat conducting media are reduced, the heat dissipation efficiency of the mode is higher than that of the first mode, but only the upper surface and the lower surface of the water cooling plate are utilized for heat dissipation, and the overall utilization rate of the water cooling plate is low. The use requirement of a high-power laser can be met only by adopting a water-cooling plate with a larger size, so that the laser is large in size and heavy in weight, and the difficulty in installation and maintenance is increased.
Therefore, the heat dissipation effects of the two modes are not ideal, so that the existing high-power water-cooled laser has the defects of large integral size and heavy weight, and the development requirements of small volume and high power of the whole laser are also restricted by the defects.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems in the prior art, the application provides a water-cooling heat dissipation power supply module of a high-power laser, which comprises a shell, wherein a circuit board and a heat dissipation mechanism are arranged in the shell, and the circuit board is connected with the heat dissipation mechanism; the heat dissipation mechanism comprises a water cooling strip, the water cooling strip is connected with the shell, a first heating component, a second heating component and a third heating component are arranged on the circuit board, the first heating component is connected with the lower surface of the water cooling strip, the second heating component is connected with the left side surface of the water cooling strip, and the third heating component is connected with the right side surface of the water cooling strip.
As a further improvement of the present application, the number of the water-cooling strips is two, and two the water-cooling strips are communicated through a connecting pipe.
As a further improvement of this application, be equipped with the electromagnetism water valve on the connecting pipe, the electromagnetism water valve with circuit board electric connection, the electromagnetism water valve is used for control the connecting pipe switches on or closes.
As the further improvement of this application, two the one end of water-cooling strip all stretches out the casing, and two the one end that the water-cooling strip stretches out the casing all is equipped with water pipe head.
As a further improvement of the application, the shape of water-cooling strip is the cuboid shape, the material of water-cooling strip is the aluminum alloy.
As the further improvement of this application, first heating element includes the rectifier bridge, the rectifier bridge welding is in on the circuit board, the up end of rectifier bridge with the lower surface butt of water-cooling strip.
As the further improvement of this application, the second heating element includes MOS pipe and diode, MOS pipe and diode weld respectively in on the circuit board, MOS pipe and diode respectively with the left surface butt of water-cooling strip.
As a further improvement of the application, the second heating assembly is connected with the water cooling strip in a clamping or bonding mode.
As a further improvement of this application, the third heating element includes aluminium system heat conduction jar, aluminium system heat conduction jar with the right flank of water-cooling strip is connected.
As a further improvement of the application, the lower end face of the aluminum heat conduction tank is provided with heat conduction mud.
As a further improvement of this application, be equipped with in the casing and settle the frame, it is used for placing the drier to settle the frame, it is equipped with transparent cover on the frame to settle, transparent cover with the connection can be dismantled to the casing.
As a further improvement of the application, a handle is arranged on the outer side wall of the shell.
Compared with the prior art, the beneficial effects of this application are:
the heat dissipation mechanism adopts a water cooling strip structure mode, and the size of the heat dissipation mechanism can be reduced relative to a water cooling plate, so that the overall size of the laser power module is reduced; meanwhile, the first heating assembly, the second heating assembly and the third heating assembly are respectively connected with the three surfaces of the water cooling strip, the characteristic that the four surfaces of the water cooling strip can be cooled is fully utilized, the internal space of the power supply module is saved by the installation mode, and the heat dissipation efficiency is far higher than that of the original water cooling plate heat dissipation mode, so that a better heat dissipation effect can be realized by a water cooling pipe with smaller size and lighter weight, and the development requirements of small size and high power of the whole laser can be met.
Drawings
In order to illustrate the present application or prior art more clearly, a brief description of the drawings needed for the description of the embodiments or prior art will be given below, it being clear that the drawings in the following description are some embodiments of the present application and that other drawings can be derived from them by a person skilled in the art without inventive effort.
FIG. 1 is a schematic diagram of an external structure of an embodiment of the present application;
FIG. 2 is a schematic diagram of the internal structure of an embodiment of the present application;
fig. 3 is a schematic structural diagram of a heat dissipation mechanism in an embodiment of the present application.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the description is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions. The terms "first," "second," and the like in the description and claims of this application or in the foregoing drawings are used for distinguishing between different objects and not for describing a particular sequential order.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.
As shown in fig. 1-3, a high-power laser water-cooling heat dissipation power module includes a housing 1, a circuit board 2 and a heat dissipation mechanism are fixedly installed in the housing 1, the circuit board 2 is connected with the heat dissipation mechanism, the circuit board 2 may be one or more, the heat dissipation mechanism is used for dissipating heat of a heating device on the circuit board 2, and the heat dissipation mechanism of the high-power laser water-cooling heat dissipation power module adopts a water-cooling heat dissipation manner; specifically, the heat dissipation mechanism comprises a water cooling strip 3, one end of the water cooling strip 3 extends into the shell 1 and is fixedly connected with the shell 1 through a screw, a first heating component 4, a second heating component 5 and a third heating component 6 are arranged on the circuit board 2, the first heating component 4 is connected with the lower surface of the water cooling strip 3, the second heating component 5 is connected with the left side surface of the water cooling strip 3, and the third heating component 6 is connected with the right side surface of the water cooling strip 3; therefore, heat generated by the operation of the first heating assembly 4, the second heating assembly 5 and the third heating assembly 6 can be directly conducted into the water cooling pipe, flowing cooling water in the water cooling pipe can bring the heat out of the shell 1, and the purpose of heat dissipation of the first heating assembly 4, the second heating assembly 5 and the third heating assembly 6 is achieved.
The heat dissipation mechanism of the high-power laser water-cooling heat dissipation power module adopts a structural mode of the water-cooling strip 3, and can reduce the volume relative to a water-cooling plate, so that the overall size of the laser power module is reduced; meanwhile, the first heating component 4, the second heating component 5 and the third heating component 6 are respectively connected with the three surfaces of the water cooling strip 3, the characteristic that the four surfaces of the water cooling strip 3 can be cooled is fully utilized, the internal space of the power supply module is saved by the installation mode, and the heat dissipation efficiency is far higher than that of the original water cooling plate heat dissipation mode, so that the better heat dissipation effect can be realized by the water cooling tube with smaller size and lighter weight, and the development requirements of small size and high power of the whole laser can be met.
The water cooling strip 3 is integrally in a cuboid shape, the cross section of the water cooling strip is in a square shape, and in other embodiments, the water cooling strip 3 can be replaced by any other shape according to the requirement of the internal structure of a product; the water-cooling strip 3 is made of aluminum alloy materials, the aluminum alloy has good heat conducting performance, and the heat radiating efficiency of the water-cooling heat radiating power supply module of the high-power laser can be improved. In the embodiment, two water-cooling strips 3 are provided, one ends of the two water-cooling strips 3 extend into the shell 1 to be connected with the circuit board 2, the other ends of the two water-cooling strips 3 extend out of the shell 1, and one ends of the two water-cooling strips 3 extending into the shell 1 are communicated through a connecting pipe 7, so that cooling water in the two water-cooling strips 3 can circulate; in other embodiments, the number of water-cooling strips 3 may be any other number according to actual needs.
The connecting pipe 7 is provided with an electromagnetic water valve 14, the electromagnetic water valve 14 is electrically connected with the circuit board 2, and the electromagnetic water valve 14 is used for controlling the connection or the disconnection of the connecting pipe 7; specifically, when the water-cooling heat dissipation power supply module of the high-power laser works, the electromagnetic water valve 14 is controlled to be conducted through the circuit board 2, so that cooling water in the two water-cooling strips 3 can circulate, and heat dissipation is performed on a heating device on the circuit board 2; when the high-power laser water-cooling heat dissipation power supply module does not work, the circuit board 2 is powered off to control the electromagnetic water valve 14 to be closed, cooling water between the two water-cooling strips 3 is cut off to circulate, and condensate can be effectively prevented from being generated when the high-power laser water-cooling heat dissipation power supply module does not work by the water-cooling strips 3. In other embodiments, the installation position of the electromagnetic water valve 14 in the water cooling cycle may also be installed at the water inlet or other suitable position.
One end of each of the two water-cooling strips 3 extending out of the shell 1 is provided with a water pipe joint 8, wherein one water pipe joint 8 is used for connecting a water inlet pipe, and the other water pipe joint 8 is used for connecting a water outlet pipe; during operation, the water inlet pipe is externally connected with a water source, so that the two water-cooling strips 3, the connecting pipe 7 and the electromagnetic water valve 14 form a circulating water path, flowing cooling water is formed inside the water-cooling strips 3, and the flowing cooling water can be used for taking away heat generated by the work of the first heating component 4, the second heating component 5 and the third heating component 6 with higher speed, so that the heat dissipation efficiency is improved. In this embodiment, water pipe head 8 is for inserting the self-locking type joint soon, and the installation of being convenient for and dismantlement business turn over water pipe improve assembly efficiency.
The shell 1 is used as a main body mounting mechanism of the water-cooling heat dissipation power supply module of the high-power laser, and comprises a bottom frame 11 and a surface cover 12, wherein the surface cover 12 is fixedly and detachably connected with the bottom frame 11 through screws; the circuit board 2 and the water-cooling strip 3 are both fixedly arranged in the bottom frame 11, and the circuit board 2 and the water-cooling strip 3 in the bottom frame 11 can be overhauled by disassembling the surface cover 12; install handle 9 on the lateral wall of underframe 11, set up handle 9 and be convenient for install, dismantle and carry, improve the convenience.
A mounting frame 15 is mounted on the inner side of the bottom frame 11, the mounting frame 15 is used for placing a drying agent, a transparent cover plate 13 is arranged on the mounting frame 15, and the transparent cover plate 13 and the shell are detachably connected and fixed through screws, so that the drying agent in the mounting frame 15 is isolated from the outside; in the sealed shell 1, the desiccant can effectively control the internal humidity, so that the stability of the electrical performance is ensured; when the desiccant is observed to be out of order through the transparent cover 13, the transparent cover 13 can be removed for replacement of the desiccant.
The third heating element 6 comprises an aluminum heat conducting tank 61, the aluminum heat conducting tank 61 is fixedly arranged on the right side surface of the water cooling strip 3, and the aluminum heat conducting tank 61 is connected with other heating devices on the circuit board 2, such as: the transformer, the resistor and the like can conduct heat generated by the corresponding heating device to the water cooling strip 3 for heat dissipation. In order to improve the heat dissipation efficiency, the lower end surface of the aluminum heat conduction tank 61 is coated with heat conduction mud, so that the aluminum heat conduction tank 61 can be connected with the corresponding heating device in a seamless manner.
In other embodiments, the aluminum heat conducting tank 6 and various heating electronic components on the circuit board 2 can be optionally connected with any one surface of the water cooling strip 3, and only the heat generated by the heating component can be conducted to the water cooling strip 3 without hindrance.
The working principle is as follows:
before the water-cooling heat dissipation power supply module of the high-power laser works, one of the two water pipe connectors 8 is connected with a water inlet pipe, and the other water pipe connector is connected with a water outlet pipe; when the water cooling device works, a water source is opened, cooling water sequentially flows into the two water-cooling strips 3 from the water inlet pipe and then flows out of the water outlet pipe, so that the cooling water in the two water-cooling strips 3 circulates to form circulating water; the heat that work such as MOS pipe, diode, rectifier bridge on the circuit board 2 produced can be quick conduction for water-cooling strip 3, takes away the heat through the cooling water of circulation again, plays quick radiating effect.
It is to be understood that the above-described embodiments are merely illustrative of some, but not restrictive, of the broad invention, and that the appended drawings illustrate preferred embodiments of the invention and do not limit the scope of the invention. This application is capable of embodiments in many different forms and these embodiments are provided so that this disclosure will be thorough and complete. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to one skilled in the art that the present application may be practiced without modification or with equivalents of some of the features described in the foregoing embodiments. All equivalent structures made by using the contents of the specification and the drawings of the present application are directly or indirectly applied to other related technical fields and are within the protection scope of the present application.
Claims (12)
1. A high-power laser water-cooling heat dissipation power module is characterized in that: the heat dissipation device comprises a shell, wherein a circuit board and a heat dissipation mechanism are arranged in the shell, and the circuit board is connected with the heat dissipation mechanism;
the heat dissipation mechanism comprises a water cooling strip, the water cooling strip is connected with the shell, a first heating component, a second heating component and a third heating component are arranged on the circuit board, the first heating component is connected with the lower surface of the water cooling strip, the second heating component is connected with the left side surface of the water cooling strip, and the third heating component is connected with the right side surface of the water cooling strip.
2. The water-cooling heat dissipation power module for the high-power laser device as recited in claim 1, wherein: the quantity of water-cooling strip has two, and two the water-cooling strip is linked together through the connecting pipe.
3. The high power laser water-cooling heat dissipation power module as recited in claim 2, wherein: the connecting pipe is provided with an electromagnetic water valve, the electromagnetic water valve is electrically connected with the circuit board, and the electromagnetic water valve is used for controlling the connecting pipe to be switched on or switched off.
4. The high-power laser water-cooling heat dissipation power module as recited in claim 2, wherein: two the one end of water-cooling strip all stretches out the casing, just two the one end that the water-cooling strip stretches out the casing all is equipped with water pipe head.
5. The high power laser water-cooling heat dissipation power module as recited in claim 2, wherein: the water-cooling strip is in a cuboid shape and is made of aluminum alloy.
6. The high-power laser water-cooling heat dissipation power module as recited in claim 1, wherein: the first heating assembly comprises a rectifier bridge, the rectifier bridge is welded on the circuit board, and the upper end face of the rectifier bridge is abutted to the lower surface of the water-cooling strip.
7. The high-power laser water-cooling heat dissipation power module as recited in claim 1, wherein: the second heating assembly comprises an MOS tube and a diode, the MOS tube and the diode are respectively welded on the circuit board, and the MOS tube and the diode are respectively abutted to the left side face of the water-cooling strip.
8. The high-power laser water-cooling heat dissipation power module as recited in claim 7, wherein: and the second heating component is clamped or bonded with the water cooling strip.
9. The water-cooling heat dissipation power module for the high-power laser device as recited in claim 1, wherein: the third heating assembly comprises an aluminum heat conduction tank, and the aluminum heat conduction tank is connected with the right side face of the water cooling strip.
10. The power module of claim 9, wherein: and the lower end surface of the aluminum heat conduction tank is provided with heat conduction mud.
11. The high-power laser water-cooling heat dissipation power module as claimed in any one of claims 1-10, wherein: the drying agent storage device is characterized in that a placement frame is arranged in the shell and used for placing a drying agent, a transparent cover plate is arranged on the placement frame, and the transparent cover plate is detachably connected with the shell.
12. The high power laser water-cooling heat dissipation power module as recited in claim 11, wherein: and a handle is arranged on the outer side wall of the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222453241.4U CN218388442U (en) | 2022-09-15 | 2022-09-15 | Water-cooling heat dissipation power module of high-power laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222453241.4U CN218388442U (en) | 2022-09-15 | 2022-09-15 | Water-cooling heat dissipation power module of high-power laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218388442U true CN218388442U (en) | 2023-01-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222453241.4U Active CN218388442U (en) | 2022-09-15 | 2022-09-15 | Water-cooling heat dissipation power module of high-power laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218388442U (en) |
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- 2022-09-15 CN CN202222453241.4U patent/CN218388442U/en active Active
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Address after: 518000, Building 4, West Half Floor, 601, 701, Building 301, 401, 501, Fubilun Technology Factory, Tantou Community, Songgang Street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Lianming Power Supply Co.,Ltd. Country or region after: China Address before: 518000 floor 10, floor 11 and floor 9 of plant 1 and plant 2, No. 128, Shangnan East Road, Huangpu Community, Xinqiao street, Bao'an District, Shenzhen, Guangdong Patentee before: SHENZHEN LIANMING POWER Co.,Ltd. Country or region before: China |
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