CN213638412U - Gilding film structure of circuit board - Google Patents
Gilding film structure of circuit board Download PDFInfo
- Publication number
- CN213638412U CN213638412U CN202022895296.1U CN202022895296U CN213638412U CN 213638412 U CN213638412 U CN 213638412U CN 202022895296 U CN202022895296 U CN 202022895296U CN 213638412 U CN213638412 U CN 213638412U
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- CN
- China
- Prior art keywords
- areas
- circuit pattern
- circuit board
- edge area
- film structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a circuit board gilding film structure, include: the PCB comprises a body, wherein an plate edge area and a plurality of circuit pattern areas are formed on the body, the plate edge area is arranged around the outer sides of the circuit pattern areas and surrounds the circuit pattern areas, a plurality of electroplating conductive areas are arranged in the plate edge area, and dry films are arranged in the rest areas of the body except the electroplating conductive areas and the circuit pattern areas. The utility model discloses can simplify the preparation flow, need not earlier manual rubber coating, the protection flange limit practices thrift the cost, promotes output simultaneously.
Description
Technical Field
The utility model relates to a circuit board field of making, in particular to circuit board gilding film structure.
Background
The multiple external light imaging film process adopts a mode of changing a film graph, is inseparable from an electroplating graph of a PCB, can meet the electroplating requirements of different graphs, such as graph copper electroplating, especially graph gold electroplating, graph soft gold electroplating and graph local gold electroplating, and all the film graphs need to be changed, so that the phenomenon that gold is plated on the edge of the plate is prevented, and unnecessary cost waste is reduced. At present, the method for manufacturing the electroplated gold is more commonly used in the industry, and comprises the steps of manually wrapping the plate edge, reserving an electroplated conductive part in a manual opening, electroplating gold, manually stripping glue, checking, stripping a film and etching, so that the cost is increased due to more steps.
SUMMERY OF THE UTILITY MODEL
The utility model provides a circuit board gilding film structure to solve at least one above-mentioned technical problem.
In order to solve the above problem, as an aspect of the present invention, there is provided a circuit board gilding film structure, including: the PCB comprises a body, wherein an plate edge area and a plurality of circuit pattern areas are formed on the body, the plate edge area is arranged around the outer sides of the circuit pattern areas and surrounds the circuit pattern areas, a plurality of electroplating conductive areas are arranged in the plate edge area, and dry films are arranged in the rest areas of the body except the electroplating conductive areas and the circuit pattern areas.
Preferably, the plated conductive region is rectangular.
Preferably, the width of the electroplating conductive area is 0.5-1 cm.
The utility model discloses can simplify the preparation flow, need not earlier manual rubber coating, the protection flange limit practices thrift the cost, promotes output simultaneously.
Drawings
Fig. 1 schematically shows a schematic structural diagram of the present invention.
Reference numbers in the figures: 1. a body; 2. a board edge area; 3. a line pattern region; 4. electroplating the conductive area; 5. and (3) drying the film.
Detailed Description
The embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways as defined and covered by the claims.
As an aspect of the utility model, a circuit board gilding film structure, specially adapted external light formation of image gilding film script is provided, include: the body 1, be formed with flange edge region 2 and a plurality of circuit figure region 3 on the body 1, flange edge region 2 centers on the outside setting in a plurality of circuit figure regions 3 will a plurality of circuit figure regions 3 surround, be provided with a plurality of electrically conductive regions 4 of electroplating in the flange edge region 2, on the body 1 except electrically conductive regions 4 of electroplating and all be provided with dry film 5 in the remaining area beyond a plurality of circuit figure regions 3, can prevent the edge gold of board like this, practice thrift manufacturing cost.
The dry film is a photosensitive material, is an important material in PCB production, is used for transfer manufacturing of circuit board patterns, is subjected to photopolymerization, is acid-resistant and alkali-resistant after being subjected to photopolymerization, is non-conductive, and can be used as an anti-corrosion layer and an anti-electroplating layer.
Preferably, the plated conductive areas 4 are rectangular. Preferably, the width of the plated conductive area 4 is 0.5-1 cm.
Since the technical scheme is used, the utility model discloses change the film figure, directly at electroplating the link plate, need not traditional manual rubber coating of flange limit reduce in production cost among the prior art, but directly changed the film figure, can save manual rubberizing, manual opening, manual taking off glues, whether the inspection has and takes off the gluey several steps of remaining, reduce to one-time operation by the quartic operation, practiced thrift the cost simultaneously.
The utility model discloses can simplify the preparation flow, need not earlier manual rubber coating, the protection flange limit practices thrift the cost, promotes output simultaneously.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (3)
1. A circuit board gilding film structure, comprising: the circuit board comprises a body (1), an board edge area (2) and a plurality of circuit pattern areas (3) are formed on the body (1), the board edge area (2) surrounds the outer sides of the circuit pattern areas (3) and surrounds the circuit pattern areas (3), a plurality of electroplating conductive areas (4) are arranged in the board edge area (2), and dry films (5) are arranged in the rest areas of the body (1), except the electroplating conductive areas (4) and the circuit pattern areas (3).
2. A circuit board gilded film structure according to claim 1, characterised in that the plated conductive areas (4) are rectangular.
3. A circuit board gilded film structure according to claim 1, characterised in that the width of the plated conductive areas (4) is 0.5-1 cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022895296.1U CN213638412U (en) | 2020-12-04 | 2020-12-04 | Gilding film structure of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022895296.1U CN213638412U (en) | 2020-12-04 | 2020-12-04 | Gilding film structure of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213638412U true CN213638412U (en) | 2021-07-06 |
Family
ID=76638562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022895296.1U Expired - Fee Related CN213638412U (en) | 2020-12-04 | 2020-12-04 | Gilding film structure of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213638412U (en) |
-
2020
- 2020-12-04 CN CN202022895296.1U patent/CN213638412U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210706 Termination date: 20211204 |