CN213601857U - Electromagnetic shielding packaging assembly - Google Patents
Electromagnetic shielding packaging assembly Download PDFInfo
- Publication number
- CN213601857U CN213601857U CN202022869428.3U CN202022869428U CN213601857U CN 213601857 U CN213601857 U CN 213601857U CN 202022869428 U CN202022869428 U CN 202022869428U CN 213601857 U CN213601857 U CN 213601857U
- Authority
- CN
- China
- Prior art keywords
- fixed
- base plate
- block
- substrate
- top end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses an electromagnetic shield's encapsulation subassembly, including base plate, last sliding block, stopper, conducting resin and vice connecting block, the both sides of base plate bottom all are fixed with the stopper, and one side slidable mounting on stopper top has last sliding block to one side on last sliding block top is fixed with the safety cover, one side of base plate bottom is installed and is led electrical pillar, and leads the base island to install in the base plate bottom of electrical pillar one side to one side on base island top adopts the conducting material to paste through SMT technology and is equipped with first component, the radio frequency chip is installed to one side on base plate top, one side on substrate surface is provided with the wire groove. The utility model discloses not only reduce the use cost of encapsulation subassembly, the installation convenience of reinforcing encapsulation subassembly still avoids the sealing connection of metal shield cover, safety cover and base plate not tight, improves the electromagnetic shield effect of encapsulation subassembly.
Description
Technical Field
The utility model relates to a semiconductor package technical field specifically is an electromagnetic shield's encapsulation subassembly.
Background
The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a function requirement to obtain an independent chip, and the packaging process is as follows: the wafer from the previous wafer process is cut into small chips through a scribing process, the cut chips are fixed on corresponding small islands of a substrate frame, bonding pads of the chips are connected to corresponding pins of the substrate through superfine metal wires or conductive resin, required circuits are formed, semiconductor chips are generally required to be packaged, and the chips are prevented from being influenced by electromagnetism.
The packaging assemblies on the market are various and can basically meet the use requirements of people, but certain defects still exist, and the following problems exist in the prior art.
(1) Most of the existing packaging assemblies cover metal on the surface of a plastic package body in a sputtering or electroplating mode so as to play a role in electromagnetic shielding, but the sputtering or electroplating mode has a complex process and causes higher use cost of the packaging assembly;
(2) the existing packaging assembly is troublesome in installation and fixation, and brings inconvenience to installation work of workers;
(3) the existing packaging assembly is mostly fixed by screws, and the electromagnetic shielding net and the substrate are not tightly sealed easily in the fixing mode, so that the packaging assembly is poor in shielding effect.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electromagnetic shield's encapsulation subassembly to the use cost who proposes the encapsulation subassembly among the solution above-mentioned background is higher, the fixed inconvenient and limited problem of electromagnetic shield effect of installation.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an electromagnetic shield's encapsulation subassembly, includes the base plate, goes up sliding block, stopper, conducting resin and auxiliary connecting block, the both sides of base plate bottom are all fixed with the stopper, and one side slidable mounting on stopper top has last sliding block to one side on last sliding block top is fixed with the safety cover, one side of base plate bottom is installed and is led electrical pillar, and leads the base island to install of electrical pillar bottom of electrical pillar one side to one side on base island top adopts conducting material to paste through SMT technology and is equipped with first device, the radio frequency chip is installed to one side on base plate top, one side on substrate surface is provided with the wire groove, one side on base plate top is provided with the conducting resin, and one side of conducting resin top pastes and is equipped with metallic shield cover, the inside one side of safety cover is provided with.
Preferably, the both sides on base plate top all are fixed with the fixed block, and are fixed with on the safety cover outer wall of fixed block top and press the board main part.
Preferably, all be fixed with main connecting block on the both sides inner wall of safety cover, main connecting block is symmetrical structure about the central point department of safety cover.
Preferably, the central point department of clamp plate main part bottom is fixed with folding metal strip, and the bottom of folding metal strip extends to the inside of fixed block, and one side of folding metal strip bottom is provided with protruding section.
Preferably, one side on clamp plate main part surface is provided with the constant head tank, and the locating pin is installed to the inside one side of constant head tank, and the bottom of locating pin extends to the inside of fixed block.
Preferably, the outer walls of the two sides of the metal shielding case are both fixed with auxiliary connecting blocks, and the auxiliary connecting blocks can be connected with the main connecting blocks.
Compared with the prior art, the beneficial effects of the utility model are that: the electromagnetic shielding packaging assembly not only reduces the use cost of the packaging assembly and enhances the installation convenience of the packaging assembly, but also avoids loose sealing connection of the metal shielding cover, the protective cover and the substrate, and improves the electromagnetic shielding effect of the packaging assembly;
(1) the metal shielding cover is attached to the top end of the substrate through the conductive adhesive through the substrate and the metal shielding cover, the metal shielding cover mainly plays a role of electromagnetic shielding, laser grooving is not needed on the top end of the substrate, the problem of poor combination of the metal shielding cover and the substrate is avoided, a film attaching mode is adopted, operation is convenient, the process flow is simplified, sputtering or electroplating work is not needed in the process, and the use cost of a packaging assembly is effectively reduced;
(2) the protective cover and the upper sliding block are arranged, the protective cover is used for protecting parts such as the metal shielding cover and the first component, the protective cover is manually taken out, the upper sliding blocks on two sides of the bottom end of the protective cover slide into the top end of the limiting block until the upper sliding blocks and the limiting block are completely overlapped, in the process, the auxiliary connecting blocks on the outer walls on two sides of the metal shielding cover are required to be aligned to the main connecting block, the main connecting block and the auxiliary connecting blocks slide relatively, and therefore the protective cover is used for protecting the metal shielding cover, the operation process is rapid, and the operation convenience of the packaging assembly is enhanced;
(3) through being provided with folding metal strip and constant head tank, manual clamp plate main part with on the safety cover outer wall is fixed to the fixed block on base plate top, folding metal strip probes into the inside of fixed block promptly, takes out the multiunit locating pin afterwards, probes into clamp plate main part, the inside of fixed block this time with the locating pin through the constant head tank to fix clamp plate main part to the top department of base plate, avoid metal shielding cover, the sealing connection of safety cover and base plate is not tight, improve the electromagnetic shield effect of encapsulation subassembly.
Drawings
Fig. 1 is a schematic view of the structure of the present invention;
fig. 2 is a schematic view of the front view cross-sectional structure of the present invention;
fig. 3 is a schematic view of the protective cover of the present invention;
FIG. 4 is a schematic side view of the pressing plate main body of the present invention;
in the figure: 1. a substrate; 2. an upper sliding block; 3. a limiting block; 4. a protective cover; 5. a base island; 6. an outlet groove; 7. a conductive post; 8. a conductive adhesive; 9. a main connecting block; 10. an auxiliary connecting block; 11. a radio frequency chip; 12. a first component; 13. plastic sealing; 14. a platen body; 15. folding the metal strip; 16. positioning pins; 17. a fixed block; 18. positioning a groove; 19. a convex section; 20. a metal shield can.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides an embodiment: an electromagnetic shielding packaging assembly comprises a substrate 1, an upper sliding block 2, a limiting block 3, conductive adhesive 8 and an auxiliary connecting block 10, wherein the limiting block 3 is fixed on two sides of the bottom of the substrate 1, the upper sliding block 2 is slidably mounted on one side of the top end of the limiting block 3, a protective cover 4 is fixed on one side of the top end of the upper sliding block 2, a conductive post 7 is mounted on one side of the bottom of the substrate 1, a base island 5 is mounted at the bottom of the substrate 1 on one side of the conductive post 7, a first component 12 is mounted on one side of the top end of the base island 5 through an SMT (surface mount technology) process by adopting conductive materials, a radio frequency chip 11 is mounted on one side of the top end of the substrate 1, a wire outlet groove 6 is formed in one side of the surface of the substrate 1, the conductive adhesive 8 is arranged on one side of the top end;
the metal shielding cover 20 is attached to the top end of the substrate 1 through the conductive adhesive 8, the metal shielding cover 20 mainly plays a role of electromagnetic shielding, laser grooving is not needed on the top end of the substrate 1, the problem of poor combination of the metal shielding cover 20 and the substrate 1 is avoided, a film attaching mode is adopted, operation is convenient, the process flow is simplified, sputtering or electroplating work is not needed in the process, and the use cost of a packaging assembly is effectively reduced;
a positioning groove 18 is formed in one side of the surface of the pressure plate main body 14, a positioning pin 16 is installed on one side of the inside of the positioning groove 18, and the bottom end of the positioning pin 16 extends into a fixing block 17;
the pressing plate main body 14 on the outer wall of the protection cover 4 can be manually fixed into the fixing block 17 at the top end of the substrate 1, namely the folding metal strips 15 are inserted into the fixing block 17, then a plurality of groups of positioning pins 16 are taken out, and the positioning pins 16 are inserted into the pressing plate main body 14 and the fixing block 17 through the positioning grooves 18, so that the pressing plate main body 14 is fixed to the top end of the substrate 1, the tight sealing connection between the metal shielding cover 20 and the protection cover 4 and the substrate 1 is avoided, and the electromagnetic shielding effect of a packaging assembly is improved;
the inner walls of the two sides of the protective cover 4 are both fixed with main connecting blocks 9, the main connecting blocks 9 are in a symmetrical structure relative to the central position of the protective cover 4, the outer walls of the two sides of the metal shielding cover 20 are both fixed with auxiliary connecting blocks 10, and the auxiliary connecting blocks 10 can be mutually connected with the main connecting blocks 9;
utilize safety cover 4 to metal shielding cover 20 afterwards, spare parts such as first component 12 protect, take out safety cover 4 manually, slide 2 on 4 bottom both sides of safety cover and slide into the top of stopper 3, until slide 2 and stopper 3 coincide completely on, at this in-process, need to make the vice connecting block 10 on the outer wall of metal shielding cover 20 both sides aim at main connecting block 9, make main connecting block 9 and vice connecting block 10 take place relative slip, thereby utilize safety cover 4 to protect metal shielding cover 20, it is swift in the operation process, the simple operation nature of reinforcing encapsulation subassembly.
The working principle is as follows: when in use, firstly, the metal shielding cover 20 is attached to the top end of the substrate 1 through the conductive adhesive 8, the metal shielding cover 20 mainly plays a role of electromagnetic shielding, no laser grooving is needed on the top end of the substrate 1, the problem of poor combination of the metal shielding cover 20 and the substrate 1 is avoided, a film attaching mode is adopted, the operation is convenient, the process flow is simplified, in the process, sputtering or electroplating work is not needed, the use cost of a packaging assembly is effectively reduced, then the protective cover 4 is utilized to protect the metal shielding cover 20, the first component 12 and other parts, the protective cover 4 is manually taken out, the upper sliding blocks 2 on two sides of the bottom end of the protective cover 4 are slid into the top end of the limiting block 3 until the upper sliding blocks 2 and the limiting block 3 are completely overlapped, in the process, the auxiliary connecting blocks 10 on the outer walls on two sides of the metal shielding cover 20 are required to be aligned with the main connecting blocks 9, so that, thereby utilize safety cover 4 to protect metal shield 20, it is swift in the operation process, strengthen the simple operation nature of encapsulation subassembly, in order to avoid safety cover 4 and metal shield 20, base plate 1 is connected insecure phenomenon, can be manual fix the clamp plate main part 14 on the safety cover 4 outer wall to the fixed block 17 on base plate 1 top, folding metal strip 15 promptly probes into the inside of fixed block 17, take out multiunit locating pin 16 afterwards, probe into clamp plate main part 14 this time through constant head tank 18 with locating pin 16, the inside of fixed block 17, thereby fix clamp plate main part 14 to base plate 1's top department, avoid metal shield 20, the sealing connection of safety cover 4 and base plate is not tight, improve the electromagnetic shield effect of encapsulation subassembly.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The utility model provides an electromagnetic shielding's encapsulation subassembly, includes base plate (1), last slider (2), stopper (3), conducting resin (8) and vice connecting block (10), its characterized in that: limiting blocks (3) are fixed on two sides of the bottom of the base plate (1), an upper sliding block (2) is slidably mounted on one side of the top end of each limiting block (3), a protective cover (4) is fixed on one side of the top end of the upper sliding block (2), a conductive column (7) is arranged on one side of the bottom of the substrate (1), and the base island (5) is arranged at the bottom of the substrate (1) at one side of the conductive post (7), and one side of the top end of the base island (5) is stuck with a first component (12) by adopting a conductive substance through an SMT process, a radio frequency chip (11) is arranged on one side of the top end of the substrate (1), a wire outlet groove (6) is arranged on one side of the surface of the substrate (1), a conductive adhesive (8) is arranged on one side of the top end of the substrate (1), and one side of the top end of the conductive adhesive (8) is attached with a metal shielding cover (20), and one side inside the protective cover (4) is provided with a plastic seal (13).
2. The electromagnetically shielded package assembly of claim 1, wherein: both sides on base plate (1) top all are fixed with fixed block (17), and are fixed with clamp plate main part (14) on safety cover (4) outer wall above fixed block (17).
3. The electromagnetically shielded package assembly of claim 1, wherein: all be fixed with main connecting block (9) on the both sides inner wall of safety cover (4), main connecting block (9) are symmetrical structure about the central point department of putting of safety cover (4).
4. The electromagnetically shielded package assembly of claim 2, wherein: the central point department of clamp plate main part (14) bottom is fixed with folding metal strip (15), and the bottom of folding metal strip (15) extends to the inside of fixed block (17), and one side of folding metal strip (15) bottom is provided with protruding section (19).
5. The electromagnetically shielded package assembly of claim 2, wherein: one side on clamp plate main part (14) surface is provided with constant head tank (18), and constant head tank (18) inside one side install locating pin (16), and the bottom of locating pin (16) extends to the inside of fixed block (17).
6. An electromagnetically shielded package assembly as claimed in claim 3, wherein: the outer walls of two sides of the metal shielding cover (20) are all fixed with auxiliary connecting blocks (10), and the auxiliary connecting blocks (10) can be connected with the main connecting block (9) mutually.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022869428.3U CN213601857U (en) | 2020-12-04 | 2020-12-04 | Electromagnetic shielding packaging assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022869428.3U CN213601857U (en) | 2020-12-04 | 2020-12-04 | Electromagnetic shielding packaging assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213601857U true CN213601857U (en) | 2021-07-02 |
Family
ID=76597435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022869428.3U Active CN213601857U (en) | 2020-12-04 | 2020-12-04 | Electromagnetic shielding packaging assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213601857U (en) |
-
2020
- 2020-12-04 CN CN202022869428.3U patent/CN213601857U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5527740A (en) | Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities | |
| EP0977251A4 (en) | Resin sealed semiconductor device and method for manufacturing the same | |
| TW518729B (en) | Quad flat non-leaded semiconductor package structure and manufacturing process | |
| CN213601857U (en) | Electromagnetic shielding packaging assembly | |
| KR970700369A (en) | Integrated circuit package and manufacturing method | |
| JP2000208690A (en) | Lead frame, resin-sealed semiconductor device, and manufacture thereof | |
| CN211240662U (en) | Semiconductor package electromagnetic shielding structure | |
| CN214592686U (en) | Electrical equipment | |
| GB2290660A (en) | Resin-sealed semiconductor device | |
| CN208433942U (en) | A kind of permanent protective property chip compensation quartz oscillator | |
| CN209232767U (en) | A kind of novel semi-conductor encapsulating structure | |
| CN203325892U (en) | Wafer particle | |
| CN217881466U (en) | Packaging cover plate of integrated circuit chip | |
| CN108574458A (en) | A kind of permanent protective property chip compensation quartz oscillator | |
| CN207020705U (en) | Contact Type Ic Card | |
| CN210805761U (en) | Semiconductor chip | |
| JPH04267549A (en) | Resin sealed type semiconductor device | |
| CN210467799U (en) | Semiconductor packaging structure | |
| CN212542433U (en) | High-power-density integrated packaging module | |
| CN211957624U (en) | SMD diode chip that restraines in twinkling of an eye that heat dissipation is good | |
| CN216648273U (en) | Semiconductor packaging unit | |
| CN215102993U (en) | Shading waterproof conductive adhesive tape | |
| CN215069942U (en) | Semiconductor device packaging structure with low thermal resistance | |
| CN209843690U (en) | Integrated forming and packaging structure | |
| CN214313183U (en) | Frameless ultrathin front lead-out TVS chip packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |