CN212542433U - High-power-density integrated packaging module - Google Patents

Abstract

The utility model discloses an integrated encapsulation module of high power density, including the radiating bottom plate, the slot has all vertically been seted up to the both sides on radiating bottom plate top surface, and the picture peg has been placed to the inner chamber of slot, and the surface of picture peg has the location sealant with the junction packing of slot inner chamber, the sealed frame of top fixedly connected with of picture peg, and the surface at radiating bottom plate top and the inner chamber tiling that is located sealed frame have the heat-conducting glue. The utility model discloses a set up the radiating bottom plate, the heat conduction is glued, the location briquetting, the heat dissipation window, the filter screen, sealed frame, the picture peg, the cooperation of location sealing glue and slot is used, can protect the electronic components in the integrated encapsulation module, integrated encapsulation module's life is longer like this, it is when using to have solved integrated encapsulation module, because of lacking effectual protection, make electronic components directly expose in external environment, cause electronic components's damage easily, thereby lead to integrated encapsulation module to appear the shorter problem of life.

Description

High-power-density integrated packaging module

Technical Field

The utility model relates to the field of electronic technology, specifically a high power density integrated packaging module.

Background

Electronic technology, which is related to technologies including electronics, data, magnetism, optics, electromagnetism, or the like, the electronic form refers to an information existing form that cannot be directly sensed by human vision or hearing and must be converted by means of a certain carrier, so that an integrated package module is widely used in the electronic industry, more types of integrated package modules are integrated package modules with high power density, and the existing integrated package modules are not effectively protected when in use, so that electronic components are directly exposed to the external environment and are easily damaged, the problem that the integrated package modules have short service lives is caused, and the practicability of the integrated package modules is greatly reduced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an integrated encapsulation module of high power density possesses the advantage of protecting the electronic components in the integrated encapsulation module, has solved integrated encapsulation module when using, because of lacking effectual protection for electronic components directly exposes in external environment, causes electronic components's damage easily, thereby leads to integrated encapsulation module to appear the short problem of life.

In order to achieve the above object, the utility model provides a following technical scheme: a high power density integrated package module comprises a heat radiation bottom plate, wherein slots are longitudinally formed in the two sides of the top surface of the heat radiation bottom plate, a plug board is placed in the inner cavity of each slot, a positioning sealant is filled in the joint of the surface of the plug board and the inner cavity of each slot, a sealing frame is fixedly connected to the top of the plug board, heat-conducting glue is paved on the surface of the top of the heat radiation bottom plate and the inner cavity of the sealing frame, a copper substrate is paved on the surface of the top of the heat-conducting glue, a silicon substrate is fixedly connected to the two sides of the top surface of the copper substrate, a diode body is installed on the left side of the top surface of the silicon substrate on the left side, a capacitor is installed on the right side of the top surface of the silicon substrate on the left side, a chip body is installed on the surface of the top of the silicon, the heat dissipation window has all been seted up to the front side and the rear side of seal frame inner chamber both sides, the inner chamber fixedly connected with filter screen of heat dissipation window.

Preferably, the front side and the rear side of the bottom of the surface of the two sides of the heat dissipation bottom plate are fixedly connected with positioning installation blocks, and the center of the top surface of each positioning installation block is provided with a positioning screw hole in a penetrating manner.

Preferably, the surface of the bottom of the inserting plate is in contact with the bottom of the inner cavity of the slot, and the transverse length of the bottom of the sealing frame is greater than that of the slot.

Preferably, the top of the inner side surface of the positioning pressing block is positioned on the outer side of the silicon substrate, and the bottom of the inner side surface of the positioning pressing block is positioned on the outer side of the heat-conducting glue.

Preferably, the diode body, the capacitor and the bottom of the chip base pin penetrate through the silicon substrate and are fixedly connected with the copper substrate.

Preferably, the right side of the top of the inner cavity of the sealing frame is provided with a leak hole, and the surface of the top of the sealing frame and the top of the leak hole are fixedly connected with a limiting ring.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a set up the radiating bottom plate, the heat conduction is glued, the location briquetting, the heat dissipation window, the filter screen, sealed frame, the picture peg, the cooperation of location sealing glue and slot is used, can protect the electronic components in the integrated encapsulation module, integrated encapsulation module's life is longer like this, integrated encapsulation module has been solved when using, because of lacking effectual protection, make electronic components directly expose in external environment, cause electronic components's damage easily, thereby lead to the short problem of life to appear in the integrated encapsulation module, be worth promoting.

2. The utility model discloses a setting up the cooperation of location installation piece and location screw, conveniently fixing a position the installation to the radiating bottom plate, through the sealed cooperation of gluing of picture peg, slot and location, can fix a position the installation to sealed frame, through the location briquetting, can fix a position the copper base plate, improved the stability of copper base plate, through the cooperation of small opening and spacing ring, can get into in the integrated encapsulation module to external lead wire.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged schematic view of A of FIG. 1 according to the present invention;

fig. 3 is a side view of the sealing frame structure of the present invention.

In the figure: the heat dissipation structure comprises a heat dissipation bottom plate 1, heat conduction glue 2, a copper substrate 3, a silicon substrate 4, a chip substrate 5, a positioning pressing block 6, a positioning installation block 7, a heat dissipation window 8, a filter screen 9, a sealing frame 10, a limiting ring 11, a leakage hole 12, a capacitor 13, a diode body 14, an insertion plate 15, positioning sealant 16 and an insertion slot 17.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, a high power density integrated package module includes a heat dissipation base plate 1, wherein the front side and the rear side of the bottom of the two side surfaces of the heat dissipation base plate 1 are fixedly connected with a positioning mounting block 7, a positioning screw hole is formed through the center of the top surface of the positioning mounting block 7, the positioning mounting block 7 and the positioning screw hole are matched to facilitate the positioning mounting of the heat dissipation base plate 1, slots 17 are longitudinally formed on the two sides of the top surface of the heat dissipation base plate 1, an insertion plate 15 is placed in the inner cavity of the slot 17, a positioning sealant 16 is filled at the joint of the surface of the insertion plate 15 and the inner cavity of the slot 17, a sealing frame 10 is fixedly connected to the top of the insertion plate 15, the surface of the bottom of the insertion plate 15 is in contact with the bottom of the inner cavity of the slot 17, the transverse length of the sealing frame 10 is greater, the sealing frame 10 can be positioned and installed, the surface of the top of the radiating bottom plate 1 and the inner cavity of the sealing frame 10 are tiled with heat conducting glue 2, the surface of the top of the heat conducting glue 2 is provided with a copper substrate 3, both sides of the top surface of the copper substrate 3 are fixedly connected with silicon substrates 4, the top of the inner side surface of a positioning pressing block 6 is positioned at the outer side of the silicon substrate 4, the bottom of the inner side surface of the positioning pressing block 6 is positioned at the outer side of the heat conducting glue 2, the copper substrate 3 can be positioned through the positioning pressing block 6, the stability of the copper substrate 3 is improved, the left side of the top surface of the left side silicon substrate 4 is provided with a diode body 14, the right side of the top surface of the left side silicon substrate 4 is provided with a capacitor 13, the surface of the top of the right side silicon substrate 4 is provided with a chip substrate 5, the front side and the rear side of the two sides of the top surface of the copper substrate 3 are fixedly connected with positioning press blocks 6, the outer side of the bottom of each positioning press block 6 is fixedly connected with a radiating bottom plate 1, the front side and the rear side of the two sides of the inner cavity of a sealing frame 10 are respectively provided with a radiating window 8, the inner cavity of each radiating window 8 is fixedly connected with a filter screen 9, the radiating bottom plate 1, heat-conducting glue 2, the positioning press blocks 6, the radiating windows 8, the filter screens 9, the sealing frame 10, a plug board 15, positioning sealant 16 and a slot 17 are arranged in a matched mode for use, electronic components in the integrated packaging module can be protected, the service life of the integrated packaging module is longer, and the problem that the service life of the integrated packaging module is shorter due to the fact that the electronic components are directly exposed in the external environment due to lack of effective protection is solved, be worth promoting, leak 12 has been seted up on the right side at sealed frame 10 inner chamber top, and the surface at sealed frame 10 top just is located the top fixedly connected with spacing ring 11 of leak 12, through the cooperation of leak 12 and spacing ring 11, can get into integrated packaging module to external lead wire.

When the heat dissipation device is used, the inserting plate 15 is inserted into the inserting groove 17 and filled with the positioning sealant 16, the sealing frame 10 is used for protecting various electronic components, meanwhile, heat generated in the working process of the electronic components is discharged through the heat dissipation window 8, and the filter screen 9 can prevent external sundries from entering the sealing frame 10 and prevent internal electronic components from being damaged.

All kinds of parts used in the application document are standard parts and can be purchased from the market, the specific connection mode of all parts adopts conventional means such as mature bolts, rivets, welding and the like in the prior art, the conventional models in the prior art are adopted for machinery, parts and electrical equipment, the conventional connection mode in the prior art is adopted for circuit connection, and detailed description is not given here.

In summary, the following steps: this integrated encapsulation module of high power density, through setting up radiating bottom plate 1, heat-conducting glue 2, location briquetting 6, heat dissipation window 8, filter screen 9, sealed frame 10, picture peg 15, sealed 16 and slot 17's of gluing cooperation use in location, solved integrated encapsulation module when using, because of lacking effectual protection for electronic components directly exposes in external environment, causes electronic components's damage easily, thereby leads to integrated encapsulation module to appear the short problem of life.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A high power density integrated package module, includes heat dissipation bottom plate (1), its characterized in that: the heat dissipation bottom plate comprises a heat dissipation bottom plate (1), slots (17) are longitudinally formed in the two sides of the top surface of the heat dissipation bottom plate (1), a plug plate (15) is placed in an inner cavity of the slots (17), a positioning sealant (16) is filled in the joint of the surface of the plug plate (15) and the inner cavity of the slots (17), a sealing frame (10) is fixedly connected to the top of the plug plate (15), a heat-conducting glue (2) is flatly laid on the surface of the top of the heat dissipation bottom plate (1) and the inner cavity of the sealing frame (10), a copper substrate (3) is laid on the surface of the top of the heat-conducting glue (2), a silicon substrate (4) is fixedly connected to the two sides of the top surface of the copper substrate (3), a diode body (14) is installed on the left side of the top surface of the silicon substrate (4) on the left, the heat dissipation device is characterized in that a positioning pressing block (6) is fixedly connected to the front side and the rear side of the two sides of the top surface of the copper substrate (3), the outer side of the bottom of the positioning pressing block (6) is fixedly connected with the heat dissipation bottom plate (1), heat dissipation windows (8) are formed in the front side and the rear side of the two sides of the inner cavity of the sealing frame (10), and a filter screen (9) is fixedly connected to the inner cavity of each heat dissipation window (8).

2. A high power density integrated package module according to claim 1, wherein: the heat dissipation base plate is characterized in that the front side and the rear side of the bottom of the surfaces of the two sides of the heat dissipation base plate (1) are fixedly connected with positioning installation blocks (7), and the center of the top surface of each positioning installation block (7) is penetrated and provided with a positioning screw hole.

3. A high power density integrated package module according to claim 1, wherein: the surface of the bottom of the inserting plate (15) is in contact with the bottom of the inner cavity of the inserting groove (17), and the transverse length of the bottom of the sealing frame (10) is larger than that of the inserting groove (17).

4. A high power density integrated package module according to claim 1, wherein: the top of the inner side surface of the positioning pressing block (6) is positioned on the outer side of the silicon substrate (4), and the bottom of the inner side surface of the positioning pressing block (6) is positioned on the outer side of the heat-conducting glue (2).

5. A high power density integrated package module according to claim 1, wherein: the bottoms of the diode body (14), the capacitor (13) and the chip base body (5) pin penetrate through the silicon substrate (4) and are fixedly connected with the copper substrate (3).

6. A high power density integrated package module according to claim 1, wherein: the right side at the top of the inner cavity of the sealing frame (10) is provided with a leak hole (12), and the surface at the top of the sealing frame (10) is fixedly connected with a limiting ring (11) at the top of the leak hole (12).

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