CN217334127U

CN217334127U - Glue injection sealing device for LED packaging

Info

Publication number: CN217334127U
Application number: CN202123417728.9U
Authority: CN
Inventors: 肖文靖; 胡勋涛
Original assignee: Jiangsu Prajna Electronic Industry Co ltd
Current assignee: Jiangsu Prajna Electronic Industry Co ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-08-30
Anticipated expiration: 2031-12-31

Abstract

The utility model discloses a belong to the technical field of sealing device, in particular to an injecting glue sealing device for LED packaging, which comprises a substrate, wherein a groove is arranged in the middle of the upper wall of the substrate, an LED component is arranged on the lower wall of the inner cavity of the groove, a light-passing plate is arranged above the substrate, an injecting glue layer is arranged between the light-passing plate and the substrate, leak-proof frames are arranged at the joint between the injecting glue layer and the light-passing plate, two injecting glue holes are arranged on the front walls of the leak-proof frames, a rubber plug is arranged in the injecting glue hole, a connecting strip is arranged between the rubber plug and the injecting glue hole, the LED component comprises an LED chip, a negative plate is arranged on the left side of the LED chip, a positive plate is arranged on the right side of the LED chip, a lead is arranged between the positive plate, the negative plate and the LED chip, the positive plate, the negative plate and the LED chip are electrically connected through leads, and are matched through the leak-proof frames, the glue holes, the rubber plug and the connecting strip, the glue does not overflow to affect the appearance of the finished product.

Description

Glue injection sealing device for LED packaging

Technical Field

The utility model relates to a sealing device technical field specifically is a injecting glue sealing device is used in LED encapsulation.

Background

As a new generation of green light source, LEDs have advantages of high luminous efficiency, long life, energy saving, environmental protection, etc., and have been widely used in many fields, and in order to protect LED chips used as light sources, they are generally packaged.

In order to ensure the sealing performance of glue injection in the glue injection process of the existing glue injection sealing device for LED packaging, a large amount of glue is often injected, and partial glue overflows after the large amount of glue is solidified, so that the appearance of a finished product is influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a injecting glue sealing device is used in LED encapsulation to solve the current injecting glue sealing device for LED encapsulation that proposes in the above-mentioned background art and in order to guarantee the leakproofness of injecting glue at the injecting glue in-process, often pour into a large amount of glue into, it is excessive that there is partial glue after a large amount of glue solidifies, influences the problem of finished product outward appearance.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a injecting glue sealing device for LED encapsulation, includes the base plate, base plate upper wall middle part is seted up flutedly, recess inner chamber lower wall is equipped with the LED subassembly, the base plate top is equipped with the light-passing board, be equipped with the injecting glue layer between light-passing board and the base plate, the junction between the injecting glue layer and between the light-passing board all is equipped with the leak protection frame, two the injecting glue hole has all been seted up to leak protection frame antetheca, the downthehole portion of injecting glue is equipped with the plug, be equipped with the connecting strip between plug and the injecting glue hole.

Preferably, the LED assembly comprises an LED chip, a negative plate is arranged on the left side of the LED chip, a positive plate is arranged on the right side of the LED chip, wires are arranged between the positive plate and the negative plate and between the positive plate and the LED chip, the positive plate and the negative plate are electrically connected with the LED chip through the wires, conductive parts are arranged below the positive plate and the negative plate, and the conductive parts penetrate through the inside of the substrate and extend to the lower wall of the substrate.

Preferably, an insulating protective film is arranged on the surface of the outer wall of the substrate.

Preferably, the surface of the outer wall of the light-transmitting plate is provided with a transparent dustproof film.

Preferably, the light-passing board lower wall left and right sides all is equipped with the holding tank, two the holding tank is located the junction of glue injection layer and light-passing board.

Compared with the prior art, the beneficial effects of the utility model are that: through the common cooperation between the leakage-proof frame, the rubber hole, the rubber plug and the connecting strip, the glue does not overflow to influence the appearance of a finished product.

Drawings

FIG. 1 is a schematic front sectional view of the structure of the present invention;

FIG. 2 is a schematic view of a three-dimensional structure of the leakage-proof frame of the present invention;

fig. 3 is a schematic structural diagram of the present invention.

In the figure: 1. a substrate; 2. a groove; 3. an LED chip; 4. a wire; 5. a positive plate; 6. a negative plate; 7. a conductive member; 8. a light-transmitting plate; 9. injecting a glue layer; 10. a leakage-proof frame; 11. a rubber plug; 12. injecting glue holes; 13. a connecting strip; 14. and (6) accommodating the tank.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Example (b):

referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a injecting glue sealing device for LED encapsulation, includes base plate 1, base plate 1 is high heat conduction cermet base plate, and the heat conductivity is good, 1 upper wall middle part of base plate is seted up flutedly 2, 2 inner chamber lower walls of recess are equipped with the LED subassembly, 1 top of base plate is equipped with light-passing board 8, be equipped with injection glue layer 9 between light-passing board 8 and the base plate 1, the junction between injection glue layer 9 and between the light-passing board 8 all is equipped with leak protection frame 10, two injection hole 12 has all been seted up to leak protection frame 10 antetheca, the inside plug 11 that is equipped with in injection hole 12, be equipped with connecting strip 13 between plug 11 and the injection hole 12.

Wherein, the LED subassembly includes

LED chip

3, 3 left sides of LED chip are equipped with

negative plate

6, 3 right sides of LED chip are equipped with positive plate 5, be equipped with wire 4 between positive plate 5, negative plate 6 and the LED chip 3, be connected through 4 electricity of wire between positive plate 5, negative plate 6 and the LED chip 3, positive plate 5 all is equipped with electrically conductive 7 with 6 below of negative plate, electrically conductive 7 runs through 1 inside and extends to 1 lower wall of base plate, 1 outer wall surface of base plate is equipped with insulating protective film, 8 outer wall surfaces of light-passing board are equipped with transparent dust-proof film, 8 lower wall left and right sides of light-passing board all are equipped with holding tank 14, two the holding tank 14 is located the junction of glue-injection layer 9 and light-passing board 8.

The working principle is as follows: before glue injection, the rubber plug 11 in the glue injection hole 12 is taken out firstly, then a glue injection pipe of a glue injection machine is plugged into the glue injection hole 12, glue is injected into the glue injection layer 9 by the glue injection machine, the light-transmitting plate 8 is connected with the substrate 1 through the glue injection layer 9 after the glue is injected, the glue cannot overflow under the action of the leakage-proof frame 10, and redundant glue on one side, which is not contacted with the light-transmitting plate 8, of the leakage-proof frame 10 enters the accommodating groove 14.

Having shown and described the basic principles and principal features of the invention and advantages thereof, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof; the present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, and any reference signs in the claims are not intended to be construed as limiting the claim concerned.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a injecting glue sealing device for LED encapsulation, includes base plate (1), its characterized in that: base plate (1) upper wall middle part is seted up flutedly (2), recess (2) inner chamber lower wall is equipped with the LED subassembly, base plate (1) top is equipped with light-passing board (8), be equipped with between light-passing board (8) and base plate (1) injection glue film (9), junction between injection glue film (9) and between light-passing board (8) all is equipped with leak protection frame (10), two injection hole (12) have all been seted up to leak protection frame (10) antetheca, injection hole (12) inside is equipped with plug (11), be equipped with connecting strip (13) between plug (11) and injection hole (12).

2. The glue injection sealing device for the LED package according to claim 1, wherein: the LED assembly comprises an LED chip (3), a negative plate (6) is arranged on the left side of the LED chip (3), a positive plate (5) is arranged on the right side of the LED chip (3), a wire (4) is arranged between the positive plate (5), the negative plate (6) and the LED chip (3), the positive plate (5), the negative plate (6) and the LED chip (3) are electrically connected through the wire (4), an electric conducting piece (7) is arranged below the positive plate (5) and the negative plate (6), and the electric conducting piece (7) runs through the inside of the substrate (1) and extends to the lower wall of the substrate (1).

3. The glue injection sealing device for the LED package according to claim 1, wherein: and an insulating protective film is arranged on the surface of the outer wall of the substrate (1).

4. The glue injection sealing device for the LED package according to claim 1, wherein: and a transparent dustproof film is arranged on the surface of the outer wall of the light-transmitting plate (8).

5. The glue injection sealing device for the LED package according to claim 1, wherein: light-passing board (8) lower wall left and right sides all is equipped with holding tank (14), two holding tank (14) are located the junction of glue injection layer (9) and light-passing board (8).